A rapid cooling device for large electronic devices
By combining top-down air cooling and bottom-up liquid cooling, and utilizing an arc-shaped design and control system, the problems of low efficiency and cumbersome operation of existing data processing electronic equipment heat dissipation devices have been solved, achieving efficient and energy-saving heat dissipation and simple operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TAIZHOU FENGXUN ELECTRONIC ENG EQUIP CO LTD
- Filing Date
- 2023-12-06
- Publication Date
- 2026-06-30
Smart Images
Figure CN117529044B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of heat dissipation devices for data processing electronic equipment, specifically a rapid cooling device for large electronic equipment. Background Technology
[0002] With the continuous development of society and the continuous improvement of people's living standards, the application of data processing electronic equipment is becoming more and more widespread. In particular, large-scale data processing electronic equipment will generate heat due to resistance loss, dielectric loss, and iron loss after working for a long time due to the effects of current and voltage. This will greatly affect the normal operation of the electronic equipment in data processing. At present, heat dissipation equipment (liquid cooling plate, blower, etc.) is usually installed on the market to dissipate heat from the electronic equipment and ensure its normal operation.
[0003] Publication No. CN212723913U discloses a heat dissipation structure for a data processing device, including a data processor body. The outer wall of the data processor body has an opening with a heat dissipation cover plate. A heat dissipation structure is connected to the heat dissipation cover plate, which is connected to the data processor body via a maintenance structure. The heat dissipation structure includes a circulation pump, a heat pipe, a cooling box, and a cooling component. The heat dissipation cover plate has a serpentine circulation groove inside. One end of the heat pipe is connected to one end of the circulation pump, and the other end is connected to one end of the circulation groove inside the heat dissipation cover plate. The other end of the circulation groove is connected to the cooling box. This device adopts a detachable water-cooled heat dissipation structure, which can effectively dissipate heat inside the data processor. However, in actual use, the above-mentioned device uses liquid cooling to dissipate heat from the data processing electronic device, which is relatively slow. Using only air cooling to dissipate heat from the data processing electronic device will result in dead air angles, leading to mediocre heat dissipation. Moreover, liquid cooling devices on the market usually require users to add cooling water or coolant every once in a while to ensure normal heat dissipation of the device, which is cumbersome and consumes a lot of resources, making it unfavorable for daily use. Summary of the Invention
[0004] In practical use, existing technologies have drawbacks. The liquid cooling method used in these devices is slow to dissipate heat from data processing electronic equipment, while air cooling alone results in poor heat dissipation due to dead airflow. Furthermore, commercially available liquid cooling devices typically require users to add cooling water or coolant periodically to ensure proper cooling, which is cumbersome and resource-intensive, hindering daily use. This invention provides a rapid cooling device for large electronic devices. This device combines liquid cooling from bottom to top with air cooling from top to bottom, improving both heat dissipation efficiency and effectiveness. The liquid cooling system continuously and cyclically cools the bottom of the electronic device. The device can be easily installed and fixed to electronic devices of various sizes, making it convenient for users.
[0005] To achieve the above objectives, the present invention provides the following technical solution: a rapid cooling device for large electronic equipment, comprising: a main body, a base plate, a control center, an opening and closing door, a handle, a cooling chamber, a first guardrail, a second guardrail, a first slide rail, a backing plate, a second slide rail, a fixed plate, a support column, a through hole, a telescopic rod, a locking tooth, an adjusting device, a rotating component, a first shaft, a gear, an adjusting wheel, a backing rod, a sliding rod, a liquid extraction device, a pump, a liquid extraction pipe, a transport pipe, a first solenoid valve, a cooling plate, a cooling chamber, a circulation pipe, a second solenoid valve, a first air cooler, a first air outlet, a split air outlet, a drive motor, a rotating shaft, a worm gear, a worm wheel, a second shaft, a screw, a movable rod, an internal threaded hole, a heat dissipation chamber, a second air cooler, a second air outlet, and a slider.
