Cell assembly substrate, preparation method thereof, display panel and display device

Abstract

The application discloses a cell substrate and a preparation method thereof, a display panel and a display device. The cell substrate comprises a backlight layer, a polarizing layer and a substrate layer. The backlight layer comprises a plurality of light emitting elements arranged in an array. The backlight layer comprises a substrate and a plurality of light emitting elements arranged in an array on the substrate. The substrate comprises a plurality of protrusions arranged in an array. The orthographic projection of the light emitting elements on the substrate at least partially overlaps the protrusions. The polarizing layer is arranged on the light emitting surface of the backlight layer away from the light emitting elements. The substrate layer is arranged on the polarizing layer away from the backlight layer. The surface of the substrate layer away from the backlight layer is flush. The driving circuit layer is arranged on the surface of the substrate layer away from the backlight layer. The application takes the light emitting surface of the independent backlight structure as the substrate of the cell substrate. The driving circuit and the liquid crystal cell are formed on the substrate. The overall thickness of the display module can be reduced. The polarizing layer is arranged on the backlight layer. The light control effect of the backlight layer can be improved. The display effect is improved.

Description

Technical Field

[0001] This application generally relates to the field of display technology, and specifically to a substrate and its preparation method, a display panel, and a display device. Background Technology

[0002] A liquid crystal display panel consists of a color filter (CF) substrate, a thin film transistor array substrate (TFT array substrate), and a liquid crystal layer disposed between the two substrates. Its working principle is to control the rotation of liquid crystal molecules in the liquid crystal layer by applying a driving voltage to the two substrates, thereby refracting the light from the backlight module to produce an image.

[0003] Currently, LCD panels are quite thick, making it difficult to meet consumers' demand for ultra-thin LCD devices. Moreover, improving the thickness of LCD devices is also the direction of their development. Summary of the Invention

[0004] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a substrate and preparation method, a display panel, and a display device that can realize an ultra-thin display module and improve the display effect.

[0005] In a first aspect, this application provides a substrate for a cell, comprising:

[0006] A backlight layer, the backlight layer including a plurality of light-emitting elements arranged in an array, the backlight layer including a substrate and a plurality of light-emitting elements arranged in an array on the substrate, the substrate including a plurality of protrusions arranged in an array, the orthographic projection of the light-emitting elements on the substrate at least partially overlapping the protrusions;

[0007] A polarizing layer disposed on the side of the backlight layer away from the light-emitting element;

[0008] A substrate layer is disposed on the side of the polarizing layer away from the backlight layer, and the surface of the substrate layer is flush with the side away from the backlight layer.

[0009] A driving circuit layer is disposed on the surface of the substrate layer away from the backlight layer.

[0010] Optionally, the polarizing layer is a metal wire grid type polarizing layer, the polarizing layer includes a plurality of light-transmitting gratings arranged in an array, and the orthographic projection of the light-transmitting gratings on the backlight layer at least partially overlaps with the light-emitting area of ​​the light-emitting element.

[0011] Optionally, the substrate layer is an organic material, and the substrate layer fills the light-transmitting grating.

[0012] Optionally, the substrate includes a first surface and a second surface disposed opposite to each other, the first surface is provided with a groove, the protrusion is located in the groove and spaced apart from the side surface of the groove; in the direction from the first surface to the second surface, the area of ​​the cross section of the protrusion parallel to the second surface gradually increases.

[0013] Optionally, the backlight layer further includes a color conversion structure located within the groove, wherein the color conversion structure is flush with the first surface on the side away from the second surface;

[0014] The light-emitting element is disposed on the first surface, and the light-emitting element is a micro LED.

[0015] Optionally, the second surface is flush with the side away from the light-emitting element, and the polarizing layer is disposed on the second surface.

[0016] Optionally, the driving circuit layer includes a thin-film transistor for controlling the liquid crystal layer, as well as a pixel electrode layer and a common electrode layer, wherein the thin-film transistor includes a gate layer, a source layer, and a drain layer.

[0017] Secondly, this application provides a method for preparing a substrate, the method comprising:

[0018] A substrate is provided, on which a plurality of protrusions arranged in an array are formed and on which light-emitting elements are arranged in an array are formed to form a backlight layer, the backlight layer including a plurality of light-emitting elements arranged in an array, wherein the orthographic projection of the light-emitting elements on the substrate at least partially overlaps with the protrusions;

[0019] A polarizing layer is formed on the side of the backlight layer away from the light-emitting element;

[0020] A substrate layer is formed on the side of the polarizing layer away from the backlight layer, and the surface of the substrate layer is flush with the side away from the backlight layer.

[0021] A driving circuit layer is formed on the surface of the substrate layer away from the backlight layer.

[0022] Thirdly, this application provides a display panel, including a color filter substrate and a cell substrate as described above, which are disposed opposite to each other, and a liquid crystal layer is disposed between the color filter substrate and the cell substrate.

[0023] Fourthly, this application provides a display device, including the display panel as described above.

[0024] The technical solutions provided by the embodiments of this application may include the following beneficial effects:

[0025] The cell substrate provided in this application uses the light-emitting surface of the independent backlight structure as the substrate of the cell substrate. By forming the driving circuit and liquid crystal cell on the substrate, the overall thickness of the display module can be reduced. By setting a polarizing layer on the backlight layer, the light control effect of the backlight layer can be improved, thereby improving the display effect. Attached Figure Description

[0026] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0027] Figure 1 A schematic diagram of the structure of a display panel provided for an exemplary embodiment of this application;

[0028] Figure 2 A schematic diagram of the structure of a substrate for a cell is provided as an exemplary embodiment of this application;

[0029] Figure 3 This is a partial cross-sectional view of the backlight layer provided in an exemplary embodiment of this application;

[0030] Figure 4 This is a partial cross-sectional view of the backlight layer provided in another exemplary embodiment of this application;

[0031] Figure 5 This is a partial cross-sectional view of the backlight layer provided in another exemplary embodiment of this application;

[0032] Figure 6 This is a partial cross-sectional view of the backlight layer provided in another exemplary embodiment of this application;

[0033] Figure 7 This is a partial top view of the substrate and protrusions of the backlight layer provided in an exemplary embodiment of this application;

[0034] Figure 8 yes Figure 4 A magnified view of a portion of the backlight layer is shown.

[0035] Figure 9 yes Figure 5 A magnified view of a portion of the backlight layer is shown.

[0036] Figure 10 This is a flowchart of a method for preparing a backlight layer according to an exemplary embodiment of this application;

[0037] Figure 11 This is a partial cross-sectional view of the first intermediate structure of the backlight layer provided in an exemplary embodiment of this application;

[0038] Figure 12 This is a partial cross-sectional view of the second intermediate structure of the backlight layer provided in an exemplary embodiment of this application;

[0039] Figure 13 This is a partial cross-sectional view of the third intermediate structure of the backlight layer provided in an exemplary embodiment of this application;

[0040] Figure 14 This is a partial cross-sectional view of the fourth intermediate structure of the backlight layer provided in an exemplary embodiment of this application;

[0041] Figure 15 This is a partial cross-sectional view of the fifth intermediate structure of the backlight layer provided in an exemplary embodiment of this application;

[0042] Figure 16 This is a partial cross-sectional view of the sixth intermediate structure of the backlight layer provided in an exemplary embodiment of this application;

[0043] Figure 17 This is a first intermediate structure of the backlight layer provided in another exemplary embodiment of this application.

[0044] A partial sectional view;

[0045] Figure 18 yes Figure 17 A partially enlarged view of the first intermediate structure shown;

[0046] Figure 19 This is a partial cross-sectional view of the second intermediate structure of the backlight layer provided in another exemplary embodiment of this application;

[0047] Figure 20 This is a third intermediate structure of the backlight layer provided in another exemplary embodiment of this application.

