Vibration suppression method, apparatus, device, and computer-readable storage medium

Abstract

The application discloses a vibration suppression method, device, equipment and computer readable storage medium, and belongs to the technical field of laser processing. The vibration suppression method comprises the following steps: acquiring a process cutting speed of a to-be-cut plate and a feedback height; when the process cutting speed is smaller than a preset vibration suppression reference speed and the feedback height is smaller than a preset standard cutting height, calculating a limited height deviation amount of a laser head; and based on the limited height deviation amount, suppressing the control speed of a servo controller, so that the servo controller controls the laser head to lift up at the maximum movement speed of the laser head after the control speed is suppressed. The application provides a vibration suppression strategy to ensure the cutting effect of laser cutting.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of laser processing, and particularly relates to a vibration suppression method, device, equipment and computer readable storage medium. BACKGROUND

[0002] With the continuous development of science and technology, high-precision laser cutting has become an important application scenario of laser technology in the processing field, and laser cutting systems have been greatly improved in various aspects of performance.

[0003] Currently, in the laser cutting system, the follow-up controller is usually a PID (Proportion Integration Differentiation, Proportion Integration Differentiation controller) controller. The follow-up controller is used to monitor the distance (plate spacing, also referred to as feedback height) from the laser head nozzle to the surface of the workpiece to be cut by the capacitive displacement sensor to adjust the position of the laser head in real time, so as to ensure that the focal point of the laser emitted by the cutting head nozzle is located at a fixed position relative to the surface of the plate to be cut to achieve uniform and bright cutting plate cross-sectional stripes. However, when using laser processing technology to cut thicker plates, molten slag splashing, plate surface oxide skin bursting and other situations easily occur, which causes the plate spacing monitored by the capacitive displacement sensor to become smaller, and the follow-up controller controls the laser head to lift up, especially the excessive lifting speed will cause the vibration of the laser cutting system, and then affect the cutting effect.

[0004] In summary, how to provide a vibration suppression strategy to ensure the cutting effect of laser cutting has become a technical problem to be solved in the field of laser processing technology. SUMMARY

[0005] The main purpose of the present application is to provide a vibration suppression method, device, equipment and computer readable storage medium. A vibration suppression strategy is provided to ensure the cutting effect of laser cutting.

[0006] In order to achieve the above purpose, the present application provides a vibration suppression method, which comprises the following steps:

[0007] Obtaining the process cutting speed of the plate to be cut and the feedback height;

[0008] When the process cutting speed is less than the preset vibration suppression reference speed and the feedback height is less than the preset standard cutting height, calculating the limit height deviation amount of the laser head;

[0009] Based on the limit height deviation amount, the control speed of the follow-up controller is suppressed, so that the follow-up controller controls the laser head to lift up at the maximum motion speed of the laser head after suppression.

[0010] Optionally, the step of calculating the limit height deviation of the laser head comprises:

[0011] determining an alternative deviation based on the process cutting speed, the vibration suppression reference speed and a preset deviation threshold value;

[0012] determining the limit height deviation of the laser head as the minimum value between the height difference between the feedback height and the standard cutting height and the alternative deviation.

[0013] Optionally, the step of determining an alternative deviation based on the process cutting speed, the vibration suppression reference speed and a preset deviation threshold value comprises:

[0014] calculating a speed ratio between the process cutting speed and the vibration suppression reference speed;

[0015] determining the alternative deviation as the maximum value between the speed ratio and a preset deviation threshold value.

[0016] Optionally, the step of suppressing the control speed of the servo controller based on the limit height deviation comprises:

[0017] multiplying the limit height deviation by a proportional gain of the servo controller to obtain a target control amount, and determining the control speed of the servo controller based on the target control amount.

[0018] Optionally, the method further comprises:

[0019] when the process cutting speed is less than a preset vibration suppression reference speed and the feedback height is less than a preset standard cutting height, calculating a control acceleration of a servo controller, so that the servo controller controls the laser head to lift up with the control acceleration as the maximum movement acceleration of the laser head.

[0020] Optionally, the step of calculating a control acceleration of a servo controller comprises:

[0021] determining an acceleration coefficient based on the process cutting speed, the vibration suppression reference speed and a preset coefficient threshold value;

[0022] multiplying the acceleration coefficient by a preset acceleration to obtain the control acceleration of the servo controller.

[0023] Optionally, the step of determining an acceleration coefficient based on the process cutting speed, the vibration suppression reference speed and a preset coefficient threshold value comprises:

[0024] calculating a speed ratio between the process cutting speed and the vibration suppression reference speed;

[0025] The maximum value between the speed ratio and the preset coefficient threshold is determined as an acceleration coefficient.

