A kind of planoconvex quartz wafer spherical lapping roller and lapping method

Abstract

A kind of plano-convex quartz wafer spherical lapping roller and lapping method, the plano-convex quartz wafer spherical lapping roller is equipped with barrel assembly, screen assembly, fixed shaft and bearing;The barrel assembly includes barrel and mounting seat, the cross-sectional diameter size of the barrel matches the spherical curvature radius of plano-convex quartz wafer, mounting seat is set at one end of barrel, the mounting seat is sleeve structure with the axial penetration of barrel;The bearing is centripetal ball bearing, is sleeved in mounting seat, the outer ring of bearing is assembled with the inboard wall of mounting seat in interference fit mode, fixed shaft is pressed in the inner ring of bearing;The screen assembly is fixedly installed on fixed shaft, with the axial section angle α of barrel assembly = 30 ~ 45º, the distance L between screen assembly periphery and barrel inboard wall = 15 ~ 20 mm.The present application realizes the lapping processing of batch quartz plano-convex wafer spherical surface, reaches the purpose of ensuring wafer lapping quality, improving production efficiency, reducing processing cost.

Description

Technical Field

[0001] This invention relates to the field of quartz wafer processing equipment technology, specifically to a plano-convex quartz wafer spherical grinding roller and grinding method. Background Technology

[0002] With the continuous advancement of technology, the applications of quartz resonators and quartz oscillators are becoming increasingly widespread, leading to higher requirements for their stability and smaller dimensions. As a core component of high-stability quartz crystals, plano-convex wafers suffer from a high breakage rate during processing, particularly in the grinding of the spherical (convex) side. Due to the extreme fragility of the product edges, a single-wafer processing method is currently commonly used. This involves using a concave spherical processing disk, applying external force to fix the wafer to the hemispherical concave surface of the disk, adding abrasive, and using the cutting action of the abrasive to remove excess material from one side of the wafer, forming the spherical surface of the plano-convex wafer. However, this single-wafer processing method has very low production efficiency, significantly increasing processing costs and making it difficult to achieve industrial-scale production of plano-convex wafers. Summary of the Invention

[0003] This invention provides a grinding roller and grinding method for plano-convex quartz wafer spherical surfaces. Through optimized design of the roller and its structure in conjunction with a fixed screen, it enables the grinding of large batches of plano-convex quartz wafer spherical surfaces, thereby ensuring wafer grinding quality, improving production efficiency, and reducing processing costs.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A spherical grinding roller for plano-convex quartz wafers includes a cylinder assembly, a screen assembly, a fixed shaft, and a bearing. The cylinder assembly comprises a cylinder and a mounting base. The cylinder is cylindrical, and its cross-sectional diameter matches the radius of curvature of the plano-convex quartz wafer. A mounting base connected to a rotary drive mechanism is provided at one end of the cylinder. The mounting base is a sleeve structure that axially penetrates the cylinder. The bearing is a radial ball bearing, fitted inside the mounting base. The outer ring of the bearing is assembled with the inner wall of the mounting base by an interference fit. A fixed shaft is press-fitted into the inner ring of the bearing. The screen assembly is fixedly mounted on the fixed shaft, with an angle α of 30–45º between it and the axial section of the cylinder assembly. The distance L between the periphery of the screen assembly and the inner wall of the cylinder is 15–20 mm.

[0006] The aforementioned plano-convex quartz wafer spherical grinding roller includes a screen assembly comprising a screen and a screen fixing frame; the screen aperture size is smaller than the diameter of the quartz wafer to be ground, and the screen is mounted on the screen fixing frame; the screen fixing frame is fitted onto a fixed shaft, and is connected to the fixed shaft as a whole by a counterweight and locking screw fitted at one end of the fixed shaft.

[0007] In the aforementioned plano-convex quartz wafer spherical grinding roller, one end of the counterweight is a sleeve structure, which is fitted onto the non-bearing end of the fixed shaft and assembled with the fixed shaft through a threaded connection structure. The other end of the counterweight is fixedly assembled with the screen fixing frame by locking screws.

[0008] The aforementioned plano-convex quartz wafer spherical grinding roller has a cylinder body made of ductile iron. The inner wall of the cylinder body is uniformly provided with concave dots with a diameter and depth of 1 mm, and the distance between two adjacent sets of concave dots is 5 mm.

[0009] The aforementioned plano-convex quartz wafer spherical grinding roller has a bearing retainer ring installed on the inner end of the mounting base of the cylinder to prevent the grinding abrasive from damaging the bearing.

[0010] The aforementioned plano-convex quartz wafer spherical grinding roller has an external thread on the outer wall of the mounting base. The cylinder is connected to the rotary drive mechanism through a threaded connection structure, and the cylinder rotates under the drive of the rotary drive mechanism.