[0048] A partial sectional view;

[0049] Figure 21 This is a partial cross-sectional view of the seventh intermediate structure of the backlight layer provided in an exemplary embodiment of this application;

[0050] Figure 22 This is a partial cross-sectional view of the first intermediate structure of the backlight layer provided in another exemplary embodiment of this application;

[0051] Figure 23 yes Figure 22 A partially enlarged view of the first intermediate structure shown;

[0052] Figure 24 This is a partial cross-sectional view of the second intermediate structure of the backlight layer provided in another exemplary embodiment of this application;

[0053] Figure 25 This is a partial cross-sectional view of the third intermediate structure of the backlight layer provided in another exemplary embodiment of this application;

[0054] Figure 26 This is a partial cross-sectional view of the first intermediate structure 5 of the backlight layer provided in another exemplary embodiment of this application;

[0055] Figure 27 This is a partial cross-sectional view of the second intermediate structure of the backlight layer provided in another exemplary embodiment of this application;

[0056] Figure 28 This is a partial cross-sectional view of the eighth intermediate structure of the backlight layer provided in an exemplary embodiment of this application;

[0057] Figure 29 This is a partial cross-sectional view of the ninth intermediate structure of the backlight layer provided in an exemplary embodiment of this application;

[0058] Figure 30 This is a partial cross-sectional view of the tenth intermediate structure of the backlight layer provided in an exemplary embodiment of this application;

[0059] Figure 31 This is a partial cross-sectional view of the eleventh intermediate structure of the backlight layer provided in an exemplary embodiment of this application;

[0060] Figure 32 This is a partial cross-sectional view of the twelfth intermediate structure of the backlight layer provided in an exemplary embodiment of this application;

[0061] Figure 33 This is a partial cross-sectional view of the thirteenth intermediate structure of the backlight layer provided in an exemplary embodiment of this application;

[0062] Figure 34 This is a partial cross-sectional view of the backlight layer provided in an exemplary embodiment of this application.

[0063] Figure 35 A partial structural schematic diagram of a substrate provided for an exemplary embodiment of this application;

[0064] Figure 36 This is a partial structural schematic diagram of a substrate provided for an exemplary embodiment of this application. Detailed Implementation

[0065] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0066] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0067] Please see details. Figure 1 This application provides a display panel including a color filter substrate 2000 and a cell-mount substrate 1000 disposed opposite to each other, and a liquid crystal layer 3000 disposed between the color filter substrate 2000 and the cell-mount substrate 1000.

[0068] This application does not limit the type of display panel. The display panel can be an IPS (In-Plane Switching) driving mode display panel in which the common electrode and the pixel electrode are set on the same layer, or a TN (Twisted Nematic) driving mode display panel in which the common electrode and the pixel electrode are set opposite to each other, or an MVA (Multi-domain Vertical Alignment) driving mode display panel, or an FFS (Fringe Field Switching) driving mode display panel.

[0069] Please see details. Figure 2 This application provides a substrate 1000, comprising:

[0070] A backlight layer 100 includes a plurality of light-emitting elements 130 arranged in an array. The backlight layer 100 includes a substrate 10 and a plurality of light-emitting elements 130 arranged in an array on the substrate 10. The substrate 10 includes a plurality of protrusions 20 arranged in an array. The orthographic projection of the light-emitting elements 130 on the substrate 10 at least partially overlaps with the protrusions 20.

[0071] A polarizing layer 200 is disposed on the side of the backlight layer 100 away from the light-emitting element 130;

[0072] A substrate layer 300 is disposed on the side of the polarizing layer 200 away from the backlight layer 100, and the surface of the substrate layer 300 is flush with the side away from the backlight layer 100.

[0073] A driving circuit layer 400 is disposed on the surface of the substrate layer 300 away from the backlight layer 100.

[0074] The cell substrate 1000 provided in this embodiment uses the light-emitting surface of the independent backlight structure as the base of the cell substrate 1000. By forming the driving circuit and liquid crystal cell on the base, the overall thickness of the display module can be reduced. By setting the polarizing layer 200 on the backlight layer 100, the light control effect of the backlight layer 100 can be improved, thereby improving the display effect.

[0075] The substrate 10 is made of glass, which can improve the alignment effect of the alignment process when it is used as the alignment substrate 1000, and improve the fabrication effect of the display panel. In addition, the substrate 10 in this application can also be used as the substrate for fabricating the light-emitting element 130, improving the fabrication effect of the backlight layer 100, and simplifying the thickness of the backlight layer 100.

[0076] Optionally, the polarizing layer 200 is a metal wire grid polarizing layer 200. By setting the polarizing layer 200 on the light-emitting side of the backlight layer 100, the light control effect of the backlight layer 100 is improved. By using the metal wire grid polarizing layer 200, the thickness of the substrate 1000 can be reduced.

[0077] The polarizing layer 200 includes a plurality of light-transmitting gratings 210 arranged in an array, and the orthographic projection of the light-transmitting gratings 210 on the backlight layer 100 at least partially overlaps with the light-emitting area of ​​the light-emitting element 130.

[0078] Optionally, the substrate layer 300 is an organic material, and the substrate layer 300 fills the light-transmitting grating 210. By filling the substrate layer 300 with a metal wire grid polarizing layer 200, it serves as a substrate for the subsequent fabrication of the driving circuit layer 400, reducing the fabrication difficulty and improving the fabrication effect.

[0079] The driving circuit layer 400 includes thin-film transistors for controlling the liquid crystal layer 3000, as well as a pixel electrode layer and a common electrode layer. The thin-film transistors include a gate layer, a source layer, and a drain layer.

[0080] For example, the thin-film transistor (TFT) array layer may specifically include: an active layer, a gate insulating layer, a gate layer, an interlayer dielectric layer, a source / drain electrode layer, and a planarization layer sequentially formed on a substrate. As described above, the TFT structure is a top-gate type. However, the TFT structure in this embodiment can also be a bottom-gate type; this embodiment is not limited to this.

[0081] In one embodiment, the light-emitting element 130 can be any one of an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QD), or an inorganic light-emitting diode (LED). The light-emitting element 130 can be a micro-LED, such as a micro LED, a sub-millimeter light-emitting diode (Mini LED), or a micro organic light-emitting diode (Micro OLED). This application does not limit this specific application.

[0082] The smaller size of micro-LEDs makes high resolution easier to achieve, such as 4K or even 8K resolution smartphones. Compared to the microsecond-level response time of OLED elements, the response time of micro-LEDs is reduced to the nanosecond level, which is 1000 times faster. In this embodiment, the light-emitting element 130 used in the backlight layer 100 is a micro-LED.

[0083] To further reduce the thickness of the substrate 1000, such as Figure 3 As shown, this application provides an ultra-thin backlight layer 100. The backlight layer 100 provided in this embodiment achieves a thickness of 0.55mm by employing an ultra-thin backlight, wherein the glass substrate is 0.3mm thick, the encapsulant is 0.25mm thick, and the final module thickness formed on the substrate 1000 is 0.8mm. This achieves an extremely thin display module.

[0084] The substrate 10 includes a first surface 101 and a second surface 102 facing each other. The first surface 101 has a groove 11. The protrusion 20 is located within the groove 11 and is spaced apart from the side surface of the groove 11. In the direction from the first surface 101 to the second surface 102, the area of ​​the cross-section of the protrusion 20 parallel to the second surface 102 gradually increases. The first reflective layer 50 at least covers the side surface of the protrusion 20. The second reflective layer 30 is located on the side of the substrate 10 away from the second surface 102, and covers the area of ​​the substrate 10 surrounding the groove 11. The conductive layer 40 is located on the side of the second reflective layer 30 opposite to the substrate 10, and the conductive layer 40 includes a conductive pad 41.

