A heat dissipation inductor and a manufacturing method thereof

Abstract

The present invention discloses a heat dissipation inductor and a manufacturing method thereof, and relates to the technical field of inductors. The method comprises: placing a metal heat dissipation guide in a mold; filling a bottom layer of magnetic powder in the mold to cover the metal heat dissipation guide; performing a first molding on the mold so that the bottom layer of magnetic powder and the metal heat dissipation guide form a primary semi-finished product; placing a conductive sheet in the mold on the primary semi-finished product; filling an upper layer of magnetic powder in the mold and covering part of the conductive sheet; performing a second molding on the mold so that the upper layer of magnetic powder and part of the conductive sheet cooperate with the primary semi-finished product to form a secondary semi-finished product; and performing high-temperature sintering on the secondary semi-finished product. The present invention enables the heat dissipation inductor to have good heat dissipation and avoid heat accumulation through the design of "the covering portion of the conductive sheet is covered by a magnetic part and contacts the magnetic part" and "the wide side of the metal heat dissipation guide contacts at least one side of the magnetic part", thereby ensuring the overall performance of the inductor.

Description

Technical Field

[0001] The invention belongs to the technical field of inductors, and in particular relates to a heat dissipation inductor and a manufacturing method thereof. Background Art

[0002] The existing inductor uses insulating material as the surface layer, that is, the magnetic part of the inductor is covered by an insulating layer. However, the heat dissipation properties (e.g., thermal conductivity) of the insulating material are poor, causing the existing inductor to often be in a high temperature state during operation, thereby affecting the overall performance (e.g., increasing copper loss). Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a heat dissipation inductor and a manufacturing method thereof in view of the deficiencies in the prior art.

[0004] The purpose of the present invention can be achieved through the following technical solutions:

[0005] In a first aspect, an embodiment of the present application provides a method for manufacturing a heat dissipation inductor, comprising the following steps:

[0006] Place a metal heat sink guide in the mold;

[0007] Filling the bottom layer of magnetic powder into the mold to cover the metal heat dissipation guide;

[0008] Performing a first molding on the mold to form a primary semi-finished product with the bottom layer of magnetic powder and the metal heat dissipation guide;

[0009] placing a conductive sheet on the primary semi-finished product in the mold;

[0010] Filling the upper layer of magnetic powder into the mold and covering a portion of the conductive sheet;

[0011] Performing a second molding on the mold so that the upper layer of magnetic powder and the part of the conductive sheet cooperate with the primary semi-finished product to form a secondary semi-finished product;

[0012] The secondary semi-finished product is subjected to high temperature sintering.

[0013] Preferably, after the secondary semi-finished product is subjected to high temperature sintering, the following steps are further included:

[0014] A metal heat dissipation coating is electroplated or sputtered on the surface of the secondary semi-finished product.

[0015] Preferably, before placing the metal heat dissipation guide into the mold, the following steps are also included:

[0016] A plurality of first through holes are formed in the metal heat dissipation guide plate.

[0017] Preferably, before placing the metal heat dissipation guide into the mold, the following steps are also included:

[0018] A first rough surface is processed on the surface of the metal heat dissipation guide plate.

[0019] Preferably, before the second molding is performed on the mold, the following steps are also included:

[0020] An amplified metal heat sink guide is placed in the mold to cover the upper layer of magnetic powder.

[0021] Preferably, before placing the amplified metal heat dissipation guide into the mold, the following steps are also included:

[0022] A plurality of second through holes are opened on the amplified metal heat dissipation guide plate, or a second rough surface is processed on the surface of the metal heat dissipation guide plate.

[0023] In a second aspect, an embodiment of the present application provides a heat dissipation inductor, including a magnetic component, a metal heat dissipation guide sheet, and a conductive sheet;

[0024] The metal heat dissipation guide is arranged on the magnetic member; the wide side surface of the metal heat dissipation guide contacts at least one side surface of the magnetic member;

[0025] The conductive sheet passes through the magnetic component; the conductive sheet includes a covering portion and two connecting portions; the covering portion is covered and fixed by the magnetic component and contacts the magnetic component; the two connecting portions extend from both ends of the covering portion to the outside of the magnetic component respectively.

