A new form of high thermal conductive epoxy resin pre-impregnated glass yarn device

Abstract

The application discloses a new high-thermal-conductivity epoxy resin pre-impregnation glass yarn device, and relates to the technical field of pre-impregnation yarn equipment, which comprises a first storage cylinder for storing high-thermal-conductivity epoxy resin and a second storage cylinder for storing a curing agent; a first temperature control loop is communicated with a discharging end of the first storage cylinder, and the first temperature control loop is used for controlling the viscosity of the high-thermal-conductivity epoxy resin discharged from a discharging end of the first temperature control loop; the pre-impregnation glass yarn device further comprises a yarn dipping chamber, and the high-thermal-conductivity epoxy resin passing through the first temperature control loop is mixed with the curing agent to form a mixture and then is discharged into the yarn dipping chamber. The application has the effect of reducing the adverse influence of the temperature reduction of the epoxy resin on the viscosity of the epoxy resin in the process of pre-impregnation of the glass yarn.

Description

Technical Field

[0001] This application relates to the technical field of prepreg equipment, and in particular to a novel device for prepreg glass yarn with high thermal conductivity epoxy resin. Background Technology

[0002] High thermal conductivity epoxy resin materials have wide applications in thermal management and electronic packaging. They can effectively conduct and disperse heat, improving the heat dissipation performance of equipment. The use of high thermal conductivity epoxy resin materials in dry air reactors will change the temperature distribution and heat dissipation of the thermal field of dry reactor products, effectively reducing the overall temperature rise of the coil, while reducing the temperature difference between the conductor and the air gap, reducing the thermal stress of epoxy composite materials, and ensuring the safe and reliable operation of the equipment.

[0003] The epoxy resin pre-impregnation process for glass yarn is widely used in dry-type air reactor products. Because thermally conductive fillers are added to the high thermal conductivity epoxy resin, the viscosity of the high thermal conductivity epoxy resin is higher than that of conventional epoxy resin. If the viscosity of the high thermal conductivity epoxy resin cannot be effectively controlled, problems such as thermally conductive filler sedimentation and impregnation of the impregnated yarn are likely to occur, and the thermal conductivity of the impregnated glass yarn will be greatly reduced.

[0004] Currently, the epoxy resin preimpregnation process for glass yarn only controls the viscosity of high thermal conductivity epoxy resin by roughly controlling the removal temperature of the high thermal conductivity epoxy resin. Throughout the entire preimpregnation process, the temperature of the high thermal conductivity epoxy resin is not precisely controlled. As the temperature of the high thermal conductivity epoxy resin changes during the entire process, the viscosity of the high thermal conductivity epoxy resin is prone to change, resulting in unstable performance of the glass yarn after preimpregnation. Summary of the Invention

[0005] In order to improve the adverse effect of the temperature drop of high thermal conductivity epoxy resin on the viscosity of high thermal conductivity epoxy resin in the process of preimpregnating high thermal conductivity epoxy resin with glass yarn, this application provides a new type of device for preimpregnating high thermal conductivity epoxy resin with glass yarn.

[0006] This application provides a novel device for pre-impregnated glass yarn with high thermal conductivity epoxy resin, employing the following technical solution:

[0007] A novel high thermal conductivity epoxy resin prepreg glass yarn device includes a first storage cylinder for storing high thermal conductivity epoxy resin and a second storage cylinder for storing curing agent.

[0008] The discharge end of the first storage cylinder is connected to a first temperature control circuit, which is used to control the viscosity of the high thermal conductivity epoxy resin discharged from the discharge end of the first temperature control circuit.

[0009] The prepreg glass yarn apparatus also includes an impregnation chamber, into which a mixture of high thermal conductivity epoxy resin and curing agent, formed by passing through a first temperature control circuit, is discharged.

[0010] By adopting the above technical solution, the first temperature control loop can more accurately control the viscosity of the high thermal conductivity epoxy resin by adjusting the temperature, so that the viscosity of the high thermal conductivity epoxy resin and the curing agent is lower when mixed, which makes it easier to mix evenly.

