A resin grinding block for a grinding process in ceramic large plates and a preparation method thereof

Abstract

This invention discloses a resin grinding block and its preparation method for the intermediate grinding process of ceramic slabs. The resin grinding block is prepared from the following components in parts by weight: 20-30 parts modified resin liquid, 15-30 parts curing agent, 1-3 parts diluent, 10-30 parts copper foam powder, 3-10 parts PVB powder, 1-5 parts silica, 5-15 parts green silicon, and 5-15 parts diamond. The modified resin liquid is prepared from epoxy resin E44 and phenolic epoxy resin F51 in a mass ratio of 1:(1-3). This grinding block can improve the sharpness and service life of the grinding block, and the surface of the ceramic slabs polished is free of scratches, with high flatness and no light bending under fluorescent lamps.

Description

Technical Field

[0001] This invention relates to the field of ceramic processing, and in particular to a resin grinding block and its preparation method for the intermediate grinding process of large ceramic slabs. Background Technology

[0002] Large ceramic slabs are made from various inorganic non-metallic materials such as clay and minerals through a high-temperature firing process at 1200℃. Compared to other ceramic tile products, large ceramic slabs are characterized by their large size, high hardness, stable performance, safety and durability, environmental friendliness and health benefits, and strong decorative appeal. They are mainly used for wall and floor decoration in architectural spaces, as well as for furniture decoration such as wardrobe panels, cabinet panels, and door panels.

[0003] However, due to its large production size (such as 3600mm×1600mm×15.5mm) and poor surface flatness, water ripples occur during polishing, reducing the customer's yield.

[0004] Before being finished, ceramic slabs require polishing, which includes coarse grinding, medium grinding, and fine grinding. Coarse grinding mainly removes surface imperfections and reshapes the slab, maintaining its approximate geometry and roughness. Coarse grinding improves polishing efficiency and reduces wear on the grinding tools during subsequent polishing processes. Medium grinding follows coarse grinding and is used to further smooth out any uneven areas on the surface of the ceramic slab, facilitating subsequent polishing through fine grinding.

[0005] In the current polishing process of large ceramic slabs, the intermediate grinding step all uses hot-pressed resin grinding blocks, the structure of which is as follows: Figure 1 As shown, its formula is mainly prepared by hot pressing of the following components in parts by weight: 50-60 parts of powdered phenolic resin, 5-10 parts of zinc oxide, 20-30 parts of green silica, 5-10 parts of alumina, 3-10 parts of glass fiber powder, 3-10 parts of calcium carbonate, and 10-15 parts of diamond. According to the polishing requirements of the intermediate grinding mill, the diamond particle size in the grinding block is 0.04-0.07 mm, and the green silica particle size is 300-800 mesh.

[0006] However, these hot-pressed resin abrasive blocks have a short lifespan during rough grinding and polishing. They are brittle, and the edges are prone to chipping and splintering, resulting in scratches on the ceramic panel. Furthermore, the flatness of the large ceramic slab cannot be guaranteed.

[0007] Therefore, this patent mainly focuses on the development of a grinding block that can improve the sharpness and service life of the grinding block while ensuring the flatness of the surface of the processed ceramic slab. Summary of the Invention

[0008] In order to overcome the shortcomings of the prior art, one of the objectives of the present invention is to provide a resin grinding block for the intermediate grinding process of ceramic slabs.

[0009] The second objective of this invention is to provide a method for preparing resin grinding blocks for the intermediate grinding process of ceramic slabs.

[0010] One of the objectives of this invention is achieved by the following technical solution: a resin grinding block for the intermediate grinding process of ceramic slabs, which is prepared from the following components in parts by weight: 20-30 parts modified resin liquid, 15-30 parts curing agent, 1-3 parts diluent, 10-30 parts copper foam powder, 3-10 parts PVB powder, 1-5 parts fumed silica, 5-15 parts green silicon, and 5-15 parts diamond.

[0011] The modified resin solution is prepared from epoxy resin E44 and phenolic epoxy resin F51 in a mass ratio of 1:(1-3).

