Display panel

Abstract

The embodiment of the present application provides a display panel. The display panel comprises a display area, a non-display area, a binding area in the non-display area, a binding terminal arranged in the binding area, and a chip on film. The binding terminal comprises two-dimensionally arranged sub-terminals, the sub-terminals which are continuous in a first direction are connected to a same signal source and form a terminal group, and the terminal groups are arranged at intervals in a second direction. In the embodiment of the present application, the terminal group comprises a first binding terminal and a second binding terminal, the first binding terminal and the second binding terminal are arranged as corresponding terminal group structures, so that the relative area of the alignment and bonding is increased, and the precision and quality of the binding and the comprehensive performance of the panel are effectively improved.

Description

Technical Field

[0001] This invention relates to the field of display panel design and manufacturing technology, and more particularly to a display panel. Background Technology

[0002] With the development of display panel manufacturing technology, people have put forward higher requirements for the display effect and overall performance of display panels.

[0003] A properly functioning display panel and device are typically assembled and tested from multiple different functional components to form a usable device. Commonly, the internal components of such a display device include a display component and a driving component. The display component and driving component are electrically connected, with the display component providing driving control signals to the driving component. When connecting the display component and driving component, they are usually bonded together, such as using the existing Chip on Filmor Flex (COF) bonding technology. COF bonding works well for rigid materials like the driving component and display component, ensuring the bonding terminals of the two components align and bond effectively. However, when applying COF bonding technology to flexible components, such as flexible panels and flexible circuit boards, these flexible components are prone to bending or deformation. When bonding them, the bonding terminals between the two different flexible components are easily misaligned after bending or deformation, resulting in a smaller contact area and bonding failure, leading to unsatisfactory bonding performance. This reduces the reliability of the display panel and display device, hindering further improvement in the overall performance of the device. Summary of the Invention

[0004] This invention provides a display panel that effectively improves upon the problem of unsatisfactory bonding effect between bonding terminals when bonding flexible display panels and devices in the prior art.

[0005] To address the aforementioned technical problems, embodiments of the present invention provide a display panel, comprising:

[0006] Display area, non-display area, and binding area located in the non-display area;

[0007] A binding terminal is disposed in the binding area;

[0008] The flip-chip film is electrically connected to the bonding region via the bonding terminals;

[0009] The binding terminal includes sub-terminals arranged in a two-dimensional dot matrix. In a first direction, the consecutive sub-terminals are connected to the same signal source and form a terminal group. In a second direction, the terminal groups are spaced apart.

[0010] According to an embodiment of the present invention, the terminal group includes a first bonding terminal disposed on the display substrate of the display panel, and a second bonding terminal disposed opposite to the first bonding terminal on the flip-chip film. The first bonding terminal on the display substrate and the second bonding terminal on the flip-chip film are electrically bonded together, and the bonding area is greater than or equal to 3500 square micrometers.

[0011] According to one embodiment of the present invention, the area of ​​the first bonding terminal on the display substrate is greater than or equal to the area of ​​the second bonding terminal on the flip-chip film.

[0012] According to one embodiment of the present invention, both the first bonding terminal on the display substrate and the second bonding terminal on the flip-chip film are configured as rectangular structures.

[0013] According to one embodiment of the present invention, the rectangular structure of the first bonding terminal includes two first sides and two second sides arranged opposite to each other, and the rectangular structure of the second bonding terminal includes two third sides and two fourth sides arranged opposite to each other. The length of the first side is L1, the length of the second side is L2, the length of the third side is L3, and the length of the fourth side is L4.

[0014] The area of ​​the bond is K, where K satisfies the following formula,

[0015] K=[L3+(L1-L3) / 2-γ-M1]*[L4+(L2-L4) / 2-η-M2],

[0016] Wherein, γ is the alignment accuracy of the first binding terminal and the second binding terminal in the first direction, η is the alignment accuracy of the first binding terminal and the second binding terminal in the second direction, M1 is the expansion / contraction deviation of the third side, and M2 is the expansion / contraction deviation of the fourth side.

[0017] According to an embodiment of the present invention, the first bonding terminal on the display substrate and the second bonding terminal on the flip-chip film are both arranged in an array in the first direction;

[0018] In the same row along the first direction, the distance between adjacent first bonding terminals is S1, where M1≤S1+(L1-L3) / 2;

[0019] In the same column along the second direction, the distance between two adjacent first bonding terminals is S2, where M2≤S2+(L2-L4) / 2.