[0011] This application provides a device that provides a fully closed-loop process and precisely controls the viscosity of high thermal conductivity epoxy resin throughout the process, so that the high thermal conductivity epoxy resin can maintain a low viscosity and stable performance throughout the entire process, thereby improving the impregnation quality of glass yarn.

[0012] Optionally, the discharge end of the second storage cylinder is connected to a second temperature control circuit, which is used to control the viscosity of the curing agent discharged from the discharge end of the second temperature control circuit.

[0013] By adopting the above technical solution, a second temperature control circuit is set at the rear end of the second storage cylinder used to store the curing agent, so that the temperature of the curing agent and the high thermal conductivity epoxy resin are similar when they are mixed. This reduces the situation where the temperature of the high thermal conductivity epoxy resin decreases due to the lower temperature of the curing agent, which leads to an increase in viscosity and poor mixing effect.

[0014] Optionally, it also includes a mixing drum for uniformly mixing the high thermal conductivity epoxy resin and the curing agent, wherein the inlet end of the mixing drum is simultaneously connected to the outlet end of the first temperature control circuit and the second temperature control circuit.

[0015] A third temperature control loop for controlling the viscosity of the mixture is provided at the outlet of the mixing drum.

[0016] By adopting the above technical solution, after the high thermal conductivity epoxy resin and curing agent are mixed in the mixing drum to form a mixture, the mixture is passed through a third temperature control loop to adjust the temperature of the mixture again, thereby maintaining the low viscosity of the high thermal conductivity epoxy resin in the mixture, making the performance of the mixture entering the impregnation chamber stable and reducing the impact on the impregnation effect.

[0017] Optionally, the first temperature control loop, the second temperature control loop, and the third temperature control loop each include:

[0018] A feed pipe is connected to the first storage cylinder, the second storage cylinder, or the stirring cylinder, and a main viscometer is installed on the feed pipe;

[0019] The main solenoid valve is installed at the free end of the conveying pipe;

[0020] The discharge pipe is connected at one end to the main solenoid valve, and at the other end is used to discharge high thermal conductivity epoxy resin, curing agent, or mixture into the temperature control circuit.

[0021] The return pipe has one end connected to the main solenoid valve and the other end connected to the discharge pipe. A heating device, a secondary viscometer, and a secondary solenoid valve are installed sequentially on the return pipe, and a transmission pipe directly connects the heating device and the secondary solenoid valve.

[0022] By adopting the above technical solution, high thermal conductivity epoxy resin, curing agent, or mixture enters the first temperature control circuit, the second temperature control circuit, or the third temperature control circuit through the conveying pipe. When passing through the conveying pipe, the viscosity is detected by the main viscometer. A main solenoid valve is installed at the end of the conveying pipe. The main solenoid valve can control the direction of the high thermal conductivity epoxy resin, curing agent, or mixture.

[0023] If the viscosity value meets the requirements, the high thermal conductivity epoxy resin, curing agent, or mixture is discharged through the discharge pipe; if the viscosity value is high, the high thermal conductivity epoxy resin, curing agent, or mixture enters the return pipe and is heated by the heating device to reduce the viscosity of the high thermal conductivity epoxy resin.

[0024] After heating, the high thermal conductivity epoxy resin, curing agent, or mixture is tested for viscosity again using a viscometer. If the viscosity value meets the requirements, the high thermal conductivity epoxy resin, curing agent, or mixture is discharged through the discharge pipe. If the viscosity value is too high, the high thermal conductivity epoxy resin, curing agent, or mixture re-enters the heating device through the transfer pipe, thus forming a circulation path until the viscosity value of the high thermal conductivity epoxy resin, curing agent, or mixture reaches the requirements, at which point it can be discharged from the discharge pipe.

[0025] The first, second, or third temperature control loop of this application precisely controls the viscosity of the high thermal conductivity epoxy resin, curing agent, or mixture by adjusting the temperature. This ensures that the viscosity of the high thermal conductivity epoxy resin can be precisely controlled throughout the entire impregnation process, preventing the viscosity from exceeding the required value and thus improving the impregnation quality.