[0026] In addition, to achieve the above object, the present application also provides a vibration suppression device, which comprises the following steps:

[0027] An acquisition module is configured to acquire a process cutting speed of a plate to be cut and a feedback height;

[0028] A calculation module is configured to calculate a limited height deviation of a laser head when the process cutting speed is less than a preset vibration suppression reference speed and the feedback height is less than a preset standard cutting height.

[0029] A suppression module is configured to suppress a control speed of a servo controller based on the limited height deviation, so that the servo controller controls the laser head to lift up at the suppressed control speed as a maximum movement speed of the laser head.

[0030] In addition, to achieve the above object, the present application also provides a vibration suppression device, which comprises a memory, a processor and a vibration suppression program stored in the memory and executable on the processor, and the vibration suppression program of the vibration suppression device implements the steps of the vibration suppression method when executed by the processor.

[0031] In addition, to achieve the above object, the present application also provides a computer readable storage medium, which stores a vibration suppression program, and the vibration suppression program implements the steps of the vibration suppression method when executed by a processor.

[0032] The embodiment of the present application acquires the process cutting speed of the plate to be cut and the feedback height, calculates the limited height deviation of the laser head when the process cutting speed is less than the preset vibration suppression reference speed and the feedback height is less than the preset standard cutting height, that is, when the plate spacing monitored by the capacitive displacement sensor (i.e., the feedback height) becomes small due to the molten slag splashing, the plate surface oxide skin bursting and other situations, calculates the limited height deviation of the laser head, then obtains the control speed of the servo controller based on the limited height deviation, and takes the control speed as the maximum movement speed when the laser head lifts up, controls the laser head to lift up by the servo controller to eliminate the height error. In this way, by suppressing the control speed of the servo controller when the plate spacing monitored by the capacitive displacement sensor becomes small due to the molten slag splashing, the plate surface oxide skin bursting and other situations, the laser head is relatively stably lifted up at a smaller control speed as the maximum movement speed, the movement speed of the laser head is suppressed, thereby avoiding the vibration of the laser cutting system and ensuring the cutting effect of the laser cutting. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 is a device structure schematic diagram of a hardware running environment of a vibration suppression device involved in an embodiment scheme of the present application.

[0034] Figure 2 is a step flow schematic diagram of a first embodiment of a vibration suppression method of the present application.

[0035] Figure 3 is a vibration suppression structure block diagram involved in an embodiment of a vibration suppression method of the present application.

[0036] Figure 4 is a vibration suppression flow schematic diagram involved in an embodiment of a vibration suppression method of the present application.

[0037] Figure 5 is a function module schematic diagram of an embodiment of a vibration suppression device of the present application.

[0038] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0039] It should be understood that the specific embodiments described herein are merely intended to explain the present application and are not intended to limit the present application.

[0040] Referring to Figure 1 , Figure 1 is a device structure schematic diagram of a hardware running environment of a vibration suppression device involved in an embodiment scheme of the present application.

[0041] It should be noted that the present application relates to a vibration suppression device in the field of laser processing technology. Specifically, the vibration suppression device can be a smart phone, a PC (Personal Computer), a tablet computer, a portable computer, etc.

[0042] As Figure 1As shown, the vibration suppression device can include a processor 1001, such as a CPU, a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. The communication bus 1002 is used to realize the connection communication between these components. The user interface 1003 can include a display screen (DiSplay), an input unit such as a keyboard (Keyboard), and the optional user interface 1003 can also include a standard wired interface, a wireless interface. The network interface 1004 can optionally include a standard wired interface, a wireless interface (such as a Wi-Fi interface). The memory 1005 can be a high-speed RAM memory, or a stable memory (non-volatile memory) such as a disk memory. The memory 1005 can also be an independent storage device from the aforementioned processor 1001. The following is omitted for the sake of description The execution subject of the method steps in each embodiment.

[0043] Those skilled in the art can understand that Figure 1 The vibration suppression device structure shown in the figure does not constitute a limitation on the vibration suppression device, and can include more or fewer components than the figure, or combine certain components, or different component arrangements.

[0044] As Figure 1 As shown, the memory 1005 as a computer storage medium can include an operating system, a network communication module, a user interface module, and a vibration suppression program.