[0012] Further, the modified resin liquid is prepared as follows: epoxy resin E44 and phenolic epoxy resin F51 are mixed in a mass ratio of 1:(1-3), and then 5-15% of the total content of the above resin liquid CMP-410 toughening agent is added and stirred evenly, and then placed in an oven at 120℃ for 0.5-2 hours.

[0013] Furthermore, the porosity of the foamed copper powder is 60-95%, and the average pore size is 0.2-4 mm.

[0014] Furthermore, the curing agent is selected from one of aliphatic amine curing agents, aromatic amine curing agents, and polyamide curing agents.

[0015] Furthermore, the diluent is selected from one of epoxy resin reactive diluent AGE, styrene, and ethanol.

[0016] Furthermore, the particle size of the PVB powder is 300-500 mesh.

[0017] Furthermore, the particle size of the silica is 300-500 mesh.

[0018] Furthermore, the particle size of the green silicon is 300-800 mesh.

[0019] Furthermore, the diamond has a particle size of 0.04-0.07 mm.

[0020] The second objective of this invention is achieved by the following technical solution: a method for preparing resin grinding blocks for the intermediate grinding process of large ceramic slabs, comprising the following steps:

[0021] (1) Modification treatment of resin solution

[0022] Epoxy resin E44 and phenolic epoxy resin F51 were mixed in a mass ratio of 1:(1-3), and then CMP-410 toughening agent with a total content of 5-15% of the above resin liquid was added and stirred evenly. The mixture was placed in an oven at 120℃ for 0.5-2 hours, and then taken out for use to obtain modified resin liquid.

[0023] (2) Preparation of resin abrasive fluid

[0024] The abrasive powder is prepared according to the following components by weight: 10-30 parts copper foam powder, 3-10 parts PVB powder, 1-5 parts silica, 5-15 parts silicon dioxide, and 5-15 parts diamond. The abrasive powder is passed through a 46# sieve and then placed in an oven to dry to remove moisture. The oven temperature is set to 55-65℃ and held for 0.5-1 hour. The dried powder is then poured into a three-dimensional mixer for mixing for 1-2 hours. The mixture is then removed and set aside to obtain the abrasive powder.

[0025] Add 20-30 parts of the modified resin liquid prepared in step (1) and 1-3 parts of the diluent to the mixing tank; then add the mixed abrasive powder and stir evenly; finally add 15-30 parts of the curing agent and stir evenly to obtain the resin abrasive liquid.

[0026] (3) Curing of resin grinding blocks

[0027] Place the mold into the mold slot, pour the resin abrasive liquid mixed in step (2) into the mold, place the rubber pad on top of the mold so that the resin liquid and the rubber pad come into contact, then apply pressure to the rubber pad, turn on the ultrasonic device and the heating device, set the ultrasonic frequency to 1500-1600w, the ultrasonic time to 0.5-1h, the heating temperature of the heating device to 50-80℃, and the pressing time to 1-3h, and perform ultrasonic and hot pressing curing. After complete curing, take it out, and it can be used for the resin abrasive block in the intermediate grinding process of ceramic slabs.

[0028] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0029] (1) The grinding blocks used in the intermediate grinding process of this invention are made of foam metal combined with liquid resin to replace the hot-pressed resin grinding blocks in the existing intermediate grinding process. On the one hand, it can improve the sharpness and service life of the grinding blocks. On the other hand, it can improve the polishing effect. The resulting ceramic slabs have no scratches on the surface, the brick surface has high flatness, and the light under the fluorescent lamp is not bent.

[0030] Specifically, the grinding blocks used in the intermediate grinding process of this invention prioritize sharpness, ensuring the removal of surface scratches from the coarse grinding process without causing scratches themselves. By adding foamed copper powder to the intermediate grinding blocks, the high porosity (60-95%) and three-dimensional porous structure allow the blocks to quickly recover their original shape under pressure. This characteristic gives the copper-foamed grinding blocks compression, shock absorption, and cushioning properties, as well as a certain degree of toughness when in contact with processed materials, effectively preventing breakage and scratches, thus significantly improving the overall strength and sharpness of the grinding blocks. The addition of modified liquid resin, along with the foamed copper powder, other abrasive fillers, and diamond, forms a three-dimensional network structure, increasing the bonding force between the metal particles and the resin, thereby enhancing the overall strength of the grinding blocks and reducing breakage. Furthermore, the modified resin liquid of this invention exhibits even higher strength after curing, further extending the service life of the grinding blocks.