[0006] The positions and connections of the above structures are as follows: A rapid cooling device for large electronic equipment includes a main body, a cooling chamber, a liquid extraction device, and a cooling plate. The cooling chamber is fixedly connected to the bottom interior of the main body and contains cooling water. A liquid extraction pipe is fixedly connected to the right end surface of the cooling chamber. A liquid extraction device is installed at the end of the liquid extraction pipe away from the cooling chamber. A pump is fixedly connected inside the liquid extraction device. The end of the liquid extraction pipe near the pump is fixedly connected to the left end surface of the pump. A transport pipe is fixedly connected to the top output end of the pump. A first solenoid valve is fixedly connected to the outer surface of the transport pipe near the pump. A cooling plate is installed at the end of the transport pipe away from the pump. A cooling chamber is fixedly connected to the top layer of the cooling plate. The bottom of the cooling chamber is designed as a bridge-shaped arc. The cooling chamber is shaped like a container. The right end of the cooling chamber is fixedly connected to a transport pipe. A first cold air fan is installed at the bottom of the cooling chamber, and its bottom surface is fixedly connected to the inner bottom surface of the cooling plate. Several first air outlets are located at the end of the first cold air fan near the cooling chamber. Air distribution vents are fixedly connected to both ends of the first cold air fan. A circulation pipe is fixedly connected to the rear left side of the cooling chamber. A second solenoid valve is fixedly connected to the outer surface of the circulation pipe near the cooling chamber. The end of the circulation pipe away from the cooling chamber is fixedly connected to the rear left side of the cooling chamber. Electronic equipment is first installed on top of the cooling chamber using a backing plate and adjusting devices. When the electronic equipment dissipates heat during prolonged operation, cooling water inside the cooling chamber flows from the bottom of the electronic equipment to the top of the cooling chamber. The heat emitted is absorbed to produce a liquid cooling effect. During this process, the pump inside the pumping device is turned on by the control center. The pump draws out the cooling water, which has absorbed heat and increased in temperature, from the cooling chamber through the pumping pipe. The first solenoid valve is opened, and the heated cooling water is transported to the cooling chamber inside the cooling plate through the transport pipe. Due to the arched design at the bottom of the cooling chamber, the cooling water will first collect and accumulate on the right side of the arched bottom of the cooling chamber. Then, the first cold air fan is turned on by the control center. The first cold air fan blows cold air through the first air outlet to the bottom of the cooling chamber, thereby cooling the cooling water inside the cooling chamber. As the cooling water continues to accumulate, some of the cooling water will overflow to the arched bottom of the cooling chamber, relative to the flat surface. In terms of plate structure, the arc-shaped structure reduces the depth of the cooling water receiving the cooling water in the cooling chamber, allowing for faster cooling and improving the cooling efficiency after the cooling water temperature rises. As the cooling water accumulates at the arched bottom of the cooling chamber, it overflows to the left side of the arched bottom and opens the second solenoid valve. Under the influence of gravity (or with the assistance of a pump), the cooled water flows back into the cooling chamber through the circulation pipe to cool the electronic equipment. The cold air blown by the first air cooler is guided by the arched bottom of the cooling chamber to the left and right sides. Due to the thermal expansion and contraction of the cold air, it descends.The cooled air descends through the air vents to the interior of the main unit and the top of the electronic equipment, cooling the overall internal environment and providing a top-down cooling effect for the electronic equipment.
[0007] Preferably, a first guardrail is fixedly connected to both the left and right ends of the top surface of the cooling chamber, and a second guardrail is fixedly connected to the front and rear sides of the top surface of the cooling chamber. A first sliding groove is opened inside the second guardrail, which extends to the front and rear surfaces of the second guardrail. Several abutment plates are fixedly connected to the top surface of the cooling chamber to ensure the normal operation of the device.
[0008] Preferably, the abutment plate has a second sliding groove at one end near the first guardrail plate, extending into the interior of the abutment plate. A fixing plate is fixedly connected to the surface of the abutment plate away from the second guardrail plate. A support column is fixedly connected to the surface of the fixing plate away from the second guardrail plate, and the support column and the abutment plate are in the same plane. A through hole is opened at the end of the support column near the second guardrail plate, extending into the interior of the support column. A telescopic rod is provided at the end of the support column near the second guardrail plate, and the telescopic rod is sleeved inside the support column through the through hole. Several locking teeth are fixedly connected to the surface of the telescopic rod near the abutment plate. An installation area can be formed between the support column, the abutment plate, the abutment rod, and the fixing plate to install and place electronic equipment, ensuring the normal operation of the device.
[0009] Preferably, an adjustment device is provided at the end of the telescopic rod away from the abutment plate. A rotating component is rotatably connected to the bottom of the adjustment device, and a first shaft is fixedly connected to the top of the rotating component. A gear adapted to a locking tooth is fixedly connected to the outer surface of the end of the first shaft away from the rotating component. A through groove is provided at the end of the adjustment device near the telescopic rod, and the gear is engaged with the telescopic rod at the end near the telescopic rod through the through groove and the locking tooth. An adjustment wheel is fixedly connected to the top surface of the first shaft, and the adjustment wheel is located on the top outer surface of the adjustment device. When the electronic equipment is installed on top of the cooling chamber, the adjustment wheel is manually rotated clockwise. The adjustment wheel rotates, driving the gear to rotate via the first shaft. The gear rotates, driving the telescopic rod to extend from the support column through the through hole and move towards the second guardrail. The movement of the telescopic rod causes the abutment rod to move through the second slide groove and slide bar, increasing the area between the support column, abutment plate, abutment rod, and fixed plate. At this point, the electronic device can be placed smoothly. Then, the adjustment wheel is rotated counterclockwise, gradually decreasing the area between the support column, abutment plate, abutment rod, and fixed plate until the abutment rod is tightly fitted to the outer surface of the electronic device. Finally, the external fixing sleeve fixes the adjustment wheel.
[0010] Preferably, the end of the telescopic rod near the second guardrail is fixedly connected to an abutment rod, and the end of the abutment rod near the first sliding groove is fixedly connected to a sliding rod. The abutment rod is slidably connected to the abutment plate through the sliding rod and the second sliding groove, ensuring the normal operation of the device and facilitating user use.
[0011] Preferably, a base plate is fixedly connected to the bottom of the main body of the equipment, a control center is fixedly connected to the left front surface of the main body of the equipment, the control center is electrically connected to the pump and the first cold air fan, an opening and closing door is rotatably connected to the right front surface of the main body of the equipment, a handle is fixedly connected to the front surface of the opening and closing door, the base plate is used to support the main body of the equipment, and the opening and closing door is used to open or close when installing electronic equipment to expose or cover the cooling chamber and electronic equipment, so as to ensure the normal operation of the device.
