Display module, preparation method thereof and display device

Abstract

The application provides a display module, a preparation method thereof and a display device. The display module comprises a display panel, a printed circuit board and a flexible circuit board. The display panel comprises a binding area. The printed circuit board comprises a main circuit area and an edge circuit area connected to each other. The thickness of the edge circuit area is less than that of the main circuit area. The printed circuit board has a groove formed by the main circuit area and the edge circuit area. The flexible circuit board has a first connecting end electrically connected to the binding area and a second connecting end electrically connected to the edge circuit area. The first connecting end and the binding area are oppositely arranged in the thickness direction of the display panel. The second connecting end is located in the groove and oppositely arranged with the edge circuit area in the thickness direction of the printed circuit board. The binding between the flexible circuit board and the display panel and the printed circuit board is improved.

Description

Technical Field

[0001] This invention relates to the field of display technology, specifically to a display module, its manufacturing method, and a display device. Background Technology

[0002] The display module includes a display panel. The bonding area of ​​the display panel is electrically connected to a flexible circuit board (PCB) and a printed circuit board (PCB). The PCB is bent to place the PCB on the back of the display panel. In related technologies, the thickness of the PCB and the bonding area differs significantly. The PCB is approximately 0.8 mm thick, while the bonding area of ​​the display panel is approximately 0.13 mm thick, resulting in a 0.67 mm thickness difference. This leads to poor bonding between the bonding area of ​​the display panel and the flexible circuit board, as well as poor bonding between the PCB and the flexible circuit board. Summary of the Invention

[0003] The technical problem to be solved by this invention is how to reduce the problem of poor bonding between the flexible circuit board and the display panel and the printed circuit board in the display module in related technologies.

[0004] To address the aforementioned technical problems, the present invention provides a display module, comprising: a display panel including a bonding area; a printed circuit board including a main circuit area and an edge circuit area connected together, wherein the thickness of the edge circuit area is less than the thickness of the main circuit area, and the printed circuit board having a groove formed by the main circuit area and the edge circuit area; and a flexible circuit board having a first connection end electrically connected to the bonding area and a second connection end electrically connected to the edge circuit area, wherein the first connection end and the bonding area are disposed opposite to each other in the thickness direction of the display panel, and the second connection end is located in the groove and the edge circuit area is disposed opposite to each other in the thickness direction of the printed circuit board.

[0005] Optionally, it further includes: a first conductive connector located between the first connecting end and the bonding area and connected to the first connecting end and the bonding area respectively; and a second conductive connector located in the groove, the second conductive connector being located between the second connecting end and the edge circuit area and connected to the second connecting end and the edge circuit area respectively.

[0006] Optionally, the bonding area and the edge circuit area are located on the same side of the flexible circuit board in the thickness direction.

[0007] Optionally, the absolute value of the difference between the thickness of the edge circuit area and the thickness of the bonding area is less than or equal to 0.2 mm.

[0008] Optionally, the thickness of the edge circuit region is the same as the thickness of the bonding region.

[0009] Optionally, the bonding area is located on one side of the flexible circuit board in the thickness direction, and the edge circuit area is located on the other side of the flexible circuit board in the thickness direction.

[0010] Optionally, the absolute value of the difference between the total thickness of the first conductive connector, the second conductive connector, the flexible circuit board, and the bonding area and the depth of the groove is less than or equal to 0.2 mm.

[0011] Optionally, the total thickness of the first conductive connector, the second conductive connector, the flexible circuit board, and the bonding area is equal to the depth of the groove.

[0012] Optionally, the width of the bottom surface of the groove is greater than the depth of the groove, and the width direction of the bottom surface of the groove is parallel to the length direction of the second connecting end.

[0013] Optionally, the groove has a feature sidewall that exposes the main circuit area, and the angle between the feature sidewall and the bottom surface of the groove is an obtuse angle.

[0014] Optionally, the printed circuit board has multiple recesses, which are spaced apart; the flexible circuit board has multiple locations; the bonding area has multiple locations; the flexible circuit board corresponds one-to-one with the recesses, and the flexible circuit board corresponds one-to-one with the bonding area.

[0015] Optionally, all of the grooves may be of the same length; or, at least some of the grooves may be of different lengths.

[0016] Optionally, the printed circuit board includes multiple layers of circuitry spaced apart and an insulating substrate located between adjacent circuitry layers, wherein the number of circuitry layers in the main circuitry area is greater than the number of circuitry layers in the edge circuitry area, and the number of insulating substrate layers in the main circuitry area is greater than the number of insulating substrate layers in the edge circuitry area.

[0017] Optionally, the number of insulating base layers in the edge circuit area is one or more, and the number of circuit layers in the edge circuit area is one or more.

[0018] The present invention also provides a method for manufacturing a display module, comprising: providing a display panel, the display panel including a bonding area; providing a printed circuit board, the printed circuit board including a connected main circuit area and an edge circuit area, the thickness of the edge circuit area being less than the thickness of the main circuit area, the printed circuit board having a groove surrounded by the main circuit area and the edge circuit area; providing a flexible circuit board, the flexible circuit board having a first connecting end and a second connecting end opposite to each other; bonding the first connecting end and the bonding area together, the first connecting end and the bonding area being disposed opposite to each other in the thickness direction of the display panel; bonding the second connecting end and the edge circuit area together, the second connecting end being located in the groove and the edge circuit area being disposed opposite to each other in the thickness direction of the printed circuit board.

[0019] Optionally, before binding the first connection end and the bonding area together, and binding the second connection end and the edge circuit area together, the method for manufacturing the display module further includes: providing a carrier platform; placing the printed circuit board and the display panel on the carrier platform at intervals; binding the first connection end and the bonding area together through a first conductive connector, the first conductive connector being located between the first connection end and the bonding area; binding the second connection end and the edge circuit area together through a second conductive connector, the second conductive connector being located in the groove and located between the second connection end and the edge circuit area.

[0020] Optionally, in the step of binding the first connection end and the binding area together using the first conductive connector, the first connection end is located on the side of the binding area away from the support platform; in the step of binding the second connection end and the edge circuit area together using the second conductive connector, the groove is located on the side of the edge circuit area away from the support platform.

[0021] Optionally, after binding the first connection end and the bonding area together using the first conductive connector, the second connection end and the edge circuit area are bound together using the second conductive connector; or, after binding the second connection end and the edge circuit area together using the second conductive connector, the first connection end and the bonding area are bound together using the first conductive connector.