[0026] Preferably, the magnetic member has a plurality of side protrusions on at least one side, the metal heat dissipation guide plate has a plurality of first through holes, the positions of the plurality of first through holes correspond to the positions of the plurality of side protrusions, and each of the first through holes is used to accommodate each of the side protrusions;

[0027] The heat dissipation inductor further includes a metal heat dissipation coating, and the metal heat dissipation coating is fixed on the surface of the magnetic component.

[0028] Preferably, the heat dissipation inductor further includes an amplified metal heat dissipation guide plate, which is disposed on the magnetic component, and a wide side surface of the amplified metal heat dissipation guide plate contacts a top surface of the magnetic component.

[0029] Preferably, the magnetic component has a plurality of top surface protrusions on the top surface, and the amplified metal heat dissipation guide plate has a plurality of second through holes, the positions of the plurality of second through holes correspond to the positions of the plurality of top surface protrusions, and each of the second through holes is used to accommodate each of the top surface protrusions.

[0030] In a third aspect, an embodiment of the present application provides a method for manufacturing a heat dissipation inductor, comprising the following steps:

[0031] Filling the mold with bottom layer magnetic powder;

[0032] Performing a first molding on the mold to form the bottom layer of magnetic powder into a primary semi-finished product;

[0033] placing a conductive sheet on the primary semi-finished product in the mold;

[0034] Filling the mold with an upper layer of magnetic powder and covering part of the conductive sheet;

[0035] Performing a second molding on the mold so that the upper layer of magnetic powder and the part of the conductive sheet cooperate with the primary semi-finished product to form a secondary semi-finished product;

[0036] sintering the secondary semi-finished product at high temperature;

[0037] The surface of the secondary semi-finished product after high temperature sintering is electroplated or sputtered with a metal heat dissipation coating.

[0038] The beneficial effects of the present invention are as follows: through the designs of "the covering portion of the conductive sheet is covered by the magnetic component and contacts the magnetic component", and "the wide side of the metal heat dissipation guide sheet contacts at least one side of the magnetic component", the heat dissipation inductor can have good heat dissipation and avoid heat accumulation, thereby ensuring the overall performance of the inductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] For better understanding and implementation, the technical solution of the present application is described in detail below with reference to the accompanying drawings.

[0040] Figure 1 It is a schematic flow chart of a method for manufacturing a heat dissipation inductor according to the first embodiment of the present application;

[0041] Figure 2 This is a schematic diagram of the metal heat dissipation guide plate of the first embodiment of the present application being placed in a mold;

[0042] Figure 3 This is a schematic diagram of the bottom layer of magnetic powder covering the metal heat dissipation guide plate in the first embodiment of the present application;

[0043] Figure 4 This is a schematic diagram of the bottom layer magnetic powder of the first embodiment of the present application being molded for the first time;

[0044] Figure 5 This is a schematic diagram of the conductive sheet of the first embodiment of the present application being placed in a mold;

[0045] Figure 6 This is a schematic diagram of the first embodiment of the present application when the upper layer of magnetic powder covers the conductive sheet;

[0046] Figure 7 This is a schematic diagram of the upper layer of magnetic powder of the first embodiment of the present application being molded for the second time;

[0047] Figure 8 This is a schematic diagram of a secondary semi-finished product of the first embodiment of the present application being sintered at high temperature;

[0048] Fig. 9 It is a schematic diagram of the secondary semi-finished product of the first embodiment of the present application when a metal heat dissipation coating is electroplated or sputtered;

[0049] Fig.10 It is a three-dimensional schematic diagram of a heat dissipation inductor according to a second embodiment of the present application;

[0050] Fig.11 This is a schematic diagram of the second embodiment of the present application when the upper layer of magnetic powder is covered with an amplified metal heat dissipation guide;

[0051] Fig.12 Another schematic diagram of the secondary semi-finished product of the second embodiment of the present application when a metal heat dissipation coating is electroplated or sputtered;

[0052] Fig.13 A schematic diagram of a metal heat dissipation guide plate according to a second embodiment of the present application when a first through hole is processed;

