An anti-radiation image acquisition device and an image acquisition method thereof

Abstract

The application discloses an anti-radiation image acquisition device and an image acquisition method thereof. The anti-radiation image acquisition device comprises an optical lens module, a substrate, a sensor module, an integrated module, a storage module, an output module and a shielding bin. The substrate comprises a substrate proximal end and a substrate distal end. The sensor module is arranged on the substrate proximal end, and the integrated module is arranged on the substrate distal end. The anti-radiation image acquisition device effectively protects the radiation-sensitive devices, reduces the probability of damage of the image acquisition device due to radiation, and improves the durability and stability.

Description

Technical Field

[0001] This invention relates to the field of electronic technology, and in particular to a radiation-resistant image acquisition device and its image acquisition method. Background Technology

[0002] When electrical appliances are exposed to high radiation environments, the modules in operation are affected by the radiation, resulting in electron traps, holes, and displacement damage. This damage accumulates over time, leading to performance degradation or failure. In the case of image acquisition devices such as cameras, in addition to damage to the components themselves, the operating current and voltage are also affected, causing image quality degradation, filter blurring, distortion, and even malfunction.

[0003] Existing technologies mainly address this issue by adding heavy physical shielding. While this can be effective to some extent, it increases the weight of the device, causing inconvenience in installation and use. Furthermore, image acquisition devices still suffer from problems such as short lifespan, poor durability, and poor stability, which bring numerous challenges to practical work.

[0004] The above background information is provided only to assist in understanding the inventive concept and technical solution of this invention. It does not necessarily belong to the prior art of this patent application, nor does it necessarily provide technical teaching. In the absence of clear evidence that the above information was disclosed before the filing date of this patent application, the above background information should not be used to evaluate the novelty and inventiveness of this application. Summary of the Invention

[0005] The purpose of this invention is to provide a radiation-resistant image acquisition device and its image acquisition method, which effectively protects radiation-sensitive devices, reduces the probability of image acquisition devices being damaged by radiation, and improves durability and stability.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0007] A radiation-resistant image acquisition device, the radiation-resistant image acquisition device comprising:

[0008] An optical lens module, comprising a first channel, a second channel, and a reflective element, wherein the reflective element is configured to reflect incident light from the first channel to the second channel;

[0009] A circuit board, disposed along the extension direction of the second channel, is made of a radiation-resistant material. The circuit board houses a sensor module, an integrated module, a storage module, and an output module, wherein the integrated module, storage module, and output module are located further away from the reflective element than the sensor module.

[0010] A shielded compartment is configured to house the optical lens module, circuit board, sensor module, integrated module, storage module, and output module. The shielded compartment has an opening corresponding to the entrance of the first channel.

[0011] in,

[0012] The sensor module is configured to convert optical signals into electrical signals;

[0013] The integrated module includes a signal processing module, a filtering module, a power supply, and a power management module. The signal processing module is configured to read the electrical signal output by the sensor module and perform image processing operations on it to obtain image information. The filtering module is configured to filter the image information obtained by the signal processing module. The power supply is used to supply power to the sensor module, the signal processing module, and the filtering module. The power management module is configured to control the output of the power supply.

[0014] The storage module is configured to receive and store signal data output from the filtering module of the integrated module;

[0015] The output module is configured to call and output the signal data stored in the storage module.

[0016] Each module in the integrated module is sensitive to radiation and easily damaged by radiation. The topological design of the reflective element and the substrate ensures that the rays being collected do not directly face the integrated module, reducing the amount of radiation received by the integrated module. The shielding chamber further protects the integrated module.

[0017] Furthermore, based on any or a combination of the aforementioned technical solutions, the number of integrated modules is multiple, and the multiple integrated modules are arranged side by side. Each integrated module has a working state and a standby state. At any given time, only one integrated module is in the working state, while the other integrated modules are in the standby state.

[0018] The radiation-resistant image acquisition device also includes a feedback module disposed in the shielding chamber. The feedback module is connected to multiple integrated modules respectively. The feedback module is configured to monitor the integrated modules that are currently in operation and feed back the monitoring results to the power management module of the integrated modules.

[0019] If the monitoring result exceeds the preset normal range, the power management module controls the integrated module to stop working and controls one of the remaining integrated modules to switch to working state.

