Check method, device and equipment for component heat dissipation pad design and medium

Abstract

The application discloses a kind of inspection methods, devices and equipment and medium for component heat dissipation pad design, comprising: reading PCB design file and screening out heat dissipation pad containing package;Each heat dissipation pad of screened package is executed checking step, checking step covers multiple checking items with certain checking order, when any checking item does not meet corresponding design requirement, it is judged that the heat dissipation pad needs to be redesigned, when multiple checking items all meet respective corresponding design requirements, it is judged that the heat dissipation pad meets all design requirements;Checking order is generated according to the design constraint between multiple checking items when meeting heat dissipation pad reliability requirement;Multiple checking items at least include copper foil area design of heat dissipation pad, solder mask bridge design, solder mask window area design, drill hole design in solder mask window, gas guide groove design, drill hole design on heat dissipation pad, jack design and backside bright copper design.The application is automatically checked after PCB design is completed, and can improve checking efficiency and accuracy.

Description

Technical Field

[0001] This invention belongs to the field of PCB design, specifically relating to an inspection method, apparatus, equipment, and medium for the design of thermal pads for components. Background Technology

[0002] Electronic devices generate heat during operation, causing their internal temperature to rise rapidly. If this heat is not dissipated in time, the device will continue to overheat, leading to component failure and reduced reliability. This can result in anything from malfunction to explosions, fires, or even serious safety incidents. Therefore, effective heat dissipation for circuit boards is crucial.

[0003] The heat generated by electronic devices is due to the presence of many heat-generating components on the circuit board, such as MOSFETs, LEDs, and transistors, especially under full load. If heat dissipation is not properly managed, the circuit board may fail at any time. Common heat dissipation methods include creating vias in areas of high heat concentration on the PCB, allowing copper foil to connect the top and bottom surfaces of the board. This increases the surface area and volume available for heat dissipation, reducing thermal resistance and facilitating heat dissipation during operation.

[0004] In practice, EDA engineers often only consider graphic data when designing PCB component packages, easily overlooking the heat dissipation of components. This can easily lead to poorly designed component packages, along with their associated drilling and solder masking. When these components are mounted on the PCB and powered on, various problems caused by poor heat dissipation will arise during operation. Therefore, performing heat dissipation-related checks after PCB layout design is complete is beneficial for early detection of such design flaws and improving product quality. However, the industry currently lacks comprehensive and efficient automated inspection methods. Summary of the Invention

[0005] To address the aforementioned problems in the prior art, this invention provides an inspection method, apparatus, equipment, and medium for the design of component heat dissipation pads. The technical problem to be solved by this invention is achieved through the following technical solution:

[0006] In a first aspect, embodiments of the present invention provide an inspection method for the design of thermal pads for components, the method comprising:

[0007] Read the PCB design file and filter out packages containing heat dissipation pads based on the PCB design file; wherein, the PCB design file includes basic PCB information, PCB layer information, component information, and component package information;

[0008] For each selected package's heat dissipation pad, an inspection step is performed on the heat dissipation pad. The inspection step covers multiple inspection items in a certain inspection order. When any of the inspection items does not meet the corresponding design requirements, it is determined that the heat dissipation pad needs to be redesigned. When all of the multiple inspection items meet their respective design requirements, it is determined that the heat dissipation pad meets all design requirements.

[0009] The inspection sequence is generated based on the design constraints between the multiple inspection items when the reliability requirements of the heat dissipation pad are met; the multiple inspection items include at least the copper foil area design of the heat dissipation pad, the solder mask bridge design, the solder mask opening area design, the drilling design in the solder mask opening, the air duct design, the drilling design on the heat dissipation pad, the plugging design, and the back bright copper design.

[0010] Secondly, embodiments of the present invention provide an inspection device for the design of thermal pads for components, the device comprising:

[0011] The information reading and heat dissipation pad filtering module is used to read PCB design files and filter out packages containing heat dissipation pads based on the PCB design files; wherein, the PCB design files include basic PCB information, PCB layer information, component information and component package information;

[0012] The thermal pad inspection module is used to perform inspection steps on the thermal pad of each selected package. The inspection steps cover multiple inspection items in a certain inspection order. When any of the inspection items does not meet the corresponding design requirements, it is determined that the thermal pad needs to be redesigned. When all the inspection items meet their respective design requirements, it is determined that the thermal pad meets all design requirements.

[0013] The inspection sequence is generated based on the design constraints between the multiple inspection items when the reliability requirements of the heat dissipation pad are met; the multiple inspection items include at least the copper foil area design of the heat dissipation pad, the solder mask bridge design, the solder mask opening area design, the drilling design in the solder mask opening, the air duct design, the drilling design on the heat dissipation pad, the plugging design, and the back bright copper design.

[0014] Thirdly, embodiments of the present invention provide an electronic device, including a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus;

[0015] The memory is used to store computer programs;

[0016] When the processor executes the program stored in the memory, it implements the steps of the inspection method for component heat dissipation pad design provided in the embodiments of the present invention.

[0017] Fourthly, embodiments of the present invention provide a computer-readable storage medium storing a computer program, wherein the computer program, when executed by a processor, implements the steps of the inspection method for component heat dissipation pad design provided in embodiments of the present invention.

[0018] The beneficial effects of this invention are:

[0019] This invention proposes a method for inspecting the design of thermal pads for components. First, the PCB design file is read, and packages containing thermal pads are extracted. Then, for each selected package's thermal pad, an inspection process is performed. This inspection process covers multiple inspection items in a specific order. If any inspection item fails to meet the corresponding design requirements, the thermal pad is determined to need redesign. If all inspection items meet their respective design requirements, the thermal pad is deemed to meet all design requirements. The inspection order in this invention is generated based on the design constraints between the multiple inspection items to meet the reliability requirements of the thermal pad. Each inspection item has a corresponding inspection standard. Thermal pads that meet the design requirements can continue to be used, while those that do not meet the requirements are given modification suggestions. This guides designers to redesign according to the modification suggestions and re-inspect until the final PCB design requirements are met. The multiple inspection items include at least the copper foil area design of the heat dissipation pad, the solder mask bridge design, the solder mask opening area design, the drilling design within the solder mask opening, the air duct design, the drilling design on the heat dissipation pad, the via plugging design, and the back bright copper design, covering all possible heat dissipation pad design items in PCB design. The method of this invention can check whether the heat dissipation pad design conforms to specifications after the PCB design is completed, using computer software or other means, to identify design rationality in advance, and provide modification suggestions to the design team for reference. This ensures the consistency between design and manufacturing, greatly shortens the new product development cycle, improves the yield rate, and can create more profits for enterprises. The inspection sequence of this invention can improve inspection efficiency and accuracy, avoiding missed inspections; and the automated inspection method can also avoid errors and omissions caused by manual inspection, and greatly reduce labor costs. Attached Figure Description

[0020] Figure 1 This is a flowchart illustrating an inspection method for component heat dissipation pad design provided in an embodiment of the present invention.

[0021] Figure 2 Schematic diagram of the weld neck design;

[0022] Figure 3A schematic diagram of the drilling design within the solder mask pattern area;

[0023] Figure 4 A schematic diagram of a heat dissipation pad design without air ducts;

[0024] Figure 5 The left and right images are schematic diagrams of a heat dissipation pad with air guide grooves.

[0025] Figure 6 A schematic diagram of the drilling design for a heat dissipation pad;

[0026] Figure 7 This is a schematic diagram showing the distribution of multiple drill holes on a heat dissipation pad;

[0027] Figure 8 A schematic diagram showing the spacing between a set of adjacent borehole profiles in the target area;

[0028] Figure 9 This is a schematic diagram of a via on a PCB.

[0029] Figure 10 This is a schematic diagram of the bright copper back side;

[0030] Figure 11 This is a flowchart illustrating the inspection steps performed according to an embodiment of the present invention;

[0031] Figure 12 This is a schematic diagram of the PCB in the example embodiment;

[0032] Figure 13 This is a schematic diagram of the component information of the PCB in the example embodiment;

[0033] Figure 14 This is a schematic diagram of the component packaging information of the PCB in the example embodiment;

[0034] Figure 15 This is a schematic diagram of the PKG001 package in an example embodiment;

[0035] Figure 16 This is a schematic diagram of the PKG002 package in an example embodiment;

[0036] Figure 17 This is a schematic diagram of the solder mask pattern area on the heat dissipation pad of the PKG003 package in the example embodiment.

[0037] Figure 18 This is a schematic diagram showing drilled holes within a solder resist pattern area of ​​a specific pattern area in an example embodiment;

[0038] Figure 19 This is a schematic diagram of the air channel design for the heat dissipation pad on the package in an example embodiment;

[0039] Figure 20This is a schematic diagram of a package with drilled holes for the heat dissipation pads in an example embodiment;

[0040] Figure 21 This is a schematic diagram illustrating the inspection of hole size, density, and spacing on a heat dissipation pad or solder mask pattern area in an example embodiment.

[0041] Figure 22 This is a schematic diagram illustrating the design for checking whether the hole drill has a plug in the example embodiment;

[0042] Figure 23 This is a schematic diagram of the hole drilling without plugging design within the solder resist pattern area in an embodiment of the present invention;

[0043] Figures 24(a) and 24(b) are schematic diagrams of inspecting the back-side bright copper when the drilled hole in the target area is not plugged in the example embodiment;

[0044] Figure 25 This is a schematic diagram of the structure of an inspection device for heat dissipation pad design of components provided in an embodiment of the present invention;

[0045] Figure 26 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0046] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0047] To enable comprehensive, efficient, and automated thermal management checks after PCB layout design is completed, this invention provides a method, apparatus, equipment, and medium for checking component thermal pad designs.

[0048] It should be noted that the execution subject of the inspection method for component heat dissipation pad design provided in this embodiment of the invention can be an inspection device for component heat dissipation pad design, which can run in an electronic device. This electronic device can be a server or a terminal device, but is not limited to these. Optionally, the method of this embodiment of the invention can be executed by a core data module within a computer. This core data module can be associated with EDA design software, for example, it can be built into the EDA software, etc., all of which are reasonable.

[0049] To facilitate understanding of the embodiments of the present invention, the various algorithms involved will first be briefly introduced.

[0050] (I) Algorithm for Calculating the Area of ​​a Shape

[0051] The size information of a graphic on each layer of the PCB can be represented by the MBR(A, B) of that graphic, where MBR (Minimum Bounding Rectangle) represents the maximum outer contour of the graphic; A and B represent the dimensions of the maximum outer contour of the graphic in the X and Y directions, respectively, that is, the dimensions of the minimum bounding rectangle of the graphic.

[0052] If the figure is a rectangle, then A and B represent the length and width of the smallest bounding rectangle of the figure, respectively, and the area of ​​the figure is S = A * B;

[0053] If the figure is a circle, then A and B are equal to the diameter of the circle, and the area of ​​the figure is S = π*(A / 2). 2 ;

[0054] If the shape is a polygon, the coordinates of each vertex can be obtained as P1(x1,y1), P2(x2,y2), ..., P. n (x n ,y n The area of ​​the figure is:

[0055]

[0056] Where n is the total number of polygon vertices in the figure.

