Drive mechanism

Abstract

A driving mechanism for driving an optical element includes a movable portion, a fixed portion, and at least one conductive element. The movable portion carries the optical element, and the fixed portion is connected to the movable portion, wherein the movable portion is movable relative to the fixed portion. A portion of the conductive element is embedded in the fixed portion, and during a forming process of the fixed portion, a positioning element restricts the conductive element to a predetermined position within the fixed portion.

Description

Technical Field

[0001] This invention relates to a driving mechanism, and more particularly to a driving mechanism for driving the movement of an optical element. Background Technology

[0002] With the development of technology, many electronic devices today (such as smartphones or digital cameras) have the function of taking pictures or recording videos. The use of these electronic devices is becoming more and more common, and they are developing towards convenient and thinner designs to provide users with more choices.

[0003] In some electronic devices, corresponding coils and magnets are used to move the lens in order to make the lens focal length adjustable. However, the miniaturization requirements of electronic devices often lead to many problems such as difficulties in optical mechanism design, poor reliability, or insufficient lens driving force. Therefore, solving the aforementioned problems has become an important challenge. Summary of the Invention

[0004] The purpose of this invention is to provide a driving mechanism to solve at least one of the above-mentioned problems.

[0005] In view of the aforementioned known problems, one embodiment of the present invention provides a driving mechanism for driving an optical element. The driving mechanism includes a movable portion, a fixed portion, and at least one conductive element. The movable portion carries the optical element, and the fixed portion is connected to the movable portion, wherein the movable portion is movable relative to the fixed portion. A portion of the conductive element is embedded in the fixed portion, and during a forming process of the fixed portion, a positioning element restricts the conductive element to a predetermined position within the fixed portion.

[0006] In one embodiment, the aforementioned positioning element is a pin, and during the aforementioned forming process of the aforementioned fixing portion, the aforementioned pin abuts against the aforementioned conductive element to restrict the aforementioned conductive element to the aforementioned predetermined position in the aforementioned fixing portion.

[0007] In one embodiment, the aforementioned driving mechanism further includes a housing and an integrated circuit element connected to the aforementioned fixing portion, and the aforementioned fixing portion forms a recessed structure, wherein the aforementioned recessed structure faces the aforementioned housing, and a tail end of the aforementioned conductive element is located within the aforementioned recessed structure for connecting the aforementioned integrated circuit element.

[0008] In one embodiment, the aforementioned driving mechanism further includes an integrated circuit element, and the aforementioned fixing portion forms a recessed structure, wherein a tail end of the aforementioned conductive element is located within the aforementioned recessed structure and is electrically connected to the aforementioned integrated circuit element.

[0009] In one embodiment, the aforementioned conductive element is formed with a cut groove, and the cut groove is adjacent to the aforementioned tail end.

[0010] In one embodiment, the aforementioned fixing portion has a stop block located within the aforementioned recessed structure and adjacent to the aforementioned tail end of the aforementioned conductive element, wherein the aforementioned stop block partially shields the aforementioned conductive element.

[0011] In one embodiment, the aforementioned fixing portion has a protrusion that protrudes from the bottom side of the aforementioned recessed structure and supports the aforementioned integrated circuit element, thereby creating a distance between the aforementioned bottom side of the aforementioned recessed structure and the aforementioned integrated circuit element.

[0012] In one embodiment, the aforementioned fixing part has a first plastic block and a second plastic block, wherein the first plastic block first partially covers the aforementioned conductive element by embedding, then the aforementioned conductive element is bent, and then the aforementioned second plastic block partially covers the aforementioned conductive element and the aforementioned first plastic block by embedding.

[0013] In one embodiment, the melting point of the first plastic block is higher than that of the second plastic block.

[0014] In one embodiment, the aforementioned fixing part is quadrilateral, the aforementioned first plastic block is located on one side of the aforementioned fixing part and has a groove for accommodating a protrusion of the aforementioned movable part, wherein the aforementioned groove forms an inclined surface and the aforementioned inclined surface has an angle of inclination relative to the aforementioned side.

[0015] In one embodiment, the aforementioned inclined surface partially overlaps with the aforementioned conductive element in a horizontal direction, and the aforementioned horizontal direction is perpendicular to the aforementioned side.