[0011] A method for spherical grinding of plano-convex quartz wafers, which uses the aforementioned plano-convex quartz wafer spherical grinding roller to complete the spherical grinding operation of batch plano-convex quartz wafers, and the specific operation steps are as follows:

[0012] a. Glue the two quartz crystal pieces together, one facing the other;

[0013] b. Place hundreds of pasted quartz wafers and an appropriate amount of abrasive powder into the cylinder;

[0014] c. Adjust the assembly angle of the screen assembly to meet the requirements of the grinding process;

[0015] d. Start the rotary drive mechanism of the grinding equipment. As the cylinder rotates, the quartz wafer workpiece is brought into contact with the inner wall of the cylinder, and the quartz wafer is ground with the help of the grinding abrasive.

[0016] e. After grinding for the set time, the grinding equipment stops running, and the quartz wafers and grinding sand are taken out from the cylinder and the quartz wafer workpieces are sorted out.

[0017] f. Remove the adhesive and clean the quartz wafers to separate the two quartz wafers that are stuck together, resulting in plano-convex quartz wafer products.

[0018] In the above-described plano-convex quartz wafer spherical grinding method, in step a, two quartz wafers are bonded together with anaerobic adhesive.

[0019] In the above-described plano-convex quartz wafer spherical grinding method, the grinding abrasive grade in step b is GC#4000.

[0020] In the above-mentioned plano-convex quartz wafer spherical grinding method, in step c, the rotary drive mechanism drives the cylinder to rotate clockwise. Under the action of centrifugal force, the quartz wafer adheres to the inner wall of the cylinder and is ground with the help of grinding abrasive. When the quartz wafer rotates with the cylinder to a position of about 11:30, most of the quartz wafer flips and falls back, while some quartz wafers adhere to the inner wall of the cylinder until they fall onto the screen at a position of about 11:30 and slide down along the inclined direction of the screen, returning to the bottom of the cylinder through the gap between the screen and the inner wall of the cylinder. The above process is repeated until the set grinding time is reached, and then the operation process proceeds to step d.

[0021] This invention discloses a spherical grinding roller for plano-convex quartz wafers. The inner wall of the roller has the same radius of curvature as the spherical surface of the quartz wafer to be ground. During the grinding operation, hundreds of quartz wafers can be ground simultaneously with the aid of grinding abrasive. After grinding, the quartz wafers are cleaned to remove adhesive, separating two wafers that are stuck together, thus enabling batch processing of plano-convex quartz wafers. The invention also includes a fixed shaft and a screen assembly inside the roller. The screen assembly can catch quartz wafers falling from a height, absorbing impact and reducing the breakage rate. Tests have shown that using this invention for grinding plano-convex quartz wafers increases production efficiency by more than 5 times, and product yield increases from approximately 70% to approximately 90%.

[0022] The present invention also discloses a method for spherical grinding of plano-convex quartz wafers, which provides a process guarantee for realizing the mass production of plano-convex quartz wafers by using a spherical grinding roller.

[0023] In summary, this invention, through optimized design of the roller and its cooperation structure with the fixed screen, as well as the grinding process, enables the simultaneous grinding of a large batch of quartz plano-convex wafer spherical surfaces, thereby achieving the goals of ensuring wafer grinding quality, improving production efficiency, and reducing processing costs. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of the plano-convex quartz wafer spherical grinding roller described in this invention;

[0025] Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure of the middle AA section;

[0026] Figure 3 This is a schematic diagram of the cross-sectional structure of the cylindrical assembly;

[0027] Figure 4 This is a schematic diagram of the fixed shaft and screen assembly structure;

[0028] Figure 5 yes Figure 4K-direction view;

[0029] Figure 6 This is a schematic diagram of the working state of the spherical grinding roller for plano-convex quartz wafers.

[0030] Explanation of each label in the diagram:

[0031] 1 is the cylinder assembly, 1-1 is the cylinder, 1-2 is the recess, 1-3 is the mounting base, 1-4 is the external thread, and 1-5 is the bearing retaining ring;

[0032] 2 is the screen assembly, 2-1 is the screen, 2-2 is the screen fixing frame, 2-3 is the counterweight, and 2-4 is the locking screw;

[0033] 3 is a fixed axis;

[0034] 4 represents bearings;

[0035] 5 is a quartz crystal wafer;