[0085] The backlight layer 100 provided in this application embodiment has a groove on the first surface of the substrate. In the direction from the first surface of the substrate to the second surface, the cross-section of the protrusion located in the groove of the substrate gradually increases. Light incident from one side of the first surface of the substrate onto the first reflective layer covering the side of the protrusion is reflected by the first reflective layer. The light reflected by the first reflective layer is incident on the second reflective layer disposed around the groove and is reflected again. Part of the light emitted by the second reflective layer passes directly through the surface of the substrate away from the second reflective layer and exits, while the other part of the light is reflected multiple times in the substrate and exits through the surface of the substrate away from the second reflective layer, which can improve the uniformity of the emitted light. In this way, the backlight layer 100 can be without a uniform light film layer or reduce the number of uniform light film layers, which is beneficial to reduce the basic thickness of the array.

[0086] In this embodiment, the side surface of the groove 11 refers to the portion of the inner surface of the groove 11 that is opposite to and continuous with the protrusion 20, and the bottom surface of the groove 11 refers to the portion of the inner surface of the groove 11 that is not opposite to and continuous with the protrusion 20 and the portion that contacts the bottom of the protrusion 20. The distance from the bottom surface of the groove 11 to the second surface 102 of the substrate 10 is less than the minimum distance from the side surface to the second surface 102 of the substrate 10.

[0087] In one embodiment, the refractive index of the substrate 10 is greater than that of air. With this configuration, when light reflected by the second reflective layer 30 is incident on the second surface 102 of the substrate 10, a portion of the light can undergo total internal reflection and be re-incidentally incident on the second reflective layer 30. This further improves the uniformity of the emitted light. In some embodiments, the material of the substrate 10 may be sapphire, quartz, etc.

[0088] In one embodiment, the distance from the surface of the protrusion 20 away from the second surface 102 to the second surface 102 is less than or equal to the distance from the first surface 101 to the second surface 102. Figure 3 In the embodiment shown, the distance from the surface of the protrusion 20 away from the second surface 102 to the second surface 102 is less than the distance from the first surface 101 to the second surface 102. Figures 2 to 6 In the embodiment shown, the distance from the surface of the protrusion 20 away from the second surface 102 to the second surface 102 is equal to the distance from the first surface 101 to the second surface 102.

[0089] In one embodiment, the material of the protrusion 20 is the same as the material of the substrate 10. This can improve the adhesion between the protrusion 20 and the substrate 10.

[0090] Furthermore, the protrusion 20 and the substrate 10 are an integral structure.

[0091] In one embodiment, the longitudinal section of the side surface of the protrusion 20 is approximately an arc, a straight line, or a broken line. "Approximately an arc" means that it is generally arc-shaped, but not limited to a standard arc. That is, "arc" here includes not only the shape of a basic arc, but also shapes resembling arcs. For example, some points in the longitudinal section of the side surface of the protrusion 20 may not lie on the same circle as other points. "Approximately a straight line" means that it is generally straight, but not limited to a standard straight line. That is, "straight line" here includes not only the shape of a basic straight line, but also shapes resembling straight lines. For example, some points in the longitudinal section of the side surface of the protrusion 20 may not lie on the same straight line as other points. "Approximately a broken line" means that it is generally broken, but not limited to a standard broken line. That is, "broken line" here includes not only the shape of a basic broken line, but also shapes resembling broken lines. For example, a segment in the longitudinal section of the side surface of the protrusion 20 may be arc-shaped. The longitudinal direction refers to the direction perpendicular to the second surface 102 of the substrate.

[0092] In one embodiment, such as Figures 3 to 6 As shown, the substrate 10 has a plurality of grooves 11 arranged at intervals, and the second reflective layer 30 covers the area of ​​the substrate 10 surrounding each groove 11.

[0093] In one embodiment, in the direction from the first surface 101 to the second surface 102, the area of ​​the groove 11 parallel to the cross section of the second surface 102 gradually decreases.

[0094] In one embodiment, such as Figure 3 As shown, the area surrounding the protrusion 20 on the bottom surface of the groove 11 is planar.

[0095] In one embodiment, such as Figure 7 As shown, the outer contour of the protrusion 20 projected onto the second surface 102 of the substrate 10 is circular, and the outer contour of the groove 11 projected onto the second surface 102 of the substrate 10 is also circular.

[0096] In one embodiment, such as Figure 7 As shown, the center of the outer contour of the protrusion 20 projected onto the second surface 102 of the substrate 10 coincides with the center of the outer contour of the groove 11 projected onto the second surface 102 of the substrate 10.

[0097] In one embodiment, the ratio of the radius of the outer contour of the orthographic projection of the protrusion 20 on the second surface 102 of the substrate 10 to the radius of the outer contour of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10 is less than 0.5.

[0098] In one embodiment, the conductive layer 40 includes a plurality of conductive pads 41, which are divided into a plurality of conductive pad groups. Each conductive pad 41 in a conductive pad group is used for soldering to an electronic component. Specifically, the electronic component includes at least two pins, and the number of pins in the electronic component is the same as the number of conductive pads 41 in its corresponding conductive pad group. Each pin is soldered to one conductive pad 41. The electronic component may include an inorganic light-emitting diode with a size on the order of hundreds of micrometers or less, or a driver chip with a size on the order of hundreds of micrometers or less.

[0099] In one embodiment, the conductive layer 40 further includes a plurality of signal lines for providing signals to the inorganic light-emitting diode and / or the driver chip. The plurality of signal lines may include a common voltage line, a drive voltage line, a source power supply line, a source address line, a clock signal line, a data line, etc. In some embodiments, the thickness of the conductive layer 40 may range from 2 μm to 7 μm.

[0100] In one embodiment, such as Figures 3 to 6As shown, the backlight layer 100 further includes a color conversion structure 70 located within the groove 11. The color conversion structure 70 may cover the first reflective layer 50. When the light emitted by the light-emitting element of the backlight layer 100 is non-white light, the color conversion structure 70, under the excitation of the non-white light, converts the light into white light to improve the utilization rate of light energy. By placing the color conversion structure 70 within the groove 11, the color conversion structure 70 does not increase the thickness of the backlight layer 100, thus contributing to the thinning of the backlight layer 100. In some embodiments, the material of the color conversion structure 70 may include at least one of quantum dot materials and fluorescent materials.

[0101] In one embodiment, the color conversion structure 70 of the backlight layer 100 is made of quantum dot materials of different colors. For example, when the light-emitting element emits blue light, the color conversion structure 70 of the backlight layer 100 may include red quantum dot materials, green quantum dot materials, and transparent materials, and the same color conversion structure 70 may include quantum dot materials of one color. When blue light passes through the red quantum dot material, it is converted into red light; when blue light passes through the green quantum dot material, it is converted into green light; blue light can pass directly through the transparent material; and when blue light, red light, and green light are mixed and superimposed in a certain proportion, they appear as white light.

[0102] In other embodiments, when the light emitted by the light-emitting element is white light, the color conversion structure 70 does not need to be filled in the groove 11. In this case, the groove 11 can be filled with transparent organic resin. The transmittance of the transparent organic resin can be greater than or equal to 95%, and the refractive index of the transparent organic resin is less than the refractive index of the substrate 10.

[0103] In one embodiment, the distance from the surface of the color conversion structure 70 away from the second surface 102 to the second surface 102 is less than or equal to the distance from the first surface 101 to the second surface 102. Figures 3 to 6 In the illustrated embodiment, the distance from the surface of the color conversion structure 70 away from the second surface 102 to the second surface 102 is equal to the distance from the first surface 101 to the second surface 102. In other embodiments, the distance from the surface of the color conversion structure 70 away from the second surface 102 to the second surface 102 may be less than the distance from the first surface 101 to the second surface 102.