[0057] (II) Graphic Distance Calculation Algorithm

[0058] If the center coordinates of graphic object P on a certain layer are (x1, y1) and the center coordinates of graphic object Q are (x2, y2), then the distance between the centers of graphic objects P and Q is the distance between these two graphics, calculated using the following formula:

[0059]

[0060] (III) Graphic Overlap Comparison Algorithm

[0061] Specifically, a collision calculation is performed between graphic region 1 and graphic region 2. If a collision exists, the area of ​​the collision region is calculated. Otherwise, a value of NULL can be returned.

[0062] The area of ​​the collision region can be calculated using a graphic area calculation algorithm, which will not be explained in detail here.

[0063] In a first aspect, embodiments of the present invention provide an inspection method for the design of thermal pads for components, such as... Figure 1 As shown, it may include the following steps:

[0064] S1, Read the PCB design file and filter out packages containing heat dissipation pads based on the PCB design file;

[0065] The PCB design file is an ECAD file output after the design is completed in EDA software. The PCB design file includes basic PCB information, PCB layer information, component information, and component package information. This embodiment of the invention does not limit the EDA design software used.

[0066] Specifically, in the PCB design file:

[0067] The basic information of the PCB includes: PCB length, PCB width, PCB thickness, number of signal layers, and copper thickness of the signal layers;

[0068] The PCB layer information includes: circuit layer, solder mask layer, drill layer, via filling layer, solder paste layer, coordinates, shape and size of all graphics on each layer; wherein, the coordinates of the graphics include the center coordinates of the graphics and the vector coordinates of each point on the edge contour of the graphics;

[0069] The component information includes: component reference number, component coordinates, and component package name; it may also include angles; wherein, the component coordinates include the center coordinates of the component and the vector coordinates of each point on the component edge contour; in this embodiment of the invention, the center coordinates refer to the X and Y coordinates relative to the origin;

[0070] The component packaging information includes: package name, package type, and package graphic information; wherein, the package graphic information includes component body information and pin pad information; the component body information includes the length, width, and position of the body pads; the pin pad information includes the length, width, orientation, position, and number of the pin pads.

[0071] Please understand the above concepts in conjunction with relevant PCB design knowledge; they will not be explained in detail here.

[0072] In one optional implementation, selecting packages containing heat dissipation pads based on the PCB design files may include the following steps:

[0073] 1) Obtain the area of ​​the body pads and all pin pads in each package based on the solder paste layer;

[0074] The solder paste layer information in each PCB layer contains the coordinates, shape, and size of the pad patterns. Based on this information, an area calculation algorithm can be used to calculate the area of ​​the pad patterns. For example, if the pad pattern is rectangular, its length and width are used for calculation; if the pad pattern is circular, its diameter is used; and if the pad pattern is polygonal, the vector coordinates of its vertices are used. For standardized processing, the area of ​​pad patterns of various shapes can be calculated using their vector coordinates. For details, please refer to the relevant content of the area calculation algorithm described in this application.

[0075] Therefore, for each package, the area of ​​the body pad and all pin pads can be obtained.

[0076] It should be noted that, in the embodiments of the present invention, the area calculation of graphics in each layer of the PCB can be achieved by using a graphic area calculation algorithm based on the vector coordinates of the graphics. This can cover the calculation methods for all graphic shapes, which will be explained in detail in the relevant steps later in this application.

[0077] 2) For each package, calculate the ratio between the area of ​​the largest pad and the area of ​​the smallest pad in that package;

[0078] Specifically, among all areas of the body pads and all pin pads of the package, the maximum and minimum values ​​are selected to calculate the ratio.

[0079] 3) If the ratio is determined to be greater than the preset ratio, the largest pad in the package is determined to be the heat dissipation pad, and the package is a package containing the heat dissipation pad.

[0080] The preset ratio can be set based on experience, such as 8, and is not limited here.

[0081] If the ratio is greater than the preset ratio, the largest pad in the package is determined to be a heat dissipation pad, and the package is a package containing a heat dissipation pad. Then step S2 is executed. Otherwise, the package is determined to be a package that does not contain a heat dissipation pad, and step S2 is not executed, that is, no operation is performed on the package.

[0082] In this embodiment of the invention, step S1 can automatically identify all packages containing thermal pads in a PCB. Only packages containing thermal pads are checked for subsequent thermal pad design, while packages without thermal pads are left unchecked. Since it does not involve checking each package one by one, the workload of the inspection can be reduced and the inspection efficiency can be improved.

[0083] S2, For each selected package heat dissipation pad, an inspection step is performed on the heat dissipation pad. The inspection step covers multiple inspection items in a certain inspection order. When any of the inspection items does not meet the corresponding design requirements, it is determined that the heat dissipation pad needs to be redesigned. When all the inspection items meet their respective design requirements, it is determined that the heat dissipation pad meets all design requirements.

[0084] The inspection sequence is generated based on the design constraints between the multiple inspection items when the reliability requirements of the heat dissipation pad are met; the multiple inspection items include at least the copper foil area design of the heat dissipation pad, the solder mask bridge design, the solder mask opening area design, the drilling design in the solder mask opening, the air duct design, the drilling design on the heat dissipation pad, the plugging design, and the back bright copper design.

[0085] Those skilled in the art will understand that the various designs of PCB thermal pads have a certain sequence and dependency, and each inspection item has its own design requirements. This embodiment of the invention considers the design constraints between multiple design items when the thermal pad meets reliability requirements. Multiple design items, such as the copper foil area design, solder mask bridge design, solder mask window area design, drilling design within the solder mask window, air duct design, drilling design on the thermal pad, via plugging design, and back-side bright copper design, are designed as inspection items, and a specific inspection sequence is established. Inspection steps are performed on each package's thermal pad according to this sequence to check each inspection item. This ensures comprehensive coverage of all inspection items for the thermal pad while avoiding unnecessary inspection paths and improving inspection efficiency. Furthermore, during the inspection process, if any inspection item fails to meet the corresponding design requirements, it is determined that the thermal pad needs to be redesigned. Corresponding warning messages can be output to remind designers to modify the design in a timely manner, ensuring timely and comprehensive recording of design items to be modified and avoiding omissions in modifications. Meanwhile, the thermal pads are checked one by one in a certain order to avoid missing any thermal pads. The order in which the thermal pads are traversed can be based on the name, tag number, etc. of the corresponding device, and there are no restrictions here.

[0086] The following example uses a heat sink pad to illustrate the specific steps for performing an inspection on that heat sink pad.

[0087] The inspection process performed on the heat dissipation pad may include the following steps a1 to a5:

[0088] Step a1: Based on the package type corresponding to the heat dissipation pad in the component package information and the number of signal layers in the PCB basic information, determine the target thermal resistance value corresponding to the component package to which the heat dissipation pad belongs from the preset correspondence between component packages and thermal resistance.

[0089] Thermal resistance refers to the resistance encountered by heat in the heat flow path, reflecting the heat transfer capacity of the medium or between media, and indicating the temperature rise caused by 1W of heat. The unit is ℃ / W. Multiplying the heat dissipation by the thermal resistance gives the temperature rise along the heat transfer path.

[0090] The embodiments of the present invention can predetermine the correspondence between component packaging and thermal resistance through experimental testing and other methods. For example, a correspondence table between component packaging and thermal resistance can be determined, which lists the thermal resistance values ​​of various component packaging types under different signal layer numbers.

[0091] Therefore, for this heat dissipation pad, the target thermal resistance value corresponding to the component package to which the heat dissipation pad belongs can be determined by consulting the table above, based on the package type corresponding to the heat dissipation pad in the component package information and the number of signal layers in the PCB basic information.

[0092] Step a2: Substitute the target thermal resistance value into the preset formula to calculate the minimum copper foil area corresponding to the heat dissipation pad that meets the thermal resistance requirements.

[0093] In surface mount applications, to ensure that the thermal resistance (Rth) of components meets requirements, a corresponding heat dissipation area is needed, i.e., the copper foil area corresponding to the thermal pad. This step requires calculating the minimum copper foil area corresponding to the thermal pad that meets the thermal resistance requirements, while simultaneously considering heat dissipation needs, layout area, and cost requirements.

[0094] A large dataset of thermal resistances Rth and corresponding minimum copper foil areas can be obtained in advance through experimental testing to determine the relationship between thermal resistance Rth and the corresponding minimum copper foil area. For example, numerical fitting can be used to determine the minimum copper foil area S used to obtain the minimum copper foil area. min The default formula is:

[0095] S min =K / (Rth-ρ);

[0096] Where Rth represents thermal resistance; S min This represents the minimum copper foil area corresponding to the heat dissipation pad; K and ρ are coefficients, such as 12500 and 30 respectively.

[0097] Substituting the target thermal resistance value Rth into the preset formula, the minimum copper foil area S corresponding to the heat dissipation pad that meets the thermal resistance requirement can be calculated. min .

[0098] Step a3: Obtain the area of ​​all patterns on the surface circuit layer to which the heat sink is connected, and sum them to obtain the actual copper foil area of ​​the heat sink.

[0099] Specifically, the coordinates, shape, and size of all patterns on all surface circuit layers connected to the heat sink pad can be obtained. Based on the vector coordinates of the patterns, the area of ​​all patterns on all surface circuit layers connected to the heat sink pad can be calculated using a pattern area calculation algorithm. Then, the actual copper foil area of ​​the heat sink pad can be obtained by summing the results. The specific process will not be described in detail here.

[0100] Step a4: Determine whether the actual copper foil area of ​​the heat dissipation pad is greater than or equal to the calculated minimum copper foil area;

[0101] Step a5: If yes, then determine that the copper foil area of ​​the heat sink pad meets the thermal resistance requirement; if no, then determine that the copper foil area of ​​the heat sink pad does not meet the thermal resistance requirement, record the component reference number and component package name corresponding to the heat sink pad, and indicate that the heat sink pad needs to be redesigned.

[0102] Of course, if so, then it is determined that the copper foil area of ​​the heat sink pad meets the thermal resistance requirements, that is, the copper foil area design of the heat sink pad meets the corresponding design requirements, and subsequent inspection items can be carried out.

[0103] In the above embodiments, the correspondence between component packages and thermal resistance is first queried by using the package type and signal layer number corresponding to the heat dissipation pad to determine the thermal resistance value of the heat dissipation pad. Then, the determined thermal resistance value is substituted into a preset formula to calculate the minimum copper foil area required for the heat dissipation pad. Next, the actual copper foil area of ​​the heat dissipation pad is obtained and compared with the calculated minimum copper foil area. If the actual copper foil area is not less than the calculated minimum copper foil area, the copper foil area of ​​the heat dissipation pad is determined to meet the thermal resistance requirements. This embodiment of the invention pre-determines the correspondence between component packages and thermal resistance, as well as the preset formula characterizing the relationship between thermal resistance value and minimum copper foil area, through big data experiments and other means. This ensures that an accurate thermal resistance value can be quickly obtained for the heat dissipation pad to be inspected, and the minimum copper foil area corresponding to any thermal resistance value can be determined as a design standard. Therefore, by accurately calculating the actual copper foil area of ​​the heat dissipation pad and comparing it with this design standard, it is possible to quickly determine whether the copper foil area of ​​the heat dissipation pad meets the design requirements.