[0012] Preferably, a drive motor is fixedly connected to the right side of the rear end of the main body of the device. A rotating shaft is fixedly connected to the front output end of the drive motor. A worm gear is fixedly connected to the end of the rotating shaft away from the drive motor. A worm wheel adapted to the worm gear is provided on the right side of the worm gear. A second shaft is rotatably connected to the inner wall of the left side of the main body of the device near the worm wheel. The end of the second shaft near the worm wheel is fixedly connected to the worm wheel. The worm wheel is meshed with the worm gear through the second shaft. When the device is used to dissipate heat from the electronic device, the drive motor is turned on by the control center. The drive motor turns the rotating shaft clockwise, which in turn turns the worm gear. The rotation of the worm gear drives the worm wheel to rotate through the shaft. This provides power for the device to move the heat dissipation chamber to the top of the electronic device and dissipate heat from top to bottom in a cool air environment, ensuring the normal operation of the device.
[0013] Preferably, a screw is fixedly connected to the end of the worm gear away from the second shaft, and a movable rod is provided at the end of the screw away from the worm gear. An internal threaded hole adapted to the screw is opened at the end of the movable rod near the screw. The screw is threadedly connected to the movable rod through the internal threaded hole. The rotation of the worm gear drives the screw to rotate, and the rotation of the screw drives the movable rod to make a linear motion away from the drive motor through the internal threaded hole, ensuring the normal operation of the device.
[0014] Preferably, a heat dissipation chamber is fixedly connected to the surface of the movable rod away from the screw. A second cold air fan is fixedly connected to the top of the heat dissipation chamber. The second cold air fan is electrically connected to the control center. When the movable rod moves, it causes the heat dissipation chamber to move outside the second guardrail via the slider and the first sliding groove, while simultaneously shielding the electronic equipment installed on the top of the heat dissipation chamber. Then, the control center turns on the second cold air fan, which blows cold air into the heat dissipation chamber through the second air outlet, causing the interior of the heat dissipation chamber to be filled with cold air, thus lowering the ambient temperature and cooling the electronic equipment from top to bottom.
[0015] Preferably, the top layer inside the heat dissipation chamber is fixedly connected with several second air outlets, and the front and rear surfaces of the end of the heat dissipation chamber near the cooling chamber are fixedly connected with sliders that are adapted to the first sliding groove. The heat dissipation chamber is slidably connected to the cooling chamber through the sliders, the first sliding groove and the second guardrail plate to ensure the normal operation of the device.
[0016] Beneficial effects:
[0017] 1. This rapid cooling device for large electronic equipment includes a main body, a cooling chamber, a liquid extraction device, and a cooling plate. Cooling water inside the cooling chamber absorbs heat emitted from the bottom of the electronic equipment from the top of the chamber, producing a liquid cooling effect. During this process, the pump inside the liquid extraction device is activated by the control center. The pump draws the heated cooling water from the cooling chamber through the extraction pipe. The first solenoid valve is then opened, and the heated cooling water is transported to the cooling plate via a transport pipe. Inside the cooling chamber, due to the arched, bridge-like design at the bottom, cooling water preferentially collects and accumulates on the right side of the arch. Then, the control center activates the first air cooler, which blows cold air through the first outlet towards the bottom of the cooling chamber, thus cooling the cooling water inside. As the cooling water accumulates, some overflows to the arched bottom of the cooling chamber. Compared to a flat structure, the arched structure reduces the depth of the cooling water receiving cooling within the chamber, allowing for faster cooling and improving the cooling efficiency after the cooling water temperature rises. As the cooling water from the arched, bridge-shaped bottom of the cooling chamber increases, it overflows into the left side of the arched bottom. The second solenoid valve then opens, and the cooled water, under the influence of gravity (or with an additional pump), flows back into the cooling chamber through a circulation pipe to cool the electronic equipment. This continuous circulation of cooling water effectively cools the bottom of the electronic equipment, conserving resources. When the first air cooler blows cold air from the arched bottom of the cooling chamber to cool the water, the cold air will... The arched bottom of the cooling chamber, guided by its arched structure, directs the blown cold air to the left and right sides of the bottom. Due to thermal expansion and contraction, the cold air descends and flows through the air vents to the interior of the main body of the equipment and the top of the electronic equipment, cooling the overall environment inside the main body of the equipment. This top-down cooling effect on the electronic equipment allows the device to simultaneously cool the electronic equipment from bottom to top using liquid cooling and top-down air cooling, improving the device's heat dissipation efficiency and effect, and facilitating daily use.
[0018] 2. This rapid cooling device for large electronic equipment works by manually rotating an adjusting wheel clockwise. The rotation of the adjusting wheel drives a gear through a first shaft, which in turn drives a telescopic rod through a through-hole to extend from the support column and move towards the second guardrail. The movement of the telescopic rod causes the abutment rod to move through the second slide groove and slide bar, increasing the area between the support column, abutment plate, abutment rod, and fixing plate. At this point, the electronic equipment can be placed smoothly. Subsequently, the adjusting wheel is rotated counterclockwise to gradually decrease the area between the support column, abutment plate, abutment rod, and fixing plate until the abutment rod is tightly fitted to the outer surface of the electronic equipment. Then, an external fixing sleeve secures the adjusting wheel. This device can install and fix electronic equipment of various sizes in a simple and user-friendly manner.