[0022] Optionally, after binding the second connection end and the edge circuit area together using the second conductive connector, the first connection end and the binding area are bound together using the first conductive connector; in the step of binding the second connection end and the edge circuit area together using the second conductive connector, the groove is located on the side of the edge circuit area facing away from the carrier platform; the method for manufacturing the display module further includes: after binding the second connection end and the edge circuit area together using the second conductive connector, and before binding the first connection end and the binding area together using the first conductive connector, flipping the printed circuit board on the carrier platform so that the groove faces the carrier platform; in the step of binding the first connection end and the binding area together using the first conductive connector, the first connection end is located on the side of the binding area facing away from the carrier platform.

[0023] The present invention also provides a display device, including the display module of the present invention.

[0024] The technical solution of this invention has the following technical effects:

[0025] The display module provided by this invention has a thickness in the edge circuit area that is less than the thickness in the main circuit area. This reduces the difference in thickness between the edge circuit area and the bonding area, causing the first connection end to experience a near-horizontal peeling force or a horizontal peeling force. The component of this near-horizontal peeling force in the thickness direction of the display panel acting on the first connection end is weak, or there is no component of the horizontal peeling force acting on the first connection end in the thickness direction of the display panel, thus reducing poor bonding between the first connection end and the bonding area. The length dimension designed for the flexible circuit board primarily considers the lateral distance between the edge circuit area and the bonding area. When the height difference between the printed circuit board and the bonding area of ​​the display panel is reduced, the length dimension designed for the flexible circuit board is close to the actual required length dimension. This reduces the internal stress of the second connection end after the flexible circuit board is bonded to the display panel and the printed circuit board, further reducing poor bonding between the second connection end and the edge circuit area in the printed circuit board. In summary, this reduces poor bonding between the flexible circuit board and both the display panel and the printed circuit board.

[0026] The display device provided by the technical solution of the present invention includes the display module of the present invention, which reduces the poor bonding between the flexible circuit board and the display panel and the printed circuit board. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the specific embodiments or related technologies of the present invention, the drawings used in the description of the specific embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of a display module in related technologies;

[0029] Figure 2 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention;

[0030] Figure 3 This is a top view of a printed circuit board according to one embodiment of the present invention;

[0031] Figure 4 This is another top view of a printed circuit board according to an embodiment of the present invention;

[0032] Figure 5 This is another top view of a printed circuit board according to an embodiment of the present invention;

[0033] Figure 6 This is another top view of a printed circuit board according to an embodiment of the present invention;

[0034] Figure 7 This is another top view of a printed circuit board according to an embodiment of the present invention;

[0035] Figure 8 This is another top view of a printed circuit board according to an embodiment of the present invention;

[0036] Figure 9 This is a schematic diagram of the structure of a display module provided in another embodiment of the present invention;

[0037] Figure 10 This is a schematic diagram of the structure of a display module provided in another embodiment of the present invention;

[0038] Figure 11 This is a schematic diagram of the structure of a display module provided in another embodiment of the present invention;

[0039] Figures 12 to 17 This is a schematic diagram of the manufacturing process of a display module according to an embodiment of the present invention;

[0040] Figures 18 to 23 This is a schematic diagram of the manufacturing process of a display module according to another embodiment of the present invention;

[0041] Reference numerals: Display panel 10; Printed circuit board 20; Flexible circuit board 30; First connecting end 31; Second connecting end 32; First connector 41; Second connector 42; Display panel 100; Printed circuit board 200; Edge circuit area 201; Main circuit area 202; Recess 203; Flexible circuit board 300; First connecting end 301; Second connecting end 302; Flexible main area 303; First conductive connector 401; Second conductive connector 402; Recess 2031; Recess 2032; Recess 2033; Recess 2034; Recess 2035 Printed circuit board 200a; main circuit area 202a; edge circuit area 201a; groove 203a; included angle θ; display panel 100b; printed circuit board 200b; main circuit area 202b; edge circuit area 201b; groove 203b; flexible circuit board 300b; first connection end 301b; second connection end 302b; first conductive connector 401b; second conductive connector 402b; flexible main area 303b; printed circuit board 200c; main circuit area 202c; edge circuit area 201c; groove 203c; support platform P. Detailed Implementation

[0042] A display module in related technologies, reference Figure 1 The system includes: a display panel 10; a printed circuit board 20; and a flexible circuit board 30. The flexible circuit board 30 has a first connection end 31 and a second connection end 32. The first connection end 31 is connected to a bonding area in the display panel 10 via a first connector 41, and the second connection end 32 is connected to the printed circuit board 20 via a second connector 42. Both surfaces of the flexible circuit board 30 are planar in the thickness direction. The thickness direction of the flexible circuit board 30 is the stacking direction of the multiple circuit layers inside the flexible circuit board 30.

[0043] The thickness of the first connector 41 and the thickness of the second connector 42 are both very small, so it is difficult to improve the bonding yield by increasing the thickness of the first connector 41.

[0044] Because of the significant height difference between the bonding area of ​​the printed circuit board 20 and the display panel 10, the force applied to the first connecting end 31 becomes an inclined peeling force. The component of this inclined peeling force in the thickness direction of the display panel 10 acts on the first connecting end 31, easily leading to poor bonding between the first connecting end 31 and the bonding area. Secondly, the length of the flexible circuit board 30 is designed primarily based on the lateral distance L between the printed circuit board 20 and the bonding area. The designed length of the flexible circuit board 30 is the distance from the first connecting end 31 to the second connecting end 32. When the height difference between the bonding area of ​​the printed circuit board 20 and the display panel 10 is too high, the designed length of the flexible circuit board 30 is less than the actual required length. Thus, after the flexible circuit board 30 is bonded to the display panel 10 and the printed circuit board 20, the stress inside the second connecting end 32 is high, resulting in poor bonding between the second connecting end 32 and the printed circuit board 20.

[0045] Based on this, a display module and its manufacturing method and display device are proposed, which can reduce the poor bonding between the flexible circuit board and the display panel and printed circuit board in the display module.

