Laser shearing speckle thermal loading method, device, equipment and storage medium

Abstract

The application provides a laser shear speckle thermal loading method, device, equipment and storage medium. The method comprises the following steps: establishing a finite element model of a structure and damage according to characteristics of the structure and typical damage characteristics; applying thermal load to the finite element model according to a loading power of a thermal loading device; forming a relationship between temperature and strain values at a typical damage position and a temperature control point based on an application result of the thermal load; determining a temperature control value according to the relationship; and controlling thermal loading based on the control temperature value to obtain a target shear speckle image. The method provided by the application applies thermal load to the finite element model according to the loading power of the thermal loading device, forms the relationship between the temperature and the strain values at the typical damage position and the temperature control point based on the application result of the thermal load, and obtains the target shear speckle image according to the temperature value of the thermal loading. The method realizes quantitative application of the thermal load, makes the structure produce a required deformation, obtains a satisfactory shear speckle image, and obtains a damage result.

Description

Technical Field

[0001] This application relates to the field of optical nondestructive testing technology, and in particular to a laser shear speckle thermal loading method, apparatus, device, and storage medium. Background Technology

[0002] Laser shear speckle technology is widely used for damage detection in composite materials and special structures due to its advantages such as full-field coverage, non-destructive testing, high precision, and ease of implementation. It is a damage detection method based on optical shear theory, offering higher precision compared to traditional non-destructive testing methods. According to shear speckle imaging theory, the test piece needs to be imaged and analyzed using a laser shear speckle device before and after the change to obtain the damage state of the structure. Therefore, loading the test structure and inducing controllable deformation is crucial to ensuring the quality of the shear speckle image and even the success of the detection.

[0003] Currently, the main laser shear speckle loading method is thermal loading. Because composite materials are more sensitive to thermal loading than metallic materials, and damage sources are easily induced, thermal loading is commonly chosen as the excitation method for shear speckle interferometry. Theoretically, it can be used for non-destructive testing of various engineering materials. Thermal loading can be applied to the non-destructive testing of composite materials, accurately determining the location and magnitude of damage.

[0004] For temperature loading methods, the key to shear speckle detection technology lies in how to quantitatively apply thermal loads to induce the required deformation in the structural components, obtain satisfactory shear speckle images, and obtain damage results. This is also the current research focus. Summary of the Invention

[0005] To address one of the aforementioned technical deficiencies, this application provides a laser shearing speckle thermal loading method, apparatus, device, and storage medium.

[0006] In a first aspect, this application provides a laser shear speckle thermal loading method, the method comprising:

[0007] Based on the characteristics and typical damage features of the structural components, finite element models of the structural components and their damage are established.

[0008] The thermal load is applied to the finite element model based on the loading power of the thermal loading device;

[0009] Based on the results of the application of thermal load, the relationship between temperature and strain values ​​at typical damage sites and temperature control points is established.

[0010] Determine the temperature control value based on the relationship;

[0011] By controlling the thermal loading based on the controlled temperature value, a target shear speckle image is obtained.

[0012] Optionally, based on the results of the applied thermal load, a relationship between temperature and strain values ​​is established at typical damage sites and temperature control points, including:

[0013] The temperature and strain values ​​of the finite element model at pre-set typical damage sites and temperature control points under various thermal loads are obtained, and the relationship between temperature and strain values ​​at typical damage sites and temperature control points is formed.

[0014] Optionally, the temperature control value is determined based on the relationship, including:

[0015] Based on the relationship, determine the strain value as a function of temperature T0 at the temperature transition point;

[0016] Determine the maximum actual temperature control value T1 and the minimum actual temperature control value T2 based on T0;

[0017] Determine the temperature control value based on T1 and T2.

[0018] Optionally, T1 = T0 * a; T2 = T0 * (1 - a), where a is the proportion of the actual temperature control value.

