Horizontal compressor controller and control method thereof
By combining passive and active heat dissipation in the horizontal compressor controller, the problem of poor heat dissipation of the scroll compressor controller chip is solved, achieving efficient heat dissipation and energy consumption optimization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI HIGHLY NEW ENERGY TECH CO LTD
- Filing Date
- 2023-12-25
- Publication Date
- 2026-06-26
AI Technical Summary
The controller chip of a scroll compressor may overheat or become over-temperature under certain operating conditions due to poor heat dissipation, which could damage the compressor controller chip.
The design employs a horizontal compressor controller, which achieves passive heat dissipation by contacting the control chip with the rear shell surface, and active heat dissipation by connecting the flat heat pipes to the cooling fins. Combined with the Peltier effect, the heat dissipation effect is improved.
It effectively improves the heat dissipation of the control chip, avoids chip overheating and damage, and reduces heat dissipation energy consumption.
Smart Images
Figure CN117514811B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of refrigeration, and in particular to a horizontal compressor controller and its control method. Background Technology
[0002] The variable frequency controller chip of a scroll compressor generates a lot of heat under certain operating conditions. When the heat dissipation of the controller chip is lower than its own power consumption heat generation, the controller chip gradually enters an overheated or over-temperature state, which will limit the operation of the compressor. In severe cases, it may even damage the compressor controller chip.
[0003] In existing technologies, the controller chip dissipates heat by transferring it to the low-temperature area of the compressor's low-pressure chamber using thermal grease. However, this design is passive heat dissipation, and under certain operating conditions, the chip may still overheat due to poor heat dissipation.
[0004] In view of the above-mentioned deficiencies, the present invention proposes a new horizontal compressor controller and its control method. Summary of the Invention
[0005] The purpose of this invention is to provide a horizontal compressor controller and its control method, thereby improving the heat dissipation of the horizontal compressor controller chip.
[0006] The present invention solves the above-mentioned technical problems through the following technical solution:
[0007] The present invention provides a horizontal compressor controller, wherein the controller is installed on the rear housing of the horizontal compressor, and the rear housing and the suction side of the horizontal compressor form a surface contact;
[0008] The controller includes a PCB board, a control chip, a flat heat pipe, and a cooling chip. The control chip is electrically connected to the PCB board on one side and forms a surface contact with the rear shell.
[0009] The flat heat pipe is located between the control chip and the PCB board and extends along a first direction, forming a first region, a second region and a third region sequentially on the side facing the rear shell; the cooling chip installed on the inner wall of the rear shell forms a surface contact with the first region, the control chip forms a surface contact with the third region, and a gap is left between the second region and the rear shell;
[0010] The cooling chip is electrically connected to the PCB board and is used to conduct heat from the control chip to the back cover when power is applied. The cooling chip includes a hot end and a cold end. The cold end of the cooling chip is connected to the flat heat pipe, and the hot end of the cooling chip is connected to the back cover.
[0011] In this technical solution, the control chip achieves passive heat dissipation through surface contact with the back cover, and also achieves active heat dissipation by utilizing the Peltier effect generated when the cooling chip is energized through the connection between the flat heat pipe and the cooling chip, thereby greatly improving the heat dissipation effect of the control chip. At the same time, the part of the flat heat pipe connecting the control chip and the cooling chip is suspended, avoiding direct contact between the cold source and the heat source, improving the heat transfer effect of the flat heat pipe, and enhancing the heat dissipation of the control chip.
[0012] Preferably, a first thermally conductive layer is coated between the control chip and the back cover.
[0013] In this technical solution, the first thermally conductive layer eliminates the air between the control chip and the back cover, allowing the control chip to conduct heat fully to the back cover.
[0014] Preferably, a second thermally conductive layer is coated between the flat heat pipe and the control chip.
[0015] In this technical solution, the second heat-conducting layer eliminates the air between the control chip and the flat heat pipe, allowing the control chip to conduct heat fully to the flat heat pipe.
[0016] Preferably, a third thermally conductive layer is coated between the cooling chip and the flat heat pipe, and a fourth thermally conductive layer is coated between the cooling chip and the rear shell.
[0017] In this technical solution, the third heat-conducting layer eliminates the air between the cooling chip and the flat heat pipe, and the fourth heat-conducting layer eliminates the air between the cooling chip and the back shell, so that heat can be conducted from the flat heat pipe to the cooling chip to the back shell without affecting the temperature of the cooling chip, thereby improving the heat dissipation efficiency.
[0018] Preferably, the control chip is connected to the PCB board via multiple pins, the flat heat pipe is located in the middle of the control chip, and the multiple pins are arranged on both sides of the control chip parallel to the flat heat pipe.