[0020] According to one embodiment of the present invention, the ratios of L2 / L1 and L4 / L3 are both in the range of 1 to 3.

[0021] According to one embodiment of the present invention, the first direction is perpendicular to the second direction; wherein,

[0022] The first side and the third side are arranged parallel to the first direction;

[0023] The second side and the fourth side are arranged parallel to the second direction.

[0024] According to one embodiment of the present invention, S2 is 18um to 22um, and the distance between two adjacent second bonding terminals is S3, where S3 is 23um to 27um.

[0025] According to one embodiment of the present invention, in the same column along the second direction, the projection portions of the second bonding terminals of two adjacent rows along the first direction overlap in the second direction.

[0026] According to one embodiment of the present invention, each of the sub-terminals includes a lead wire, and the leads of the sub-terminals in the same column along the second direction are led out from the same side, and the leads are electrically connected to the display area.

[0027] According to a second aspect of the present invention, a display device is also provided, the display device including the display panel provided in the embodiments of the present application.

[0028] The beneficial effects of this invention are as follows: Compared with the prior art, this application provides a display panel. The display panel includes a display area, a non-display area, a bonding area within the non-display area, bonding terminals disposed within the bonding area, and a flip-chip film. The bonding terminals include sub-terminals arranged in a two-dimensional dot matrix. In a first direction, consecutive sub-terminals are connected to the same signal source and form a terminal group. In a second direction, the terminal groups are spaced apart. In this application embodiment, the terminal group includes a first bonding terminal and a second bonding terminal. By setting the first bonding terminal and the second bonding terminal as corresponding terminal group structures, the relative bonding area is increased during alignment and bonding, effectively improving the bonding accuracy, bonding quality, and overall panel performance. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 A schematic diagram of a display device bonding structure provided in the prior art;

[0031] Figure 2 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0032] Figure 3 This is a schematic diagram showing the structure and arrangement of the second bonding terminal provided in the embodiments of this application;

[0033] Figure 4 This is a schematic diagram of the first and second binding terminals provided in the embodiments of this application during alignment binding;

[0034] Figure 5 This is a schematic diagram illustrating the binding effect of some rectangular structure binding terminals provided in the embodiments of this application. Detailed Implementation

[0035] The following description, in conjunction with the accompanying drawings of the embodiments of the present invention, provides different implementation methods or examples to realize different structures of the present invention. To simplify the present invention, the components and arrangements of specific examples are described below. Furthermore, the various specific processes and materials provided in the present invention are examples that those skilled in the art will recognize for the application of other processes. All other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present invention.

[0036] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0037] Flexible display devices are widely used in various display fields due to their ability to bend or deform to a certain extent. However, in the fabrication of these flexible devices, bonding is typically required to enable the transmission of control signals. For example... Figure 1 As shown, Figure 1This is a schematic diagram of the bonding structure of a display device provided in the prior art. When two different components are electrically connected by the flip-chip film 203, the terminals 101 on the COF are usually set as vertical strip structures. However, when the vertical strip terminals 101 are aligned and bonded, the flexible panel may bend or deform, resulting in bonding failure and other bonding problems, which is not conducive to further improving the overall performance of the device.

[0038] This application provides a display panel that improves the bonding structure within the device to enhance its bonding effect and improve the overall quality and performance of the device.

[0039] like Figures 2-3 As shown, Figure 2 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Figure 3 This is a schematic diagram illustrating the structure and arrangement of the second bonding terminal provided in this embodiment. Specifically, the display panel includes a flip-chip film 203 and a flexible circuit board 201. The display panel and the flexible circuit board 201 are respectively disposed on opposite sides of the flip-chip film 203 and electrically connected through the flip-chip film 203. In the following embodiments, the display panel and circuit board are described using a flexible display panel and a flexible circuit board as examples, respectively.

[0040] Specifically, when the display panel is bonded to the flexible circuit board 201, the display panel also includes a display substrate 202. For example, if the display substrate is an array substrate, different traces are set on the display substrate 202 to realize the transmission of control signals and ensure the normal operation of the display panel.