[0019] Optionally, the temperature control values ​​include: a maximum temperature control value T11 and a minimum temperature control value T21;

[0020] Based on T1 and T2, determine the temperature control values, including:

[0021] Determine the strain values ​​ε1 and ε2 corresponding to T1 and T2 at typical damage sites;

[0022] Determine the temperature values ​​T11 and T21 corresponding to ε1 and ε2 at the temperature control point.

[0023] Optionally, the target shear speckle image is obtained by controlling the thermal loading based on the control temperature value, including:

[0024] Based on shear theory and deformation theory, the temperature value of the proportional-integral-derivative (IPD) controller is controlled within [T11, T21], and heating is performed through a heat loading control system to obtain the target shear speckle image.

[0025] Optionally, the heat loading control system consists of thermocouples, IPD controllers, silicon controlled rectifiers (SCRs), and modular quartz lamps;

[0026] Thermocouple connected to IPD controller;

[0027] The thyristor is connected to the modular quartz lamp;

[0028] The thyristor is also connected to the IPD controller;

[0029] The thermocouple is located at the temperature control point of the structural component.

[0030] A second aspect of this application provides a laser shear speckle hot-loading device, the device comprising:

[0031] A module is established to create finite element models of structural components and their damage based on the characteristics and typical damage features of the structural components.

[0032] The processing module is used to apply thermal loads to the finite element model established by the modeling module based on the loading power of the thermal loading device.

[0033] A forming module is used to form the relationship between temperature and strain values ​​at typical damage sites and temperature control points based on the application results of the thermal load from the processing module.

[0034] The determining module is used to determine the temperature control value based on the relationship formed by the forming module;

[0035] The acquisition module is used to control the thermal loading based on the control temperature value determined by the determination module, and to obtain the target shear speckle image.

[0036] A third aspect of this application provides an electronic device, comprising:

[0037] Memory;

[0038] Processor; and

[0039] Computer programs;

[0040] The computer program is stored in the memory and configured to be executed by the processor to implement the method described in the first aspect above.

[0041] In a fourth aspect, this application provides a computer-readable storage medium having a computer program stored thereon; the computer program is executed by a processor to implement the method described in the first aspect above.

[0042] This application provides a laser shear speckle thermal loading method, apparatus, device, and storage medium. The method includes: establishing a finite element model of the structural component and damage based on its characteristics and typical damage features; applying a thermal load to the finite element model according to the loading power of the thermal loading device; establishing a relationship between temperature and strain values ​​at typical damage locations and temperature control points based on the thermal load application results; determining a temperature control value based on the relationship; and controlling the thermal loading based on the control temperature value to obtain a target shear speckle image. The method provided in this application applies a thermal load to the finite element model based on the loading power of the thermal loading device, establishes a relationship between temperature and strain values ​​at typical damage locations and temperature control points based on the thermal load application results, and obtains a target shear speckle image based on the temperature value of the thermal loading according to the relationship. This achieves quantitative application of thermal load, causing the structural component to produce the required deformation, obtaining a satisfactory shear speckle image, and obtaining the damage result. Attached Figure Description

[0043] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0044] Figure 1 A schematic flowchart of a laser shearing speckle thermal loading method provided in an embodiment of this application;

[0045] Figure 2 This application provides a diagram showing the relationship between temperature and strain changes at a typical damage site and a temperature control point, as illustrated in an embodiment of the present application.

[0046] Figure 3 This is a schematic diagram of a laser shearing speckle heat-loading device provided in an embodiment of this application. Detailed Implementation

[0047] To make the technical solutions and advantages of the embodiments of this application clearer, the exemplary embodiments of this application will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not an exhaustive list of all embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0048] In the process of developing this application, the inventors discovered that the main laser shear speckle loading method currently available is the thermal loading method. Since composite materials are more sensitive to thermal loading than metallic materials, and damage sources are easily induced, thermal loading is commonly chosen as the excitation method for shear speckle interferometry, and theoretically, it can be used for non-destructive testing of various engineering materials. Thermal loading can be applied to the non-destructive testing of composite materials, accurately determining the location of damage and estimating its magnitude. For temperature loading methods, the key to shear speckle detection lies in how to quantitatively apply the thermal load to induce the required deformation in the structural component, obtain satisfactory shear speckle images, and obtain damage results; this is also the current research focus.