[0046] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0047] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0048] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can also refer to the internal connection of two components; and they can refer to a wireless connection or a wired connection. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0049] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0050] One embodiment of the present invention provides a display module, with reference to... Figure 2 and Figure 3 , Figure 3 for Figure 2 A top view of the printed circuit board 200 includes:

[0051] Display panel 100, the display panel 100 including a binding area;

[0052] Printed circuit board 200, the printed circuit board 200 includes a main circuit area 202 and an edge circuit area 201 connected together, the thickness of the edge circuit area 201 is less than the thickness of the main circuit area 202, and the printed circuit board 200 has a groove 203 surrounded by the main circuit area 202 and the edge circuit area 201.

[0053] A flexible circuit board 300 has a first connection end 301 electrically connected to the bonding area and a second connection end 302 electrically connected to the edge circuit area 201. The first connection end 301 and the bonding area are disposed opposite to each other in the thickness direction of the display panel 100. The second connection end 302 is located in the groove 203 and the edge circuit area 201 is disposed opposite to each other in the thickness direction of the printed circuit board 200.

[0054] In this embodiment, the thickness of the edge circuit area 201 is less than the thickness of the main circuit area 202. The difference between the thickness of the edge circuit area 201 and the thickness of the bonding area is reduced. The force applied to the first connection end 301 becomes a near-horizontal peeling force or a horizontal peeling force. The component of the near-horizontal peeling force in the thickness direction of the display panel 100 acts on the first connection end 301 with a smaller intensity. Alternatively, the horizontal peeling force has no component in the thickness direction of the display panel 100 acting on the first connection end 301, thereby reducing poor bonding between the first connection end 301 and the bonding area. The length of the flexible circuit board 300 is designed primarily by considering the lateral distance between the edge circuit area 201 and the bonding area. When the height difference between the bonding area of ​​the printed circuit board 200 and the display panel 100 is reduced, the length of the flexible circuit board 300 designed is close to the actual length required by the flexible circuit board 300. In this way, when the flexible circuit board 300 is bonded to the display panel 100 and the printed circuit board 200, the stress inside the second connection end 302 is reduced, thereby reducing poor bonding between the second connection end 302 and the edge circuit area 201 in the printed circuit board 200.

[0055] The thickness direction of the display panel 100 is parallel to the light emission direction of the display panel 100.

[0056] In one embodiment, the thickness of the main circuit area 202 of the printed circuit board 200 is 0.6mm-0.8mm, and the thickness of the bonding area of ​​the display panel 100 is 0.1mm-0.13mm.

[0057] In one embodiment, the display panel 100 is a flexible display panel. The flexible display panel is an organic light-emitting diode (OLED) display panel or a quantum dot (QD) light-emitting diode (QLED) display panel. In other embodiments, the display panel 100 is a rigid display panel, such as a liquid crystal display panel.

[0058] The printed circuit board 200 is electrically connected to the display panel 100 via a flexible circuit board 300.

[0059] The printed circuit board 200 includes multiple layers of circuitry spaced apart and insulating substrates located between adjacent circuitry layers. The number of circuitry layers in the main circuit region 202 is greater than the number of circuitry layers in the edge circuit region 201, and the number of insulating substrates in the main circuit region 202 is greater than the number of insulating substrates in the edge circuit region 201. The thickness direction of the printed circuit board 200 is the stacking direction of the multiple circuitry layers and insulating substrates in the printed circuit board 200.

[0060] The number of insulating base layers in the edge circuit region 201 is one or more, and the number of circuit layers in the edge circuit region 202 is one or more.

[0061] The display module further includes: a first conductive connector 401, located between the first connecting end 301 and the bonding area and respectively connected to the first connecting end 301 and the bonding area; and a second conductive connector 402 located in the groove 203, located between the second connecting end 302 and the edge circuit area 201 and respectively connected to the second connecting end 302 and the edge circuit area 201. The material of the first conductive connector 401 includes anisotropic conductive adhesive. The material of the second conductive connector 402 includes anisotropic conductive adhesive.

[0062] The thickness of the first conductive connector 401 is much smaller than the thickness of the bonding area and much smaller than the thickness of the first connecting end 301. The thickness of the second conductive connector 402 is much smaller than the thickness of the second connecting end 302 and much smaller than the thickness of the edge circuit area 201. In one embodiment, the thickness of the first conductive connector 401 is 15μm to 22μm. The thickness of the second conductive connector 402 is 15μm to 22μm.

[0063] The flexible circuit board 300 further includes a flexible main region 303 located between the first connecting end 301 and the second connecting end 302, the flexible main region 303 being connected to the first connecting end 301 and the second connecting end 302 respectively. The length of the flexible main region 303 is greater than the length of the first connecting end 301 and the length of the second connecting end 302. In other embodiments, the length of the flexible main region 303 is not limited. The length direction of the flexible circuit board 300 is the direction in which the first connecting end 301 extends to the second connecting end 302.

[0064] In this embodiment, the bonding area and the edge circuit area 201 are located on the same side of the flexible circuit board 300 in the thickness direction. The flexible circuit board 300 has a first surface and a second surface opposite to each other in the thickness direction; the first surface of the first connecting end 301 faces the bonding area, and the second surface of the first connecting end 301 faces away from the bonding area; the first surface of the second connecting end 302 faces the edge circuit area 201, and the second surface of the second connecting end 302 faces away from the edge circuit area 201.

[0065] In one embodiment, the absolute value of the thickness difference between the edge circuit region 201 and the bonding region is less than or equal to 0.2 mm. This further reduces the peeling force acting on the first connection end 301 in the thickness direction of the display panel 100, further reducing poor bonding between the first connection end 301 and the bonding region. It also further reduces the stress inside the second connection end 302, further reducing poor bonding between the second connection end 302 and the edge circuit region 201 in the printed circuit board 200.

[0066] In one embodiment, the thickness of the bonding area of ​​the display panel 100 is 0.1mm-0.13mm, and the thickness of the edge circuit area 201 is 0.1mm-0.13mm, for example, 0.137mm.

[0067] Furthermore, the thickness of the edge circuit region 201 is the same as the thickness of the bonding region.

[0068] In one embodiment, the width of the bottom surface of the groove 203 is greater than the depth of the groove 203, and the width direction of the bottom surface of the groove 203 is parallel to the length direction of the second connecting end 302. This ensures that during the bonding process between the second connecting end 302 and the edge circuit area 201, the bonding pressure head is laterally farther from the main circuit area 202, preventing the bonding pressure head from colliding with the main circuit area 202. In other embodiments, the width of the bottom surface of the groove is less than or equal to the depth of the groove.