[0019] 3. This rapid cooling device for large electronic equipment has a heat dissipation chamber fixedly connected to the surface of the end of a movable rod away from the screw. A second cooling fan is fixedly connected to the top of the heat dissipation chamber. The second cooling fan is electrically connected to the control center. When the movable rod moves, it causes the heat dissipation chamber to move outside the second guardrail via a slider and a first sliding groove, simultaneously shielding the electronic equipment installed on top of the heat dissipation chamber. Then, the control center turns on the second cooling fan, which blows cold air through the second air outlet into the heat dissipation chamber, filling the chamber with cold air and lowering the ambient temperature. This provides cooling to the electronic equipment from top to bottom, allowing the device to continuously maintain a cold air environment while improving its heat dissipation effect, ensuring normal operation of the device, and facilitating user operation. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the external structure of a rapid cooling device for large electronic devices according to the present invention.
[0021] Figure 2 This is a rear view schematic diagram of a rapid cooling device for large electronic devices according to the present invention.
[0022] Figure 3 This is a schematic diagram of the internal structure of a rapid cooling device for large electronic devices according to the present invention.
[0023] Figure 4 This is a schematic diagram of the liquid pumping device structure of a rapid cooling device for large electronic devices according to the present invention.
[0024] Figure 5 This is a schematic diagram of a heat sink structure for a rapid cooling device for large electronic devices according to the present invention.
[0025] Figure 6 This is a schematic diagram of the support plate structure of a rapid cooling device for large electronic devices according to the present invention;
[0026] Figure 7 This is a schematic diagram of the structure of a rapid cooling device adjustment device for large electronic devices according to the present invention;
[0027] Figure 8 This is a schematic diagram of the drive motor structure for a rapid cooling device for large electronic devices according to the present invention.
[0028] Figure 9 This is a schematic diagram of a heat dissipation chamber structure for a rapid cooling device for large electronic devices according to the present invention.
[0029] Figure 10 This is a schematic diagram of the control center operation process structure of a rapid cooling device for large electronic devices according to the present invention.
[0030] In the diagram: 1. Main body of the equipment; 10. Base plate; 11. Control center; 12. Opening door; 120. Handle; 2. Cooling chamber; 20. First guardrail; 21. Second guardrail; 210. First slide rail; 22. Abutment plate; 220. Second slide rail; 23. Fixing plate; 24. Support column; 240. Through hole; 241. Telescopic rod; 242. Clamping tooth; 25. Adjusting device; 250. Rotating component; 251. First shaft; 252. Gear; 253. Adjusting wheel; 26. Abutment rod; 260. Slide rod; 3. 1. Liquid extraction device; 30. Pump; 31. Liquid extraction pipe; 32. Transport pipe; 320. First solenoid valve; 4. Cooling plate; 40. Cooling chamber; 400. Circulation pipe; 401. Second solenoid valve; 41. First air cooler; 410. First air outlet; 42. Air distribution port; 5. Drive motor; 50. Rotating shaft; 51. Worm gear; 52. Worm wheel; 520. Second shaft; 53. Screw; 54. Movable rod; 540. Internal threaded hole; 6. Heat dissipation chamber; 60. Second air cooler; 61. Second air outlet; 62. Slider. Detailed Implementation
[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0032] Example 1
[0033] Please see Figure 1-10A rapid cooling device for large electronic equipment includes a main body 1, a cooling chamber 2, a liquid extraction device 3, and a cooling plate 4. The cooling chamber 2 is fixedly connected to the bottom inside the main body 1. The cooling chamber 2 is filled with cooling water. A liquid extraction pipe 31 is fixedly connected to the right end surface of the cooling chamber 2. The liquid extraction device 3 is located at the end of the liquid extraction pipe 31 away from the cooling chamber 2. A pump 30 is fixedly connected inside the liquid extraction device 3. The end of the liquid extraction pipe 31 near the pump 30 is fixedly connected to the left end surface of the pump 30. A transport pipe 32 is fixedly connected to the top output end of the pump 30. A first solenoid valve 320 is fixedly connected to the outer surface of the transport pipe 32 near the pump 30. A cooling plate 4 is located at the end of the transport pipe 32 away from the pump 30. A cooling chamber 40 is fixedly connected to the top layer inside the cooling plate 4. The bottom of the cooling chamber 40 is designed as a bridge-shaped arc. The right end surface of the cooling chamber 40 is fixedly connected to the transport pipe 32. A first air cooler 41 is installed at the bottom of the cooling chamber 40. The bottom surface of the first air cooler 41 is fixedly connected to the inner bottom surface of the cooling plate 4. Several first air outlets 410 are provided at the end of the first air cooler 41 near the cooling chamber 40. Air distribution ports 42 are fixedly connected to both the left and right ends of the first air cooler 41. A circulation pipe 400 is fixedly connected to the left rear end surface of the cooling chamber 40. A second solenoid valve 401 is fixedly connected to the outer surface of the end of the circulation pipe 400 near the cooling chamber 40. The end of the circulation pipe 400 away from the cooling chamber 40 is connected to the left rear end surface of the cooling chamber 2. In a fixed connection, the electronic device is first installed on top of the cooling chamber 2 using components such as the abutment plate 22 and the adjustment device 25. When the electronic device dissipates heat during long-term operation, the cooling water inside the cooling chamber 2 absorbs the heat dissipated by the electronic device from the bottom of the electronic device, producing a liquid cooling effect. During this process, the pump 30 inside the pumping device 3 is turned on by the control center 11. The pump 30 starts and draws the cooling water that has absorbed heat and caused the temperature to rise from inside the cooling chamber 2 through the pumping pipe 31. The first solenoid valve 320 is opened and the heated cooling water is transported to the cooling chamber 40 inside the cooling plate 