An electronic device

Abstract

The present application provides an electronic device, which relates to the field of terminal device technology. It is used to solve the problem that the width of the non-display area at the bottom edge of the electronic device is large, which reduces the user experience. The above-mentioned electronic device includes a middle frame, a display panel, a light-transmitting cover plate and a protective layer. The display panel and the middle frame are stacked and fixedly connected. The display panel includes a bending area and a non-bending area. The bending area is arranged at the edge of the non-bending area, and the bending area is bent toward the side close to the middle frame, and the non-bending area is bonded and fixed to the middle frame. The light-transmitting cover plate is arranged on the side of the display panel away from the middle frame, and the light-transmitting cover plate is bonded and fixed to the non-bending area. The protective layer wraps the non-display area, the protective layer is fixedly connected to the middle frame, and the protective layer is bonded and fixed to the light-transmitting cover plate.

Description

Technical Field

[0001] The present application relates to the technical field of terminal equipment, and in particular to an electronic device. Background Art

[0002] With the continuous development of technology, users have higher and higher requirements for the screen-to-body ratio of electronic devices (such as mobile phones). Electronic devices include a display module and a housing, and the display module is fixedly connected to the housing. Due to the packaging technology limitations of the display module, the non-display area at the bottom edge of the electronic device (i.e., the black border area on the display surface of the electronic device) is relatively wide, thereby reducing the user experience. Summary of the invention

[0003] An embodiment of the present application provides an electronic device for solving the problem that the width of the non-display area at the bottom edge of the electronic device is relatively large, thereby reducing the user experience.

[0004] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0005] An electronic device is provided, the electronic device comprising a middle frame, a display panel, a light-transmitting cover plate and a protective layer, the display panel and the middle frame are stacked and fixedly connected, the display panel comprises a bending area and a non-bending area, the bending area is arranged at the edge of the non-bending area, and the bending area is bent toward a side close to the middle frame, and the non-bending area is bonded and fixed to the middle frame. The light-transmitting cover plate is arranged on a side of the display panel away from the middle frame, and the light-transmitting cover plate is bonded and fixed to the non-bending area. The protective layer wraps the non-display area, the protective layer is fixedly connected to the middle frame, and the protective layer is bonded and fixed to the light-transmitting cover plate.

[0006] The electronic device provided in the embodiment of the present application wraps the bending area of ​​the display panel with a protective layer, thereby effectively protecting the bending area. The non-bending area of ​​the display panel is bonded and fixed to the middle frame through the protective layer, which will not cause damage to the display panel, and at the same time, the bonding strength between the protective layer (i.e., the display panel) and the middle frame can be ensured. The bending area of ​​the display panel is bonded and fixed to the middle frame, which is conducive to improving the connection reliability between the display panel and the middle frame.

[0007] In addition, since the connection strength between the display panel and the middle frame is improved, there is no need to glue the transparent cover plate and the middle frame, which is beneficial to reduce the width of the black border area formed at the edge of the electronic device, thereby helping to increase the screen-to-body ratio of the electronic device and enhance the user experience.

[0008] In a possible implementation of the embodiment of the present application, the display panel includes multiple functional layers, and there are gaps between the functional layers in the bending area, and the protective layer is filled in the gaps. Under this structure, the protective layer is filled in the gaps between the functional layers, so as to form support for the functional layers, which is conducive to further improving the protection effect of the bending area of ​​the display panel.

[0009] In a possible implementation of the embodiment of the present application, the electronic device further includes a first adhesive layer, and the light-transmitting cover plate and the non-bending area are bonded and fixed by the first adhesive layer. Exemplarily, the first adhesive layer may be optical adhesive, so that the display panel can display images through the first adhesive layer and the light-transmitting cover plate.

[0010] In a possible implementation of the embodiment of the present application, the middle frame includes a frame and a middle plate, the middle plate is fixed in the frame, the display panel and the middle plate are stacked, the protective layer is bonded and fixed to the middle plate, and the protective layer is bonded and fixed to the frame. In this structure, the protective layer is bonded and fixed to the middle plate and the frame, which is conducive to increasing the bonding area between the protective layer and the middle frame, thereby facilitating improving the bonding strength between the protective layer and the middle frame.

[0011] In a possible implementation of the embodiment of the present application, there is a first gap between the side wall of the light-transmitting cover plate and the inner wall of the frame. Under this structure, the light-transmitting cover plate can be assembled in the middle frame, that is, in the frame, to ensure the success rate of assembly.

[0012] In a possible implementation of the embodiment of the present application, the first gap is greater than or equal to 0.01 mm, and the first gap is less than or equal to 0.1 mm. Within this range, on the one hand, the normal assembly of the light-transmitting cover plate and the middle frame can be ensured, and on the other hand, the first gap can be prevented from being too large, which is conducive to improving the overall aesthetics of the electronic device.

