Droplet ejection head, droplet ejection head unit, and droplet ejection apparatus

Abstract

The present invention relates to a liquid droplet ejection head, a liquid droplet ejection head unit, and a liquid droplet ejection apparatus, and aims to prevent occurrence of crosstalk and prevent foreign matter from being mixed into a bonding surface. The liquid droplet ejection head has a nozzle plate (10) having a plurality of nozzle holes (11), a vibrating plate (30) opposed to the inner side of the nozzle plate, a plurality of individual liquid chambers (21) connected to the nozzle holes between the nozzle plate and the vibrating plate, a plurality of piezoelectric elements (40) on the vibrating plate, a holding member (12) opposed to the piezoelectric elements and the vibrating plate and bonded to the peripheral portion of the vibrating plate with a first bonding portion (7), and a plurality of accommodation spaces (14) that accommodate the piezoelectric elements between the holding member and the vibrating plate, the vibrating plate is vibrated by the piezoelectric elements to generate pressure in the individual liquid chambers, liquid droplets are ejected from the nozzle holes, a non-bonding space (NA) is formed in the area inside the first bonding portion other than the accommodation spaces, and a second bonding portion (2) that bonds the vibrating plate and the holding member is provided between the accommodation spaces.

Description

Technical Field

[0001] This invention relates to droplet nozzles, droplet nozzle units, and droplet ejection devices. Background Technology

[0002] The droplet ejection device, unlike the inkjet method disclosed in Patent Document 1 (JP Patent No. 6064688), uses an actuator (piezoelectric element) to vibrate a diaphragm, generating pressure in individual liquid chambers. This pressure is then used to eject droplets from tiny nozzle orifices formed on a nozzle plate. Droplet ejection devices are used in various fields, such as for high-resolution graphic drawing on car bodies, or for ejecting liquid photoresist and DNA samples as droplets.

[0003] Patent document 1 discloses a droplet nozzle comprising an actuator substrate on a silicon substrate on which a vibrating plate, piezoelectric elements, and individual liquid chambers are integrally formed; a holding member (sub-frame) reinforcing the actuator substrate from one side; and a nozzle plate opposite the holding member and attached to the individual liquid chambers. In recent years, there has been a growing trend towards using droplet nozzles that improve rendering resolution by reducing the nozzle spacing. Simultaneously, the spacing between piezoelectric elements on the actuator substrate has also become narrower. This narrowing of the spacing can be achieved using MEMS (Micro ElectroMechanical Systems) technology, which applies semiconductor processes.

[0004] Previously, to prevent crosstalk (mutual interference) between piezoelectric elements with narrow spacing, the actuator substrate and holding components were almost entirely bonded with adhesives (coatings), except for the housing space for the piezoelectric elements. Although MEMS processes are carried out in clean rooms, fine foreign matter smaller than 10 μm can sometimes get mixed into the bonding surface (coating) between the actuator substrate and the holding components and become trapped. This can cause cracking of the actuator substrate and deterioration of substrate characteristics, resulting in a decrease in substrate yield.

[0005] Furthermore, a large coating area can easily cause adhesive to overflow towards the piezoelectric element side, and this overflow can affect droplet ejection performance. When the adhesive coating conditions are inconsistent, the amount of adhesive used across the entire actuator substrate can vary, and uneven residual stress in the coating can cause differences in droplet ejection characteristics across different substrates. Summary of the Invention

[0006] The purpose of this invention is to avoid crosstalk and prevent a decrease in yield caused by foreign matter entering the bonding surface of the retaining components.

[0007] To address the aforementioned issues, the present invention provides a droplet nozzle comprising: a nozzle plate having a plurality of nozzle holes; a vibrating plate disposed opposite to the inner surface of the nozzle plate; a plurality of individual liquid chambers formed between the nozzle plate and the vibrating plate and respectively connected to the plurality of nozzle holes; a plurality of actuators disposed on the vibrating plate opposite to the individual liquid chambers, corresponding to each individual liquid chamber; a retaining member disposed opposite to the actuators and the vibrating plate and bonded to the periphery of the vibrating plate by a first adhesive portion; and a plurality of receiving spaces formed between the retaining member and the vibrating plate and individually accommodating the actuators. Under pressure generated in the individual liquid chambers by driving the actuators to vibrate the vibrating plate, droplets are ejected from the nozzle holes. The invention is characterized in that, in the area inside the first adhesive portion other than the receiving spaces, a non-adhesive space is formed where the vibrating plate and the retaining member are not bonded; and second adhesive portions are provided between the plurality of receiving spaces for bonding the vibrating plate and the retaining member.

[0008] The advantage of this invention is that it can avoid crosstalk and prevent the yield reduction caused by foreign matter mixing into the bonding surface of the retaining components. Attached Figure Description

[0009] Figure 1A This is a schematic diagram of a droplet ejection device according to an embodiment of the present invention.

[0010] Figure 1B This is a plan view of the nozzle unit of the droplet jetting device.

[0011] Figure 2A This is an exploded perspective view of the head unit according to an embodiment of the present invention.

[0012] Figure 2B This is an exploded perspective view from the nozzle side of the head unit.

[0013] Figure 3 It is a cross-sectional view along the short side of the head element.

[0014] Figure 4 In the first embodiment, (a) is the bonding surface of the actuator substrate of the holding member of the droplet nozzle, and (b) is the bonding surface of the holding member of the actuator substrate of the droplet nozzle.

