Test equipment for data storage devices

Abstract

A test device for a data storage device (DSD), the test device comprising a chassis and at least one interface module, the interface module being configured to be removably inserted into the chassis and accommodating a plurality of interface boards. Each interface board comprises a DSD connector for connecting the DSD to the interface board and a backplane connector for connecting to a backplane to communicate with a corresponding computing unit. In one aspect, the at least one interface module comprises a housing and a plurality of openings on a side of the housing, wherein each opening is configured to receive a corresponding interface board. A plurality of guide member pairs are positioned to guide the corresponding interface board when inserted into the corresponding opening so that the backplane connector is located at a corresponding predetermined position for connection to the backplane. In another aspect, the interface board is removable from the interface module.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. non-provisional application No. 17 / 458,045, filed on August 26, 2021, entitled “TESTING APPARATUS FOR DATA STORAGE DEVICES,” for all purposes and the entire contents of that patent application are hereby incorporated by reference. Background Art

[0003] Manufacturers of data storage devices (DSDs) such as solid-state drives (SSDs) often test DSDs before the device leaves the factory to ensure quality control, such as in terms of data retention or operational performance. In some cases, many DSDs can be tested simultaneously in a test device. However, there are many SSDs of different form factors, such as U.215mm, U.27mm, E3, M.2, and EDSFF, each of which has different physical sizes and different connectors for different types of DSDs. Testing for these different form factors usually requires disassembly of the test device and replacement of components such as new backplanes to adapt to different form factors, or use of dedicated test devices for each form factor. Even in the case of dedicated test devices for specific form factors, it may also be difficult to access DSDs to replace them with other DSDs to be tested. In addition, backplanes using a fast peripheral component interconnect (PCIe) bus may suffer from problems with wiring in terms of data errors, which are often used in temperature-controlled test devices to thermally isolate the DSD from the backplane and test the computer connected to the DSD. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] The features and advantages of the embodiments of the present disclosure will become more apparent through the detailed description described below and in conjunction with the accompanying drawings. The drawings and associated descriptions are provided to illustrate the embodiments of the present disclosure, rather than to limit the scope of the claimed protection.

[0005] Figure 1 is a front perspective view of the exterior of a testing device according to one or more embodiments.

[0006] Figure 2 According to one or more embodiments Figure 1 A front view of the test setup with some internal components exposed.

[0007] Figure 3 is a front perspective view of an interface module according to one or more embodiments.

[0008] Figure 4is a front perspective view of an interface module housing a data storage device (DSD) and an interface board according to one or more embodiments.

[0009] Figure 5 Depicted are interface boards connected to DSDs having different form factors according to one or more embodiments.

[0010] Figure 6 Depicted is a front view of an interface module for DSDs having different form factors according to one or more embodiments.

[0011] Figure 7 According to one or more embodiments Figure 6 Front perspective view of the interface module housing the DSD and interface board.

[0012] Figure 8 is a rear perspective view of a test device according to one or more embodiments, depicting a removable computing module before being fully inserted into or removed from the test device.

[0013] Fig. 9 is a rear perspective view of a removable computing module according to one or more embodiments. DETAILED DESCRIPTION

[0014] In the following detailed description, many specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it will be apparent to one of ordinary skill in the art that the various embodiments disclosed may be practiced without some of these specific details. In other cases, well-known structures and techniques are not shown in detail to avoid unnecessarily obscuring the various embodiments.

[0015] Figure 1 1 is a front perspective view of the exterior of a test apparatus 100 according to one or more embodiments. The test apparatus 100 is used to test a data storage device (DSD), which may also be referred to herein as a device under test (DUT). In some embodiments, the test apparatus 100 may be used, for example, to test a DSD, such as a solid state drive (SSD). The test may be performed, for example, by a manufacturer as part of a quality control process, or to test the performance of the DSD at different temperatures, such as data retention, or to determine safe temperature operating limits. Such temperature control testing is described in more detail in application Ser. No. 17 / 412,889, which is incorporated by reference above.