[0013] In a possible implementation of the embodiment of the present application, the distance between the bending area and the inner wall of the frame is a first distance, the first distance is greater than or equal to 0.1 mm, and the first distance is less than or equal to 0.5 mm. That is, the difference between the first distance and the first gap is the minimum thickness of the protective layer covering the bending area of ​​the display panel. Within this range, it is beneficial to improve the protective effect of the protective layer on the display panel.

[0014] In a possible implementation of the embodiment of the present application, the electronic device further includes a second adhesive layer, and the protective layer and the middle frame are bonded and fixed by the second adhesive layer. Exemplarily, the second adhesive layer may be made of hot melt adhesive, which has high fluidity when in a molten state, and can diffuse and extend between the protective layer and the middle frame during the lamination process, thereby facilitating an increase in the bonding area between the protective layer and the middle frame to ensure the overall connection strength.

[0015] In a possible implementation of the embodiment of the present application, the electronic device further includes a third adhesive layer, and the middle plate and the non-bending area are adhesively fixed through the third adhesive layer. Exemplarily, the third adhesive layer may adopt a back adhesive, which has good adhesive performance and reduced hardness. Therefore, it is beneficial to reduce the extrusion of the third adhesive layer on the display panel, thereby reducing the risk of imprints appearing on the display panel.

[0016] In a possible implementation of the embodiment of the present application, the third adhesive layer extends along the edge of the middle plate, and both ends of the third adhesive layer are respectively connected to both ends of the second adhesive layer. In this structure, it is beneficial to increase the adhesive area between the middle plate and the non-bending area of the display panel, thereby enhancing the adhesive strength.

[0017] In a possible implementation of the embodiment of the present application, the electronic device further includes a fourth adhesive layer. The fourth adhesive layer is disposed between the display panel and the middle plate, and the fourth adhesive layer is connected between the end of the third adhesive layer and the end of the second adhesive layer; the second adhesive layer, the fourth adhesive layer, and the third adhesive layer are connected in sequence and extend around the edge of the middle plate. In this structure, the second adhesive layer, the fourth adhesive layer, and the third adhesive layer are connected in sequence, and can form an annular structure, thereby forming a sealed cavity between the middle plate and the display panel to prevent water vapor from entering between the display panel and the middle plate, which is beneficial to improving the waterproof and sealing effect. Description of the Drawings

[0018] Figure 1 is a structural diagram of an electronic device provided by an embodiment of the present application;

[0019] Figure 2 is an exploded view of an electronic device provided by an embodiment of the present application;

[0020] Figure 3 is a front view of the display panel of the electronic device provided by an embodiment of the application;

[0021] Figure 4 is a sectional view of a partial structure of the display panel of the electronic device provided by an embodiment of the present application using the COG packaging process;

[0022] Figure 5 is a sectional view of a partial structure of the display panel of the electronic device provided by an embodiment of the present application using the COF packaging process;

[0023] Figure 6 is a sectional view of a partial structure of the display panel of the electronic device provided by an embodiment of the present application using the COP packaging process;

[0024] Figure 7 is a sectional view of a partial structure of the light-transmitting cover plate and the frame of the electronic device provided by the related art;

[0025] Figure 8A partial cross-sectional structural diagram of an electronic device provided in an embodiment of the present application;

[0026] Fig. 9 for Figure 8 A partial structural cross-sectional view of the display panel provided;

[0027] Fig.10 for Figure 8 A partial structural cross-sectional view of the display panel and the protective layer is provided;

[0028] Fig.11 A front view of a display panel of an electronic device provided in an embodiment of the present application;

[0029] Fig.12 A front view of a middle plate of an electronic device provided in an embodiment of the present application;

[0030] Fig.13 for Fig.11 A magnified view of the structure of region B;

[0031] Fig.14 for Fig.12 A magnified view of the C region structure.

[0032] Figure numerals: 10-electronic device; 100-display module; 110-light-transmitting cover plate; 120-display panel; 121-display area; 122-non-display area; 123-bending area; 124-non-bending area; 125-functional layer; 200-housing; 210-back cover; 220-middle frame; 221-frame; 221a-step surface; 222-middle plate; 300-circuit board; 310-FPC board; 400-electronic device; 500-display driver chip; 600-protective layer; 610-first area; 620-second area; 630-third area; 640-fourth area; 700-first adhesive layer; 710-second adhesive layer; 720-third adhesive layer; 730-fourth adhesive layer. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0034] In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features.

[0035] In addition, in the present application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to the changes in the orientation of the components in the drawings.