[0053] Fig.14 A schematic diagram of a metal heat dissipation guide plate of the second embodiment of the present application when a first rough surface is processed;

[0054] Fig.15 This is a schematic diagram of the second through hole processed on the amplified metal heat dissipation guide plate of the second embodiment of the present application;

[0055] Fig.16 A schematic diagram of the second roughened surface of the amplified metal heat dissipation guide plate according to the second embodiment of the present application;

[0056] Fig.17 It is another three-dimensional schematic diagram of the heat dissipation inductor according to the second embodiment of the present application;

[0057] Fig.18 A schematic flow chart of a method for manufacturing a heat dissipation inductor according to a third embodiment of the present application; BRIEF DESCRIPTION OF THE DRAWINGS

[0059] In the figure: 100, heat dissipation inductor; 1, magnetic part; 1A, bottom layer magnetic powder; 1B, upper layer magnetic powder; 2, metal heat dissipation guide; 3, conductive sheet; 31, covering portion; 32, connecting portion; 4, metal heat dissipation coating; 5, expanded metal heat dissipation guide; 21, first through hole; 21', first rough surface; 51, second through hole; 51', second rough surface; M, mold; X1, primary semi-finished product; X2, secondary semi-finished product. DETAILED DESCRIPTION

[0060] In order to further explain the technical means and effects taken by the present invention to achieve the predetermined invention purpose, exemplary embodiments will be described in detail here, and examples thereof are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are only examples of methods and systems consistent with some aspects of the present application as detailed in the attached claims.

[0061] The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used in this article refers to any or all possible combinations of one or more associated listed items.

[0062] The following is an explanation of the implementation methods of the "heat dissipation inductor and its manufacturing method" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0063] It should be understood that, although the terms "first", "second", "third", etc. may be used in this article to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0064] In addition, in the following description, if it is indicated to refer to a specific figure or as shown in a specific figure, it is only used to emphasize that most of the related content described in the subsequent description appears in the specific figure, but it does not limit the subsequent description to only refer to the specific figure.

[0065] Example 1

[0066] See also Figures 1 to 10The present invention provides a method for manufacturing a heat dissipation inductor, and the manufacturing method includes the following steps:

[0067] S101: Figure 1 and Figure 2 As shown, a metal heat dissipation guide 2 is placed in the mold M. In practice, the metal heat dissipation guide 2 can be made of a metal material with a thermal conductivity of 80 to 400K (W / m*K), such as die-cast aluminum (80 to 100K), pure aluminum (180 to 200K), silver and copper (400K).

[0068] S103: Figure 1 and Figure 3 As shown, the bottom layer magnetic powder 1A is filled into the mold M to cover the metal heat dissipation guide 2. In this embodiment, the bottom layer magnetic powder 1A is stacked on the metal heat dissipation guide 2, and the area of ​​the bottom layer magnetic powder 1A projected on the metal heat dissipation guide 2 is substantially equal to the area of ​​the wide side of the metal heat dissipation guide 2. However, the present application is not limited to this. For example, the area of ​​the bottom layer magnetic powder 1A projected on the metal heat dissipation guide 2 may also be greater than or less than the area of ​​the wide side of the metal heat dissipation guide 2.

[0069] S105: Figure 1 and Figure 4 As shown, the mold M is subjected to the first molding, so that the bottom magnetic powder 1A and the metal heat dissipation guide plate 2 form a primary semi-finished product X1. The bottom magnetic powder 1A is temporarily molded on the metal heat dissipation guide plate 2 by being pressurized by the first molding.

[0070] S107: Figure 1 and Figure 5 As shown, the conductive sheet 3 is placed on the primary semi-finished product X1 in the mold M. In other words, the conductive sheet 3 is stacked on the temporarily molded bottom magnetic powder 1A.

[0071] S109: Figure 1 and Figure 6 As shown, the upper layer of magnetic powder 1B is filled into the mold M, and the upper layer of magnetic powder 1B covers part of the conductive sheet 3. The upper layer of magnetic powder 1B does not completely cover the conductive sheet 3, so that both ends of the conductive sheet 3 can be exposed.