4 through the transport pipe 32. Due to the bridge-shaped arc design at the bottom of the cooling chamber 40, the cooling water will preferentially... Cooling water accumulates and gathers inside the right side of the arc-shaped bottom of the cooling chamber 40. Then, the first cooling fan 41 is activated by the control center 11, blowing cold air through the first air outlet 410 towards the bottom of the cooling chamber 40 to cool the cooling water inside. As the cooling water accumulates, some overflows to the arched bottom of the cooling chamber 40. Compared to a flat structure, the arc-shaped structure reduces the depth of the cooling water receiving cooling within the cooling chamber 40, allowing for faster cooling and improving cooling efficiency after the cooling water temperature rises. As the amount of cooling water cooled at the arched bottom of the cooling chamber 40 increases, the cooled water overflows to the left side of the arched bottom of the cooling chamber 40.The second solenoid valve 401 is opened, and the cooled water, after being cooled, flows back into the cooling chamber 2 through the circulation pipe 400 under the action of gravity (an additional pump 30 can be added for auxiliary injection) to cool and dissipate heat from the electronic equipment. This allows the cooling water inside the device to circulate and continuously liquid cool the bottom of the electronic equipment, saving resources while cooling. When the first air cooler 41 blows cold air from the bridge-shaped arc bottom of the cooling chamber 40 to cool the cooling water, the cold air blown by the first air cooler 41 will follow the bridge-shaped arc bottom of the cooling chamber 40. Guided by the structure, the blown cold air is directed to the left and right sides of the bottom of the cooling chamber 40. Due to thermal expansion and contraction, the cold air descends, and then flows through the air distributor 42 to the interior of the main body 1 and the top of the electronic equipment, cooling the overall environment inside the main body 1. This top-down cooling effect on the electronic equipment provides a cooling effect, allowing the device to simultaneously cool the electronic equipment from bottom to top using liquid cooling and from top to bottom air cooling, improving the device's heat dissipation efficiency and effect, and facilitating daily use.
[0034] Example 2
[0035] Please see Figure 1-7 Furthermore, based on Embodiment 1, a first guardrail plate 20 is fixedly connected to both the left and right ends of the top surface of the cooling chamber 2, and a second guardrail plate 21 is fixedly connected to the front and rear sides of the top surface of the cooling chamber 2. A first sliding groove 210 is provided inside the second guardrail plate 21, and the first sliding groove 210 extends to the front and rear surfaces of the second guardrail plate 21. Several abutment plates 22 are fixedly connected to the top surface of the cooling chamber 2 to ensure the normal operation of the device.
[0036] A second sliding groove 220 is provided at one end of the abutment plate 22 near the first guardrail plate 20. The second sliding groove 220 extends into the interior of the abutment plate 22. A fixing plate 23 is fixedly connected to the surface of the abutment plate 22 away from the second guardrail plate 21. A support column 24 is fixedly connected to the surface of the fixing plate 23 away from the second guardrail plate 21, and the support column 24 and the abutment plate 22 are in the same plane. A through hole 240 is provided at one end of the support column 24 near the second guardrail plate 21. The through hole 240 extends into the interior of the support column 24. A telescopic rod 241 is provided at one end of the support column 24 near the second guardrail plate 21. The telescopic rod 241 is sleeved inside the support column 24 through the through hole 240. Several locking teeth 242 are fixedly connected to the surface of the telescopic rod 241 near the abutment plate 22. An installation area can be formed between the support column 24, the abutment plate 22, the abutment rod 26 and the fixing plate 23 to install and place electronic equipment to ensure the normal operation of the device.
[0037] An adjusting device 25 is provided at the end of the telescopic rod 241 away from the abutment plate 22. A rotating component 250 is rotatably connected to the bottom of the adjusting device 25. A first shaft 251 is fixedly connected to the top of the rotating component 250. A gear 252, matching the locking teeth 242, is fixedly connected to the outer surface of the end of the first shaft 251 away from the rotating component 250. A through groove is provided at the end of the adjusting device 25 near the telescopic rod 241. The end of the gear 252 near the telescopic rod 241 is connected to the telescopic rod 241 through the through groove and the locking teeth 242. An adjusting wheel 253 is fixedly connected to the top surface of the first shaft 251. The adjusting wheel 253 is located on the top outer surface of the adjusting device 25. When the electronic equipment is installed on the top of the cooling chamber 2, the adjusting wheel 253 is manually rotated clockwise. The rotation of the adjusting wheel 253 drives the first shaft 251. Gear 252 rotates, and the rotation of gear 252 drives telescopic rod 241 to extend from support column 24 through through hole 240 and move towards second guardrail 21 via clip 242. The movement of telescopic rod 241 drives abutment rod 26 to move through second slide groove 220 and slide rod 260, thereby increasing the area between support column 24, abutment plate 22, abutment rod 26 and fixing plate 23. At this time, electronic equipment can be placed smoothly. Then, similarly, the adjusting wheel 253 is rotated counterclockwise to gradually decrease the area between support column 24, abutment plate 22, abutment rod 26 and fixing plate 23 until abutment rod 26 is tightly attached to the outer surface of electronic equipment. Then, the external fixing sleeve fixes the adjusting wheel 253, so that the device can install and fix electronic equipment of various sizes in a simple way, which is convenient for users.
[0038] An abutment rod 26 is fixedly connected to one end of the telescopic rod 241 near the second guardrail 21. A slide rod 260 is fixedly connected to one end of the abutment rod 26 near the first slide groove 210. The abutment rod 26 is slidably connected to the abutment plate 22 through the slide rod 260 and the second slide groove 220, ensuring the normal operation of the device and facilitating user use.