[0036] In the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0037] The embodiment of the present application provides an electronic device. Specifically, the electronic device may be a portable electronic device or other types of electronic devices. For example, the electronic device may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a monitor, a camera, a personal computer, a notebook computer, a wearable device, etc. For the convenience of description, the following examples are all taken as an example of the electronic device being a mobile phone.

[0038] See also Figure 1 and Figure 2 , Figure 1 This is a structural diagram of an electronic device 10 provided in an embodiment of the present application. Figure 2 The exploded view of the electronic device 10 provided in the embodiment of the present application. As can be seen from the above, in the present embodiment, the electronic device 10 is a mobile phone, and the electronic device 10 can be in an approximately rectangular plate-shaped structure. The electronic device 10 can include a display module 100, a housing 200, a circuit board 300 and an electronic device 400.

[0039] For the convenience of the following description, an XYZ coordinate system is established, and the width direction of the electronic device 10 is defined as the X-axis direction, the length direction of the electronic device 10 is defined as the Y-axis direction, and the thickness direction of the electronic device 10 is defined as the Z-axis direction. It is understood that the coordinate system of the electronic device 10 can be flexibly set according to actual needs, and this application only gives an example, which cannot be considered as a special limitation to this application. Figure 1 and Figure 2 Only some components of the electronic device 10 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not subject to the present invention. Figure 1 and Figure 2 restrictions.

[0040] The above-mentioned display module 100 is used to display images, videos, etc. The display module 100 may include a light-transmitting cover plate 110 and a display panel 120, and the light-transmitting cover plate 110 and the display panel 120 are stacked. The material of the light-transmitting cover plate 110 includes but is not limited to glass. For example, the light-transmitting cover plate 110 can adopt an ordinary light-transmitting cover plate 110, which is used to protect the display panel 120 to prevent the display panel 120 from being damaged due to external force, and can play a dust-proof role. Alternatively, the light-transmitting cover plate 110 can also adopt a light-transmitting cover plate 110 with a touch function, so that the electronic device 10 has a touch function, which makes it more convenient for users to use. Therefore, the present application does not specifically limit the specific material of the light-transmitting cover plate 110.

[0041] In addition, the display panel 120 may be a flexible display panel 120 or a rigid display panel 120. For example, the display panel 120 may be an organic light-emitting diode (OLED) display panel 120, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display panel 120, a mini organic light-emitting diode (MIL-E) display panel 120, a micro organic light-emitting diode (MIL-E) display panel 120, a micro organic light-emitting diode (MIL-E) display panel 120, a quantum dot light-emitting diode (QLED) display panel 120, or a liquid crystal display (LCD) panel 120.

[0042] The housing 200 is used to protect the electronic device 400 inside the electronic device 10. The housing 200 may include a back cover 210 and a frame 221. The back cover 210 is located on the side of the display panel 120 away from the light-transmitting cover plate 110, and is stacked with the light-transmitting cover plate 110 and the display panel 120. The frame 221 is located between the light-transmitting cover plate 110 and the back cover 210. The frame 221 is fixed to the back cover 210. For example, the frame 221 may be fixed to the back cover 210 by bonding, threading, welding, clamping, etc.; or, the frame 221 may also be an integrally formed structure with the back cover 210, that is, the frame 221 and the back cover 210 form a structural component as a whole. The light-transmitting cover plate 110 may be fixed to the frame 221 by gluing, so that the light-transmitting cover plate 110, the back cover 210 and the frame 221 enclose a receiving cavity inside the electronic device 10, and the circuit board 300 and the electronic device 400 are both arranged in the receiving cavity.

[0043] In some embodiments, the housing 200 may further include a middle plate 222, which is disposed in the housing cavity and is located on the side of the display panel 120 away from the light-transmitting cover plate 110. The middle plate 222 is fixedly connected to the frame 221, and the middle plate 222 and the frame 221 form the middle frame 220 of the electronic device 10. For example, the middle plate 222 and the frame 221 may be fixedly connected by gluing, threading, welding, snapping, etc.; or, the middle plate 222 and the frame 221 may also be an integrally formed structure, that is, the middle plate 222 and the frame 221 form a structural component as a whole. The middle plate 222 divides the housing cavity into two independent spaces, one of which is located between the light-transmitting cover plate 110 and the middle plate 222, and the display panel 120 is located in the space. The other space is located between the middle plate 222 and the back cover 210, and the circuit board 300 is located in the space.

[0044] The circuit board 300 is used to set the electronic devices 400 inside the electronic device 10 and realize the electrical connection between the electronic devices 400. The circuit board 300 can be fixed on the middle plate 222 by gluing, screw connection, welding, clamping, etc. Therefore, the present application does not specifically limit the fixing method of the circuit board 300.

[0045] The electronic device 400 is used to implement various functions of the electronic device 10. For example, the electronic device 400 may be a control chip (such as a system on chip, SOC), a graphics processing unit (GPU), a universal flash storage (UFS), a camera module, a flash module, a capacitor, a resistor, an inductor, etc.