[0104] In this embodiment of the application, in order to form a polarizing layer 200 and a light-emitting element 130 on the two side surfaces of the substrate 10 respectively, the color conversion structure 70 is flush with the first surface 101 on the side away from the second surface 102, and the light-emitting element 130 is disposed on the first surface 101; the second surface 102 is flush with the side away from the light-emitting element 130, and the polarizing layer 200 is disposed on the second surface 102.

[0105] In one embodiment, such as Figures 3 to 6 As shown, the backlight layer 100 further includes an encapsulation layer 60, which is located between the substrate 10 and the conductive layer 40. The encapsulation layer 60 covers the color conversion structure 70. This configuration allows the encapsulation layer 60 to protect the color conversion structure 70, thereby reducing the risk of water and oxygen erosion causing the color conversion structure 70 to fail.

[0106] In one embodiment, the encapsulation layer 60 includes an organic film layer and an inorganic film layer, with the film layer furthest from the substrate 10 being an inorganic film layer. The encapsulation layer 60 may include multiple inorganic film layers, and the material of the inorganic film layers may include at least one of silicon carbonitride and silicon oxide.

[0107] In one embodiment, the encapsulation layer 60 is a continuous, solid film layer that covers each color conversion structure 70 and the gaps between adjacent color conversion structures 70. In some embodiments, the orthographic projection of the encapsulation layer 60 onto the second surface 102 of the substrate may cover the second surface 102 of the substrate 10. Alternatively, all the grooves 11 are located in the central region of the substrate 10, and the encapsulation layer 60 covers the central region of the substrate 10 but does not cover the edge regions of the substrate 10.

[0108] In one embodiment, the material of the second reflective layer 30 includes a conductive material. The orthographic projection of the organic film layer of the encapsulation layer 60 onto the second surface 102 of the substrate 10 overlaps with the orthographic projection of the second reflective layer 30 onto the second surface 102 of the substrate 10. The relatively large thickness of the organic film layer, with its orthographic projection onto the second surface 102 of the substrate 10 overlapping the orthographic projection of the second reflective layer 30 onto the second surface 102 of the substrate 10, reduces signal interference from the second reflective layer 30 to the conductive layer 40. In some embodiments, the thickness of the organic film layer is greater than or equal to 2 μm, the thickness of the inorganic film layer located on the side of the organic film layer away from the substrate is greater than or equal to 1000 angstroms, and the total thickness of all inorganic film layers in the encapsulation layer 60 is greater than or equal to 1 μm.

[0109] In one embodiment, the reflectivity of the first reflective layer 50 is greater than or equal to 85%. In some embodiments, the material of the first reflective layer 50 may include a metal, such as at least one of aluminum, silver, copper, and platinum. Alternatively, the material of the first reflective layer 50 may include white ink and / or silicone-based white adhesive.

[0110] In one embodiment, such as Figures 3 to 6 As shown, the second reflective layer 30 may have multiple openings 303, each opening 303 exposing at least a portion of a groove 11. The openings of the second reflective layer 30 and the grooves 11 may correspond one-to-one, with each opening 303 exposing at least a portion of the corresponding groove 11. Light emitted by the light-emitting element can enter the first reflective layer 50 through the openings 303 of the second reflective layer 30.

[0111] In one embodiment, such as Figures 3 to 6 As shown, the edge of the orthographic projection of the opening 303 of the second reflective layer 30 onto the second surface 102 of the substrate 10 is located inside the edge of the orthographic projection of the corresponding groove 11 onto the second surface 102 of the substrate 10; the orthographic projection of the second reflective layer 30 onto the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the protrusion 20 onto the second surface 102 of the substrate 10. With this configuration, a portion of the light reflected by the first reflective layer 50 is incident on the portion of the second reflective layer 30 opposite to the groove 11, and finally exits from the surface of the substrate 10 away from the second reflective layer 30. This helps improve light efficiency compared to a scheme where the second reflective layer 30 does not include the portion opposite to the groove 11. The second reflective layer 30 can act as a mask when forming the groove 11, thus saving the mask in the process step of forming the groove 11 and reducing the fabrication cost of the backlight layer 100. Since the orthographic projection of the second reflective layer 30 on the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the protrusion 20 on the second surface 102 of the substrate 10, the second reflective layer 30 will not obstruct the propagation of light emitted by the light-emitting element to the first reflective layer 50.

[0112] In one embodiment, such as Figures 3 to 6 As shown, the second reflective layer 30 includes a first reflective portion 301 and a second reflective portion 302. The orthographic projection of the first reflective portion 301 on the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10. The orthographic projection of the second reflective portion 302 on the second surface 102 of the substrate 10 falls within the orthographic projection of the groove 11 on the second surface 102 of the substrate 10.

[0113] In one embodiment, such as Figures 3 to 6As shown, the second reflective layer 30 includes a first sub-reflective layer 31, a second sub-reflective layer 32 located on the side of the first sub-reflective layer 31 away from the substrate 10, and a third sub-reflective layer 33 located on the side of the second sub-reflective layer 32 away from the substrate.

[0114] In one embodiment, the orthographic projection of the first sub-reflective layer 31 onto the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the groove 11 onto the second surface 102 of the substrate 10; the reflectivity of the first sub-reflective layer 31 is greater than that of the second sub-reflective layer 32. Because the first sub-reflective layer 31 has a higher reflectivity, more light reflected by the first reflective layer 50 is reflected by the first sub-reflective layer 31 after incident on it, thus increasing the light emissivity and reducing light loss.

[0115] In some embodiments, the reflectivity of the first sub-reflective layer 31 is greater than or equal to 85%. Exemplarily, the material of the first sub-reflective layer 31 may include a metal, such as at least one of aluminum, silver, copper, and platinum. Exemplarily, the material of the first sub-reflective layer 31 may include white ink and / or silicone-based white adhesive.

[0116] In one embodiment, the orthographic projection of the second sub-reflective layer 32 onto the second surface 102 of the substrate 10 overlaps with the orthographic projection of the groove 11 onto the second surface 102 of the substrate 10. This configuration allows the second sub-reflective layer 32 to act as a mask when forming the groove. In some embodiments, the material of the second sub-reflective layer 32 may include a metal, such as molybdenum, thus providing good corrosion resistance. During etching of the substrate with an etchant, the portion of the second sub-reflective layer 32 extending beyond the first sub-reflective layer 31 is less likely to collapse; and the second sub-reflective layer 32 covers the edge of the first sub-reflective layer 31, protecting the first sub-reflective layer 31 during etching.

[0117] In one embodiment, the third sub-reflective layer 33 covers the second sub-reflective layer 32, and the material of the third sub-reflective layer 33 is the same as the material of the first reflective layer 50. The orthographic projection of the third sub-reflective layer 33 on the second surface 102 of the substrate 10 coincides with the orthographic projection of the second sub-reflective layer 32 on the second surface 102 of the substrate 10. Because the third sub-reflective layer 33 covers the second sub-reflective layer 32, the thickness and strength of the portion of the second reflective layer 30 opposite to the groove 11 can be increased, which helps to prevent the portion of the second reflective layer 30 opposite to the groove 11 from collapsing before the color conversion structure or transparent organic resin is formed in the groove 11. Since the material of the third sub-reflective layer 33 is the same as the material of the first reflective layer 50, the third sub-reflective layer 33 and the first reflective layer 50 can be formed simultaneously, which helps to simplify the manufacturing process.

[0118] In one embodiment, such as Figures 3 to 6 As shown, the first reflective portion 301 of the second reflective layer 30 includes a portion of the first sub-reflective layer 31, a portion of the second sub-reflective layer 32, and a portion of the third sub-reflective layer 33; the second reflective portion 302 includes the region of the second sub-reflective layer 32 opposite to the groove 11 and the region of the third sub-reflective layer 33 opposite to the groove 11.