[0016] like Figure 1As shown, the test device 100 is placed on a surface 10, which can be a floor or other substantially horizontal surface (e.g., within 5 degrees of ground plane) for supporting the test device 100. As used herein, horizontal or substantially horizontal can refer to a plane that is parallel or substantially parallel (e.g., within 5 degrees) to the surface (i.e., surface 10) on which the test device 100 is placed. The test device 100 includes a door 104 that provides access to an internal chamber or space (e.g., a DSD to be tested) within a chassis 106. Figure 2 The door 104 includes an air inlet 108. A and 108 B The device is used to draw fluid, such as air, from outside the test device 100 to cool the DSD inside the test device 100 .

[0017] exist Figure 1 In an example of the present invention, the test device 100 includes an exhaust hood 102 for exhausting fluid from the test device 100. In some implementations, the amount of fluid exhausted from the test device 100 is controlled to adjust the relative amount of fluid drawn into the chamber and recirculated or circulated within the chamber to achieve or maintain a target temperature in the chamber. In other implementations, the exhaust hood 102 can be omitted, such as by exhausting the fluid from the test device 100 to the environment outside the test device 100, as opposed to directing the exhausted fluid to an outlet.

[0018] As will be understood by those skilled in the art with reference to this disclosure, other specific implementations of the test device 100 may include Figure 1 For example, other implementations may include a different number of air inlets 108 or a different footprint of the test device 100, such that the test device 100 may be a bench mounted test device.

[0019] Figure 2 According to one or more embodiments Figure 1 1. A front view of the test apparatus of FIG. 1 with door 104 removed to show certain internal components. Figure 2 As shown, interface modules 1101, 1102, 1103, 1104, 1105, 1106, 1107, and 1108 are located inside chamber 140 in chassis 106 of test device 100. Figure 2 Each interface module 110 in the example of FIG. 1 accommodates sixteen DSDs that can be removed and inserted into an opening in the front of the interface module 110. The DSDs are arranged in horizontal or substantially horizontal rows relative to the surface 10. Each horizontal row in the interface module 110 includes two DSDs. In addition, each interface module 110 accommodates an interface board (e.g., Figure 4 , Figure 5 and Figure 7 The interface module 110 itself, with or without the DSD and interface board, can be removed and inserted into the chamber 140, into any of the eight different positions shown therein.

[0020] Those skilled in the art will appreciate that other implementations may include different arrangements for the interior of the test device 100. For example, other implementations may include Figure 2 Different numbers of interface modules or different numbers of DSDs per interface module are shown.

[0021] Figure 3 is a front perspective view of an empty interface module without any DSD or interface board according to one or more embodiments. Figure 3 As shown, the interface module 1101 includes sixteen openings on the front side of the interface module 1101, such as openings 1121 and 1122. The openings 1121 and 1122 are arranged in a top horizontal or substantially horizontal row. Each opening on the front side of the interface module 1101 can receive an interface board and a DSD. The recess 116 1A and 116 1B A support is provided for holding or securing the DSD in position in the opening 1121. Recess 116 2A and 116 2B A support is provided for holding or securing the DSD in position in the opening 1122. The recess 116 may be coupled to a locking tab or another locking mechanism that may form part of the interface plate, such as a Figure 5 Other implementations may use different locking mechanisms, such as locking clips or rotating locks, for example.

[0022] Each opening also corresponds to a pair of guide members, such as guide members 118 2A and 118 2B , which are positioned to guide an interface board inserted through the opening so that the backplane connector of the interface board (e.g. Figure 5 The backplane connector 123 in the test device 100 is located at a predetermined position relative to the chassis 106 of the test device 100 and relative to the housing 1261 of the interface module 1101 for connecting to the backplane (e.g., Figure 8 A and Figure 8 B). Figure 3 In the example of FIG. 12 , the backplane connector is configured to protrude from a rear opening, such as rear opening 1202 , for connection to a backplane.

[0023] Handles 1141 and 1142 can facilitate insertion and removal of interface module 1101 into and from a test device. In this regard, the first space or chamber of the test device can include a shelf or slats for receiving interface module 1101 and holding it in place within chamber 140. Interface module 110 can also be interchanged between different test devices, such as test device 100. Figure 3 In some implementations, handles 114 are removable, but other implementations may include non-removable handles or a different number of handles.

[0024] Those of ordinary skill in the art will appreciate that other specific implementations of the interface module 1101 may be different. For example, the interface module 1101 may include openings of different sizes for receiving DSDs having different form factors, openings of different sizes at the back of the interface module 1101, or a mixture of no openings at the sides of the interface module 1101.