[0045] In Figure 1 In the terminal shown, the network interface 1004 is mainly used to connect to the background server and communicate data with the background server; the user interface 1003 is mainly used to connect to the client and communicate data with the client; and the processor 1001 can be used to call the vibration suppression program stored in the memory 1005 and perform the following operations:

[0046] Obtain the process cutting speed of the to-be-cut plate and the feedback height;

[0047] When the process cutting speed is less than a preset vibration suppression reference speed and the feedback height is less than a preset standard cutting height, calculate a limit height deviation amount of the laser head;

[0048] Based on the limit height deviation amount, suppress the control speed of the follow-up controller, so that the follow-up controller controls the laser head to lift up at the suppressed control speed as the maximum movement speed of the laser head.

[0049] Further, the operation of calculating the limit height deviation amount of the laser head includes:

[0050] determining an alternative deviation amount based on the process cutting speed, the vibration suppression reference speed, and a preset deviation amount threshold value;

[0051] determining a limit height deviation amount as a minimum value between the feedback height and the standard cutting height and the alternative deviation amount.

[0052] Further, the operation of determining the alternative deviation amount based on the process cutting speed, the vibration suppression reference speed, and a preset deviation amount threshold value comprises:

[0053] calculating a speed ratio between the process cutting speed and the vibration suppression reference speed;

[0054] determining a maximum value between the speed ratio and a preset deviation amount threshold value as the alternative deviation amount.

[0055] Further, the operation of suppressing the control speed of the servo controller based on the limit height deviation amount comprises:

[0056] multiplying the limit height deviation amount and a proportional gain of the servo controller to obtain a target control amount, and determining the control speed of the servo controller based on the target control amount.

[0057] Further, the processor 1001 can be further configured to invoke a vibration suppression program stored in the memory 1005 to perform the following operations:

[0058] calculating a control acceleration of a servo controller when the process cutting speed is less than a preset vibration suppression reference speed and the feedback height is less than a preset standard cutting height, so that the servo controller controls the laser head to lift up with a maximum movement acceleration of the laser head at the control acceleration.

[0059] Further, the operation of calculating the control acceleration of the servo controller comprises:

[0060] determining an acceleration coefficient based on the process cutting speed, the vibration suppression reference speed, and a preset coefficient threshold value;

[0061] multiplying the acceleration coefficient and a preset acceleration to obtain the control acceleration of the servo controller.

[0062] Further, the operation of determining the acceleration coefficient based on the process cutting speed, the vibration suppression reference speed, and a preset coefficient threshold value comprises:

[0063] calculating a speed ratio between the process cutting speed and the vibration suppression reference speed;

[0064] determining a maximum value between the speed ratio and a preset coefficient threshold value as the acceleration coefficient.

[0065] Based on the above structure, various embodiments of the vibration suppression method are proposed.

[0066] Please refer to Figure 2 , Figure 2 The flowchart of the first embodiment of the vibration suppression method of the present application is shown. It should be noted that although the logical order is shown in the flowchart, in some cases, the vibration suppression method of the present application can of course be executed in a different order than shown or described here. In this embodiment, the execution subject of the vibration suppression method can be a personal computer, a smart phone or other device, which is not limited in this embodiment. The vibration suppression method comprises S10-S30:

[0067] Step S10, obtaining the process cutting speed and feedback height of the to-be-cut plate;

[0068] High-precision laser cutting is an important application scenario of laser technology in the processing field. With the development and progress of laser technology, laser equipment manufacturing technology, control technology and processing technology, the overall system of laser cutting has been greatly improved in various aspects. Laser follow-up control system, an automatic height adjustment system integrating CNC technology, laser technology, automatic control technology and capacitive sensor technology, is an important part of laser cutting system. In the laser cutting system, the follow-up control system usually refers to an automatic control system for controlling the movement of the follow-up shaft, which is specifically a PID controller in this application. In a three-axis laser cutting system, the follow-up shaft is the Z-axis. In the processing process, in order to ensure the processing quality, the distance between the laser cutting head nozzle and the workpiece surface is always within the set range. The distance between the laser cutting head nozzle and the workpiece surface is called the plate spacing. The laser follow-up system monitors the distance between the laser cutting head nozzle and the workpiece in real time according to the capacitive displacement sensor based on the capacitive plate effect. The laser follow-up control system adjusts the position of the laser cutter on the Z-axis in real time according to the plate spacing monitored by the capacitive sensor (i.e. the capacitive displacement sensor mentioned above), and finally achieves cutting control.