[0015] Figure 4A (a) is a plan view of the actuator substrate, and (b) is a cross-sectional view of the actuator substrate along line A-A'.

[0016] Figure 4B This is a B-B' cross-sectional view of the actuator substrate.

[0017] Figure 4CThis is a C-C' cross-sectional view of the actuator substrate.

[0018] Figure 4D This is a D-D' cross-sectional view of the driver substrate.

[0019] Figure 5 It is the bonding surface of the actuator substrate of the previous retaining component.

[0020] Figure 5A This is a cross-sectional view of the actuator substrate and the holding component along line A''-A'''.

[0021] Figure 5B This is a cross-sectional view of the actuator substrate and the holding component along the B''-B''' line.

[0022] Figure 5C This is a C''-C''' cross-sectional view of the actuator substrate and the holding component.

[0023] Figure 5D This is a cross-sectional view of the actuator substrate and the holding component from D'' to D'''.

[0024] Figure 6 (a) is a mating surface of the actuator substrate of the droplet nozzle holding member according to the second embodiment of the present invention, and (b) is a cross-sectional view along E-E' of the droplet nozzle holding member according to the second embodiment of the present invention.

[0025] Figure 7 (a) is a bonding surface of the actuator substrate of the droplet nozzle holding member according to the third embodiment of the present invention, and (b) is a cross-sectional view along F-F' of the droplet nozzle holding member according to the third embodiment of the present invention.

[0026] Figure 8 (a) is a plan view of one bonding surface of the holding member of the actuator substrate according to the fourth embodiment of the present invention; (b) is an enlarged plan view of the island-shaped bonding pattern of the fourth bonding portion according to the fourth embodiment of the present invention; (c) is a cross-sectional view of the fourth bonding portion along G-G' according to the fourth embodiment of the present invention; and (d) is a plan view of the island-shaped bonding pattern according to the fourth embodiment of the present invention.

[0027] Figure 9 (a) is a plan view of the actuator substrate showing the first to fourth bonding portions of Modified Example 1, and (b) is a plan view of the third bonding portion of Modified Example 2.

[0028] Figure 10 (a) is a plan view of a variant of the first embodiment according to Variation 3 of the present invention, and (b) is a plan view of a variant of the third embodiment according to Variation 4 of the present invention.

[0029] Figure 11This is a plan view of a variant of the second embodiment involved in Variant Example 5.

[0030] Figure 12 This is a cross-sectional view of the bonding portion between the retaining member and the actuator substrate in variant example 6. Detailed Implementation

[0031] Hereinafter, embodiments will be described with reference to the accompanying drawings. For clarity, the following description and drawings have been appropriately omitted or simplified. In the various drawings, constituent elements and equivalent parts having the same structure or function are given the same reference numerals, and their descriptions are omitted.

[0032] <Printing device>

[0033] The following is for reference. Figure 1A and Figure 1B This illustrates an example of the droplet ejection device of the present invention. Figure 1A This is a schematic diagram of a printing device 500 that uses a droplet ejection mechanism. Figure 1B This is a plan view of the head unit 100 used in the printing device 500.

[0034] The printing apparatus 500 includes an infeed section 501 for transporting a continuous roll of paper 510, a guide transport section 503 for guiding and transporting the continuous roll of paper 510 from the infeed section 501 to the printing section 505, a printing section 505 for performing printing and spraying droplets onto the continuous roll of paper 510 to form an image, a drying section 507 for drying the continuous roll of paper 510, and an outfeed section 509 for transporting the continuous roll of paper 510 out.

[0035] The continuous roll of paper 510 is fed out from the original winding roller 511 of the feed section 501, guided and transported by the rollers of the feed section 501, the guide transport device 503, the drying section 507, and the delivery section 509, and is wound up by the take-up roller 591 of the delivery section 509. The continuous roll of paper 510 is transported to the transport guide member 559 in the printing section 505, which is opposite to the head unit 550, and the image is printed by the liquid sprayed from the head unit 550.

[0036] like Figure 1B As shown, in head unit 550, two head units 100A and 100B of the present invention are disposed on a common base component 552. Then, when the arrangement direction of the nozzles 101 in the direction orthogonal to the transport direction of head unit 100 is taken as the nozzle arrangement direction, the nozzle rows 1A1 and 1A2 of head unit 100A spray droplets of the same color. Similarly, the nozzle rows 1B1 and 1B2 of head unit 100A are grouped together, the nozzle rows 1C1 and 1C2 of head unit 100B are grouped together, and the nozzle rows 1D1 and 1D2 are grouped together, each spraying droplets of the desired color.

[0037] The head unit of the present invention can be integrally formed with functional components and mechanisms to constitute a liquid jetting unit. For example, the head unit can be combined with at least one of the following components: a nozzle box, a bracket, a supply mechanism, a maintenance and recovery mechanism, a main scanning movement mechanism, and a liquid circulation device.

[0038] Here, the integral formation includes a configuration in which, for example, the head unit and functional components and mechanisms are fixed to each other by fastening, bonding, or engaging, and a configuration in which one party is movable relative to the other. In addition, the head unit, functional components, and mechanisms can also be configured to be detachable.