[0025] Figure 4 1 is a front perspective view of an interface module 1102 housing a DSD and an interface board within a housing 1262 according to one or more embodiments. Figure 2 As shown, the interface module 1102 includes eight horizontal or substantially horizontal rows of DSDs, such as DSDs 201 and 202, which have been inserted into openings 1123 and 1124, respectively, to be partially accommodated in corresponding compartments of the interface module 1102. Each DSD is connected to the interface board via a DSD connector (not shown) of the interface board. In the example of DSD 202, the interface board 1222 is removably connected to the DSD 202, and the backplane connector 1232 of the interface board 1222 is accessible via an opening 1204 on the rear side of the interface module 1102 opposite the front opening 112.

[0026] As with the interface module 1101 discussed above, Figure 4 The interface board and DSD shown in FIG. 1 are removable from the interface module 1102. In this regard, the interface board is supported and guided to a predetermined position using a pair of guide members on opposite sides of each opening. The guide members 1184 are located at the bottom of the interface module 1102. Figure 4 12 and is used to support and guide the interface board 1222.

[0027] exist Figure 4 In the example of , the interface module 1102 and the interface board are configured so that each interface board can be inserted into any front opening. Similarly, Figure 4Each DSD in the example can be partially inserted into any of the front openings to connect with any of the interface boards previously inserted into the interface module 1102. This interchangeability of DSDs can reduce the testing time of a large number of DSDs in a test device because the DSD can be conveniently inserted into the front opening of the test device before replacing the DSD with a new DSD to be tested and removed when the test is completed. In some cases, the entire interface module 1102 can be exchanged with a different interface module that may already include an interface board and / or DSD to be tested. In this regard, handles 1143 and 1144 can be used to remove the interface module 1102 from the test device chamber or insert the interface module into the test device chamber.

[0028] As discussed in more detail below, the interface module 1102 can also accommodate a variety of different form factors by replacing the interface board in the housing 1262. In some embodiments, the front opening can be different sizes to accommodate different form factors, or can all be the same size that can also accommodate different form factors, such as Figure 4 Those skilled in the art will appreciate that the interface module 1102, DSD, and interface board may have Figure 4 For example, other implementations may not include an opening on a side of the interface module 1102, or may include a different number of front openings.

[0029] Figure 5 Depicted are interface boards connected to DSDs having different form factors according to one or more embodiments. Figure 5 Each DSD in has a different form factor and a different corresponding interface board. DSD 203 has a U.2 15mm form factor, DSD 204 has an E3 form factor, DSD 205 has an M.2 form factor, DSD 206 has an EDSFF form factor, and DSD 207 has a U.27mm form factor. As will be understood by those of ordinary skill in reference to the present invention, various other interfaces may be used. Figure 5 Form factors and corresponding interface boards other than those shown in .

[0030] In addition to having different physical dimensions, Figure 5 Each DSD in the embodiment uses a different type of connection to its corresponding interface board. In this regard, interface board 1221 of DSD 203 uses DSD connector 1251, interface board 1222 of DSD 204 uses DSD connector 1252, interface board 1223 of DSD 205 uses DSD connector 1253, interface board 1224 of DSD 206 uses DSD connector 1254, and interface board 1225 of DSD 207 uses DSD connector 1255.

[0031] The backplane connectors 1231, 1232, 1233, 1234, and 1235 of the interface boards 1221, 1222, 1223, 1224, and 1225 respectively utilize the same high-speed peripheral component interconnect (PCIe) connector for a unified backplane connection. Such standardization on one backplane connector type such as PCIe can facilitate the interchangeability of different types of interface boards into different slots or compartments of the interface module. In addition to having different DSD connector types, Figure 5 The interface board 122 in the embodiment also has different physical shapes to accommodate different size types of DSDs.

[0032] Figure 5 Each interface plate 122 in the embodiment also includes a DSD support having a locking mechanism to stabilize or retain the DSD in the opening of the interface module. Figure 5 In the example of FIG. 1 , DSD supports 1271 , 1272 , 1273 , 1274 , and 1275 hold DSDs 203 , 204 , 205 , 206 , and 207 in a position such as Figure 3 The openings 1121 and 1122 in Figure 4 In addition, locking tabs 1241, 1242, 1243, 1244 and 1245 can lock or secure DSDs 203, 204, 205, 206 and 207 into their respective openings. The pair of locking tabs 124 for each DSD can be locked to a position such as Figure 3 The DSD may be inserted into the notch 116 of the interface module 1101 to secure the DSD into the opening.

