Automatic extraction device for semiconductors and method of use
The automated semiconductor extraction device solves the problems of contamination, time-consuming operation, and high cost associated with manual operation, achieving efficient and accurate detection of micro-contamination.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- FERROTEC(SHANGHAI) TECH CO LTD
- Filing Date
- 2023-11-13
- Publication Date
- 2026-06-02
AI Technical Summary
Existing methods for detecting micro-contamination in semiconductor materials suffer from problems such as the introduction of contamination through manual operation, long processing time, high cost, and complex extraction processes.
Design an automated extraction device for semiconductors. Through an automated extraction process, combined with acid solution extraction and inductively coupled plasma mass spectrometry (ICP-MS) for elemental content determination, the extraction process and extraction area calculation can be performed simultaneously, reducing manual operation.
It achieves reduced pollution, lower labor costs, and improved extraction efficiency. The extraction process is completed within 15 minutes, ensuring the accuracy and efficiency of the test results.
Smart Images

Figure CN117483026B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of micro-contamination detection in semiconductor materials, and specifically to an automatic extraction device for semiconductors and its usage method. Background Technology
[0002] With the rapid development of the semiconductor industry, semiconductor material manufacturing processes are complex, requiring high purity and manufacturing precision. Therefore, micro-contamination control in semiconductor materials is one of the most pressing issues in the industry. Currently, pretreatment for micro-contamination detection generally employs manual surface extraction, using acid solutions of varying concentrations for extraction. After a certain period, the solution is recovered, and the elemental content is determined by inductively coupled plasma mass spectrometry (ICP-MS). While manual surface extraction meets the basic requirements for pretreatment before micro-contamination detection in semiconductor materials, several issues have made it increasingly unsuitable for the rapidly evolving semiconductor industry: 1. Differences in operator skill levels can easily introduce contamination during the process, leading to inaccurate results; 2. Pretreatment of large batches of samples requires significant time, increasing labor costs; 3. Manual extraction cannot simultaneously complete the extraction process and calculate the extraction area, resulting in a complex extraction workflow. Summary of the Invention
[0003] In view of the problems existing in the prior art, the present invention provides an automatic extraction device and method for semiconductors, which solves at least one of the above-mentioned technical problems.
[0004] The technical solution of the present invention is: an automatic extraction device for semiconductors and a method of using it, characterized by comprising the following steps:
[0005] Step 1: Preparation of experimental materials. Place the automated extraction device in a cleanroom of at least Class 100. Fill the pipette tip rack with pipette tips. Soak the pipette tips in 23% HNO3 solution for at least 2 weeks, and then rinse them 6 times with ultrapure water. Place waste liquid bottles, ultrapure water, and extraction solution in the test solution and waste liquid rack. Open the bottle retrieval window and place clean polytetrafluoroethylene (PTFE), polyethylene (PE), or polypropylene (PP) centrifuge tubes in the test tube rack and rotary cylinder for recycling the extraction solution. Soak the PTFE, PE, and PP centrifuge tubes and empty perfluoroalkoxy resin (PFA) bottles in 23% HNO3 solution for at least 2 weeks, then rinse them 6 times with ultrapure water, dry them with a high-pressure air gun, and test them on the machine to verify that they are qualified. These are then used as ultrapure containers for later use.
[0006] Step 2: Place the material in the container, open the double-door observation port, and place the material on the extraction platform with the center of the material positioned at the red laser crosshair cursor position.
[0007] Step 3: Set the extraction process parameters. After the equipment is powered on, the human-machine interface displays user login, automatic screen, manual screen, parameter setting, alarm screen, and I / O monitoring. After logging in, you will enter the automatic screen, which includes the worktable status, running cycle, system position and status. Enter the setting interface to set the product height, and set the common parameters and machine parameters in the parameter setting interface.
[0008] Step 4: Set the extraction area acquisition software parameters, open the AOI software on the monitor, start the software, select the material mode, and wait for data acquisition.
[0009] Step 5: Run the program and switch to automatic mode. Click "System Start" on the automatic screen interface. The equipment will start running and begin extraction to obtain the material extract.