[0019] In this technical solution, the flat heat pipe and the pins do not interfere with each other, allowing the control chip to function normally.
[0020] Preferably, the control chip is connected to the PCB board via multiple pins, and the flat heat pipe has at least one through hole through which the pins pass.
[0021] In this technical solution, to accommodate the design of the control chip, through holes are made on the flat heat pipe to make way for the pins, so that the liquid inside the flat heat pipe can circulate normally and the pins can also be connected to the PCB board normally.
[0022] Preferably, the cooling chip is located above the control chip, and the first direction is the direction of gravity.
[0023] In this technical solution, the liquid inside the flat heat pipe connecting the cooling chip and the control chip is heated and flows from one end of the control chip to the other end of the cooling chip in a gaseous state. After being cooled by releasing heat at the cooling chip end, it becomes liquid again and flows back to the control chip end naturally under the action of gravity, without the need for external additional drive.
[0024] Preferably, the flat heat pipe extends from one side of the cooling plate to the opposite side.
[0025] In this technical solution, the flat heat pipe has a large contact area with the cooling chip, which can evenly transfer heat to all parts of the cooling chip.
[0026] Preferably, a plurality of protrusions are formed on the inner wall of the rear shell, and the control chip and the cooling chip are respectively connected to different protrusions.
[0027] In this technical solution, the control chip and the cooling chip act as heat source and cold source, respectively, without direct contact, which improves the heat transfer effect of the flat heat pipe and enhances the heat dissipation of the control chip.
[0028] The present invention also provides a control method for a horizontal compressor controller, which is applied to the horizontal compressor controller described above;
[0029] When the temperature of the control chip rises to the first preset temperature of the control chip, the PCB board begins to supply a weak DC current to the cooling chip, and the cooling chip begins to cool down.
[0030] When the temperature of the control chip drops to the second preset temperature of the control chip, the PCB board stops supplying weak DC power to the cooling chip, and the cooling chip stops cooling.
[0031] In this technical solution, when the control chip is dissipating heat normally, the cooling chip does not work and does not perform active heat dissipation. The cooling chip only starts working when the control chip temperature is too high, which avoids damage to the control chip due to excessive temperature and reduces heat dissipation energy consumption.
[0032] Based on common knowledge in the field, the above-mentioned preferred conditions can be combined arbitrarily to obtain various preferred embodiments of the present invention.
[0033] The positive and progressive effects of this invention are as follows:
[0034] The horizontal compressor controller and its control method of the present invention enable the control chip to achieve passive heat dissipation through surface contact with the rear shell, and also achieve active heat dissipation by utilizing the Peltier effect generated when the cooling chip is energized through the connection between the flat heat pipe and the cooling chip, thereby greatly improving the heat dissipation effect of the control chip; at the same time, the part of the flat heat pipe connecting the control chip and the cooling chip is suspended, avoiding direct contact between the cold source and the heat source, improving the heat transfer effect of the flat heat pipe, and enhancing the heat dissipation of the control chip. Attached Figure Description
[0035] Figure 1 This is a side view of a horizontal compressor controller according to an embodiment of the present invention.
[0036] Figure 2 This is a schematic diagram of the cooling plate and flat heat pipe of the horizontal compressor controller according to an embodiment of the present invention.
[0037] Explanation of reference numerals in the attached figures:
[0038] Rear shell 1, boss 11;
[0039] PCB board 2;
[0040] Control chip 3, pin 31;
[0041] Flat heat pipe 4, first region 41, second region 42, third region 43;
[0042] Cooling element 5, hot end 51, cold end 52;
[0043] First thermal conductive layer 6;
[0044] Second thermal conductive layer 7;
[0045] Third heat-conducting layer 8;
[0046] Fourth thermal conductive layer 9. Detailed Implementation
[0047] The present invention will be further illustrated by way of embodiments below, but the present invention is not limited to the scope of the embodiments described herein.