[0069] Currently, the capacitance sensor in the thick plate cutting process is affected by the flying slag and the plate surface oxide skin burst, etc. to produce fluctuations. In the follow-up control system, the height control will be performed according to the capacitance value. Without processing the fluctuations, the follow-up control shaft will fluctuate, and then the cutting effect will be poor. It should be noted that the specific scene of interfering with the capacitance sensor is not limited in the present application. In order to ensure good cutting effect, the vibration of the laser cutting system needs to be suppressed. However, the existing vibration suppression control does not consider the scene of different cutting process parameters. For example, the same control suppression strategy is used in the case of high process cutting height and low process cutting speed and low process cutting height, resulting in a large difference in the vibration suppression effect of different thickness plates under different process requirements. However, the vibration suppression method of the present application can automatically identify the cutting scene by adaptively matching the cutting state, automatically identify the cutting scene, and automatically match the control amount for the scene when performing vibration suppression control to automatically adapt different vibration suppression parameters when different cutting process parameters are used for different thickness plates.

[0070] It should be noted that relevant personnel can set different process cutting speeds for plates with different thicknesses according to the thickness of the plate alone when the material type (metal) of the plate to be cut, laser power, focal point and focus point diameter, and cutting gas and other factors are the same.

[0071] The plate to be cut is the plate or workpiece that needs to be cut in the current laser cutting process. The process cutting speed of the plate to be cut and the plate spacing monitored by the capacitance sensor are obtained, that is, the feedback height.

[0072] Step S20, when the process cutting speed is less than the preset vibration suppression reference speed and the feedback height is less than the preset standard cutting height, the limit height deviation amount of the laser head is calculated.

[0073] The to-be-cut plate is a plate or workpiece that needs to be cut in the laser cutting process. A thickness threshold value, i.e., the preset thickness, is set according to an empirical value in advance. The cutting speed corresponding to the preset thickness is the preset vibration suppression reference speed. When the to-be-cut plate exceeds the preset thickness, i.e., the process cutting speed of the to-be-cut plate is less than the preset vibration suppression reference speed, the to-be-cut plate is prone to molten slag splashing, a large amount of heat causing the surface of the plate to oxidize and crack, and other conditions that cause interference to the capacitive sensor during the cutting process. The plate spacing is the distance between the laser head nozzle and the surface of the to-be-cut plate. Before the laser cutting is performed, the process cutting height, i.e., the standard cutting height, is set according to actual requirements. The process cutting height is determined by adjusting the lens in the nozzle to determine the distance between the laser focal point and the nozzle, and this distance is used as the process cutting height, because the laser focal point is usually kept on the surface of the to-be-cut plate to ensure the accuracy of the cutting. The limit height deviation of the laser head is a feedback deviation used by the PID controller recalculated by using the technical solution provided in the present application.

[0074] When the thickness of the to-be-cut plate is greater than the preset thickness, i.e., the process cutting speed of the to-be-cut plate is less than the preset vibration suppression reference speed, and the plate spacing monitored by the capacitive sensor, i.e., the feedback height, is less than the preset standard cutting height, it indicates that molten slag splashing, surface oxidation and cracking of the plate, and other conditions that cause the plate spacing monitored by the capacitive displacement sensor to become smaller have occurred. At this time, the limit height deviation of the laser head is calculated.

[0075] Because the process cutting speed is smaller when the thickness of the plate is thicker, i.e., there is a direct proportional relationship between the thickness of the plate and the cutting speed. The process cutting speed corresponding to the thickness of the to-be-cut plate is denoted as F; the process cutting speed corresponding to the preset thickness, i.e., the preset vibration suppression reference speed, is denoted as Fref, which can also be referred to as the splashing slag vibration suppression reference speed. The process cutting speed F is smaller than Fref, and the splashing slag vibration suppression control can be performed; the process cutting height set for this cutting is denoted as Hcmd, which can also be referred to as the command height, and is the target height to be maintained in the follow-up control; the plate spacing monitored by the sensor is denoted as Hi, which can also be referred to as the feedback height, and is the feedback height obtained in the i-th cycle. In the specific implementation, the size relationship between F and Fref can be compared. When F is smaller than Fref, it indicates that the thickness of the to-be-cut plate is greater than the preset thickness. Therefore, the suppression deviation control condition can be represented as: (F < Fref && Hi < Hcmd), i.e., the laser process cutting speed F is smaller than the splashing slag vibration suppression reference speed Fref, and the feedback height Hi is smaller than the command height Hcmd.

[0076] In an implementation, the step S20 includes steps S201-S202:

[0077] Step S201, determining a candidate deviation amount based on the process cutting speed, the vibration suppression reference speed and a preset deviation amount threshold.

[0078] The maximum deviation amount calculated by the splash suppression vibration suppression limit parameter is set in advance according to the empirical value, that is, the preset deviation amount threshold, which can be represented as Href. In the present application, Href is set as 0.5 mm.