[0049] To address the aforementioned problems, this application provides a laser shear speckle thermal loading method, apparatus, device, and storage medium. The method includes: establishing a finite element model of the structural component and its damage based on the characteristics and typical damage features of the structural component; applying a thermal load to the finite element model according to the loading power of the thermal loading device; establishing a relationship between temperature and strain values ​​at typical damage locations and temperature control points based on the application results of the thermal load; determining a temperature control value based on the relationship; and controlling the thermal loading based on the control temperature value to obtain a target shear speckle image. The method provided in this application applies a thermal load to the finite element model based on the loading power of the thermal loading device, establishes a relationship between temperature and strain values ​​at typical damage locations and temperature control points based on the application results of the thermal load, and obtains a target shear speckle image based on the temperature value of the thermal loading according to the relationship. This achieves quantitative application of thermal load, causing the structural component to undergo the required deformation, obtaining a satisfactory shear speckle image, and obtaining the damage result.

[0050] See Figure 1 This embodiment provides a laser shear speckle thermal loading method, the implementation process of which is as follows:

[0051] 101. Based on the characteristics of the structural components and typical damage features, establish finite element models of the structural components and damage.

[0052] 102. Apply thermal load to the finite element model based on the loading power of the thermal loading device.

[0053] The heat loading device can be a modular quartz lamp, etc.

[0054] For example, thermal loads are applied to the finite element model based on the loading power of thermal loading devices such as modular quartz lamps.

[0055] 103. Based on the results of applying thermal load, the relationship between temperature and strain values ​​at typical damage sites and temperature control points is established.

[0056] When step 103 is executed, the temperature and strain values ​​of the finite element model at the pre-set typical damage sites and temperature control points under various thermal loads can be obtained, thus forming the relationship between the temperature and strain values ​​at the typical damage sites and temperature control points.

[0057] For example, based on the results of applying thermal loads, the temperature changes and strain values ​​of structural components under thermal loading are analyzed. Temperature and strain values ​​are obtained at pre-selected typical damage locations and temperature control points, respectively. Plotting is then performed as follows... Figure 2 The diagram shows the relationship between temperature changes and strain values ​​at typical damage sites and temperature control points. Figure 2 P1 in the figure represents the curve of change at a typical damage site, and P2 represents the curve of change at the temperature control point.

[0058] 104. Based on the relationship, determine the temperature control value.

[0059] Step 104 can be achieved through the following steps:

[0060] 104-1, Based on the relationship, determine the temperature T0 at the point where the strain value changes with temperature.

[0061] 104-2, Determine the maximum actual temperature control value T1 and the minimum actual temperature control value T2 based on T0.

[0062] For example, T1 = T0 * a; T2 = T0 * (1 - a), where a is the proportion of the actual temperature control value.

[0063] Taking a = 0.8 as an example, T1 = T0 * 0.8. T2 = T0 * 0.2.

[0064] 104-3, Determine the temperature control value based on T1 and T2.

[0065] The temperature control values ​​include: the maximum temperature control value T11 and the minimum temperature control value T21.

[0066] When determining the temperature control values, first determine the strain values ​​ε1 and ε2 corresponding to T1 and T2 at typical damage sites, and then determine the temperature values ​​T11 and T21 corresponding to ε1 and ε2 at the temperature control points.

[0067] If step 103 plots a graph showing the relationship between temperature changes and strain values ​​at typical damage sites and temperature control points, then step 104 can determine the temperature control value based on this graph.

