Apparatus for cleaning the surface of a single crystal silicon wafer

Abstract

The application discloses a kind of cleaning monocrystalline silicon wafer surface equipment, comprising: electric guide rail, the output end of electric guide rail is connected with lifting rod, lifting rod bottom end is connected with drive box, cleaning basket is connected to drive box bottom end, cleaning basket contains monocrystalline silicon wafer, electric guide rail below is provided with multiple ultrasonic cleaning tank, electric guide rail is used to drive and raise cleaning basket moves along cleaning direction, lifting rod is used to adjust the height of cleaning basket so that it is immersed in the cleaning liquid of ultrasonic cleaning tank;Turbidity detection unit, turbidity detection unit is by setting turbidity sensor in ultrasonic cleaning tank, obtains the turbidity value of cleaning liquid in ultrasonic cleaning tank, judges the turbidity degree in ultrasonic cleaning tank.The turbidity sensor is used to detect the turbidity degree of cleaning liquid in the application, the use of cleaning liquid can be monitored in real time, staff is prompted to replace cleaning liquid and clean ultrasonic cleaning tank, without manual supervision, improve the utilization of cleaning liquid.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer cleaning technology, and more specifically, to a device for cleaning the surface of monocrystalline silicon wafers. Background Technology

[0002] During silicon wafer processing, the cut silicon wafers need to be ground, polished, and cleaned in sequence. Existing silicon wafer cleaning equipment usually has multiple cleaning tanks arranged side by side. Multiple silicon wafers are placed in the cleaning basket, and the cleaning basket is lowered by a lifting device to immerse it in the first cleaning tank. After immersion for a period of time, the cleaning basket is lifted upwards, and then the cleaning basket is moved forward by a transmission device to the top of the next cleaning tank. Then the cleaning basket is lowered and immersed again.

[0003] In the prior art, such as Chinese Patent Application No. 202320092618.X, a silicon wafer cleaning device is disclosed, including a cleaning chamber. A sliding plate is slidably connected inside the cleaning chamber. The top of a slider is fixedly connected to the bottom of the sliding plate. A groove is formed on the top of the sliding plate, and a base plate is rotatably connected within the groove. Support frames are fixedly connected to both sides of the top of the base plate, and multiple clamping components are rotatably connected between the two support frames via a first connecting shaft. A rotating component is driven to one side of each clamping component. This device drives the storage tray to rotate through the support frames, realizing the vertical and horizontal rotation of the silicon wafer, thereby allowing the silicon wafer to be rinsed by the cleaning liquid at multiple angles, thus improving the cleaning effect. However, impurities and reaction precipitates are generated during the use of the cleaning tank. Although the above device improves the cleaning effect, there is no specific basis for changing the cleaning liquid. Long-term residue of impurities and reactions will still lead to a deterioration in the cleaning effect, and frequent changes of the cleaning agent will result in resource waste. Therefore, it is necessary to propose a device for cleaning the surface of monocrystalline silicon wafers to at least partially solve the problems existing in the prior art. Summary of the Invention

[0004] The summary section introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. The summary section of this invention is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0005] To at least partially solve the above problems, the present invention provides a device for cleaning the surface of a single-crystal silicon wafer, comprising:

[0006] The electric guide rail has a lifting rod connected to its output end, and a drive box connected to the bottom end of the lifting rod. The cleaning basket is connected to the bottom end of the drive box and contains a single crystal silicon wafer. Multiple ultrasonic cleaning tanks are set below the electric guide rail. The electric guide rail is used to drive the cleaning basket to move along the cleaning direction, and the lifting rod is used to adjust the height of the cleaning basket so that it is immersed in the cleaning liquid of the ultrasonic cleaning tank.

[0007] The turbidity detection unit obtains the turbidity value of the cleaning liquid in the ultrasonic cleaning tank by setting a turbidity sensor in the ultrasonic cleaning tank, and determines the degree of turbidity in the ultrasonic cleaning tank.

[0008] Preferably, a dehydration tank and a drying tank are also provided below the electric guide rail, and the dehydration tank and the drying tank are located behind the ultrasonic cleaning tank.