[0046] Furthermore, the display panel 120 and the circuit board 300 may be electrically connected via a flexible connector, so that the circuit board 300 can control the display panel 120 to display an image. For example, the flexible connector may be an FPC board 310 (flexible printed circuit, see below). Figure 4 , Figure 5 as well as Figure 6 ); or, the flexible connector may also be a wire or an enameled wire, etc., which is not specifically limited in the present application. In the following embodiments, the flexible connector is an FPC board 310 as an example for description.

[0047] Also, see Figure 3 , Figure 3 A front view of a display panel 120 of an electronic device 10 provided in an embodiment of the application. The display panel 120 may include a display area 121 and a non-display area 122, wherein the display area 121 is used to display an image, and the non-display area 122 forms a black border area. Based on the different packaging processes of the display panel 120, the area ratio of the display area 121 to the non-display area 122 is affected, that is, the screen-to-body ratio of the electronic device 10 is affected.

[0048] It should be noted that the above screen-to-body ratio is the area ratio of the display area 121 to the display surface (i.e., the front side facing the user when the user is using the electronic device 10). That is, screen-to-body ratio = area of ​​the display area 121 / (area of ​​the display area 121 + area of ​​the non-display area 122). It can be seen that the larger the area of ​​the display area 121, the larger the screen-to-body ratio, which is more conducive to improving the user experience.

[0049] Furthermore, the packaging process of the display panel 120 refers to the display driver chip 500 (Display Driver IC, DDIC, see below). Figure 4 , Figure 5 as well as Figure 6 ), that is, the display driver chip 500 is packaged on the display panel 120 and electrically connected to the circuit board 300. For example, the display driver chip 500 can be arranged at the bottom edge of the electronic device 10, that is, different packaging processes will affect the width of the black border area at the bottom edge of the electronic device 10.

[0050] For example, commonly used packaging processes for the display panel 120 include COG (Chip On Glass) packaging process, COF (Chip On Film) packaging process, and COP (Chip On Plastic) packaging process. Figure 4 , Figure 5 as well as Figure 6 , Figure 4This is a cross-sectional view of a partial structure of a display panel 120 of an electronic device 10 provided in an embodiment of the present application using a COG packaging process. Figure 5 This is a cross-sectional view of a partial structure of a display panel 120 of an electronic device 10 provided in an embodiment of the present application using a COF packaging process. Figure 6 This is a cross-sectional view of a partial structure of a display panel 120 of an electronic device 10 provided in an embodiment of the present application using a COP packaging process.

[0051] Specifically, when using COG packaging technology, please refer to Figure 4 As shown, the display panel 120 may be a rigid display panel 120, and the display driver chip 500 is bonded to the display panel 120 and electrically connected to the circuit board 300 via the FPC board 310. At this time, the width of the black border area is D1.

[0052] When using COF packaging technology, please refer to Figure 5 As shown, the display panel 120 can be a flexible display panel 120, the display driver chip 500 is bonded to the FPC board 310, and the FPC board 310 is bent toward the side close to the middle board 222, and is electrically connected to the circuit board 300 through the FPC board 310. At this time, the width of the black border area is D2.

[0053] When using COP packaging technology, please refer to Figure 6 As shown, the display panel 120 may be a flexible display panel 120, and one side edge of the display panel 120 is bent, that is, the display panel 120 may include a bending area 123 and a non-bending area 124, and the bending area 123 is close to Figure 2 As shown, one side of the middle plate 222 is bent, and the display driver chip 500 can be bonded to the bent area 123 and electrically connected to the circuit board 300 through the FPC board 310. At this time, the width of the black edge area is D3.

[0054] It can be seen that for the COG packaging process, the display driver chip 500 needs to be hidden in the non-display area 122 (ie, the black border area), so the width D1 of the black border area corresponding to the display driver chip 500 is larger.

[0055] For the COF packaging process, since the display driver chip 500 is set on the FPC board 310, that is, there is no need to hide the display driver chip 500, therefore, compared with the COG packaging process, the width of the black border area can be reduced, that is, D2<D1; but the connection between the FPC board 310 and the display panel 120 still needs to be hidden in the non-display area 122.

[0056] For the COP packaging process, since the display driver chip 500 is disposed on the bending area 123 of the display panel 120, there is no need to hide the display driver chip 500 and the FPC board 310. Therefore, compared with the COG packaging process, the width of the black border area can be further reduced, that is, D3<D2.