[0033] Those skilled in the art will appreciate that other locking mechanisms or interface plates may be used in other implementations. For example, other interface plates may have different shapes or DSD supports to accommodate different form factors.

[0034] Figure 6 Depicted is a front view of an interface module for DSDs having different form factors according to one or more embodiments. Figure 6 As shown, interface modules 1103 and 1101 include front openings in housings 1263 and 1261, respectively. Openings 1125 and 1126 in interface module 1103 and openings 1121 and 1122 in interface module 1101 have slightly different sizes to accommodate different form factors or types of DSDs. In addition, the relative positions of the recesses with respect to the front opening in interface module 1103, such as recess 116 3A , 116 3B , 116 4A and 116 4B, different from the relative position of the notch relative to the front opening in the interface module 1101, such as the notch 116 1A , 116 1B , 116 2A and 116 2B The position of the guide member within the interface modules 1103 and 1101 (eg, guide member 118 2B ) may also be different to accommodate DSDs with different form factors, such as by being located at half height more toward the front opening, rather than below half height as is the case with the recess in interface module 1101. Like handles 1141 and 1142 of interface module 1101, handles 1145 and 1146 facilitate insertion and removal of interface module 1103 into and from a test device.

[0035] Figure 7 According to one or more embodiments Figure 6 Front perspective view of the interface module housing the DSD and interface board. Figure 7 As shown, interface module 1103 accommodates three different types of DSDs having different form factors, and interface module 1101 accommodates four different types of DSDs having different form factors. In this regard, interface module 1103 can accommodate DSD 206 and DSD 205, due in part to different interface boards, such as interface board 1223. Figure 7 In the example, by using Figure 5 DSD 206 is held in place in interface module 1103 by using DSD supports 1274 and locking tabs 1244 of interface plate 1224 shown in FIG. Similarly, DSD 205 is held in place in interface module 1103 by using DSD supports 1273 and locking tabs 1243 of interface plate 1223.

[0036] With respect to the interface module 1101, the DSD 203 is fixed to the interface module 1101 with the DSD support 1271 and the locking tab 1241. The DSD 204 is fixed to the interface module 1101 with the DSD bracket 1271 and the locking tab 1241, and the DSD 204 is fixed to the interface module 1101 with the DSD bracket 1272 and the locking tab 1242. Figure 7 As shown, interface boards 1225 and 1222 are used to connect to the communication with DSDs 207 and 204, respectively. The interchangeability of DSDs having different form factors and corresponding interface boards that can be used with the interface module can allow DSDs having different form factors to be tested simultaneously. For a given opening in the interface module, the only change required to switch from one form factor to another is to change the interface board. This arrangement allows for greater flexibility in the equipment used to test the DSD.

[0037] Figure 8 is a rear perspective view of the test device 100 according to one or more embodiments, depicting the removable computing module 1281 before being fully inserted into or fully removed from the test device 100. Figure 8 As shown, the removable computing module 1281 is a portion of the rear portion or back volume of the test apparatus 100 located behind the test chamber or front volume that houses the interface module. For its part, the removable computing module 1281 houses one or more computing units that may include, for example, processing circuitry that has been programmed to run tests on the DSD in the test chamber of the test apparatus, such as one or more central processing units (CPUs), field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), or graphics processing units (GPUs).

[0038] exist Figure 8 In the example of FIG. 1 , removable computing unit 1281 corresponds to an interface module in chamber 140 that is accessed from the front of test apparatus 100 via door 104. Removable computing unit 1281 may be adjacent to the corresponding interface module or on the opposite side of a wall between the corresponding interface module and removable computing unit 1281 to allow a direct connection between an interface board inside the corresponding interface module and a backplane of removable computing module 1281 (i.e., Fig. 9 Back plate 136 shown).

[0039] At this point, Figure 8 Each of the removable computing modules 1281, 1282, 1285, and 1286 shown in the figure can correspond to a corresponding interface module in chamber 140, which is accessed from the front of test device 100 via door 104. Removable computing modules 128 can be removed from and inserted into any of the different locations using, for example, rails in test device 100. In some implementations, removable computing modules 128 can also be secured to test device 100 using screws or other locking mechanisms. The interchangeability of computing units 128 in test device 100 can facilitate making changes to one or more computing units in removable computing modules 128 before reinserting a computing module 128 into its previous location or before exchanging a computing module with a different removable computing module 128.