[0041] Furthermore, the display substrate 202 includes a display area, a non-display area, and a bonding area 205 located within the non-display area and near its edge. Within the bonding area 205, a bonding structure 206 is provided on the display substrate 202. In this embodiment, to achieve better bonding between the display substrate 202 and the flip-chip film 203, a plurality of sub-terminals 40 are provided within the bonding structure 206. The sub-terminals 40 are arranged in a two-dimensional dot matrix, such as a two-dimensional array. The sub-terminals 40 are connected to the same signal source and form a terminal group 50.

[0042] When setting the aforementioned sub-terminals 40 and their corresponding terminal groups 50, each sub-terminal 40 includes a first bonding terminal 2061 disposed on the display substrate 202, and a second bonding terminal 2041 disposed on the flip-chip film 203 and bonded to the first bonding terminal. Thus, the first bonding terminal 2061 and the second bonding terminal 2041 form a terminal group, thereby enabling the transmission of electrical signals between different film layers. In the following embodiments, Figure 2The diagram only shows the arrangement of the first bonding terminal 2061 on the display substrate. Since the second bonding terminal on the flip-chip film forms a terminal group with the first bonding terminal, the structure of the second bonding terminal can be set with reference to the first bonding terminal.

[0043] In this embodiment, the first bonding terminal 2061 and the second bonding terminal 2041 can both be disposed along the first direction X, and arrayed at corresponding positions on the display substrate and the flip-chip film. See details. Figure 2 The first direction X and the second direction Y are defined by a certain angle between them. For example, the first direction X can be set to a horizontal direction and the second direction Y can be set to a vertical direction. The first direction X and the second direction Y are perpendicular to each other.

[0044] In this embodiment, within the two-dimensional area formed by the first direction X and the second direction Y, since each sub-terminal 40 is independent of the others, after the first binding terminal 2061 and the second binding terminal 2041 corresponding to the sub-terminal 40 are aligned and bound to form a terminal group, the adjacent terminal groups are also independent of each other. This effectively avoids the problem of misalignment of one terminal group affecting the binding of other terminal groups during the binding process, effectively avoids the problem of mutual interference between different bound terminals, improves the binding yield, and ensures the normal operation of the display panel.

[0045] In the following embodiments, when the first binding terminal 2061 and the second binding terminal 2041 are configured, the first binding terminal 2061 and the second binding terminal 2041 correspond one-to-one and are electrically connected. Furthermore, when configuring the structure of the first binding terminal and the second binding terminal, both the first binding terminal and the second binding terminal are described using a rectangular structure as an example.

[0046] Furthermore, the rectangular structure includes a long side and a short side. The ratio between the length of the long side and the short side is set between 1 and 3, such as the long side being twice the width of the rectangular structure, thus ensuring a large contact and connection area between the bonding terminals. Simultaneously, it effectively prevents the bonding effect between other bonding terminals from being affected if one bonding terminal fails. Optionally, the first bonding terminal 2061 and the second bonding terminal 2041 can also be set as circular, elliptical, regular, or irregular polygonal shapes, etc., which will not be elaborated further here.

[0047] like Figure 4 As shown, Figure 4 This is a schematic diagram of the first binding terminal and the second binding terminal provided in the embodiments of this application during alignment binding.

[0048] For the rectangular structure corresponding to the first binding terminal 2061, the first binding terminal 2061 includes two first sides L1 and two second sides L2 arranged opposite to each other. The first sides L1 are parallel to the first direction X, and the second sides L2 are parallel to the second direction Y. For example, the first sides L1 may be sides ab and cd of the rectangular structure, and the first sides L1 and the third side L3 are the shorter sides, while the second sides L2 and the fourth side L4 are the longer sides.

[0049] For the rectangular structure corresponding to the second bonding terminal 2041, the second bonding terminal 2041 includes two oppositely arranged third sides L3 and two oppositely arranged fourth sides L4. The third sides L3 are parallel to the first direction X, and the fourth sides L4 are parallel to the second direction Y. Simultaneously, the first side L1 is parallel to the third side L3, and the second side L2 is parallel to the fourth side L4. This forms... Figure 4 The binding structure in the middle.

[0050] In this embodiment, to ensure the bonding effect between the first bonding terminal and the second bonding terminal, the ratio L2 / L1 between the second side L2 and the first side L1 is set to 1 to 3, and the corresponding ratio L4 / L3 between the fourth side L4 and the third side L3 is set to 1 to 3. This ensures the bonding effect between different bonding terminals.

