A diamond semi-cured sheet for polishing pad, and a method of manufacturing and using the same

Abstract

The application discloses a kind of diamond prepreg for polishing pad and its preparation method and application, the prepreg includes substrate and diamond semi-solid layer, by weight fraction, the preparation material of diamond semi-solid layer includes solid epoxy resin 35-55 parts, epoxy resin containing unsaturated double bond 20-40 parts, dicyandiamide curing agent 1.5-10 parts, imidazole 0.05-1 part, photoinitiator 0.6-1.2 parts, diamond micro powder 15-25 parts, silicon nitride micro powder 20-30 parts, alumina whisker 2-7 parts, talc powder 2-7 parts, auxiliary agent 0.5-3 parts, epoxy resin containing unsaturated double bond has the number of C=C functional group 1, the number of epoxy functional group is 1-5.The diamond prepreg is the semi-solid product obtained by photocuring, has good storage period and softening point, further curing has good hardness and wear resistance, the diamond prepreg is used for the preparation of polishing pad, can realize efficient continuous production, need not repeat mixing, pulping, printing and other procedures, can improve production efficiency and reduce cost.

Description

Technical Field

[0001] This invention relates to the field of abrasive material preparation technology, and in particular to a diamond prepreg for abrasive pads, its preparation method, and its application. Background Technology

[0002] With the advancement of technology, high-strength and high-hardness materials are increasingly widely used in fields such as electronics, military, and aerospace. However, high-hardness and high-wear-resistant materials such as high-strength glass, alumina ceramics, aluminum nitride ceramics, and titanium alloys have long faced difficulties in processing and low processing efficiency. Ordinary polishing powder processing methods can no longer meet the needs of large-scale industrial applications. Therefore, diamond polishing pads have emerged, offering superior polishing results.

[0003] Currently, the main production methods for diamond polishing pads include direct photocuring and direct thermo-pressing. However, both methods suffer from high equipment investment and poor continuous production capabilities. Chinese patent CN114952608A discloses a method for preparing photocurable diamond polishing pads. This method uses a photo-cationic curing epoxy resin approach, but the short shelf life after mixing the cationic catalyst and epoxy resin leads to significant waste in actual production. Furthermore, this method involves numerous steps, making large-scale manufacturing difficult. For example, Chinese patent CN115890479A discloses a diamond polishing pad using gravure screen printing to produce patterns. However, the diamond slurry used requires prolonged curing at a heated temperature before molding and demolding, resulting in low production efficiency. Summary of the Invention

[0004] Based on the above, one of the objectives of this invention is to provide a diamond prepreg for abrasive pads, which has a good semi-cured state. Using this diamond prepreg for the preparation of diamond abrasive pads allows for efficient and continuous production of diamond abrasive pads without the need for repeated mixing, pulping, printing, and other processes, and can produce abrasive pads with excellent hardness and wear resistance.

[0005] To achieve the above objectives, the present invention provides a diamond prepreg for abrasive pads, comprising a substrate and a diamond prepreg layer disposed on the surface of the substrate. By weight, the materials used to prepare the diamond prepreg layer include 35-55 parts of solid epoxy resin, 20-40 parts of epoxy resin containing unsaturated double bonds, 1.5-10 parts of dicyandiamide curing agent, 0.05-1 part of imidazole, 0.6-1.2 parts of photoinitiator, 15-25 parts of diamond micropowder, 20-30 parts of silicon nitride micropowder, 2-7 parts of alumina whiskers, 2-7 parts of talc, and 0.5-3 parts of additives.

[0006] Among them, epoxy resins containing unsaturated double bonds have 1 C=C functional group and 1-5 epoxy functional groups.

[0007] It should be noted that the diamond prepreg for the abrasive pad of the present invention is a semi-cured product obtained by photocuring. It uses epoxy resin containing unsaturated double bonds as the free radical photocurable matrix resin. Because the epoxy resin containing unsaturated double bonds has one C=C functional group and 1-5 epoxy functional groups, it has a good shelf life and softening point, and after further curing, it exhibits good hardness and wear resistance. If the number of C=C functional groups exceeds one (e.g., functional groups are 2, 3, 4, etc.), a semi-cured state cannot be formed. Furthermore, if the aforementioned photocurable resin molecule structure lacks epoxy functional groups, the free radical resin and epoxy resin have poor compatibility, resulting in low strength and poor wear resistance of the cured material.