[0079] The candidate deviation amount is determined based on the process cutting speed, the vibration suppression reference speed and the preset deviation amount threshold of the plate to be cut, wherein the candidate deviation amount is the value that can be determined as the limit height deviation amount of the laser head.

[0080] In an available embodiment, the step S201 includes steps S2011-S2012:

[0081] Step S2011, calculating the speed ratio between the process cutting speed and the vibration suppression reference speed.

[0082] The speed ratio between the process cutting speed and the vibration suppression reference speed, that is, the above-mentioned speed ratio, is calculated.

[0083] Step S2012, determining the maximum value between the speed ratio and the preset deviation amount threshold as the candidate deviation amount.

[0084] The maximum value between the speed ratio and the preset deviation amount threshold is determined as the candidate deviation amount. In a specific embodiment, the ratio between the process cutting speed and the vibration suppression reference speed is represented as F / Fref, and the preset deviation amount threshold is represented as Href. max(Href, F / Fref) is taken as the candidate deviation amount. Since F is less than Fref, F / Fref is less than 1, and the thicker the plate to be cut, the smaller F is, and the smaller F / Fref is. In addition, Href is 0.5, so the candidate deviation amount is less than 1.

[0085] Step S202, determining the minimum value between the height difference between the feedback height and the standard cutting height and the candidate deviation amount as the limit height deviation amount of the laser head.

[0086] The difference between the feedback height and the standard cutting height, that is, the above-mentioned height difference, is calculated, and the minimum value between the height difference and the candidate deviation amount is determined as the limit height deviation amount of the laser head.

[0087] In the specific embodiment, the difference between the plate spacing and the standard cutting height is denoted as Hcmd-Hi, and the calculated limited height deviation is denoted as min(Hcmd-Hi, max(Href, F / Fref)), that is, when the laser process cutting speed F is less than the splash vibration suppression reference speed Fref, and the feedback height Hi is less than the command height Hcmd, the limited height deviation used for PID control cannot exceed the splash vibration suppression limit maximum deviation Href. However, when the ratio of the laser cutting process speed F to the splash vibration control reference speed Fref is greater, the deviation limit will adopt this ratio. It should be understood that because max(Href, F / Fref) is less than 1, and the limited height deviation is min(Hcmd-Hi, max(Href, F / Fref)), the final limited height deviation is also less than 1.

[0088] In step S30, the control speed of the servo controller is suppressed based on the limited height deviation, so that the servo controller controls the laser head to lift up at the maximum movement speed of the laser head at the suppressed control speed.

[0089] Because the servo controller adopts a PID controller, the proportional gain of the PID controller is KP, and the speed control is performed according to the height deviation, the greater the height deviation, the greater the control speed of the PID controller, and the smaller the height deviation, the smaller the control speed of the PID controller. The control of the height deviation can make the system more stable when the error information is introduced.

[0090] Based on the calculated limited height deviation of the laser head, the control speed of the servo controller is suppressed to obtain a control speed for controlling the movement of the laser head, so that the servo controller controls the laser head to lift up at the maximum movement speed of the laser head.

[0091] It should be noted that the distance of the laser head lifting up is the distance between the plate spacing and the preset standard cutting height, that is, to ensure that the laser focal point is at a fixed position relative to the surface of the plate after the laser head is lifted up.

[0092] In an embodiment, the step S30 includes step S301:

[0093] In step S301, the limited height deviation and the proportional gain of the servo controller are multiplied to obtain a target control amount, and the control speed of the servo controller is determined based on the target control amount.

[0094] The limited height deviation less than 1 is multiplied by the proportional gain of the servo controller to obtain a target control amount, and the speed of the servo controller for controlling the movement of the laser head is determined based on the target control amount.

[0095] In the specific embodiment, the target control quantity can be considered as a new proportional gain, so that the servo controller determines the speed of the laser head according to the new proportional gain.

[0096] Thus, the application obtains the process cutting speed of the to-be-cut plate and the feedback height, calculates the limit height deviation of the laser head when the process cutting speed is less than the preset vibration suppression reference speed and the feedback height is less than the preset standard cutting height, that is, when the molten slag splashing, plate surface oxide skin explosion and the like cause the plate spacing monitored by the capacitive displacement sensor (i.e., the above-mentioned feedback height) to become smaller, the limit height deviation of the laser head is calculated, then the control speed of the servo controller is obtained based on the limit height deviation, and the control speed is taken as the maximum movement speed of the laser head when the laser head is lifted up, and the laser head is lifted up by the servo controller to eliminate the height error. In this way, by suppressing the control speed of the servo controller when the molten slag splashing, plate surface oxide skin explosion and the like cause the plate spacing monitored by the capacitive displacement sensor to become smaller, the control speed of the laser head is ensured to be relatively stable when the laser head is lifted up at a smaller control speed as the maximum movement speed, the movement speed of the laser head is suppressed, thereby avoiding the vibration of the laser cutting system and ensuring the cutting effect of the laser cutting.