[0069] In one embodiment, reference Figure 3The number of recesses 203 in the printed circuit board 200 is one.

[0070] In another embodiment, reference Figure 4 The number of grooves 2031 in the printed circuit board 200 is multiple, and the multiple grooves 2031 are spaced apart; correspondingly, the number of flexible circuit boards 300 is multiple; the number of bonding areas is multiple; the flexible circuit boards 300 and the grooves 2031 correspond one-to-one, and the flexible circuit boards 300 and the bonding areas correspond one-to-one.

[0071] In another embodiment, reference Figure 5 The number of grooves 2032 in the printed circuit board 200 is multiple, and the multiple grooves 2032 are spaced apart; correspondingly, the number of flexible circuit boards 300 is multiple; the number of bonding areas is multiple; the flexible circuit boards 300 and the grooves 2032 correspond one-to-one, and the flexible circuit boards 300 and the bonding areas correspond one-to-one.

[0072] Figure 4 and Figure 5 The difference is: Figure 4 The number of grooves 2031 in the middle is more than Figure 5 The number of grooves 2032 in the middle. Figure 4 The length of the groove 2031 in the middle is less than Figure 5 The length of the recess 2032. The length direction of the recess is perpendicular to the width direction of the recess and perpendicular to the thickness direction of the printed circuit board. The length of the recess in the printed circuit board 200 can be adjusted according to actual needs to match the width dimension of the flexible circuit board 300. The width direction of the flexible circuit board 300 is parallel to the length direction of the recess. The width direction of the flexible circuit board 300 is perpendicular to the length direction of the flexible circuit board 300 and perpendicular to the thickness direction of the flexible circuit board 300.

[0073] In another embodiment, reference Figure 6 The number of grooves 2033 in the printed circuit board 200 is multiple, and the multiple grooves 2033 are spaced apart; correspondingly, the number of flexible circuit boards 300 is multiple; the number of bonding areas is multiple; the flexible circuit boards 300 and the grooves 2033 are in one-to-one correspondence, and the flexible circuit boards 300 and the bonding areas are in one-to-one correspondence.

[0074] In another embodiment, reference Figure 7 The number of grooves 2034 in the printed circuit board 200 is multiple, and the multiple grooves 2034 are spaced apart; correspondingly, the number of flexible circuit boards 300 is multiple; the number of bonding areas is multiple; the flexible circuit boards 300 and the grooves 2034 are in one-to-one correspondence, and the flexible circuit boards 300 and the bonding areas are in one-to-one correspondence.

[0075] In another embodiment, reference Figure 8The printed circuit board 200 has multiple grooves 2035, which are spaced apart; correspondingly, there are multiple flexible circuit boards 300 and multiple bonding areas; the flexible circuit boards 300 and the grooves 2035 are in one-to-one correspondence, and the flexible circuit boards 300 and the bonding areas are in one-to-one correspondence.

[0076] refer to Figure 4 All grooves 2031 have the same length; Reference Figure 5 All of the grooves 2032 have the same length.

[0077] In other embodiments, at least some of the grooves have different lengths. (See reference...) Figure 6 Some grooves 2033 have different lengths, while others have the same length. (Reference) Figure 7 All grooves 2034 have different lengths. (See reference) Figure 8 All the grooves 2035 have different lengths. The lengths of the different grooves in the printed circuit board 200 can be adjusted according to actual needs so that the lengths of the different grooves correspond to the width dimensions of the different flexible circuit boards 300.

[0078] The display panel 100 includes a driving circuit and a light-emitting structure located on the driving circuit. A flexible circuit board 300 is electrically connected to the driving circuit in the display panel 100. When the display panel 100 is electrically connected to multiple flexible circuit boards 300, and at least some of the flexible circuit boards 300 have different widths, at least different areas of the driving circuit are electrically connected by flexible circuit boards 300 of at least different widths, thus supporting diverse design options for the driving circuit in the display panel 100.

[0079] In this embodiment, the display panel 100 is a flexible display panel, which includes a non-bending area, a bending area, and a bonding area connected in sequence. The bonding area is positioned on the back side of the non-bending area by bending through the bending area. When the bonding area is positioned on the back side of the non-bending area by bending through the bending area, the printed circuit board 200 is located on the back side of the non-bending area. When the display panel 100 includes a non-bending area, a bending area, and a bonding area connected in sequence, the flexible circuit board 300 is located on the back side of the non-bending area. When the display panel 100 is a rigid display panel, one end of the flexible circuit board 300 is electrically connected to the rigid display panel, and the other end of the flexible circuit board 300 is bent to the back side of the rigid display panel. When the other end of the flexible circuit board 300 is bent to the back side of the rigid display panel, the printed circuit board 200 is located on the back side of the rigid display panel.

[0080] Another embodiment of the present invention also provides a display module, see reference. Figure 9The difference between the display module in this embodiment and the previous embodiment is that the printed circuit board 200a includes a main circuit area 202a and an edge circuit area 201a. The thickness of the edge circuit area 201a is less than the thickness of the main circuit area 202a. The printed circuit board 200a has a groove 203a formed by the main circuit area 202a and the edge circuit area 201a. The groove 203a has a characteristic sidewall that exposes the main circuit area 202a. The angle θ between the characteristic sidewall and the bottom surface of the groove 203a is an obtuse angle. The advantage of this is that during the bonding process between the second connection end 302 and the edge circuit area 201a, the bonding pressure head is laterally farther away from the main circuit area 202a, avoiding collision between the bonding pressure head and the main circuit area 202a.

[0081] The angle θ between the characteristic sidewall and the bottom surface of the groove 203a is an obtuse angle, for example: the angle θ between the characteristic sidewall and the bottom surface of the groove 203a is 95°, 100°, 120°, 130°, 140° or 150°.

[0082] In one embodiment, the width of the bottom surface of the groove 203a is greater than the depth of the groove 203a, and the width direction of the bottom surface of the groove 203a is parallel to the length direction of the second connecting end 302. In other embodiments, the width of the bottom surface of the groove is less than or equal to the depth of the groove.

[0083] All other aspects of this embodiment are the same as those in the previous embodiment and will not be described in detail again.