[0072] S111: Figure 1 and Figure 7As shown, the mold M is molded for the second time, so that the upper magnetic powder 1B and part of the conductive sheet 3 can cooperate with the primary semi-finished product X1 to form a secondary semi-finished product X2. In other words, the upper magnetic powder 1B is temporarily molded on the bottom magnetic powder 1A by being pressurized by the second molding, and the upper magnetic powder 1B cooperates with the bottom magnetic powder 1A to cover the conductive sheet 3.

[0073] S113: Figure 1 and Figure 8 As shown, the secondary semi-finished product X2 is sintered at high temperature. Accordingly, the upper magnetic powder 1B and the bottom magnetic powder 1A can be solidified, and further form an integral structure with the metal heat dissipation guide plate 2 and the conductive plate 3.

[0074] S115: Figure 1 , Fig. 9 and Fig.10 As shown, a metal heat dissipation coating 4 is electroplated or sputtered on the surface of the secondary semi-finished product X2 to form a finished product, namely the heat dissipation inductor 100. The metal heat dissipation coating 4 can be electroplated or sputtered on the surface of the bottom layer magnetic powder and the upper layer magnetic powder, and a metal material with a thermal conductivity of 80 to 400K (W / m*K) is selected. In other words, this step S115 uses electroplating or sputtering to fix the metal heat dissipation coating 4 as a conductor or semiconductor on the surface of the secondary semi-finished product X2 as a magnetic conductive material, thereby achieving the effect of heat dissipation and magnetic shielding. The metal heat dissipation coating 4 can also be omitted in practice, that is, the step S115 is omitted.

[0075] It is worth mentioning that in order to ensure that the metal heat dissipation guide plate 2 and the bottom magnetic powder 1A have better bonding and heat dissipation effect during the high-temperature sintering process, before the metal heat dissipation guide plate 2 is placed in the mold M, the manufacturing method of the heat dissipation inductor 100 further includes step S101A or step S101B. Fig.13 As shown, the step S101A is: a plurality of first through holes 21 are formed on the metal heat dissipation guide plate 2. Fig.14 As shown, the step is S101B: processing the surface of the metal heat dissipation guide 2 to form a first rough surface 21'. Fig.17 As shown, when the bottom layer magnetic powder 1A is in a molten state at a high temperature, it can penetrate into the first through holes 21 or the grooves of the first rough surface 21 ′ to increase the contact area.

[0076] In addition, in order to increase the heat dissipation area of ​​the heat dissipation inductor 100 to improve the heat dissipation effect, before the secondary semi-finished product X2 is sintered at high temperature (ie, step S113), the manufacturing method further includes step S112. Fig.11As shown, the step S112 is: placing an enlarged metal heat dissipation guide 5 in the mold M to cover the upper magnetic powder 1B. Accordingly, when the mold M is molded for the second time, the secondary semi-finished product X2 further includes the enlarged metal heat dissipation guide 5, and the opposite sides of the secondary semi-finished product X2 are the metal heat dissipation guide 2 and the enlarged metal heat dissipation guide 5. In addition, the secondary semi-finished product X2 is electroplated with the metal heat dissipation coating 4 as shown in FIG. Fig.12 shown.

[0077] Of course, if Fig.15 and Fig.16 As shown, before the amplified metal heat dissipation guide 5 is placed in the mold M (i.e., step S112), the manufacturing method may also include the following steps: a plurality of second through holes 51 are opened in the amplified metal heat dissipation guide 5, or a second rough surface 51' is processed on the surface of the amplified metal heat dissipation guide 5. Accordingly, the amplified metal heat dissipation guide 5 and the upper magnetic powder 1B can have better bonding and heat dissipation effect during high-temperature sintering.

[0078] In addition, at least one of the enlarged metal heat dissipation guide plate 5 and the metal heat dissipation guide plate 2 is away from the side surface of the conductive plate 3 and can be processed into a rough surface (not shown) when necessary to increase the air contact area.

[0079] Example 2

[0080] like Fig.10 and Fig.17 As shown, it is the second embodiment of the present invention. The heat dissipation inductor 100 of this embodiment can be made by the manufacturing method of the first embodiment, so please cooperate with Figures 1 to 10 Of course, the heat dissipation inductor 100 can also be manufactured by other manufacturing methods. Next, the various components of the heat dissipation inductor 100 and their connection relationships are introduced below.