[0008] In some embodiments, the substrate is selected from any one of PET film, fiberglass cloth, nonwoven fabric, and paper-based phenolic cloth. A diamond prepreg is prepared by coating a diamond prepreg layer onto the substrate surface and then curing it with ultraviolet light.

[0009] In some embodiments, the softening point of the solid epoxy resin is in the range of 60°C to 120°C, and more preferably, the softening point of the solid epoxy resin is in the range of 70°C to 85°C.

[0010] In some embodiments, the solid epoxy resin is selected from at least one of o-cresol epoxy, phenolic epoxy, biphenyl epoxy, dicyclopentadiene epoxy, biphenyl phenolic epoxy, aralkyl phenolic epoxy, hydrogenated bisphenol A epoxy, bisphenol F epoxy, bisphenol A phenolic epoxy, poly[(2-epoxyethylene)-1,2-cyclohexanediol]2-ethyl-2-(hydroxymethyl)-1,3-propanediol ether, and dicyclopentadiene diester. As an example, the solid epoxy resin may be o-cresol epoxy or biphenyl phenolic epoxy, but is not limited thereto; it may also be a mixture of hydrogenated bisphenol A epoxy and bisphenol F epoxy.

[0011] In some embodiments, the epoxy resin containing unsaturated double bonds is selected from at least one of glycidyl methacrylate, 1,2-epoxy-4-vinylcyclohexane, and 3,4-epoxycyclohexylmethyl methacrylate. As an example, the epoxy resin containing unsaturated double bonds is glycidyl methacrylate or 3,4-epoxycyclohexylmethyl methacrylate, but is not limited thereto, and may also be a mixture of glycidyl methacrylate and 1,2-epoxy-4-vinylcyclohexane.

[0012] In some embodiments, the dicyandiamide curing agent is a dicyandiamide powder curing agent, and further, the particle size D50 of the dicyandiamide powder is in the range of 1-20 μm.

[0013] Imidazole, acting as a catalyst for epoxy and dicyandiamide curing, can lower the curing temperature of the prepreg and shorten the curing time. In some embodiments, the imidazole is selected from at least one of 2-methylimidazolium, 2-ethyl-4-methylimidazolium, 2-phenylimidazolium, undecylimidazolium, and cyanoimidazolium.

[0014] In some embodiments, the photoinitiator is a free radical photoinitiator. Further, the photoinitiator is selected from one or more of 2-hydroxy-2-methyl-1-phenylpropanone, 1-hydroxycyclohexylphenyl ketone, 2-methyl-2-(4-morpholino)-1-[4-(methylthio)phenyl]-1-propanone, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, ethyl 2,4,6-trimethylbenzoylphenylphosphonate, and 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]-1-propanone.

[0015] In some embodiments, the average particle size D50 of the diamond powder is 5-100 micrometers. For example, the average particle size D50 of the diamond powder may be, but is not limited to, 5 micrometers, 10 micrometers, 15 micrometers, 20 micrometers, 25 micrometers, 30 micrometers, 50 micrometers, 70 micrometers, or 100 micrometers.

[0016] In some embodiments, the average particle size D50 of silicon nitride micro powder is less than 100 micrometers. The addition of silicon nitride can assist grinding and improve grinding efficiency. For example, the average particle size D50 of silicon nitride micro powder is 1-100 micrometers. For instance, the average particle size D50 of silicon nitride micro powder can be, but is not limited to, 5 micrometers, 10 micrometers, 15 micrometers, 20 micrometers, 25 micrometers, 30 micrometers, 50 micrometers, 70 micrometers, or 100 micrometers.

[0017] In some embodiments, the diameter of the alumina whiskers is 0.5-1 micrometer and the length is 8-25 micrometers. Because the alumina whiskers are elongated structures, they can form bridging bonds with the diamond powder and silicon nitride powder in the prepreg, thereby improving the thermal conductivity of the system and effectively releasing the heat generated during grinding.

[0018] In some embodiments, the average particle size D50 of talc is less than 50 micrometers. For example, the average particle size D50 of talc is 1-50 micrometers. The flake-like properties of talc provide a good lubrication effect, and adding it to the semi-cured sheet can improve the roughness uniformity after polishing.