[0119] In one embodiment, the orthographic projection of the second reflective layer 30 on the second surface 102 of the substrate 10 overlaps with the orthographic projection of the first reflective layer 50 on the second surface 102 of the substrate 10. Figures 3 to 6 In the illustrated embodiment, the edge of the orthographic projection of the second reflective portion 302 onto the second surface 102 of the substrate 10 overlaps with the outer edge of the orthographic projection of the first reflective layer 50 onto the second surface 102 of the substrate 10. This arrangement prevents the first reflective layer 50 from covering the side surface of the groove 11, reducing the amount of light reflected by the first reflective layer 50 that exits through the opening of the groove 11 and minimizing light loss. In other embodiments, the orthographic projection of the second reflective portion 302 onto the second surface 102 of the substrate 10 partially overlaps with the orthographic projection of the first reflective layer 50 onto the second surface 102 of the substrate 10, meaning the first reflective layer 50 covers a portion of the side surface of the groove 11.

[0120] In one embodiment, such as Figure 4 and Figure 6As shown, the first reflective portion 301 has a plurality of spaced-apart light-diffusing structures 311 on its surface facing the substrate 10. The light-diffusing structures 311 can disperse the light incident on the second reflective layer 30 so that it is scattered in various directions. Specifically, the light reflected by the first reflective layer 50 is dispersed by the light-diffusing structures 311 after it is incident on the second reflective layer 30, changing the propagation direction of the light. After being reflected by the second reflective layer 30, the light is emitted through the surface of the substrate away from the second reflective layer 30, which can improve the brightness uniformity of the backlight layer 100.

[0121] In one embodiment, the light-diffusing structure 311 is uniformly distributed across the surface of the first reflective portion facing the substrate 10, and the distance between the edge of the first sub-reflective layer 31 near the groove 11 and the groove 11 is less than or equal to 5 μm. This arrangement avoids a large distance between the edge of the first sub-reflective layer 31 near the groove 11 and the groove 11, which would prevent light reflected by the first reflective layer from reaching the light-diffusing structure in the area between the edge of the first sub-reflective layer 31 near the groove 11 and the groove 11, thus preventing sufficient scattering of this portion of the light.

[0122] In one embodiment, such as Figure 4 and Figure 8 As shown, the light-uniforming structure 311 includes a plurality of recessed structures 312 arranged at intervals, and the backlight layer 100 also includes a plurality of support portions 13 arranged at intervals between the second reflective layer 30 and the substrate 10, with the second reflective layer 30 in direct contact with the support portions 13. The provision of the support portions 13 facilitates the formation of the recessed structures 312.

[0123] In one embodiment, the support portion 13 may be made of a transparent resin material. The maximum dimension of the cross-section of the support portion 13 parallel to the surface of the substrate 10 ranges from 5 μm to 50 μm. This configuration allows for better light uniformity in the formed uniform light structure 311, and also makes the support portion 13 easier to fabricate. In some embodiments, the maximum dimension of the cross-section of the support portion 13 parallel to the surface of the substrate 10 is 5 μm, 15 μm, 25 μm, 35 μm, 45 μm, 50 μm, etc.

[0124] In one embodiment, such as Figure 4 and Figure 8 As shown, the recessed structure 312 is formed on the surface of the first sub-reflective layer 31 facing the substrate 10, and the regions of the second sub-reflective layer 32 and the third sub-reflective layer 33 opposite to the recessed structure 312 are also formed with recessed structures.

[0125] In one embodiment, the support portion 13 may be approximately conical, pyramidal, or spherical cap in shape. "Approximately conical and pyramidal" means that it is generally conical or pyramidal in shape, but is not limited to standard conical or pyramidal shapes. That is, "conical and pyramidal" here includes not only the shapes of basic cones and pyramids, but also shapes similar to cones and pyramids. For example, the apex of a conical or pyramidal shape is a curved surface. "Approximately spherical cap" means that it is generally spherical cap in shape, but is not limited to a standard spherical cap. That is, "spherical cap" here includes not only the shape of a basic spherical cap, but also shapes similar to spherical caps. For example, the upper half of a spherical cap is a standard spherical cap, and the lower half is a cylinder.

[0126] In one embodiment, when the second reflective layer 30 is located between the encapsulation layer 60 and the substrate 10, the support portion 13 is located on the side of the second reflective layer 30 facing the substrate 10. The support portion 13 can be in direct contact with the substrate 10. Alternatively, the second reflective layer 30 is located on the side of the encapsulation layer 60 away from the substrate 10, and the support portion 13 is located between the encapsulation layer 60 and the second reflective layer 30.

[0127] In one embodiment, such as Figure 5 and Figure 9 As shown, the uniform light structure 311 includes a plurality of spaced-apart protrusions 313 facing the substrate 10, and a plurality of spaced-apart recesses 12 are provided on the surface of the substrate 10 facing the conductive layer 40, with the protrusions 313 located within the recesses 12. Each protrusion 313 corresponds one-to-one with a recess 12, with each protrusion 313 located within its corresponding recess 12. The formation of the protrusions 313 is facilitated by providing recesses 12 on the surface of the substrate 10.

[0128] In one embodiment, such as Figure 5 and Figure 9 As shown, the protrusion structure 313 is formed on the side of the first sub-reflective layer 31 facing the substrate 10, and the second sub-reflective layer 32 and the third sub-reflective layer 33 also have protrusion structures in the areas opposite to the protrusion structure 313.

[0129] In one embodiment, the shape of the protrusion may be approximately one of a cone, a pyramid, and a spherical cap.

[0130] In one embodiment, such as Figure 6As shown, the backlight layer 100 further includes a transparent organic layer 80 located within the groove 11. The orthographic projection of the second reflective layer 30 onto the second surface 102 of the substrate 10 overlaps with the orthographic projection of the groove 11 onto the second surface 102 of the substrate 10. The orthographic projection of the transparent organic layer 80 onto the second surface 102 of the substrate 10 covers this overlapping area. This configuration allows the transparent organic layer 80 to support the second reflective portion 302 of the second reflective layer 30, preventing the area of ​​the second reflective layer 30 opposite to the groove 11 from collapsing. Furthermore, by forming the transparent organic layer 80 before forming the first reflective layer 50, the transparent organic layer 80 prevents the first reflective layer 50 from extending to the side of the groove 11, thereby reducing the amount of light reflected by the first reflective layer 50 exiting through the opening of the groove 11 and reducing light loss.

[0131] In one embodiment, such as Figure 6 As shown, the orthographic projection of the transparent organic layer 80 onto the second surface 102 of the substrate 10 coincides with the overlapping region. Thus, the transparent organic layer 80 provides better support for the second reflective portion 302. The transmittance of the transparent organic layer can be greater than or equal to 95%, and the refractive index of the transparent organic layer is less than the refractive index of the substrate 10.

[0132] In one embodiment, such as Figure 6 As shown, the color conversion structure 70 is located between the transparent organic layer 80 and the first reflective layer 50.

[0133] In one embodiment, such as Figure 4 As shown, the width of the second reflective part 302 is the first dimension d1; the longitudinal section of the side of the groove 11 is an arc, and the length of the radius of the circle containing the longitudinal section of the side of the groove 11 is the second dimension d2; the first dimension d1 is equal to the second dimension d2, and is equal to the depth h of the groove 11.

[0134] Furthermore, such as Figure 4 As shown, the longitudinal section of the side of the protrusion 20 is an arc, and the length of the radius of the circle containing the longitudinal section of the side of the protrusion 20 is the third dimension d3, which is equal to the depth h of the groove 11.