[0057] Based on this, in order to reduce the width of the black border area and increase the screen-to-body ratio, the display panel 120 of many electronic devices 10 will adopt the COP packaging process. Figure 6 When the display panel 120 is bonded and fixed to the middle frame 220, excessive squeezing may easily lead to damage due to the low strength of the bending area 123. Therefore, in order to prevent the bending area 123 of the display panel 120 from being damaged and to achieve waterproof sealing between the display module 100 and the middle frame 220, the transparent cover plate 110 and the middle frame 220 need to be fixed by glue.

[0058] See also Figure 7 , Figure 7 The partial structural cross-sectional diagram of the light-transmitting cover plate 110 and the frame 221 of the electronic device 10 provided in the related art shows that a step surface 221a needs to be reserved on the inner wall of the frame 221, for example, a step surface 221a with a reserved width of 0.6 mm. The light-transmitting cover plate 110 is bonded to the step surface 221a by glue. In this way, the step surface 221a increases the width of the black border on the display surface of the electronic device 10, affecting the user experience.

[0059] To solve the above problems, the present application provides an electronic device 10, which includes the housing 200 (ie, the middle frame 220 and the back cover 210), a display panel 120, and a light-transmitting cover plate 110. Figure 8 and Fig. 9 , Figure 8 A partial cross-sectional structural diagram of an electronic device 10 provided in an embodiment of the present application, Fig. 9 for Figure 8 A partial structural cross-sectional view of a display panel 120 is provided. Figure 8 for Figure 1 AA cross-section of the electronic device shown.

[0060] The display panel 120 includes a bending area 123 and a non-bending area 124, and the display driver chip 500 is disposed on the bending area 123. The light-transmitting cover plate 110 is bonded and fixed to the non-bending area 124 of the display panel 120, and the middle frame 220 (i.e., the middle plate 222) is bonded and fixed to the non-bending area 124 of the display panel 120. That is, a first adhesive layer 700 may be disposed between the light-transmitting cover plate 110 and the non-bending area 124, and the light-transmitting cover plate 110 and the non-bending area 124 are bonded and fixed by the first adhesive layer 700.

[0061] For example, please refer to Figure 8 and Fig. 9 , the first adhesive layer 700 can be made of optical adhesive (OCA, Optically Clear Adhesive). Optical adhesive has the advantages of being colorless and transparent, having a light transmittance of more than 95%, and having good bonding strength. Therefore, the transparent cover plate 110 and the display panel 120 are fixed by bonding with optical adhesive, which can ensure the bonding strength of the two while ensuring that the display panel 120 can display images through the first adhesive layer 700 and the transparent cover plate 110.

[0062] It can be understood that the display area 121 (such as Figure 3 ) can be formed entirely on the non-bending region 124, and the bending region 123 can form the non-display region 122 (as shown Figure 3 Alternatively, part of the bending area 123 also forms the display area 121. For example, the edge of the bending area 123 close to the non-bending area 124 can form the display area 121 of the display panel 120 together with the non-bending area 124. Therefore, this application does not make any special limitation to this.

[0063] Also, please read Figure 8 and Fig. 9 The electronic device 10 provided in the embodiment of the present application further includes a protective layer 600, which wraps the bending area 123, is fixedly connected to the middle frame 220, and is bonded and fixed to the light-transmitting cover plate 110. In some embodiments, when the middle frame 220 includes a middle plate 222 and a frame 221, the protective layer 600 is bonded and fixed to the middle plate 222, and the protective layer 600 is bonded and fixed to the frame 221.

[0064] In some embodiments, the display panel 120 may include multiple functional layers 125 , and there are gaps between the functional layers 125 in the bending area 123 , and the protective layer 600 is filled in the gaps, so that the protective layer 600 can effectively support the gaps between the functional layers 125 .

[0065] Exemplarily, the protective layer 600 may be made of a material with a higher hardness after curing, such as epoxy resin glue, which has a higher adhesion and a higher hardness after curing. In this way, on the one hand, since the protective layer 600 itself has a better adhesion, the protective layer 600 can be bonded and fixed to the light-transmitting cover plate 110 without the need to set other adhesive materials. On the other hand, after the protective layer 600 is cured, its own hardness is higher, so that it can provide better protection for the bending area 123 of the display panel 120 and form better support in the gap between different functional layers 125.

[0066] Based on this, the electronic device 10 provided in the embodiment of the present application wraps the bending area 123 of the display panel 120 with the protective layer 600. On the one hand, the protective layer 600 can effectively protect the bending area 123 and form effective support between different functional layers 125 in the bending area 123. On the other hand, the protective layer 600 is bonded and fixed to the middle frame 220, and a material with strong bonding strength can be used for bonding, which will not cause damage to the bending area 123 of the display panel 120, and can also ensure the bonding strength between the protective layer 600 and the middle frame 220, which is conducive to improving the reliability of bonding between the display panel 120 and the middle frame 220.