[0020] As mentioned earlier, due to their operating characteristics, integrated modules are extremely susceptible to damage from radiation when powered on. The use of multiple integrated modules allows for timely switching to other working modules if the currently used module fails, thus protecting data from loss, maintaining the stability of the radiation-resistant image acquisition device, and extending its lifespan. Integrated modules in standby mode are not powered on. Since no circuitry is active in these modules, charge easily diffuses and recombines, making them less susceptible to radiation damage in a short time. Therefore, this "cold backup" redundancy technique results in an even longer lifespan.

[0021] Furthermore, following any or a combination of the aforementioned technical solutions, the feedback module is configured to detect the output voltage and / or current information of the power supply. If the voltage and / or current information exceeds a preset normal range, the feedback module feeds back the monitoring results to the first power management module of the currently operating integrated module and the second power management module of one of the remaining integrated modules.

[0022] The first power management module controls the power supply in its integrated module to stop supplying power, while the second power management module controls the power supply in its integrated module to start supplying power.

[0023] Furthermore, following any one or a combination of the aforementioned technical solutions, after the first power management module controls the power supply in its integrated module to stop supplying power, the communication between the integrated module and the feedback circuit is cut off.

[0024] Furthermore, in accordance with any or a combination of the aforementioned technical solutions, the feedback module is also electrically connected to the output module;

[0025] Each integrated module or power management module is pre-set with a unique and identifiable ID number. If the integrated module is in working state, its corresponding ID number is associated with the working state; if the integrated module is in standby state, its corresponding ID number is associated with the standby state; if the integrated module switches from working state to stopped working state, its corresponding ID number is associated with the damaged state.

[0026] The feedback module is configured to send the status associated with the ID number of each integration module to the output module.

[0027] Furthermore, following any one or a combination of the aforementioned technical solutions, the radiation-resistant image acquisition device also includes a warning device, which is configured to issue a warning signal when the number of ID numbers associated with damage states reaches a preset value or percentage value.

[0028] Furthermore, following any one or a combination of the aforementioned technical solutions, the filtering module is configured with a pre-analysis unit and multiple filtering units with different filtering levels. The pre-analysis unit is configured to perform noise analysis on the information to be filtered received by the filtering module and select a suitable filtering unit based on the results of the noise analysis.

[0029] Furthermore, in accordance with any one or a combination of the aforementioned technical solutions, the reflective element is made partly or entirely of lead-containing glass;

[0030] And / or, the shielding chamber is made partly or entirely of radiation-resistant material.

[0031] Furthermore, based on any or a combination of the aforementioned technical solutions, the circuit board is made of one or more materials selected from glass fiber cloth, polytetrafluoroethylene, ceramics, and silicon carbide; the selection of the substrate material enhances the durability and reliability of the radiation-resistant image acquisition device.

[0032] And / or, the shielding chamber is made partly or entirely of epoxy resin and / or ceramic.

[0033] Furthermore, following any or a combination of the aforementioned technical solutions, the power management module controls the output of the power supply and optimizes the bias voltage of the power supply output. This ensures sufficient photon accumulation while reducing dark current caused by radiation, resulting in better camera imaging.

[0034] According to another aspect of the present invention, a radiation-resistant image acquisition method based on the above-described method is provided, comprising the following steps:

[0035] S1. The N integrated modules are pre-numbered sequentially from 1 to N;

[0036] S2. Record the number M of the integrated module that is currently in operation, where M≤N;

[0037] S3. Monitor the status data of integrated module M;

[0038] S4. Compare the monitored status data with the pre-stored reference data range. If the status data falls within the reference data range, proceed to step S3; otherwise, proceed to step S5.

[0039] S5. If (M+1)≤N, then start the (M+1) integrated module, put the (M+1) integrated module into working state, shut down the M integrated module, put the M integrated module into standby state, assign M=M+1, and jump to step S3; otherwise, shut down the M integrated module, put the M integrated module into standby state, and issue a warning signal.

[0040] The beneficial effects of the technical solution provided by this invention are as follows:

[0041] a. The topology design of the optical lens module and circuit board effectively protects radiation-sensitive devices and reduces the probability of damage caused by radiation.

[0042] b. The overall topology and shielding chamber design enable the radiation-resistant image acquisition device to maintain a relatively light weight while improving radiation resistance and stability, thus bringing convenience to its operation.