[0016] In one embodiment, a groove is formed on one edge of the aforementioned first plastic block to guide the flow of adhesive.

[0017] In one embodiment, the aforementioned second plastic block is formed with a groove for accommodating a protrusion of the aforementioned movable part, wherein the width of a top of the aforementioned groove is greater than the width of a bottom of the aforementioned groove.

[0018] In one embodiment, the aforementioned driving mechanism further includes a plurality of conductive elements. The aforementioned first plastic block first partially covers the aforementioned conductive elements by embedding and molding, then the aforementioned conductive elements are bent, and then the aforementioned second plastic block partially covers the aforementioned conductive elements and the aforementioned first plastic block by embedding and molding. During the forming of the aforementioned first plastic block, a plurality of positioning elements respectively restrict the aforementioned conductive elements to the aforementioned predetermined positions in the aforementioned fixing portion.

[0019] In one embodiment, the aforementioned fixing part is quadrilateral, the aforementioned first plastic block is located on one side of the aforementioned fixing part, and the aforementioned conductive elements include a first conductive element and a second conductive element, wherein the aforementioned first conductive element crosses the aforementioned second conductive element, and the aforementioned first and second conductive elements partially overlap in a horizontal direction, wherein the aforementioned horizontal direction is perpendicular to the aforementioned side.

[0020] In one embodiment, the first conductive element has a Z-shaped bend, a U-shaped reversal, and an extension, wherein the extension extends across the second conductive element and connects the bend and the reversal.

[0021] In one embodiment, the first conductive element further has an L-shaped bend, and the bend is embedded in the second plastic block.

[0022] In one embodiment, the aforementioned fixing portion has a recessed hole corresponding to the aforementioned positioning element, and the aforementioned conductive element is exposed on one side of the aforementioned fixing portion through the aforementioned recessed hole.

[0023] In one embodiment, the aforementioned driving mechanism further includes a housing connected to the aforementioned fixing portion, and the aforementioned housing has a through hole, wherein the position of the aforementioned through hole corresponds to the aforementioned recessed hole.

[0024] In one embodiment, the aforementioned driving mechanism further includes a housing connected to the aforementioned fixing portion, and the aforementioned housing has a plurality of perforations located on the opposite side of the aforementioned housing and asymmetrical to a central position of the aforementioned driving mechanism. Attached Figure Description

[0025] Figure 1 An exploded view showing a drive mechanism according to an embodiment of the present invention.

[0026] Figure 2 express Figure 1 The exploded view of the fixing part and the shell before assembly.

[0027] Figure 3 express Figure 2 Exploded view of the shell.

[0028] Figure 4 and Figure 5 express Figure 2 The fixed part in the middle is shown in exploded views from different angles.

[0029] Figure 6 express Figure 4 A magnified view of the first plastic block in the image.

[0030] Figure 7 express Figure 5 A magnified view of the first plastic block in the image.

[0031] Figure 8 This is a schematic diagram showing an integrated circuit element disposed within a recessed structure and electrically connected to a conductive element.

[0032] Figure 9 A schematic diagram showing all the grooves formed on the surface of a conductive element.

[0033] Figure 10 This is a schematic diagram showing a stop block set inside a recessed structure.

[0034] Figure 11 This is a schematic diagram showing a block partially shielding a conductive element.

[0035] Figure 12 A cross-sectional view showing the conductive element exposed on the outside of the first plastic block through a recessed hole.

[0036] Figure 13 and Figure 14 A perspective view showing a conductive element connecting two integrated circuit elements according to another embodiment of the present invention.

[0037] Figure 15 This is a magnified 3D view showing a conductive element traversing two other conductive elements along the Y-axis.

[0038] Figure 16 This is a magnified view of a conductive element across two other conductive elements along the Y-axis.

[0039] Figure 17 express Figure 1 A magnified view of a portion of the active part.

[0040] Figure 18 This is a partial enlarged cross-sectional view showing the shell and fixing part of an embodiment of the present invention bonded together by a first adhesive and a second adhesive.

[0041] Figure 19 An exploded view showing the drive mechanism of another embodiment of the present invention.

[0042] Figure 20 express Figure 19 The drive mechanism is shown in a magnified sectional view after assembly.