[0010] Step 6: Extraction area calculation. After the equipment completes the settling step, the imaging and positioning components move above the material extraction liquid, take extraction photos and transmit them to the monitor. The extraction area is calculated using AOI software.
[0011] Step 7: Preparation of blank extract. Prepare blank extract according to the above steps, except that in step 2, place a clean empty bottle of perfluoroalkoxy resin (PFA) on the extraction platform, and keep the other steps the same.
[0012] Step 8: Data collection. The elemental content of the blank extract and the material extract was determined by inductively coupled plasma mass spectrometry (ICP-MS).
[0013] The automatic semiconductor material extraction device provided by this invention extracts the elemental content of the semiconductor material surface using an acid solution. By fixing the extraction process, the instability of manual operation is avoided, and the extraction process and extraction area calculation are performed simultaneously, improving extraction efficiency. It can achieve continuous extraction of the same type of material and reduce labor costs.
[0014] Further preferably, the automatic extraction device includes an extraction motion control component, a worktable component, and a processing chamber component. The extraction motion control component includes an extraction component and an imaging and positioning component, and also includes a three-dimensional motion mechanism for driving the extraction component and the imaging and positioning component. The moving end of the three-dimensional motion mechanism is equipped with an extraction gun, a camera, and a positioning device. The extraction gun is driven by a first motor that drives the liquid transfer rate of the extraction gun and a second motor that controls the replacement of the extraction gun head.
[0015] Further preferably, the workbench assembly includes an extraction table, the upper part of which is equipped with a pipette holder and a sample liquid and waste liquid holder, and the right side is equipped with a test tube holder and a rotary cylinder.
[0016] Further preferably, an air filter is installed on the upper part of the processing chamber assembly, a double-door observation port and a bottle retrieval window are installed on the side wall of the processing chamber assembly, and a human-machine interface and display are installed on the outer wall of the processing chamber assembly for operating the extraction process.
[0017] More preferably, the worktable assembly is located in the middle of the processing chamber assembly.
[0018] Beneficial effects:
[0019] 1. Reduced contamination during pretreatment: Automated extraction is simple to operate, with standardized extraction steps, reducing the introduction of elements such as Al, Fe, Ca, and K;
[0020] 2. Reduced labor costs: Samples of the same material can be extracted continuously, reducing personnel operation time;
[0021] 3. Improved extraction efficiency: The automatic extraction device can calculate the extraction liquid area during the extraction process, and the extraction process can be completed within 15 minutes. Attached Figure Description
[0022] Figure 1 This is a partial structural schematic diagram of the automatic extraction device of the present invention;
[0023] Figure 2 This is a schematic diagram of the extraction motion control component of the present invention;
[0024] Figure 3 This is a partial structural schematic diagram of the workbench assembly of the present invention;
[0025] Figure 4 This is a partial structural schematic diagram of the processing cavity assembly of the present invention;
[0026] Figure 5 It is the human-machine interface of the equipment;
[0027] Figure 6 It is the automatic display screen of the device;
[0028] Figure 7 This is the device settings interface;
[0029] Figure 8 This is the device model parameter interface.
[0030] In the diagram: 1. Extraction assembly; 2. Extraction gun; 3. First motor; 4. Second motor; 5. Three-dimensional motion mechanism; 6. Imaging and positioning assembly 6; 7. Gun head holder; 8. Test liquid and waste liquid rack; 9. Test tube rack and rotary cylinder; 10. Extraction platform; 11. Air filter; 12. Display; 13. Human-machine interface; 14. Double-door observation port; 15. Bottle retrieval window. Detailed Implementation
[0031] The present invention will now be further described with reference to the accompanying drawings.
[0032] Example 1, see Figures 1-4 The automated silicon wafer extraction method in this embodiment includes the following steps:
[0033] 1. Preparation of experimental materials:
[0034] The automated extraction device is placed in a clean room of at least Class 100. The pipette tip rack 7 is filled with pipette tips, which are soaked in 23% HNO3 solution for at least 2 weeks and then rinsed 6 times with ultrapure water. The waste liquid bottle is placed in the first position of the test solution and waste liquid rack 8, ultrapure water is placed in the second position, and 0.1%-5% HNO3 solution is placed in the remaining positions as the extraction solution. The bottle retrieval window 15 is opened, and clean polytetrafluoroethylene (PTFE), polyethylene (PE), or polypropylene (PP) centrifuge tubes are placed in the test tube rack and rotary cylinder 9 for the recovery of the extraction solution.