[0104] In this embodiment of the invention, the notification that the heat sink pad needs to be redesigned can be displayed via a pop-up notification box, allowing designers to observe it intuitively. Furthermore, information such as the component reference number and package name corresponding to the heat sink pad can be displayed directly in the notification box or recorded in other designated locations in other document formats; both are reasonable. In this embodiment of the invention, if the notification indicates that the heat sink pad needs to be redesigned, the designer can promptly modify the design items requiring modification, and then re-check them after completion before proceeding with subsequent checks; alternatively, after completing the check sequence, the designer can focus on modifying multiple design items that need modification, and then repeat the check sequence after all modifications are completed; both are reasonable.

[0105] In one optional implementation, after determining that the copper foil area of ​​the heat dissipation pad meets the thermal resistance requirements, the step of performing an inspection on the heat dissipation pad may further include the following steps b1 to b4:

[0106] Step b1: Obtain the minimum outer rectangle size information of the heat dissipation pad based on the component packaging information; the minimum outer rectangle size information of the heat dissipation pad includes the maximum outer contour size of the heat dissipation pad graphic in the X and Y directions;

[0107] Since the component package information contains package name, package type, and package graphic information, the minimum bounding rectangle information of the heat sink pad can be obtained based on the package graphic information. The minimum bounding rectangle information is the MBR(A, B) of the graphic described in this application. Here, A and B correspond to the dimensions of the maximum outer contour of the heat sink pad graphic in the X and Y directions.

[0108] Step b2: Determine the larger and smaller values ​​in the minimum bounding rectangle size information of the heat dissipation pad as the length and width of the heat dissipation pad, respectively.

[0109] The length and width of the heat dissipation pad can be denoted as L1 and W1, respectively.

[0110] Step b3: Based on the length and width of the heat sink, determine whether the size of the heat sink is within the specified heat sink size range;

[0111] A specific range of thermal pad sizes can refer to And W1>W1 * ,in, and W1 * These represent the threshold values ​​for length and width, respectively. These values ​​can be selected based on experience, and can be 2.5mm and 2mm, etc. There are no specific restrictions here.

[0112] Step b4: If yes, check if the heat sink pad has a solder mask bridge design; if no, check if the heat sink pad has an air duct design.

[0113] If the size of the heat sink pad is within a specific range, it indicates that the area of ​​the heat sink pad is relatively large, and it should have a solder mask bridge design. Therefore, the solder mask bridge design needs to be checked.

[0114] If the size of the heat sink pad is not within the specified range, it means that the area of ​​the heat sink pad is small and there is no need for solder mask design, but there may be an air duct design. Therefore, the air duct design needs to be checked.

[0115] In the above embodiment, by obtaining the minimum bounding rectangle size information of the heat sink pad, the length and width data are used to determine whether the size of the heat sink pad is within a specific heat sink pad size range. If it is, the system checks whether the heat sink pad has a solder mask bridge design; if not, it checks whether the heat sink pad has an air duct design. Therefore, corresponding inspection items can be performed specifically according to the size of the heat sink pad, avoiding unnecessary inspection paths and thus improving inspection efficiency.

[0116] Specifically, step b4, checking whether the heat dissipation pad has a solder mask bridge design, may include the following steps:

[0117] Step c1: Obtain the corresponding heat dissipation pad graphic area based on the center coordinates and vector coordinates of the heat dissipation pad;

[0118] The center coordinates and vector coordinates of the heat dissipation pad can be obtained from the solder paste layer information in each layer of the PCB. This information is already available when the package of the heat dissipation pad is selected based on the PCB design file. Therefore, the area of ​​the corresponding heat dissipation pad graphic region can be determined using the vector coordinates of the heat dissipation pad. The area calculation is implemented using the graphic area calculation algorithm described in this application.

[0119] Step c2: Obtain at least one solder resist pattern area based on the center coordinates and vector coordinates of the pattern in the solder resist layer;

[0120] The solder mask pattern area can be obtained from the solder mask layer information in the PCB layer information. Specifically, the area of ​​the solder mask pattern area can be obtained by using the center coordinates and vector coordinates of the solder mask pattern and employing a pattern area calculation algorithm. It is understood that there are multiple solder mask pattern areas, and in this embodiment of the invention, the overlap area between each pattern area and the heat dissipation pad pattern area needs to be determined in step c3.

[0121] Step c3: If the overlap area between the heat dissipation pad graphic area and all solder mask graphic areas is equal to 0, then the heat dissipation pad is determined to have no solder mask window design and no solder mask bridge design; if the overlap area between the heat dissipation pad graphic area and any solder mask graphic area is greater than 0, then the heat dissipation pad is determined to have a solder mask window design.

[0122] The method for determining the overlap area between the heat dissipation pad pattern area and the solder mask pattern area can be implemented using the pattern overlap comparison algorithm described in this application, which will not be explained in detail here.

[0123] For the design of the weld resistance bridge, please refer to Figure 2 understand. Figure 2 The large, light gray rectangles represent the heat dissipation pad pattern area, while the multiple small, dark rectangles represent the solder mask pattern area, which here indicates solder mask openings.

[0124] Step c4: If it is determined that the heat sink pad has a solder mask window design, and the number of solder mask graphic areas with an overlap area greater than 0 with the heat sink pad graphic area is greater than or equal to 2, then it is determined that the heat sink pad has a solder mask bridge design; if the number of solder mask graphic areas with an overlap area greater than 0 with the heat sink pad graphic area is less than 2, then it is determined that the heat sink pad does not have a solder mask bridge design.

[0125] Specifically, if the overlap area between the heat dissipation pad pattern area and any solder mask pattern area is greater than 0, then the heat dissipation pad is determined to have a solder mask window design. Based on this, if it is further determined that the number of solder mask pattern areas with an overlap area greater than 0 with the heat dissipation pad pattern area is greater than or equal to 2, then it is determined that the heat dissipation pad also has a solder mask bridge design. If it is further determined that the number of solder mask pattern areas with an overlap area greater than 0 with the heat dissipation pad pattern area is less than 2, then it is determined that the heat dissipation pad only has a solder mask window design and no solder mask bridge design.

[0126] In the above implementation, the presence of a solder mask window design is first determined by the overlap area between the heat dissipation pad graphic area and the solder mask graphic area. If no solder mask window design is found, it is determined that there is no solder mask bridge design. Then, if a solder mask window design is found, the presence of a solder mask bridge design is further determined based on the number of solder mask graphic areas with an overlap area greater than 0. This accurately determines whether the heat dissipation pad contains solder mask bridges, facilitating further review of whether the solder mask bridges meet design requirements.

[0127] In one optional implementation, after determining that the heat sink pad has a solder mask bridge design, the step of performing an inspection on the heat sink pad may further include the following steps:

[0128] Step d1: For each solder mask pattern area within the range corresponding to the heat dissipation pad, determine whether the area of ​​the solder mask pattern area is greater than the area of ​​a specific pattern.

[0129] Specifically, based on the information of the solder mask layer, the vector coordinates of each solder mask pattern area within the corresponding range of the heat dissipation pad can be obtained. The area of ​​the corresponding solder mask pattern area can be calculated using the vector coordinates and the pattern area calculation algorithm.

[0130] See Figure 2 This can be understood as obtaining the area of ​​each of the four dark rectangles representing the solder mask pattern.

[0131] The area of ​​a specific shape is determined based on empirical values, for example, it could be 3 mm. 2 No specific restrictions are imposed here.

[0132] This step corresponds to the inspection items designed for the weld resistance window area.

[0133] Step d2: If yes, check if there are drill holes in the solder mask pattern area. If there are drill holes, count the number of drill holes and check if the size, density and spacing of the drill holes meet the corresponding design requirements. If there are no drill holes, record the component reference number and component package name corresponding to the heat dissipation pad where the solder mask pattern area is located, and indicate that the heat dissipation pad needs to be redesigned.

[0134] In PCB design, for larger areas (in this embodiment of the invention, the area of ​​the solder mask pattern is larger than the area of ​​a specific pattern), holes are usually drilled in the solder mask pattern area to achieve good heat dissipation. This step is based on this design requirement.

[0135] For designing drill holes within the solder mask pattern area, please refer to [link / reference]. Figure 3 Understand, the black dots represent drill holes.

[0136] If the area is relatively large, this embodiment of the invention checks whether there are drill holes in the solder resist pattern area. If there are drill holes, it only means that there are drill holes in the solder resist window area of ​​a specific solder resist window, that is, there are drill holes in the solder resist pattern area larger than the specific pattern area. This check item meets the corresponding design requirements. Furthermore, the number of drill holes should be counted, and the size, density and spacing of the drill holes should be checked to see if they meet the corresponding design requirements. That is, the check item of drill hole design in the solder resist window (i.e., drill hole design in the solder resist pattern area) should be checked.

[0137] If the area is large as described above, but there are no drill holes, it means that the check item of having drill holes in the solder mask opening area does not meet the corresponding design requirements. In this case, record the component reference number and component package name corresponding to the heat dissipation pad where the solder mask pattern area is located, and indicate that the heat dissipation pad needs to be redesigned.

[0138] Step d3: If not, it is determined to be a normal design, and no further checks or judgments are made.

[0139] If the area is not large as described above, there is no need to drill holes within the solder mask pattern area, and therefore no inspection or judgment is required.

[0140] In the above embodiments, for solder mask areas larger than a specific pattern area within the corresponding range of the heat dissipation pad, it is checked whether there are drill holes within the solder mask area. If drill holes are present, the number of drill holes is further counted, and the size, density, and spacing of the drill holes are checked to see if they meet the corresponding design requirements. This completes the checks for the requirement that drill holes must be present within the solder mask opening area of ​​a specific solder mask area, as well as the drill hole design within the solder mask opening area. If no drill holes are present, it indicates that the requirement that drill holes must be present within the solder mask opening area of ​​a specific solder mask area does not meet the corresponding design requirements, and a corresponding record is made to indicate that the heat dissipation pad needs to be redesigned. This embodiment of the invention has a series of checks for drill holes in the design of solder mask areas larger than a specific pattern area, which can avoid missed detections. In one optional embodiment, step d2, checking whether there are drill holes within the solder mask area, may include the following steps:

[0141] Step e1: Obtain at least one borehole pattern region based on the center coordinates and vector coordinates of the borehole layer pattern;

[0142] The center coordinates and vector coordinates of the drill pattern area can be obtained from the information of the drill layer in each layer of the PCB, and the area can be calculated using a pattern area calculation algorithm.

[0143] Step e2: If the overlap area between the solder resist pattern area and any drill hole pattern area is greater than 0, then it is determined that there is a drill hole in the solder resist pattern area.

[0144] The area of ​​the solder mask graphic region is obtained by using the corresponding vector coordinates from the information of the solder mask layer in each layer of the PCB and then calculating the graphic area using an algorithm, which will not be elaborated here.

[0145] The overlap area between the solder resist pattern area and any drill hole pattern area can be determined using the pattern overlap comparison algorithm described in this application, which will not be explained in detail here.

[0146] Step e3: If the overlap area between the solder resist pattern area and all drilled pattern areas is equal to 0, then it is determined that there are no drilled holes in the solder resist pattern area.