[0009] Preferably, the drive box includes:

[0010] The unit consists of an upper chamber, a lower chamber, and side chambers. The two side chambers are symmetrically connected to the bottom of the upper chamber on both sides. The two sides of the lower chamber are rotatably connected to the side chambers via rotating rods. The upper chamber is connected to the bottom of the lifting rod, and the lower chamber is connected to the top of the washing basket.

[0011] Preferably, the upper housing includes:

[0012] The first slide groove is horizontally opened at the top of the inner wall of the upper box. There are two symmetrical first slide grooves, and a first slider is slidably connected inside the first slide groove.

[0013] A lead screw is rotatably connected to the inner wall of the first slide groove, and the end of the lead screw extends out of the first slide groove and connects to the two output ends of the first motor. The first slider is screwed onto the lead screw.

[0014] Push plate, which is slidably connected to the inner wall of the upper box;

[0015] The connecting rods are configured as two symmetrical rods, with their ends hinged to the push plate and the first slider, respectively.

[0016] Preferably, the upper housing is provided with a drive unit for driving the lower housing to rotate, the drive unit including:

[0017] The second motor is connected to the center of the bottom end of the push plate;

[0018] The bent rod has its top end connected to the output end of the second motor and its bottom end connected to a guide block. The top of the lower housing has an opening, and the bent rod extends into the lower housing.

[0019] The guide rod is connected to the inner wall of the lower box. The guide rod is arc-shaped and protrudes upward in the middle. An arc-shaped guide groove is opened at the top of the guide rod, and the guide groove is adapted to the guide block.

[0020] Preferably, a second slide groove is provided inside the side box, a second slider is slidably connected in the second slide groove, a rotating rod is rotatably connected to the second slider and extends into the side box, and a first spring is connected between the second slider and the top of the second slide groove.

[0021] Preferably, two limiting rods are symmetrically connected on both sides of the bottom end of the push plate, and the bottom end of the limiting rod is provided with a groove that matches the rotating rod.

[0022] Preferably, a vibration unit is provided inside the upper and lower housings, and the vibration unit includes:

[0023] Vibrating plate, two vibrating plates are symmetrically connected to the bottom of the push plate. The bottom of the vibrating plate is provided with an arc-shaped groove, and multiple vibrating protrusions are evenly connected in the arc-shaped groove.

[0024] Two vibrating rods are symmetrically arranged and vertically slidably connected to the side wall of the lower chamber. The top and bottom ends of the vibrating rods protrude from the lower chamber, and the bottom end of the vibrating rod is connected to the cleaning basket.

[0025] An arc-shaped plate is connected to the top of the vibrating rod and protrudes upward in the middle. A second spring is connected between the bottom of the arc-shaped plate and the lower housing. Multiple vibrating protrusions are evenly connected on the arc-shaped plate.

[0026] Preferably, a rinsing unit is provided on the side chamber, and the rinsing unit includes:

[0027] The water storage chamber is located on the upper part of the side box. A piston plate is slidably connected inside the water storage chamber. The piston rod connected to the bottom end of the piston plate passes through the water storage chamber and is rotatably connected to the end of the rotating rod. The side wall of the water storage chamber is provided with a one-way water inlet and water outlet. The water inlet of the water storage chamber is connected to the water tank through a pipeline.

[0028] The flushing assembly is connected to the bottom of the side tank, and the water inlet of the flushing assembly is connected to the water outlet of the water storage chamber through a pipeline.

[0029] Preferably, the rinsing assembly includes:

[0030] The rinsing tray has an inlet pipe at the top that connects to the side box and is connected to the outlet of the water storage chamber through a pipe. The rinsing tray has a diversion channel that connects to the inlet pipe.

[0031] The nozzle holder is evenly connected to the bottom of the rinsing tray, and the nozzle is connected to the bottom of the nozzle holder, with the nozzle facing the cleaning basket.

[0032] The pressure stabilizing chamber is located inside the flushing plate and at the top of the nozzle seat. The pressure stabilizing chamber is connected to the diversion channel. A hemispherical pressure stabilizing piston is slidably connected inside the pressure stabilizing chamber. A third spring is connected between the pressure stabilizing piston and the bottom of the pressure stabilizing chamber. A passage with a decreasing diameter from top to bottom is opened inside the pressure stabilizing piston. The passage is connected to the water flow path of the nozzle seat.