[0051] Furthermore, in this embodiment of the application, when binding the first binding terminal 2061 and the second binding terminal 2041, the overlapping binding area between them is K. This binding area K satisfies the following formula:

[0052] K=[L3+(L1-L3) / 2-γ-M1]*[L4+(L2-L4) / 2-η-M2].

[0053] Because the flexible film layer itself undergoes flexible deformation during bonding to the flexible substrate, resulting in expansion and contraction, and factors such as alignment accuracy errors of the bonding terminals also play a role in the bonding process. Therefore, when determining the overlap area K after bonding, it is necessary to consider the above-mentioned influencing factors to obtain an accurate overlap area K.

[0054] Specifically, in this embodiment, when determining the overlapping area K, γ is the alignment accuracy of the first binding terminal 2061 and the second binding terminal 2041 in the first direction X, η is the alignment accuracy of the first binding terminal 2061 and the second binding terminal 2041 in the second direction, M1 is the expansion / contraction deviation of the third side L3, and M2 is the expansion / contraction deviation of the fourth side L4. Thus, the overlapping area K after binding is accurately calculated using the above formula.

[0055] Furthermore, for different bonding terminals to achieve a better bonding effect, the corresponding bonding overlap area K needs to be greater than or equal to 3500 square micrometers.

[0056] See details Figure 5 In this embodiment, the lengths of different sides of the first and second bonding terminals are controlled, such as the first side L1 = 105 μm, the third side L3 = 95 μm, the second side L2 = 105 μm, and the fourth side L4 = 95 μm. Furthermore, the specific values ​​of γ and η can be selected differently depending on the type of device. For example, in this embodiment, the alignment accuracy γ is 8.06 micrometers, and the alignment accuracy η is 20 micrometers. The calculated overlap area is then:

[0057] K = [95 + (105 - 95) / 2 - 8.06 - M1] * [95 + (105 - 95) / 2 - 20 - M2] ≥ 3500 square micrometers.

[0058] Generally, the expansion and contraction deviation of the third and fourth sides of the second bonding terminal 2041 is 8 micrometers, and the value of the overlapping area K is 6044 square micrometers, which is much greater than 3500 square micrometers, thus effectively ensuring the bonding effect after different bonding terminals are bonded.

[0059] like Figure 5 As shown, Figure 5 This is a schematic diagram illustrating the binding effect of some rectangular structure binding terminals provided in the embodiments of this application. Combined with... Figure 4 In the structure described in this application embodiment, the first binding terminal and the second binding terminal are arranged in an array in the first direction and the second direction, and are bound accordingly.

[0060] In the same row along the first direction X, the distance between two adjacent first binding terminals 2061 is S1;

[0061] In the same column along the second direction Y, the distance between two adjacent first binding terminals 2061 is S2.

[0062] In this embodiment, the distance S1 is set to 23 μm to 27 μm, and the distance S2 is set to 18 μm to 22 μm. Optionally, the distance S1 is 25 μm and the distance S2 is 20 μm.

[0063] Furthermore, when calculating the overlap area K after the bonding terminals are bonded, considering the expansion and contraction deviation of the second bonding terminals on the flexible film layer, in order to ensure the corresponding bonding accuracy of the first bonding terminal 2061 and the second bonding terminal 2041, and to prevent the second bonding terminals 2041 in one row or column from being bonded to the first bonding terminals 2061 in an adjacent row or column due to their size expansion and contraction, in this embodiment, the expansion and contraction deviation M1 of the third side of the second bonding terminal 2041 is: M1≤S1+(L1-L3) / 2, and the expansion and contraction deviation M2 of the fourth side of the second bonding terminal 2041 is: M2≤S2+(L2-L4) / 2. This ensures that the first bonding terminal 2061 and the second bonding terminal 2041 are correspondingly bonded, improving the bonding accuracy.

[0064] For further details, please see Figure 3 as well as Figure 5 The binding structure in the middle is such that the first binding terminal and the second binding terminal are correspondingly set. Therefore, the arrangement and shape of the first binding terminal are the same as or similar to the second binding terminal, and it is applicable to different flexible panels. It will not be described in detail here.