[0039] The "droplet ejection device" of the present invention includes a head unit or a liquid ejection unit, and includes means for driving the liquid ejection head to eject droplets. The droplet ejection device is not only a device that can eject droplets onto objects that can adhere to liquid, but also a device that can eject liquids into gases and liquids.

[0040] "Droplet ejection apparatus" may also include devices related to the transport, conveying, and discharge of objects with attached liquids, as well as pretreatment devices, post-treatment devices, etc. For example, as "droplet ejection apparatus", there are devices that eject ink to form images on paper, i.e., image forming devices, and three-dimensional modeling devices, which are used to eject modeling liquid into powder layers that have been formed into powder layers to create three-dimensional objects.

[0041] "Droplet jetting device" is not limited to devices that visualize meaningful images such as text and graphics by jetting liquid. It also includes devices that form patterns that are not meaningful in themselves, and devices that create three-dimensional images.

[0042] The term "objects capable of adhering to liquids" refers to objects that can at least temporarily adhere to liquids, objects that can adhere to and be fixed in place, and objects that can adhere to and penetrate liquids. For example, this includes all objects to which liquids adhere, unless otherwise specified, such as paper, recording paper, recording paper for recording purposes, films, cloth and other recording media, electronic substrates, electronic components such as piezoelectric elements, powder layers, organ models, inspection units, and other media.

[0043] The aforementioned "object capable of adhering to liquid" can be made of materials such as paper, thread, fiber, cloth, leather, metal, plastic, glass, wood, ceramics, etc., as long as it can temporarily adhere to liquid. A "droplet jetting device" is a device that causes relative movement between the liquid nozzle and the object capable of adhering to liquid, but it is not limited to this. Examples include tandem devices that move the liquid nozzle and linear devices that do not move the liquid nozzle.

[0044] Other "droplet jetting devices" include treatment liquid coating devices that spray treatment liquid onto paper for the purpose of altering the paper surface, and jet granulation devices that granulate raw materials into microparticles by spraying a component liquid in a solution dispersed in the raw material through a nozzle. The sprayed liquid only needs to have a viscosity and surface tension suitable for spraying from the nozzle; there are no other particular restrictions, but liquids with a viscosity of 30 MPa·s or less at room temperature and pressure, or by heating or cooling, are preferred.

[0045] More specifically, these are solutions, suspensions, emulsions, etc., containing solvents such as water or organic solvents, colorants such as dyes or pigments, polymers, synthetic resins, functional materials such as surfactants, biocompatible materials such as DNA, amino acids or proteins, and calcium, and edible materials such as natural pigments. These can be used for applications such as inkjet inks, surface treatment liquids, liquids for forming photoresist patterns in electronic components or light-emitting elements, and liquid materials for three-dimensional modeling.

[0046] Energy sources for ejected droplets include thermal actuators using piezoelectric actuators (layered piezoelectric elements and thin-film piezoelectric elements), electrothermal conversion elements such as heating resistors, and electrostatic actuators consisting of a vibrating plate and a counter electrode. In this document, the terms image formation, recording, printing, imprinting, and modeling are all synonyms.

[0047] <Head Unit>

[0048] The following is for reference. Figure 2A , Figure 2B , Figure 3 This describes the header unit of an embodiment of the present invention. Figure 2A This is an exploded perspective view from the retaining component side of the head unit. Figure 2B This is an exploded perspective view from the nozzle plate side. Figure 3 It is a cross-sectional view along the short side of the head element.

[0049] The head unit 100 includes multiple nozzles 101 that serve as liquid nozzles for ejecting droplets, a base component 102, a cover component 103, a heat dissipation component 104, a manifold 105, a printed circuit board (PCB) 106, and a module housing 107.

[0050] The multiple nozzles 101 include: a nozzle plate 10 forming a nozzle hole 11, an individual flow path plate 20 forming an individual liquid chamber 21 communicating with the nozzle hole 11, a vibrating plate 30 including a piezoelectric element 40, an intermediate flow path plate 50 stacked on the vibrating plate 30 as a holding member of the vibrating plate 30, and a common flow path member 70 stacked on the intermediate flow path plate 50.

[0051] Individual flow path plate 20, together with individual liquid chamber 21, forms a supplier individual flow path 22 communicating with individual liquid chamber 21 and a receiver individual flow path 24 communicating with individual liquid chamber 21. Intermediate flow path plate 50 forms a supplier intermediate individual flow path 51 communicating with supplier individual flow path 22 through opening 31 of vibrating plate 30, and a receiver intermediate individual flow path 52 communicating with receiver individual flow path 24 through opening 32 of vibrating plate 30.

[0052] The common flow path component 70 forms a supplier common flow path 71 that communicates with the intermediate individual flow path 51 of the supplier and a recycling common flow path 72 that communicates with the intermediate individual flow path 52 of the recycling party. The supplier common flow path 71 communicates with the supply port 81 through the flow path 151 of the manifold 105. The recycling common flow path 72 communicates with the recycling port 82 through the flow path 152 of the manifold 105.

[0053] The piezoelectric element 40 of the printed circuit board 106 and the printhead 101 is connected by a flexible wiring component 90. A driver IC (driver circuit) 91 is mounted on the flexible wiring component 90.

[0054] In this embodiment, a plurality of nozzles 101 are mounted on the base component 102 at intervals. The nozzles 101 are inserted into the openings 121 provided on the base component 102, and the periphery of the nozzle plate 10 of the nozzles 101 is bonded to the cover component 103 bonded and fixed on the base component 102, thereby mounting the nozzles 101 onto the base component 102.