[0033] Compared with the prior art, the present invention has at least the following beneficial effects:

[0034] This invention provides a device for cleaning the surface of monocrystalline silicon wafers. By setting up multiple ultrasonic cleaning tanks, the device utilizes the strong penetrating power of ultrasound to generate microbubbles that impact the surface of the monocrystalline silicon wafers. Combined with the chemical decontamination effect of the cleaning agent, the surface of the monocrystalline silicon wafers is cleaned. A turbidity sensor is used to detect the turbidity of the cleaning solution in the ultrasonic cleaning tanks, enabling real-time monitoring of the cleaning solution usage and prompting staff to replace the cleaning solution and clean the ultrasonic cleaning tanks. This eliminates the need for manual supervision and improves the utilization rate of the cleaning solution.

[0035] The present invention provides a device for cleaning the surface of single-crystal silicon wafers. Other advantages, objectives and features of the present invention will be apparent in part from the following description, and in part from the understanding of those skilled in the art through study and practice of the invention. Attached Figure Description

[0036] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0037] Figure 1 This is a schematic diagram of the structure of the present invention;

[0038] Figure 2 This is a cross-sectional structural diagram of the drive box in this invention;

[0039] Figure 3 This is a three-dimensional structural diagram of the lower box in this invention;

[0040] Figure 4 For the present invention Figure 2 A magnified view of the structure at point A in the middle;

[0041] Figure 5 For the present invention Figure 2 A magnified schematic diagram of the structure at point B in the middle;

[0042] Figure 6 For the present invention Figure 2 A magnified schematic diagram of the structure at point C in the middle;

[0043] Figure 7 This is a cross-sectional structural diagram of the flushing assembly in this invention;

[0044] Figure 8 For the present invention Figure 7 A magnified schematic diagram of the structure at point D.

[0045] In the diagram: 1. Electric guide rail; 2. Lifting rod; 3. Drive box; 4. Cleaning basket; 5. Ultrasonic cleaning tank; 11. Upper chamber; 12. Lower chamber; 13. Side chamber; 14. Rotating rod; 15. First slide rail; 16. Lead screw; 17. First motor; 18. First slider; 19. Push plate; 20. Connecting rod; 21. Second motor; 22. Bent rod; 23. Guide block; 24. Guide rod; 25. Guide groove; 26. 27. Second slide rail; 28. Limiting rod; 29. ​​Vibrating plate; 31. Arc-shaped groove; 32. Vibrating protrusion; 33. Vibrating rod; 34. Arc-shaped plate; 35. Vibrating ridge; 41. Water storage chamber; 42. Piston plate; 43. Piston rod; 44. Rinsing plate; 45. Water inlet pipe; 46. Diversion channel; 47. Nozzle seat; 48. Pressure stabilizing chamber; 49. Pressure stabilizing piston; 50. Nozzle; 51. Second spring. Detailed Implementation

[0046] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments, so that those skilled in the art can implement it based on the description.

[0047] It should be understood that terms such as “having,” “comprising,” and “including” as used herein do not exclude the presence or addition of one or more other elements or combinations thereof.

[0048] Example 1:

[0049] like Figure 1 As shown, the present invention provides a device for cleaning the surface of a single-crystal silicon wafer, comprising:

[0050] An electric guide rail 1 is provided. The output end of the electric guide rail 1 is connected to a lifting rod 2. The bottom end of the lifting rod 2 is connected to a drive box 3. A cleaning basket 4 is connected to the bottom end of the drive box 3. The cleaning basket 4 contains a single crystal silicon wafer. Multiple ultrasonic cleaning tanks 5 are provided below the electric guide rail 1. The electric guide rail 1 is used to drive the cleaning basket 4 to move along the cleaning direction. The lifting rod 2 is used to adjust the height of the cleaning basket 4 so that it is immersed in the cleaning liquid of the ultrasonic cleaning tank 5.

[0051] The turbidity detection unit obtains the turbidity value of the cleaning liquid in the ultrasonic cleaning tank 5 by setting a turbidity sensor in the ultrasonic cleaning tank 5, and determines the degree of turbidity in the ultrasonic cleaning tank 5.