[0031] Compared to other metals, the foamed metal copper selected in this invention has a light specific gravity, resulting in a lower overall weight of the grinding blocks made from it. This reduces the motor load during polishing, thereby improving sharpness.

[0032] In addition, the resin grinding blocks in the intermediate grinding process are cylindrical. On the one hand, compared with rectangular grinding blocks, cylindrical grinding blocks have no sharp corners on their surface. When the resin liquid is poured and molded, the liquid will not be subject to surface tension, thus preventing the formation of pores at the corners. On the other hand, each cylinder is an individual processing body with an independent grinding surface, which can process the concave layers that were not ground off in the rough grinding process, further improving the grinding effect on the brick surface.

[0033] (2) In the grinding block preparation method, the present invention pours liquid resin into the mold and introduces ultrasonic equipment during curing. The liquid resin formula contains foamed metal copper with large porosity. During the ultrasonic curing process, the high-speed micro-jet generated by ultrasonic cavitation enhances the stirring effect of the solution and strengthens the movement of powder in the resin liquid. Diamond and other fillers can more easily enter the pores, increase the bonding force, reduce the thickness of the dispersion layer and the concentration gradient, and ensure that the resin liquid and powder are mixed evenly.

[0034] (3) After the resin grinding block of this new type is cured and molded, there is no need to arrange a separate process of pasting adhesive pads and / or Velcro. The grinding block adheres to the adhesive pad when the resin liquid is poured and cured, which simplifies the processing process and reduces the cost. Attached Figure Description

[0035] Figure 1 A schematic diagram of the structure of the hot-pressed resin grinding block (Comparative Example 9) in the existing intermediate grinding process of ceramic large plates;

[0036] Figure 2This is a three-dimensional schematic diagram of the resin grinding block according to a preferred embodiment of the present invention;

[0037] Figure 3 This is a schematic diagram showing scratches left on the surface of a ceramic slab after the intermediate grinding process, which is a comparative example of the present invention.

[0038] Figure 4 This is a schematic diagram showing the unevenness of the surface of a ceramic slab after the intermediate grinding process under light, which is a comparative example of the present invention. Detailed Implementation

[0039] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0040] In this invention, unless otherwise specified, all parts and percentages are by weight, and the equipment and raw materials used are commercially available or commonly used in the art. Unless otherwise specified, the methods in the following embodiments are conventional methods in the art.

[0041] This invention provides a resin grinding block for the intermediate grinding process of ceramic slabs, which is prepared from the following components in parts by weight: 20-30 parts modified resin liquid, 15-30 parts curing agent, 1-3 parts diluent, 10-30 parts copper foam powder, 3-10 parts PVB powder, 1-5 parts fumed silica, 5-15 parts green silicon, and 5-15 parts diamond.

[0042] The modified resin solution is prepared from epoxy resin E44 and phenolic epoxy resin F51 in a mass ratio of 1:(1-3).

[0043] As a further preferred embodiment, the modified resin liquid is prepared as follows: epoxy resin E44 and phenolic epoxy resin F51 are mixed in a mass ratio of 1:(1-3), and then 5-15% of the total content of the above resin liquid CMP-410 toughening agent is added and stirred evenly, and then placed in an oven at 120℃ for 0.5-2 hours.

[0044] As a further preferred embodiment, the porosity of the foamed copper powder is 60-95% and the average pore size is 0.2-4 mm.

[0045] As a further preferred embodiment, the curing agent is selected from one of aliphatic amine curing agents, aromatic amine curing agents, and polyamide curing agents.

[0046] As a further preferred embodiment, the diluent is selected from one of epoxy resin reactive diluent AGE, styrene, and ethanol.

[0047] As a further preferred embodiment, the particle size of the PVB powder is 300-500 mesh.