[0055] The flange 70a, which is located outside the common flow path component 70 of the nozzle 101, is bonded to the base component 102 for fixation. The fixing structure is not limited to the nozzle 101 and the base component 102, and can be fixed by bonding, riveting, screw fixing, etc.

[0056] Here, it is preferable to use a material with a low coefficient of linear expansion to form the base component 102, such as 42 alloy (alloy) with nickel added to iron and Invar material.

[0057] This embodiment uses Invar material. In this way, even if the nozzle 101 heats up and the temperature of the base component 102 rises, the nozzle is less likely to deviate from the predetermined nozzle position because the expansion of the base component 102 is small, thus suppressing the deviation of the dripping position.

[0058] Similarly, the nozzle plate 10, as well as individual flow path plates 20 and vibrating plates 30, are formed from silicon single-crystal substrates, so that the coefficients of linear expansion of the base components 102 are approximately the same. This reduces nozzle position shift caused by thermal expansion.

[0059] <First Implementation Method>

[0060] The bonding structure between the vibrating plate 30 and the intermediate flow path plate 50 will be described next. In the accompanying drawings described and referenced below, the intermediate flow path plate 50 is used as the retaining member 12 of the vibrating plate 30.

[0061] Figure 4 (a) is a plan view of the retaining member 12 as seen from the vibrating plate 30 side, and (b) is a plan view of the vibrating plate 30 as seen from the retaining member 12 side.

[0062] As described above, a piezoelectric element 40 is provided on the vibrating plate 30. The piezoelectric element 40 is connected to the outside via the functional wiring section 4. The vibrating plate 30, which provides the piezoelectric element 40, is also referred to as an actuator substrate. Figure 4A As shown, the multiple individual liquid chambers 21 below the vibrating plate 30 are separated by partition walls 26 and are independent of each other.

[0063] <First adhesive part, second adhesive part>

[0064] The retaining member 12 is a horizontal rectangle, and a first adhesive portion 7 is formed along the four sides of the retaining member 12 with a specified width. The first adhesive portion 7 is rectangular and is bonded to the four sides of the vibrating plate 30 with adhesive.

[0065] The adhesive can be, for example, a resin material; specifically, a thermosetting adhesive such as an epoxy resin can be used. Preferably, the adhesive has a Young's modulus of 2 GPa or higher. The coating thickness of the adhesive is, for example, 1.0 to 3.0 μm.

[0066] Multiple second adhesive portions 2 are formed in two rows along the length of the retaining member 12. Each second adhesive portion 2 is formed in a linear shape. The second adhesive portions 2 are formed at a predetermined angle relative to the width direction of the retaining member 12. This is to effectively utilize the space on the vibrating plate 30 and achieve a narrow spacing.

[0067] A receiving space 14 is formed between the second adhesive portions 2 to accommodate the piezoelectric element 40 on the vibrating plate 30. The length of the second adhesive portion 2 is the length of the receiving space 14 located between two parallel straight lines connecting the two ends of adjacent second adhesive portions 2.

[0068] The containment space 14 described herein does not necessarily need to be divided into surrounding components. The containment space 14 only needs to have space to accommodate the piezoelectric element 40.

[0069] Preferably, the width of the second adhesive portion 2 is 20μm to 50μm, and the height is 15μm to 50μm. Preferably, the thickness of the retaining member 12 is 300μm to 500μm.

[0070] like Figure 4A (a) and (b) and Figure 12As shown, the second adhesive portion 2 is bonded to the vibrating plate 30 via the non-functional wiring portion 3 and adhesive AD. The second adhesive portion 2 is used to suppress crosstalk between the piezoelectric elements 40.

[0071] The non-functional wiring portions 3 are configured in pairs. The pair of non-functional wiring portions 3 are arranged with a width W1 approximately the same as the second adhesive portion 2, forming a gap between the non-functional wiring portions 3. The function of this gap will be explained later. Figure 12 The explanation is as follows.

[0072] The adhesive AD can be a thermosetting adhesive such as an epoxy resin. Preferably, the Young's modulus of the adhesive AD is 2 GPa or higher. The coating thickness of the adhesive AD can be, for example, 1.0 to 3.0 μm.

[0073] The two rows of second adhesive portions 2 form liquid supply channels 8 in pairs, corresponding to each receiving space 14. For example... Figure 4B As shown, the liquid supply channel 8 is connected to a set of two liquid supply channels 9 formed on the vibrating plate 30. The liquid supply channels 9 of the vibrating plate 30 are connected to each liquid chamber 21. On the other hand, the upstream of the liquid supply channel 8 is connected to the main flow (common channel), and the main flow is connected to multiple liquid supply channels that are respectively connected to multiple pressure chambers.

[0074] <Third Adhesive Section>

[0075] like Figure 4B As shown, a third adhesive portion 5 is formed integrally with the retaining member 12 around the liquid supply channel 8 of the retaining member 12. Preferably, the height of the third adhesive portion 5 is 15 μm to 50 μm.

[0076] The third adhesive portion 5 is formed in a rectangular shape, surrounding the two liquid supply channels 8, and is bonded to the vibrating plate 30 around the liquid supply channel 9 by adhesive AD. Adhesive AD can be, for example, a thermosetting epoxy adhesive. Preferably, the Young's modulus of adhesive AD is 2 GPa or higher. The coating thickness of the adhesive can be, for example, 1.0 to 3.0 μm.