[0040] Fig. 9 is a rear perspective view of a removable computing module 1281 according to one or more embodiments. Fig. 9 As shown, removable computing module 1281 includes back plate 136 and thermal insulation wall 134. The computing unit of removable computing module 1281 is directly connected to back plate 136, which in turn is directly connected to the interface board inside the corresponding interface module in chamber 140.

[0041] exist Fig. 9 In the example of FIG. 1 , the computing unit, which may be part of the motherboard, is separated from the test chamber and its corresponding interface module by a thermally insulating wall 134 that provides a thermal barrier between the test chamber and the test engine compartment 128. As discussed in application Ser. No. 17 / 412,889, incorporated by reference above, the test chamber may be temperature controlled to run different tests at different temperatures or to ensure operation of the DSD at or near a target temperature.

[0042] The backplane 136 allows wireless connection to an interface board in the test chamber without compromising the thermal isolation provided by the insulating wall 134. In contrast, conventional temperature test devices for DSDs typically use wires with grommets around the wires for communicating with the DSD in a temperature controlled test chamber. However, bus standards such as PCIe may suffer from noise induced errors due to such wiring. The arrangement of the backplane 136 on the insulating wall 134 may provide a direct connection to the interface board, which in turn is directly connected to the DSD to avoid wiring while still providing thermal isolation of the test chamber.

[0043] As discussed above, the foregoing arrangement of removable interface modules and removable interface boards can facilitate testing of DSDs having different form factors using the same test apparatus. Such interchangeability can avoid complex disassembly of test equipment to accommodate different form factors. Additionally, the interface board can allow for wire-free connection to the backplane and computing unit while still thermally isolating the DSD from the computing unit and backplane in different bays of the test apparatus for better temperature control.

[0044] Other Implementations

[0045] Those skilled in the art will appreciate that the various illustrative logic blocks, modules, and processes described in conjunction with the examples disclosed herein may be implemented as electronic hardware, computer software, or a combination of both. In addition, the aforementioned processes may be embodied in a computer-readable medium that enables a processor or controller circuit system to perform or implement certain functions.

[0046] To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, and modules have been generally described above in terms of their functionality. Whether this functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. One of ordinary skill in the art may implement the described functionality in different ways for each specific application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

[0047] The various illustrative logic blocks, units, modules, processor circuit systems, and controller circuit systems described in conjunction with the examples disclosed herein may be implemented or executed with a general purpose processor, GPU, digital signal processor (DSP), ASIC, FPGA or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, but in an alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. The processor or controller circuit system may also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, multiple microprocessors, SoC, one or more microprocessors in combination with a DSP core, or any other such configuration.

[0048] The activities of the methods or processes described in conjunction with the examples disclosed herein may be directly embodied in hardware, in software modules executed by a processor or controller circuit system, or in a combination of the two. The steps of the method or algorithm may also be performed in an order alternative to the order provided in the example. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable medium, an optical medium, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor or controller circuit system so that the processor or controller circuit system can read information from the storage medium and can write information to the storage medium. In an alternative, the storage medium may be a component of the processor or controller circuit system. The processor or controller circuit system and the storage medium may reside in an ASIC or SoC.

[0049] The above description of the exemplary embodiments of the present disclosure is provided to enable any person of ordinary skill in the art to make or use the embodiments of the present disclosure. Various modifications to these examples will be apparent to those of ordinary skill in the art, and the principles disclosed herein may be applied to other examples without departing from the spirit or scope of the present disclosure. The embodiments described are to be considered in all respects to be merely exemplary and non-restrictive. In addition, the language used in the form of "at least one of A and B" in the following claims should be understood to mean "only A, only B, or both A and B".

Claims

1. A testing device for testing a data storage device, namely a DSD, the testing device comprising: Chassis; and at least one interface module configured to be removably inserted into the chassis and to accommodate a plurality of interface boards, Each of the plurality of interface boards comprises a DSD connector for connecting the DSD to the interface board and a backplane connector for directly connecting to a backplane to communicate with a corresponding computing unit.

