Eutectic soldering fixture and soldering method

Abstract

This invention provides a eutectic bonding fixture and bonding method, relating to the technical field of chip processing. The eutectic bonding fixture includes a base, an assembly plate, and a cover plate. The cover plate has a through-hole for machining. The assembly plate and the cover plate are arranged from bottom to top. There are multiple assembly plates arranged sequentially along a direction perpendicular to the base. Each assembly plate is equipped with a housing positioning stage, and at least two assembly plates have housing positioning stages of different types. The assembly plate and / or the cover plate are movably connected to the base so that the downward projection of the machining hole can fall on the housing positioning stage to be worked, and the unworked housing positioning stage is located within the downward projection path of the cover plate.

Description

Technical Field

[0001] This invention relates to the field of chip processing technology, and in particular to a eutectic bonding fixture and bonding method. Background Technology

[0002] The gold-silicon eutectic alloy welding method is mainly used in integrated circuit packaging technology for high-quality and high-reliability chip assembly, and it is now an important low-melting-point welding process in microelectronic assembly.

[0003] Eutectic bonding utilizes the interaction and vibration between the silicon on the back of the chip and the gold on the housing cavity at a certain temperature, resulting in the formation of a new eutectic at their interface. This eutectic exhibits excellent flowability and wetting ability, and after cooling and solidification, it forms a hard, rigid body, thus providing a good contact surface and high bonding strength between the integrated circuit chip and the housing cavity. The thermal, electrical, and mechanical properties of eutectic bonding are significantly superior to those of conductive adhesive bonding.

[0004] Different types of chips require different types of matching fixtures. Existing eutectic bonding equipment fixtures are difficult to match, and it is time-consuming and labor-intensive to disassemble the fixtures and replace them accordingly. Summary of the Invention

[0005] The purpose of this invention is to provide a eutectic bonding fixture and a bonding method to alleviate the technical problem of the inconvenience of replacing chips of different sizes with existing eutectic bonding fixtures.

[0006] In a first aspect, the present invention provides a eutectic welding fixture, comprising: a base, an assembly plate and a cover plate, wherein the cover plate is provided with a through-hole, the assembly plate and the cover plate are arranged from bottom to top, and there are multiple assembly plates arranged sequentially along a direction perpendicular to the base, each assembly plate is equipped with a shell positioning stage, and at least two assembly plates have different types of shell positioning stages.

[0007] The assembly plate and / or cover plate are movably connected to the base so that the downward projection of the machining hole can fall on the positioning table of the tube shell to be worked.

[0008] Furthermore, the assembly plate is semi-circular, the base is cylindrical, and the base is provided with a rotating shaft extending in a direction perpendicular to the base. The assembly plate has a shaft hole located at the center of the semi-circular assembly plate, so that the assembly plate is rotatably connected to the rotating shaft.

[0009] Furthermore, the inner wall of the shaft hole is provided with two limiting grooves that are recessed outward in a circumferential direction, and the two limiting grooves are arranged opposite to each other; the side wall of the rotating shaft has multiple sets of limiting structures, the number of the limiting structures is the same as that of the assembly plate, and they correspond one-to-one; the limiting structure includes two limiting protrusions located at the same axial position and protruding in opposite directions.

[0010] The rotating shaft and the assembly plate can slide relative to each other in the axial direction; the rotating shaft is fixed relative to the base in the circumferential direction, but can move up and down relative to the base, and has a first state and a second state. In the first state, the limiting structure and the limiting groove are located on the same horizontal plane, and the two limiting protrusions are respectively located in the two limiting grooves. The tube shell positioning platform on the assembly plate where the limiting groove is located is in a ready-to-work state or a non-working state. In the second state, the limiting structure and the limiting groove are misaligned in the direction perpendicular to the base, and the assembly plate can rotate relative to the rotating shaft.