[0043] Figure 21 A schematic diagram showing the fixing part of the drive mechanism according to another embodiment of the present invention.

[0044] Figure 22 express Figure 21 A schematic diagram showing the fixing part after the first plastic block has been removed.

[0045] Figure 23 A schematic diagram showing multiple conductive elements embedded in a fixed part.

[0046] Figure 24 A partially enlarged schematic diagram showing the mating portion formed at the tail end of a conductive element.

[0047] The attached figures are labeled as follows:

[0048] First adhesive A1

[0049] Second adhesive A2

[0050] Fixing part B

[0051] First plastic block B1

[0052] Second plastic block B2

[0053] Protrusion B21

[0054] retaining wall B22

[0055] Concave structure B10

[0056] Grooves B11, B12

[0057] Coil C

[0058] Fitting part F

[0059] Groove F1

[0060] Buffer G

[0061] Opening G1

[0062] Piercing G2

[0063] Bevel G3

[0064] Groove g1

[0065] bump g2

[0066] Outer cover H1

[0067] shell H2

[0068] Top cover h0

[0069] Sidewalls h1, h2, h3, h4

[0070] Perforated h21, h41

[0071] Integrated circuit components IC1, IC2

[0072] First engagement structure J1

[0073] Second engagement structure J2

[0074] Activities Department LH

[0075] Bump LH1

[0076] Magnet M

[0077] Base unit P

[0078] Parting line PL

[0079] Incline R

[0080] Chamfered surfaces S1, S2

[0081] Reeds SP1, SP2

[0082] Buffer ST1

[0083] Buffer ST2

[0084] Conductive components T, T1, T2, T3

[0085] Tail end T'

[0086] Groove T”

[0087] Stop T”'

[0088] Bending section TZ

[0089] Extension TC

[0090] Reversal section TU

[0091] Transition section TL

[0092] Concave hole U1

[0093] Perforated U2

[0094] Concave hole V1

[0095] concave hole V2 Detailed Implementation

[0096] The following describes the drive mechanism of an embodiment of the present invention. However, it will be readily apparent that the embodiments of the present invention provide many suitable inventive concepts and can be implemented in a wide range of specific contexts. The specific embodiments disclosed are merely illustrative of the use of the invention in a particular manner and are not intended to limit the scope of the invention.

[0097] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.

[0098] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used in the embodiments are for illustrative purposes and not for limiting the present invention.

[0099] Please refer to the following first. Figure 1 ,in Figure 1 An exploded view showing a drive mechanism according to an embodiment of the present invention. Figure 1 As shown, the drive mechanism of this embodiment mainly includes an outer cover H1, a housing H2, a movable part LH, and a fixed part B. The housing H2 and the fixed part B are fixed to each other, while the movable part LH is movably housed between the housing H2 and the fixed part B to support an optical element. In addition, the outer cover H1 covers the housing H2, the movable part LH, and the fixed part B to prevent the drive mechanism from being damaged by impacts from external objects.

[0100] Specifically, the aforementioned movable part LH is connected to the fixed part B via springs SP1 and SP2. Coils C are provided on both sides of the movable part LH, and magnets M are provided on both sides of the fixed part B. When current is applied to the aforementioned coil C, a magnetic force can be generated between the aforementioned magnet M and the coil C to drive the movable part LH and the optical element to move along its optical axis (Z-axis direction) or in a direction perpendicular to the aforementioned optical axis, so as to achieve functions such as auto-focusing or optical image stabilization (OIS).

[0101] For example, the aforementioned drive mechanism is, for instance, a voice coil motor (VCM), and the aforementioned movable part LH can be used to carry an optical lens, wherein the aforementioned optical lens can be connected to... Figure 1 The drive mechanisms shown together form a camera lens module, which can be installed inside a portable electronic device (such as a mobile phone or tablet computer) to perform functions such as taking pictures or videos.