[0068] For example, a = 0.8, see [link to relevant documentation]. Figure 2The temperature T0 at the point where the strain changes with temperature on curve P1 is determined to be the highest value of the damage temperature control point. To ensure the sensitivity of the shear speckle image, 80% of T0 is taken as the maximum actual temperature control value, i.e., T1 = 0.8 * T0, and 20% of T0 is taken as the minimum actual temperature control value, i.e., T2 = 0.2 * T0.

[0069] The temperature control values ​​at typical damage sites are converted into the temperatures of typical temperature control points. The strain values ​​on curve P1 corresponding to T0, T1, and T2 are taken as input values ​​for the temperature points on curve P2, respectively, to determine the temperature values ​​of the typical temperature control points as T01, T11, and T21. That is, T01 is the highest temperature value of the typical temperature control point, T11 is the maximum temperature control value, and T21 is the minimum temperature control value.

[0070] 105. Based on the controlled temperature value, thermal loading is controlled to obtain the target shear speckle image.

[0071] In step 105, the temperature value of the IPD (Proportion-Integration-Differential) controller can be controlled within [T11, T21] according to shear theory and deformation theory, and heating can be performed through the heat loading control system to obtain the target shear speckle image.

[0072] The heat loading control system consists of thermocouples, IPD controllers, silicon controlled rectifiers (SCRs), and modular quartz lamps.

[0073] Thermocouples are connected to the IPD controller.

[0074] The thyristor is connected to the modular quartz lamp.

[0075] The thyristor is also connected to the IPD controller.

[0076] The thermocouple is located at the temperature control point of the structural component.

[0077] In step 105, the temperature control value is used as the reference temperature value for IPD temperature control during the actual heat loading process, thereby obtaining the target shear speckle image. For example, thermocouples are attached to the temperature control points of the structural component, connected to the IPD controller, and a modular quartz lamp is connected to a SCR. Finally, the SCR is connected to the IPD controller, forming a heat loading control system composed of thermocouples, the IPD controller, the SCR, and the modular quartz lamp. The control temperature value obtained in step 104 is input into the IPD controller, enabling automatic and quantitatively controllable heat loading during heat loading, thus obtaining an ideal shear speckle image.

[0078] The laser shear speckle thermal loading method provided in this embodiment can automatically and quantitatively implement thermal loading according to the condition of the structural component and the required detection accuracy, thereby improving the efficiency of laser shear speckle damage detection. It addresses the technical problem of not being able to quantitatively control loading parameters during laser shear speckle thermal loading. Compared to current empirical thermal loading methods, it can improve the accuracy of thermal loading and obtain higher quality shear speckle images.

[0079] The laser shear speckle thermal loading method provided in this embodiment uses the results of finite element analysis on the relationship between strain and temperature as the temperature control parameter for thermal loading IPD, providing a reliable basis for shear speckle thermal loading, avoiding the blindness of empirical thermal loading methods, and improving the efficiency of laser shear speckle technology in detecting damage.

[0080] This embodiment provides a laser shear speckle thermal loading method. The method includes: establishing a finite element model of the structural component and its damage based on the characteristics and typical damage features of the structural component; applying a thermal load to the finite element model according to the loading power of the thermal loading device; establishing a relationship between temperature and strain values ​​at typical damage locations and temperature control points based on the application results of the thermal load; determining a temperature control value based on the relationship; and controlling the thermal loading based on the control temperature value to obtain a target shear speckle image. The method provided in this embodiment applies a thermal load to the finite element model based on the loading power of the thermal loading device, establishes a relationship between temperature and strain values ​​at typical damage locations and temperature control points based on the application results of the thermal load, and obtains a target shear speckle image based on the temperature value of the thermal loading according to the relationship. This achieves quantitative application of thermal load, causing the structural component to produce the required deformation, obtaining a satisfactory shear speckle image, and obtaining the damage result.