[0019] In some embodiments, the additives include, but are not limited to, wetting agents, dispersants, coupling agents, defoamers, and thixotropic agents. Wetting agents can improve the compatibility between the powder and the resin; as an example, polyammonium salt wetting agents are preferred. Coupling agents can improve the bonding strength between the powder and the resin and improve wear resistance; as an example, aminosilane coupling agents and epoxysilane coupling agents are preferred. Defoamers are preferably polyether silicone oils. Thixotropic agents can increase the static viscosity of the slurry and ensure the uniformity of the coating thickness; as an example, nano-silica, bentonite, and polyamide wax are preferred.

[0020] Accordingly, the present invention also provides a method for preparing the above-mentioned diamond prepreg for abrasive pads, comprising the following steps:

[0021] (1) After drying diamond micro powder, silicon nitride micro powder, alumina whiskers and talc powder, they are mixed and then additives are added and mixed to obtain a powder mixture.

[0022] (2) Heat and stir the solid epoxy resin and the epoxy resin containing unsaturated double bonds until the solid epoxy resin dissolves, then add dicyandiamide curing agent and continue stirring to obtain the resin prepolymer.

[0023] (3) Mix and stir the resin prepolymer, imidazole and additives, then add the powder mixture and continue stirring to obtain a premix. Ball mill the premix to obtain diamond slurry.

[0024] (4) The diamond slurry is degassed under vacuum and then coated onto the substrate surface. The substrate coated with the diamond slurry is then photocured under ultraviolet light to obtain a diamond precured sheet.

[0025] In some embodiments, in step (4), the coating thickness is 0.5 mm or less, and multiple coatings and repeated exposures can be performed to obtain a thickness of more than 0.5 mm, but this is not the limitation.

[0026] In some embodiments, the wavelength of the ultraviolet light in step (4) is 320-400 nm, but is not limited thereto.

[0027] Accordingly, the present invention also provides an application of the aforementioned diamond prepreg in a grinding pad. As an example, the diamond prepreg is placed in a mold, pressed in a vacuum hot press, and after demolding, the semi-finished product is placed in an oven for heating and curing to obtain a diamond grinding pad. Therefore, using this diamond prepreg in the preparation of grinding pads allows for efficient and continuous production of diamond grinding pads, eliminating the need for repeated mixing, pulping, and printing processes, thus improving production efficiency and reducing costs.

[0028] Traditional methods for preparing diamond grinding pads often employ screen printing, requiring repeated coating, pressing, and curing steps before each curing process. The biggest drawback of this method is its difficulty in continuous production, resulting in high costs and low efficiency for large-scale manufacturing. To address these issues, this invention first prepares a diamond prepreg. Subsequent diamond grinding pad preparation only requires hot pressing for shaping, simplifying the process, reducing energy consumption, and enabling efficient and continuous production of diamond grinding pads without the need for repeated mixing, pulping, and printing processes. Detailed Implementation

[0029] The following will describe the concept and technical effects of the present invention clearly and completely with reference to embodiments, so as to fully understand the purpose, features and effects of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are all within the scope of protection of the present invention.

[0030] Example 1

[0031] A method for preparing a diamond prepreg includes the following steps:

[0032] (1) Dry powder processing: Two parts of alumina whiskers with a diameter of 0.5 μm and a length of 10 μm are provided, as well as 15 parts of diamond micro powder, 20 parts of silicon nitride micro powder, and 2 parts of talc powder with average particle sizes D50 of 10 μm, 50 μm, and 25 μm respectively. After drying these materials in an oven at 100°C for 5 hours, they are sieved through a 200-mesh sieve. After sieving, they are poured into a V-type mixer in proportion, and 0.25 parts of coupling agent 6040 and 0.5 parts of wetting agent W903 are added. The mixture is mixed for 2 hours to obtain a powder mixture.

[0033] (2) Preparation of resin prepolymer: 35 parts of o-cresol epoxy 704 and 20 parts of 3,4-epoxycyclohexylmethyl methacrylate were added to a heated stirrer, the temperature was raised to 100°C, the stirring was turned on, and the resin was stirred until it was completely dissolved. 1.5 parts of dicyandiamide powder were added and the stirring was continued for 30 minutes to obtain the resin prepolymer.