[0052] Below the electric guide rail 1, there are also dehydration tanks and drying tanks, which are located behind the ultrasonic cleaning tank 5.

[0053] The working principle and beneficial effects of the above technical solution are as follows:

[0054] In the use of a device for cleaning the surface of monocrystalline silicon wafers, the silicon wafer to be cleaned is placed in a cleaning basket 4. A lifting rod 2 raises the cleaning basket 4 to a preset height at one end of an electric guide rail 1. Then, the electric guide rail 1 is activated to transport the cleaning basket 4 above an ultrasonic cleaning tank 5. The lifting rod 2 is then activated to lower the basket 4, completely immersing it in the cleaning solution of the ultrasonic cleaning tank 5 for cleaning. After cleaning, the lifting rod 2 is activated again to raise the cleaning basket 4, and the above operation is repeated, sequentially entering subsequent ultrasonic cleaning tanks 5, ultrasonic rinsing tanks, dehydration tanks, and drying tanks to complete the cleaning of the monocrystalline silicon wafer surface. When the ultrasonic cleaning tank 5 is in use, impurities and reaction precipitates are generated. Due to the action of ultrasound, the impurities and precipitates are evenly distributed or mixed in the cleaning solution. The device is equipped with a turbidity detection unit, which uses a turbidity sensor to detect the turbidity level in the cleaning solution and transmits the detection results to the controller for early warning, prompting the operator to replace the cleaning solution and clean the ultrasonic cleaning tank 5.

[0055] This invention provides a device for cleaning the surface of monocrystalline silicon wafers. By setting up multiple ultrasonic cleaning tanks 5, the device utilizes the strong penetrating power of ultrasound to generate microbubbles that impact the surface of the monocrystalline silicon wafers. Combined with the chemical decontamination effect of the cleaning agent, the surface of the monocrystalline silicon wafers is cleaned. A turbidity sensor is used to detect the turbidity of the cleaning solution in the ultrasonic cleaning tanks 5, enabling real-time monitoring of the cleaning solution usage and prompting staff to replace the cleaning solution and clean the ultrasonic cleaning tanks 5. No manual supervision is required, thus improving the utilization rate of the cleaning solution.

[0056] Example 2:

[0057] like Figure 2-6 As shown, based on the above embodiment 1, the drive box 3 includes:

[0058] The upper box 11, the lower box 12, and the side boxes 13 are symmetrically connected to the bottom two sides of the upper box 11. The two sides of the lower box 12 are rotatably connected to the side boxes 13 through the rotating rods 14. The upper box 11 is connected to the bottom of the lifting rod 2, and the lower box 12 is connected to the top of the washing basket 4.

[0059] The working principle and beneficial effects of the above technical solution are as follows:

[0060] When the drive box 3 is in use, the upper box 11 is fixed to the lifting rod 2, the lower box 12 is used to fix the cleaning basket 4, and the side box 13 is used to form a rotating structure with the lower box 12. The rotation of the lower box 12 drives the cleaning basket 4 to rotate, so that the monocrystalline silicon wafers in the cleaning basket 4 can fully contact the cleaning liquid and improve the cleaning effect.

[0061] Example 3:

[0062] like Figure 2-6 As shown, based on the above embodiment 2, the upper housing 11 includes:

[0063] The first slide groove 15 is horizontally opened at the top of the inner wall of the upper box 11. Two symmetrical first slide grooves 15 are provided, and a first slider 18 is slidably connected in the first slide groove 15.

[0064] The lead screw 16 is rotatably connected to the inner wall of the first slide groove 15, and the end of the lead screw 16 extends out of the first slide groove 15 and connects to the two output ends of the first motor 17. The first slider 18 is screwed onto the lead screw 16.

[0065] Push plate 19, push plate 19 is slidably connected to the inner wall of upper box 11;

[0066] Connecting rod 20, two symmetrical connecting rods 20, with their ends hinged to push plate 19 and first slider 18 respectively.

[0067] The upper housing 11 is equipped with a drive unit for driving the lower housing 12 to rotate. The drive unit includes:

[0068] The second motor 21 is connected to the center of the bottom end of the push plate 19;

[0069] The top of the bent rod 22 is connected to the output end of the second motor 21, and the bottom of the bent rod 22 is connected to the guide block 23. The top of the lower housing 12 is open, and the bent rod 22 extends into the lower housing 12.