[0102] Please refer to the following as well. Figures 1-3 ,in Figure 2 express Figure 1 Exploded view of the fixing part B and the shell H2 before assembly. Figure 3 express Figure 2 Exploded view of shell H2 in the middle. (See attached image.) Figure 2 and Figure 3As shown, the housing H2 in this embodiment is composed of a metal component and four plastic buffer components G. The aforementioned metal component can be formed by stamping to form a quadrilateral top cover h0 and four side walls h1, h2, h3, h4. The aforementioned side walls h1, h2, h3, h4 are not connected to each other, and an opening G1 is formed between each of the four side walls h1, h2, h3, h4.

[0103] It should be understood that the four buffer members G can be respectively wrapped around the four corners of the metal component by insert molding, and protrude from the aforementioned top cover h0 and the four side walls h1, h2, h3, h4. Figure 3 As shown, several perforations G2 are formed on the top cover h0 and the four side walls h1, h2, h3, and h4 of the metal component. During the forming process, the aforementioned buffer member G is embedded into the perforations G2 and the openings G1 to enhance the fixing effect between the metal component and the buffer member G. Furthermore, inclined surfaces G3 are formed on the edges of the side walls h1, h2, h3, and h4, adjacent to the openings G1, thereby further improving the bonding strength between the metal component and the buffer member G. On the other hand, from... Figure 3 It can be seen that a groove g1 is formed at the corner of each buffer component G, and a protrusion g2 is formed in the groove g1, corresponding to the injection nozzle of the mold.

[0104] Please refer to the following as well. Figure 2 , Figure 4 and Figure 5 ,in Figure 4 and Figure 5 express Figure 2 Exploded views of the fixed part B from different perspectives. From Figure 2 , Figure 4 and Figure 5 As shown in the figure, the aforementioned fixing part B has a first plastic block B1 and a second plastic block B2, and at least one conductive element T is embedded inside the first and second plastic blocks B1 and B2 for conducting electrical signals. In this embodiment, the first plastic block B1 is approximately perpendicular to the XY plane, and the second plastic block B2 is approximately parallel to the XY plane. Furthermore, a recessed structure B10 and two grooves B11 and B12 are formed on the inner side of the first plastic block B1. Figure 5 The aforementioned recessed structure B10 can be used to accommodate integrated circuit components, while the aforementioned grooves B11 and B12 can be used to accommodate the protrusion LH1 protruding from the side of the movable part LH. Figure 1 This restricts the horizontal displacement or rotation of the movable part LH. In one embodiment, the aforementioned recessed structure B10 may also be formed on the outside of the first plastic block B1 and facing the aforementioned housing H2.

[0105] For example, the aforementioned first plastic block B1 can first partially cover the conductive element T by embedding and molding, and then bend the conductive element T to make it appear as shown. Figure 4 and Figure 5 As shown in the diagram, the second plastic block B2 can then partially cover the aforementioned conductive element T and the first plastic block B1 again through an embedded molding process, thereby presenting the state as shown. Figure 2 The state is shown. The melting point of the first plastic block B1 is higher than that of the second plastic block B2.

[0106] like Figure 4 As shown, two grooves B21 are formed on the inner side of the second plastic block B2 to accommodate the protrusion LH1 on the movable part LH. The width of the top of the aforementioned groove B21 is greater than the width of the bottom of the groove B21; that is, the opening width of the top of the groove B21 is wider than its bottom, and the sidewall of the groove B21 forms an inclined angle with the Z-axis direction to facilitate the smooth demolding of the second plastic block B2 after molding.

[0107] On the other hand, from Figure 4 and Figure 5 As can be seen, a first engaging structure J1 (e.g., a groove) is formed on the two end faces of the first plastic block B1, and a second engaging structure J2 (e.g., a protrusion) is formed on the second plastic block B2, corresponding to the first engaging structure J1. By making the first engaging structure J1 and the second engaging structure J2 interlock with each other during molding, the bonding strength between the first and second plastic blocks B1 and B2 can be greatly improved.

[0108] Please refer to the following as well. Figure 2 , Figure 4 and Figure 6 ,in Figure 6 express Figure 4 A magnified view of the first plastic block B1 in the image. (See image below.) Figure 2 , Figure 4 and Figure 6 As shown, the aforementioned first plastic block B1 has a recessed hole V1 and multiple recessed holes V2, wherein the aforementioned recessed hole V1 corresponds to the injection nozzle of the mold, and the aforementioned recessed holes V2 correspond to multiple positioning pins or other positioning elements used for positioning within the mold. It should be understood that during the molding process of the first plastic block B1, the aforementioned ejector pins abut against the conductive element T to limit the conductive element T to a predetermined position within the first plastic block B1.

