Cleaning device, cleaning method and electroplated diamond wire saw production method for tungsten wire

Abstract

The application discloses a kind of cleaning device of tungsten wire, cleaning method and electroplated diamond wire saw production method, belong to diamond wire saw production technical field, the cleaning device includes water washing tank, cleaning tank, overflow tank, water pump, liquid storage tank and infusion tube, overflow plate is equipped on cleaning tank, water pump is in liquid storage tank Water is sent to cleaning tank by infusion tube, when the water level height in cleaning tank exceeds overflow plate, extra water will flow to overflow tank and backflow to liquid storage tank by backflow pipe;Height adjusting rod is equipped in cleaning tank, first scrubbing plate is installed on height adjusting rod, the position of first scrubbing plate on height adjusting rod is adjustable, second scrubbing plate is equipped above first scrubbing plate, and second scrubbing plate is positioned between height adjusting rod and is limited by height adjusting rod;The application has good cleaning effect, fast cleaning speed, and the tungsten wire cleaned can be directly subjected to subsequent pre-plating, sanding, thickening and other processes.

Description

Technical Field

[0001] This invention relates to the field of diamond wire saw production technology, and in particular to a tungsten wire cleaning device, a cleaning method, and a method for producing electroplated diamond wire saws. Background Technology

[0002] Electroplated diamond wire saws are superhard tools widely used for cutting hard and brittle materials such as silicon wafers and sapphire. Currently, carbon steel wire is still the dominant material used in the market. However, with advancements in diamond wire thinning and silicon wafer thinning technology, carbon steel wire is increasingly unable to meet the cost reduction and efficiency improvement requirements of enterprises. Tungsten wire's high toughness, extremely fine processing capability, and excellent cutting performance offer greater potential for finer wire cutting in photovoltaic applications. Compared to carbon steel wire, tungsten wire possesses high strength, good machinability, and fatigue resistance, resulting in significant benefits in the cutting process. Increasingly, there are indications that the photovoltaic cutting field is gradually shifting towards using tungsten wire to replace traditional carbon steel wire.

[0003] Graphite is used as a lubricant in the tungsten wire drawing process, leaving oxides, graphite, and other impurities on the surface of the finished tungsten wire, which is detrimental to the deposition of subsequent coatings. Existing tungsten wires undergo pretreatment before plating, with processes typically including alkaline washing, water washing, or acid washing and water washing. However, these processes are not efficient at cleaning the tungsten wire surface, thus affecting the adhesion of the diamond coating.

[0004] In view of this, a new technical solution is needed to solve the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this invention is to provide a tungsten wire cleaning device, a cleaning method, and a method for producing electroplated diamond wire saws, so as to solve the problem of poor coating caused by impurities on the surface of tungsten wires in the prior art.

[0006] To achieve the above objectives, the present invention employs the following technical means:

[0007] The first aspect of the present invention provides a cleaning device for tungsten wire, comprising a washing tank, a water pump, a storage tank, and a delivery pipe. The washing tank contains a cleaning tank, and the space enclosed between the washing tank and the cleaning tank is an overflow tank. An overflow plate is provided on the cleaning tank. The water pump delivers water from the storage tank to the cleaning tank through the delivery pipe. When the water level in the cleaning tank exceeds the overflow plate, excess water flows into the overflow tank and returns to the storage tank through a return pipe. At least two height adjusting rods are provided in the cleaning tank. A first scrubbing plate is mounted on each height adjusting rod, and the position of the first scrubbing plate on the height adjusting rod is adjustable. A second scrubbing plate is located above the first scrubbing plate. During operation, the tungsten wire is threaded between the first and second scrubbing plates and is cleaned by friction from the first and second scrubbing plates when pulled.

[0008] As a further improvement, the overflow plate is provided with multiple U-shaped grooves, the tungsten wire passes through the U-shaped grooves and is flush with the bottom of the U-shaped grooves. When the water level in the cleaning tank exceeds the bottom of the U-shaped grooves, the excess water will flow into the overflow tank and return to the storage tank through the return pipe.

[0009] As a further improvement, the first scrubbing plate includes a scrubbing base plate and a lower scrubbing layer disposed on the upper surface of the scrubbing base plate, and the second scrubbing plate includes a scrubbing cover plate and an upper scrubbing layer disposed on the lower surface of the scrubbing cover plate. The tungsten wire is threaded between the upper scrubbing layer and the lower scrubbing layer and is scrubbed and cleaned by the upper scrubbing layer and the lower scrubbing layer when pulled.