[0147] In the above embodiments, by determining the overlap area between the solder resist pattern area and the obtained drill hole pattern area, it is possible to quickly determine whether there are drill holes in the solder resist pattern area, which facilitates further review of whether the size, density and spacing of the drill holes meet the corresponding design requirements in cases where drill holes are present.

[0148] As mentioned above, after determining the heat dissipation pad has no solder bridge design in step c4, it is necessary to check whether the heat dissipation pad has an air duct design. In other words, after determining that the heat dissipation pad has no solder bridge design, the step of performing an inspection on the heat dissipation pad also includes: checking whether the heat dissipation pad has an air duct design.

[0149] In the above embodiments, after determining the design of the heat dissipation pad without solder bridge, it is checked whether the heat dissipation pad has an air duct design. This allows for the inspection of relevant items related to the design of the heat dissipation pad without solder bridge, ensuring the comprehensiveness of the overall inspection.

[0150] Specifically, checking whether the heat sink has an air duct design can include the following steps:

[0151] Step f1: Overlap the graphic area of ​​the heat sink corresponding to the heat sink with the minimum bounding rectangle of the heat sink to determine whether there is a gap.

[0152] It is understood that the heat dissipation pad graphic area corresponding to the heat dissipation pad and the minimum bounding rectangle of the heat dissipation pad have been obtained in steps c1 and b1 of this application.

[0153] In this context, the excess portion of the minimum bounding rectangle of the heat sink pad compared to the corresponding heat sink pad graphic area constitutes a gap. Overlap comparison is achieved using the graphic overlap comparison algorithm described in this application.

[0154] Step f2: If there is no gap, it is determined that the heat dissipation pad has no air duct design.

[0155] For an example of a heatsink pad design without air ducts, please see [link / reference]. Figure 4 As shown.

[0156] Step f3: If there is a gap, calculate the length and width of the gap and count the number of gaps; if the number of gaps is greater than or equal to 3, and the ratio of the gap width to the width of the heat dissipation pad is less than the first preset percentage, and the ratio of the gap length to the length of the heat dissipation pad is greater than the second preset percentage, it is determined that the heat dissipation pad has an air guide groove design and meets the corresponding design requirements; otherwise, it is determined that the heat dissipation pad does not have an air guide groove design.

[0157] The length and width of the notch are calculated and the number of notches are counted using a graphic overlay comparison algorithm and the vector coordinates of the heat dissipation pads. The specific process will not be described in detail here.

[0158] The first and second preset percentages can be set based on empirical values, such as 10% and 30% respectively, without any specific restrictions here. If it is determined that the heat dissipation pad has an air duct design, then the air duct design check item meets the corresponding design requirements.

[0159] For an example of a heat sink pad with an air duct design, please see [link to example]. Figure 5 As shown.

[0160] In the above embodiments, the presence of a gap is determined by comparing the overlapping area of ​​the heat sink graphic region corresponding to the heat sink with the minimum bounding rectangle of the heat sink. If there is no gap, it is directly determined that the heat sink has no air duct design. If there is a gap, the number of gaps, the ratio of the gap width to the width of the heat sink, and the ratio of the gap length to the length of the heat sink are further used to determine whether the heat sink has an air duct design. This allows for accurate determination of whether the heat sink has an air duct design for different situations.

[0161] In one optional implementation, after determining in step f2 that the heat dissipation pad has no air duct design, the step of performing an inspection on the heat dissipation pad may further include the following steps:

[0162] Step g1: Obtain at least one borehole pattern region based on the center coordinates and vector coordinates of the borehole layer pattern;

[0163] This step is the same as step e1, and will not be repeated here.

[0164] Step g2: Calculate the overlap area between the heat sink pattern area corresponding to the heat sink and any drill hole pattern area;

[0165] The heat dissipation pad graphic area corresponding to the heat dissipation pad has been obtained in step c1 of this application. The overlapping area calculation in step g2 is implemented using the graphic overlap comparison algorithm described in this application.

[0166] Step g3: If the overlap area between the heat dissipation pad pattern area and any drill hole pattern area is greater than 0, then it is determined that the heat dissipation pad has a drill hole design. The number of drill holes is counted, and the size, density and spacing of the drill holes are checked to see if they meet the corresponding design requirements.

[0167] For the drilling design on the heat sink pads, please refer to Figure 6 Understand, the rectangle represents a heat dissipation pad, and the dot represents a drill hole.

[0168] Similarly, the calculation of the overlapping area in step g3 is implemented using the graphic overlap comparison algorithm described in this application.

[0169] Step g4: If the overlap area between the heat dissipation pad graphic area and all drilled areas is equal to 0, it is determined that the heat dissipation pad has no drilled design. Record the component reference number and component package name corresponding to the heat dissipation pad, and indicate that the heat dissipation pad needs to be redesigned.

[0170] If step g4 determines that the heat sink pad has no drill hole design, it means that the check item of drill hole design on the heat sink pad has failed.

[0171] In the above embodiments, the overlap area between the heat dissipation pad graphic area and the drill hole graphic area corresponding to the heat dissipation pad is calculated to determine whether the heat dissipation pad is designed for drilling. After the drilling design is implemented, the number of drill holes is further counted, and the size, density and spacing of the drill holes are checked to see if they meet the corresponding design requirements. A series of inspection items for drilling can be designed for the heat dissipation pad graphic area, which can avoid the occurrence of missed inspections.

[0172] In one optional implementation, after determining in step d2 that there are drill holes within the solder mask pattern area, and after determining in step g3 that the heat dissipation pad has a drill hole design, checking whether the size, density, and spacing of the drill holes meet the corresponding design requirements includes:

[0173] Step h1, the step of checking the drill hole size, includes: obtaining the diameter of the drill hole from the information of the drill hole layer in the information of each layer of the PCB, and determining whether the diameter of the drill hole is within the preset diameter range; if yes, confirm that the drill hole diameter meets the corresponding design requirements; if no, record the position of the drill hole and prompt that the drill hole needs to be redesigned.

[0174] Specifically, in this embodiment of the invention, when checking whether the size, density, and spacing of the drill holes meet the corresponding design requirements, the drill holes targeted can be drill holes in the solder mask pattern area or drill holes on the heat dissipation pad. Regardless of the type of drill hole, since the information of the drill hole layer contains the coordinates, shape, and size of all the patterns in that layer, the diameter of the corresponding drill hole can be obtained from it. The specific process will not be described in detail.

[0175] The preset diameter range in this embodiment of the invention can be set empirically, for example, it can be 0.2 to 0.4 mm. If the diameter of the drilled hole is within the preset diameter range, it is determined that the drilled hole diameter meets the corresponding design requirements, and then step h2 continues; if the diameter of the drilled hole is not within the preset diameter range, it is determined that the drilled hole diameter does not meet the corresponding design requirements, then the position of the drilled hole is recorded, indicating that the drilled hole needs to be redesigned, and suggestions for modifying the hole diameter can be given. For example, multiple drilled holes distributed on the heat dissipation pad can be referred to... Figure 7 understand, Figure 7 In this context, "hole" indicates a drilled hole, "D" indicates the diameter of the drilled hole, and "thermal pad" indicates a heat dissipation pad.

[0176] Step h2, the step of checking the borehole density, includes: obtaining the number of boreholes and the area of ​​the target area where the boreholes are located; calculating the number of boreholes per unit area of ​​the target area to obtain the actual borehole density; determining whether the actual borehole density is greater than the borehole density threshold of the target area; if so, determining that the borehole density meets the corresponding design requirements; if not, proposing to increase the number of boreholes.

[0177] The target area includes a heat dissipation pad containing drill holes and / or a solder mask pattern area; the number of drill holes is determined after confirming their existence in step d2 or g3. The area of ​​the heat dissipation pad where the drill hole is located can be obtained from the vector coordinates of the heat dissipation pad, and the area of ​​the solder mask pattern area where the drill hole is located can be obtained from the vector coordinates of the solder mask pattern area. This can be processed using a pattern area calculation algorithm, the specific process of which will not be described in detail here.

[0178] The actual drilling density represents the number of drill holes per unit area of ​​the target region. Specifically, it is calculated as the number of drill holes in the heat sink pad divided by the area of ​​the heat sink pad, and the number of drill holes in the solder mask area divided by the area of ​​the solder mask area.

[0179] The borehole density threshold for the target area is set based on empirical values, representing the minimum borehole density in the target area to meet heat dissipation performance requirements; for example, it could be 25 boreholes / cm². 2 That is, 0.25 per mm 2 .

[0180] If the actual borehole density is greater than the borehole density threshold of the target area, then the borehole density is determined to meet the corresponding design requirements, and step h3 is continued; otherwise, it indicates that the number of boreholes is insufficient, and a modification suggestion to increase the number of boreholes is proposed.

[0181] Step h3, the step of checking the borehole spacing, includes: when the number of boreholes in the target area is less than 2, determining that the borehole spacing meets the corresponding design requirements; when the number of boreholes in the target area is greater than or equal to 2, calculating the center distance of the group of adjacent boreholes based on the center coordinates of each group of adjacent boreholes; calculating the spacing between the outlines of the group of adjacent boreholes using a preset spacing calculation formula based on the center distance of the group of adjacent boreholes and the diameter of each of the group of adjacent boreholes; if the spacing between the outlines of the group of adjacent boreholes is greater than the preset spacing value, determining that the spacing between the group of adjacent boreholes meets the corresponding design requirements; otherwise, recording the position of each of the group of adjacent boreholes and the spacing between the outlines of the group of adjacent boreholes, and proposing modification suggestions.

[0182] This step involves checking the drilling spacing when the number of holes in the target area is less than 2, i.e., 1. This indicates that there are no adjacent holes, and the hole spacing can be considered to meet the corresponding design requirements. This step mainly focuses on checking the hole spacing when the number of holes in the target area is greater than or equal to 2.

[0183] Specifically, the center-to-center distance between adjacent boreholes in each group is calculated based on their center coordinates, using a graphical distance calculation algorithm.

[0184]

[0185] In the above formula, d1 represents the center distance between adjacent boreholes in the group, and (x1,y1) and (x2,y2) are the center coordinates of each adjacent borehole in the group.

[0186] Substituting the center distance of the group of adjacent boreholes and the diameter of each adjacent borehole into the preset spacing calculation formula, the spacing between the outlines of the group of adjacent boreholes is obtained as follows:

[0187] d2 = d1 - D1 / 2 - D2 / 2;

[0188] The above formula is the preset spacing calculation formula, where d2 is the spacing between adjacent borehole profiles in this group, which can be found in [reference]. Figure 8 Understand; D1 and D2 are the diameters of the adjacent boreholes in this group.

[0189] The preset spacing value in this embodiment of the invention can be determined based on empirical values, such as 0.6 mm, etc., which will not be elaborated here.