[0026] Optionally, the first temperature control loop, the second temperature control loop, and the third temperature control loop all further include a control element. The control element is connected to the main solenoid valve, the secondary solenoid valve, the main viscometer, and the secondary viscometer, and is used to receive the main viscosity data measured by the main viscometer and the secondary viscosity data measured by the secondary viscometer, and to determine whether the main viscosity data and the secondary viscosity data are greater than a preset value, respectively.

[0027] If the main viscosity data is greater than the preset value, the control element controls the main solenoid valve to connect with the return pipe and blocks the connection between the main solenoid valve and the discharge pipe.

[0028] If the main viscosity data is not greater than the preset value, the control element controls the main solenoid valve to connect with the discharge pipe and blocks the connection between the main solenoid valve and the return pipe.

[0029] If the secondary viscosity data is greater than the preset value, the control element controls the secondary solenoid valve to connect with the transmission pipe and blocks the connection between the main solenoid valve and the discharge pipe.

[0030] If the secondary viscosity data is not greater than the preset value, the control element controls the secondary solenoid valve to connect with the discharge pipe and blocks the connection between the main solenoid valve and the transmission pipe.

[0031] By adopting the above technical solution, the control element is used to receive viscosity data measured by the main viscometer and the secondary viscometer in real time, thereby making judgments and issuing opening and closing commands to the main solenoid valve and the secondary solenoid valve. This enables automatic detection, adjustment and judgment of the viscosity of high thermal conductivity epoxy resin, eliminating the need for manual judgment and manual opening and closing of the main solenoid valve and the secondary solenoid valve, making it more accurate and efficient.

[0032] Optionally, the output terminal of the first temperature control loop is provided with a first metering pump for storing and metering out high thermal conductivity epoxy resin.

[0033] The output of the second temperature control circuit is equipped with a second metering pump for storing and metering the curing agent.

[0034] Both the first metering pump and the second metering pump are connected to the stirring drum, and the stirring drum is equipped with a weighing device for weighing the high thermal conductivity epoxy resin or curing agent discharged into the stirring drum.

[0035] By adopting the above technical solution, the high thermal conductivity epoxy resin passing through the first temperature control loop and the curing agent passing through the second temperature control loop enter the first metering pump and the second metering pump respectively, and are introduced into the mixing drum according to a preset ratio through the first metering pump and the second metering pump; the weighing device set in the mixing drum can measure the weight of the high thermal conductivity epoxy resin and the curing agent introduced into the mixing drum, thereby accurately determining whether the mixing ratio is met; setting the first metering pump, the second metering pump and the weighing device can more accurately control the mixing ratio of the high thermal conductivity epoxy resin and the curing agent, thereby improving the performance and mixing uniformity of the mixture.

[0036] Optionally, the impregnation chamber is equipped with a discharge pool and a winding device, and the mixture discharged from the third temperature control loop enters the discharge pool;

[0037] The discharge pool is equipped with a stirring device for mixing the materials.

[0038] By adopting the above technical solution, the discharge tank is used to store the mixture to facilitate the impregnation process. A stirring device is installed in the discharge tank to stir the mixture, thereby reducing the settling of thermally conductive fillers in the high thermal conductivity epoxy resin during the impregnation process, which could cause changes in the properties of the mixture and affect the quality of the impregnation.

[0039] Optionally, the impregnation chamber is equipped with a temperature and humidity control loop. This loop includes a temperature and humidity sensor and an infrared dehumidifier installed within the impregnation chamber, and a thermostat installed in the discharge tank. The temperature and humidity sensor is used to monitor the temperature and humidity within the impregnation chamber in real time and determine whether they match preset values.

[0040] If so, the yarn winding device will begin the yarn winding operation;

[0041] If not, the infrared dehumidification device will be activated to adjust the humidity in the yarn impregnation chamber and the yarn winding device will be kept in a state of waiting to start the yarn winding operation.