[0010] As a further improvement, the height adjustment rod is threadedly installed with the scrubbing base plate, and the height of the scrubbing base plate in the cleaning tank is adjusted by rotating the height adjustment rod.

[0011] As a further improvement, the number of height adjustment rods is four, and the four height adjustment rods are distributed at the four corners of the scrubbing base plate.

[0012] As a further improvement, the material of the scrubbing cover is one or a mixture of polytetrafluoroethylene, polybutene, polyethylene, polypropylene, or polyvinyl chloride; the material of the scrubbing base plate is one or a mixture of polytetrafluoroethylene, polybutene, polyethylene, polypropylene, or polyvinyl chloride.

[0013] As a further improvement, the upper wiping layer is made of one or more of the following materials: polypropylene nonwoven fabric, polyester nonwoven fabric, nylon nonwoven fabric, acrylic nonwoven fabric, polyethylene nonwoven fabric, chlorofiber nonwoven fabric, woven cotton fabric, linen fabric, and wool fabric; the lower wiping layer is made of one or more of the following materials: polypropylene nonwoven fabric, polyester nonwoven fabric, nylon nonwoven fabric, acrylic nonwoven fabric, polyethylene nonwoven fabric, chlorofiber nonwoven fabric, woven cotton fabric, linen fabric, and wool fabric.

[0014] As a further improvement, the upper scrubbing layer is attached to the scrubbing cover plate by an adhesive or sewing process, and the lower scrubbing layer is attached to the scrubbing base plate by an adhesive or sewing process.

[0015] A second aspect of the present invention provides a method for cleaning tungsten wire for electroplating diamond, characterized by comprising the following steps:

[0016] Before electroplating the tungsten wire with diamond, the tungsten wire is cleaned using the cleaning device described above.

[0017] A third aspect of the present invention provides a method for producing an electroplated diamond wire saw, which uses tungsten wire as the electroplating busbar, and includes the following steps:

[0018] 1) Electrolytic polishing of the tungsten wire;

[0019] 2) The tungsten wire after electropolishing is acid-washed or alkali-washed;

[0020] 3) Wipe the acid-washed or alkali-washed tungsten wire according to the cleaning method described above;

[0021] 4) Electroplating diamond onto the cleaned tungsten wire.

[0022] Compared to existing technologies, this invention offers the following advantages: The height of the scrubbing base plate and consequently the scrubbing cover plate can be adjusted by adjusting the height adjustment rod, making it suitable for scrubbing needs at different wire cuts; the scrubbing layer material is easy and convenient to change, suitable for different cleaning requirements of tungsten wires and large-scale production needs; each washing tank with a scrubbing device is separated by a baffle, preventing impurities removed from the electroplated diamond tungsten wire in the previous working tank from contaminating the next working tank; this invention provides excellent cleaning results and fast cleaning speed, allowing the cleaned tungsten wire to directly undergo subsequent pre-plating, sandblasting, and thickening processes, resulting in a reliable plating layer that meets the specifications of diamond wire saws. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of the tungsten wire cleaning device is shown.

[0025] Figure 2 A partial structural schematic diagram of a tungsten wire cleaning device is shown;

[0026] Figure 3 A partial structural schematic diagram of a tungsten wire cleaning device is shown;

[0027] Figure 4 The image shows a comparison of scanning electron microscope (SEM) images of the tungsten wire before and after cleaning.

[0028] Explanation of key component symbols:

[0029] 100-Tungsten wire; 1-Baffle; 2-Water pump; 3-Storage tank; 4-Infusion pipe; 5-Cleaning tank; 6-Overflow tank; 7-Overflow plate; 71-U-shaped groove; 8-Return pipe; 9-Height adjustment rod; 10-Scrubbing base plate; 11-Lower scrubbing layer; 12-Scrubbing cover plate; 13-Upper scrubbing layer; 21-Water washing tank; 22-First scrubbing plate; 23-Second scrubbing plate. Detailed Implementation

[0030] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0031] A tungsten wire cleaning device includes a washing tank, a water pump, a storage tank, and a delivery pipe. The washing tank contains a cleaning tank, and the space enclosed between the washing tank and the cleaning tank is an overflow tank. An overflow plate is provided on the cleaning tank. The water pump delivers water from the storage tank to the cleaning tank through the delivery pipe. When the water level in the cleaning tank exceeds the overflow plate, excess water flows into the overflow tank and returns to the storage tank through a return pipe. At least two height adjusting rods are provided in the cleaning tank. A first scrubbing plate is mounted on each height adjusting rod, and the position of the first scrubbing plate on the height adjusting rod is adjustable. A second scrubbing plate is provided above the first scrubbing plate.