[0036] 6 represents abrasive sand. Detailed Implementation

[0037] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0038] See Figure 1. Figure 2 , Figure 3This invention provides a spherical grinding roller for plano-convex quartz wafers, comprising a cylinder assembly 1, a screen assembly 2, a fixed shaft 3, and a bearing 4. The cylinder assembly 1 includes a cylinder 1-1 and a mounting base 1-3. The cylinder 1-1 is a horizontally arranged cylindrical body made of ductile iron. The cross-sectional diameter of the cylinder 1-1 matches the radius of curvature of the plano-convex quartz wafer. Indentations 1-2, each with a diameter and depth of 1 mm, are evenly distributed on the inner wall of the cylinder, with a spacing of 5 mm between adjacent sets of indentations 1-2. A mounting base 1-3, connected to a rotary drive mechanism, is located at one end of the cylinder 1-1. The mounting base 1-3 is a sleeve structure axially penetrating the cylinder 1-1. An external thread 1-4 is provided on the outer wall of the mounting base 1-3. The cylinder 1-4 is connected to the cylinder 1-1 via the thread. The threaded connection structure is connected to the rotary drive mechanism, and the cylinder 1-4 rotates under the drive of the rotary drive mechanism; the bearing 4 is a radial ball bearing, which is fitted inside the mounting base 1-3. The outer ring of the bearing 4 is assembled with the inner side wall of the mounting base 1-3 by an interference fit. The fixed shaft 3 is press-fitted into the inner ring of the bearing 4; the fixed shaft 3 passes through the cylinder 1-4 axially; the screen assembly 2 is fixedly installed on the fixed shaft 3, and the angle α between the screen assembly 2 and the axial section of the cylinder assembly 1 is 30-45º. The distance L between the periphery of the screen assembly 2 and the inner side wall of the cylinder 1-1 is 15-20mm. For products with a flat and convex sheet diameter greater than 5.5mm, the preferred value of the angle α between the screen assembly 2 and the axial section of the cylinder assembly 1 is 30º, and the preferred value of the distance L between the periphery of the screen assembly 2 and the inner side wall of the cylinder 1-1 is 20mm.

[0039] See Figure 1 , Figure 4 , Figure 5 The plano-convex quartz wafer spherical grinding roller of the present invention comprises a screen assembly 2 including a screen 2-1, a screen fixing frame 2-2, a counterweight 2-3, and a locking screw 2-4. The screen aperture size of the screen 2-1 is smaller than the diameter of the quartz wafer 5 to be ground, and the screen 2-1 is mounted on the screen fixing frame 2-2. The screen fixing frame 2-2 is fitted onto a fixed shaft 3, and is connected to the fixed shaft by the counterweight 2-3 fitted at one end of the fixed shaft 3 and the locking screw 2-4. One end of the counterweight 2-3 is a sleeve structure, fitted onto the non-bearing end of the fixed shaft 3, and assembled with the fixed shaft by a threaded connection structure. The other end of the counterweight 2-3 is fixedly assembled with the screen fixing frame 2-2 by the locking screw 2-4.

[0040] See Figure 6This invention also provides a method for spherical grinding of plano-convex quartz wafers. When grinding quartz wafers 5, two quartz wafers 5 are first bonded together with anaerobic adhesive. Then, hundreds of bonded quartz wafers 5 and an appropriate amount of abrasive 6 (abrasive grade generally GC#4000) are placed inside a horizontally placed cylinder 1-1. The assembly angle of the screen assembly is adjusted by changing the screw-in angle of the threaded connection mechanism between the counterweight 2-3 and the fixed shaft 3 to meet the grinding process requirements. The screen assembly 2, mounting block 2-3, and fixed shaft are then locked in place. After the grinding equipment is started, the cylinder 1-1 rotates clockwise under the drive of the rotary drive mechanism. As the cylinder 1-1 rotates, the quartz wafer 5 adheres to the inner wall of the cylinder 1-1 under centrifugal force, and is ground with the aid of the abrasive 6. During the grinding process described above, when the quartz wafer 5 rotates with the cylinder 1-1 to approximately the 9 o'clock position (the position determined by referring to the clock face on the cross-section of the cylinder), it flips and falls back. However, due to the humidity and static electricity of the working environment, some quartz wafers 5 will adhere to the cylinder wall until they fall off at approximately the 11:30 position. At this point, the falling quartz wafers 5 can be caught by the screen 2-1 and allowed to slide down along the inclined direction of the screen 2-1, returning to the bottom of the cylinder 1-1 through the gap between the screen 2-1 and the inner wall of the cylinder 1-1, completing one work cycle. Then, the above process is repeated to enter the next work cycle. After the grinding operation is completed, the quartz wafers can be cleaned to remove the adhesive, separating the two quartz wafers that are stuck together, resulting in plano-convex quartz wafer products.