[0035] After soaking in 23% HNO3 solution for at least 2 weeks, polytetrafluoroethylene (PTFE), polyethylene (PE), polypropylene (PP) centrifuge tubes and perfluoroalkoxy resin (PFA) empty bottles are rinsed with ultrapure water 6 times, dried with a high-pressure air gun, and tested on a machine to verify that they are qualified before being used as ultra-clean containers.
[0036] 2. Place the silicon wafer:
[0037] Open the double-door observation port 14 and place the silicon wafer on the extraction stage 10, with the center of the silicon wafer at the position of the red laser crosshair.
[0038] 3. Set the extraction process parameters:
[0039] After the device is powered on, the human-machine interface (HMI) will display the following: (See point 13) Figure 5 This includes user login, automatic screen, manual screen, parameter setting, alarm screen, and I / O monitoring. After logging in, you can access the automatic screen. Figure 6 This includes the workbench status, operating cycle, system location and status. See the settings interface for details. Figure 7 Set the product height. In the parameter setting interface, set the common parameters and machine type parameters, including a settling time of 240 seconds and an extraction speed of 3 mm / s; see [link to machine type parameters] for details. Figure 8 The program is set as follows: 1. Change the needle, 2. Take solution A, 3. Drain to waste liquid (repeat steps 2 and 3 6 times), 4. Take solution B, 5. Drain to waste liquid, 6. Take solution B, 7. Drain to product (repeat steps 6 and 7 2 times), 8. Let stand, 9. Recover the extract, 10. End.
[0040] 4. Set the parameters of the extraction area acquisition software.
[0041] Open the AOI software on monitor 12, start the software, select silicon wafer as the material mode, and wait for data acquisition.
[0042] 5. Run the program
[0043] Switch to automatic mode, click "System Start" on the automatic screen interface, the device will start running, begin extraction, and obtain the extract.
[0044] 6. Calculation of extraction area
[0045] After the equipment reaches the settling step, the imaging and positioning component 6 moves above the silicon wafer extraction liquid, takes an extraction photo and transmits it to the display 12, and uses software AOI to calculate the extraction area.
[0046] 7. Preparation of blank extract
[0047] Prepare a blank extract according to the steps described above, wherein in step 2, a clean empty bottle of perfluoroalkoxy resin (PFA) is placed on the extraction platform 10, and the remaining steps are kept the same.
[0048] 8. Data collection
[0049] The elemental content of the blank extract and the silicon wafer extract was determined by inductively coupled plasma mass spectrometry (ICP-MS), and the results are shown in Table 1.
[0050] Table 1
[0051]
[0052]
[0053] Implementation Case 2
[0054] See Figure 1-4 The automated quartz extraction method in this embodiment includes the following steps:
[0055] 1. Preparation of experimental materials:
[0056] The automated extraction device is placed in a clean room of at least Class 100. The pipette tip rack 7 is filled with pipette tips, which are soaked in 23% HNO3 solution for at least 2 weeks and then rinsed 6 times with ultrapure water. The waste liquid bottle is placed in the first position of the test solution and waste liquid rack 8, ultrapure water is placed in the second position, and 0.1%-5% HNO3 solution is placed in the remaining positions as the extraction solution. The bottle retrieval window 15 is opened, and clean polytetrafluoroethylene (PTFE), polyethylene (PE), or polypropylene (PP) centrifuge tubes are placed in the test tube rack and rotary cylinder 9 for the recovery of the extraction solution.
[0057] After soaking in 23% HNO3 solution for at least 2 weeks, polytetrafluoroethylene (PTFE), polyethylene (PE), polypropylene (PP) centrifuge tubes and perfluoroalkoxy resin (PFA) empty bottles are rinsed with ultrapure water 6 times, dried with a high-pressure air gun, and tested on a machine to verify that they are qualified before being used as ultra-clean containers.