[0043] c. Select radiation-resistant materials for the circuit board to improve the stability of the circuit structure;

[0044] d. The design of multiple integrated modules constitutes a "cold backup" for the device. Under the premise of only a small increase in overall weight and cost, it greatly improves the stability and reliability of the radiation-resistant image acquisition device. It can effectively solve the problem of instrument failure when suddenly detecting a super strong radiation source in actual work, and also extend the life of a single radiation-resistant image acquisition device, avoid the waste of radiation-insensitive devices, and reduce the overall cost of use. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 A cross-sectional schematic diagram of a radiation-resistant image acquisition device provided as an exemplary embodiment of the present invention from a forward viewing angle;

[0047] Figure 2 A cross-sectional schematic diagram of a radiation-resistant image acquisition device provided as an exemplary embodiment of the present invention from a stereoscopic perspective;

[0048] Figure 3 A schematic diagram of the overall appearance of a radiation-resistant image acquisition device provided for an exemplary embodiment of the present invention;

[0049] Figure 4A circuit diagram of a radiation-resistant image acquisition device provided as an exemplary embodiment of the present invention.

[0050] Reference numerals: 1-Optical lens module, 11-Acquisition inlet, 12-Reflective element, 2-Sensor module, 3-Integrated module, 4-Shielding chamber, 41-Opening. Detailed Implementation

[0051] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0052] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, apparatus, product, or device that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0053] See Figures 1-3 In one embodiment of the present invention, a radiation-resistant image acquisition device is provided, comprising:

[0054] The optical lens module 1 includes a first channel, a second channel, and a reflective element 12. The first channel and the second channel can intersect at 90°. The reflective element 12 is configured to completely reflect the light entering through the acquisition inlet 11 of the first channel to the second channel, and propagate along the extension direction of the second channel. Preferably, leaded glass is provided at the acquisition inlet 11, and the reflective element 12 is made of leaded glass. To ensure accuracy, the reflective element 12 is set as a total reflection mirror, which can effectively block some rays while avoiding direct exposure to radiation.

[0055] A circuit board, disposed along the extension direction of the second channel, is made of a radiation-resistant material. The circuit board houses a sensor module, an integrated module, a storage module, and an output module, wherein the integrated module, storage module, and output module are located further away from the reflective element than the sensor module. The circuit board is directly or indirectly connected to the optical lens module 1 and is made of a high-radiation-resistant material, including a near end and a far end. The distance from the far end of the substrate to the optical lens module 1 is greater than the distance from the near end of the substrate to the optical lens module 1. The high-radiation-resistant material can be fiberglass cloth, polytetrafluoroethylene, ceramics, silicon carbide, or other materials considered to have good radiation resistance. Preferably, the extension direction of the circuit board is from the near end to the far end of the substrate, and the extension direction is parallel to the second channel. This substrate topology better protects the integrated module from the high-radiation portion of the radiation field.

[0056] The sensor module 2 is disposed near the substrate. The sensor module 2 can convert the received light signal into an electrical signal and output it. Preferably, lead glass is disposed on the side of the sensor module 2 near the optical lens module 1 to further reduce radiation.

[0057] The integrated module 3 is located at the far end of the substrate. The integrated module 3 includes a signal processing module connected to the sensor module, a filtering module connected to the signal processing module, and a power supply module connected to the sensor module, the signal processing module, and the filtering module respectively. The signal processing module can convert the received electrical signal into an image signal and output it. In this process, the filtering module identifies and / or filters the electrical signal received by the signal processing module. The power supply module can supply power to each module connected to it.

[0058] The storage module is connected to the integration module 3, and can receive and store signal data from the integration module. The signal data in the storage module can be retrieved.

[0059] The output module is connected to the storage module and can call up and output the signal data stored in the storage module.

[0060] The shielding chamber 4 houses the optical lens module 1, circuit board, sensor module 2, integrated module 3, storage module, and output module. The shielding chamber 4 has an opening 41 that matches the acquisition inlet 11. Preferably, the shielding chamber 4 is partially or entirely made of radiation-resistant materials, such as epoxy resin or ceramic.

[0061] In this embodiment, the radiation-resistant image acquisition device features circuit topology optimization. Based on the main influencing factors of the radiation environment on the circuit, the ionization effect, damage effect, and interference effect caused by radiation are analyzed and evaluated. Then, the circuit topology is adjusted, adding directional protection and isolation measures for radiation-resistant components and optimizing the inter-board circuit layout. Specifically, each module within the integrated module 3 requires power to operate. Powered modules are affected by radiation, resulting in electron traps, holes, and displacement damage. These damages accumulate over time, leading to performance degradation or failure. Therefore, the integrated module 3 is sensitive to radiation and easily damaged by it. The topology design of the reflective element 12 and the circuit board ensures that the rays being acquired do not directly face the integrated module 3, reducing the amount of radiation received by the integrated module 3. The shielding chamber 4 further protects the integrated module 3, and the choice of circuit board material also improves the durability and reliability of the radiation-resistant image acquisition device. Furthermore, the sensor module 2, being not directly facing the entrance of the first channel, is also protected to a certain extent.