[0032] The tungsten wire is conveyed forward by the wire feeding device. During operation, the lower surface of the tungsten wire enters the cleaning tank along the upper surface of the overflow plate. The lower surface of the tungsten wire is flush with the upper surface of the first scrubbing plate. The second scrubbing plate abuts against the upper surface of the tungsten wire under the action of gravity, causing the lower surface of the tungsten wire to abut against the upper surface of the first scrubbing plate. That is, the tungsten wire is passed between the first and second scrubbing plates. When the tungsten wire is pulled, it is rubbed and cleaned by the first and second scrubbing plates.

[0033] This invention adjusts the height of the scrubbing base plate and thus the scrubbing cover plate by adjusting the height adjustment rod, making it suitable for scrubbing needs of wires at different heights. The scrubbing plate is made of a material with a friction effect, making it simple and convenient to replace, and suitable for different cleaning requirements of tungsten wires and large-scale production needs. Each water washing tank with a scrubbing device is separated by a baffle, ensuring that impurities washed off the electroplated diamond tungsten wire in the previous working tank do not contaminate the next working tank. This invention provides good cleaning effect and fast cleaning speed, and the cleaned tungsten wire can be directly subjected to subsequent processes such as pre-plating, sandblasting, and thickening.

[0034] Example

[0035] Please see Figure 1 and Figure 2 The present invention provides a tungsten wire cleaning device for cleaning the tungsten wire 100 used as the busbar of an electroplated diamond wire saw. The cleaning device includes a water washing tank 21, a water pump 2, a liquid storage tank 3 and a liquid delivery pipe 4. The water washing tank 21 is surrounded by baffles 1, and a cleaning tank 5 is provided inside the water washing tank 21. The space enclosed between the water washing tank 21 and the cleaning tank 5 is an overflow tank 6, and an overflow plate 7 is provided on the cleaning tank 5.

[0036] When the washing tank 21 is started, the water pump 2 transports water from the storage tank 3 to the cleaning tank 5 through the delivery pipe 4. When the water level in the cleaning tank 5 exceeds the overflow plate 7, the excess water flows into the overflow tank 6 and back to the storage tank 3 through the return pipe 8, completing one cycle.

[0037] The cleaning tank 5 is equipped with four height adjustment rods 9. A first scrubbing plate 22 is mounted on each height adjustment rod 9, and its position is adjustable. A second scrubbing plate 23 is placed on the water surface of the cleaning tank 5, positioned above the first scrubbing plate 22. The second scrubbing plate 23 is positioned between the height adjustment rods 9 and is limited in position by the height adjustment rods 9. The first scrubbing plate 22 is threadedly connected to the height adjustment rods 9, and its height relative to the bottom of the cleaning tank 5 can be adjusted by rotating the height adjustment rods 9.

[0038] It should be noted that the wire feeding device used in this embodiment feeds multiple tungsten wires 100 at the same time, which is a conventional operation in the field, and will not be described in detail in this embodiment.

[0039] During cleaning, the lower surface of the tungsten wire 100 enters the cleaning tank 5 along the upper surface of the overflow plate 7. The lower surface of the tungsten wire 100 is flush with the upper surface of the first scrubbing plate 22. Under the action of gravity, the second scrubbing plate 23 abuts against the upper surface of the tungsten wire 100, causing the lower surface of the tungsten wire 100 to abut against the upper surface of the first scrubbing plate 22. When pulled, the tungsten wire 100 is cleaned by friction from the first scrubbing plate 22 and the second scrubbing plate 23. At the same time, since the water in the cleaning tank 5 is constantly flowing, it will carry the oxides, graphite and other impurities washed off the tungsten wire 100 out of the overflow plate 7 and into the overflow tank 6.

[0040] It is worth mentioning that the descriptions of "upper surface" and "lower surface" in the text are not strictly upper and lower surfaces, but rather symbolically represent the upper and lower parts of the tungsten wire 100.