[0058] 2. Place in quartz:
[0059] Open the double-door observation port 14 and place the quartz on the extraction platform 10, with the center of the quartz at the position of the red laser crosshair.
[0060] 3. Set the extraction process parameters:
[0061] After the device is powered on, the human-machine interface (HMI) will display the following: (See point 13) Figure 5 This includes user login, automatic screen, manual screen, parameter setting, alarm screen, and I / O monitoring. After logging in, you can access the automatic screen. Figure 6 This includes the workbench status, operating cycle, system location and status. See the settings interface for details. Figure 7 Set the product height. In the parameter setting interface, set the common parameters and machine type parameters, including a settling time of 240 seconds and an extraction speed of 3 mm / s; see [link to machine type parameters] for details. Figure 8 The procedure is set as follows: 1. Change the needle; 2. Take solution A; 3. Drain to waste liquid (steps 2 and 3 are repeated 6 times); 4. Take solution B; 5. Drain to waste liquid; 6. Take solution B; 7. Drain to product (steps 6 and 7 are repeated 2 times); 8. Let stand; 9. Recover the extract; 10. End.
[0062] 4. Set the parameters of the extraction area acquisition software.
[0063] Open the AOI software on monitor 12, start the software, select quartz as the material mode, and wait for data acquisition.
[0064] 5. Run the program
[0065] Switch to automatic mode, click "System Start" on the automatic screen interface, the device will start running, begin extraction, and obtain the extract.
[0066] 6. Calculation of extraction area
[0067] After the equipment completes the settling step, the imaging and positioning component 6 moves above the quartz extraction liquid, takes an extraction photo and transmits it to the display 12, and uses software AOI to calculate the extraction area.
[0068] 7. Preparation of blank extract
[0069] Prepare a blank extract according to the steps described above, wherein in step 2, a clean empty bottle of perfluoroalkoxy resin (PFA) is placed on the extraction platform 10, and the remaining steps are kept the same.
[0070] 8. Data collection
[0071] The elemental content of the blank extract and the quartz extract was determined by inductively coupled plasma mass spectrometry (ICP-MS), and the results are shown in Table 2.
[0072] Table 2
[0073] element result unit Li 0.01 10^10 atoms / cm 2 ]] Na 0.49 10^10 atoms / cm 2 ]] Mg 4.13 <![CDATA[10^10atoms / cm 2 ]]> AI 18.96 <![CDATA[10^10atoms / cm 2 ]]> Ni 0.49 <![CDATA[10^10atoms / cm 2 ]]> Cu 0.11 <![CDATA[10^10atoms / cm 2 ]]> Zn 0.32 <![CDATA[10^10atoms / cm 2 ]]> Cd ND <![CDATA[10^10atoms / cm 2 ]]> Pb 0.01 <![CDATA[10^10atoms / cm 2 ]]> K 0.25 <![CDATA[10^10atoms / cm 2 ]]> Ca 11.61 <![CDATA[10^10atoms / cm 2 ]]> Mn 0.04 <![CDATA[10^10atoms / cm 2 ]]> Cr 0.26 <![CDATA[10^10atoms / cm 2 ]]> Fe 2.70 <![CDATA[10^10atoms / cm 2 ]]>
[0074] Further preferred, the automatic extraction device includes an extraction motion control component, a worktable component, and a processing chamber component. The extraction motion control component includes an extraction component 1 and an imaging and positioning component 6, and also includes a three-dimensional motion mechanism 5 for driving the extraction component and the imaging and positioning component. The moving end of the three-dimensional motion mechanism is equipped with an extraction gun 2, a camera, and a positioning device. The extraction gun is driven by a first motor 3 that drives the liquid transfer rate of the extraction gun and a second motor 4 that controls the replacement of the extraction gun head.
[0075] Further preferred, the workbench assembly includes an extraction table, with a pipette holder and a sample liquid and waste liquid rack installed on the upper part of the extraction table, and a test tube rack and a rotary cylinder installed on the right side.