[0067] For details, please continue to see Figure 8 and Fig. 9 , the protective layer 600 and the middle frame 220 can be fixedly connected by the second adhesive layer 710. For example, the second adhesive layer 710 can be a hot melt adhesive. That is, hot melt adhesive is applied between the middle frame 220 and the protective layer 600, and because the hot melt adhesive is in a molten state, it has greater fluidity. Therefore, during the lamination process, the hot melt adhesive can diffuse and extend to the surroundings, so that the protective layer 600 can be bonded and fixed to a partial area of ​​the middle plate 222, and the protective layer 600 can also be bonded and fixed to a partial area of ​​the frame 221, which is beneficial to improve the bonding strength between the protective layer 600 and the middle frame 220.

[0068] Furthermore, after the second adhesive layer 710 solidifies, the second adhesive layer 710 will exert a certain squeezing force on the protective layer 600. Since the protective layer 600 fills the gaps between the functional layers 125, it can support the functional layers 125. Therefore, the influence of the squeezing force on the display panel 120 can be reduced, which is conducive to further reducing the risk of squeezing damage to the bending area 123 of the display panel 120.

[0069] In addition, since the bonding strength between the protective layer 600 and the middle frame 220 is relatively high, the transparent cover plate 110 and the frame 221 do not need to be fixed by glue, that is, there is no need to set a step surface 221a on the inner wall of the frame 221. Figure 7 The frame 221 shown has the step surface 221 a removed, further reducing the width of the black border area at the bottom edge of the electronic device 10, thereby further improving the user experience.

[0070] At the same time, since the width of the black border area at the bottom edge of the electronic device 10 is further reduced, it is helpful to reduce the difference in the width of the black border areas at the four edges of the electronic device 10. That is, the width of the black border areas at the four edges of the electronic device 10 can be made equal, forming an effect of equal width of the black border areas at the four edges, which is helpful to further improve the user experience.

[0071] In some embodiments, please refer to Figure 8 and Fig. 9 , there may be a first gap H1 between the light-transmitting cover plate 110 and the frame 221, and the first gap H1 can ensure that the light-transmitting cover plate 110 can be assembled in the frame 221 to improve the reliability of the overall structure. Exemplarily, the first gap H1 may be greater than or equal to 0.01 mm, and the first gap H1 may be less than or equal to 0.1 mm. That is, the first gap H1 may be 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm or 0.1 mm, etc.

[0072] It should be noted that the second adhesive layer 710 may cover the entire surface of the protective layer 600 facing the frame 221. Alternatively, the second adhesive layer 710 may only cover a portion of the surface of the protective layer 600 facing the frame 221. In this case, the first gap H1 exists between the protective layer 600 and the frame 221, that is, the first gap H1 may extend between the protective layer 600 and the frame 221.

[0073] Also, please read Figure 8 and Fig. 9 , the distance between the bending area 123 wrapped by the protective layer 600 and the inner wall of the frame 221 is a first distance H2, and the first distance H2 may be greater than or equal to 0.1 mm, and the first distance H2 may be less than or equal to 0.5 mm. For example, the first distance H2 may be 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm or 0.5 mm, etc. It can be understood that the distance between the bending area 123 and the inner wall of the frame 221 refers to the distance between the position of the bending area 123 closest to the inner wall of the frame 221 and the inner wall of the frame 221.

[0074] It can be seen from the above-mentioned first gap H1 and first distance H2 that at the position where the bending area 123 is closest to the inner wall of the frame 221, the thickness of the protective layer 600 corresponding to this position is the first thickness H3, and the range of the first thickness H3 is the difference between the first distance H2 and the first gap H1, that is, between 0.09mm and 0.4mm. For example, when the first gap H1 is 0.05mm and the first distance H2 is 0.25mm, the first thickness H3 of the protective layer 600 at this position is 0.2mm. This reduces the risk of damage to the bending area 123 of the display panel 120 due to the small first thickness H3 of the protective layer 600 at this position.

[0075] Specifically, see Fig.10 , Fig.10 for Figure 8A partial structural cross-sectional view of the display panel 120 and the protective layer 600 is provided. In the cross section along the Y-axis direction, the protective layer 600 may include a first area 610 , a second area 620 , a third area 630 and a fourth area 640 .

[0076] Please continue to read Fig.10 , and return to the reference Figure 8 as well as Fig. 9 As shown, the first area 610 is located between the display panel 120 and the cover glass, the second area 620 is located between the display panel 120 and the inner wall of the frame 221, the third area 630 is located between the display panel 120 and the middle plate 222, and the fourth area 640 is filled in the gap between the functional layers 125 of the display panel 120.

[0077] The minimum thickness of the second region 620 is the first thickness H3, and the first thickness H3 is equal to the difference between the first gap H1 and the first distance H2. The greater the minimum thickness of the second region 620, the better the protection effect on the bending region 123 of the display panel 120.