[0081] Based on the same inventive concept as the laser shear speckle thermal loading method, this embodiment provides a laser shear speckle thermal loading device, see [link to relevant documentation]. Figure 3 The device includes:

[0082] Module 301 is established to create finite element models of structural components and damage based on their characteristics and typical damage features.

[0083] The processing module 302 is used to apply thermal load to the finite element model established by the establishment module 301 according to the loading power of the thermal loading device.

[0084] The forming module 303 is used to form the relationship between temperature and strain values ​​at typical damage sites and temperature control points based on the results of the thermal load applied by the processing module 302.

[0085] The determination module 304 is used to determine the temperature control value based on the relationship formed by the formation module 303.

[0086] The module 305 is used to control the thermal loading based on the control temperature value determined by the determining module 304, and to obtain the target shear speckle image.

[0087] The forming module 303 is used to obtain the temperature and strain values ​​of the finite element model at pre-set typical damage sites and temperature control points under various thermal loads, and to form the relationship between the temperature and strain values ​​at the typical damage sites and temperature control points.

[0088] The determination module 304 is used to determine the temperature T0 at the transition point between strain and temperature based on the relationship. It then determines the maximum actual temperature control value T1 and the minimum actual temperature control value T2 based on T0. Finally, it determines the temperature control value based on T1 and T2.

[0089] Where T1 = T0 * a, T2 = T0 * (1 - a), and a is the proportion of the actual temperature control value.

[0090] The temperature control values ​​include: the maximum temperature control value T11 and the minimum temperature control value T21.

[0091] Module 304 is used to determine the strain values ​​ε1 and ε2 corresponding to T1 and T2 at typical damage sites. It also determines the temperature values ​​T11 and T21 corresponding to ε1 and ε2 at temperature control points.

[0092] The module 305 is used to control the temperature value of the proportional-integral-derivative (IPD) controller within the range of [T11, T21] based on shear theory and deformation theory, and to heat the target shear speckle image through a heat loading control system.

[0093] The heat loading control system consists of thermocouples, IPD controllers, silicon controlled rectifiers (SCRs), and modular quartz lamps.

[0094] Thermocouples are connected to the IPD controller.

[0095] The thyristor is connected to the modular quartz lamp.

[0096] The thyristor is also connected to the IPD controller.

[0097] The thermocouple is located at the temperature control point of the structural component.

[0098] The device provided in this embodiment applies a thermal load to the finite element model based on the loading power of the thermal loading device, and forms a relationship between temperature and strain values ​​at typical damage points and temperature control points based on the application results of the thermal load. According to the temperature value of the thermal loading relationship, the target shear speckle image is obtained, realizing the quantitative application of thermal load, causing the structural component to produce the required deformation, obtaining a satisfactory shear speckle image and obtaining the damage result.

[0099] Based on the same inventive concept of the laser shear speckle hot loading method, this embodiment provides an electronic device, which includes: a memory, a processor, and a computer program.

[0100] The computer program is stored in memory and configured to be executed by a processor to implement the laser shear speckle hot loading method described above.

[0101] Specifically,

[0102] Based on the characteristics of the structural components and typical damage features, finite element models of the structural components and their damage are established.

[0103] Thermal loads are applied to the finite element model based on the loading power of the thermal loading device.

[0104] Based on the results of applying thermal load, the relationship between temperature and strain values ​​at typical damage sites and temperature control points is established.

[0105] Determine the temperature control value based on the relationship.

[0106] By controlling the thermal loading based on the controlled temperature value, a target shear speckle image is obtained.

[0107] Optionally, based on the results of the applied thermal load, a relationship between temperature and strain values ​​is established at typical damage sites and temperature control points, including:

[0108] The temperature and strain values ​​of the finite element model at pre-set typical damage sites and temperature control points under various thermal loads are obtained, and the relationship between temperature and strain values ​​at typical damage sites and temperature control points is formed.

[0109] Optionally, the temperature control value is determined based on the relationship, including:

[0110] Based on the relationship, determine the temperature T0 at the temperature transition point where the strain value changes with temperature.

