A high-precision angular contact ball bearing special assembly tool

By combining temperature control of semiconductor materials with cylinder positioning components, the problems of low efficiency and insufficient precision in traditional assembly are solved, realizing high-precision automated angular contact ball bearing assembly and meeting the high precision requirements of high-speed electric spindles.

CN117489709BActive Publication Date: 2026-06-30JIANGXI BILLY FU IND CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
JIANGXI BILLY FU IND CO LTD
Filing Date
2023-11-24
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Traditional manual assembly operations are inefficient and limited by the experience of the staff, making it impossible to guarantee the assembly accuracy of high-precision angular contact ball bearings, which affects product quality.

Method used

The device employs a temperature-conducting component that generates heat and cold by energizing semiconductor materials. Combined with a cylinder positioning component and an outer cylinder positioning component, it utilizes the principle of thermal expansion and contraction to regulate the installation space and automatically complete the fixing of the inner and outer cylinders and the installation of the ball bearings.

Benefits of technology

It achieves a high-precision, automated assembly process, improving assembly efficiency and accuracy, and meeting the high-precision requirements of different types of angular contact ball bearings.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN117489709B_ABST
    Figure CN117489709B_ABST
Patent Text Reader

Abstract

This invention relates to the field of angular contact ball bearing processing technology, and more particularly to a high-precision assembly fixture specifically designed for angular contact ball bearings. It includes an assembly box, an inner cylinder positioning assembly, an outer cylinder positioning assembly, and a temperature-conducting assembly. This invention utilizes the principle that semiconductor materials absorb and release heat at their two ends when energized, and, in conjunction with the lifting and rotating of the temperature-conducting assembly with a concentric cylinder structure, achieves flexible switching between cooling and heating. By attaching the heating / cold ends of the temperature-conducting assembly to the temperature-conducting platform, the temperature of the angular contact ball bearing is specifically adjusted, and the principle of thermal expansion and contraction is used to control the installation space. During assembly, the inner and outer cylinder positioning assemblies, working together, not only fix and limit the inner and outer cylinders respectively, but also automatically complete the installation of the balls. The installation methods are diverse, the process is highly controllable and automated, and it meets the high-precision requirements of different types of angular contact ball bearings.
Need to check novelty before this filing date? Find Prior Art