[0109] It should be noted that, from Figure 2It can be seen that perforations h21 and h41 are formed on the side walls h2 and h4 of the housing H2, respectively. These perforations h21 and h41 are located on opposite sides of the housing H2 and asymmetrically relative to the center of the drive mechanism. The position of perforation h21 corresponds to the aforementioned recesses V1 and V2, facilitating heat dissipation or the application of adhesive. Furthermore, from... Figure 6 As can be seen, a groove B13 (sloping surface) is formed on the upper edge of the first plastic block B1, which can be used to guide the flow of glue so that the first plastic block B1 and the shell H2 can be tightly bonded to each other.

[0110] Please refer to the following as well. Figure 5 and Figure 7 Figure, in which Figure 7 express Figure 5 A magnified view of the first plastic block B1 in the image. (See image below.) Figure 5 and Figure 7 As shown in the figure, a recessed structure B10 is formed on the inner surface of the aforementioned first plastic block B1, wherein the tail ends T' of a plurality of conductive elements T are exposed on the bottom surface of the recessed structure B10.

[0111] Please refer to the following as well. Figure 8 and Figure 9 ,in Figure 8 This diagram illustrates integrated circuit elements IC1 and IC2 disposed within the recessed structure B10 and electrically connected to the conductive element T. Figure 9 This is a schematic diagram showing that all grooves T are formed on the surface of a conductive element T. (Example) Figure 8 As shown, the aforementioned recessed structure B10 can be used to accommodate two integrated circuit elements IC1 and IC2, wherein the tail ends T' of multiple conductive elements T are electrically connected to the aforementioned integrated circuit elements IC1 and IC2 by soldering; furthermore, from Figure 7 and Figure 8 As can be seen, multiple recessed holes V2 are formed on the bottom surface of the recessed structure B10. During the forming process of the first plastic block B1, multiple ejector pins will pass through the aforementioned recessed holes V2 and abut against the conductive element T to restrict the conductive element T to a predetermined position within the first plastic block B1.

[0112] from Figure 8 and Figure 9 As can be seen, a groove T” is formed on the surface of a conductive element T, and the groove T” is adjacent to the tail end T’ of the conductive element T, so as to prevent solder from flowing along the surface of the conductive element T and causing the integrated circuit element IC1 to tilt or have poor contact during soldering. After the soldering is completed, glue can be filled into the recessed structure B10 to fix the aforementioned integrated circuit elements IC1 and IC2.

[0113] In addition, from Figures 4-6 and Figure 8As can be seen, the first plastic block B1 is located on one side of the quadrilateral fixing part B, and the aforementioned groove B12 forms a slope R, wherein the slope R has an inclination angle relative to the side (parallel to the Y-axis direction); it should be noted that the aforementioned slope R and a conductive element T inside the first plastic block B1 partially overlap in the horizontal direction (X-axis direction), so that when the protrusion LH1 protruding from the side of the movable part LH ( Figure 1 When it collides with the aforementioned inclined plane R, it can generate a stress-dispersing effect to improve the reliability of the drive mechanism, and at the same time, it can also help to achieve the miniaturization of the mechanism.

[0114] Please refer to the following as well. Figure 10 and Figure 11 ,in Figure 10 This diagram illustrates a stop block T”' positioned within a recessed structure B10. Figure 11 This is a schematic diagram showing that a stop T" partially blocks a conductive element T. (See diagram below.) Figure 10 and Figure 11 As shown, in another embodiment of the present invention, a plastic block T”' can also be disposed within the recessed structure B10, and partially shield a conductive element T. It should be understood that the aforementioned block T”' is adjacent to the tail end T' of the conductive element T, thereby preventing solder from flowing along the conductive element T, so as to avoid tilting or poor contact of the integrated circuit element IC1 during soldering.