[0076] Further preferably, an air filter 11 is installed on the upper part of the processing chamber assembly, a double-door observation port 14 and a bottle retrieval window 15 are installed on the side wall of the processing chamber assembly, and a human-machine interface 13 and a display 12 are installed on the outer wall of the processing chamber assembly for operating the extraction process.
[0077] Further preferred, the worktable assembly is located in the middle of the processing chamber assembly.
[0078] The upper and lower limit embodiments of the present invention have been specifically described above, but the present invention is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.
Claims
1. A method of using an automated extraction device for semiconductors, characterized in that, Includes the following steps: Step 1: Preparation of experimental materials. Place the automated extraction device in a cleanroom of at least Class 100. Fill the pipette tip rack with pipette tips. Soak the pipette tips in 23% HNO3 solution for at least 2 weeks, then rinse them 6 times with ultrapure water. Place waste liquid bottles, ultrapure water, and extraction solution in the test solution and waste liquid rack. Open the bottle retrieval window and place clean polytetrafluoroethylene (PTFE), polyethylene (PE), or polypropylene (PP) centrifuge tubes in the test tube rack and rotary cylinder for recycling the extraction solution. Soak the PTFE, PE, and PP centrifuge tubes and empty perfluoroalkoxy resin (PFA) bottles in 23% HNO3 solution for at least 2 weeks, then rinse them 6 times with ultrapure water. Dry them with a high-pressure air gun and test them on the machine to verify that they are qualified. These are then used as ultrapure containers for later use. Step 2: Place the material in the container, open the double-door observation port, and place the material on the extraction platform with the center of the material positioned at the red laser crosshair cursor position. Step 3: Set the extraction process parameters. After the equipment is powered on, the human-machine interface displays user login, automatic screen, manual screen, parameter setting, alarm screen, and I / O monitoring. After logging in, you will enter the automatic screen, which includes the worktable status, running cycle, system position and status. Enter the setting interface to set the product height, and set the common parameters and machine parameters in the parameter setting interface. Step 4: Set the extraction area acquisition software parameters, open the AOI software on the monitor, start the software, select the material mode, and wait for data acquisition. Step 5: Run the program and switch to automatic mode. Click "System Start" on the automatic screen interface. The equipment will start running and begin extraction to obtain the material extract. Step 6: Extraction area calculation. After the equipment completes the settling step, the imaging and positioning components move above the material extraction liquid, take extraction photos and transmit them to the monitor. The extraction area is calculated using AOI software. Step 7: Preparation of blank extract. Prepare blank extract according to steps 2 to 5 above. In step 2, place a clean empty bottle of perfluoroalkoxy resin (PFA) on the extraction platform. The remaining steps are the same. Step 8: Data collection. The elemental content of the blank extract and the material extract was determined by inductively coupled plasma mass spectrometry (ICP-MS).
2. The method of using the automatic extraction device for semiconductors according to claim 1, characterized in that: The device includes an automatic extraction unit, which comprises an extraction motion control component, a worktable component, and a processing chamber component. The extraction motion control component includes an extraction component and an imaging and positioning component, and also includes a three-dimensional motion mechanism for driving the extraction component and the imaging and positioning component. The moving end of the three-dimensional motion mechanism is equipped with an extraction gun, a camera, and a positioning device. The extraction gun is driven by a first motor that drives the rate at which the extraction gun moves liquid and a second motor that controls the replacement of the extraction gun head.
3. The method of using the automatic extraction device for semiconductors according to claim 2, characterized in that: The workbench assembly includes an extraction table, the upper part of which is equipped with a pipette holder and a sample liquid and waste liquid holder, and the right side is equipped with a test tube holder and a rotary cylinder.
4. The method of using an automatic extraction device for semiconductors according to claim 2, characterized in that: An air filter is installed on the upper part of the processing chamber assembly, and a double-door observation port and a bottle retrieval window are installed on the side wall of the processing chamber assembly. A human-machine interface and a display are installed on the outer wall of the processing chamber assembly for operating the extraction process.
5. The method of using the automatic extraction device for semiconductors according to claim 2, characterized in that: The worktable assembly is located in the middle of the processing chamber assembly.