[0084] Another embodiment of the present invention also provides a display module, see reference. Figure 10 The system includes: a display panel 100b, the display panel 100b including a bonding area; a printed circuit board 200b, the printed circuit board 200b including a main circuit area 202b and an edge circuit area 201b connected together, the thickness of the edge circuit area 201b being less than the thickness of the main circuit area 202b, the printed circuit board 200b having a groove 203b surrounded by the main circuit area 202b and the edge circuit area 201b; and a flexible circuit board 300b, the flexible circuit board 300b having a first connection end 301b electrically connected to the bonding area and a second connection end 302b electrically connected to the edge circuit area 201b, the first connection end 301b and the bonding area being disposed opposite to each other in the thickness direction of the display panel 100b, the second connection end 302b being located in the groove 203b and the edge circuit area 201b being disposed opposite to each other in the thickness direction of the printed circuit board 200b.

[0085] The printed circuit board 200b includes multiple layers of circuits spaced apart and an insulating base layer located between adjacent circuit layers. The number of circuit layers in the main circuit area 202b is greater than the number of circuit layers in the edge circuit area 201b, and the number of insulating base layers in the main circuit area 202b is greater than the number of insulating base layers in the edge circuit area 201b.

[0086] The number of insulating base layers in the edge circuit region 201b is one or more, and the number of circuit layers in the edge circuit region 202b is one or more.

[0087] The display module further includes: a first conductive connector 401b, located between the first connecting end 301b and the bonding area and connected to both the first connecting end 301b and the bonding area; and a second conductive connector 402b located in the groove 203b, located between the second connecting end 302b and the edge circuit area 201b and connected to both the second connecting end 302b and the edge circuit area 201b. The first conductive connector 401b is made of anisotropic conductive adhesive. The second conductive connector 402b is made of anisotropic conductive adhesive.

[0088] The thickness of the first conductive connector 401b is much smaller than the thickness of the bonding area and much smaller than the thickness of the first connecting end 301b. The thickness of the second conductive connector 402b is much smaller than the thickness of the second connecting end 302b and much smaller than the thickness of the edge circuit area 201b. In one embodiment, the thickness of the first conductive connector 401b is 15μm to 22μm. The thickness of the second conductive connector 402b is 15μm to 22μm.

[0089] The flexible circuit board 300b further includes a flexible main region 303b located between the first connecting end 301b and the second connecting end 302b, the flexible main region 303b being connected to both the first connecting end 301b and the second connecting end 302b. The length of the flexible main region 303b is greater than the length of the first connecting end 301b and the length of the second connecting end 302b. In other embodiments, the length of the flexible main region 303b is not limited.

[0090] In this embodiment, the bonding area is located on one side of the flexible circuit board 300b in the thickness direction, and the edge circuit area 201b is located on the other side of the flexible circuit board 300b in the thickness direction. Specifically, the flexible circuit board 300b has a first surface and a second surface opposite to each other in the thickness direction; the first surface of the first connecting end 301b faces the bonding area, and the second surface of the first connecting end 301b faces away from the bonding area; the second surface of the second connecting end 302b faces the edge circuit area 201b, and the first surface of the second connecting end 302b faces away from the edge circuit area 201b.

[0091] In one embodiment, the absolute value of the difference between the total thickness of the first conductive connector 401b, the second conductive connector 402b, the flexible circuit board 300b, and the bonding area and the depth of the groove 203b is less than or equal to 0.2 mm. This further reduces the peeling force acting on the first connector 301b in the thickness direction of the display panel 100b, further reducing poor bonding between the first connector 301b and the bonding area. It also further reduces the stress inside the second connector 302b, further reducing poor bonding between the second connector 302b and the edge circuit area 201b in the printed circuit board 200b.

[0092] Furthermore, the total thickness of the first conductive connector 401b, the second conductive connector 402b, the flexible circuit board 300b, and the bonding area is equal to the depth of the groove 203b.

[0093] In one embodiment, the width of the bottom surface of the groove 203b is greater than the depth of the groove 203b, and the width direction of the bottom surface of the groove 203b is parallel to the length direction of the second connecting end 302b. This ensures that during the bonding process between the second connecting end 302b and the edge circuit area 201b, the bonding pressure head is laterally farther from the main circuit area 202b, preventing the bonding pressure head from colliding with the main circuit area 202b. In other embodiments, the width of the bottom surface of the groove is less than or equal to the depth of the groove.

[0094] The printed circuit board 200b has one or more recesses 203b. When there are multiple recesses 203b in the printed circuit board 200, the multiple recesses 203b are spaced apart; correspondingly, there are multiple flexible circuit boards 300b; there are multiple bonding areas; the flexible circuit boards 300b and the recesses 203b correspond one-to-one, and the flexible circuit boards 300b and the bonding areas correspond one-to-one. When there are multiple recesses 203b in the printed circuit board 200, the lengths of the multiple recesses 203b are all the same, or at least some of the recesses 203b have different lengths.

[0095] At least some of the grooves have different lengths. In one embodiment, some of the grooves have different lengths, and some have the same length. In another embodiment, all the grooves have different lengths.

[0096] In this embodiment, the display panel 100b is a flexible display panel, which includes a non-bending area, a bending area, and a bonding area connected in sequence. The bonding area is positioned on the back side of the non-bending area by bending through the bending area. When the bonding area is positioned on the back side of the non-bending area by bending through the bending area, the printed circuit board 200b is located on the back side of the non-bending area. When the display panel 100b includes the non-bending area, bending area, and bonding area connected in sequence, the flexible circuit board 300b is located on the back side of the non-bending area. When the display panel 100b is a rigid display panel, one end of the flexible circuit board 300b is electrically connected to the rigid display panel, and the other end of the flexible circuit board 300b is bent to the back side of the rigid display panel. When the other end of the flexible circuit board 300b is bent to the back side of the rigid display panel, the printed circuit board 200b is located on the back side of the rigid display panel.

[0097] Another embodiment of the present invention also provides a display module, see reference. Figure 11 The difference between this embodiment and the previous embodiment is that the printed circuit board 200c includes a main circuit area 202c and an edge circuit area 201c. The thickness of the edge circuit area 201c is less than the thickness of the main circuit area 202c. The printed circuit board 200c has a groove 203c formed by the main circuit area 202c and the edge circuit area 201c. The groove 203c has a characteristic sidewall that exposes the main circuit area 202c. The angle between the characteristic sidewall and the bottom surface of the groove 203c is an obtuse angle.