[0070] Guide rod 24 is connected to the inner wall of the lower housing 12. Guide rod 24 is arc-shaped and protrudes upward in the middle. An arc-shaped guide groove 25 is opened at the top of guide rod 24. Guide groove 25 is adapted to guide block 23.

[0071] The working principle and beneficial effects of the above technical solution are as follows:

[0072] When the upper housing 11 is in use, the first motor 17 is started first. The first motor 17 is set as a dual-axis motor. The first motor 17 drives the two lead screws 16 to rotate synchronously. The lead screws 16 are threadedly driven with the first sliders 18, so that the two first sliders 18 slide along the first slide groove 15 and move away from each other. The first sliders 18 push the push plate 19 downward through the connecting rod 29. The push plate 19 drives the second motor 21 to slide downward until the guide block 23 at the bottom of the bent rod 22 is engaged in the guide groove 25 on the guide rod 24. Then the second motor 21 is started to drive the bent rod 22 to rotate. In order to adapt to the rotation of the guide block 23, the guide rod 24 will also rotate, thereby driving the lower housing 11 to rotate around the rotating rod 14. That is, the cleaning basket 4 is rotated around the rotating rod 14, so that the monocrystalline silicon wafer in the cleaning basket 4 rotates itself while being ultrasonically cleaned, so that the micro bubbles generated by the ultrasonic waves can fully contact the monocrystalline silicon wafer, improve the cleaning effect, and the rotation amplitude of the cleaning basket 4 can be controlled by controlling the size of the bent rod 22.

[0073] Example 4:

[0074] like Figure 2-6 As shown, based on the above embodiment 3, a second slide groove 26 is provided on the inner side of the side box 13, a second slider 27 is slidably connected in the second slide groove 26, a rotating rod 14 is rotatably connected to the second slider 27 and extends into the side box 13, and a first spring is connected between the second slider 27 and the top of the second slide groove 26.

[0075] Two limiting rods 28 are symmetrically connected on both sides of the bottom end of the push plate 19. The bottom end of the limiting rod 28 is provided with a groove that matches the rotating rod 14.

[0076] The working principle and beneficial effects of the above technical solution are as follows:

[0077] In the initial position, the rotating rod 14 is in equilibrium under the action of the first spring. When the cleaning basket 4 is immersed downward, it is pushed upward by the buoyancy of the cleaning liquid. The first spring provides elasticity and buffers the cleaning basket 4. When the monocrystalline silicon wafer floats upward under the action of buoyancy, the cleaning basket 4 can move upward by a certain distance, reducing the displacement difference between the cleaning basket 4 body and the monocrystalline silicon wafer, and preventing the monocrystalline silicon wafer from floating upward and falling off.

[0078] When the push plate 19 slides downward, it drives the two limiting rods 28 to slide downward, so that the groove at the bottom of the limiting rod 28 abuts against the rotating rod 14. As the push plate 19 moves downward, it limits the rotating rod 14 to the bottom of the second slide groove 26, so as to prevent the rotating rod 14 from shifting when the lower box 12 rotates, thus ensuring the stability of the rotation of the cleaning basket 4 and preventing damage to the monocrystalline silicon wafer.

[0079] Example 5:

[0080] like Figure 2-6 As shown, based on the above embodiment 4, a vibration unit is provided inside the upper housing 11 and the lower housing 12. The vibration unit includes:

[0081] Vibrating plate 29, two vibrating plates 29 are symmetrically connected to the bottom end of push plate 19, and the bottom end of vibrating plate 29 is provided with an arc-shaped groove 31, and multiple vibrating protrusions 32 are evenly connected in the arc-shaped groove 31.

[0082] Two vibrating rods 33 are symmetrically arranged and vertically slidably connected to the side wall of the lower box 12. The top and bottom ends of the vibrating rods 33 extend out of the lower box 12, and the bottom end of the vibrating rods 33 is connected to the cleaning basket 4.