[0034] (3) Slurry premixing: 56.5 parts of resin prepolymer, 0.05 parts of methylimidazole, 0.6 parts of 184 initiator, 0.5 parts of defoamer BYK-530, and 0.5 parts of polyamide wax thixotropic agent 6650 are added to a mechanical stirrer and stirred at room temperature for 30 minutes. After stirring evenly, the above powder mixture is added and stirring is continued for 2 hours. The stirred premix is ​​placed in a wet ball mill and ball milled for 30 minutes to obtain diamond slurry.

[0035] (4) Coating and drying: After vacuum degassing, the diamond slurry is uniformly coated onto the PET film by scraping. The coating thickness is 0.5 mm. Then, it is cured for 20 seconds under 500W power 365nm ultraviolet light to obtain a diamond prepreg.

[0036] Example 2

[0037] A method for preparing a diamond prepreg includes the following steps:

[0038] (1) Dry powder processing: Seven parts of alumina whiskers with a diameter of 0.7 μm and a length of 20 μm, and 25 parts of diamond micro powder, 30 parts of silicon nitride micro powder, and 7 parts of talc powder with average particle sizes D50 of 100 μm, 90 μm, and 40 μm respectively are provided. After drying these materials in an oven at 100°C for 5 hours, they are sieved through a 100-mesh sieve. After sieving, they are poured into a V-type mixer in proportion, and 0.25 parts of coupling agent 6040 and 0.5 parts of wetting agent W903 are added. The mixture is mixed for 1 hour to obtain a powder mixture.

[0039] (2) Preparation of resin prepolymer: 55 parts of o-cresol epoxy 704 and 40 parts of glycidyl methacrylate were added to a heated stirrer, the temperature was raised to 100°C, the stirring was turned on, and the resin was stirred until it was completely dissolved. 10 parts of dicyandiamide powder were added and the stirring was continued for 30 minutes to obtain the resin prepolymer.

[0040] (3) Slurry premixing: 96.5 parts of resin prepolymer, 1 part of methylimidazole, 1.2 parts of 1173 initiator, 0.5 parts of defoamer BYK-530 and 0.5 parts of polyamide wax thixotropic agent 6650 are added to a mechanical stirrer and stirred at room temperature for 30 minutes. After stirring evenly, the above powder mixture is added and stirring is continued for 2 hours. The stirred premix is ​​placed in a wet ball mill and ball milled for 30 minutes to obtain diamond slurry.

[0041] (4) Coating and drying: After vacuum degassing, the diamond slurry is uniformly coated onto the PET film by scraping. The coating thickness is 0.5 mm. Then, it is cured for 20 seconds under 500W power 365nm ultraviolet light to obtain a diamond prepreg.

[0042] Example 3

[0043] A method for preparing a diamond prepreg includes the following steps:

[0044] (1) Dry powder processing: Five parts of alumina whiskers with a diameter of 1 μm and a length of 25 μm are provided, and 20 parts of diamond micro powder, 25 parts of silicon nitride micro powder and 5 parts of talc powder with average particle sizes D50 of 25 μm, 40 μm and 20 μm are provided. After drying these materials in an oven at 100℃ for 5 hours, they are sieved through a 100-mesh sieve. After sieving, they are poured into a V-type mixer in proportion, and 0.5 parts of coupling agent 6040 and 0.5 parts of wetting agent W903 are added. After mixing for 1 hour, a powder mixture is obtained.

[0045] (2) Preparation of resin prepolymer: 40 parts of o-cresol epoxy 704 and 30 parts of glycidyl methacrylate were added to a heated stirrer, the temperature was raised to 100°C, the stirring was turned on, and the resin was stirred until it was completely dissolved. 5 parts of dicyandiamide powder were added and the stirring was continued for 30 minutes to obtain the resin prepolymer.

[0046] (3) Slurry premixing: 75 parts of resin prepolymer, 0.3 parts of methylimidazole, 0.8 parts of 1173 initiator, 0.5 parts of defoamer BYK-530 and 0.5 parts of polyamide wax thixotropic agent 6650 are added to a mechanical stirrer and stirred at room temperature for 30 minutes. After stirring evenly, the above powder mixture is added and stirring is continued for 2 hours. The stirred premix is ​​placed in a wet ball mill and ball milled for 30 minutes to obtain diamond slurry.