[0078] In addition, please continue to refer to Figure 8 , Fig. 9 as well as Fig.10 , along the Y-axis direction, the width L1 of the third region 630 can be greater than the width L2 of the first region 610. Under this structure, the width L2 of the first region 610 is set to be smaller, which is conducive to reducing the width of the black edge region. In addition, the width L1 of the third region 630 is larger, which is conducive to increasing the protection area of ​​the protective layer 600 on the bending area 123, thereby further improving the protection effect.

[0079] For example, along the Y-axis direction, the difference between the width L1 of the third region 630 and the width L2 of the first region 610 may be in the range of 0.75 mm to 1 mm, thereby increasing the area of ​​the third region 630 covering the surface of the bending zone 123 facing the middle plate 222, thereby improving the protective effect of the protective layer 600 on the bending zone 123.

[0080] Furthermore, the larger the width L1 of the third region 630 is, the larger the area of ​​the third region 630 that can be covered by the second adhesive layer 710 is, thereby facilitating the improvement of the bonding strength between the protective layer 600 and the middle plate 222 and the improvement of the reliability of the overall structure.

[0081] On this basis, see Fig.11 and Fig.12 , Fig.11 This is a front view of the display panel 120 of the electronic device 10 provided in an embodiment of the present application. Fig.12This is a front view of the middle plate 222 of the electronic device 10 provided in the embodiment of the present application. The electronic device 10 further includes a third adhesive layer 720 , through which the middle plate 222 and the non-bending area 124 of the display panel 120 are bonded and fixed.

[0082] Furthermore, the third adhesive layer 720 may extend along the frame 221 of the middle plate 222, and the two ends of the third adhesive layer 720 are respectively connected to the two ends of the second adhesive layer 710. That is, the second adhesive layer 710 is disposed at the lower edge of the electronic device 10 (i.e., the middle plate 222), and the third adhesive layer 720 may be disposed at the upper edge and the left and right edges of the middle plate 222, so as to achieve bonding and fixing of the middle plate 222 and the display panel 120.

[0083] For example, the third adhesive layer 720 may be made of adhesive backing, also known as foam adhesive, which is a double-sided adhesive tape with good bonding performance and low hardness. Therefore, the third adhesive layer 720 can achieve good bonding and fixing between the non-bending area 124 of the display panel 120 and the middle plate 222. In addition, since the third adhesive layer 720 has a low hardness, the third adhesive layer 720 can reduce the squeezing of the display panel 120, thereby reducing the risk of imprints on the display panel 120.

[0084] In some other embodiments, see Fig.13 and Fig.14 , Fig.13 for Fig.11 A magnified view of the B region structure. Fig.14 for Fig.12 The electronic device 10 provided in the present application may further include a fourth adhesive layer 730, which is disposed between an end of the third adhesive layer 720 and an end of the second adhesive layer 710, that is, the second adhesive layer 710, the fourth adhesive layer 730 and the third adhesive layer 720 are sequentially connected to form an annular structure extending around the edge of the middle plate 222.

[0085] Exemplarily, the fourth adhesive layer 730 may be made of dam glue, also known as single-component dam silicone, which has the advantages of good adhesion, high bonding strength, excellent aging resistance, moisture resistance, waterproofness, high temperature resistance and good chemical stability.

[0086] In this way, by setting the fourth adhesive layer 730 between the end of the second adhesive layer 710 and the end of the third adhesive layer 720, it is possible to avoid a gap at the junction of the second adhesive layer 710 and the third adhesive layer 720, so that the annular structure surrounded by the second adhesive layer 710, the third adhesive layer 720 and the fourth adhesive layer 730 can form a closed cavity between the middle plate 222 and the display panel 120 to prevent external water vapor from entering between the display panel 120 and the middle plate 222, which is beneficial to improve the sealing performance between the middle plate 222 and the display panel 120.

[0087] It should be noted that Figures 11 to 14 The second adhesive layer 710, the third adhesive layer 720 and the fourth adhesive layer 730 are on the display panel 120 (ie Fig.11 and Fig.13 As shown) and on the middle plate 222 (ie Fig.12 and Fig.14 The shapes of the two (shown) are not exactly the same. This is because the colloid has fluidity and will spread and extend after pressing, and its shape after solidification is not fixed. Therefore, Figures 11 to 14 It is only an illustration of the positions, and the shapes of the second adhesive layer 710 , the third adhesive layer 720 and the fourth adhesive layer 730 are not specifically limited.

[0088] The above is a description of the structure of the electronic device 10 provided in the embodiment of the present application. The following is a description of the process flow of the electronic device 10.