[0042] By adopting the above technical solution, a temperature and humidity control loop is set in the impregnation chamber, so that the winding device can only be turned on after the temperature and humidity in the impregnation chamber reach the required values. This ensures that the viscosity of the high thermal conductivity epoxy resin remains stable during the impregnation process, reduces the impact of temperature and humidity in the impregnation chamber on the performance of the mixture, and effectively controls the performance quality of the glass yarn after impregnation, so that the performance of the glass yarn formed after impregnation remains stable.

[0043] Optionally, both the discharge pipe and the transmission pipe are equipped with a one-way valve.

[0044] By adopting the above technical solution, a one-way valve is set up to allow the high thermal conductivity epoxy resin, curing agent, or mixture to flow in one direction according to the designed path, thereby reducing the occurrence of backflow of the high thermal conductivity epoxy resin, curing agent, or mixture.

[0045] Optionally, both the first and second storage cylinders are equipped with temperature sensors and thermostats.

[0046] By adopting the above technical solution and setting temperature sensors and thermostats, the high thermal conductivity epoxy resin and curing agent are kept at constant temperatures in the first and second storage cylinders, respectively. On the one hand, this allows the high thermal conductivity epoxy resin to maintain low viscosity, making it easy to flow and be discharged from the first storage cylinder; on the other hand, it keeps the stored high thermal conductivity epoxy resin and curing agent at constant temperatures, reducing the number of heating cycles after entering the temperature control loop and improving the efficiency of the entire process.

[0047] In summary, this application includes at least one of the following beneficial effects:

[0048] 1. This application controls the viscosity of the high thermal conductivity epoxy resin by adjusting the temperature, thereby ensuring that the high thermal conductivity epoxy resin maintains a low viscosity throughout the entire impregnation process, and the mixture maintains stable performance throughout the entire process, thus improving the stability of the glass yarn performance after impregnation.

[0049] 2. This application provides a device for precise control of the viscosity of high thermal conductivity epoxy resin throughout the entire process, thereby overcoming the drawback of the high thermal conductivity epoxy resin viscosity changing due to temperature changes in the traditional process, resulting in unstable final impregnation quality.

[0050] 3. A temperature and humidity control loop is set up in the impregnation chamber and a stirring device is set up in the discharge tank so that the mixture can maintain stable performance when the winding device is winding, reducing the influence of temperature, humidity and heat-conducting filler sedimentation, and improving the consistency and stability of the performance of glass yarn after impregnation.

[0051] 4. This application provides a device with a fully enclosed process and precise control throughout the process, which controls the factors affecting the viscosity of high thermal conductivity epoxy resin throughout the process and improves the quality of yarn impregnation. Attached Figure Description

[0052] Figure 1 This is a schematic diagram of the overall structure and flow of the device according to an embodiment of this application.

[0053] Explanation of reference numerals in the attached drawings: 1. First storage tank; 2. Second storage tank; 3. First temperature control circuit; 31. Feeding pipe; 311. Main viscometer; 32. Main solenoid valve; 33. Discharge pipe; 34. Return pipe; 341. Heating device; 342. Secondary viscometer; 343. Secondary solenoid valve; 35. Transmission pipe; 36. Check valve; 4. Second temperature control circuit; 5. Third temperature control circuit; 6. Yarn impregnation chamber; 61. Discharge tank; 62. Yarn winding device; 63. Temperature and humidity sensor; 64. Infrared dehumidification device; 7. First metering pump; 8. Second metering pump; 9. Stirring tank; 10. Weighing device. Detailed Implementation

[0054] The following is in conjunction with the appendix Figure 1 This application will be described in further detail.

[0055] This application discloses a novel high thermal conductivity epoxy resin prepreg glass yarn device, referring to... Figure 1 A novel high thermal conductivity epoxy resin prepreg glass yarn device includes a first storage cylinder 1 for storing the high thermal conductivity epoxy resin. The first storage cylinder 1 is equipped with a temperature sensor and a thermostat. The temperature sensor detects the temperature of the high thermal conductivity epoxy resin stored in the first storage cylinder 1, and the thermostat regulates the temperature of the high thermal conductivity epoxy resin in the first storage cylinder 1 to bring it to a preset temperature.