[0135] This application also provides a method for preparing a substrate 1000, the method comprising:

[0136] S100. A substrate 10 is provided, and a plurality of protrusions 20 arranged in an array and light-emitting elements 130 arranged in an array are formed on the substrate 10 to form a backlight layer 100. The backlight layer 100 includes a plurality of light-emitting elements 130 arranged in an array, and the orthographic projection of the light-emitting elements 130 on the substrate 10 at least partially overlaps with the protrusions 20.

[0137] In this step, the light-emitting element 130 uses the glass substrate of the substrate 10 as the substrate, and the backlight layer 100 is formed by forming the light-emitting element 130 on the substrate.

[0138] Specifically, step S100 includes:

[0139] Step 110: A groove is formed on the surface of the substrate, a protrusion is formed in the groove, a first reflective layer and a second reflective layer are formed, the first reflective layer at least covers the side of the protrusion, and the second reflective layer covers the area of ​​the substrate surrounding the groove.

[0140] In one embodiment, step 110 includes the following process:

[0141] First, a mask is formed on a substrate.

[0142] This step yields the following result: Figure 11 The first intermediate structure shown. (As shown) Figure 11 As shown, the photomask 81 is formed on the surface of the substrate 82. The photomask 81 includes a first mask portion 811 and a second mask portion 812. The first mask portion 811 has a through hole, and the second mask portion 812 is located inside the through hole of the first mask portion 811, with a gap between the second mask portion 812 and the first mask portion 811. The surface of the second mask portion 812 may be circular, the through hole of the first mask portion 811 may be circular, and the center of the surface of the second mask portion 812 may coincide with the center of the through hole of the first mask portion 811. The diameter of the surface of the second mask portion 812 is D1, the diameter of the through hole of the first mask portion 811 may be D2, and the distance between the edge of the through hole of the first mask portion 811 and the edge of the second mask portion 812 is a, then D2 = D1 + 2a.

[0143] In some embodiments, D1 ≥ 5 μm. The value of D1 is related to the height of the subsequently formed protrusion; the larger D1 is, the greater the height of the formed protrusion. By setting D1 ≥ 5 μm, it is possible to avoid the protrusion being too small, which would result in the first reflective layer covering the side of the protrusion being too small, causing less light emitted by the light-emitting element to be reflected by the first reflective layer and failing to effectively improve the uniformity of the light.

[0144] In one embodiment, a ≥ 2 μm. This setting avoids the distance between the edge of the through hole of the first mask portion 811 and the edge of the second mask portion 812 being too small, which would affect the contact between the etching solution and the substrate.

[0145] In one embodiment, such as Figure 11 As shown, the first mask portion 811 includes a first sub-reflective layer 31 and a second sub-reflective layer 32 located on the side of the first sub-reflective layer 31 away from the substrate 82. The distance between the inner edge of the second sub-reflective layer 32 and the second mask portion 812 is less than the distance between the inner edge of the first sub-reflective layer 31 and the second mask portion 812. The second sub-reflective layer 32 covers the edge of the first sub-reflective layer facing the second mask portion 812.

[0146] Subsequently, a wet etching process is used to etch the substrate to form grooves, resulting in a substrate including the grooves and protrusions located within the grooves.

[0147] In this step, the etching solution contacts the substrate 82 through the gap between the first mask portion 811 and the second mask portion 812, and etches the substrate 82. Due to the presence of the second mask portion 812, the area of ​​the substrate 82 covered by it is not completely etched away; the retained area is the protrusion. This step yields the following... Figure 10 The second intermediate structure shown. (As shown in the image) Figure 10 As shown, both the substrate 10 and the protrusion 20 are part of the substrate 82, that is, the substrate 10 and the protrusion 20 are integrally formed; there is a gap between the protrusion 20 and the side of the groove 11; the orthographic projection of the second sub-reflective layer 32 of the second mask 812 on the surface of the substrate 10 away from the second sub-reflective layer 32 and the orthographic projection of the groove 11 on the surface of the substrate 10 away from the second sub-reflective layer 32 overlap, that is, a part of the second sub-reflective layer 32 is opposite to the groove 11.

[0148] In this step, the etching solution etches the second mask portion 812 while etching the substrate 82. After the etching of the substrate 82 is completed, the second mask portion 812 can be completely etched away.

[0149] Due to the isotropic nature of wet etching, the area corresponding to the gap between the first mask portion 811 and the second mask portion 812 on the bottom surface of the groove 11 is approximately planar. That is, the area surrounding the protrusion 20 on the bottom surface of the groove 11 is approximately planar, and the width of the planar area on the bottom surface of the groove 11 is approximately equal to a. The longitudinal section of the side surface of the groove 11 is approximately arc-shaped, and the radius of the circle containing the arc is approximately equal to the maximum depth of the groove 11. The longitudinal section of the side surface of the protrusion 20 is approximately arc-shaped, and the radius of the circle containing the arc is approximately equal to the maximum depth of the groove 11. The radius of the circle containing the longitudinal section of the side surface of the groove 11 is approximately the same as the width of the portion of the second sub-reflective layer 32 opposite to the groove 11.

[0150] In one embodiment, the depth of the groove 11 is greater than or equal to D1 / 2. When the depth of the groove 11 is equal to D1 / 2, the top surface of the protrusion 20 is approximately flush with the surface of the substrate 10 facing the first sub-reflective layer 31.

[0151] Subsequently, the first reflective layer is formed.

[0152] This step yields the following result: Figure 11 The third intermediate structure shown. (As shown in the image) Figure 11 As shown, while forming the first reflective layer 50, a third sub-reflective layer 33 covering the second sub-reflective layer 32 is formed, resulting in a second reflective layer 30 including the first sub-reflective layer 31, the second sub-reflective layer 32, and the third sub-reflective layer 33.

[0153] In one embodiment, after step 110, the method for preparing the backlight layer 100 further includes the following step: forming a color conversion structure within the groove.

[0154] This step yields the following result: Figure 12 The fourth intermediate structure is shown. (As shown in the image) Figure 12 As shown, the surface of the color conversion structure 70 facing the second sub-reflective layer 32 may be flush with the surface of the substrate 10 facing the second sub-reflective layer 32. In other embodiments, the surface of the color conversion structure 70 facing the second sub-reflective layer 32 may be lower than the surface of the substrate 10 facing the second sub-reflective layer 32.

[0155] In another embodiment, if the light emitted by the light-emitting element is white, after step 110, the method for preparing the backlight layer 100 further includes the following process: forming a transparent organic layer in the groove.

[0156] In one embodiment, after the step of forming the color conversion structure in the groove, the method for preparing the backlight layer 100 further includes the step of forming an encapsulation layer covering the color conversion structure.

[0157] This step yields the following result: Figure 13 The fifth intermediate structure is shown. (As shown in the image.) Figure 13 As shown, the encapsulation layer 60 covers the color conversion structure 70 and the second reflective layer 30.

[0158] Step 120: A conductive layer is formed on the side of the second reflective layer away from the substrate, the conductive layer including a conductive pad.

[0159] This step yields the following result: Figure 1 The backlight layer 100 is shown.

[0160] In one embodiment, prior to step 110, the method for preparing the backlight layer 100 further includes the following step: forming a plurality of support portions on the surface of the substrate.

[0161] This step yields the following result: Figure 14 The sixth intermediate structure is shown. (As shown in the image.) Figure 14 As shown, a plurality of support portions 13 are formed on the surface of the substrate 82, and the continuous area on the surface of the substrate 82 without support portions 13 can be approximately circular. In some embodiments, a resin material can be coated on the surface of the substrate 82 first, and then the resin material can be patterned to obtain a plurality of support portions 13.