[0039] Example 3
[0040] Please see Figure 1-10 Furthermore, based on Embodiment 2, a base plate 10 is fixedly connected to the bottom of the main body 1, and a control center 11 is fixedly connected to the left front surface of the main body 1. The control center 11 is electrically connected to the pump 30 and the first air cooler 41. An opening and closing door 12 is rotatably connected to the right front surface of the main body 1, and a handle 120 is fixedly connected to the front surface of the opening and closing door 12. The base plate 10 is used to support the main body 1, and the opening and closing door 12 is used to open or close when installing electronic equipment to expose or cover the cooling chamber 2 and electronic equipment, ensuring the normal operation of the device.
[0041] A drive motor 5 is fixedly connected to the right side of the rear end of the main body 1. A rotating shaft 50 is fixedly connected to the front output end of the drive motor 5. A worm gear 51 is fixedly connected to the end of the rotating shaft 50 away from the drive motor 5. A worm wheel 52 adapted to the worm gear 51 is provided on the right side of the worm gear 51. A second shaft 520 is rotatably connected to the inner wall of the left side of the main body 1 near the worm wheel 52. The end of the second shaft 520 near the worm wheel 52 is fixedly connected to the worm wheel 52. The worm wheel 52 is meshed with the worm gear 51 through the second shaft 520. When the device is used to dissipate heat from the electronic equipment, the drive motor 5 is turned on by the control center 11. The drive motor 5 turns the rotating shaft 50 clockwise. The rotation of the rotating shaft 50 drives the worm gear 51 to rotate. The rotation of the worm gear 51 drives the worm wheel 52 to rotate through the shaft. This provides power for the device to move the heat dissipation chamber 6 to the top of the electronic equipment and dissipate heat from top to bottom in a cool air environment, ensuring the normal operation of the device.
[0042] A screw 53 is fixedly connected to the end of the worm gear 52 away from the second shaft 520. A movable rod 54 is provided at the end of the screw 53 away from the worm gear 52. An internal threaded hole 540 adapted to the screw 53 is opened at the end of the movable rod 54 near the screw 53. The screw 53 is threadedly connected to the movable rod 54 through the internal threaded hole 540. The rotation of the worm gear 52 drives the screw 53 to rotate. The rotation of the screw 53 drives the movable rod 54 to make a linear motion away from the drive motor 5 through the internal threaded hole 540, ensuring the normal operation of the device.
[0043] A heat dissipation chamber 6 is fixedly connected to the surface of the movable rod 54 away from the screw 53. A second cooling fan 60 is fixedly connected to the top of the heat dissipation chamber 6. The second cooling fan 60 is electrically connected to the control center 11. When the movable rod 54 moves, it causes the heat dissipation chamber 6 to move outside the second guardrail 21 via the slider 62 and the first sliding groove 210, while simultaneously shielding the electronic equipment installed on the top of the heat dissipation chamber 2. Then, the control center 11 turns on the second cooling fan 60, which blows cold air into the heat dissipation chamber 6 through the second air outlet 61. This causes the heat dissipation chamber 6 to be filled with cold air, creating a cold air environment that lowers the temperature. This process cools the electronic equipment from top to bottom, allowing the device to continuously maintain a cold air environment while improving the device's heat dissipation effect, ensuring the normal operation of the device, and facilitating user operation.
[0044] Several second air outlets 61 are fixedly connected to the top layer inside the heat dissipation chamber 6. The front and rear surfaces of the end of the heat dissipation chamber 6 near the cooling chamber 2 are fixedly connected to sliders 62 that are compatible with the first slide groove 210. The heat dissipation chamber 6 is slidably connected to the cooling chamber 2 through the sliders 62, the first slide groove 210 and the second guardrail 21 to ensure the normal operation of the device.
[0045] It should be noted that: Embodiment 1 and Embodiment 3 are independent embodiments but with different implementation methods. Both can achieve rapid cooling of the electronic equipment inside the main body 1. In Embodiment 1, the cooling water inside the device can circulate and continuously cool the bottom of the electronic equipment with liquid cooling, saving resources while cooling. This allows the device to cool the electronic equipment from bottom to top with liquid cooling and from top to bottom with air cooling, improving the heat dissipation efficiency and effect of the device. In Embodiment 3, the heat dissipation chamber 6 can continuously maintain a cold air environment to cool the electronic equipment while improving the heat dissipation effect of the device. The two can be used interchangeably.