[0083] The arc-shaped plate 34 is connected to the top of the vibration rod 32 and protrudes upward in the middle. A second spring 51 is connected between the bottom of the arc-shaped plate 34 and the lower housing 12. Multiple vibration protrusions 35 are evenly connected on the arc-shaped plate 34.

[0084] The working principle and beneficial effects of the above technical solution are as follows:

[0085] When the push plate 19 slides downward, it drives the vibrating plate 29 to move downward, so that the vibrating plate 29 contacts the arc plate 34, and the central axis of the arc plate 34 is collinear with the central axis of the rotating rod 14. When the lower chamber 12 rotates, the arc plate 34 is pressed tightly against the vibrating plate 29 under the action of the second spring 52. As the arc plate 34 slides on the vibrating plate 29, the vibrating protrusion 35 on the arc plate 34 and the vibrating protrusion 32 on the vibrating plate 29 make intermittent contact, causing the vibrating rod 33 to vibrate up and down, causing the cleaning basket 4 to generate a small amplitude vibration in the vertical direction. This small amplitude vibration can create a small gap between the monocrystalline silicon wafer in the cleaning basket 4 and the structure of the cleaning basket 4, allowing the microbubbles generated by the ultrasonic waves to enter and clean. By utilizing the small amplitude vibration of the cleaning basket 4 itself, the problem of cleaning dead corners on the contact clamping surface between the monocrystalline silicon wafer and the cleaning basket 4 is solved without damaging the monocrystalline silicon wafer, thus improving the cleaning effect.

[0086] Example 6:

[0087] like Figure 2 As shown, based on the above embodiment 2, a rinsing unit is provided on the side housing 13, and the rinsing unit includes:

[0088] A water storage chamber 41 is located on the upper part of the side box 13. A piston plate 42 is slidably connected inside the water storage chamber 41. A piston rod 43 connected to the bottom end of the piston plate 42 passes through the water storage chamber 41 and is rotatably connected to the end of the rotating rod 14. The side wall of the water storage chamber 41 is provided with a one-way water inlet and water outlet. The water inlet of the water storage chamber 41 is connected to the water tank through a pipeline.

[0089] The flushing assembly is connected to the bottom of the side chamber 13, and the water inlet of the flushing assembly is connected to the water outlet of the water storage chamber 41 through a pipeline.

[0090] The working principle and beneficial effects of the above technical solution are as follows:

[0091] After cleaning in the ultrasonic cleaning tank 5, some cleaning fluid remains on the monocrystalline silicon wafer. As the cleaning basket 4 moves through multiple ultrasonic cleaning tanks 5, the cleaning fluid is carried away, which can affect the concentration of the cleaning fluid and the composition of the cleaning agent in different cleaning tanks. Therefore, a rinsing unit is provided. When the cleaning basket 4 is immersed in the ultrasonic cleaning tank 5 and rotates, the rotating rod 14 moves downward, and the rotating rod 13 drives the piston rod 43 to move downward. The piston plate 42 draws clean water from the water tank into the water storage chamber 41. When the cleaning basket 4 is removed from the ultrasonic cleaning tank 5, the unique motor 17 is simultaneously activated to reverse, causing the rotating rod 13 to move upward and reset under the action of the first spring. At this time, the rotating rod 13 drives the piston rod 43 to move upward, and the piston plate 42 squeezes the clean water in the water storage chamber 41 into the rinsing assembly, which rinses the cleaning basket 4. While the cleaning basket 4 is being immersed and rotated, it can automatically draw in clean water without the need for an additional water pump, allowing water storage and cleaning to proceed simultaneously. When the cleaning basket 4 is removed and stops rotating, it can promptly remove the residual cleaning solution on the silicon wafer through rinsing, reducing the loss and mixing reaction of the cleaning agent, ensuring that each ultrasonic cleaning tank 5 is relatively independent, and facilitating the control of the cleaning agent content in each ultrasonic cleaning tank 5.

[0092] Example 7:

[0093] like Figure 7 , 8 As shown, based on the above embodiment 6, the rinsing assembly includes:

[0094] The flushing plate 44 has an inlet pipe 45 at the top that is connected to the side box 13 and is connected to the outlet of the water storage chamber 41 through a pipe. The flushing plate 44 has a diversion channel 46 that is connected to the inlet pipe 45.