[0077] Previously, as will be described later Figure 5 As shown, including the area surrounding the liquid supply channel 8, the inner region of the first adhesive portion 7 and the vibrating plate 30 are fully bonded together by the coating 12a. In this embodiment, by forming the second adhesive portion 2, the third adhesive portion 5, and the fourth adhesive portion 6 in a limited manner, the coating film can be significantly reduced, and the yield of the droplet nozzle can be improved.

[0078] <Fourth Adhesive Section>

[0079] A fourth adhesive portion 6 is formed between a rectangular frame-shaped first adhesive portion 7 and a linear second adhesive portion 2 on its inner side. Preferably, the height of the fourth adhesive portion 6 is 15 μm to 50 μm.

[0080] The fourth adhesive part 6 is formed into a triangular island shape, such as Figure 4D As shown, the adhesive is bonded to one side of the vibrating plate 30 via an island-shaped adhesive pattern 13. The adhesive can be, for example, a thermosetting epoxy-based adhesive. Preferably, the adhesive has a Young's modulus of 2 GPa or higher. The coating thickness of the adhesive can be, for example, 1.0 to 3.0 μm.

[0081] The fourth adhesive portion 6 enhances the bonding strength between the retaining member 12 and the vibrating plate 30 at their periphery. The fourth adhesive portion 6 also suppresses the propagation of crosstalk that detours to the outside of the first adhesive portion 7. Alternatively, the fourth adhesive portion 6 can be omitted by making a portion of the first adhesive portion 7 protrude inwards.

[0082] <Comparison with existing technologies>

[0083] As described above in this embodiment, apart from the minimum necessary second adhesive portion 2, third adhesive portion 5, and fourth adhesive portion 6, the inner region of the frame-shaped first adhesive portion 7 of the retaining member 12 becomes a non-contact area NA where the entire surface is not bonded to the vibrating plate 30. The housing space 14 of the piezoelectric element 40 is included in the non-contact area NA.

[0084] The inner area of ​​the existing frame-shaped first adhesive part 7, such as Figure 5 As shown, except for the housing space 14 of the piezoelectric element 40, almost the entire surface is covered by a coating 12a of adhesive AD, as... Figures 5A-5D The piezoelectric elements 40 are also bonded to the vibrating plate 30 with a coating 12a between them, with a width W2, via the non-functional wiring portion 3. Figure 4A (W1 < W2). Therefore, as mentioned above, there is a problem that foreign matter may be mixed into the coating 12a, leading to a decrease in the yield of the droplet nozzle.

[0085] In this embodiment, the inner region of the frame-shaped first adhesive portion 7, apart from the second adhesive portion 2 necessary to suppress crosstalk between the piezoelectric elements 40, essentially becomes a non-contact area NA that keeps the component 12 and the vibrating plate 30 from being bonded together. Therefore, compared to the prior art, the adhesive surface of the adhesive AD is significantly reduced, which can greatly improve the reduction in nozzle yield caused by foreign matter contamination at the adhesive surface.

[0086] <Second Implementation Method>

[0087] Figure 6This invention shows a second embodiment, in which the second adhesive portion 2 is configured as two parallel lines. Compared with the first embodiment, although the adhesive area of ​​the second adhesive portion is slightly increased, two second adhesive portions 2 can be arranged between the piezoelectric elements 40, thus improving the suppression effect of crosstalk between the piezoelectric elements 40.

[0088] <Third Implementation Method>

[0089] Figure 7 This invention shows a third embodiment in which the second adhesive portion 2b is formed in a closed shape. That is, the second adhesive portion 2b is formed in a rectangular frame shape so that the second adhesive portion 2b surrounds the receiving space 14 of the piezoelectric element 40.

[0090] In this way, by using the second adhesive portion 2b to surround the receiving space 14 of the piezoelectric element 40 to form a rectangular frame, although the adhesive area of ​​the second adhesive portion 2b is slightly increased compared with the first embodiment, the suppression effect of crosstalk between the piezoelectric elements 40 can be improved.

[0091] <Fourth Implementation Method>

[0092] Figure 8 Displayed Figure 4D This is a modified example of the island-shaped adhesive pattern 13 described above. As described above, the adhesion between the fourth adhesive portion 6 and the island-shaped adhesive pattern 13 can improve the adhesion force between the retaining member 12 and the periphery of the vibrating plate 30, but foreign matter may also be mixed into the coating of the island-shaped adhesive pattern 13.

[0093] In order to reduce the coating area, such as Figure 8 As shown in (b) and (c), an island-shaped adhesive pattern 13 with recesses 13a is formed. Since the coating area of ​​the island adhesive pattern 13 can be reduced by only passing through the portion of the recesses 13a, the possibility of foreign matter contamination in the coating can be reduced.

[0094] Furthermore, the amount of adhesive used in the coating can be reduced. Additionally, since the adhesive penetrates the recess 13a, an anchoring effect is achieved, thus increasing the bond strength.

[0095] Figure 8 Example (d) is an island-shaped bonding pattern 13 constructed from non-functional wiring sections that have no electrical connection to the outside. By using the island-shaped bonding pattern 13 as a non-functional wiring section, electrical faults can be prevented. The island-shaped bonding pattern 13 can be constructed from functional wiring sections that have electrical connection to the outside, or multiple island-shaped bonding patterns 13 can be arranged alternately with functional wiring sections and non-functional wiring sections.