[0098] The angle between the feature sidewall and the bottom surface of the groove 203c is an obtuse angle. For example, the angle θ between the feature sidewall and the bottom surface of the groove 203c is 95°, 100°, 120°, 130°, 140° or 150°.

[0099] In one embodiment, the width of the bottom surface of the groove 203c is greater than the depth of the groove 203c, and the width direction of the bottom surface of the groove 203c is parallel to the length direction of the second connecting end 302. In other embodiments, the width of the bottom surface of the groove 203c is less than or equal to the depth of the groove 203c.

[0100] All other aspects of this embodiment are the same as those in the previous embodiment and will not be described in detail again.

[0101] Another embodiment of the present invention provides a method for manufacturing a display module, comprising: providing a display panel, the display panel including a bonding area; providing a printed circuit board, the printed circuit board including a connected main circuit area and an edge circuit area, the thickness of the edge circuit area being less than the thickness of the main circuit area, the printed circuit board having a groove surrounded by the main circuit area and the edge circuit area; providing a flexible circuit board, the flexible circuit board having a first connecting end and a second connecting end opposite to each other; bonding the first connecting end and the bonding area together, the first connecting end and the bonding area being disposed opposite to each other in the thickness direction of the display panel; bonding the second connecting end and the edge circuit area together, the second connecting end being located in the groove and the edge circuit area being disposed opposite to each other in the thickness direction of the printed circuit board.

[0102] Before binding the first connection end and the bonding area together, and binding the second connection end and the edge circuit area together, the method for manufacturing the display module further includes: providing a carrier platform; placing the printed circuit board and the display panel on the carrier platform at intervals; binding the first connection end and the bonding area together by a first conductive connector, the first conductive connector being located between the first connection end and the bonding area; binding the second connection end and the edge circuit area together by a second conductive connector, the second conductive connector being located in the groove and between the second connection end and the edge circuit area.

[0103] refer to Figures 12 to 17 This article details a method for manufacturing a display module.

[0104] refer to Figure 12 A display panel 100 is provided, the display panel 100 including a binding area.

[0105] In one embodiment, the display panel 100 is a flexible display panel. The flexible display panel is an organic light-emitting diode (OLED) display panel or a quantum dot (QD) light-emitting diode (QLED) display panel. In other embodiments, the display panel 100 is a rigid display panel, such as a liquid crystal display panel.

[0106] refer to Figure 13 A printed circuit board 200 is provided, the printed circuit board 200 includes a main circuit area 202 and an edge circuit area 201 connected together, the thickness of the edge circuit area 201 is less than the thickness of the main circuit area 202, and the printed circuit board 200 has a groove 203 formed by the main circuit area 202 and the edge circuit area 201.

[0107] Specifically, an initial printed circuit board is provided; a portion of the thickness of the edge area of ​​the initial printed circuit board is cut away to form a printed circuit board 200. The process of cutting away a portion of the thickness of the edge area of ​​the initial printed circuit board includes mechanical cutting or laser cutting.

[0108] The printed circuit board 200 includes multiple layers of circuitry spaced apart and insulating substrates located between adjacent circuitry layers. The number of circuitry layers in the main circuit region 202 is greater than the number of circuitry layers in the edge circuit region 201, and the number of insulating substrates in the main circuit region 202 is greater than the number of insulating substrates in the edge circuit region 201. The number of insulating substrates in the edge circuit region 201 is one or more, and the number of circuitry layers in the edge circuit region 202 is one or more.

[0109] In one embodiment, the absolute value of the difference between the thickness of the edge circuit region 201 and the thickness of the bonding region is less than or equal to 0.2 mm. Further, the thickness of the edge circuit region 201 is the same as the thickness of the bonding region.

[0110] In one embodiment, the width of the bottom surface of the groove 203 is greater than the depth of the groove 203. In other embodiments, the width of the bottom surface of the groove is less than or equal to the depth of the groove.

[0111] The number of recesses in the printed circuit board 200 refers to the description of the first embodiment.

[0112] refer to Figure 14 A flexible circuit board 300 is provided, the flexible circuit board having a first connection end 301 and a second connection end 302 opposite to each other.

[0113] The flexible circuit board 300 further includes a flexible main region 303 located between the first connecting end 301 and the second connecting end 302, and the flexible main region 303 is connected to the first connecting end 301 and the second connecting end 302 respectively. The length of the flexible main region 303 is greater than the length of the first connecting end 301 and the length of the second connecting end 302. In other embodiments, the length of the flexible main region 303 is not limited.

[0114] refer to Figure 15 A carrier platform P is provided; the printed circuit board 200 and the display panel 100 are placed on the carrier platform P at intervals.

[0115] refer to Figure 16 The second connection end 302 and the edge circuit area 201 are bound together, with the second connection end 302 located in the groove 203 and the edge circuit area 201 disposed opposite to the thickness direction of the printed circuit board 200.

[0116] The second connecting end 302 and the edge circuit area 201 are bound together by the second conductive connector 402, which is located in the groove 203 and between the second connecting end 302 and the edge circuit area 201.

[0117] In the step of binding the second connection end 302 and the edge circuit area 201 together by means of the second conductive connector 402, the groove 203 is located on the side of the edge circuit area 201 away from the support platform P.

[0118] The bonding process involves binding the second connection end 302 and the edge circuit area 201 together using the second conductive connector 402.

[0119] In one embodiment, the width of the bottom surface of the groove 203 is greater than the depth of the groove 203, and the width direction of the bottom surface of the groove 203 is parallel to the length direction of the second connecting end 302. This ensures that during the bonding process between the second connecting end 302 and the edge circuit area 201, the pressure head used in the bonding process is laterally farther from the main circuit area 202, preventing the pressure head from colliding with the main circuit area 202. In other embodiments, the width of the bottom surface of the groove is less than or equal to the depth of the groove.

[0120] refer to Figure 17 The first connecting end 301 and the binding area are bound together, and the first connecting end 301 and the binding area are arranged opposite to each other in the thickness direction of the display panel 100.

[0121] The first connecting end 301 and the bonding area are bonded together by a first conductive connector 401, which is located between the first connecting end 301 and the bonding area. The process of bonding the first connecting end 301 and the bonding area together by the first conductive connector 401 is a bonding process.

[0122] In the step of binding the first connection end 301 and the binding area together by means of the first conductive connector 401, the first connection end 301 is located on the side of the binding area away from the bearing platform P.