[0190] In the above embodiments, the drilling size is checked to ensure it meets the corresponding design requirements by determining whether the diameter of the drill hole is within a preset diameter range; the actual drilling density is calculated by obtaining the number of drill holes and the area of ​​the heat dissipation pad and / or solder mask pattern area where the drill holes are located, and it is determined whether the actual drilling density is greater than the drilling density threshold to check whether the drilling density meets the corresponding design requirements; when there are at least two drill holes on the heat dissipation pad and / or solder mask pattern area, the center distance of each group of adjacent drill holes is calculated, and combined with the diameter of each group of adjacent drill holes, the spacing between the outlines of the group of adjacent drill holes is calculated using a preset spacing calculation formula and compared with a preset spacing value to check whether the drilling spacing meets the corresponding design requirements. It can be seen that this application can accurately check whether the corresponding design requirements are met for drilling size, density, and spacing through certain calculation methods, thus ensuring that the drilling design on the heat dissipation pad and / or solder mask pattern area meets the requirements.

[0191] In one optional implementation, after determining that the size, density, and spacing of the boreholes in the target area meet the corresponding design requirements, the method may further include the following steps:

[0192] Step i1: Determine the smaller of the minimum bounding rectangle dimensions of the target region as the width of the target region.

[0193] In this implementation, the corresponding design requirement is that, for a specific device with a fixed single-sided dimension, the holes in the heat dissipation pads or solder mask pattern areas need to be plugged.

[0194] Understandably, as electronic products become lighter, thinner, shorter, and smaller, PCBs also become more dense and complex. This results in a large number of high-power, high-heat-generating PCBs. The main functions of via plugging are as follows: 1. Preventing solder from penetrating through the vias and causing short circuits during wave soldering; 2. Preventing flux residue from remaining in the drilled holes; 3. Ensuring a vacuum is created on the PCB during testing after SMT processing and component assembly in electronics factories; 4. Preventing surface solder paste from flowing into the holes and causing cold solder joints, affecting placement; 5. Preventing solder balls from popping out during wave soldering and causing short circuits. For details on via plugging, please refer to [link to documentation]. Figure 9 understand, Figure 9 The word "PLUGHOLE" in this context means "plug hole".

[0195] Specifically, the target area includes a heat dissipation pad with drilled holes and / or a solder mask pattern area. The corresponding minimum bounding rectangle size information has been obtained in previous steps of this application through component package information, solder mask layer information, and drilled hole layer information, etc., and will not be described in detail here.

[0196] Step i2: If the width of the target area is less than a preset width threshold, it means that the drilling in the target area meets the corresponding design requirements;

[0197] The preset width threshold can be set based on empirical values, such as 2mm, and no specific limit is imposed here.

[0198] Step i3: If the width of the target area is greater than or equal to the preset width threshold, check whether each drill hole in the target area has a plugging design; if yes, it is determined that the drill holes in the target area have a plugging design and meet the corresponding design requirements; if no, it means that the drill holes in the target area do not have a plugging design, and check whether the target area has a back bright copper design.

[0199] The target area width being greater than or equal to the preset width threshold indicates that a specific device with a fixed dimension on one side requires a via plugging design. If the drilled hole lacks a via plugging design, it is necessary to further check whether the target area has a backside bright copper design.

[0200] In the above embodiments, when the width of the target area is less than a preset width threshold, the drilling meets the corresponding design requirements and no further inspection is needed. When the width of the target area is greater than or equal to the preset width threshold, the drilling of the heat dissipation pads or solder mask areas requires via plugging design. Therefore, it is necessary to check whether each drilling in the target area has a via plugging design. If so, it is determined that it meets the corresponding design requirements; if not, it is necessary to further check whether the target area has a back-side bright copper design. It can be seen that through the above inspection method, it can be ensured that the corresponding design requirements can be met under different target area widths.

[0201] Specifically, step i3, checking whether each borehole in the target area has a plugging design, may include:

[0202] Obtain the coordinates of each pattern on the borehole layer within the target area, and compare the coordinates of each pattern with the coordinates of the plugging pattern on the plugging layer. If a matching coordinate is found, the borehole corresponding to that pattern in the target area is determined to have a plugging design, which meets the corresponding design requirements. If a matching coordinate cannot be found, the borehole corresponding to that pattern in the target area is determined to have an unplugged design.

[0203] Specifically, for a given borehole, if the coordinates of the pattern on the borehole layer and the coordinates of the pattern on the plugging layer correspond to the same position, then the borehole is considered to have a plug. This embodiment of the invention can sequentially traverse each borehole in the target area to determine whether the borehole has a plugging design.

[0204] In the above embodiments, by obtaining the coordinates of each pattern on the borehole layer in the target area, and comparing the coordinates of each pattern with the coordinates of the plugging pattern on the plugging layer, it is determined whether a matching coordinate of the plugging layer pattern can be found, thereby checking whether each borehole in the target area has a plugging design, which can accurately and quickly complete the corresponding inspection purpose.

[0205] Specifically, step i3, checking whether the target area has a back-side bright copper design, may include the following steps:

[0206] Step j1: Based on the center coordinates and vector coordinates of the solder resist layer pattern on the opposite side of the target area, obtain at least one opposite solder resist pattern area corresponding to the target area.

[0207] In this implementation, the corresponding design requirement is that if the drill holes on the heat dissipation pads and / or solder mask areas are not plugged, then back-side bright copper is required. For more information on back-side bright copper, please refer to [link to relevant documentation]. Figure 10 understand. Figure 10 In the text, BOT represents the PCB bottom surface BOTTOM, and the target area corresponding to the dark small rectangle has multiple drill holes arranged on it. NoPlugHole indicates that the drill holes are not plugged, and OpenOpposite Side indicates that the reverse solder mask pattern area is open.

[0208] The area of ​​at least one solder resist pattern region corresponding to the target region can be obtained by using a pattern area calculation algorithm based on the center coordinates and vector coordinates of the solder resist layer pattern on the opposite side of the target region.

[0209] For example, if a heat dissipation pad is on the T-side (i.e., the TOP side), the opposite side of the T-side, i.e. the B-side (i.e., the Bottom side), needs to be checked. Based on the center coordinates and vector coordinates of the solder mask pattern on the B-side, the area of ​​at least one solder mask pattern region on the B-side is determined using a pattern area calculation algorithm.

[0210] Step j2: If the overlap area between the target area and any corresponding solder mask pattern area on the reverse side is greater than 0, then it is determined that the heat dissipation pad has a back bright copper design, which meets the corresponding design requirements.

[0211] If the overlap area between the target area and any corresponding solder mask pattern area on the opposite side is greater than 0, it indicates that the heat dissipation pad and / or solder mask pattern area has a solder mask opening on the opposite side, i.e. there is bright copper on the back, which meets the design requirements.

[0212] The calculation of the overlapping area is achieved using a graphic overlap comparison algorithm.

[0213] Step j3: If the overlap area between the target area and all the corresponding solder mask pattern areas on the reverse side is equal to 0, it is determined that the heat dissipation pad has no back bright copper design. Then, the component reference number and component package name corresponding to the target area are recorded, and a redesign is required.

[0214] If the overlap area between the target area and all corresponding solder mask pattern areas on the opposite side is equal to 0, it means that the heat dissipation pad and / or solder mask pattern area has no solder mask opening on the opposite side, that is, no back bright copper, which does not meet the design requirements.

[0215] In the above embodiments, by determining the overlap area between the target area and its corresponding reverse solder mask pattern area, it is possible to accurately and quickly determine whether the heat dissipation pad has a back bright copper design, thereby determining whether it meets the corresponding design requirements.

[0216] Based on the above description, an exemplary flowchart of the inspection steps according to an embodiment of the present invention is provided, which can be found in [reference]. Figure 11 As shown. It should be noted that this process is only an example of the inspection order in an embodiment of the present invention and does not constitute a limitation on the embodiments of the present invention.

[0217] Currently, the industry lacks a review scheme for component thermal pads. During the actual use of finished PCB products, poor heat dissipation due to high heat generation often leads to functional impairment. To address this issue, this invention proposes a method for inspecting component thermal pad design. First, the PCB design file is read, and packages containing thermal pads are extracted. Then, for each selected package's thermal pad, an inspection process is performed. This inspection process covers multiple items in a specific order. If any inspection item fails to meet the corresponding design requirements, the thermal pad is determined to need redesign. If all inspection items meet their respective design requirements, the thermal pad is deemed to meet all design requirements. The inspection order in this invention is generated based on the design constraints between the multiple inspection items to meet the reliability requirements of the thermal pad. Each inspection item has a corresponding inspection standard. Thermal pads that meet the design requirements can continue to be used, while those that do not meet the requirements are given modification suggestions. This guides designers to redesign according to the modification suggestions and re-inspect until the final PCB design requirements are met. The multiple inspection items include at least the copper foil area design of the heat dissipation pad, the solder mask bridge design, the solder mask opening area design, the drilling design within the solder mask opening, the air duct design, the drilling design on the heat dissipation pad, the via plugging design, and the back bright copper design, covering all possible heat dissipation pad design items in PCB design. The method of this invention can check whether the heat dissipation pad design conforms to specifications after the PCB design is completed, using computer software or other means, to identify design rationality in advance, and provide modification suggestions to the design team for reference. This ensures the consistency between design and manufacturing, greatly shortens the new product development cycle, improves the yield rate, and can create more profits for enterprises. The inspection sequence of this invention can improve inspection efficiency and accuracy, avoiding missed inspections; and the automated inspection method can also avoid errors and omissions caused by manual inspection, and greatly reduce labor costs.

[0218] To facilitate understanding of the embodiments of the present invention, a specific embodiment is given below for illustrative purposes.

[0219] Example:

[0220] Step 1: Read the PCB design file into the system's core data module.

[0221] To facilitate understanding, some explanations are provided first. In this embodiment, the heat dissipation pads PKG002 and PKG003 are rectangular, and their shapes are the same size as the minimum bounding rectangle. The heat dissipation pad PKG004 is an irregular polygon. The solder mask pattern areas A1, A2, A3, and A4 are all rectangular, and their shapes are the same size as the minimum bounding rectangle. The solder mask pattern area on the reverse side of PKG002 is also rectangular, and its shape is the same size as the minimum bounding rectangle. Therefore, in this embodiment, the corresponding pattern area can be directly calculated using MBR without using the vector coordinates of the pattern. However, those skilled in the art should understand that using MBR to calculate the pattern area is an example of using the pattern vector coordinates.

[0222] In the PCB design files:

[0223] Basic PCB information includes: PCB length 50mm; PCB width 40mm; PCB thickness 1mm; number of signal layers 2; signal layer copper thickness 0.035mm.

[0224] Information on each PCB layer, specifically including: circuit layer, solder mask layer, drill layer, via filling layer, solder paste layer, coordinates, shape and size of all graphics on each layer; wherein, the coordinates of the graphics include the center coordinates of the graphics and the vector coordinates of each point on the edge contour of the graphics.

[0225] Component information includes: component reference designation, component coordinates, and component package name; wherein, the component coordinates include the center coordinates of the component and the vector coordinates of each point on the component's edge contour;

[0226] The component package information includes: package name, package type, and package graphic information; wherein, the package graphic information includes component body information and pin pad information; the component body information includes the length, width, and position of the body pads; the pin pad information includes the length, width, orientation, position, and number of the pin pads.