[0011] Furthermore, the tube shell positioning platform includes a slot, the slot including two slot walls that are parallel and spaced apart in the horizontal direction, and a slot bottom surface connecting the two slot walls, the slot bottom surface being connected to the end of the slot wall away from the rotating shaft;

[0012] The extension direction of the groove wall is perpendicular to the rotating shaft, and the extension path of the gap formed by the two groove walls passes through the rotating shaft;

[0013] The sidewall of the rotating shaft and the bottom surface of the groove are used to stop at the opposite ends of the tube shell that match the tube shell positioning platform.

[0014] Furthermore, the tube housing positioning platform is detachably connected to the assembly plate.

[0015] Furthermore, the number of the shell positioning platforms is multiple, and there are at least two shell positioning platforms, which are used to install different types of shells.

[0016] Furthermore, the bottom surface of the tube positioning platform has a protrusion, and the assembly plate has a groove. The extending direction of the groove is perpendicular to the straight side of the semi-circular assembly plate. The protrusion is inserted into the groove and can slide along the groove.

[0017] The assembly plate is threaded with a locking bolt, which can move relative to the assembly plate in a direction perpendicular to the base. The bolt head of the locking bolt can press against the tube housing positioning platform so that it stops moving relative to the assembly plate at the expected position.

[0018] Furthermore, the assembly plate is fixed relative to the base, the cover plate rotates relative to the base, and the tube shell positioning platforms on the multiple assembly plates are staggered in a direction perpendicular to the base. In the two adjacent layers of assembly plates, the downward projection of the upper assembly plate falls on the outside of the tube shell positioning platform of the lower assembly plate.

[0019] Furthermore, the cover plate is fixed relative to the base, the half of the base with the cover plate is provided with heat dissipation holes, and the half of the base with the machining holes is provided with a heating mechanism.

[0020] Secondly, the welding method provided in this embodiment of the invention uses the aforementioned eutectic welding fixture.

[0021] Further steps include:

[0022] S1. Identify the type of chip to be processed;

[0023] S2. Depending on the type of chip to be processed, switch the corresponding housing positioning stage to the area below the processing hole.

[0024] Furthermore, it also includes the following steps:

[0025] S3. Solder the chip onto the housing inside the housing positioning stage. When soldering the housing and the chip, the temperature range provided by the base is 400℃-500℃; the nitrogen flow rate during soldering is 1.5-3L / Min; the vibration time of the nozzle holding the chip is 3-12ms; and the nozzle temperature is 60℃-85℃.

[0026] Furthermore, it also includes the following steps:

[0027] S4. After the chip soldering is completed, the housing positioning stage located below the processing hole is switched to the underside of the cover plate and heat dissipation treatment is performed on it; another housing positioning stage corresponding to the type of chip to be processed is switched to the underside of the processing hole.

[0028] The eutectic bonding fixture provided in this embodiment of the invention includes: a base, an assembly plate, and a cover plate. The cover plate has a through-hole extending from both the top and bottom. Multiple assembly plates are arranged sequentially from bottom to top, perpendicular to the base. Each assembly plate is equipped with a housing positioning stage, and at least two assembly plates have housing positioning stages of different types. The assembly plates and / or the cover plate are movably connected to the base so that the downward projection of the machining hole falls on the housing positioning stage to be used, and the unused housing positioning stages are located within the downward projection path of the cover plate. After selecting the chip to be processed, firstly, a housing positioning stage matching the chip is found, and the relative positions of the cover plate and the assembly plate are adjusted so that the required housing positioning stage moves directly below the machining hole, while other temporarily unused housing positioning stages move below the cover plate. After changing the chip to be processed, the relative positions of the cover plate and the assembly plate need to be readjusted so that the housing positioning stage on the matching assembly plate is aligned with the working hole. A single fixture has multiple housing positioning stages that can match chips of different sizes. By adjusting the relative position of the assembly plate and the cover, the desired housing positioning stage can be aligned with the working hole without changing the fixture. Switching between housing positioning stages is more convenient and improves welding efficiency. Attached Figure Description