[0046] Working principle: When electronic devices generate heat during prolonged operation, the cooling water inside the cooling chamber 2 absorbs the heat emitted by the electronic devices from the bottom, producing a liquid cooling effect. During this process, the control center 11 activates the pump 30 inside the pumping device 3. The pump 30 draws the cooling water, which has absorbed heat and caused its temperature to rise, out of the cooling chamber 2 through the pumping pipe 31. The first solenoid valve 320 is then opened, and the heated cooling water is transported to the cooling chamber 40 inside the cooling plate 4 via the transport pipe 32. Due to the bridge-shaped arc design at the bottom of the cooling chamber 40, the cooling water will preferentially flow to the right side of the arc at the bottom of the cooling chamber 40. The cooling water accumulates and gathers inside the cooling chamber 40. Then, the control center 11 activates the first cooling fan 41, which blows cold air through the first air outlet 410 to the bottom of the cooling chamber 40, thereby cooling the cooling water inside. As the cooling water accumulates, some overflows to the arched bottom of the cooling chamber 40. Compared to a flat structure, the arched structure reduces the depth of the cooling water receiving cooling within the cooling chamber 40, allowing for faster cooling and improving cooling efficiency after the water temperature rises. As the amount of cooling water cooled at the arched bottom of the cooling chamber 40 increases, the cooled water overflows to the arched bottom of the cooling chamber 40. Inside the left side of the arc-shaped bottom, the bridge-shaped arc design separates the uncooled, cooling, and cooled water for different processes, while simultaneously dispersing cold air to the air distribution port 42 to cool the electronic equipment. Cooling water overflows from the right side as the water level rises, flowing into the arc-shaped area and then to the left side. The second solenoid valve 401 opens, and the cooled water, under the influence of gravity (or with the assistance of a pump 30), flows back into the cooling chamber 2 through the circulation pipe 400 to cool the electronic equipment. This allows the cooling water inside the device to circulate continuously, providing liquid cooling to the bottom of the electronic equipment. This cooling process saves resources while cooling. The first air cooler 41 blows out... When cold air cools the cooling water from the arched bottom of the cooling chamber 40, the cold air will be dispersed and guided to the left and right sides of the bottom of the cooling chamber 40 under the guidance of the arched structure. Due to the thermal expansion and contraction, the cold air will descend and fall through the air distribution port 42 to the inside of the main body 1 and the top of the electronic equipment, thus cooling the overall environment inside the main body 1. The air cooling effect is generated by the top-down heat dissipation of the electronic equipment. This allows the device to cool the electronic equipment from the bottom up with liquid cooling and from the top down with air cooling, improving the heat dissipation efficiency and effect of the device and making it convenient for users to use in daily life.
[0047] When installing the electronic device on top of the cooling chamber 2, manually rotate the adjusting wheel 253 clockwise. The rotation of the adjusting wheel 253 drives the gear 252 to rotate via the first shaft 251. The rotation of the gear 252 drives the telescopic rod 241 to extend from the support column 24 through the through hole 240 and move towards the second guardrail 21. The movement of the telescopic rod 241 drives the abutment rod 26 to move through the second slide groove 220 and the slide rod 260, thereby increasing the area between the support column 24, the abutment plate 22, the abutment rod 26 and the fixing plate 23. At this time, the electronic device can be placed smoothly in it. Then, similarly, rotate the adjusting wheel 253 counterclockwise to gradually decrease the area between the support column 24, the abutment plate 22, the abutment rod 26 and the fixing plate 23 until the abutment rod 26 is tightly attached to the outer surface of the electronic device. Then, the external fixing sleeve fixes the adjusting wheel 253, so that the device can install and fix electronic devices of various sizes and the fixing method is simple and convenient for users.
[0048] When using this device to dissipate heat from electronic devices, the control center 11 activates the drive motor 5, which in turn rotates the rotating shaft 50 clockwise. The rotation of the rotating shaft 50 drives the worm gear 51 to rotate, which in turn drives the worm wheel 52 to rotate via the shaft. The rotation of the worm wheel 52 drives the screw 53 to rotate, which in turn drives the movable rod 54 to move linearly away from the drive motor 5 via the internal threaded hole 540. The movement of the movable rod 54 causes the heat dissipation chamber 6 to move outside the second guardrail 21 via the slider 62 and the first sliding groove 210, while simultaneously shielding the electronic devices mounted on top of the cooling chamber 2. Then, the control center 11 activates the second cold air fan 60, which blows cold air through the second air outlet 61 into the heat dissipation chamber 6. This fills the heat dissipation chamber 6 with cold air, lowering the ambient temperature and dissipating heat from top to bottom. This allows the device to continuously maintain a cold air environment while cooling the electronic devices, improving the device's heat dissipation effect, ensuring the normal operation of the device, and facilitating user operation.
[0049] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A rapid cooling device for large electronic equipment, comprising a main body (1), a cooling chamber (2), a liquid extraction device (3), and a cooling plate (4), characterized in that: A cooling chamber (2) is fixedly connected to the bottom of the main body (1) of the equipment. The cooling chamber (2) is filled with cooling water. A liquid extraction pipe (31) is fixedly connected to the right end surface of the cooling chamber (2). A liquid extraction device (3) is provided at the end of the liquid extraction pipe (31) away from the cooling chamber (2). A pump (30) is fixedly connected inside the liquid extraction device (3). The end of the liquid extraction pipe (31) near the pump (30) is fixedly connected to the left end surface of the pump (30). A transport pipe (32) is fixedly connected to the top output end of the pump (30). A first solenoid valve (320) is fixedly connected to the end of the transport pipe (32) near the pump (30). A cooling plate (4) is provided at the end of the transport pipe (32) away from the pump (30). A cooling chamber (40) is fixedly connected to the top layer inside the cooling plate (4). The bottom of the cooling chamber (40) is set as a bridge-shaped arc. The right end surface of the cooling chamber (40) is fixedly connected to the transport pipe (32). Next, a first air cooler (41) is provided at the bottom of the cooling chamber (40). The bottom surface of the first air cooler (41) is fixedly connected to the inner bottom surface of the cooling plate (4). Several first air outlets (410) are provided at one end of the first air cooler (41) near the cooling chamber (40). Air distribution ports (42) are fixedly connected at both ends of the first air cooler (41). A circulation pipe (400) is fixedly connected to the left rear end surface of the cooling chamber (40). A second solenoid valve (401) is fixedly connected to the outer surface of the end of the circulation pipe (400) near the cooling chamber (40). The end of the circulation pipe (400) away from the cooling chamber (40) is fixedly connected to the left rear end surface of the cooling chamber (2). The electronic equipment is installed on the top of the cooling chamber (2). The main body of the equipment (1) can cool the electronic equipment from bottom to top by liquid cooling in the cooling chamber (2) and cool the electronic equipment from top to bottom by air cooling through the first air cooler (41).