[0056] Reference Figure 1The discharge end of the first storage cylinder 1 is connected to a first temperature control circuit 3. The first temperature control circuit 3 includes a conveying pipe 31 connected to the first storage cylinder 1. A main solenoid valve 32 is installed at the free end of the conveying pipe 31. In this embodiment, the main solenoid valve 32 is a two-position three-way solenoid valve. The two outlets of the main solenoid valve 32 are respectively connected to a discharge pipe 33 and a return pipe 34. The discharge pipe 33 is used to discharge the high thermal conductivity epoxy resin into the first temperature control circuit 3. The return pipe 34 is used to heat the high thermal conductivity epoxy resin and discharge the high thermal conductivity epoxy resin into the first temperature control circuit 3 along the discharge pipe 33.

[0057] Reference Figure 1 A primary viscometer 311 is installed on the feed pipe 31. A heating device 341, a secondary viscometer 342, and a secondary solenoid valve 343 are sequentially installed on the return pipe 34 in the direction away from the primary solenoid valve 32. A transmission pipe 35 directly connects the heating device 341 and the secondary solenoid valve 343. The primary viscometer 311 is used to measure the viscosity of the high thermal conductivity epoxy resin flowing through the feed pipe 31. If the viscosity value of the high thermal conductivity epoxy resin measured by the primary viscometer 311 meets the requirements, the high thermal conductivity epoxy resin flows out of the first temperature control circuit 3 through the primary solenoid valve 32 and the discharge pipe 33. If the viscosity value of the high thermal conductivity epoxy resin measured by the primary viscometer 311 does not meet the requirements, the high thermal conductivity epoxy resin flows into the heating device 341 through the primary solenoid valve 32 and the return pipe 34 for heating. After heating, it enters the secondary viscometer 342 for viscosity testing. If the viscosity of the high thermal conductivity epoxy resin meets the required value as measured by the viscometer 342, the high thermal conductivity epoxy resin is discharged from the first temperature control circuit 3 via the secondary solenoid valve 343, reflux pipe 34, and discharge pipe 33. If the viscosity of the high thermal conductivity epoxy resin does not meet the required value, the high thermal conductivity epoxy resin re-enters the heating device 341 via the transmission pipe 35, and the cycle continues until the viscosity of the high thermal conductivity epoxy resin reaches the required value as measured by the secondary viscometer 342.

[0058] Reference Figure 1 The process of adjusting the viscosity of the high thermal conductivity epoxy resin by heating described above can be manually operated. In this embodiment, a control element is preferably set in the first temperature control loop 3 to achieve automatic and precise adjustment. The control element is connected to the main solenoid valve 32, the secondary solenoid valve 343, the main viscometer 311, and the secondary viscometer 342. It is used to receive the main viscosity data measured by the main viscometer 311 and the secondary viscosity data measured by the secondary viscometer 342, and to determine whether the main viscosity data and the secondary viscosity data are greater than preset values. Then, based on the determination results, it drives the opening and closing of the main solenoid valve 32 and the secondary solenoid valve 343. A determination program is set in the control element: if the main viscosity data is greater than the preset value, the control element controls the main solenoid valve 32 to connect with the return pipe 34 and blocks the connection between the main solenoid valve 32 and the discharge pipe 33.

[0059] If the main viscosity data is not greater than the preset value, the control element controls the main solenoid valve 32 to connect with the discharge pipe 33 and blocks the connection between the main solenoid valve 32 and the return pipe 34.

[0060] If the viscosity data is greater than the preset value, the control element controls the secondary solenoid valve 343 to connect with the transmission pipe 35 and blocks the connection between the main solenoid valve 32 and the discharge pipe 33.

[0061] If the viscosity data is not greater than the preset value, the control element controls the secondary solenoid valve 343 to connect with the discharge pipe 33 and blocks the connection between the main solenoid valve 32 and the transmission pipe 35.