[0048] As a further preferred embodiment, the particle size of the silica is 300-500 mesh.

[0049] As a further preferred embodiment, the particle size of the green silicon is 300-800 mesh.

[0050] As a further preferred embodiment, the diamond has a particle size of 0.04-0.07 mm.

[0051] This invention also provides a method for preparing resin grinding blocks for the intermediate grinding process of large ceramic slabs, comprising the following steps:

[0052] (1) Modification treatment of resin solution

[0053] Epoxy resin E44 and phenolic epoxy resin F51 were mixed in a mass ratio of 1:(1-3), and then CMP-410 toughening agent with a total content of 5-15% of the above resin liquid was added and stirred evenly. The mixture was placed in an oven at 120℃ for 0.5-2 hours, and then taken out for use to obtain modified resin liquid.

[0054] (2) Preparation of resin abrasive fluid

[0055] The abrasive powder is prepared according to the following components by weight: 10-30 parts copper foam powder, 3-10 parts PVB powder, 1-5 parts silica, 5-15 parts silicon dioxide, and 5-15 parts diamond. The abrasive powder is passed through a 46# sieve and then placed in an oven to dry to remove moisture. The oven temperature is set to 55-65℃ and held for 0.5-1 hour. The dried powder is then poured into a three-dimensional mixer for mixing for 1-2 hours. The mixture is then removed and set aside to obtain the abrasive powder.

[0056] Add 20-30 parts of the modified resin liquid prepared in step (1) and 1-3 parts of the diluent to the mixing tank; then add the mixed abrasive powder and stir evenly; finally add 15-30 parts of the curing agent and stir evenly to obtain the resin abrasive liquid.

[0057] (3) Curing of resin grinding blocks

[0058] Place the mold into the mold slot, pour the resin abrasive liquid mixed in step (2) into the mold, place the rubber pad on top of the mold so that the resin liquid and the rubber pad come into contact, then apply pressure to the rubber pad, turn on the ultrasonic device and the heating device, set the ultrasonic frequency to 35-45KHz, the ultrasonic time to 0.5-1h, the heating temperature of the heating device to 50-80℃, and the pressing time to 1-3h, and perform ultrasonic and hot pressing curing. After complete curing, take it out, and it can be used for the resin abrasive block in the intermediate grinding process of ceramic slabs.

[0059] The adhesive pad is an accessory that connects the abrasive block to the mounting position on the polishing machine. In existing technologies, the processed abrasive block needs to be fixed to the adhesive pad by adhesive bonding or by attaching Velcro to facilitate subsequent mounting of the module onto the polishing machine. In this process, after the resin abrasive block has cured, there is no need for a separate adhesive pad attachment process and / or Velcro application. The abrasive block adheres to the adhesive pad during the curing process of the poured resin liquid, simplifying the processing and reducing costs.

[0060] The following are specific embodiments of the present invention. Unless otherwise specified, the raw materials, equipment and other materials used in the following embodiments can be obtained by purchasing.

[0061] Examples 1-3 and Comparative Examples 1-9

[0062] Weigh the raw materials according to the proportions in Table 1, and prepare resin grinding blocks according to the preparation methods in Table 1 to obtain resin grinding blocks of different embodiments. See Table 1 for details:

[0063] Table 1. Raw material ratio table for Examples 1-3

[0064] Example Example 1 Example 2 Example 3 Modified resin solution (20-30 parts) 22 25 28 Hardener (15-30 parts) 17 26 20 Diluent (1-3 parts) 1 2 3 Copper foam powder (10-30 parts) 12 20 27 PVB powder (3-10 parts) 5 6 8 Silica (1-5 parts) 1.5 4 4 Green silicon (5-15 parts) 6 10 13 Diamonds (5-15 parts) 7 10 14

[0065] The modified resin liquid in Table 1 was prepared by the following method: epoxy resin E44 and phenolic epoxy resin F51 were mixed in a mass ratio of 1:2, and then 10% of the total content of the above resin liquid CMP-410 toughening agent was added and stirred evenly. The mixture was then placed in an oven at 120°C for 1.5 hours.