[0081] like Figure 1 and Fig.10 As shown, the heat dissipation inductor 100 includes a magnetic component 1, a metal heat dissipation guide 2, a conductive sheet 3, and a metal heat dissipation coating 4. The magnetic component 1 is formed by sintering magnetic powder at a high temperature in this embodiment and is a rectangular structure. For ease of explanation, the magnetic component 1 has multiple side surfaces, and is respectively defined with opposite top and bottom surfaces, and multiple connection surfaces connecting the top and bottom surfaces. The bottom surface is the magnetic component 1 at Fig.10 The lower surface shown in the figure, the top surface is the magnetic member 1 at Fig.10The upper surface is shown in FIG. 1 , but the present invention is not limited thereto. The metal heat dissipation guide 2 is disposed on the magnetic member 1 , and the wide side of the metal heat dissipation guide 2 contacts the bottom surface of the magnetic member 1 .

[0082] like Fig.13 and Fig.17 As shown, in a practical application of the present embodiment, the magnetic component 1 has a plurality of side protrusions on the bottom surface, and the metal heat dissipation guide plate 2 has a plurality of first through holes 21, the positions of the plurality of first through holes 21 correspond to the positions of the plurality of side protrusions, and each of the first through holes 21 can be used to accommodate the side protrusions.

[0083] In another practical application of this embodiment, Fig.14 As shown, the side of the metal heat dissipation guide plate 2 facing the bottom surface has a first rough surface 21', and the first rough surface 21' can be embedded with liquid magnetic powder during the high-temperature sintering process of the magnetic component 1. Accordingly, the above two practical applications can increase the bonding degree between the metal heat dissipation guide plate 2 and the magnetic component 1 to improve reliability.

[0084] like Fig.15 and Fig.17 As shown, in a practical application of the present embodiment, the magnetic component 1 has a plurality of top surface protrusions on the top surface, and the amplified metal heat dissipation guide 5 has a plurality of second through holes 51, the positions of the plurality of second through holes 51 correspond to the positions of the plurality of top surface protrusions, and each of the second through holes 51 is used to accommodate each of the top surface protrusions.

[0085] In another practical application of this embodiment, Fig.16 As shown, the side of the amplified metal heat dissipation guide 5 facing the bottom surface has a second rough surface 51', and the second rough surface 51' can be embedded with liquid magnetic powder during the high-temperature sintering process of the magnetic component 1. Accordingly, the above two practical applications can increase the bonding degree between the amplified metal heat dissipation guide 5 and the magnetic component 1 to improve reliability.

[0086] Re-reference Fig.10 As shown, the conductive sheet 3 penetrates the magnetic member 1, and the conductive sheet 3 includes a covering portion 31 and two connecting portions 32. Specifically, as Figure 3 and Figure 6As shown, the conductive sheet 3 is placed between the bottom layer magnetic powder 1A and the upper layer magnetic powder 1B; the bottom layer magnetic powder 1A and the upper layer magnetic powder 1B are sintered at high temperature to form the magnetic component 1, and the magnetic component 1 is used to cover and fix the covering portion 31, and the covering portion 31 contacts the magnetic component 1. The two connecting portions 32 extend from the two ends of the covering portion 31 to the outside of the magnetic component 1, and the two connecting portions 32 are used for electrical connection. The metal heat dissipation coating 4 is fixed to the surface of the magnetic component 1 as one of the heat dissipation elements, but the present invention is not limited to this. For example, in other embodiments of the present invention not shown, the metal heat dissipation coating 4 can also be omitted.