[0115] Alternatively, a protrusion (not shown) can be formed on the bottom side of the aforementioned recessed structure B10. Since the protrusion protrudes from the bottom surface of the recessed structure B10, it can be used to support the integrated circuit element IC1, and a distance is placed between the bottom side of the recessed structure B10 and the integrated circuit element IC1, thereby avoiding the situation where the integrated circuit element IC1 tilts or has poor contact during the soldering process.

[0116] Please see again Figure 12 ,in Figure 12 This is a cross-sectional view showing the conductive element T exposed on the outside of the first plastic block B1 through the recessed hole V2. (See image.) Figure 12 As shown, recessed holes V2 are formed on both the inner and outer sides of the first plastic block B1. The aforementioned conductive element T is electrically connected to the integrated circuit element IC1 and can be exposed on the outer side of the first plastic block B1 through part of the recessed holes V2, thereby helping to dissipate heat.

[0117] Please refer to the following: Figures 13-16 ,in Figure 13 and Figure 14 A perspective view showing conductive elements T1, T2, and T3 connected to two integrated circuit elements IC1 and IC2 according to another embodiment of the present invention. Figure 15This is a magnified 3D view showing a conductive element T1 traversing two conductive elements T2 along the Y-axis. Figure 16 This is a magnified view from another perspective showing a conductive element T1 moving along the Y-axis across two conductive elements T2.

[0118] like Figures 13-16 As shown, the driving mechanism of this embodiment includes multiple conductive elements T1, T2, and T3 to connect two integrated circuit elements IC1 and IC2 disposed on the first plastic block B1. The first plastic block B1 is located on one side of the fixing part B, and this side is approximately parallel to the Y-axis direction. It should be noted that in this embodiment, the conductive element T1 extends across at least one second conductive element T2 along the Y-axis direction, such that the first and second conductive elements T1 and T2 partially overlap in a horizontal direction (X-axis direction).

[0119] Specifically, in this embodiment, the first conductive element T1 has a Z-shaped bend TZ, an extension TC, a U-shaped reversal TU, and an L-shaped turning portion TL. The extension TC crosses the second conductive element T2 and connects the bend TZ and the reversal TU. The extension TC is embedded inside the first plastic block B1, while the turning portion TL is embedded inside the second plastic block B2.

[0120] Please see again Figure 17 ,in Figure 17 express Figure 1 A magnified schematic diagram of a portion of the active part LH. (See attached diagram.) Figure 17 As shown, at least one protrusion LH1 can be formed on each of the two opposite sides of the movable part LH. The protrusion LH1 can be movably accommodated in the grooves B11, B12 or B21 inside the fixed part B after assembly, thereby restricting the displacement or rotation of the movable part LH in the horizontal direction.

[0121] Please continue reading. Figure 17 Two chamfered surfaces S1 and S2 are formed on the top of the aforementioned protrusion LH1, which are connected to each other and arranged along one optical axis (Z-axis direction) of the optical element. The aforementioned chamfered surfaces S1 and S2 taper towards the Z-axis direction to form a stepped structure. It should be noted that a parting line PL is formed between the aforementioned two chamfered surfaces S1 and S2, and when the movable part LH is undergoing plastic injection molding, the two molds are connected at the parting line PL.

[0122] Please refer to the following: Figure 18 ,in Figure 18 This is a partial enlarged cross-sectional view showing the shell H2 and the fixing part B after being bonded together by a first adhesive A1 and a second adhesive A2, according to an embodiment of the present invention. Figure 18As shown, in this embodiment, the fixing part B has a recessed hole U1, and a through hole U2 corresponding to the recessed hole U1 is formed on the housing H2. During actual assembly, a first adhesive A1 can be applied between the outer surface of the fixing part B and the inner surface of the housing H2, and then a second adhesive A2 can be applied to the recessed hole U1 of the fixing part B through the through hole U2 on the housing H2. The viscosity of the second adhesive A2 is greater than that of the first adhesive A1.

[0123] In this way, not only can the outer surface of the fixing part B and the inner surface of the housing H2 be bonded together by the first adhesive A1, but also the bonding strength between the fixing part B and the housing H2 can be further improved because the concave hole U1 on the side of the fixing part B and the perforation U2 on the housing H2 are filled with a second adhesive A2 with a higher viscosity than the first adhesive A1.