[0062] In the underlying circuit design, for specific radiation environments, high-purity silicon carbide and other materials with good radiation resistance are selected for the circuit board. Their main characteristics are good stability and radiation resistance, low noise, and the ability to reduce radiation-induced damage and stress effects. Appropriate encapsulation materials are chosen for the shielding enclosure to further improve the camera's radiation resistance.

[0063] See Figure 1 , Figure 2 and Figure 4 In a preferred embodiment of the present invention, there are multiple integrated modules 3, arranged side by side, each having a working state and a standby state. At any given time, only one integrated module is in the working state, while the others are in the standby state. The radiation-resistant image acquisition device also includes a feedback module (corresponding to...) disposed in the shielding chamber. Figure 4 The feedback module (within the feedback circuit) is connected to multiple integrated modules to monitor the currently operating integrated module 3. In a specific embodiment, the feedback module is configured to detect the output voltage and / or current information of the power supply. If the voltage and / or current information exceeds a preset normal range, the feedback module feeds back the abnormal monitoring result to the first power management module of the currently operating integrated module and the second power management module of one of the remaining integrated modules. Then, the first power management module controls the power supply in its integrated module to stop supplying power, while the second power management module controls the power supply in its integrated module to start supplying power.

[0064] The various circuit components in a radiation-resistant image acquisition device (i.e., a camera) are interconnected. When one circuit malfunctions, others can still function normally. Therefore, redundancy design is necessary for these modules. After the system is powered on, the redundant parts are not operational. When a circuit is damaged, the backup circuit can automatically switch over and replace the function of the damaged part, performing alternative work to maintain the camera's normal operation, thereby ensuring the camera's reliability and stability. As mentioned earlier, under irradiation, powered modules are affected by radiation, resulting in electron traps, holes, and displacement damage. These damages accumulate over time, leading to performance degradation or failure. Integrated modules in standby (backup) state are not powered on. Since no circuit is active, the charge in unpowered modules is easily diffused and reorganized, making them less susceptible to radiation damage in a short period. Therefore, a "cold backup" redundancy technique is adopted, resulting in a longer lifespan. Preferably, the feedback module incorporates adaptive recovery technology, which detects circuit faults or damage promptly through self-detection and fault monitoring. Once a fault is detected, recovery can be achieved adaptively, such as automatically restarting the faulty circuit or reconfiguring circuit parameters. This technology can improve the speed of fault recovery and avoid invalid restart or recovery operations.

[0065] Due to its operational characteristics, integrated module 3 is extremely susceptible to damage from radiation when powered on. The use of multiple integrated modules 3 allows for timely switching to other functioning modules if the currently used module fails, thus protecting data from loss, maintaining the stability of the radiation-resistant image acquisition device, and extending its lifespan. The integrated module 3 itself, as a chip or microcircuit, is very lightweight; using multiple modules does not significantly increase the weight of the radiation-resistant image acquisition device, but it greatly improves its operational stability and eliminates the need for complete replacement when a partial circuit fails.

[0066] Each integrated module or power management module is pre-set with a unique and identifiable ID number. If the integrated module is in the working state, its corresponding ID number is associated with the working state; if the integrated module is in the standby state, its corresponding ID number is associated with the standby state; if the integrated module switches from the working state to the stopped working state, its corresponding ID number is associated with the damaged state. The integrated module associated with the damaged state will stop communicating with the feedback circuit, that is, the integrated module associated with the damaged state will not be able to be activated when the standby circuit needs to be started next time.

[0067] The feedback module is also electrically connected to the output module to send the status associated with the ID numbers of each integrated module to the output module. A warning device can also be provided; when the number of ID numbers associated with damage status reaches a preset value or percentage, the warning device will issue a warning signal.

[0068] In addition to controlling the power output, the power management module also optimizes the power output bias voltage. In cameras, photosensitive elements typically employ a PN junction photodiode structure. When light is applied, electrons are captured in the PN junction with a 100% success rate. When the control voltage (i.e., the bias voltage) is low, dark current increases, but this also reduces the radiation effect. Therefore, properly optimizing the bias voltage can provide sufficient photon accumulation while reducing the dark current caused by radiation, resulting in better camera imaging.