[0123] In the step of binding the first connection end 301 and the binding area together through the first conductive connector 401, the thickness difference between the display panel 100 and the edge circuit area 201 is small. Therefore, the flexible circuit board 300 is placed flat on the support platform P, avoiding the flexible circuit board 300 pulling the display panel 100 upward, and improving the firmness of the display panel 100 being vacuum-adsorbed on the support platform P.

[0124] In this embodiment, after the second connection end 302 and the edge circuit area 201 are bound together by the second conductive connector 402, the first connection end 301 and the binding area are bound together by the first conductive connector 401. In other embodiments, after the first connection end and the binding area are bound together by the first conductive connector, the second connection end and the edge circuit area are bound together by the second conductive connector.

[0125] It should be noted that, Figures 12 to 17 In this method, the printed circuit board 200 and Figure 2 The printed circuit board 200 in the corresponding embodiment is the same; in other embodiments, it can also be used. Figure 9 The printed circuit board 200a in the corresponding embodiment.

[0126] Another embodiment of the present invention also provides a method for manufacturing a display module. (See reference) Figures 18 to 23 This document details a method for manufacturing a display module. After binding the second connection terminal and the edge circuit area together using a second conductive connector, the first connection terminal and the binding area are then bound together using a first conductive connector.

[0127] refer to Figure 18 It provides a display panel 100b.

[0128] refer to Figure 19 A printed circuit board 200b is provided, the printed circuit board 200b including a main circuit area 202b and an edge circuit area 201b connected together, the thickness of the edge circuit area 201b being less than the thickness of the main circuit area 202b, and the printed circuit board 200b having a groove 203b surrounded by the main circuit area 202b and the edge circuit area 201b.

[0129] Specifically, an initial printed circuit board is provided; a portion of the thickness of the edge area of ​​the initial printed circuit board is cut away to form a printed circuit board 200b. The process of cutting away a portion of the thickness of the edge area of ​​the initial printed circuit board includes mechanical cutting or laser cutting.

[0130] The printed circuit board 200b includes multiple layers of circuitry spaced apart and insulating substrates located between adjacent circuitry layers. The number of circuitry layers in the main circuit region 202b is greater than the number of circuitry layers in the edge circuit region 201b, and the number of insulating substrates in the main circuit region 202b is greater than the number of insulating substrates in the edge circuit region 201b. The number of insulating substrates in the edge circuit region 201b is one or more, and the number of circuitry layers in the edge circuit region 202b is one or more.

[0131] refer to Figure 20 A flexible circuit board 300b is provided, the flexible circuit board 300b having a first connection end 301b and a second connection end 302b opposite to each other.

[0132] The flexible circuit board 300b further includes a flexible main region 303b located between the first connecting end 301b and the second connecting end 302b, the flexible main region 303b being connected to both the first connecting end 301b and the second connecting end 302b. The length of the flexible main region 303b is greater than the length of the first connecting end 301b and the length of the second connecting end 302b. In other embodiments, the length of the flexible main region 303b is not limited.

[0133] refer to Figure 21 A carrier platform P is provided; the printed circuit board 200b and the display panel 100b are placed on the carrier platform P at intervals.

[0134] refer to Figure 22 The second connection end 302b and the edge circuit area 201b are bound together, with the second connection end 302b located in the groove 203b and the edge circuit area 201b disposed opposite to the thickness direction of the printed circuit board 200b.

[0135] The second connecting end 302b and the edge circuit area 201b are bound together by the second conductive connector 402b, which is located in the groove 203b and between the second connecting end 302b and the edge circuit area 201b.

[0136] In the step of binding the second connection end 302b and the edge circuit area 201b together by means of the second conductive connector 402b, the groove 203b is located on the side of the edge circuit area 201b away from the support platform P.

[0137] In one embodiment, the width of the bottom surface of the groove 203b is greater than the depth of the groove 203b, and the width direction of the bottom surface of the groove 203b is parallel to the length direction of the second connecting end 302b. This ensures that during the bonding process between the second connecting end 302b and the edge circuit area 201b, the pressure head used in the bonding process is laterally farther from the main circuit area 202b, preventing the pressure head from colliding with the main circuit area 202b. In other embodiments, the width of the bottom surface of the groove is less than or equal to the depth of the groove.

[0138] refer to Figure 23After the second connection end 302b and the edge circuit area 201b are bound together by the second conductive connector 402b, the printed circuit board 200b is flipped on the carrier platform P so that the groove 203b faces the carrier platform P.

[0139] Continue to refer to Figure 23 The first connecting end 301b and the binding area are bound together, and the first connecting end 301b and the binding area are arranged opposite to each other in the thickness direction of the display panel 100b.

[0140] After flipping the printed circuit board 200b onto the carrier platform P so that the groove 203b faces the carrier platform P, the first connection end 301b and the bonding area are bonded together.

[0141] The first connecting end 301b and the bonding area are bonded together by a first conductive connector 401b, with the first conductive connector 401b located between the first connecting end 301b and the bonding area. The process of bonding the first connecting end 301b and the bonding area together by the first conductive connector 401b is a bonding process.

[0142] In the step of binding the first connection end 301b and the binding area together by means of the first conductive connector 401b, the first connection end 301b is located on the side of the binding area away from the bearing platform P.

[0143] In the step of binding the first connection end 301b and the binding area together by the first conductive connector 401b, the absolute value of the difference between the total thickness of the first conductive connector 401b, the second conductive connector 402b, the flexible circuit board 300b and the binding area and the depth of the groove 203b is small. Therefore, the flexible circuit board 300b is placed flat on the support platform P, avoiding the flexible circuit board 300b pulling the display panel 100b upward, and improving the firmness of the display panel 100b being vacuum-adsorbed on the support platform P.

[0144] In one embodiment, the absolute value of the difference between the total thickness of the first conductive connector 401b, the second conductive connector 402b, the flexible circuit board 300b, and the bonding area and the depth of the groove 203b is less than or equal to 0.2 mm. This further reduces the peeling force acting on the first connector 301b in the thickness direction of the display panel 100b, further reducing poor bonding between the first connector 301b and the bonding area. It also further reduces stress reduction inside the second connector 302b, further reducing poor bonding between the second connector 302b and the edge circuit area 201b in the printed circuit board 200b.

[0145] It should be noted that, Figures 18 to 23 The method uses a printed circuit board 200b and Figure 10 The printed circuit board 200b in the corresponding embodiment is the same; in other embodiments, it can also be used. Figure 11 The printed circuit board 200c in the corresponding embodiment.