[0097] Further, based on the first embodiment of the vibration suppression method of the application, a second embodiment of the vibration suppression method of the application is proposed.

[0098] In this embodiment, the vibration suppression method of the application further includes step A10:

[0099] Step A10, when the process cutting speed is less than the preset vibration suppression reference speed and the feedback height is less than the preset standard cutting height, the control acceleration of the servo controller is calculated, so that the servo controller controls the laser head to lift up with the control acceleration as the maximum movement acceleration of the laser head.

[0100] The control acceleration of the servo controller is the maximum movement acceleration of the laser head when the servo controller controls the movement of the laser head. When the thickness of the to-be-cut plate is greater than the preset thickness, that is, the process cutting speed of the to-be-cut plate is less than the preset vibration suppression reference speed, and the plate spacing monitored by the capacitive sensor is less than the preset standard cutting height, it indicates that the molten slag splashing, plate surface oxide skin explosion and the like cause the plate spacing monitored by the capacitive displacement sensor to become smaller, at this time, the control acceleration of the servo controller is calculated, so that the servo controller controls the laser head to lift up with the control acceleration as the maximum movement acceleration of the laser head.

[0101] Exemplarily, as Figure 3The laser cutting system includes a splashing slag vibration suppression module, a follow-up PID controller and a servo system + load. The main function of the splashing slag vibration suppression module is to calculate the limit height deviation and control the acceleration limit ratio according to the obtained related parameters of the splashing slag vibration suppression, and the limit height deviation and the acceleration limit ratio are used for subsequent PID module control and finally for acceleration amplitude limit. Specifically, the instruction height (Hcmd) input to the splashing slag vibration suppression module is set by the relevant personnel responsible for this laser cutting in advance, and the feedback height (Hi) output by the servo system + load module is fed back to the splashing slag vibration suppression module. At the same time, the splashing slag vibration suppression module can also obtain the pre-stored F, Fref, Href and Rref, and then calculate the limit height deviation and the follow-up control acceleration ratio (i.e. the above acceleration coefficient) based on F, Fref, Href, Rref, Hcmd and Hi. Then the limit height deviation and the follow-up control acceleration ratio are output to the follow-up PID controller. According to the limit height deviation, the follow-up PID controller obtains the final control speed, and according to the acceleration coefficient, the preset acceleration is suppressed to obtain the final control acceleration. Based on the control speed and the control acceleration, the lifting of the laser head is controlled.

[0102] In an implementable embodiment, the step A10 comprises steps A101-A102:

[0103] Step A101, determining the acceleration coefficient based on the process cutting speed, the vibration suppression reference speed and a preset coefficient threshold.

[0104] The maximum acceleration coefficient of the follow-up controller when controlling the movement of the laser head is set in advance according to the empirical value, that is, the above-mentioned preset coefficient threshold, which can be represented as Rref, and is the acceleration coefficient of the splashing slag vibration suppression limit calculation follow-up control planning. The acceleration coefficient is less than 1.

[0105] Determine the acceleration coefficient for this time laser head lifting control based on the process cutting speed, the vibration suppression reference speed and the preset coefficient threshold of the to-be-cut plate.

[0106] In an implementable embodiment, the step S201 comprises steps S2011-S1012:

[0107] Step S2011, calculating the speed ratio between the process cutting speed and the vibration suppression reference speed.

[0108] Step S2012, determining the maximum value of the speed ratio and the preset coefficient threshold as the acceleration coefficient.

[0109] The ratio between the process cutting speed and the vibration suppression reference speed, i.e. the above-mentioned speed ratio, is calculated, and the maximum value between the speed ratio and the preset coefficient threshold is determined as the acceleration coefficient.

[0110] In the specific embodiment, the maximum acceleration control quantity corresponding proportion used by the PID control, i.e. the above-mentioned acceleration coefficient, is recalculated: max(Rref, F / Fref), i.e. when the laser process cutting speed F is less than the splashing slag vibration suppression reference speed Fref, and the feedback height Hi is less than the command height Hcmd, the maximum acceleration coefficient used for the PID control planning limit is the acceleration coefficient Rref limit, but when the ratio of the laser cutting process speed F to the splashing slag vibration control reference speed Fref is greater, the acceleration coefficient limit will adopt this ratio.