[0069] The filtering module is optimized using mathematical modeling, employing different filtering methods based on the noise signals generated by different rays. The filtering circuit filters out external radiated noise and other interference, preventing the signal current from being submerged in noise. In addition to reasonable wiring layout and enclosure shielding, the filtering module undergoes further optimization, including proper selection, filtering, grounding, and electrostatic shielding. In one specific embodiment, the filtering module is configured with a pre-analysis unit and multiple filtering units of different filtering levels. The pre-analysis unit is configured to perform noise analysis on the information to be filtered received by the filtering module and select a suitable filtering unit based on the noise analysis results.

[0070] The radiation-resistant image acquisition device in this embodiment uses a highly radiation-resistant material as the substrate material for the underlying circuit, which reduces the impact of radiation on the underlying circuit to a certain extent. The circuit substrate is made of silicon carbide, a highly radiation-resistant material, to minimize the impact of radiation on the underlying circuit. When constructing the underlying circuit, vulnerable modules, including the power supply module, signal processing module, and filtering module, are placed away from the radiation irradiation end. Diodes and other radiation-sensitive devices on the circuit are placed far away from the circuit substrate, keeping these sensitive devices away from the radiation source and using partial shielding to reduce the impact of radiation. The circuit system optimizes the bias voltage to provide sufficient photon accumulation while reducing the dark current caused by radiation. The underlying circuit design considers the backup circuit. When a device in the circuit is damaged by failure or radiation, the backup circuit will automatically activate to ensure that the device still has stable operating efficiency.

[0071] See Figure 4In one specific embodiment of the present invention, when the radiation-resistant image acquisition device is working, the sensor module captures light and converts it into an electrical signal. The signal processing module reads the signal generated by the sensor module, performs image compression and encoding, and then performs image processing operations such as white balance, noise reduction, sharpening, and color correction. It then performs algorithmic support operations such as dynamic focusing based on field changes, finally generating a compressed image for output. The filtering module identifies and filters the electrical signal given by the sensor module and / or the image signal given by the signal processing module based on the different noise signals generated by particles with different radioactive energies. The feedback circuit constantly monitors the system circuit feedback information. If any module is damaged, the circuit is immediately switched. For example, when signal processing module_1 is detected to be damaged, the power supply to this line is immediately cut off, and power is immediately supplied to signal processing module_2. The storage module receives image data from the filtering module and stores it to a memory card or other device for user playback and browsing at any time. The power management module manages the camera's power supply, including the power supply to each module. The power management module also has a backup. The output module (i.e....) Figure 4 The video output module in the storage module transmits image data from the storage module to other external devices, such as a monitor, so that users can view the images or preview them in real time.

[0072] A camera that can withstand a cumulative radiation dose of 2000 Gy is generally considered to have high radiation resistance. The radiation-resistant image acquisition device of the present invention can work normally for more than 10 hours in a radiation environment with a radiation dose rate of 1000 Gy / h, with a cumulative dose of 10 KGy. Its high radiation resistance is significantly higher than the conventional definition standard.

[0073] In one embodiment of the present invention, a radiation-resistant image acquisition method is also provided, comprising the following steps:

[0074] S1. Pre-number the N integrated modules sequentially from 1 to N;

[0075] S2 records the number M of the integrated module that is currently in operation, where M≤N;

[0076] S3. Monitor the status data of integrated module M;

[0077] S4. Compare the obtained status data with the pre-stored reference data range. If the status data falls within the reference data range, proceed to step S3; otherwise, proceed to step S5.

[0078] S5. If (M+1)≤N, then start integrated module (M+1) to make it work, shut down integrated module M to make it standby, assign M=M+1, and jump to step S2; otherwise, shut down integrated module M to make it standby and issue a warning signal.

[0079] This method can solve the problems of camera stability and image quality in high-radiation environments, greatly improve the stability and reliability of radiation-resistant image acquisition devices, effectively solve the problem of instrument failure when suddenly detecting ultra-strong radiation sources in actual work, extend the life of individual radiation-resistant image acquisition devices, avoid the waste of radiation-insensitive components, and reduce the overall cost of use.