[0062] Reference Figure 1 One-way valves 36 are installed on the discharge pipe 33 and the transmission pipe 35. The one-way valves 36 enable the high thermal conductivity epoxy resin to flow in one direction in the first temperature control circuit 3, thereby reducing the occurrence of backflow of the high thermal conductivity epoxy resin in the first temperature control circuit 3.

[0063] Reference Figure 1 The high thermal conductivity epoxy resin preimpregnated glass yarn device of this application also includes a second storage cylinder 2, which is used to store curing agent. The second storage cylinder 2 is also equipped with a temperature sensor and a thermostat for controlling the temperature of the curing agent. The curing agent in the second storage cylinder 2 is used to mix with the high thermal conductivity epoxy resin in the first storage cylinder 1 to form a mixture for the impregnation process. The curing agent in the second storage cylinder 2 can be directly stirred and mixed with the high thermal conductivity epoxy resin discharged from the first temperature control circuit 3. However, in the embodiments of this application, a second temperature control circuit 4 is preferably provided at the outlet end of the second storage cylinder 2. The second temperature control circuit 4 has the same structure and design principle as the first temperature control circuit 3 to achieve precise control of the temperature and viscosity of the curing agent, which will not be elaborated further here.

[0064] Reference Figure 1 The first temperature control circuit 3 is equipped with a first metering pump 7 at its outlet end, and the second temperature control circuit 4 is equipped with a second metering pump 8 at its outlet end. The discharge end of the first metering pump 7 is equipped with a stirring drum 9, and the discharge end of the second metering pump 8 is also connected to the stirring drum 9.

[0065] Reference Figure 1High thermal conductivity epoxy resin and curing agent, meeting the required viscosity, are introduced into a mixing drum 9 by a first metering pump 7 and a second metering pump 8 in a preset ratio. A weighing device 10 is installed inside the mixing drum 9, which provides real-time feedback on the weight of the high thermal conductivity epoxy resin and curing agent to the first metering pump 7 and the second metering pump 8, controlling the total weight of the high thermal conductivity epoxy resin and curing agent to meet the preset requirements. When the ratio and weight of the high thermal conductivity epoxy resin and curing agent discharged into the mixing drum 9 meet the preset requirements, the first metering pump 7 and the second metering pump 8 stop introducing the resin, and the mixing drum 9 begins to operate, mixing the high thermal conductivity epoxy resin and curing agent evenly to obtain a mixture.

[0066] Reference Figure 1 A third temperature control circuit 5 is provided at the discharge end of the mixing drum 9. The third temperature control circuit 5 has the same structure and design principle as the first temperature control circuit 3. The viscosity of the mixture is detected again through the third temperature control circuit 5, and the viscosity of the mixture is adjusted through the third temperature control circuit 5 until the viscosity of the mixture meets the requirements. Then the mixture is discharged from the discharge pipe 33.

[0067] Reference Figure 1 The high thermal conductivity epoxy resin preimpregnated glass yarn apparatus of this application also includes an impregnation chamber 6. The mixture is discharged into the impregnation chamber 6 after passing through the third temperature control circuit 5 for impregnation. The impregnation chamber 6 is equipped with a discharge tank 61 and a winding device 62. The mixture is discharged into the discharge tank 61 for storage, and glass yarn is installed on the winding device 62 so that the glass yarn is immersed through the discharge tank 61, thereby completing the glass yarn impregnation operation. The discharge tank 61 is equipped with a stirring device for stirring the mixture, reducing the precipitation of thermally conductive fillers in the high thermal conductivity epoxy resin when the mixture is stored in the discharge tank 61, which could lead to unstable performance of the mixture.