[0146] The present invention also provides a display device, including the display module described above.

[0147] Since the principle by which this display device solves the problem is similar to that of the aforementioned display module, the implementation of the display module in this display device can refer to the implementation of the aforementioned display module, and repeated details will not be repeated. This display device can be any product or component with display functionality, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. Other essential components of this display device are understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting the present invention.

[0148] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A display module, characterized in that, include: Display panel, the display panel including a binding area; A printed circuit board, the printed circuit board including a connected main circuit area and an edge circuit area, the main circuit area and the bonding area having a thickness difference; The thickness of the edge circuit area is less than the thickness of the main circuit area, and the printed circuit board has a groove surrounded by the main circuit area and the edge circuit area; A flexible circuit board having a first connection terminal electrically connected to the bonding area and a second connection terminal electrically connected to the edge circuit area, the first connection terminal and the bonding area being disposed opposite to each other in the thickness direction of the display panel, and the second connection terminal being located in the groove and disposed opposite to the edge circuit area in the thickness direction of the printed circuit board.

2. The display module according to claim 1, characterized in that, Also includes: A first conductive connector is located between the first connecting end and the binding area and is respectively connected to the first connecting end and the binding area; a second conductive connector is located in the groove, the second conductive connector is located between the second connecting end and the edge circuit area and is respectively connected to the second connecting end and the edge circuit area.

3. The display module according to claim 1 or 2, characterized in that, The bonding area and the edge circuit area are located on the same side of the flexible circuit board in the thickness direction.

4. The display module according to claim 3, characterized in that, The absolute value of the difference between the thickness of the edge circuit area and the thickness of the bonding area is less than or equal to 0.2 mm.

5. The display module according to claim 4, characterized in that, The thickness of the edge circuit region is the same as the thickness of the bonding region.

6. The display module according to claim 2, characterized in that, The bonding area is located on one side of the flexible circuit board in the thickness direction, and the edge circuit area is located on the other side of the flexible circuit board in the thickness direction.

7. The display module according to claim 6, characterized in that, The absolute value of the difference between the total thickness of the first conductive connector, the second conductive connector, the flexible circuit board, and the bonding area and the depth of the groove is less than or equal to 0.2 mm.

8. The display module according to claim 7, characterized in that, The total thickness of the first conductive connector, the second conductive connector, the flexible circuit board, and the bonding area is equal to the depth of the groove.

9. The display module according to claim 1, characterized in that, The width of the bottom surface of the groove is greater than the depth of the groove, and the width direction of the bottom surface of the groove is parallel to the length direction of the second connecting end.

10. The display module according to claim 1 or 9, characterized in that, The groove has a feature sidewall that exposes the main circuit area, and the angle between the feature sidewall and the bottom surface of the groove is an obtuse angle.

11. The display module according to claim 1, characterized in that, The printed circuit board has multiple recesses, which are spaced apart; the flexible circuit board has multiple locations; the bonding area has multiple locations; each flexible circuit board corresponds to a recess, and each flexible circuit board corresponds to a bonding area.

12. The display module according to claim 11, characterized in that, All of the grooves are of the same length; or, at least some of the grooves are of different lengths.

13. The display module according to claim 1, characterized in that, The printed circuit board includes multiple layers of circuitry spaced apart and an insulating base layer located between adjacent circuitry layers. The number of circuitry layers in the main circuit area is greater than the number of circuitry layers in the edge circuit area, and the number of insulating base layer layers in the main circuit area is greater than the number of insulating base layer layers in the edge circuit area.

14. The display module according to claim 13, characterized in that, The number of insulating base layers in the edge circuit area is one or more, and the number of circuit layers in the edge circuit area is one or more.

15. A method for manufacturing a display module, characterized in that, include: A display panel is provided, the display panel including a binding area; A printed circuit board is provided, the printed circuit board including a connected main circuit area and an edge circuit area, the main circuit area and the bonding area having a thickness difference; The thickness of the edge circuit area is less than the thickness of the main circuit area, and the printed circuit board has a groove surrounded by the main circuit area and the edge circuit area; A flexible circuit board is provided, the flexible circuit board having opposing first and second connection ends; The first connecting end and the bonding area are bonded together, and the first connecting end and the bonding area are arranged opposite to each other in the thickness direction of the display panel. The second connecting end and the edge circuit area are bonded together, and the second connecting end is located in the groove and is arranged opposite to the edge circuit area in the thickness direction of the printed circuit board.

16. The method for preparing a display module according to claim 15, characterized in that, Before binding the first connection terminal and the bonding area together, and binding the second connection terminal and the edge circuit area together, the method for manufacturing the display module further includes: providing a carrier platform; and placing the printed circuit board and the display panel on the carrier platform at intervals. The first connecting end and the bonding area are bonded together by a first conductive connector, which is located between the first connecting end and the bonding area; the second connecting end and the edge circuit area are bonded together by a second conductive connector, which is located in the groove and between the second connecting end and the edge circuit area.

17. The method for manufacturing a display module according to claim 16, characterized in that, In the step of binding the first connection end and the binding area together using the first conductive connector, the first connection end is located on the side of the binding area away from the support platform; in the step of binding the second connection end and the edge circuit area together using the second conductive connector, the groove is located on the side of the edge circuit area away from the support platform.

18. The method for preparing a display module according to claim 17, characterized in that, After binding the first connection end and the bonding area together using the first conductive connector, the second connection end and the edge circuit area are bound together using the second conductive connector; or, after binding the second connection end and the edge circuit area together using the second conductive connector, the first connection end and the bonding area are bound together using the first conductive connector.

19. The method for preparing a display module according to claim 16, characterized in that, After the second connection end and the edge circuit area are bound together by the second conductive connector, the first connection end and the binding area are bound together by the first conductive connector; in the step of binding the second connection end and the edge circuit area together by the second conductive connector, the groove is located on the side of the edge circuit area away from the support platform; The method for manufacturing the display module further includes: after binding the second connection end and the edge circuit area together by the second conductive connector, and before binding the first connection end and the binding area together by the first conductive connector, flipping the printed circuit board on the carrier platform so that the groove faces the carrier platform; In the step of binding the first connection end and the binding area together by means of the first conductive connector, the first connection end is located on the side of the binding area away from the support platform.

20. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 14.

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