[0096] <Variation Example 1>

[0097] Figure 9(a) shows the surrounding text Figure 4 , Figure 4B Example 1 of a modification of the third adhesive portion 5 of the liquid supply channel 8 shown. Figure 4 , Figure 4B The third adhesive part 5 is rectangular. In this regard, Figure 9 In (a), the third adhesive part 5 is formed into a continuous linear figure-eight shape.

[0098] In this way, by forming the third adhesive portion 5 continuously in a linear manner, the adhesive area around the liquid supply channel 8 and the amount of adhesive used can be reduced, thereby reducing the possibility of foreign matter mixing into the coating film.

[0099] <Variation Example 2>

[0100] Figure 9 (b) represents a variation 2 of the third adhesive portion 5, in which two third adhesive portions 5 are independently formed around the two liquid supply channels 8. In this case, each third adhesive portion 5 can be formed as a ring with the same shape as the liquid supply channel 8. This further reduces the bonding area and adhesive usage around the liquid supply channel 8, and reduces the possibility of foreign matter contamination in the coating film.

[0101] <Variation Example 3>

[0102] Figure 10 (a) shows Figure 4 Example 3 of the modification of the second adhesive part 2 described in (a). Figure 4 The second adhesive part 2 of (a) is a line shape and is formed independently.

[0103] In response, Figure 10 The second adhesive portions 2 are bonded to each other via linear connecting portions 2a. Since one side of the housing space 14 of the piezoelectric element 40 is closed by the connecting portion 2a, crosstalk propagation between adjacent piezoelectric elements 40 can be suppressed by detouring the second connecting portion 2 outward.

[0104] <Variant Example 4>

[0105] Figure 10 (b) display Figure 7 Example 4 of the modification of the second adhesive part 2b described in (a). Figure 7 The second adhesive part 2b of (a) is rectangular and formed independently.

[0106] In response, Figure 10 The second adhesive portion 2b of (b) is bonded to each other through the linear connecting portion 2a. The connecting portion 2a can suppress the propagation of crosstalk between adjacent piezoelectric elements 40.

[0107] <Variation Example 5>

[0108] Figure 11 show Figure 6 Example 5 of the modification of the second adhesive part 2. Figure 6 The second adhesive portion 2 is composed of two parallel lines, which improves the crosstalk suppression effect. In response, Figure 11 The second adhesive portion 2 is in the shape of two parallel lines, but the length of the second adhesive portion 2 is greater than that of the other two lines. Figure 6 short.

[0109] The ends of the two second adhesive portions 2 overlap near the midpoint of the longitudinal direction of the receiving space 14 of the piezoelectric element 40. The midpoint of the longitudinal direction of the receiving space 14 is the part most prone to crosstalk propagation. By overlapping the ends of the two second adhesive portions 2 at this part, the crosstalk suppression effect can be improved, while reducing the bonding area of ​​the second adhesive portions 2 and the amount of adhesive used, thereby reducing the possibility of foreign matter contamination in the coating.

[0110] <Variation Example 6>

[0111] Figure 12 This is a variation 6, in which the structure of component 12 and vibrating plate 30 is maintained by bonding the second adhesive portion 2 and the non-functional wiring portion 3. The non-functional wiring portion 3 is a wiring portion without electrical function, which is patterned during the MEMS process. The non-functional wiring portion 3 can also be connected to external electrodes to realize functional wiring, but in order to prevent electrical problems, it is preferable to use the non-functional wiring portion 3.

[0112] Two non-functional wiring portions 3 are arranged parallel to the second adhesive portion 2 relative to one non-functional wiring portion 3. That is, the width of one non-functional wiring portion 3 is smaller than the width of one second adhesive portion 2. As a result, a space for adhesive AD to enter can be formed between the two non-functional wiring portions 3.

[0113] By introducing adhesive AD into this space, the adhesion force between the second adhesive portion 2 and the vibrating plate 30 can be improved through an anchoring effect. In this case, it is preferable that the Young's modulus of adhesive AD is 2 GPa or higher.

[0114] The invention described above has been specifically illustrated with reference to the embodiments, but the invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the invention. For example, an epoxy-based thermosetting adhesive can be used as the adhesive, but other types of adhesives can certainly be used. Furthermore, a heat-fused film or similar material can be used instead of the adhesive.

[0115] <Postscript>

[0116] The following are preferred embodiments of the present invention.

[0117] <Method 1>

[0118] A droplet nozzle includes: a nozzle plate having a plurality of nozzle holes; a vibrating plate disposed opposite to the inner side of the nozzle plate; a plurality of individual liquid chambers formed between the nozzle plate and the vibrating plate and respectively connected to the plurality of nozzle holes; a plurality of actuators disposed on the vibrating plate opposite to the individual liquid chambers, corresponding to each individual liquid chamber; a retaining member disposed opposite to the actuators and the vibrating plate and bonded to the periphery of the vibrating plate by a first adhesive portion; and a plurality of receiving spaces formed between the retaining member and the vibrating plate and individually accommodating the actuators. Under pressure generated in the individual liquid chambers by driving the actuators to vibrate the vibrating plate, droplets are ejected from the nozzle holes. The nozzle nozzle is characterized in that, in the area inside the first adhesive portion other than the receiving spaces, a non-adhesive space is formed where the vibrating plate and the retaining member are not bonded; and second adhesive portions are provided between the plurality of receiving spaces for bonding the vibrating plate and the retaining member.