[0068] Reference Figure 1 The impregnation chamber 6 is also equipped with a temperature and humidity control circuit. Specifically, a thermostat is installed in the discharge tank 61 to keep the temperature of the mixture constant, so that the viscosity of the high thermal conductivity epoxy resin is lower than the required value. The impregnation chamber 6 is also equipped with a temperature and humidity sensor 63 and an infrared dehumidification device 64. The temperature and humidity sensor 63 is used to monitor the temperature and air humidity in the impregnation chamber 6 in real time and feed the data information back to the infrared dehumidification device 64 and the yarn winding device 62 in real time.

[0069] Reference Figure 1 When the air humidity and temperature in the impregnation chamber 6 reach the preset requirements, the winding device 62 starts the winding operation; when the air humidity and temperature in the impregnation chamber 6 do not reach the preset requirements, the winding device 62 is in a waiting state to start the winding operation, and the infrared dehumidification device 64 is turned on to dehumidify the impregnation chamber 6 until the air humidity and temperature in the impregnation chamber 6 both reach the preset requirements, and then the winding device 62 starts the winding operation.

[0070] The implementation principle of a novel high thermal conductivity epoxy resin preimpregnation glass yarn device according to an embodiment of this application is as follows: A thermostat is installed in the first storage cylinder 1 to maintain the high thermal conductivity epoxy resin at a low viscosity, making the high thermal conductivity epoxy resin easy to flow and reducing the workload of the first temperature control circuit 3; the first temperature control circuit 3 is installed at the rear end of the first storage cylinder 1 to achieve precise control of the viscosity of the high thermal conductivity epoxy resin, thereby improving the stability of the high thermal conductivity epoxy resin performance throughout the impregnation process; a thermostat is installed in the second storage cylinder 2 and a second temperature control circuit 4 is installed at the rear end to adjust the temperature and viscosity of the curing agent, thereby reducing the influence of the curing agent temperature change on the temperature of the high thermal conductivity epoxy resin when the high thermal conductivity epoxy resin and the curing agent are mixed, thus reducing the influence on the viscosity of the high thermal conductivity epoxy resin during mixing.

[0071] A third temperature control loop 5 is set at the rear end of the mixing drum 9 to further precisely control the viscosity of the mixture, ensuring that the performance of the mixture entering the impregnation chamber 6 meets the requirements. A temperature and humidity control loop is set in the impregnation chamber 6 so that the impregnation operation can be carried out in a temperature and humidity environment that does not affect the viscosity of the mixture, reducing the influence of environmental factors that cause the temperature of the mixture to change, thereby increasing the viscosity of the high thermal conductivity epoxy resin in the mixture, which in turn has an adverse effect on the consistency and stability of the performance of the glass yarn after pre-impregnation.

[0072] The device described in this application achieves precise viscosity control of high thermal conductivity epoxy resin throughout the entire process, ensuring the stability of the mixture's properties, thereby improving the quality of impregnation and the stability of the properties of pre-impregnated glass yarn.