[0111] Step A102, multiplying the acceleration coefficient and the preset acceleration to obtain the control acceleration of the servo controller.

[0112] The above-mentioned preset acceleration is the acceleration limit configured in the PID controller. The acceleration coefficient and the preset acceleration are multiplied to obtain the control acceleration of the servo controller. It should be noted that since the acceleration coefficient is max(Rref, F / Fref), Rref is less than 1, and F / Fref is less than 1, the acceleration coefficient is less than 1, that is, the control acceleration of the servo controller is an acceleration smaller than the preset acceleration obtained by suppressing the preset acceleration.

[0113] Exemplarily, as Figure 4 The vibration suppression flowchart is shown in the figure. First, the splashing slag vibration suppression related calculation data (F, Fref, Href, Rref, Hcmd and Hi) is obtained; it is judged whether the suppression deviation control condition is met, the suppression deviation control condition is (F < Fref && Hi < Hcmd), if yes, the limit height deviation is calculated; it is judged whether the suppression acceleration control condition is met, the suppression acceleration control condition is (F < Fref && Hi < Hcmd), if yes, the limit servo control acceleration proportion calculation is calculated; then the system vibration is suppressed based on the limit height deviation and the limit servo control acceleration proportion.

[0114] Therefore, since the PID controller controls the laser head movement using an excessively large acceleration, which causes mechanical vibration and oscillation of the laser cutting system, the laser head movement acceleration is limited on the basis of the limitation of the laser head movement speed, which can further ensure the smoothness and quality of the workpiece surface in the cutting process, reduce mechanical vibration and oscillation, prolong the service life of the mechanical system, and reduce the wear of the parts. That is, by combining the double suppression in the speed dimension and the acceleration dimension, the vibration suppression of the laser cutting system can be realized, and the laser cutting effect can be ensured.

[0115] Further, the application also provides a vibration suppression device.

[0116] Please refer to Figure 5 , Figure 5 The figure is a functional module diagram of an embodiment of the vibration suppression device of the application, as shown in the figure, the vibration suppression device of the application comprises: Figure 5

[0117] The acquisition module 10 is configured to acquire a process cutting speed of a to-be-cut plate and a feedback height.

[0118] The calculation module 20 is configured to calculate a limit height deviation amount of the laser head when the process cutting speed is less than a preset vibration suppression reference speed and the feedback height is less than a preset standard cutting height.

[0119] The suppression module 30 is configured to suppress a control speed of a servo controller based on the limit height deviation amount, so that the servo controller controls the laser head to lift up at a maximum movement speed of the laser head at the suppressed control speed.

[0120] Further, the calculation module 10 comprises:

[0121] The first determination unit is configured to determine a candidate deviation amount based on the process cutting speed, the vibration suppression reference speed and a preset deviation amount threshold.

[0122] The second determination unit is configured to determine a minimum value between a height difference value between the feedback height and the standard cutting height and the candidate deviation amount as the limit height deviation amount of the laser head.

[0123] Further, the first determination unit is further configured to calculate a speed ratio value between the process cutting speed and the vibration suppression reference speed, and determine a maximum value between the speed ratio value and a preset deviation amount threshold as the candidate deviation amount.

[0124] Further, the suppression module 20 is further configured to multiply the limit height deviation amount and a proportional gain of the servo controller to obtain a target control amount, and determine the control speed of the servo controller based on the target control amount.

[0125] Further, the vibration suppression device of the application further comprises:

[0126] The acceleration suppression module is configured to calculate a control acceleration of a servo controller when the process cutting speed is less than a preset vibration suppression reference speed and the feedback height is less than a preset standard cutting height, so that the servo controller controls the laser head to lift up at a maximum movement acceleration of the laser head at the control acceleration.

[0127] Further, the acceleration suppression module comprises:​

[0128] a third determining unit, configured to determine an acceleration coefficient based on the process cutting speed, the vibration suppression reference speed and a preset coefficient threshold value;

[0129] a fourth determining unit, configured to multiply the acceleration coefficient and a preset acceleration to obtain a control acceleration of a servo controller.

[0130] Further, the third determining unit is further configured to calculate a speed ratio between the process cutting speed and the vibration suppression reference speed, and determine a maximum value between the speed ratio and the preset coefficient threshold value as the acceleration coefficient.