[0089] Since the display panel 120 of the electronic device 10 includes the protective layer 600, the display panel 120 is firstly pre-processed by injection, that is, the display panel 120 is placed in a glue injection fixture, and the glue is injected under pressure in the glue injection fixture to inject the material of the protective layer 600 so that the protective layer 600 wraps the bending area 123 of the display panel 120 and fills the gaps between the functional layers 125 of the display panel 120.

[0090] Next, the transparent cover plate 110 is bonded to the non-bending area 124 of the display panel 120 through the first adhesive layer 700 , and the transparent cover plate 110 is attached to the protective layer 600 and bonded and fixed, and then the protective layer 600 is solidified.

[0091] Next, the third adhesive layer 720 (i.e., back adhesive) is mounted on the upper edge and left and right edges of the middle frame 220 (i.e., middle plate 222), and the adhesive dispensing process is performed on the lower edge of the middle frame 220, i.e., the second adhesive layer 710 (i.e., hot melt adhesive) is dispensed. Then, the fourth adhesive layer 730 (i.e., dam adhesive) is dispensed at the junction of the second adhesive layer 710 and the third adhesive layer 720.

[0092] Next, the display panel 120 provided with the protective layer 600 is assembled on the middle frame 220 and a pressure-maintaining operation is performed. The middle frame 220 and the display panel 120 after the pressure-maintaining operation are then pressed together so that the middle frame 220 and the non-bending area 124 of the display panel 120 are bonded and fixed by the third adhesive layer 720. Then, the display panel 120 is left to stand and the subsequent assembly process is performed.

[0093] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0094] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that: include: A middle frame, comprising a frame and a middle plate, wherein the middle plate is fixed inside the frame; A display panel is stacked and fixedly connected with the middle frame, and the display panel is stacked with the middle plate; the display panel includes a bending area and a non-bending area, the bending area is arranged at the edge of the non-bending area, and the bending area is bent toward a side close to the middle frame, a bending space is formed inside the bending area, and the non-bending area is bonded and fixed to the middle frame; the display panel includes multiple functional layers, and there are gaps between the functional layers in the bending area; A light-transmitting cover plate is disposed on a side of the display panel away from the middle frame, the light-transmitting cover plate is bonded and fixed to the non-bending area, and at least a portion of the light-transmitting cover plate extends into the frame; A protective layer, wherein the protective layer is epoxy resin glue, the protective layer wraps the bending area, the protective layer is filled in the bending space, and the protective layer is filled in the gap, the protective layer is fixedly connected to the middle frame, and the protective layer is attached to and bonded to the light-transmitting cover plate; the protective layer is bonded to the frame, and the protective layer is bonded to the middle plate; the protective layer includes a first area, a second area, a third area and a fourth area, the first area is located between the display panel and the light-transmitting cover plate, the second area is located between the display panel and the frame, the third area is located between the display panel and the middle plate, and the fourth area is filled in the bending space and the gap; along the length direction of the electronic device, the width of the third area is greater than the width of the first area, and the vertical projection of the third area on the middle plate overlaps with a part of the vertical projection of the non-bending area on the middle plate; a second adhesive layer, wherein the second adhesive layer is hot melt adhesive, the second area is bonded and fixed to the frame through the second adhesive layer, and the third area is bonded and fixed to the middle plate through the second adhesive layer; A third adhesive layer, wherein the third adhesive layer is a back adhesive, the middle plate and the non-bending area are bonded and fixed by the third adhesive layer, and the third adhesive layer extends along the edge of the middle plate; A fourth adhesive layer, the fourth adhesive layer is a dam adhesive, the fourth adhesive layer is arranged between the display panel and the middle plate, the fourth adhesive layer is connected between the end of the third adhesive layer and the end of the second adhesive layer; the second adhesive layer, the fourth adhesive layer and the third adhesive layer are connected in sequence and extend along the edge of the middle plate, and a closed cavity is formed between the middle plate and the display panel; along the width direction of the electronic device, a partial area of ​​the fourth adhesive layer overlaps with a partial area of ​​the second adhesive layer, and a partial area of ​​the fourth adhesive layer overlaps with a partial area of ​​the third adhesive layer.

2. The electronic device according to claim 1, characterized in that: The electronic device further includes a first adhesive layer, and the light-transmissive cover plate and the non-bending area are bonded and fixed by the first adhesive layer.

3. The electronic device according to claim 1 or 2, characterized in that: A first gap is defined between the side wall of the light-transmitting cover plate and the inner wall of the frame.

4. The electronic device according to claim 3, characterized in that: The first gap is greater than or equal to 0.01 mm, and the first gap is less than or equal to 0.1 mm.

5. The electronic device according to claim 1 or 2, characterized in that: The distance between the bending area and the inner wall of the frame is a first distance, the first distance is greater than or equal to 0.1 mm, and the first distance is less than or equal to 0.5 mm.

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