[0066] The curing agent is selected from CYD-N1403 curing agent, and the diluent is selected from reactive diluent AGE. The porosity of the copper foam powder is 60-95%, and the average pore size is 0.2-4 mm. The particle size of PVB powder is 350 mesh, the particle size of silica is 400 mesh, the particle size of green silica is 500 mesh, and the particle size of diamond is 0.04-0.07 mm.

[0067] Comparative Example 1

[0068] Compared with Example 2, the difference in Comparative Example 1 is that the modified resin liquid is prepared from a single resin liquid, epoxy resin E44. That is, the preparation method of the modified resin liquid is as follows: epoxy resin E44 and 10% of the above resin liquid content of CMP-410 toughening agent are stirred evenly and placed in an oven at 120°C for 1.5 hours; the remaining dosages and processing conditions are the same as in Example 2.

[0069] Comparative Example 2

[0070] Compared with Example 2, the difference in Comparative Example 2 is that the modified resin liquid is prepared from a single resin liquid, phenolic epoxy resin F51. That is, the preparation method of the modified resin liquid is as follows: phenolic epoxy resin F51 and 10% of the above resin liquid content of CMP-410 toughening agent are stirred evenly and placed in an oven at 120°C for 1.5 hours; the remaining dosages and processing conditions are the same as in Example 2.

[0071] Comparative Example 3

[0072] Compared with Example 2, the difference in Comparative Example 3 is that the modified resin liquid is prepared from epoxy resin E44 and epoxy resin E51. That is, the preparation method of the modified resin liquid is as follows: epoxy resin E44 and epoxy resin E51 are mixed in a mass ratio of 1:2, and then 10% of the total content of the above resin liquid CMP-410 toughening agent is added and stirred evenly. The mixture is then placed in an oven at 120°C for 1.5 hours. The remaining dosages and processing conditions are the same as in Example 2.

[0073] Comparative Example 4

[0074] Compared with Example 2, the difference in Comparative Example 4 is that conventional copper powder is used instead of foamed copper powder, while the other amounts and processing conditions are the same as in Example 2.

[0075] Comparative Example 5

[0076] Compared with Example 2, the difference in Comparative Example 5 is that the amount of foamed copper powder used is 0 parts, while the other amounts and processing conditions are the same as in Example 2.

[0077] Comparative Example 6

[0078] Compared with Example 2, the difference in Comparative Example 6 is that the amount of silica used is 0 parts, while the other amounts and processing conditions are the same as in Example 2.

[0079] Comparative Example 7

[0080] Compared with Example 2, the difference in Comparative Example 7 is that the amount of PVB powder used is 0 parts, while the other amounts and processing conditions are the same as in Example 2.

[0081] Comparative Example 8

[0082] Compared with Example 2, the difference of Comparative Example 8 is that in the preparation method of the resin grinding block, step (3) does not add the ultrasonic curing process, but directly hot presses the molding, that is, the ultrasonic frequency and ultrasonic time are both 0, and the remaining dosage and processing conditions are the same as those of Example 2.

[0083] Comparative Example 9

[0084] Comparative Example 9 is a conventional resin grinding block with the following formulation: 50 parts powdered phenolic resin, 10 parts zinc oxide, 25 parts green silica, 8 parts alumina, 3 parts glass fiber powder, 7 parts calcium carbonate, and 12 parts diamond. The diamond particle size is 0.04-0.07 mm, and the green silica particle size is 500 mesh.

[0085] The preparation methods of the resin grinding blocks for each example include the following steps:

[0086] (1) Modification treatment of resin solution

[0087] Epoxy resin E44 and phenolic epoxy resin F51 were mixed in a mass ratio of 1:(1-3), and then CMP-410 toughening agent with a total content of 5-15% of the above resin liquid was added and stirred evenly. The mixture was placed in an oven at 120℃ for 0.5-2 hours, and then taken out for use to obtain modified resin liquid.