[0227] Specifically, the PCB design file in this embodiment contains four types of packages. Please refer to the PCB schematic diagram. Figure 12 As shown, D1, U1, U2, U3, and U4 are component reference designators. For partial data in the component information, please refer to [link to component information]. Figure 13 Understanding this mainly includes the component reference designation, X-coordinate, Y-coordinate, angle, and package name. Component package information can be found in [reference needed]. Figure 14 understand.

[0228] Step 2: Select packages that contain heat dissipation pads.

[0229] The PCB design file contains four packages, and it is necessary to determine whether each package includes a heat dissipation pad design.

[0230] 1) For the PKG001 package, please refer to [link / reference needed]. Figure 15 As shown.

[0231] Figure 15 In the diagram, 1, 2, and 3 represent pin pads. From the PCB design file, we can see that pins 1 and 2 are MBR (0.406, 0.457), with an area of ​​0.1855mm. 2 A rectangle; 3 pins are MBR (0.508, 0.457), Area: 0.2322mm 2 The rectangle; where MBR(,) represents the minimum bounding rectangle size of the heat sink pad, and Area represents the area.

[0232] The calculated ratio of the area of ​​the largest pad to the area of ​​the smallest pad in the PKG001 package is 0.2322 / 0.1855 = 1.25, which is less than the preset ratio of 8. Therefore, this package does not include a heat dissipation pad design.

[0233] 2) For the PKG002 package, please refer to [link / reference needed]. Figure 16 As shown.

[0234] The PKG002 package has MBR (0.254mm, 0.610mm) pads for pins 1-32, with an area of ​​0.1549mm. 2 The rectangular shape has a 33-pin pad for MBR (5.207, 5.207), with an area of ​​27.1128mm. 2 If the square is large, then the ratio of the area of ​​the largest pad to the area of ​​the smallest pad is 27.1128 / 0.1549 = 175, which is greater than the preset ratio of 8. Therefore, the PKG002 package includes a heat dissipation pad design, and the 33-pin pad is a heat dissipation pad.

[0235] 3) Similarly, according to the above judgment method, both PKG003 and PKG004 are packages that include heat dissipation pads.

[0236] Step 3: Check whether the copper foil area of ​​the heat dissipation pad meets the thermal resistance requirements.

[0237] Knowing that the PCB is a two-layer design, and based on the QFP32 package type of the component PKG002, its thermal resistance is found to be 115℃ / W according to the correspondence between component packages and thermal resistance. Substituting this thermal resistance value of 115℃ / W into the preset formula, the minimum copper foil area corresponding to the heat sink pad that meets the thermal resistance requirements is calculated as follows:

[0238]

[0239] The thermal pad corresponds to two reference numbers, U1 and U2, in the QFP32 package. For U1 and U2, the area of ​​all patterns on the surface circuit layer connected to the thermal pad is obtained respectively, and the sum is used to obtain the actual copper foil area of ​​the thermal pad.

[0240] Specifically, based on the graphic area calculation algorithm, the sum of the graphic areas on the positive and negative circuit layers connected to the heat dissipation pad of U1, SU1 = 10.24 + 152.5 = 162.74 mm. 2 The actual copper foil area corresponding to U1 is represented as SU1;

[0241] Based on the graphic area calculation algorithm, the sum of the areas of the graphics on the positive and negative circuit layers connected to the heat sink pad of U2 is SU2 = 10.24 + 144.2 = 154.44 mm. 2 The actual copper foil area corresponding to U2 is represented as SU2.

[0242] For U1 and U2, determine whether the actual copper foil area of ​​the heat dissipation pad is greater than or equal to the calculated minimum copper foil area;

[0243] Specifically, SU1>S min This indicates that the copper foil area of ​​the U1 heat sink meets the thermal resistance requirements; SU2>S min This indicates that the copper foil area of ​​the U2 heat sink meets the thermal resistance requirements; therefore, the copper foil area of ​​the heat sink in package PKG002 meets the thermal resistance requirements.

[0244] Similarly, it can be determined through a similar method that the heat dissipation pad design of PKG003 and PKG004 both meet the thermal resistance requirements.

[0245] Step 4: Determine whether the size of the heat sink pad is within the specified heat sink pad size range. If yes, check whether the heat sink pad has a solder mask bridge design; if no, check whether the heat sink pad has an air duct design.

[0246] The MBR (3.000, 3.000) of the thermal pad of the PKG003 package can be obtained from the component package information. The length L1 and width W1 of the thermal pad are both 3mm. Since L1>2.5mm and W1>2mm, the size of the thermal pad is within the specific thermal pad size range. It is necessary to check whether there is a solder mask bridge design.

[0247] Specifically, for this heat dissipation pad, the heat dissipation pad pattern area is obtained based on its center coordinates (0, 0) and MBR (3.000, 3.000). Simultaneously, based on the center coordinates of the pattern in the solder mask layer and the MBR, four solder mask pattern areas, A1, A2, A3, and A4, are obtained, as follows: Figure 19 The following data can be obtained.

[0248] A1: Center coordinates (-0.600, 0.850), MBR (2.000, 1.500);

[0249] A2: Center coordinates (1.100, 0.850), MBR (1.000, 1.500);

[0250] A3: Center coordinates (-0.600, -0.850), MBR (2.000, 1.500);

[0251] A4: Center coordinates (1.100, -0.850), MBR (1.000, 1.500);

[0252] Calculations using a graphic overlap comparison algorithm show that the overlap area between the heat dissipation pad graphic area and the solder mask graphic area A1 is 1.9 * 1.4 = 2.66 mm. 2 The overlap area between the solder mask pattern area A2 and the solder mask pattern area is 0.9 * 1.4 = 1.26 mm. 2 The overlap area between the solder mask pattern area A3 and the solder mask pattern area is 1.9 * 1.4 = 2.66 mm. 2 The overlap area between the solder mask pattern area A4 and the solder mask pattern area is 0.9 * 1.4 = 1.26 mm. 2 If the overlap area between the heat dissipation pad graphic area and the four solder mask graphic areas is greater than 0, it indicates that the heat dissipation pad has a solder mask window design. If the number of solder mask graphic areas with an overlap area greater than 0 with the heat dissipation pad graphic area is 4, it indicates that the heat dissipation pad has a solder mask bridge design.

[0253] Similarly, the number of solder mask areas within the heat dissipation pad pattern area of ​​PKG002 and PKG004 is 1, indicating that there is no solder mask bridge design.

[0254] If the size of the heat sink pad is outside the specified range, check whether the heat sink pad has an air duct design. Also, if the heat sink pad does not have a solder mask bridge design, check whether it has an air duct design. The process of checking whether the heat sink pad has an air duct design will be explained in step 6 of this invention.

[0255] Step 5: After confirming that there is a solder mask bridge design on the heat dissipation pad, determine whether the area of ​​the solder mask pattern area is larger than the area of ​​a specific pattern. If so, check whether there are drill holes in the solder mask pattern area. If there are drill holes, count the number of drill holes and check whether the size, density and spacing of the drill holes meet the corresponding design requirements.

[0256] Specifically, the area of ​​all solder mask patterns within the corresponding range of the PKG 003 package heat dissipation pad is SA1 = 2 * 1.5 = 3 mm. 2SA2 = 1 * 1.5 = 1.5 mm 2 SA3 = 2 * 1.5 = 3 mm 2 SA4 = 1 * 1.5 = 1.5mm 2 Determine whether the area of ​​each element is greater than 2.5 mm of the area of ​​the specific shape. 2 The areas of solder mask patterns A1 and A3 are both greater than 2.5 mm. 2 The areas of A2 and A4 are both less than 2.5 mm². 2 ;

[0257] For solder resist pattern areas A1 and A3, it is necessary to further determine whether there is a drill hole design, while no determination is made for solder resist pattern areas A2 and A4. Based on the center coordinates (-0.600, 0.850) and MBR (2.000, 1.500) of solder resist pattern area A1, and the center coordinates (-0.600, -0.850) and MBR (2.000, 1.500) of solder resist pattern area A3, the area of ​​each solder resist pattern area is obtained. Based on the center coordinates (-0.600, 0.850) and diameter 0.254 of drill layer pattern D1, and the center coordinates (-0.600, 0.850) and diameter 0.254 of drill layer pattern D2, the area of ​​the corresponding drill hole pattern area is obtained. The overlap area between solder resist pattern area A1 and drill hole pattern area D1 is calculated to be 0.0507 mm using a pattern overlap comparison algorithm. 2 The overlap area between the solder mask pattern area A3 and the drill hole pattern area D2 is 0.0507 mm, which is greater than 0. 2 A value greater than 0 indicates that the solder mask pattern areas A1 and A2 have drilled holes. Please refer to [link / reference]. Figure 18 As shown.

[0258] Step 6: Check if the heat dissipation pads on the package have air ducts.

[0259] Obtain the heatsink pad pattern of PKG004. Based on the MBR (4.000, 6.000) of the heatsink pad, its larger value is length L1 = 6mm and its smaller value is width W1 = 4mm. Using a pattern overlap comparison algorithm, three notches are calculated. For example... Figure 19 As shown, the white rectangular area represents the gap.

[0260] Then, based on the vector coordinates of the heat dissipation pad graphic, obtain the center coordinates of the key points in the left rectangular area: A(-3.000, 0.100), B(0.000, 0.100), C(-3.000, -0.100), D(0.000, -0.100), and calculate the notch length L. q =AB=2mm, notch width W q =AC=0.2mm. Similarly, the other two notches have the same length and width.

[0261] Because of the gap width W q The ratio W to the width W1 of the heat sink pad q / W1 = 0.2 / 4 = 0.05, which is less than 10%, and the gap length L q The ratio L to the width L1 of the heat sink pad q / L1=2 / 6≈0.3333, which is greater than 30%, indicating that there is an air guide channel design.

[0262] Similarly, if there is no gap after overlapping and comparing the PGK002 graphic with its smallest bounding rectangle, then there is no air guide groove design.

[0263] Step 7: Check if the heat dissipation pads on the package have drilled holes.

[0264] The heat dissipation pad area is obtained based on the center coordinates (0.000, 0.000) and MBR (3.200, 3.200) of the PKG002 heat dissipation pad. Simultaneously, the drill pattern area is obtained based on the center coordinates and MBR of the drill layer pattern, resulting in five drill patterns: D1 center coordinates (-1.000, 1.000) and MBR (0.254, 0.254), D2 center coordinates (1.000, 1.000) and MBR (0.254, 0.254), and D3... The coordinates of the center of D4 (0.000, 0.000) and the center of D5 (0.254, 0.254) are calculated using a graphic overlap comparison algorithm. The overlap area between the heat sink pad region and the drilled patterns D1, D2, D3, D4, and D5 is 0.0507 mm. 2 If both are greater than 0, it indicates that the heat sink pad has a drilled hole design, such as... Figure 20 As shown.

[0265] Step 8: Check whether the size, density, and spacing of the drill holes in the target area meet the design requirements.