[0111] The maximum actual temperature control value T1 and the minimum actual temperature control value T2 are determined based on T0.

[0112] Determine the temperature control value based on T1 and T2.

[0113] Optionally, T1 = T0 * a; T2 = T0 * (1 - a), where a is the proportion of the actual temperature control value.

[0114] Optionally, the temperature control values ​​include: a maximum temperature control value T11 and a minimum temperature control value T21.

[0115] Based on T1 and T2, determine the temperature control values, including:

[0116] Determine the strain values ​​ε1 and ε2 corresponding to T1 and T2 at typical damage sites.

[0117] Determine the temperature values ​​T11 and T21 corresponding to ε1 and ε2 at the temperature control point.

[0118] Optionally, the target shear speckle image is obtained by controlling the thermal loading based on the control temperature value, including:

[0119] Based on shear theory and deformation theory, the temperature value of the proportional-integral-derivative (IPD) controller is controlled within [T11, T21], and heating is performed through a heat loading control system to obtain the target shear speckle image.

[0120] Optionally, the heat loading control system consists of thermocouples, IPD controllers, silicon controlled rectifiers (SCRs), and modular quartz lamps.

[0121] Thermocouples are connected to the IPD controller.

[0122] The thyristor is connected to the modular quartz lamp.

[0123] The thyristor is also connected to the IPD controller.

[0124] The thermocouple is located at the temperature control point of the structural component.

[0125] The electronic device provided in this embodiment has a computer program executed by a processor to apply a thermal load to the finite element model according to the loading power of the thermal loading device. Based on the application result of the thermal load, a relationship between temperature and strain values ​​is formed at typical damage points and temperature control points. According to the temperature value of the thermal loading relationship, a target shear speckle image is obtained, realizing the quantitative application of thermal load, causing the structural component to produce the required deformation, obtaining a satisfactory shear speckle image and obtaining the damage result.

[0126] Based on the same inventive concept as the laser shear speckle hot-loading method, this embodiment provides a computer-readable storage medium on which a computer program is stored. The computer program is executed by a processor to implement the aforementioned laser shear speckle hot-loading method.

[0127] Specifically,

[0128] Based on the characteristics of the structural components and typical damage features, finite element models of the structural components and their damage are established.

[0129] Thermal loads are applied to the finite element model based on the loading power of the thermal loading device.

[0130] Based on the results of applying thermal load, the relationship between temperature and strain values ​​at typical damage sites and temperature control points is established.

[0131] Determine the temperature control value based on the relationship.

[0132] By controlling the thermal loading based on the controlled temperature value, a target shear speckle image is obtained.

[0133] Optionally, based on the results of the applied thermal load, a relationship between temperature and strain values ​​is established at typical damage sites and temperature control points, including:

[0134] The temperature and strain values ​​of the finite element model at pre-set typical damage sites and temperature control points under various thermal loads are obtained, and the relationship between temperature and strain values ​​at typical damage sites and temperature control points is formed.

[0135] Optionally, the temperature control value is determined based on the relationship, including:

[0136] Based on the relationship, determine the temperature T0 at the temperature transition point where the strain value changes with temperature.

[0137] The maximum actual temperature control value T1 and the minimum actual temperature control value T2 are determined based on T0.

[0138] Determine the temperature control value based on T1 and T2.

[0139] Optionally, T1 = T0 * a; T2 = T0 * (1 - a), where a is the proportion of the actual temperature control value.

[0140] Optionally, the temperature control values ​​include: a maximum temperature control value T11 and a minimum temperature control value T21.

[0141] Based on T1 and T2, determine the temperature control values, including:

[0142] Determine the strain values ​​ε1 and ε2 corresponding to T1 and T2 at typical damage sites.

[0143] Determine the temperature values ​​T11 and T21 corresponding to ε1 and ε2 at the temperature control point.