2. The rapid cooling device for large electronic devices according to claim 1, characterized in that: The top surface of the cooling chamber (2) is fixedly connected to the left and right ends of the first guardrail plate (20), and the front and rear sides of the top surface of the cooling chamber (2) are fixedly connected to the second guardrail plate (21). The second guardrail plate (21) has a first sliding groove (210) inside, which extends to the front and rear surfaces of the second guardrail plate (21). The top surface of the cooling chamber (2) is fixedly connected to several abutment plates (22).
3. A rapid cooling device for large electronic devices according to claim 2, characterized in that: The abutment plate (22) has a second groove (220) at one end near the first guardrail plate (20), the second groove (220) extending into the interior of the abutment plate (22). A fixing plate (23) is fixedly connected to the surface of the abutment plate (22) away from the second guardrail plate (21), and a support column (24) is fixedly connected to the surface of the fixing plate (23) away from the second guardrail plate (21), and the support column (24) and the abutment plate (22) are in the same plane. A through hole (240) is provided at one end of the support post (24) near the second guardrail (21). The through hole (240) extends into the interior of the support post (24). A telescopic rod (241) is provided at one end of the support post (24) near the second guardrail (21). The telescopic rod (241) is sleeved inside the support post (24) through the through hole (240). Several locking teeth (242) are fixedly connected to the surface of the telescopic rod (241) near the abutment plate (22).
4. A rapid cooling device for large electronic devices according to claim 3, characterized in that: An adjustment device (25) is provided at the end of the telescopic rod (241) away from the abutment plate (22). A rotating part (250) is rotatably connected to the bottom of the adjustment device (25). A first shaft (251) is fixedly connected to the top of the rotating part (250). A gear (252) that matches the locking tooth (242) is fixedly connected to the outer surface of the end of the first shaft (251) away from the rotating part (250). A through groove is provided at the end of the adjustment device (25) near the telescopic rod (241). The end of the gear (252) near the telescopic rod (241) is meshed with the telescopic rod (241) through the through groove and the locking tooth (242). An adjustment wheel (253) is fixedly connected to the top surface of the first shaft (251). The adjustment wheel (253) is located on the top outer surface of the adjustment device (25).
5. A rapid cooling device for large electronic devices according to claim 4, characterized in that: The telescopic rod (241) is fixedly connected to a stop rod (26) at one end near the second guardrail (21), and a slide rod (260) is fixedly connected to one end of the stop rod (26) near the first slide groove (210). The stop rod (26) is slidably connected to the stop plate (22) through the slide rod (260) and the second slide groove (220).
6. A rapid cooling device for large electronic devices according to claim 1, characterized in that: The bottom of the main body of the equipment (1) is fixedly connected to a base plate (10), and a control center (11) is fixedly connected to the left front surface of the main body of the equipment (1). The control center (11) is electrically connected to the pump (30) and the first air cooler (41). An opening and closing door (12) is rotatably connected to the right front surface of the main body of the equipment (1), and a handle (120) is fixedly connected to the front surface of the opening and closing door (12).
7. A rapid cooling device for large electronic devices according to claim 6, characterized in that: A drive motor (5) is fixedly connected to the right side of the rear end of the main body of the equipment (1). A rotating shaft (50) is fixedly connected to the front output end of the drive motor (5). A worm (51) is fixedly connected to the end of the rotating shaft (50) away from the drive motor (5). A worm wheel (52) adapted to the worm (51) is provided on the right side of the worm (51). A second shaft (520) is rotatably connected to the inner wall of the left side of the main body of the equipment (1) near the worm wheel (52). The end of the second shaft (520) near the worm wheel (52) is fixedly connected to the worm wheel (52). The worm wheel (52) is meshed with the worm (51) through the second shaft (520).
8. A rapid cooling device for large electronic devices according to claim 7, characterized in that: The end of the worm gear (52) away from the second shaft (520) is fixedly connected to a screw (53). The end of the screw (53) away from the worm gear (52) is provided with a movable rod (54). The end of the movable rod (54) near the screw (53) is provided with an internal thread hole (540) that is compatible with the screw (53). The screw (53) is threadedly connected to the movable rod (54) through the internal thread hole (540).
9. A rapid cooling device for large electronic devices according to claim 8, characterized in that: The surface of the movable rod (54) away from the screw (53) is fixedly connected to a heat dissipation chamber (6), and the top of the heat dissipation chamber (6) is fixedly connected to a second air cooler (60). The second air cooler (60) is electrically connected to the control center (11).
10. A rapid cooling device for large electronic devices according to claim 9, characterized in that: The heat dissipation chamber (6) has several second air outlets (61) fixedly connected to the top layer inside. The front and rear surfaces of the heat dissipation chamber (6) near the cooling chamber (2) are fixedly connected to sliders (62) that are compatible with the first slide groove (210). The heat dissipation chamber (6) is slidably connected to the cooling chamber (2) through the sliders (62), the first slide groove (210), and the second guardrail (21).