Claims

1. A spherical grinding roller for plano-convex quartz wafers, characterized in that: It is provided with a cylindrical assembly (1), a screen assembly (2), a fixed shaft (3), and a bearing (4); the cylindrical assembly (1) includes a cylindrical body (1-1) and a mounting base (1-3). The cylindrical body (1-1) is a cylindrical body, and the cross-sectional diameter of the cylindrical body (1-1) matches the spherical curvature radius of the plano-convex quartz wafer. A mounting base (1-3) connected to a rotary drive mechanism is provided at one end of the cylindrical body (1-1). The mounting base (1-3) is axially connected to the cylindrical body (1-1). The sleeve structure is open; the bearing (4) is a radial ball bearing, which is installed in the mounting seat (1-3). The outer ring of the bearing (4) is assembled with the inner wall of the mounting seat (1-3) by interference fit. The fixed shaft (3) is press-fitted in the inner ring of the bearing (4); the screen assembly (2) is fixedly installed on the fixed shaft (3). The angle α between the screen assembly (2) and the axial section of the cylinder assembly (1) is 30-45º. The distance L between the periphery of the screen assembly (2) and the inner wall of the cylinder (1-1) is 15-20mm. The screen assembly (2) includes a screen (2-1) and a screen fixing frame (2-2); the screen hole size of the screen (2-1) is smaller than the diameter of the quartz wafer (5) to be ground, and the screen (2-1) is mounted on the screen fixing frame (2-2); the screen fixing frame (2-2) is fitted on the fixing shaft (3), and is connected to the fixing shaft as a whole by a counterweight (2-3) fitted at one end of the fixing shaft (3) and a locking screw (2-4).

2. The plano-convex quartz wafer spherical grinding roller according to claim 1, characterized in that: One end of the counterweight (2-3) is a sleeve structure, which is fitted onto the non-bearing end of the fixed shaft (3) and assembled with the fixed shaft through a threaded connection structure. The other end of the counterweight (2-3) is fixedly assembled with the screen fixing frame (2-2) through locking screws (2-4).

3. The plano-convex quartz wafer spherical grinding roller according to claim 1, characterized in that: The cylinder (1-1) is made of ductile iron. On the inner wall of the cylinder (1-1), there are evenly distributed concave points (1-2) with a diameter and depth of 1 mm, and the distance between two adjacent sets of concave points (1-2) is 5 mm.

4. The plano-convex quartz wafer spherical grinding roller according to claim 3, characterized in that: A bearing retainer (1-5) is provided on the inner end of the mounting seat of the cylinder (1-1) to prevent the abrasive material (6) from damaging the bearing (4).

5. The plano-convex quartz wafer spherical grinding roller according to claim 4, characterized in that: An external thread (1-4) is provided on the outer wall of the mounting base (1-3), and the cylinder (1-1) is connected to the rotary drive mechanism through a threaded connection structure. The cylinder (1-1) rotates under the drive of the rotary drive mechanism.

6. A method for spherical grinding of plano-convex quartz wafers, characterized in that: It uses the spherical grinding roller for plano-convex quartz wafers as described in any one of claims 1 to 5 to complete the spherical grinding operation of batch plano-convex quartz wafers. The specific operation steps are as follows: a. Attach the two quartz crystal wafers (5) together, one to the other; b. Place hundreds of pasted quartz wafers and an appropriate amount of abrasive (6) into the cylinder; c. Adjust the assembly angle of the screen assembly (2) to meet the requirements of the grinding process; d. Start the rotary drive mechanism of the grinding equipment. As the cylinder (1-1) rotates, the quartz wafer (5) workpiece is attached to the inner wall of the cylinder (1-1) and the quartz wafer (5) is ground with the help of the grinding sand (6). e. After grinding for the set time, the grinding equipment stops running and the quartz wafer (5) and grinding sand (6) are taken out from the cylinder (1-1) and the quartz wafer (5) workpieces are sorted out. f. Remove the adhesive from the quartz wafer (5) and clean it to separate the two quartz wafers that are stuck together, thus creating a plano-convex quartz wafer product.

7. The method for spherical grinding of plano-convex quartz wafers according to claim 6, characterized in that: In step a, the two quartz wafers (5) are bonded together with anaerobic adhesive.

8. The method for spherical grinding of plano-convex quartz wafers according to claim 6, characterized in that: In step b, the grinding sand grade is GC#4000.

9. The method for spherical grinding of plano-convex quartz wafers according to claim 6 or 8, characterized in that: In step c, the rotary drive mechanism drives the cylinder (1-1) to rotate clockwise. Under the action of centrifugal force, the quartz wafer (5) adheres to the inner wall of the cylinder (1-1) and is ground with the help of the grinding sand (6). When the quartz wafer (5) rotates with the cylinder (1-1) to a position of about 11:30, most of the quartz wafer (5) flips and falls back, and some of the quartz wafer (5) adheres to the inner wall of the cylinder until it falls onto the screen (2-1) at a position of about 11:

30. It then slides down along the inclined direction of the screen (2-1) and returns to the bottom of the cylinder through the gap between the screen (2-1) and the inner wall of the cylinder (1-1). The above process is repeated until the set grinding time is reached, and then the operation process of step d is entered.

Images