[0266] The target area includes a heat dissipation pad with drilled holes and / or a solder mask pattern area. For example, the target area is a heat dissipation pad with drilled holes, which may specifically include:

[0267] Step 8.1: Based on the dimensions of the drill hole pattern on the PKG002 heat sink pad, the drill hole diameter D0 = 0.254 mm is obtained, which is within the preset diameter range of 0.2 to 0.4 mm, thus meeting the design requirements for the drill hole diameter;

[0268] Step 8.2: Using a graphic overlay comparison algorithm, the number of drill holes within the heat dissipation pad is determined to be 5, and the area of ​​the heat dissipation pad is 10.24 mm². 2The number of holes drilled per unit area of ​​the heat dissipation pad was calculated, resulting in an actual hole density of 5 / 10.24 = 0.488 holes / mm². 2 The borehole density exceeds the threshold of 0.25 boreholes / mm. 2 This satisfies the design requirements for borehole density.

[0269] Step 8.3: Based on the coordinates (-1.000, 1.000) and (0.000, 0.000) of the nearest adjacent drill holes D1 and D3 on the heat dissipation pad, obtain the center distance between them. Based on the dimensions of adjacent boreholes, both have a diameter of 0.254 mm. The distance between their edges, d2 = d1 - 0.254 / 2 - 0.254 / 2 = 1.16 mm, is greater than the preset distance of 0.6 mm, thus meeting the design requirements for borehole spacing. Please refer to [link / reference]. Figure 21 understand.

[0270] Similarly, on the PKG003 heat sink pad, the corresponding solder mask areas A1 and A3 have drill holes D1 and D2 respectively. Please refer to [link / reference]. Figure 18 It is understood that the diameter of the drilled holes is 0.254mm, which falls within the preset diameter range of 0.2-0.4mm, thus meeting the hole diameter design requirements. Through a graphic overlay comparison algorithm, it is found that the number of drilled holes in both solder resist graphic areas A1 and A3 is 1, and the area of ​​the solder resist graphic area is 3mm². 2 The actual drill density, or the number of holes drilled per unit area of ​​the solder resist pattern, is 1 / 3 = 0.3333 holes / mm. 2 The borehole density exceeds the threshold of 0.25 boreholes / mm. 2 This satisfies the design requirements for drilling density; based on the coordinates (-0.520, 0.770) and (-0.520, -0.770) of the nearest adjacent drill holes on the heat dissipation pad, the center distance is obtained as follows:

[0271]

[0272] The dimensions of adjacent boreholes are such that the borehole diameter is 0.254 mm, and the distance between their edges d2 = 1.54 - 0.254 / 2 - 0.254 / 2 = 1.286 mm, which is greater than the preset distance value of 0.6 mm, thus meeting the design requirements for borehole spacing.

[0273] Step 9: Holes in heat dissipation pads of a specific size need to be plugged.

[0274] Based on the MBR (3.200, 3.200) of the PKG002 heat sink pad, its length L1 = 3.2mm and width W1 = 3.2mm are obtained. Since its width W1 is greater than the preset width threshold of 2mm, it means that the hole of the heat sink pad needs to be plugged.

[0275] Obtain the coordinates of the pattern on the drilled layer inside the heat dissipation pad corresponding to PKG002 U1, specifically including: center coordinates of D1 (-1.000, 1.000), center coordinates of D2 (1.000, 1.000), center coordinates of D3 (0.000, 0.000), center coordinates of D4 (-1.000, -1.000), and center coordinates of D5 (1.000, -1.000).

[0276] Obtain the coordinates of the pattern on the plug hole layer inside the heat dissipation pad, specifically including: S1 center coordinates (-1.000, 1.000), S2 center coordinates (1.000, 1.000), S3 center coordinates (0.000, 0.000), S4 center coordinates (-1.000, -1.000), and S5 center coordinates (1.000, -1.000).

[0277] If the coordinates of the graphic on the borehole layer and the coordinates of the graphic on the plugged hole layer are consistent when calculated using a graphic overlay comparison algorithm, then the borehole is considered plugged, thus meeting the design requirements. Please refer to this section. Figure 22 understand.

[0278] Similarly, the MBRs of the corresponding solder mask patterns A1, A2, A3, and A4 on the PKG003 hot solder pad are A1(2.000, 1.500), A2(1.000, 1.500), A3(2.000, 1.500), and A4(1.000, 1.500), respectively, with widths of 1.5mm, 1mm, 1.5mm, and 1mm, respectively. All of these are less than the preset width threshold of 2mm, meaning there is no need to check for via plugging, and this meets the design requirements. Please refer to [link / reference]. Figure 23 understand.

[0279] Step 10: If the holes on the heat dissipation pads and / or solder mask areas are not plugged, bright copper on the back is required.

[0280] If there is no plugging hole layer pattern in the heat dissipation pad corresponding to the U2 tag of PKG002, it is considered that the heat dissipation pad of this component is not plugged, and it is necessary to continue to determine whether there is bright copper on its back side.

[0281] Since U2 is designed on the T-side, it is necessary to check whether there is a solder mask pattern at the coordinate on its opposite side, i.e., the B-side, to determine whether there is a solder mask pattern area on the reverse side of U2.

[0282] Based on the center coordinates (0.000, 0.000) and MBR (3.300, 3.300) of the solder mask pattern on the reverse side of the component, a reverse solder mask pattern area is obtained. Using a pattern overlap algorithm, the overlap area between this reverse solder mask pattern area and the heat sink pad pattern area is calculated to be 3*3 = 9mm. 2If the value is greater than 0, it indicates that the heat dissipation pad has bright copper on the back, which meets the design requirements. Please refer to Figures 24(a) and 24(b) for further understanding.

[0283] The above is a specific example of the implementation process of the inspection method for component heat dissipation pad design provided by the embodiment of the present invention. It can be seen that the embodiment of the present invention can automatically perform the inspection of various inspection items of heat dissipation pads in a certain inspection order, thereby improving the efficiency and accuracy of inspection.

[0284] Secondly, corresponding to the above method embodiments, this invention also provides an inspection device for the design of component heat dissipation pads, such as... Figure 25 As shown, the device includes:

[0285] The information reading and heat dissipation pad filtering module 2501 is used to read PCB design files and filter out packages containing heat dissipation pads according to the PCB design files; wherein, the PCB design files include basic PCB information, PCB layer information, component information and component package information;

[0286] The heat dissipation pad inspection module 2502 is used to perform inspection steps on the heat dissipation pad of each selected package. The inspection steps cover multiple inspection items in a certain inspection order. When any of the inspection items does not meet the corresponding design requirements, it is determined that the heat dissipation pad needs to be redesigned. When all the inspection items meet their respective design requirements, it is determined that the heat dissipation pad meets all design requirements.

[0287] The inspection sequence is generated based on the design constraints between the multiple inspection items when the reliability requirements of the heat dissipation pad are met; the multiple inspection items include at least the copper foil area design of the heat dissipation pad, the solder mask bridge design, the solder mask opening area design, the drilling design in the solder mask opening, the air duct design, the drilling design on the heat dissipation pad, the plugging design, and the back bright copper design.

[0288] For details, please refer to the relevant content on the inspection method for component heat dissipation pad design described in the first aspect, which will not be repeated here.

[0289] Thirdly, embodiments of the present invention also provide an electronic device, such as... Figure 26 As shown, it includes a processor 2601, a communication interface 2602, a memory 2603, and a communication bus 2604, wherein the processor 2601, the communication interface 2602, and the memory 2603 communicate with each other through the communication bus 2604.

[0290] The memory is used to store computer programs;

[0291] When the processor executes the program stored in the memory, it implements the steps of any of the inspection methods for component heat dissipation pad design provided in the first aspect of the present invention.

[0292] The communication bus mentioned in the aforementioned electronic devices can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. This communication bus can be divided into address bus, data bus, control bus, etc.

[0293] The communication interface is used for communication between the aforementioned electronic devices and other devices.

[0294] The memory may include random access memory (RAM) or non-volatile memory (NVM), such as at least one disk storage device.

[0295] The processors mentioned above can be general-purpose processors, including central processing units (CPUs), network processors (NPs), etc.; they can also be digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), etc.

[0296] The method provided in this embodiment of the invention can be applied to electronic devices. Specifically, the electronic device can be a desktop computer, a portable computer, a smart mobile terminal, a server, etc., and is not limited thereto.

[0297] Fourthly, embodiments of the present invention also provide a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps of any of the inspection methods for component heat dissipation pad designs provided in the first aspect of the present invention.

[0298] For the embodiments of the device / electronic device / storage medium, the specific implementation principles, processes and technical effects are similar to those of the method embodiments, and will not be repeated here.

[0299] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. Those skilled in the art can combine and integrate the different embodiments or examples described in this specification. For those skilled in the art, several simple deductions or substitutions can be made without departing from the concept of the present invention, and all such deductions or substitutions should be considered within the scope of protection of the present invention.

Claims

1. A method for inspecting the design of thermal pads for components, characterized in that, include: The process involves reading a PCB design file and filtering out packages containing thermal pads based on that file. This includes: obtaining the area of ​​the body pads and all pin pads in each package based on the solder paste layer; calculating the ratio between the area of ​​the largest pad and the area of ​​the smallest pad in each package; and determining that the largest pad in the package is a thermal pad if the ratio is greater than a preset ratio, thus classifying the package as a package containing a thermal pad. The PCB design file includes basic PCB information, PCB layer information, component information, and component package information. For each selected package's heat dissipation pad, an inspection step is performed on the heat dissipation pad. The inspection step covers multiple inspection items in a certain inspection order. When any of the inspection items does not meet the corresponding design requirements, it is determined that the heat dissipation pad needs to be redesigned. When all of the multiple inspection items meet their respective design requirements, it is determined that the heat dissipation pad meets all design requirements. The inspection sequence is generated based on the design constraints between the multiple inspection items when the reliability requirements of the heat dissipation pad are met; the multiple inspection items include at least the copper foil area design of the heat dissipation pad, the solder mask bridge design, the solder mask opening area design, the drilling design in the solder mask opening, the air duct design, the drilling design on the heat dissipation pad, the plugging design, and the back bright copper design.

2. The inspection method for component heat dissipation pad design according to claim 1, characterized in that, The basic information of the PCB includes: PCB length, PCB width, PCB thickness, number of signal layers, and copper thickness of the signal layers; The PCB layer information includes: circuit layer, solder mask layer, drill layer, via filling layer, solder paste layer, coordinates, shape and size of all graphics on each layer; wherein, the coordinates of the graphics include the center coordinates of the graphics and the vector coordinates of each point on the edge contour of the graphics; The component information includes: component reference number, component coordinates, and component package name; wherein, the component coordinates include the center coordinates of the component and the vector coordinates of each point on the component edge contour; The component packaging information includes: package name, package type, and package graphic information; wherein, the package graphic information includes component body information and pin pad information; the component body information includes the length, width, and position of the body pads; the pin pad information includes the length, width, orientation, position, and number of the pin pads.

3. The inspection method for component heat dissipation pad design according to claim 2, characterized in that, The steps for inspecting the heat dissipation pad include: Based on the package type corresponding to the heat dissipation pad in the component package information and the number of signal layers in the PCB basic information, the target thermal resistance value corresponding to the component package to which the heat dissipation pad belongs is determined from the preset correspondence between component package and thermal resistance. Substitute the target thermal resistance value into the preset formula to calculate the minimum copper foil area corresponding to the heat dissipation pad that meets the thermal resistance requirement. Obtain the area of ​​all patterns on the surface circuit layer connected to the heat sink pad, and sum them to obtain the actual copper foil area of ​​the heat sink pad; Determine whether the actual copper foil area of ​​the heat sink pad is greater than or equal to the calculated minimum copper foil area; If yes, then the copper foil area of ​​the heat sink pad meets the thermal resistance requirement; if no, then the copper foil area of ​​the heat sink pad does not meet the thermal resistance requirement. Record the component reference number and component package name corresponding to the heat sink pad, and indicate that the heat sink pad needs to be redesigned.