[0131] The application further provides a computer storage medium, and the computer storage medium stores a vibration suppression program. The vibration suppression program is executed by a processor to implement the steps of the vibration suppression program method according to any one of the above embodiments.

[0132] The computer storage medium according to the embodiments of the application is basically the same as the above-mentioned vibration suppression program method of the application, and thus is not described here.

[0133] The application further provides a computer program product, which comprises a computer program. The computer program is executed by a processor to implement the steps of the vibration suppression method according to any one of the above embodiments, and thus is not described here.

[0134] It should be noted that, in this document, the terms "comprising", "including", or any other variant thereof are intended to cover non-exclusive inclusions, so that the process, method, article or system including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, article or system. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of another identical element in the process, method, article or system including the element.

[0135] The above-mentioned serial numbers of the embodiments of the application are only for description, and do not represent the advantages and disadvantages of the embodiments.

[0136] Those skilled in the art can clearly understand the above-mentioned embodiment method by means of software and the necessary general hardware platform, of course, it can also be through hardware, but in many cases the former is a better embodiment. Based on such understanding, the technical solutions of the present application can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes a plurality of instructions for making a vibration suppression device (which can be a TWS earphone or the like) execute the method described in each embodiment of the present application.

[0137] The above is only the preferred embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A vibration suppression method characterized by, The vibration suppression method comprises the following steps: Obtaining a process cutting speed of a plate to be cut and a feedback height; When the process cutting speed is less than a preset vibration suppression reference speed and the feedback height is less than a preset standard cutting height, calculating a limit height deviation of the laser head; Based on the limit height deviation, suppressing the control speed of the servo controller, so that the servo controller controls the laser head to lift up at the maximum movement speed of the laser head with the suppressed control speed.

2. The vibration suppression method according to claim 1, wherein The step of calculating the limit height deviation of the laser head comprises: Based on the process cutting speed, the vibration suppression reference speed and a preset deviation threshold, determining an alternative deviation; Determining the minimum value between the height difference between the feedback height and the standard cutting height and the alternative deviation as the limit height deviation of the laser head.

3. The vibration suppression method according to claim 2, wherein The step of determining the alternative deviation based on the process cutting speed, the vibration suppression reference speed and a preset deviation threshold comprises: Calculating the speed ratio between the process cutting speed and the vibration suppression reference speed; Determining the maximum value between the speed ratio and the preset deviation threshold as the alternative deviation.

4. The vibration suppression method of claim 1, wherein The step of suppressing the control speed of the servo controller based on the limit height deviation comprises: Multiplying the limit height deviation and the proportional gain of the servo controller to obtain a target control amount, and determining the control speed of the servo controller based on the target control amount.

5. The vibration suppression method of claim 1, wherein The method further comprises: When the process cutting speed is less than a preset vibration suppression reference speed and the feedback height is less than a preset standard cutting height, calculating a control acceleration of the servo controller, so that the servo controller controls the laser head to lift up at the maximum movement acceleration of the laser head with the control acceleration.

6. The vibration suppression method of claim 5, wherein The step of calculating the control acceleration of the servo controller comprises: Based on the process cutting speed, the vibration suppression reference speed and a preset coefficient threshold, determining an acceleration coefficient; Multiplying the acceleration coefficient and a preset acceleration to obtain the control acceleration of the servo controller.

7. The vibration suppression method according to claim 6, wherein The step of determining the acceleration coefficient based on the process cutting speed, the vibration suppression reference speed and a preset coefficient threshold comprises: Calculating the speed ratio between the process cutting speed and the vibration suppression reference speed; Determining the maximum value between the speed ratio and the preset coefficient threshold as the acceleration coefficient.

8. A vibration suppression device characterized by comprising: The vibration suppression device comprises the following steps: An obtaining module is configured to obtain a process cutting speed of a plate to be cut and a feedback height; A calculating module is configured to calculate a limit height deviation of the laser head when the process cutting speed is less than a preset vibration suppression reference speed and the feedback height is less than a preset standard cutting height; A suppressing module is configured to suppress the control speed of the servo controller based on the limit height deviation, so that the servo controller controls the laser head to lift up at the maximum movement speed of the laser head with the suppressed control speed.

9. A vibration suppression apparatus characterized by comprising: The vibration suppression device comprises a memory and a processor, the memory stores a vibration suppression program executable on the processor, and the vibration suppression program, when executed by the processor, implements the steps of the vibration suppression method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer readable storage medium stores a vibration suppression program, and the vibration suppression program, when executed by the processor, implements the steps of the vibration suppression method according to any one of claims 1 to 7.

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