[0162] In this embodiment, after the step of forming a mask on the substrate, the following can be obtained: Figure 15 and Figure 16 The first intermediate structure shown. (As shown) Figure 15 and Figure 16 As shown, a uniform light structure 311 is formed in the area of ​​the first sub-reflective layer 31 that contacts the support portion 13 on the surface of the substrate 10. The uniform light structure 311 is a recessed structure 312. The area of ​​the second sub-reflective layer corresponding to the recessed structure 312 also forms a recessed structure.

[0163] In this embodiment, after the step of etching the substrate using a wet etching process to form grooves, the desired result is as follows: Figure 17 The second intermediate structure shown.

[0164] In this embodiment, after the step of forming the first reflective layer, the following can be obtained: Figure 18 The third intermediate structure shown. (As shown in the image) Figure 18 As shown, a third sub-reflective layer 33 covering the second sub-reflective layer 32 is formed at the same time as the first reflective layer 50 is formed. The third sub-reflective layer 33 has a recessed structure in the region corresponding to the recessed structure 312 of the first sub-reflective layer 31.

[0165] In this embodiment, the final backlight layer 100 is as follows: Figure 2 As shown.

[0166] In one embodiment, prior to step 110, the method for preparing the backlight layer 100 further includes the following step: forming a plurality of recesses on the surface of the substrate.

[0167] This step yields the following result: Figure 19 The seventh intermediate structure is shown. (As shown in the image.) Figure 19 As shown, a plurality of spaced-apart recesses 12 are formed on the surface of the substrate 82, and the continuous areas on the surface of the substrate 82 without recesses 12 can be approximately circular. In this step, a mask can be formed on the surface of the substrate 82 first, and then an etching solution is used to etch the substrate to form the recesses. When the substrate material is glass, the etching solution may include hydrofluoric acid, and the mask material may be molybdenum. After the recesses are formed, the mask is removed.

[0168] In this embodiment, after the step of forming a mask on the substrate, the following can be obtained: Figure 20 and Figure 21 The first intermediate structure shown. (As shown) Figure 20 and Figure 21 As shown, the first sub-reflective layer 31 forms a plurality of light-uniforming structures 311 on the surface of the substrate 10. The light-uniforming structure 311 is a raised structure 313 located in the recess 12. The second sub-reflective layer 32 also forms a raised structure in the area corresponding to the raised structure 313.

[0169] In this embodiment, after the step of etching the substrate using a wet etching process to form grooves, the desired result is as follows: Figure 22 The second intermediate structure shown.

[0170] In this embodiment, after the step of forming the first reflective layer, the following can be obtained: Figure 23 The third intermediate structure shown. (As shown in the image) Figure 23 As shown, a third sub-reflective layer 33 covering the second sub-reflective layer 32 is formed at the same time as the first reflective layer 50 is formed. The area of ​​the third sub-reflective layer 33 corresponding to the protrusion structure 313 of the first sub-reflective layer 31 has a protrusion structure.

[0171] In this embodiment, the final backlight layer 100 is as follows: Figure 3 As shown.

[0172] In one embodiment, step 110, which involves forming a groove on the surface of a substrate, forming a protrusion within the groove, forming a first reflective layer and a second reflective layer, wherein the first reflective layer at least covers the side surface of the protrusion, and the second reflective layer covers the region of the substrate surrounding the groove, includes the following process:

[0173] First, a mask is formed on the backlight layer 100.

[0174] This step yields the following result: Figure 24 The first intermediate structure shown. Figure 24 The first intermediate structure shown is Figure 11 The difference in the first intermediate structure shown is that both the first mask portion 811 and the second mask portion 812 include only one film layer, and the material of the first mask portion 811 and the second mask portion 812 can be molybdenum.

[0175] Subsequently, a wet etching process is used to etch the substrate to form grooves, resulting in a substrate including the grooves and protrusions located within the grooves.

[0176] This step yields the following result: Figure 25 The second intermediate structure shown. Figure 25 The second intermediate structure shown is Figure 10 The difference in the second intermediate structure shown is that the first mask portion 811 includes only one film layer.

[0177] Subsequently, the first mask portion 811 is removed.

[0178] This step yields the following result: Figure 26 The eighth intermediate structure is shown. In this step, the first mask portion 811 can be removed using a wet etching process.

[0179] Then, a transparent organic layer is filled into the groove.

[0180] This step yields the following result: Figure 27 The ninth intermediate structure shown. (As shown) Figure 27 As shown, the transparent organic layer 80 completely fills the groove 11, and the surface of the transparent organic layer 80 is flush with the surface of the substrate 10 on the same side. The material of the transparent organic layer 80 can be organic resin.

[0181] Subsequently, a mask layer is formed on the surface where the substrate and the opening of the groove are on the same side.

[0182] This step yields the following result: Figure 28 The tenth intermediate structure is shown. (As shown in the image.) Figure 28 As shown, the mask layer 83 has a through hole, which can be circular, and the center of the circle containing the opening of the groove 11 can coincide with the center of the through hole. The diameter of the through hole in the mask layer 83 is D3, which can be approximately equal to D2.

[0183] In one embodiment, such as Figure 28As shown, the mask layer 83 includes a first sub-reflective layer 31 and a second sub-reflective layer 32 located on the side of the first sub-reflective layer 31 away from the substrate 10. The distance between the edge of the second sub-reflective layer 32 and the groove 11 is less than the distance between the inner edge of the first sub-reflective layer 31 and the groove 11. The second sub-reflective layer 32 covers a portion of the transparent organic layer 80, and there is a gap between the first sub-reflective layer 31 and the outer edge of the transparent organic layer 80.

[0184] Subsequently, a wet etching process was used to etch the transparent organic layer, removing the areas of the transparent organic layer not covered by the mask layer.

[0185] In this step, when the transparent organic layer 80 is made of transparent organic resin, a dry etching process can be used to etch the transparent organic layer 80. This step yields the following result: Figure 29 The eleventh intermediate structure is shown. (See example...) Figure 29 As shown, the area of ​​the transparent organic layer 80 covered by the second sub-reflective layer 32 is preserved. The preserved transparent organic layer 80 can support the second sub-reflective layer 32 and prevent the second sub-reflective layer 32 from collapsing.

[0186] Subsequently, the first reflective layer is formed.

[0187] This step yields the following result: Figure 30 The twelfth intermediate structure shown. (As shown) Figure 30 As shown, a third sub-reflective layer 33 covering the second sub-reflective layer 32 is formed simultaneously with the formation of the first reflective layer 50, resulting in a second reflective layer 30 comprising the first sub-reflective layer 31, the second sub-reflective layer 32, and the third sub-reflective layer 33. In this step, since a transparent organic layer 80 covering the side surface of the groove 11 is formed within the groove 11, the formed first reflective layer 50 is prevented from covering the side surface of the groove 11.

[0188] Subsequently, a color conversion structure is formed within the groove.

[0189] This step yields the following result: Figure 31 The thirteenth intermediate structure is shown. (See example...) Figure 31 As shown, the color conversion structure 70 is located between the transparent organic layer 80 and the protrusion 20.

[0190] Subsequently, an encapsulation layer covering the color conversion structure 70 is formed.

[0191] In this embodiment, the final backlight layer 100 is as follows: Figure 4 As shown.

[0192] The embodiments of the backlight layer 100 preparation method provided in this application and the embodiments of the backlight layer 100 belong to the same inventive concept. The relevant details and beneficial effects can be referred to each other, and will not be repeated here.

[0193] This application also provides a backlight layer 100. The backlight layer 100 includes a plurality of light-emitting elements and the backlight layer 100 described in any of the above embodiments. Figure 32 The backlight layer 100 shown is Figure 1 The backlight layer 100 shown is an example, but not limited to it. For example... Figure 32 As shown, the light-emitting element 130 includes a plurality of pins 911, each of which is soldered to a conductive pad 41.