[0047] (4) Coating and drying: After vacuum degassing, the diamond slurry is uniformly coated onto the PET film by scraping. The coating thickness is 0.5 mm. Then, it is cured for 20 seconds under 500W power 365nm ultraviolet light to obtain a diamond prepreg.

[0048] Example 4

[0049] A method for preparing a diamond prepreg includes the following steps:

[0050] (1) Dry powder processing: Five parts of alumina whiskers with a diameter of 0.8 μm and a length of 18 μm, and 20 parts of diamond micro powder, 25 parts of silicon nitride micro powder, and 5 parts of talc powder with average particle sizes D50 of 25 μm, 40 μm, and 20 μm respectively are provided. After drying these materials in an oven at 100°C for 5 hours, they are sieved through a 100-mesh sieve. After sieving, they are poured into a V-type mixer in proportion, and 0.5 parts of coupling agent 6040 and 0.5 parts of wetting agent W903 are added. After mixing for 1 hour, a powder mixture is obtained.

[0051] (2) Preparation of resin prepolymer: 40 parts of biphenyl epoxy NC-3000 and 30 parts of glycidyl methacrylate were added to a heated stirrer, the temperature was raised to 100°C, the stirring was turned on, and the resin was stirred until it was completely dissolved. 5 parts of dicyandiamide powder were added and the stirring was continued for 30 minutes to obtain the resin prepolymer.

[0052] (3) Slurry premixing: 75 parts of resin prepolymer, 0.3 parts of cyanoimidazole, 0.8 parts of 1173 initiator, 0.5 parts of defoamer BYK-530 and 0.5 parts of polyamide wax thixotropic agent 6650 are added to a mechanical stirrer and stirred at room temperature for 30 minutes. After stirring evenly, the above powder mixture is added and stirring is continued for 2 hours. The stirred premix is ​​placed in a wet ball mill and ball milled for 30 minutes to obtain diamond slurry.

[0053] (4) Coating and drying: After vacuum degassing, the diamond slurry is uniformly coated onto the PET film by scraping. The coating thickness is 0.5 mm. Then, it is cured for 20 seconds under 500W power 365nm ultraviolet light to obtain a diamond prepreg.

[0054] Comparative Example 1

[0055] Comparative Example 1 is basically the same as Example 1, except that in the preparation of the resin prepolymer, diallyl bisphenol A epoxy is used to replace glycidyl methacrylate in Example 1. The rest is the same as Example 1 and will not be described here.

[0056] Comparative Example 2

[0057] Comparative Example 2 is basically the same as Example 4, except that IBOA isobornyl acrylate is used instead of glycidyl methacrylate in Example 4 in the preparation of the resin prepolymer in Comparative Example 2. The rest is the same as Example 4 and will not be described here.

[0058] Comparative Example 3

[0059] Comparative Example 3 is basically the same as Example 1, except that methylimidazole was used in step (3) of Example 1, while methylimidazole was not used in step (3) of Comparative Example 3. The rest is the same as Example 1 and will not be described here.

[0060] The grinding pads prepared in the examples and comparative examples were tested for softening point and shelf life using diamond prepregs, and the results are shown in Table 1.

[0061] The abrasive pads prepared in the examples and comparative examples were cured with diamond prepregs at 150°C for 2 hours, and their hardness and wear resistance were tested. The results are shown in Table 1.

[0062] Softening point: Data obtained using a Mettler softening point tester.

[0063] Storage period: Data at 25°C until the gelation time is reduced to half of the initial time.

[0064] Hardness: Data was obtained by using a Shore D hardness tester after pressing and curing at 150℃ for 2 hours.

[0065] Abrasion resistance: Test data obtained by processing the same number of high borosilicate glass workpieces.

[0066] Table 1 Performance Tests

[0067]

[0068] As shown in Table 1, compared to Comparative Examples 1 and 2, Examples 1-4 all exhibited good semi-cured state, and after further curing, they possessed good wear resistance and hardness. Comparative Example 1, due to the use of a bifunctional allyl epoxy resin, formed a non-melting three-dimensional cross-linked compound after UV curing, losing its semi-cured properties. Comparative Example 2 used IBOA, which lacked epoxy groups; the IBOA cured product had poor compatibility with the epoxy resin in the system, affecting wear resistance and hardness. Comparative Example 3, due to the absence of imidazole, showed insufficient reaction during the pressing and curing of the semi-cured sheet, resulting in poor strength, wear resistance, and hardness.