[0048] like Figure 1 and Figure 2The diagram shown is a reference schematic of an embodiment of the horizontal compressor controller of the present invention. The controller for the horizontal compressor is mounted on the rear housing 1 of the horizontal compressor, and the rear housing 1 forms a surface contact with the suction side of the horizontal compressor. The controller includes a PCB board 2, a control chip 3, a flat heat pipe 4, and a cooling chip 5. The control chip 3 is electrically connected to the PCB board 2 on one side and forms a surface contact with the rear housing 1. The flat heat pipe 4 is located between the control chip 3 and the PCB board 2 and extends along a first direction, forming a first region 41, a second region 42, and a third region 43 sequentially on the side facing the rear housing 1. The cooling chip 5, mounted on the inner wall of the rear housing 1, forms a surface contact with the first region 41, and the control chip 3 forms a surface contact with the third region 43. A gap is left between the second region 42 and the rear housing 1. The cooling chip 5 is electrically connected to the PCB board 2 and is used to conduct heat from the control chip 3 to the rear housing 1 when energized. The cooling chip 5 includes a hot end 51 and a cold end 52. The cold end 52 of the cooling chip 5 is connected to the flat heat pipe 4, and the hot end 51 of the cooling chip 5 is connected to the rear housing 1. The control chip 3 achieves passive heat dissipation through surface contact with the back shell 1, and also achieves active heat dissipation by utilizing the Peltier effect generated when the cooling chip 5 is energized through the connection between the flat heat pipe 4 and the cooling chip 5, thereby greatly improving the heat dissipation effect of the control chip 3. At the same time, the part of the flat heat pipe 4 that connects the control chip 3 and the cooling chip 5 is suspended, avoiding direct contact between the cold source and the heat source, improving the heat transfer effect of the flat heat pipe 4, and enhancing the heat dissipation of the control chip 3.
[0049] The cooling element 5 is a TEC semiconductor cooling element, and its size can vary from 2mm x 2mm to 62mm x 62mm depending on the requirements. In this embodiment, the cooling element 5 has a length of 20mm, a width of 16mm, and a thickness of 4mm.
[0050] The flat heat pipe 4 consists of a shell, a wick, and end caps. After a negative pressure is created inside the pipe, a suitable amount of working fluid is filled in, filling the capillary porous material of the wick that is tightly attached to the inner wall of the pipe with liquid before sealing. The second region can be set as an insulation section. The negative pressure value is 1.3 × (10⁻⁶). -1 ~10 -4 Within the Pa range, the thermal conductivity of the flat heat pipe 4 is in the range of 10,000 to 100,000 (W / mK). The size of the flat heat pipe 4 can be adjusted according to requirements, but its thickness is not less than 2 mm. In this embodiment, the flat heat pipe 4 has a length of 50 mm, a width of 12 mm, and a thickness of 3.5 mm.
[0051] In this embodiment, a first thermally conductive layer 6 is coated between the control chip 3 and the back cover 1. The first thermally conductive layer 6 eliminates the air between the control chip 3 and the back cover 1, allowing the control chip 3 to conduct heat sufficiently to the back cover 1.
[0052] A second thermally conductive layer 7 is coated between the flat heat pipe 4 and the control chip 3. The second thermally conductive layer 7 eliminates the air between the control chip 3 and the flat heat pipe 4, allowing the control chip 3 to conduct heat to the flat heat pipe 4 effectively.
[0053] A third heat-conducting layer 8 is coated between the cooling chip 5 and the flat heat pipe 4, and a fourth heat-conducting layer 9 is coated between the cooling chip 5 and the rear shell 1. The third heat-conducting layer 8 eliminates the air between the cooling chip 5 and the flat heat pipe 4, and the fourth heat-conducting layer 9 eliminates the air between the cooling chip 5 and the rear shell 1, so that heat can be conducted from the flat heat pipe 4 to the rear shell 1 through the cooling chip 5 without affecting the temperature of the cooling chip 5, thereby improving the heat dissipation efficiency.
[0054] The first thermal conductive layer 6, the second thermal conductive layer 7, the third thermal conductive layer 8, and the fourth thermal conductive layer 9 are all made of thermally conductive silicone grease.
[0055] The control chip 3 is connected to the PCB board 2 via multiple pins 31. The flat heat pipe 4 is located in the middle of the control chip 3, and the multiple pins 31 are arranged on both sides of the control chip 3 parallel to the flat heat pipe 4. The flat heat pipe 4 and the pins 31 do not interfere with each other, allowing the control chip 3 to function normally. In this embodiment, the control chip 3 has a width of 20mm, a thickness of 6mm, and the pins 31 extend 5mm beyond the control chip 3.
[0056] In other embodiments, pin 31 can also be located in the middle of the control chip 3. In this case, at least one through hole is opened on the flat heat pipe 4, and pin 31 passes through the through hole. To accommodate the design of the control chip 3, the through hole is opened on the flat heat pipe 4 to make way for pin 31, so that the liquid inside the flat heat pipe 4 can circulate normally, and pin 31 can also be connected to the PCB board 2 normally.
[0057] In this embodiment, the cooling chip 5 is located above the control chip 3, with the first direction being the direction of gravity. The liquid in the flat heat pipe 4 connecting the cooling chip 5 and the control chip 3 is heated and flows from one end of the control chip 3 to one end of the cooling chip 5 in a gaseous state. After being cooled by releasing heat at one end of the cooling chip 5, it becomes liquid again and flows back to one end of the control chip 3 naturally under the action of gravity, without the need for external additional drive.