[0065] Furthermore, the second bonding terminals 2041 are arrayed along the first and second directions. Each second bonding terminal 2041 includes a main body 301 and a lead 302. The main body 301 primarily handles bonding between different bonding terminals, while the lead 302 primarily handles signal transmission. During installation, the lead 302 extends from the left side of the main body 301 and towards the other side of the flip-chip film. For example, after extending from the second bonding terminal 2041, the lead 302 extends below the flip-chip film 203 and electrically connects to the LED test bonding terminal on the flip-chip film 203, thereby establishing connectivity within the flip-chip film's internal circuitry. The corresponding lead of the first bonding terminal also extends from the same side and is electrically connected to the display area of ​​the display panel to transmit control signals.

[0066] Specifically, when setting the aforementioned leads 302, in the same column, the leads 302 extend from the same side of the main body 301, such as from the left side of each second bonding terminal 2041, and extend towards the flexible circuit board. In this embodiment, the leads 302 extend from the intersection of the two sides of the second bonding terminals 2041. In this way, the lead-out end of the leads 302 can be directly connected to the intersection of the second bonding terminals 2041, reducing unnecessary connection points and thereby improving the display quality of the display panel.

[0067] Furthermore, each lead 302 can be spaced apart and arranged in parallel. For example, in each binding terminal, the lead 302 is aligned with the side edge 402 on the left side of the main body 301 and extends downward. In two different second binding terminals, the lead 302 is parallel to the first side edge of the other main body 301.

[0068] See details Figure 3 Since the lead wire 302 originates from the same side of the second bonding terminal 2041, in the same column, the second terminal 2041 near the bottom needs to be shifted to the right to provide clearance and wiring space for the lead wire 302. In this embodiment, the horizontal distance between the first sides of the second bonding terminals 2041 in adjacent rows is the same.

[0069] Thus, in this column, from top to bottom, the second bonding terminal 2041 in the first row to the second bonding terminal in the last row is equivalent to moving the second bonding terminal 2041 in the first row to the right by the same distance. Optionally, the distance between two adjacent leads in the same column can be considered as the distance moved, wherein the distance between two adjacent leads is set to 10um to 20um, see details. Figure 5 In this configuration, the distance between two adjacent leads is 15 micrometers, ultimately forming the arrangement structure shown in the embodiments of this application.

[0070] Optionally, the moving distance between two adjacent second bonding terminals 2041 in the same column can also be set to be different. Specifically, it can be set according to the needs of different products and the size of the flip-chip film, which will not be elaborated here.

[0071] In this embodiment of the application, when setting the above-mentioned multiple different second binding terminals 2041, in the same column, the corresponding projection portions of the second binding terminals 2041 in adjacent rows on the same side overlap, such as at the bottom horizontal position of the second binding terminal 2041. Specifically, in the first column, the projection of the second binding terminal 2041 in the first row in the second direction Y overlaps with the projection portion of the second binding terminal 2041 in the second row in the second direction Y.

[0072] Furthermore, in this embodiment, each first binding terminal 2061 can be configured with the same size structure, and each second binding terminal 2041 can be configured with the same size structure, wherein the rectangular area of ​​the second binding terminal 2041 is smaller than the rectangular area of ​​the first binding terminal 2061. See details. Figure 3 After bonding, the second bonding terminal 2041 is completely located within the entire area of ​​the first bonding terminal 2061, thus ensuring a high bonding effect.

[0073] Furthermore, in this embodiment, when setting the first bonding terminal 2061 and the second bonding terminal 2041 corresponding to the display substrate and the flexible circuit board, the second bonding terminal on the flexible circuit board 2041 can also be symmetrically arranged relative to the center line of the bonding area, thereby ensuring that both sides of the area have the same contact effect. Simultaneously, when setting the second bonding terminal, the leads corresponding to each column can all be arranged on the same side, or the leads corresponding to odd-numbered columns can be arranged on the left side of the bonding terminal, while the leads corresponding to even-numbered columns can be arranged on the right side of the bonding terminal. In this way, by arranging the leads in different columns on different sides, the leads in different areas can be arranged more rationally, thereby improving the bonding performance and wiring effect. Further details are omitted here.