[0080] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0081] The above description is only a specific embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A radiation-resistant image acquisition device, characterized in that, The radiation-resistant image acquisition device includes: An optical lens module, comprising a first channel, a second channel, and a reflective element, wherein the reflective element is configured to totally reflect light entering through the acquisition entrance of the first channel to the second channel; A circuit board, disposed along the extension direction of the second channel, is made of a radiation-resistant material. The circuit board houses a sensor module, an integrated module, a storage module, and an output module, wherein the integrated module, storage module, and output module are located further away from the reflective element than the sensor module. A shielded chamber is configured to house the optical lens module, circuit board, sensor module, integrated module, storage module, and output module. The shielded chamber has an opening corresponding to the acquisition inlet of the first channel. in, The sensor module is configured to convert optical signals into electrical signals; The integrated module includes a signal processing module, a filtering module, a power supply, and a power management module. The signal processing module is configured to read the electrical signal output by the sensor module and perform image processing operations on it to obtain image information. The filtering module is configured to filter the image information obtained by the signal processing module. The power supply is used to supply power to the sensor module, the signal processing module, and the filtering module. The power management module is configured to control the output of the power supply. The storage module is configured to receive and store signal data output from the filtering module of the integrated module; The output module is configured to call and output the signal data stored in the storage module.

2. The radiation-resistant image acquisition device according to claim 1, characterized in that: The number of integrated modules is multiple, and the multiple integrated modules are arranged side by side. Each integrated module has a working state and a standby state. At any given time, only one integrated module is in the working state, while the other integrated modules are in the standby state. The radiation-resistant image acquisition device also includes a feedback module disposed in the shielding chamber. The feedback module is connected to multiple integrated modules respectively. The feedback module is configured to monitor the integrated modules that are currently in operation and feed back the monitoring results to the power management module of the integrated modules. If the monitoring result exceeds the preset normal range, the power management module controls the integrated module to stop working and controls one of the remaining integrated modules to switch to working state.

3. The radiation-resistant image acquisition device according to claim 2, characterized in that, The feedback module is configured to detect the output voltage and / or current information of the power supply. If the voltage and / or current information exceeds the preset normal range, the feedback module will feed back the monitoring results to the first power management module of the currently operating integrated module and the second power management module of one of the remaining integrated modules. The first power management module controls the power supply in its integrated module to stop supplying power, while the second power management module controls the power supply in its integrated module to start supplying power.

4. The radiation-resistant image acquisition device according to claim 3, characterized in that, After the first power management module controls the power supply in its integrated module to stop supplying power, the communication between the integrated module and the feedback module is cut off.

5. The radiation-resistant image acquisition device according to any one of claims 2 to 4, characterized in that, The feedback module is also electrically connected to the output module; Each integrated module is pre-set with a unique and identifiable ID number. If the integrated module is in working state, its corresponding ID number is associated with the working state; if the integrated module is in standby state, its corresponding ID number is associated with the standby state; if the integrated module switches from working state to stopped working state, its corresponding ID number is associated with the damaged state. The feedback module is configured to send the status associated with the ID number of each integration module to the output module.

6. The radiation-resistant image acquisition device according to claim 5, characterized in that, It also includes a warning device, which is configured to issue a warning signal when the number of ID numbers associated with the damage status reaches a preset value or percentage value.

7. The radiation-resistant image acquisition device according to claim 2, characterized in that: The filtering module is configured with a pre-analysis unit and multiple filtering units with different filtering levels. The pre-analysis unit is configured to perform noise analysis on the information to be filtered received by the filtering module and select a suitable filtering unit based on the noise analysis results.

8. The radiation-resistant image acquisition device according to claim 1, characterized in that: The reflective element is made partly or entirely of leaded glass; And / or, the shielding chamber is made partly or entirely of radiation-resistant material.

9. The radiation-resistant image acquisition device according to claim 1, characterized in that, The circuit board is made of one or more materials selected from glass fiber cloth, polytetrafluoroethylene, ceramics, and silicon carbide. And / or, the shielding chamber is made partly or entirely of epoxy resin and / or ceramic.

10. A radiation-resistant image acquisition method based on any one of claims 2 to 9, characterized in that, Includes the following steps: S1. The N integrated modules are pre-numbered sequentially from 1 to N; S2. Record the number M of the integrated module that is currently in operation, where M≤N; S3. Monitor the status data of integrated module M; S4. Compare the monitored status data with the pre-stored reference data range. If the status data falls within the reference data range, proceed to step S3; otherwise, proceed to step S5. S5. If (M+1)≤N, then start integrated module (M+1) to put it into working state, shut down integrated module M to put it into standby state, assign M=M+1, and jump to step S3; otherwise, shut down integrated module M to put it into standby state and issue a warning signal, wherein integrated module M in standby state is not powered.

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