4. The inspection method for component heat dissipation pad design according to claim 3, characterized in that, After confirming that the copper foil area of ​​the heat sink meets the thermal resistance requirements, the step of performing an inspection on the heat sink further includes: The minimum outer rectangle size of the heat sink pad is obtained based on the component packaging information; the minimum outer rectangle size of the heat sink pad includes the maximum outer contour of the heat sink pad in the X and Y directions. Determine the larger and smaller values ​​in the minimum bounding rectangle size information of the heat sink pad as the length and width of the heat sink pad, respectively. Based on the length and width of the heatsink pad, determine whether the size of the heatsink pad falls within a specific heatsink pad size range; where the specific heatsink pad size range refers to... and ,in, and These are the length and width of the heat dissipation pad, respectively. and These represent the threshold values ​​corresponding to the length and width, respectively. If yes, check if the heat sink pad has a solder mask bridge design; if not, check if the heat sink pad has an air duct design.

5. The inspection method for component heat dissipation pad design according to claim 4, characterized in that, The inspection of whether the heat sink pad has a solder mask bridge design includes: The corresponding heat sink graphic area is obtained based on the center coordinates and vector coordinates of the heat sink. At least one solder resist pattern region is obtained based on the center coordinates and vector coordinates of the pattern in the solder resist layer; If the overlap area between the heat dissipation pad graphic area and all solder mask graphic areas is equal to 0, then the heat dissipation pad is determined to have no solder mask window design and no solder mask bridge design; if the overlap area between the heat dissipation pad graphic area and any solder mask graphic area is greater than 0, then the heat dissipation pad is determined to have a solder mask window design. If the heat sink pad has a solder mask window design, and the number of solder mask graphic areas with an overlap area greater than 0 with the heat sink pad graphic area is greater than or equal to 2, then the heat sink pad is determined to have a solder mask bridge design; if the number of solder mask graphic areas with an overlap area greater than 0 with the heat sink pad graphic area is less than 2, then the heat sink pad is determined not to have a solder mask bridge design.

6. The inspection method for component heat dissipation pad design according to claim 5, characterized in that, After confirming that the heat sink pad has a solder mask bridge design, the step of performing an inspection on the heat sink pad further includes: For each solder mask pattern area within the corresponding range of the heat dissipation pad, determine whether the area of ​​the solder mask pattern area is greater than the area of ​​a specific pattern; where the area of ​​the specific pattern is an area value determined based on experience. If so, check if there are any drill holes in the solder mask pattern area. If there are drill holes, count the number of drill holes and check whether the size, density and spacing of the drill holes meet the corresponding design requirements. If there are no drill holes, record the component reference number and component package name corresponding to the heat dissipation pad where the solder mask pattern area is located, and indicate that the heat dissipation pad needs to be redesigned. If not, it is determined to be a normal design, and no further inspection or judgment is required.

7. The inspection method for component heat dissipation pad design according to claim 6, characterized in that, The inspection of whether there are drill holes in the solder mask pattern area includes: At least one borehole pattern region is obtained based on the center coordinates and vector coordinates of the borehole layer pattern; If the overlap area between the solder resist pattern area and any drill hole pattern area is greater than 0, then it is determined that there is a drill hole in the solder resist pattern area. If the overlap area between the solder resist pattern area and all drilled pattern areas is equal to 0, then it is determined that there are no drilled holes within the solder resist pattern area.

8. The inspection method for component heat dissipation pad design according to claim 5, characterized in that, After confirming that the heat dissipation pad has no solder bridge design, the step of performing an inspection on the heat dissipation pad also includes: checking whether the heat dissipation pad has an air duct design.

9. The inspection method for component heat dissipation pad design according to claim 5 or 8, characterized in that, The inspection of whether the heat sink has an air duct design includes: The overlap comparison between the graphic area of ​​the heat sink corresponding to the heat sink pad and the minimum bounding rectangle of the heat sink pad is performed to determine whether there is a gap; wherein, the excess part of the minimum bounding rectangle of the heat sink pad compared with the graphic area of ​​the heat sink pad corresponding to the heat sink pad is the gap; If there is no gap, it is confirmed that the heat dissipation pad has no air duct design; If a gap exists, calculate the length and width of the gap and count the number of gaps. If the number of gaps is greater than or equal to 3, and the ratio of the gap width to the width of the heat dissipation pad is less than a first preset percentage, and the ratio of the gap length to the length of the heat dissipation pad is greater than a second preset percentage, it is determined that the heat dissipation pad has an air guide groove design, which meets the corresponding design requirements; otherwise, it is determined that the heat dissipation pad does not have an air guide groove design.

10. The inspection method for component heat dissipation pad design according to claim 9, characterized in that, After confirming that the heat sink pad has no air duct design, the step of performing an inspection on the heat sink pad further includes: At least one borehole pattern region is obtained based on the center coordinates and vector coordinates of the borehole layer pattern; Calculate the overlap area between the heat sink pattern area corresponding to the heat sink and any drill hole pattern area; If the overlap area between the heat dissipation pad pattern area and any drill hole pattern area is greater than 0, it is determined that the heat dissipation pad has a drill hole design. The number of drill holes is counted, and the size, density and spacing of the drill holes are checked to see if they meet the corresponding design requirements. If the overlap area between the heat dissipation pad graphic area and all drilled areas is equal to 0, it is determined that the heat dissipation pad has no drilled design. The component reference number and component package name corresponding to the heat dissipation pad are recorded, and it is indicated that the heat dissipation pad needs to be redesigned.

11. The inspection method for component heat dissipation pad design according to claim 6 or 10, characterized in that, The inspection of whether the size, density, and spacing of the boreholes meet the corresponding design requirements includes: The steps for checking the size of the drill hole include: obtaining the diameter of the drill hole from the information of the drill hole layer in the information of each layer of the PCB, and determining whether the diameter of the drill hole is within the preset diameter range; if yes, confirm that the diameter of the drill hole meets the corresponding design requirements; if no, record the location of the drill hole and indicate that the drill hole needs to be redesigned. The steps for checking the drill density include: obtaining the number of drill holes and the area of ​​the target region where the drill holes are located; calculating the number of drill holes per unit area of ​​the target region to obtain the actual drill density; determining whether the actual drill density is greater than the drill density threshold of the target region; if so, determining that the drill density meets the corresponding design requirements; if not, proposing to increase the number of drill holes; wherein, the target region includes heat dissipation pads and / or solder mask pattern areas containing drill holes. The steps for checking the borehole spacing include: when the number of boreholes in the target area is less than 2, determining that the borehole spacing meets the corresponding design requirements; when the number of boreholes in the target area is greater than or equal to 2, calculating the center distance of the adjacent boreholes in the group based on the center coordinates of each group of adjacent boreholes; calculating the spacing between the outlines of the adjacent boreholes in the group based on the center distance of the adjacent boreholes in the group and the diameters of the adjacent boreholes in the group, using a preset spacing calculation formula; if the spacing between the outlines of the adjacent boreholes in the group is greater than the preset spacing value, determining that the spacing between the adjacent boreholes in the group meets the corresponding design requirements; otherwise, recording the positions of the adjacent boreholes in the group and the spacing between the outlines of the adjacent boreholes in the group, and proposing modification suggestions.

12. The inspection method for component heat dissipation pad design according to claim 11, characterized in that, After determining that the size, density, and spacing of the boreholes in the target area meet the corresponding design requirements, the method further includes: In determining the minimum bounding rectangle size information of the target region, the smaller of the length and width is the width of the target region. If the width of the target area is less than a preset width threshold, it means that the drilling in the target area meets the corresponding design requirements; If the width of the target area is greater than or equal to the preset width threshold, check whether each drill hole in the target area has a plugging design; if yes, it is determined that the drill holes in the target area have a plugging design, which meets the corresponding design requirements; if no, it indicates that the drill holes in the target area do not have a plugging design, and check whether the target area has a back-side bright copper design.

13. The inspection method for component heat dissipation pad design according to claim 12, characterized in that, Checking each borehole in the target area for plugging design, including: Obtain the coordinates of each pattern on the borehole layer within the target area, and compare the coordinates of each pattern with the coordinates of the plugging pattern on the plugging layer. If a matching coordinate is found, the borehole corresponding to that pattern in the target area is determined to have a plugging design, which meets the corresponding design requirements. If a matching coordinate cannot be found, the borehole corresponding to that pattern in the target area is determined to have an unplugged design.

14. The inspection method for component heat dissipation pad design according to claim 12, characterized in that, Check whether the target area has a back-side bright copper design, including: Based on the center coordinates and vector coordinates of the solder resist layer pattern on the opposite side of the target area, at least one opposite solder resist pattern area corresponding to the target area is obtained. If the overlap area between the target area and any corresponding solder mask pattern area on the reverse side is greater than 0, then it is determined that the heat dissipation pad has a bright copper back design, which meets the corresponding design requirements. If the overlap area between the target area and all corresponding solder mask pattern areas on the reverse side is equal to 0, it is determined that the heat dissipation pad has no back bright copper design. Then, the component reference number and component package name corresponding to the target area are recorded, and a redesign is required.

15. An inspection device for the design of heat dissipation pads for components, characterized in that, include: The information reading and heat dissipation pad filtering module is used to read PCB design files and filter out packages containing heat dissipation pads based on the PCB design files; wherein, the PCB design files include basic PCB information, PCB layer information, component information and component package information; The thermal pad inspection module is used to perform inspection steps on the thermal pad of each selected package. The inspection steps cover multiple inspection items in a certain inspection order. When any of the inspection items does not meet the corresponding design requirements, it is determined that the thermal pad needs to be redesigned. When all the inspection items meet their respective design requirements, it is determined that the thermal pad meets all design requirements. The inspection order is generated based on the design constraints between the multiple inspection items when the reliability requirements of the heat dissipation pad are met; the multiple inspection items include at least the copper foil area design of the heat dissipation pad, the solder mask bridge design, the solder mask opening area design, the drilling design in the solder mask opening, the air duct design, the drilling design on the heat dissipation pad, the plugging design, and the back bright copper design. Specifically, the information reading and heat dissipation pad filtering module, when filtering packages containing heat dissipation pads based on the PCB design file, is used for: The area of ​​the body pad and all pin pads in each package is obtained based on the solder paste layer; for each package, the ratio between the area of ​​the largest pad and the area of ​​the smallest pad in the package is calculated; if the ratio is greater than a preset ratio, the largest pad in the package is determined to be a heat dissipation pad, and the package is a package containing a heat dissipation pad.

16. An electronic device, characterized in that, It includes a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus; The memory is used to store computer programs; When the processor executes the program stored in the memory, it implements the steps of the method described in any one of claims 1-14.

17. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the steps of the method described in any one of claims 1-14.

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