[0124] For example, the aforementioned concave hole U1 could be Figure 2 The recessed hole V1 in the middle corresponds to the injection nozzle of the fixing part B during the molding process; or, the aforementioned recessed hole U1 can also be Figure 2 The recessed hole V2 in the middle penetrates the fixing part B and is adjacent to the conductive element T, so that the second adhesive A2 can contact the conductive element through the recessed hole V2.

[0125] Please refer to the following as well. Figure 19 and Figure 20 ,in Figure 19 An exploded view showing a drive mechanism according to another embodiment of the present invention. Figure 20 express Figure 19 The drive mechanism is shown in a partially enlarged sectional view after assembly. (See attached image.) Figure 19 and Figure 20 As shown, in this embodiment, the drive mechanism has a flexible buffer ST1 attached to the housing H2, wherein the buffer ST1 is, for example, a plastic pad, and extends from the top cover h0 of the housing H2 to at least one of the four side walls h1, h2, h3, h4.

[0126] In addition, from Figure 19 and Figure 20 It can be seen that the fixing part B is connected to a base unit P, and the aforementioned outer cover H1 is fixed on the base unit P. Two buffer pads ST2 are provided on the inner surface of the outer cover H1, facing the top cover h0 and the side wall h2 respectively.

[0127] In this way, when the drive mechanism moves the housing H2 toward the outer cover H1 due to an external impact, a buffering effect can be generated by the aforementioned buffer ST1 and buffer pad ST2 to avoid direct collision between the housing H2 and the outer cover H1, which would cause structural damage.

[0128] In one embodiment, the aforementioned buffer ST1 can cover a portion of the housing H2 by bonding or embedding. Since the buffer ST1 protrudes from the top cover and sidewalls of the housing H2, it can prevent the housing H2 and the outer cover H1 from colliding directly and provide a good buffering effect, thereby greatly improving the reliability of the drive mechanism.

[0129] Please refer to the following as well. Figures 21-24 ,in Figure 21 This diagram illustrates the fixing part B of the drive mechanism according to another embodiment of the present invention. Figure 22 express Figure 21 A schematic diagram showing the fixing part B after the first plastic block B1 is removed. Figure 23 This is a schematic diagram showing multiple conductive elements T embedded in the fixed part B. Figure 24 This is a partially enlarged schematic diagram showing the fitting portion F formed at the tail end of a conductive element T.

[0130] like Figures 21-24 As shown, in this embodiment, a plurality of conductive metal elements T are embedded in the fixing part B, wherein one end of each conductive element T is fixed to the first plastic block B1 and exposed as shown in the figure. Figure 7 The surface of the recessed structure B10 shown is used for electrically connecting integrated circuit elements IC1 and IC2 (e.g., IC1 and IC2) located in the recessed structure B10. Figure 7 and Figure 8 (As shown).

[0131] On the other hand, such as Figure 21 and Figure 22 As shown, the four corners of the aforementioned quadrilateral fixing part B each have a protrusion B21 extending toward the optical axis (Z-axis direction) of the optical element, and a barrier B22 substantially parallel to the YZ plane is formed on one side of the fixing part B; furthermore, a fitting part F extending toward the optical axis (Z-axis direction) of the optical element is formed at the other end of the aforementioned conductive element T (e.g., Figure 23 and Figure 24 As shown), the plastic fixing part B can be wrapped around the outside of the conductive element T by embedding and molding, and the aforementioned fitting part F can be embedded in the protrusion B21 and the retaining wall B22 respectively, thereby improving the overall mechanical strength of the fixing part B.

[0132] It should be noted that a plurality of grooves F1 are formed on at least one edge of the aforementioned fitting portion F. Figure 24 Furthermore, each of the multiple fitting portions F has a flat structure, wherein the aforementioned flat structures are not parallel to each other, thereby significantly increasing the contact area and bonding strength between the conductive element T and the protrusion B21 / wall B22.

[0133] For example, multiple grooves F1 can be formed on both sides of the aforementioned fitting portion F (e.g. Figure 24 (As shown), or the fitting part F can be made to have a fish-bone shaped structure to strengthen the fixing effect between the conductive element T and the fixing part B, thereby greatly improving the overall mechanical strength and reliability of the drive mechanism.