[0041] The second scrubbing plate 23 abuts against the upper surface of the tungsten wire 100 under the action of gravity. The water in the cleaning tank 5 is constantly flowing and flows out through the overflow plate 7. The gap between the second scrubbing plate 23 and the first scrubbing plate 22 can be dynamically adjusted by the water flow. The tungsten wire passing through the gap between the second scrubbing plate 23 and the first scrubbing plate 22 is dynamically cleaned, and the water in the cleaning tank 5 can quickly flush out the cleaned impurities through the overflow plate 7. This avoids the situation where a fixed gap is set between the first scrubbing plate 22 and the second scrubbing plate 23, which would cause excessive friction or inadequate cleaning between the tungsten wire 100 and the first and second scrubbing plates 22 and 23, resulting in excessive wear of the first and second scrubbing plates 22 and 23, reducing the contact area between the first and second scrubbing plates 22 and the tungsten wire, and leading to inadequate cleaning of the tungsten wire in subsequent applications.

[0042] More preferably, a filter device is added to the overflow tank 6 or the return pipe 8 to filter the washed impurities. The filter device can be a filter screen, filter membrane, etc., and can be added according to actual needs. The filter device is a commonly used technical device in the art, and its specific structure will not be described here.

[0043] For more details, please refer to Figure 3The overflow plate 7 has multiple U-shaped grooves 71. The tungsten wire 100 passes through the U-shaped grooves 71 and is flush with the bottom of the grooves. When the water level in the cleaning tank 5 exceeds the bottom of the U-shaped grooves 71, the excess water flows into the overflow tank 6 and back to the storage tank 3 through the return pipe 8. The second scrubbing plate 23, under the action of gravity, abuts against the tungsten wire 100 to perform friction cleaning. The number of U-shaped grooves 71 can be set as needed to suit the tungsten wire scrubbing process of six-wire, twelve-wire, and twenty-wire electroplating diamond wire production machines.

[0044] For more details, please refer to Figure 1 The first scrubbing plate 22 includes a scrubbing base plate 10 and a lower scrubbing layer 11 disposed on the upper surface of the scrubbing base plate 10. The second scrubbing plate 23 includes a scrubbing cover plate 12 and an upper scrubbing layer 13 disposed on the lower surface of the scrubbing cover plate 12. The position of the scrubbing base plate 10 on the height adjustment rod 9 is adjustable. The scrubbing cover plate 12 is placed on the water surface of the cleaning tank 5. The scrubbing cover plate 12 is disposed between the height adjustment rods 9 and is limited by the height adjustment rods 9. The tungsten wire 100 passes between the upper scrubbing layer 13 and the lower scrubbing layer 11 and rubs and cleans with the upper scrubbing layer 13 and the lower scrubbing layer 11.

[0045] For more details, please refer to Figure 2 The height adjustment rod 9 is installed together with the scrubbing base plate 10, but it is not fixedly connected to the bottom of the cleaning tank 5. The height adjustment rod 9 and the scrubbing base plate 10 are supported at the bottom of the cleaning tank 5 by their own weight. Preferably, the height adjustment rod 9 is a threaded rod, and the height of the scrubbing base plate 10 in the cleaning tank 5 is adjusted by rotating the height adjustment rod 9. There are four height adjustment rods 9, distributed at the four corners of the scrubbing base plate 10.

[0046] In another embodiment, the height adjustment rod 9 is mounted together with the scrubbing base plate 10 and is fixedly connected to the bottom of the cleaning tank 5. The height adjustment rod 9 is provided with a locking device that can move up and down along the height adjustment rod 9. The locking device engages with the scrubbing base plate 10 and adjusts its height in the cleaning tank 5. The locking device can be a buckle or an elastic ring.

[0047] More specifically, the length of the scrubbing cover plate 12 and the scrubbing base plate 10 is 30–100 cm, and the width is 10–50 cm. The diameter of the height adjustment rod 9 is 0.5–5 cm, the length is 10–30 cm, and the distance between the height adjustment rod 9 and the edge of the scrubbing base plate 10 is 0.5–10 cm. The length of the upper scrubbing layer 13 and the lower scrubbing layer 11 is 20–90 cm, and the width is 10–50 cm.