[0073] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A novel device for pre-impregnating high thermal conductivity epoxy resin glass yarn, characterized in that: It includes a first storage cylinder (1) for storing high thermal conductivity epoxy resin and a second storage cylinder (2) for storing curing agent; The discharge end of the first storage cylinder (1) is connected to a first temperature control circuit (3), which is used to control the viscosity of the high thermal conductivity epoxy resin discharged from the discharge end of the first temperature control circuit (3). The prepreg glass yarn device also includes an impregnation chamber (6), into which a mixture of high thermal conductivity epoxy resin and curing agent, formed by the first temperature control circuit (3), is discharged after being discharged. The discharge end of the second storage cylinder (2) is connected to a second temperature control circuit (4), which is used to control the viscosity of the curing agent discharged from the discharge end of the second temperature control circuit (4). A mixing drum (9) is used to mix high thermal conductivity epoxy resin and curing agent evenly. The inlet end of the mixing drum (9) is connected to the outlet end of the first temperature control circuit (3) and the outlet end of the second temperature control circuit (4). A third temperature control circuit (5) for controlling the viscosity of the mixture is provided at the outlet of the mixing drum (9). The first temperature control loop (3), the second temperature control loop (4), and the third temperature control loop (5) all include: The feed pipe (31) is connected to the first storage cylinder (1), the second storage cylinder (2), or the stirring cylinder (9), and a main viscometer (311) is installed on the feed pipe (31). The main solenoid valve (32) is installed at the free end of the conveying pipe (31); The discharge pipe (33) is connected at one end to the main solenoid valve (32) and at the other end to discharge high thermal conductivity epoxy resin, curing agent or mixture from the temperature control circuit. The return pipe (34) is connected at one end to the main solenoid valve (32) and at the other end to the discharge pipe (33). A heating device (341), a secondary viscometer (342) and a secondary solenoid valve (343) are installed on the return pipe (34) in sequence. A transmission pipe (35) is directly connected between the heating device (341) and the secondary solenoid valve (343). The first temperature control loop (3), the second temperature control loop (4), and the third temperature control loop (5) all further include control elements. The control elements are connected to the main solenoid valve (32), the secondary solenoid valve (343), the main viscometer (311), and the secondary viscometer (342), and are used to receive the main viscosity data measured by the main viscometer (311) and the secondary viscosity data measured by the secondary viscometer (342), and respectively determine whether the main viscosity data and the secondary viscosity data are greater than a preset value. If the main viscosity data is greater than the preset value, the control element controls the main solenoid valve (32) to connect with the return pipe (34) and blocks the connection between the main solenoid valve (32) and the discharge pipe (33); If the main viscosity data is not greater than the preset value, the control element controls the main solenoid valve (32) to connect with the discharge pipe (33) and blocks the connection between the main solenoid valve (32) and the return pipe (34); If the secondary viscosity data is greater than the preset value, the control element controls the secondary solenoid valve (343) to connect with the transmission pipe (35) and blocks the connection between the main solenoid valve (32) and the discharge pipe (33); If the secondary viscosity data is not greater than the preset value, the control element controls the secondary solenoid valve (343) to connect with the discharge pipe (33) and blocks the connection between the main solenoid valve (32) and the transmission pipe (35).

2. The novel high thermal conductivity epoxy resin pre-impregnated glass yarn device according to claim 1, characterized in that: The output end of the first temperature control circuit (3) is equipped with a first metering pump (7) for storing and metering out high thermal conductivity epoxy resin. The output end of the second temperature control circuit (4) is equipped with a second metering pump (8) for storing and metering out the curing agent; The first metering pump (7) and the second metering pump (8) are both connected to the stirring drum (9), and the stirring drum (9) is provided with a weighing device (10) for weighing the high thermal conductivity epoxy resin or curing agent discharged into the stirring drum (9).

3. The novel high thermal conductivity epoxy resin pre-impregnated glass yarn device according to claim 1, characterized in that: The impregnation chamber (6) is equipped with a discharge pool (61) and a winding device (62), and the mixture discharged from the third temperature control circuit (5) enters the discharge pool (61). The discharge pool (61) is equipped with a stirring device for mixing the mixture.

4. The novel high thermal conductivity epoxy resin pre-impregnated glass yarn device according to claim 3, characterized in that: The impregnation chamber (6) is equipped with a temperature and humidity control circuit, which includes a temperature and humidity sensor (63), an infrared dehumidification device (64), and a thermostat installed in the discharge tank (61). The temperature and humidity sensor (63) is used to monitor the temperature and humidity in the impregnation chamber (6) in real time and determine whether they are the same as the preset values. If so, the yarn winding device (62) begins the yarn winding operation; If not, the infrared dehumidification device (64) is activated to adjust the humidity in the yarn soaking chamber (6) and the yarn winding device (62) is put into a state of waiting to start the yarn winding operation.

5. The novel high thermal conductivity epoxy resin pre-impregnated glass yarn device according to claim 1, characterized in that: Both the discharge pipe (33) and the transmission pipe (35) are equipped with one-way valves (36).

6. The novel high thermal conductivity epoxy resin pre-impregnated glass yarn device according to claim 1, characterized in that: Temperature sensors and thermostats are installed in both the first storage cylinder (1) and the second storage cylinder (2).

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