[0134] While the embodiments and advantages of the present invention have been disclosed above, it should be understood that those skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. Furthermore, the scope of protection of the present invention is not limited to the processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps described in the specific embodiments of the specification. Any processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps currently or in the future that can be developed from the disclosure of this invention can be used according to the present invention, as long as they can perform substantially the same function or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of the present invention includes the aforementioned processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present invention also includes combinations of the various claims and embodiments.

[0135] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A driving mechanism for driving an optical element, the driving mechanism comprising: A movable part is used to support the optical element; A fixed part is connected to the movable part, wherein the fixed part is quadrilateral and has a first plastic block and a second plastic block, and the movable part is movable relative to the fixed part; and A first conductive element and a second conductive element, wherein the first plastic block first partially covers the first and second conductive elements by embedding molding, then the first and second conductive elements are bent, and then the second plastic block partially covers the first and second conductive elements and the first plastic block by embedding molding. The first plastic block has a higher melting point than the second plastic block. The first plastic block is located on one side of the fixing part. The first conductive element crosses the second conductive element, and the first and second conductive elements partially overlap in a horizontal direction, which is perpendicular to the side. During the forming process of the fixing part, multiple positioning elements respectively restrict the first and second conductive elements in the fixing part.

2. The driving mechanism as claimed in claim 1, wherein the plurality of positioning elements are a plurality of ejector pins, and during the forming process of the fixing portion, the plurality of ejector pins abut against the first and second conductive elements to restrict the first and second conductive elements in the fixing portion.

3. The driving mechanism as claimed in claim 1, wherein the driving mechanism further includes a housing and an integrated circuit element connected to the fixing portion, and the fixing portion is formed with a recessed structure, wherein the recessed structure faces the housing, and a tail end of the first conductive element is located in the recessed structure for connecting the integrated circuit element.

4. The driving mechanism as claimed in claim 1, wherein the driving mechanism further includes an integrated circuit element, and the fixing portion is formed with a recessed structure, wherein a tail end of the first conductive element is located within the recessed structure and is electrically connected to the integrated circuit element.

5. The drive mechanism of claim 4, wherein the first conductive element has a cut groove, and the cut groove is adjacent to the tail end.

6. The drive mechanism of claim 4, wherein the fixing portion has a stop block located within the recessed structure and adjacent to the tail end of the first conductive element, wherein the stop block partially shields the first conductive element.

7. The drive mechanism of claim 6, wherein the fixing portion has a protrusion that protrudes from a bottom side of the recessed structure and supports the integrated circuit element, thereby creating a distance between the bottom side of the recessed structure and the integrated circuit element.

8. The drive mechanism as claimed in claim 1, wherein the first plastic block has a groove for receiving a protrusion of the movable part, wherein the groove is formed with an inclined surface and the inclined surface has an angle of inclination relative to the side.

9. The drive mechanism of claim 8, wherein the inclined surface partially overlaps with the conductive element in a horizontal direction, and the horizontal direction is perpendicular to the side.

10. The drive mechanism of claim 1, wherein a groove is formed on one edge of the first plastic block for guiding the flow of adhesive.

11. The drive mechanism of claim 1, wherein the second plastic block is formed with a groove for receiving a protrusion of the movable part, wherein the width of a top of the groove is greater than the width of a bottom of the groove.

12. The drive mechanism of claim 1, wherein the first conductive element has a Z-shaped bend, a U-shaped reversal, and an extension, wherein the extension extends across the second conductive element and connects the bend and the reversal.

13. The driving mechanism as claimed in claim 12, wherein the first conductive element further has an L-shaped bend, and the bend is embedded in the second plastic block.

14. The drive mechanism as claimed in claim 1, wherein the fixing portion has a recessed hole, and the first conductive element is exposed on one side of the fixing portion through the recessed hole.

15. The drive mechanism of claim 14, wherein the drive mechanism further includes a housing connected to the fixing portion, and the housing is formed with a through hole, wherein the position of the through hole corresponds to the recess.

16. The drive mechanism of claim 1, wherein the drive mechanism further comprises a housing connected to the fixing portion, and the housing is formed with a plurality of through holes located on opposite sides of the housing and asymmetrically positioned relative to a central location of the drive mechanism.

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