[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, it is not limited to those listed in the embodiments. Those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A diamond prepreg for use in abrasive pads, characterized in that, The material comprises a substrate and a diamond semi-cured layer disposed on the surface of the substrate. By weight, the diamond semi-cured layer comprises 35-55 parts solid epoxy resin, 20-40 parts epoxy resin containing unsaturated double bonds, 1.5-10 parts dicyandiamide curing agent, 0.05-1 part imidazole, 0.6-1.2 parts photoinitiator, 15-25 parts diamond micropowder, 20-30 parts silicon nitride micropowder, 2-7 parts alumina whiskers, 2-7 parts talc, and 0.5-3 parts additives. The epoxy resin containing unsaturated double bonds has 1 C=C functional group and 1-5 epoxy functional groups.

2. The diamond prepreg for abrasive pads according to claim 1, characterized in that, The softening point of the solid epoxy resin is in the range of 60℃-120℃.

3. The diamond prepreg for abrasive pads according to claim 2, characterized in that, The solid epoxy resin is selected from at least one of o-cresol epoxy resin, phenolic epoxy resin, biphenyl epoxy resin, dicyclopentadiene epoxy resin, biphenyl phenolic epoxy, aralkyl phenolic epoxy resin, hydrogenated bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol A phenolic epoxy resin, poly[(2-epoxyethylene)-1,2-cyclohexanediol] 2-ethyl-2-(hydroxymethyl)-1,3-propanediol ether, and dicyclopentadiene diester.

4. The diamond prepreg for abrasive pads according to claim 1, characterized in that, The epoxy resin containing unsaturated double bonds is selected from at least one of glycidyl methacrylate, 1,2-epoxy-4-vinylcyclohexane, and 3,4-epoxycyclohexylmethyl methacrylate.

5. The diamond prepreg for abrasive pads according to claim 1, characterized in that, The imidazole is selected from at least one of 2-methylimidazolium, 2-ethyl-4-methylimidazolium, 2-phenylimidazolium, undecylimidazolium, and cyanoimidazolium.

6. The diamond prepreg for abrasive pads according to claim 1, characterized in that, The photoinitiator is selected from one or more of 2-hydroxy-2-methyl-1-phenylpropanone, 1-hydroxycyclohexylphenyl ketone, 2-methyl-2-(4-morpholino)-1-[4-(methylthio)phenyl]-1-propanone, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, ethyl 2,4,6-trimethylbenzoylphenylphosphonate, and 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]-1-propanone.

7. The diamond prepreg for abrasive pads according to claim 1, characterized in that, It includes at least one of the following features (a) to (b): (i) The average particle size D50 of the diamond micro powder is 5-100 micrometers; (ii) The average particle size D50 of the silicon nitride micro powder is less than 100 micrometers; (iii) The diameter of the alumina whiskers is 0.5-1 micrometer and the length is 8-25 micrometers; (iv) The average particle size D50 of the talc powder is less than 50 micrometers.

8. The diamond prepreg for abrasive pads according to claim 1, characterized in that, The additives include at least one of wetting agents, dispersants, coupling agents, defoamers, and thixotropic agents.

9. A method for preparing a diamond prepreg for an abrasive pad according to any one of claims 1-8, characterized in that, Including the following steps: (1) After drying diamond micro powder, silicon nitride micro powder, alumina whiskers and talc powder, they are mixed and then additives are added to mix them to obtain a powder mixture; (2) Heat and stir the solid epoxy resin and the epoxy resin containing unsaturated double bonds until the solid epoxy resin dissolves, then add dicyandiamide curing agent and continue stirring to obtain the resin prepolymer. (3) Mix and stir the resin prepolymer, imidazole and additives, then add the powder mixture and continue stirring to obtain a premix. Ball mill the premix to obtain diamond slurry. (4) The diamond slurry is vacuum degassed and then coated on the substrate surface. The substrate coated with the diamond slurry is photocured under ultraviolet light to obtain a diamond semi-cured sheet.

10. The application of a diamond prepreg for abrasive pads as described in any one of claims 1-8 in abrasive pads.

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