[0119] <Method 2>

[0120] According to the droplet nozzle of the first embodiment, the second adhesive portion has a retaining member adhesive portion and a vibrating plate adhesive pattern, wherein the retaining member adhesive portion is formed on the retaining member and the vibrating plate adhesive pattern is formed on the vibrating plate and is bonded to the retaining member adhesive portion by an adhesive.

[0121] <Third Method>

[0122] According to the droplet nozzle of the second embodiment, the second adhesive portion is formed as a line extending in a direction transverse to the arrangement direction of the plurality of nozzle holes.

[0123] <Method 4>

[0124] According to the droplet nozzle of the second embodiment, the second adhesive portion is formed as two lines extending in a direction transverse to the arrangement direction of the plurality of nozzle holes.

[0125] <Fifth Method>

[0126] According to the third or fourth method of the droplet nozzle, the line width of the second adhesive portion of the linear shape is 20 to 50 μm.

[0127] <Method 6>

[0128] According to the third or fourth method of the droplet nozzle, the second adhesive portion has one or two linearly shaped retaining member adhesive portions and two linearly shaped vibrating plate adhesive patterns, wherein the retaining member adhesive portion is formed on the retaining member and the vibrating plate adhesive patterns are formed on the vibrating plate and are bonded to the retaining member adhesive portion with an adhesive.

[0129] <The 7th Method>

[0130] The droplet nozzle according to any one of the first to sixth methods is characterized in that the second adhesive portion is formed in a shape that surrounds the receiving space.

[0131] <The 8th Method>

[0132] The droplet nozzle according to any one of the first to seventh embodiments is characterized in that, in the area inside the first adhesive portion other than the receiving space, a liquid supply channel is formed to supply liquid to the individual liquid chamber through the holding member and the vibrating plate, and a third adhesive portion is provided around the liquid supply channel for bonding the vibrating plate and the holding member.

[0133] <The Ninth Method>

[0134] According to the droplet nozzle of the eighth method, the third adhesive portion is formed such that its cross-sectional shape is the same as that of the liquid supply channel.

[0135] <Method 10>

[0136] According to the droplet nozzle of the eighth embodiment, the third adhesive portion has a channel adhesive portion formed on one side of the retaining member and a channel adhesive pattern formed on the vibrating plate.

[0137] <Method 11>

[0138] The droplet nozzle according to any one of the first to tenth embodiments is characterized in that a fourth adhesive portion is provided between the first adhesive portion and the second adhesive portion for bonding the vibrating plate and the retaining member.

[0139] <Method 12>

[0140] According to the droplet nozzle of the 11th embodiment, the fourth adhesive portion has an island-shaped adhesive portion formed on one side of the retaining member and an island-shaped adhesive pattern formed on the vibrating plate, the island-shaped adhesive pattern being bonded to the island-shaped adhesive portion by an adhesive.

[0141] <Method 13>

[0142] According to the droplet nozzle of the 12th method, the droplet nozzle is characterized in that a plurality of recesses are formed on the island-shaped adhesive pattern.

[0143] <Method 14>

[0144] The droplet nozzle according to any one of the methods 2 to 13 is characterized in that the Young's modulus of the adhesive is 2 GPa or higher.

[0145] <Method 15>

[0146] The droplet nozzle according to any one of the first to the fourth embodiments is characterized in that the thickness of the retaining component is 300 to 500 μm.

[0147] <Method 16>

[0148] A droplet nozzle unit is characterized by being equipped with a plurality of droplet nozzles of any one of the first to fifteenth methods.

[0149] <Method 17>

[0150] A droplet ejection device, characterized in that it is equipped with a droplet nozzle of any one of the first to the 15th methods or a droplet nozzle unit of the 16th method.

[0151] Explanation of reference numerals in the attached figures

[0152] 1A1, 1A2, 1B1, 1B2, 1C1, 1C2, 1D1, 1D2: Nozzle array

[0153] 2, 2b: Second adhesive part

[0154] 2a: Connecting part

[0155] 3: Non-functional wiring section

[0156] 4: Functional wiring section

[0157] 5: Third adhesive part

[0158] 6: Fourth adhesive part

[0159] 8, 9: Liquid supply channels

[0160] 10: Nozzle plate

[0161] 11: Nozzle orifice

[0162] 12: Retaining components

[0163] 12a: Coating

[0164] 13: Island-shaped adhesive pattern

[0165] 13a: concave part

[0166] 14: Containment Space

[0167] 20: Individual flow path boards

[0168] 21: Individual liquid chambers

[0169] 22: Individual flow paths on the supply side

[0170] 24: Individual flow paths of the recycling party

[0171] 26: Next door

[0172] 30: Vibrating plate

[0173] 31, 32: Opening

[0174] 40: Piezoelectric element (actuator)

[0175] 50: Intermediate flow path board

[0176] 51: Individual distribution channels in the supply chain

[0177] 52: Individual flow paths in the recycling process

[0178] 70: Common flow path components

[0179] 70a: Flange portion

[0180] 71: Common flow path on the supply side

[0181] 72: Common flow path for recycling

[0182] 81: Supply Port

[0183] 82: Recycling Port

[0184] 90: Flexible wiring components

[0185] 91: Driver IC (Driver Circuit)