[0194] In one embodiment, such as Figure 32 As shown, the light-emitting element 130 includes a light-emitting region 912, and the orthographic projection of the light-emitting region 912 on the second surface 102 of the substrate 10 falls within the orthographic projection of the color conversion structure 70 on the second surface 102 of the substrate 10. It should be noted that the light-emitting region 912 refers to the area where the light emitted by the light-emitting element 130 can be emitted when it is working. Figure 32 The light emission area 912 is located between pins 911, and this light emission area 912 is not necessarily a regular area in reality.

[0195] In one embodiment, the edge of the orthographic projection of the light-emitting area of ​​each light-emitting element 130 onto the second surface 102 of the substrate 10 is located inside the edge of the orthographic projection of an opening 303 of the second reflective layer 30 onto the second surface 102 of the substrate 10. This arrangement prevents light emitted by the light-emitting element 130 from being reflected off the surface of the second reflective layer 30 away from the substrate 10, thus helping to reduce light loss.

[0196] In one embodiment, such as Figure 32 The backlight layer 100 further includes a third reflective layer 93, which covers the light-emitting element 130. The third reflective layer 93 has a light-emitting aperture 931 on its side facing the backlight layer 100. The orthographic projection of the light-emitting area 912 of the light-emitting element 130 onto the second surface 102 of the substrate 10 falls within the orthographic projection of the light-emitting aperture 931 onto the second surface 102 of the substrate 10. The third reflective layer 93 can reflect light emitted from the non-light-emitting area of ​​the light-emitting element 130, improving light utilization. The third reflective layer 93 can cover the surface of the light-emitting element 130 away from the backlight layer 100, the side surface of the light-emitting element 130, and a portion of the surface of the light-emitting element 130 facing the backlight layer 100.

[0197] In one embodiment, the material of the light-emitting element 130 includes at least one of white ink and silicone-based white glue. For example, the material of the light-emitting element 130 may be white ink or silicone-based white glue.

[0198] In one embodiment, such as Figure 32 As shown, the light-emitting element 130 also includes an insulating protective layer 92, which covers the leads 911 and conductive pads 41 of the light-emitting element 130, thus protecting the leads 911 and conductive pads 41. The insulating protective layer 92 can be made of transparent resin, and the light transmittance of the transparent resin can be greater than 95%.

[0199] In one embodiment, the backlight layer 100 may further include a driver chip, the driver chip including pins, the pins of the driver chip being soldered to the conductive pad 41.

[0200] S200, a polarizing layer 200 is formed on the side of the backlight layer 100 away from the light-emitting element 130; such as Figure 35 As shown.

[0201] In this step, a polarizing layer 200 is formed on the second surface of the substrate. The polarizing layer 200 can be a metallic material, and the polarizing layer 200 can be formed by imprinting and etching processes to form a wire grating polarizer (WGP).

[0202] S300, a substrate layer 300 is formed on the side of the polarizing layer 200 away from the backlight layer 100. The surface of the substrate layer 300 is flush with the surface of the side away from the backlight layer 100. The substrate layer 300 can be made of polyimide (PI) material, with a film thickness of 3 μm or more, and is coated on the entire surface. It serves as the substrate for the subsequent driving circuit layer 400. The structure after formation is as follows: Figure 36 As shown.

[0203] S400, a driving circuit layer 400 is formed on the surface of the substrate layer 300 away from the backlight layer 100. The driving circuit layer 400 may include multiple layers of metal conductive layers to form a thin film transistor.

[0204] Based on the same concept, this application provides a display device, including the display panel as described above. This display device can be any product or component with display functionality, such as a liquid crystal panel, electronic paper, OLED panel, mobile phone, tablet computer, television, laptop computer, digital photo frame, or navigator.

[0205] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0206] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0207] Unless otherwise defined, the technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for descriptive purposes only and is not intended to limit the invention. Terms such as “set” appearing herein can refer to either a component being directly attached to another component or a component being attached to another component via an intermediary. A feature described in one embodiment herein may be applied, alone or in combination with other features, to another embodiment, unless that feature is not applicable in that other embodiment or is otherwise stated.

[0208] The present invention has been described through the above embodiments; however, it should be understood that the above embodiments are for illustrative purposes only and are not intended to limit the present invention to the described embodiments. Those skilled in the art will understand that many variations and modifications can be made based on the teachings of the present invention, and all such variations and modifications fall within the scope of protection claimed by the present invention.

Claims

1. A substrate for a housing, characterized in that, include: A backlight layer includes a substrate and a plurality of light-emitting elements arrayed on the substrate. The substrate includes a plurality of protrusions arrayed on the substrate. The orthographic projection of the light-emitting elements on the substrate at least partially overlaps with the protrusions. The substrate includes a first surface and a second surface disposed opposite to each other. The first surface is provided with a groove, and the protrusions are spaced apart from the side surfaces of the groove. A polarizing layer disposed on the side of the backlight layer away from the light-emitting element; A substrate layer is disposed on the side of the polarizing layer away from the backlight layer, and the surface of the substrate layer is flush with the side away from the backlight layer. A driving circuit layer disposed on the surface of the substrate layer away from the backlight layer; A first reflective layer that at least covers the sides of the protrusion; the backlight layer also includes a color conversion structure located within the groove; A second reflective layer is disposed on the side of the substrate away from the second surface. The second reflective layer includes a second reflective portion, and the orthographic projection of the second reflective portion on the second surface of the substrate falls within the orthographic projection of the groove on the second surface of the substrate. A conductive layer is disposed on the side of the second reflective layer opposite to the substrate. The conductive layer includes a conductive pad. The light-emitting element includes a plurality of pins, each of which is soldered to one of the conductive pads. An encapsulation layer is disposed between the substrate and the conductive layer, the encapsulation layer covering the color conversion structure.

2. The substrate according to claim 1, characterized in that, The polarizing layer is a metal wire grid type polarizing layer, which includes a plurality of light-transmitting gratings arranged in an array. The orthogonal projection of the light-transmitting gratings on the backlight layer at least partially overlaps with the light-emitting area of ​​the light-emitting element.

3. The substrate according to claim 2, characterized in that, The substrate layer is an organic material, and the substrate layer fills the light-transmitting grating.

4. The substrate according to claim 1, characterized in that, In the direction from the first surface to the second surface, the area of ​​the cross section of the protrusion parallel to the second surface gradually increases.

5. The substrate according to claim 4, characterized in that, The color conversion structure is flush with the first surface on the side away from the second surface; The light-emitting element is disposed on the first surface, and the light-emitting element is a micro LED.

6. The substrate according to claim 4, characterized in that, The second surface is flush with the side away from the light-emitting element, and the polarizing layer is disposed on the second surface.

7. The substrate according to claim 1, characterized in that, The driving circuit layer includes thin-film transistors for controlling the liquid crystal layer, as well as pixel electrode layers and common electrode layers. The thin-film transistors include gate layers, source layers, and drain layers.

8. A method for preparing a substrate as described in any one of claims 1-7, characterized in that, The method includes: A substrate is provided, on which a plurality of protrusions arranged in an array are formed and on which light-emitting elements are arranged in an array are formed to form a backlight layer, the backlight layer including a plurality of light-emitting elements arranged in an array, wherein the orthographic projection of the light-emitting elements on the substrate at least partially overlaps with the protrusions; A polarizing layer is formed on the side of the backlight layer away from the light-emitting element; A substrate layer is formed on the side of the polarizing layer away from the backlight layer, and the surface of the substrate layer is flush with the side away from the backlight layer. A driving circuit layer is formed on the surface of the substrate layer away from the backlight layer.

9. A display panel, characterized in that, It includes a color filter substrate and a cell-mount substrate as described in any one of claims 1-7, wherein a liquid crystal layer is disposed between the color filter substrate and the cell-mount substrate.

10. A display device, characterized in that, Includes the display panel as described in claim 9.

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