[0058] In other embodiments, if required, the cooling chip 5 may also be located below the control chip 3, provided that the flat heat pipe 4 has a capillary structure.
[0059] In this embodiment, the flat heat pipe 4 extends from one side of the cooling plate 5 to the opposite side. The flat heat pipe 4 has a large contact area with the cooling plate 5, which uniformly transfers heat to all parts of the cooling plate 5.
[0060] Multiple protrusions 11 are formed on the inner wall of the rear shell 1, and the control chip 3 and the cooling chip 5 are respectively connected to different protrusions 11. The control chip 3 and the cooling chip 5 act as heat source and cold source, respectively, without direct contact, which improves the heat transfer effect of the flat heat pipe 4 and enhances the heat dissipation of the control chip 3.
[0061] This invention also provides a control method for a horizontal compressor controller, applied to the horizontal compressor controller described above. When the temperature of the control chip 3 rises to a first preset temperature, the PCB board 2 begins to supply a weak DC current to the cooling chip 5, and the cooling chip 5 begins to cool down. When the temperature of the control chip 3 drops to a second preset temperature, the PCB board 2 stops supplying the weak DC current to the cooling chip 5, and the cooling chip 5 stops cooling down. In this embodiment, the protection temperature of the control chip 3 is 110°C, the first preset temperature is 100°C, the second preset temperature is 60°C, and the voltage of the weak DC current is 12V. When the control chip 3 is dissipating heat normally, the cooling chip 5 does not work and does not perform active heat dissipation. The cooling chip 5 only starts working when the temperature of the control chip 3 is too high, which avoids damage to the control chip 3 due to overheating and reduces heat dissipation energy consumption.
[0062] In other embodiments, the first preset temperature, the second preset temperature, and the voltage of the weak DC current can be set to other values as needed.
[0063] While specific embodiments of the present invention have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but all such changes and modifications fall within the scope of protection of the present invention.
Claims
1. A horizontal compressor controller, characterized in that, The controller is mounted on the rear housing of the horizontal compressor, and the rear housing forms a surface contact with the suction side of the horizontal compressor. The controller includes a PCB board, a control chip, a flat heat pipe, and a cooling chip. The control chip is electrically connected to the PCB board on one side and forms a surface contact with the rear shell. The flat heat pipe is located between the control chip and the PCB board and extends along a first direction, forming a first region, a second region and a third region sequentially on the side facing the rear shell; the cooling chip installed on the inner wall of the rear shell forms a surface contact with the first region, the control chip forms a surface contact with the third region, and a gap is left between the second region and the rear shell; The cooling chip is electrically connected to the PCB board and is used to conduct heat from the control chip to the back cover when power is applied. The cooling chip includes a hot end and a cold end. The cold end of the cooling chip is connected to the flat heat pipe, and the hot end of the cooling chip is connected to the back cover.
2. The controller as described in claim 1, characterized in that, A first thermally conductive layer is applied between the control chip and the rear shell.
3. The controller as described in claim 1, characterized in that, A second thermally conductive layer is coated between the flat heat pipe and the control chip.
4. The controller as described in claim 1, characterized in that, A third thermally conductive layer is coated between the cooling chip and the flat heat pipe, and a fourth thermally conductive layer is coated between the cooling chip and the rear shell.
5. The controller as described in claim 1, characterized in that, The control chip is connected to the PCB board via multiple pins. The flat heat pipe is located in the middle of the control chip, and the multiple pins are arranged on both sides of the control chip parallel to the flat heat pipe.
6. The controller as claimed in claim 1, characterized in that, The control chip is connected to the PCB board via multiple pins, and the flat heat pipe has at least one through hole through which the pins pass.
7. The controller as claimed in claim 1, characterized in that, The cooling chip is located above the control chip, and the first direction is the direction of gravity.
8. The controller as claimed in claim 1, characterized in that, The flat heat pipe extends from one side of the cooling plate to the opposite side.
9. The controller as claimed in claim 1, characterized in that, Multiple protrusions are formed on the inner wall of the rear shell, and the control chip and the cooling chip are respectively connected to different protrusions.
10. A control method for a horizontal compressor controller, characterized in that, Applied to the horizontal compressor controller as described in any one of claims 1-9; When the temperature of the control chip rises to the first preset temperature of the control chip, the PCB board starts to supply a weak DC current to the cooling chip, and the cooling chip starts to cool down. When the temperature of the control chip drops to the second preset temperature of the control chip, the PCB board stops supplying weak DC power to the cooling chip, and the cooling chip stops cooling.