[0186] 100, 100A, 100B: Head unit

[0187] 101: Sprayer Head

[0188] 102: Base component

[0189] 103: Covering components

[0190] 104: Heat dissipation components

[0191] 105: Manifold

[0192] 106: Printed Circuit Board

[0193] 107: Module Box

[0194] 121: Opening

[0195] 151, 152: Flow path

[0196] 500: Printing device

[0197] 501: Transport device

[0198] 503: Guided transport device

[0199] 505: Printing Department

[0200] 507: Drying Section

[0201] 509: Outbound Department

[0202] 510: Continuous roll paper

[0203] 511: Original winding roller

[0204] 550: Head unit

[0205] 552: Common base component

[0206] 559: Transporting guide components

[0207] 591: Take-up roller

[0208] AD: Adhesive

[0209] NA: Non-adhesive space

Claims

1. A droplet nozzle comprising: a nozzle plate having a plurality of nozzle holes; a vibrating plate disposed opposite to the inner surface of the nozzle plate; a plurality of individual liquid chambers formed between the nozzle plate and the vibrating plate and respectively connected to the plurality of nozzle holes; a plurality of actuators disposed on the vibrating plate opposite to the individual liquid chambers, corresponding to each individual liquid chamber; a retaining member disposed opposite to the actuators and the vibrating plate and bonded to the periphery of the vibrating plate by a first adhesive portion; and a plurality of receiving spaces formed between the retaining member and the vibrating plate and individually housing the actuators, wherein droplets are ejected from the nozzle holes under pressure generated in the individual liquid chambers by driving the actuators to vibrate the vibrating plate, characterized in that... In the area inside the first adhesive portion, excluding the receiving space, a non-adhesive space is formed, defined by the vibrating plate and the retaining member, which does not adhere to the vibrating plate and the retaining member, and the non-adhesive space includes the receiving space. Meanwhile, a second adhesive portion is provided between the plurality of receiving spaces for adhering the vibrating plate and the retaining member, and the second adhesive portion, the non-adhesive space, and the receiving space are surrounded by the first adhesive portion.

2. The droplet nozzle according to claim 1, characterized in that, The second adhesive portion has a retaining component side adhesive portion and a vibrating plate side adhesive pattern. The retaining component side adhesive portion is formed on the retaining component side, and the vibrating plate side adhesive pattern is formed on the vibrating plate side, and is bonded to the retaining component side adhesive portion by an adhesive.

3. The droplet nozzle according to claim 2, characterized in that, The second adhesive portion is formed as a line extending in a direction transverse to the arrangement direction of the plurality of nozzle holes.

4. The droplet nozzle according to claim 2, characterized in that, The second adhesive portion is formed as two lines extending in a direction that is transverse to the arrangement direction of the plurality of nozzle holes.

5. The droplet nozzle according to claim 3 or 4, characterized in that, The line width of the second adhesive portion of the linear shape is 20–50 μm.

6. The droplet nozzle according to claim 3 or 4, characterized in that, The second adhesive portion has one or two line-shaped retaining member adhesive portions and two line-shaped vibrating plate adhesive patterns. The retaining member adhesive portion is formed on one side of the retaining member, and the vibrating plate adhesive pattern is formed on the vibrating plate and is bonded to the retaining member adhesive portion with adhesive.

7. The droplet nozzle according to claim 1 or 2, characterized in that, The second adhesive portion is formed to surround the receiving space.

8. The droplet nozzle according to claim 1, characterized in that, In the area inside the first adhesive portion, excluding the receiving space, a liquid supply channel is formed that supplies liquid to the individual liquid chambers through the retaining member and the vibrating plate. A third adhesive portion is provided around the liquid supply channel for bonding the vibrating plate and the retaining member.

9. The droplet nozzle according to claim 8, characterized in that, The third adhesive portion is formed so that its cross-sectional shape is the same as that of the liquid supply channel.

10. The droplet nozzle according to claim 8, characterized in that, The third adhesive portion has a channel adhesive portion formed on one side of the retaining member and a channel adhesive pattern formed on the vibrating plate.

11. The droplet nozzle according to claim 1, characterized in that, A fourth adhesive portion is provided between the first adhesive portion and the second adhesive portion for bonding the vibrating plate and the retaining component.

12. The droplet nozzle according to claim 11, characterized in that, The fourth adhesive portion has an island-shaped adhesive portion formed on one side of the retaining member and an island-shaped adhesive pattern formed on the vibrating plate, the island-shaped adhesive pattern being bonded to the island-shaped adhesive portion by an adhesive.

13. The droplet nozzle according to claim 12, characterized in that, Multiple recesses are formed on the island-shaped adhesive pattern.

14. The droplet nozzle according to claim 2, characterized in that, The adhesive has a Young's modulus of 2 GPa or higher.

15. The droplet nozzle according to claim 1, characterized in that, The thickness of the retaining component is 300–500 μm.

16. A droplet nozzle unit, characterized in that, Equipped with a droplet nozzle as described in any one of claims 1 to 5, 8 to 15.

17. A droplet ejection device, characterized in that, Equipped with the droplet nozzle unit as described in claim 16.

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