[0048] More specifically, the material of the scrubbing cover 12 is one or more of polytetrafluoroethylene, polybutene, polyethylene, polypropylene, or polyvinyl chloride; the material of the scrubbing base plate 10 is one or more of polytetrafluoroethylene, polybutene, polyethylene, polypropylene, or polyvinyl chloride.

[0049] More specifically, the upper scrubbing layer 13 is made of one or more of the following materials: polypropylene nonwoven fabric, polyester nonwoven fabric, nylon nonwoven fabric, acrylic nonwoven fabric, polyethylene nonwoven fabric, chlorofiber nonwoven fabric, woven cotton fabric, linen fabric, and wool fabric; the lower scrubbing layer 13 is made of one or more of the following materials: polypropylene nonwoven fabric, polyester nonwoven fabric, nylon nonwoven fabric, acrylic nonwoven fabric, polyethylene nonwoven fabric, chlorofiber nonwoven fabric, woven cotton fabric, linen fabric, and wool fabric.

[0050] More specifically, the upper scrubbing layer 13 is attached to the scrubbing cover plate 12 by an adhesive or sewing process, and the lower scrubbing layer 11 is attached to the scrubbing base plate 10 by an adhesive or sewing process.

[0051] Before use, the height adjustment rods 9 at the four corners of the scrubbing base plate 10 are adjusted so that the height of the contact surface between the upper scrubbing layer 13 and the lower scrubbing layer 11 is exactly the same as the height of the tungsten wire 100 opening. During use, when the tungsten wire 100 enters the cleaning tank 5 along the U-shaped groove 71 of the overflow plate 7, the water in the cleaning tank 5 is slightly higher than the height of the tungsten wire 100 opening. When the tungsten wire 100 passes between the upper scrubbing layer 13 and the lower scrubbing layer 11, the upper and lower scrubbing layers 13 and 11 scrub the surface of the tungsten wire 100, removing residual graphite, dust, and other impurities. The scrubbed tungsten wire 100 then proceeds to the next process.

[0052] This invention provides an electroplating production process for a diamond wire saw, which uses tungsten wire 100 as the electroplating busbar, and includes the following steps:

[0053] 1) After the tungsten wire is laid out to 100mm, it is electrolytically polished.

[0054] 2) The tungsten wire 100 after electrolytic polishing is subjected to an acid washing process.

[0055] 3) The tungsten wire 100 after acid pickling undergoes a scrubbing process, which is described in the above text.

[0056] 4) After the wiping process, a smooth tungsten wire 100 is obtained, which is then subjected to the subsequent electroplating diamond process.

[0057] In step 1), electropolishing uses an AC power supply with a voltage range of 2–10V and a frequency of 50Hz. Step 2) can also be replaced by alkaline washing followed by step 3). More specifically, in step 1), the electropolishing solution uses 10g / L sodium hydroxide, and the treatment time is 2.5s; in step 2), the acid washing solution uses 10g / L aminosulfonic acid, and the treatment time is 2.5s.

[0058] Step 1) Before unwinding, it is necessary to check whether the height of the contact surfaces of the upper and lower cleaning layers 13 and 11 is consistent with the height of the tungsten wire 100 opening. In addition, the cleaning materials of the upper and lower cleaning layers 13 and 11 need to be replaced regularly, and the tightness of the height adjustment rod 9 needs to be checked.

[0059] In some other embodiments, step 2) may be an alkaline washing process. The solution used for alkaline washing and the precautions are conventional practices in the art and will not be described in detail here.

[0060] Preferably, step 3) of the wiping process is included between step 1) and step 2), that is, the tungsten wire 100 with a smooth surface is obtained by electrolytic polishing-wiping-acid washing or alkaline washing-wiping. Before the acid washing or alkaline washing step, the tungsten wire 100 after electrolytic polishing is first cleaned, then acid washing or alkaline washing is performed, and then a second cleaning is performed, which can obtain tungsten wire 100 with better surface smoothness.

[0061] Please see Figure 4 , Figure 4 The image shows scanning electron microscope (SEM) images of the tungsten wire 100 before and after processing. The left side shows the tungsten wire 100 without the cleaning process, and the right side shows the tungsten wire 100 after the cleaning process. Figure 4 It can be seen that the surface of the tungsten wire 100 that has not been cleaned has obvious wire marks, while the surface of the tungsten wire 100 that has been cleaned is smooth and flat.