[0088] (2) Preparation of resin abrasive fluid

[0089] The abrasive powder was prepared according to the component ratio in Table 1. The above-mentioned foamed copper powder, PVB powder, silica, green silicon, and diamond abrasive powder were passed through a 46# sieve and then placed in an oven to dry in order to remove moisture from the powder. The temperature of the oven was set to 60℃ and kept at that temperature for 1 hour. Then the dried powder was poured into a three-dimensional mixer for mixing for 1.5 hours. The powder was then removed and set aside to obtain the abrasive powder.

[0090] According to the component ratio in Table 1, add the modified resin liquid and diluent prepared in step (1) to the mixing tank; then add the above-mixed abrasive powder and stir evenly; finally add the curing agent and stir evenly to obtain the resin abrasive liquid.

[0091] (3) Curing of resin grinding blocks

[0092] Place the mold into the mold slot, pour the resin abrasive liquid mixed in step (2) into the mold, place the rubber pad on top of the mold so that the resin liquid and the rubber pad come into contact, then apply pressure to the rubber pad, turn on the ultrasonic device and the heating device, set the ultrasonic frequency to 40KHz, the ultrasonic time to 1h, the heating temperature of the heating device to 70℃, and the pressing time to 2h, perform ultrasonic and hot pressing curing, and take it out after complete curing. It can be used for the resin abrasive block in the intermediate grinding process of ceramic slabs.

[0093] Effect evaluation and performance testing

[0094] The performance of the grinding blocks of Examples 1-3 and Comparative Examples 1-9 was tested. The test items and results are shown in Table 2.

[0095] 1. Grinding block sharpness test

[0096] Sharpness was determined using vernier calipers by measuring the thickness change of the ceramic slab before and after processing, i.e., the depth of cut. The results are presented as slab thickness (mm). The greater the depth of cut, the sharper the abrasive block.

[0097] 2. Testing method for grinding block service life

[0098] Install the abrasive block on the polishing machine. During the polishing process, stop polishing when the ceramic surface reaches a polishing quality. Record the longest polishing time of the abrasive block, and record the results in hours (h).

[0099] 3. Polishing effect test

[0100] The grinding blocks from each example were installed on a 48-head polishing machine, and ceramic slabs with dimensions of 3600mm×1600mm×15.5mm were polished under the same medium-grind polishing conditions. The flatness of the ceramic slab surface was observed, and whether there were any scratches was observed. The flatness was observed under a fluorescent lamp. The better the polishing effect, the smoother the light without bending.

[0101] Table 2 shows the performance test data of the grinding blocks for each example.

[0102]

[0103]

[0104] As shown in the table above and appendix Figure 1-4 As shown, compared with the traditional hot-pressed resin grinding blocks of Comparative Example 9, the grinding blocks used in the medium-medium grinding process of this invention are grinding blocks containing a combination of foamed metal and liquid resin. On the one hand, this can improve the sharpness and service life of the medium-medium grinding blocks, and on the other hand, it can improve the polishing effect. The resulting ceramic slabs have no scratches on the surface, high flatness, and no bending of light under fluorescent lamps.

[0105] Compared with Example 2, the difference in the grinding block of Comparative Example 1 is that the modified resin liquid is prepared from a single resin liquid epoxy resin E44, which shows that the addition of resin liquid modification changes the sharpness and life of the grinding block.

[0106] Compared with Example 2, the difference in the grinding block of Comparative Example 2 is that the modified resin liquid is prepared from a single resin liquid phenolic epoxy resin F51, which shows that the addition of modified resin liquid changes the sharpness and life of the grinding block.

[0107] Compared with Example 2, the difference in the grinding block of Comparative Example 3 is that the modified resin liquid is prepared from epoxy resin E44 and epoxy resin E51, which shows that the modification of phenolic resin F51 changes the sharpness and life of the grinding block.

[0108] Compared with Example 2, the difference in the grinding block of Comparative Example 4 is that conventional copper powder is used instead of foamed copper powder, which shows that foamed copper powder has a positive effect on the life of the grinding block and the processing effect compared with conventional copper powder.

[0109] Compared with Example 2, the difference in the grinding block of Comparative Example 5 is that the amount of foamed copper powder is 0 parts, which indicates that the foamed copper powder improves the sharpness and life of the grinding block.