[0095] Sprayer head seat 47 is evenly connected to the bottom end of the rinsing tray 44. Sprayer head 50 is connected to the bottom end of the sprayer head seat 47 and the sprayer head 50 faces the cleaning basket 4.

[0096] The pressure stabilizing chamber 48 is located inside the flushing plate 44 and at the top of the nozzle seat 47. The pressure stabilizing chamber 48 is connected to the diversion channel 46. A hemispherical pressure stabilizing piston 49 is slidably connected inside the pressure stabilizing chamber 48. A third spring is connected between the pressure stabilizing piston 49 and the bottom of the pressure stabilizing chamber 48. The pressure stabilizing piston 49 has a passage with a decreasing diameter from top to bottom, and the passage is connected to the water flow path of the nozzle seat 47.

[0097] The working principle and beneficial effects of the above technical solution are as follows:

[0098] When the rinsing assembly is in use, the water in the water storage chamber 41 enters the rinsing plate 44 through the water inlet pipe 13 and flows into each diversion channel 46. The water flows along the diversion channel 46 to the pressure stabilizing chamber 48. In the initial position, the pressure stabilizing piston 49 is located at the upper part of the pressure stabilizing chamber 48 under the action of the spring. When the water flows in, because the diameter of the passage in the pressure stabilizing piston 49 narrows from top to bottom, the water pressure drives the pressure stabilizing piston 49 to move downward. The tension generated by the spring makes the water pressure in each pressure stabilizing chamber 48 nearly uniform, achieving the effect of pressure stabilization. At the same time, the passage with the diameter narrowing from top to bottom can play a role in pressurization, realizing the stabilization and pressurization of the water flow in each nozzle 40, so that the water flow can rinse the monocrystalline silicon wafer evenly at the preset pressure, reducing the problem of insufficient rinsing when the pressure distribution is uneven, and ensuring the removal effect of the cleaning agent.

[0099] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0100] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0101] Although embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for the present invention. Other modifications can be easily made by those skilled in the art. Therefore, without departing from the general concept defined by the claims and their equivalents, the present invention is not limited to the specific details and illustrations shown and described herein.

Claims

1. A device for cleaning the surface of a single-crystal silicon wafer, characterized in that, include: An electric guide rail (1) is connected to a lifting rod (2) at its output end. A drive box (3) is connected to the bottom end of the lifting rod (2). A cleaning basket (4) is connected to the bottom end of the drive box (3). The cleaning basket (4) contains a single crystal silicon wafer. Multiple ultrasonic cleaning tanks (5) are set below the electric guide rail (1). The electric guide rail (1) is used to drive the cleaning basket (4) to move along the cleaning direction. The lifting rod (2) is used to adjust the height of the cleaning basket (4) so ​​that it is immersed in the cleaning liquid of the ultrasonic cleaning tank (5). The turbidity detection unit obtains the turbidity value of the cleaning liquid in the ultrasonic cleaning tank (5) by setting a turbidity sensor in the ultrasonic cleaning tank (5) and determines the degree of turbidity in the ultrasonic cleaning tank (5). The drive box (3) includes: an upper box (11), a lower box (12) and a side box (13). The two side boxes (13) are symmetrically connected to the bottom sides of the upper box (11). The two sides of the lower box (12) are rotatably connected to the two side boxes (13) through a rotating rod (14). The upper box (11) is connected to the bottom of the lifting rod (2), and the lower box (12) is connected to the top of the washing basket (4). The upper housing (11) includes: The first slide groove (15) is horizontally opened at the top of the inner wall of the upper box (11). The first slide groove (15) is set as two symmetrical ones. The first slide groove (15) is slidably connected to the first slider (18). The lead screw (16) is rotatably connected to the inner wall of the first slide groove (15), and the end of the lead screw (16) extends out of the first slide groove (15) and connects to the two output ends of the first motor (17). The first slider (18) is screwed onto the lead screw (16). Push plate (19) is slidably connected to the inner wall of the upper box (11); The connecting rod (20) is configured as two symmetrical rods, and the two ends of the connecting rod (20) are respectively hinged to the push plate (19) and the first slider (18); The upper housing (11) is equipped with a drive unit for driving the lower housing (12) to rotate; Two limiting rods (28) are symmetrically connected on both sides of the bottom end of the push plate (19). The bottom end of the limiting rod (28) is provided with a groove that matches the rotating rod (14). Vibration units are provided inside the upper housing (11) and the lower housing (12), and the vibration units include: Two vibrating plates (29) are symmetrically connected to the bottom of the push plate (19). The bottom of the vibrating plate (29) is provided with an arc-shaped groove (31), and multiple vibrating protrusions (32) are evenly connected in the arc-shaped groove (31). Two vibrating rods (33) are symmetrically arranged and vertically slidably connected to the side wall of the lower box (12). The top and bottom ends of the vibrating rods (33) both protrude from the lower box (12), and the bottom end of the vibrating rods (33) is connected to the cleaning basket (4). An arc plate (34) is connected to the top of the vibrating rod (33) and protrudes upward. A second spring (51) is connected between the bottom of the arc plate (34) and the lower box (12). Multiple vibrating protrusions (35) are evenly connected on the arc plate (34).