2. The test device of claim 1 , wherein the at least one interface module comprises a plurality of openings for receiving the plurality of interface boards, and The plurality of interface boards are removable from the at least one interface module such that each of the plurality of interface boards is configured to be inserted into any one of the plurality of openings of the at least one interface module.

3. The test device of claim 1 , wherein the at least one interface module comprises a plurality of openings for receiving the plurality of interface boards and corresponding DSDs, and Wherein the plurality of openings include openings of different sizes for receiving DSDs having different form factors. 4 . The testing device according to claim 1 , wherein the backplane connectors of the plurality of interface boards are of the same type, and at least two of the DSD connectors of the plurality of interface boards are of different types from each other.

5. The test device according to claim 1, further comprising a computing module configured to be removably inserted into the chassis and to accommodate a plurality of computing units, wherein each computing unit of the plurality of computing units is configured to be connected to the backplane.

6. The test device of claim 1 , wherein the at least one interface module comprises a plurality of first openings on a first side, each opening of the plurality of openings being configured to receive a respective interface board, and Wherein the plurality of openings are arranged in at least one horizontal row relative to a surface on which the testing device is placed.

7. The testing device according to claim 1, wherein the at least one interface module comprises: a plurality of first openings, the plurality of first openings at a first side, each opening of the plurality of first openings being configured to receive a respective interface board; and A plurality of guide member pairs are positioned to guide respective interface boards when received in respective first openings of the plurality of first openings such that backplane connectors of the interface boards are positioned at predetermined positions relative to the chassis for connection to a backplane. 8 . The testing device according to claim 1 , further comprising a thermal insulation wall, the thermal insulation wall separating a first space in the chassis from the backplane, the first space being configured to receive the at least one interface module.

9. An interface module for testing a test device for testing a data storage device (DSD), the interface module comprising: shell; a plurality of openings, the plurality of openings on the first side of the housing, each opening of the plurality of openings being configured to receive a respective interface board; and A plurality of guide member pairs are positioned to guide respective interface boards when inserted into respective ones of the plurality of openings so that a backplane connector of each respective interface board is positioned at a respective predetermined position relative to the housing for direct connection to a backplane of the test device.

10. The interface module of claim 9, wherein the respective interface boards are removable from the plurality of openings such that each of the respective interface boards is configured to be inserted into any one of the plurality of openings.

11. The interface module of claim 9, wherein the plurality of openings are further configured to receive respective DSDs, and Wherein the plurality of openings include openings of different sizes for receiving DSDs having different form factors.

12. The interface module according to claim 9, wherein the corresponding interface board further comprises a DSD connector for communicating with a DSD, and The backplane connectors of the corresponding interface boards are of the same type, and at least two of the DSD connectors of the corresponding interface boards are of different types.

13. The interface module of claim 9, wherein the plurality of openings are arranged in at least one horizontal row relative to a surface on which the test device is placed.

14. The interface module of claim 9, wherein the interface module is configured to be removably inserted into a chassis of the testing device.

15. The interface module of claim 9, wherein the testing device comprises a thermally insulating wall separating the interface module from the backplane.

16. A testing device for testing a data storage device (DSD), the testing device comprising: Chassis; means for receiving a plurality of removable interface boards in the chassis, wherein each removable interface board of the plurality of removable interface boards is configured to be removably inserted into the means for receiving the plurality of removable interface boards, wherein each of the plurality of removable interface boards comprises a DSD connector for connecting to a DSD and a backplane connector for connecting to a backplane to communicate with a corresponding computing unit; as well as A thermally insulating wall separates a first space within the chassis from the backplane, the first space being configured to receive means for housing the plurality of removable interface boards.

17. The testing apparatus of claim 16, wherein the means for receiving the plurality of removable interface boards is configured to be removably inserted into the chassis.

18. The testing device according to claim 16, wherein the device for accommodating the plurality of removable interface boards is configured to guide the corresponding removable interface boards so that when the removable interface boards are inserted into the device for accommodating the plurality of removable interface boards, the backplane connector of each corresponding removable interface board is positioned at a corresponding predetermined position relative to the chassis for connection to the backplane.

19. The testing device of claim 16, further comprising means for removably inserting a plurality of computing units into the chassis housing the plurality of computing units, wherein each of the plurality of computing units is configured to connect to the backplane.

20. The testing device of claim 16, wherein the backplane connector of each removable interface board of the plurality of removable interface boards is configured to connect directly to the backplane.

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