[0110] Compared with Example 2, the difference in the grinding block of Comparative Example 6 is that the amount of silica used is 0 parts, which indicates that silica improves the life of the grinding block.

[0111] Compared with Example 2, the difference in the grinding block of Comparative Example 7 is that the amount of PVB powder used is 0 parts, which indicates that PVB powder improves the life of the grinding block.

[0112] Compared with Example 2, the difference of Comparative Example 8 is that in the preparation method of the resin grinding block, step (3) does not add the ultrasonic curing process, but directly hot-presses the molding. This shows that the combination of ultrasonic and hot pressing makes the liquid flow more uniform, which can promote the curing effect and the bonding ability between metal powder and resin liquid, and improve the service life and grinding effect of the grinding block.

[0113] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A resin grinding block for the intermediate grinding process of large ceramic slabs, characterized in that, It is prepared from the following components in parts by weight: 20-30 parts modified resin liquid, 15-30 parts curing agent, 1-3 parts diluent, 10-30 parts copper foam powder, 3-10 parts PVB powder, 1-5 parts silica, 5-15 parts green silicon, and 5-15 parts diamond. The modified resin solution is prepared from epoxy resin E44 and phenolic epoxy resin F51 in a mass ratio of 1:(1-3). The resin grinding block is prepared by the following steps: (1) Modification treatment of resin solution Epoxy resin E44 and phenolic epoxy resin F51 are mixed, and then 5-15% of the total content of the above resin liquid is added as toughening agent CMP-410 and stirred evenly. The mixture is placed in an oven at 120℃ for 0.5-2 hours, and then taken out for use to obtain modified resin liquid. (2) Preparation of resin abrasive fluid The abrasive powder is formulated according to the following components by weight: copper foam powder, PVB powder, silica, silicon dioxide, and diamond. The abrasive powder is passed through a 46# sieve and then placed in an oven to dry to remove moisture. The oven temperature is set to 55-65℃ and held for 0.5-1 hour. The dried powder is then poured into a three-dimensional mixer for mixing for 1-2 hours. The mixture is then removed and set aside to obtain the abrasive powder. Add the modified resin liquid and diluent prepared in step (1) to the mixing tank in the corresponding amount of the formula; then add the mixed abrasive powder and stir evenly; finally add the curing agent in the formula amount and stir evenly to obtain the resin abrasive liquid. (3) Curing of resin grinding blocks Place the mold into the mold slot, pour the resin abrasive liquid mixed in step (2) into the mold, place the rubber pad on top of the mold so that the resin liquid and the rubber pad come into contact, then apply pressure to the rubber pad, turn on the ultrasonic device and the heating device, set the ultrasonic frequency to 35-45KHz, the ultrasonic time to 0.5-1h, the heating temperature of the heating device to 50-80℃, and the pressing time to 1-3h, and perform ultrasonic and hot pressing curing. After the curing is complete, take it out, and it can be used for the resin abrasive block in the intermediate grinding process of ceramic slabs.

2. The resin grinding block for the grinding process of a ceramic slab according to claim 1, wherein The porosity of the foamed copper powder is 60-95%, and the average pore size is 0.2-4 mm.

3. The resin abrasive block for the grinding process in ceramic large panels according to claim 1, characterized in that, The curing agent is selected from one of aliphatic amine curing agents, aromatic amine curing agents, and polyamide curing agents.

4. The resin grinding block for ceramic plate grinding process according to claim 1, wherein The diluent is selected from one of epoxy resin reactive diluent AGE, styrene, and ethanol.

5. The resin grinding block for ceramic plate grinding process according to claim 1, wherein The particle size of the PVB powder is 300-500 mesh.

6. The resin abrasive block for the grinding process in ceramic slabs according to claim 1, characterized in that, The particle size of the silica is 300-500 mesh.

7. The resin abrasive block for the grinding process in ceramic slabs according to claim 1, characterized in that, The particle size of the green silicon is 300-800 mesh.

8. The resin abrasive block for the grinding process in ceramic slabs according to claim 1, characterized in that, The diamond has a particle size of 0.04-0.07 mm.

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