2. The device for cleaning the surface of a single-crystal silicon wafer according to claim 1, characterized in that, Below the electric guide rail (1) are a dehydration tank and a drying tank, which are located behind the ultrasonic cleaning tank (5).

3. The device for cleaning the surface of a single-crystal silicon wafer according to claim 1, characterized in that, The drive unit includes: The second motor (21) is connected to the center of the bottom end of the push plate (19); The top of the bent rod (22) is connected to the output end of the second motor (21), and the bottom of the bent rod (22) is connected to a guide block (23). The top of the lower housing (12) is open, and the bent rod (22) extends into the lower housing (12). Guide rod (24) is connected to the inner wall of the lower box (12). The guide rod (24) is arc-shaped and protrudes upward in the middle. An arc-shaped guide groove (25) is opened at the top of the guide rod (24). The guide groove (25) is adapted to the guide block (23).

4. The device for cleaning the surface of a single-crystal silicon wafer according to claim 3, characterized in that, A second slide groove (26) is provided on the inner side of the side box (13). The second slider (27) is slidably connected in the second slide groove (26). The rotating rod (14) is rotatably connected to the second slider (27) and extends into the side box (13). A first spring is connected between the second slider (27) and the top of the second slide groove (26).

5. The device for cleaning the surface of a single-crystal silicon wafer according to claim 1, characterized in that, A rinsing unit is provided on the side chamber (13), and the rinsing unit includes: A water storage chamber (41) is located on the upper part of the side box (13). A piston plate (42) is slidably connected inside the water storage chamber (41). A piston rod (43) connected to the bottom end of the piston plate (42) passes through the water storage chamber (41) and is rotatably connected to the end of the rotating rod (14). The side wall of the water storage chamber (41) is provided with a one-way water inlet and water outlet. The water inlet of the water storage chamber (41) is connected to the water tank through a pipeline. The flushing assembly is connected to the bottom of the side box (13), and the water inlet of the flushing assembly is connected to the water outlet of the water storage chamber (41) through a pipeline.

6. The device for cleaning the surface of a single-crystal silicon wafer according to claim 5, characterized in that, The rinsing components include: The flushing plate (44) has an inlet pipe (45) at the top connected to the side box (13) and connected to the outlet of the water storage chamber (41) through a pipe. A diversion channel (46) connected to the inlet pipe (45) is provided inside the flushing plate (44). The nozzle holder (47) is evenly connected to the bottom of the rinsing tray (44), and the nozzle (50) is connected to the bottom of the nozzle holder (47). The nozzle (50) faces the cleaning basket (4). The pressure stabilizing chamber (48) is located inside the flushing plate (44) and at the top of the nozzle seat (47). The pressure stabilizing chamber (48) is connected to the diversion channel (46). A hemispherical pressure stabilizing piston (49) is slidably connected inside the pressure stabilizing chamber (48). A third spring is connected between the pressure stabilizing piston (49) and the bottom end of the pressure stabilizing chamber (48). A passage with a decreasing diameter from top to bottom is opened inside the pressure stabilizing piston (49). The passage is connected to the water flow path of the nozzle seat (47).

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