[0144] Optionally, the target shear speckle image is obtained by controlling the thermal loading based on the control temperature value, including:

[0145] Based on shear theory and deformation theory, the temperature value of the proportional-integral-derivative (IPD) controller is controlled within [T11, T21], and heating is performed through a heat loading control system to obtain the target shear speckle image.

[0146] Optionally, the heat loading control system consists of thermocouples, IPD controllers, silicon controlled rectifiers (SCRs), and modular quartz lamps.

[0147] Thermocouples are connected to the IPD controller.

[0148] The thyristor is connected to the modular quartz lamp.

[0149] The thyristor is also connected to the IPD controller.

[0150] The thermocouple is located at the temperature control point of the structural component.

[0151] The computer-readable storage medium provided in this embodiment has a computer program thereon that is executed by a processor to apply a thermal load to the finite element model according to the loading power of the thermal loading device, and to form a relationship between temperature and strain values ​​at typical damage sites and temperature control points based on the application results of the thermal load. According to the temperature value of the thermal load, a target shear speckle image is obtained, thereby realizing the quantitative application of thermal load, causing the structural component to produce the required deformation, obtaining a satisfactory shear speckle image and obtaining the damage result.

[0152] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code. The solutions in the embodiments of this application can be implemented in various computer languages, such as the object-oriented programming language Java and the interpreted scripting language JavaScript.

[0153] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0154] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0155] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0156] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0157] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A laser shearing speckle thermal loading method, characterized in that, The method includes: Based on the characteristics and typical damage features of the structural components, finite element models of the structural components and their damage are established. A thermal load is applied to the finite element model according to the loading power of the thermal loading device; Based on the results of the applied thermal load, the relationship between temperature and strain values ​​at typical damage sites and temperature control points is established. Based on the aforementioned relationship, determine the temperature control value; The thermal load is controlled based on the temperature control value to obtain a target shear speckle image; Based on the application of the thermal load, the relationship between temperature and strain values ​​at typical damage sites and temperature control points is established, including: The temperature and strain values ​​of the finite element model at pre-set typical damage sites and temperature control points under various thermal loads are obtained, and the relationship between temperature and strain values ​​at typical damage sites and temperature control points is formed. Determining the temperature control value based on the relationship includes: Based on the aforementioned relationship, determine the temperature T0 at the temperature transition point where the strain value changes with temperature; The maximum actual temperature control value T1 and the minimum actual temperature control value T2 are determined based on T0. Determine the temperature control value based on T1 and T2; T1 = T0 * a; T2 = T0 * (1 - a), where a is the proportion of the actual temperature control value; The temperature control values ​​include: the maximum temperature control value T11 and the minimum temperature control value T21; The step of determining the temperature control value based on T1 and T2 includes: Determine the strain values ​​ε1 and ε2 corresponding to T1 and T2 at typical damage sites; Determine the temperature values ​​T11 and T21 corresponding to ε1 and ε2 at the temperature control point.

2. The method according to claim 1, characterized in that, The step of controlling the thermal load based on the temperature control value to obtain the target shear speckle image includes: Based on shear theory and deformation theory, the temperature value of the proportional-integral-derivative (IPD) controller is controlled within [T11, T21], and heating is performed through a heat loading control system to obtain the target shear speckle image.

3. The method according to claim 2, characterized in that, The heat loading control system consists of thermocouples, IPD controllers, silicon controlled rectifiers, and modular quartz lamps; The thermocouple is connected to the IPD controller; The thyristor is connected to the modular quartz lamp; The thyristor is also connected to the IPD controller; The thermocouple is located at the temperature control point of the structure.

4. An electronic device, characterized in that, include: Memory; processor; as well as Computer programs; The computer program is stored in the memory and configured to be executed by the processor to implement the method as described in any one of claims 1-3.

5. A computer-readable storage medium, characterized in that, It stores a computer program thereon; the computer program is executed by a processor to implement the method as described in any one of claims 1-3.

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