[0062] Those skilled in the art will readily understand that the above-described cleaning process can be integrated into the production method of electroplated diamond wire saws or it can be established separately. Therefore, this invention also provides a cleaning process for tungsten wire. Of course, integrating the cleaning process for tungsten wire into the production method of electroplated diamond wire saws is the optimal solution.

[0063] Compared to existing technologies, this invention offers the following technical advantages: The height of the scrubbing base plate 10 and the scrubbing cover plate 12 can be adjusted by adjusting the height adjustment rod 9, making it suitable for scrubbing processes at different wire opening heights. The scrubbing layer material is simple and convenient to change, suitable for different cleaning requirements of tungsten wires and the needs of large-scale production. Each washing tank 21 with a scrubbing device is separated by a baffle 1, preventing impurities washed off the main wire of the electroplated diamond wire saw in the previous working tank from contaminating the next working tank. This invention provides a cleaning method for electroplated diamond tungsten wires, offering excellent cleaning results and fast cleaning speed. The cleaned tungsten wire can be directly subjected to subsequent pre-plating, sandblasting, and thickening processes, ensuring a firm and reliable coating that meets the specifications of the diamond wire saw.

[0064] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0065] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A cleaning device for tungsten wire, characterized in that: The system includes a washing tank, a water pump, a storage tank, and a delivery pipe. The washing tank contains a cleaning tank, and the space enclosed between the washing tank and the cleaning tank is an overflow tank. An overflow plate is installed on the cleaning tank. The water pump delivers water from the storage tank to the cleaning tank through the delivery pipe. When the water level in the cleaning tank exceeds the overflow plate, excess water flows into the overflow tank and back to the storage tank through a return pipe. The cleaning tank contains at least two height adjustment rods, each equipped with a first scrubbing plate. The position of the first scrubbing plate on the height adjustment rod is adjustable. A second scrubbing plate is located above the first scrubbing plate. During operation, a tungsten wire is threaded between the first and second scrubbing plates and is cleaned by friction between the first and second scrubbing plates when pulled. The overflow plate is provided with multiple U-shaped grooves. The tungsten wire passes through the U-shaped grooves and is flush with the bottom of the U-shaped grooves. When the water level in the cleaning tank exceeds the bottom of the U-shaped grooves, the excess water will flow into the overflow tank and return to the storage tank through the return pipe. The first scrubbing plate includes a scrubbing base plate and a lower scrubbing layer disposed on the upper surface of the scrubbing base plate. The second scrubbing plate includes a scrubbing cover plate and an upper scrubbing layer disposed on the lower surface of the scrubbing cover plate. The tungsten wire is threaded between the upper scrubbing layer and the lower scrubbing layer and is scrubbed and cleaned by the upper scrubbing layer and the lower scrubbing layer when pulled.

2. The tungsten wire cleaning device according to claim 1, characterized in that: The height adjustment rod is threadedly installed with the scrubbing base plate, and the height of the scrubbing base plate in the cleaning tank can be adjusted by rotating the height adjustment rod.

3. The tungsten wire cleaning device according to claim 2, characterized in that: There are four height adjustment rods, which are distributed at the four corners of the scrubbing base plate.

4. The tungsten wire cleaning device according to claim 1, characterized in that: The material of the scrubbing cover is one or a mixture of polytetrafluoroethylene, polybutene, polyethylene, polypropylene, or polyvinyl chloride; the material of the scrubbing base plate is one or a mixture of polytetrafluoroethylene, polybutene, polyethylene, polypropylene, or polyvinyl chloride.

5. The tungsten wire cleaning device according to claim 1, characterized in that: The upper scrubbing layer is attached to the scrubbing cover plate by an adhesive or sewing process, and the lower scrubbing layer is attached to the scrubbing base plate by an adhesive or sewing process.

6. A method for cleaning tungsten wire, applied in the production process of electroplated diamond wire saws, characterized in that, Includes the following steps: Before electroplating the tungsten wire with diamond, the tungsten wire is cleaned using a cleaning device as described in any one of claims 1-5.

7. A method for producing an electroplated diamond wire saw, wherein tungsten wire is used as the electroplating busbar, characterized in that, Includes the following steps: 1) Electrolytic polishing of the tungsten wire; 2) The tungsten wire after electrolytic polishing is acid-washed or alkali-washed; 3) The tungsten wire after acid washing or alkali washing is wiped clean according to the cleaning method described in claim 6; 4) Electroplating diamond onto the cleaned tungsten wire.

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