[0087] Example 3

[0088] See also Fig.18 , which is the third embodiment of the present invention. The manufacturing method of the heat dissipation inductor of this embodiment is similar to the manufacturing method of the first embodiment. The similarities between the two embodiments are not repeated here. The manufacturing method of this embodiment is different from the first embodiment mainly in that the metal heat dissipation guide is omitted. For example, the manufacturing method in this third embodiment includes the following steps:

[0089] Step SA101: Filling the mold with bottom magnetic powder;

[0090] Step SA103: performing a first molding on the mold to form the bottom layer of magnetic powder into a primary semi-finished product;

[0091] Step SA105: placing a conductive sheet on the primary semi-finished product in the mold;

[0092] Step SA107: Filling the mold with an upper layer of magnetic powder and covering part of the conductive sheet;

[0093] Step SA109: performing a second molding on the mold so that the upper layer of magnetic powder and the part of the conductive sheet can cooperate with the primary semi-finished product to form a secondary semi-finished product together;

[0094] Step SA111: sintering the secondary semi-finished product at high temperature;

[0095] Step SA113: electroplating or sputtering a metal heat dissipation coating on the surface of the secondary semi-finished product after high-temperature sintering.

[0096] In summary, the heat dissipation inductor and the manufacturing method thereof disclosed in the embodiments of the present invention can achieve good heat dissipation and avoid heat accumulation through the designs of "the covering portion of the conductive sheet is covered by the magnetic component and contacts the magnetic component" and "the wide side of the metal heat dissipation guide sheet contacts at least one side of the magnetic component", thereby ensuring the overall performance of the inductor (for example: reducing copper loss).

[0097] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0098] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A method for manufacturing a heat dissipation inductor, characterized in that: The steps include: Place a metal heat sink guide in the mold; Filling the bottom layer of magnetic powder into the mold to cover the metal heat dissipation guide; Performing a first molding on the mold to form a primary semi-finished product with the bottom layer of magnetic powder and the metal heat dissipation guide; placing a conductive sheet on the primary semi-finished product in the mold; Filling the upper layer of magnetic powder into the mold and covering a portion of the conductive sheet; Performing a second molding on the mold so that the upper layer of magnetic powder and the part of the conductive sheet cooperate with the primary semi-finished product to form a secondary semi-finished product; sintering the secondary semi-finished product at high temperature; Before placing the metal heat dissipation guide into the mold, the following steps are also included: A first rough surface is processed on the surface of the metal heat dissipation guide plate; when the bottom layer magnetic powder is in a molten state at a high temperature, it can penetrate into the groove of the first rough surface.

2. The method for manufacturing a heat dissipation inductor according to claim 1, characterized in that: After the secondary semi-finished product is subjected to high temperature sintering, the following steps are also included: A metal heat dissipation coating is electroplated or sputtered on the surface of the secondary semi-finished product.

3. The method for manufacturing a heat dissipation inductor according to claim 1, characterized in that: Before the mold is subjected to the second molding, the following steps are also included: An amplified metal heat sink guide is placed in the mold to cover the upper layer of magnetic powder.

4. The method for manufacturing a heat dissipation inductor according to claim 3, characterized in that: Before placing the amplified metal heat dissipation guide in the mold, the following steps are also included: A plurality of second through holes are opened on the amplified metal heat dissipation guide plate, or a second rough surface is processed on the surface of the amplified metal heat dissipation guide plate; and the second rough surface can be embedded with liquid magnetic powder during high-temperature sintering.

5. A heat dissipation inductor, characterized in that: The heat dissipation inductor is made by the method for making a heat dissipation inductor according to any one of claims 1 to 4, and comprises a magnetic part, a metal heat dissipation guide sheet and a conductive sheet; The metal heat dissipation guide is arranged on the magnetic member; the wide side of the metal heat dissipation guide contacts at least one side of the magnetic member; The conductive sheet passes through the magnetic component; the conductive sheet includes a covering portion and two connecting portions; the covering portion is covered and fixed by the magnetic component and contacts the magnetic component; the two connecting portions extend from both ends of the covering portion to the outside of the magnetic component respectively.

6. The heat dissipation inductor according to claim 5, characterized in that: The heat dissipation inductor further includes a metal heat dissipation coating, and the metal heat dissipation coating is fixed on the surface of the magnetic component.

7. The heat dissipation inductor according to claim 6, characterized in that: The heat dissipation inductor further includes an amplified metal heat dissipation guide plate, which is arranged on the magnetic component, and a wide side surface of the amplified metal heat dissipation guide plate contacts the top surface of the magnetic component.

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