[0074] Specifically, to ensure the bonding effect between bonding terminals of different sizes, after bonding, the sides of the smaller second bonding terminal are equidistant from the sides of the corresponding first bonding terminal. That is, the second bonding terminal 2041 is symmetrically arranged within the first bonding terminal 2061, thereby improving the bonding effect and preventing bonding failure after component deformation. Furthermore, in this embodiment, at least one alignment mark 501 is provided on one or both sides of the second bonding terminal 2041 near its edge. This alignment mark 501 primarily serves an alignment function to improve bonding efficiency and quality. The number, location, and shape of the alignment marks 501 are not specifically limited.

[0075] Furthermore, this application embodiment also provides a display device, which includes the display panel provided in this application embodiment. The connection between the display panel and the corresponding internal components of the device can be performed in accordance with the method provided in this application embodiment, thereby effectively improving its bonding effect and quality, and improving the overall performance of the device.

[0076] In this embodiment, the display panel can be applied to any rigid or flexible product or component with display, touch and other functions, such as computers, electronic paper, monitors, laptops, and digital photo frames, and its specific type is not specifically limited.

[0077] In summary, the above description provides a detailed overview of a display panel provided by the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the technical solution and core ideas of the present invention. Although the present invention has been disclosed above with preferred embodiments, the above preferred embodiments are not intended to limit the present invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention is based on the scope defined by the claims.

Claims

1. A display panel, characterized in that, The display panel is a flexible panel, comprising: Display area, non-display area, and binding area located in the non-display area; A binding terminal is disposed in the binding area. The binding terminal includes sub-terminals arranged in a two-dimensional dot matrix. In a first direction, the consecutive sub-terminals are connected to the same signal source and form a terminal group. In a second direction, the terminal groups are spaced apart. The flip-chip film is electrically connected to the bonding region via the bonding terminals; The terminal group includes a first bonding terminal disposed on the display substrate of the display panel, and a second bonding terminal disposed on the flip-chip film opposite to the first bonding terminal. The first bonding terminal on the display substrate and the second bonding terminal on the flip-chip film are electrically bonded together.

2. The display panel according to claim 1, characterized in that, The area of ​​the bond is greater than or equal to 3500 square micrometers.

3. The display panel according to claim 2, characterized in that, The area of ​​the first bonding terminal on the display substrate is greater than or equal to the area of ​​the second bonding terminal on the flip-chip film.

4. The display panel according to claim 3, characterized in that, Both the first bonding terminal on the display substrate and the second bonding terminal on the flip-chip film are configured as rectangular structures.

5. The display panel according to claim 4, characterized in that, The rectangular structure of the first bonding terminal includes two oppositely arranged first sides and two oppositely arranged second sides. The rectangular structure of the second bonding terminal includes two oppositely arranged third sides and two oppositely arranged fourth sides. The length of the first sides is L1, the length of the second sides is L2, the length of the third sides is L3, and the length of the fourth sides is L4. The area of ​​the bond is K, where K satisfies the following formula, K=[L3+(L1-L3) / 2-γ-M1]*[L4+(L2-L4) / 2-η-M2], Wherein, γ is the alignment accuracy of the first binding terminal and the second binding terminal in the first direction, η is the alignment accuracy of the first binding terminal and the second binding terminal in the second direction, M1 is the expansion / contraction deviation of the third side, and M2 is the expansion / contraction deviation of the fourth side.

6. The display panel according to claim 5, characterized in that, The first bonding terminal on the display substrate and the second bonding terminal on the flip-chip film are both arranged in an array in the first direction; In the same row along the first direction, the distance between adjacent first bonding terminals is S1, where M1≤S1+(L1-L3) / 2; In the same column along the second direction, the distance between two adjacent first bonding terminals is S2, where M2≤S2+(L2-L4) / 2.

7. The display panel according to claim 5, characterized in that, The ratios of L2 / L1 and L4 / L3 both range from 1 to 3.

8. The display panel according to claim 5, characterized in that, The first direction is perpendicular to the second direction; wherein, The first side and the third side are arranged parallel to the first direction; The second side and the fourth side are arranged parallel to the second direction.

9. The display panel according to claim 6, characterized in that, S1 is set to 23μm to 27μm, and S2 is set to 18μm to 22μm.

10. The display panel according to claim 3, characterized in that, In the same column along the second direction, the projection portions of the second bonding terminals of two adjacent rows along the first direction overlap in the second direction.

11. The display panel according to claim 5, characterized in that, Each of the sub-terminals includes a lead wire, and the leads of the sub-terminals in the same column along the second direction extend from the same side, and the leads are electrically connected to the display area.

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