[0029] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the eutectic welding fixture provided in Embodiment 1 of the present invention;

[0031] Figure 2 A cross-sectional view of the rotating shaft of the eutectic welding fixture provided in Embodiment 1 of the present invention in a first state;

[0032] Figure 3 This is a cross-sectional view of the eutectic welding fixture provided in Embodiment 1 of the present invention with its rotating shaft in a second state;

[0033] Figure 4 for Figure 3 A magnified view of a portion of position A in the middle;

[0034] Figure 5 This is a partial top view of the assembly plate of the eutectic welding fixture provided in Embodiment 1 of the present invention;

[0035] Figure 6This is a schematic diagram of the tube shell positioning stage of the eutectic welding fixture provided in Embodiment 1 of the present invention;

[0036] Figure 7 This is a top view of the eutectic welding fixture provided in Embodiment 2 of the present invention;

[0037] Figure 8 This is a top view of the eutectic welding fixture provided in Embodiment 2 of the present invention after the cover plate has been removed.

[0038] Icons: 100-Base; 110-Heat dissipation hole; 120-Slide groove; 200-Assembly plate; 210-Shaft hole; 220-Limit groove; 300-Cover plate; 400-Tube shell positioning platform; 410-Card slot; 411-Slot bottom surface; 420-Raised strip; 500-Rotating shaft; 510-Limit protrusion; 600-Tube shell; 700-Locking bolt. Detailed Implementation

[0039] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] Example 1

[0041] like Figures 1-6As shown, the eutectic welding fixture provided in this embodiment of the invention includes: a base 100, an assembly plate 200, and a cover plate 300. The cover plate 300 is provided with a machining hole penetrating both the top and bottom surfaces. The assembly plate 200 and the cover plate 300 are arranged from bottom to top. There are multiple assembly plates 200, which are arranged sequentially along a direction perpendicular to the base 100. Each assembly plate 200 is equipped with a shell positioning stage 400, and at least two assembly plates 200 have different types of shell positioning stages 400. The assembly plate 200 and / or the cover plate 300 are movably connected to the base 100 so that the downward projection of the machining hole can fall on the shell positioning stage 400 to be worked, and the unworked shell positioning stage 400 is located within the downward projection path of the cover plate 300. After selecting the chip to be processed, firstly, locate the corresponding housing positioning stage 400. Adjust the relative positions of the cover plate 300 and the assembly plate 200 so that the required housing positioning stage 400 is moved directly below the processing hole, while other housing positioning stages 400 not currently needed are moved below the cover plate 300. When changing the chip to be processed, the relative positions of the cover plate 300 and the assembly plate 200 need to be readjusted so that the housing positioning stage 400 on the matching assembly plate 200 is aligned with the working hole. A single fixture has multiple housing positioning stages 400 that can accommodate chips of different sizes. By adjusting the relative position of the assembly plate 200 and the cover, the desired alignment of the housing positioning stage 400 with the working hole can be achieved without changing the fixture. This makes switching between housing positioning stages 400 more convenient and improves welding efficiency.

[0042] In this embodiment, the cover plate 300 can be fixed relative to the base 100. The mounting plate 200 can be a semi-circular plate structure. The base 100 is provided with a rotating shaft 500 extending in a direction perpendicular to the base 100. The mounting plate 200 has a shaft hole 210 located at the center of the semi-circular mounting plate 200, so that the mounting plate 200 can rotate around the rotating shaft 500. The position of the center of the semi-circular mounting plate 200 is contained within the mounting plate 200. It should be noted that the base 100 is cylindrical, and the mounting plate 200 is located inside the base 100. The inner circumferential sidewall of the base 100 is provided with annular grooves 120. There are multiple grooves 120, and they correspond one-to-one with the mounting plate 200. The arc-shaped edge of the mounting plate 200 is located within the groove 120, so that the position of the mounting plate 200 in the direction perpendicular to the base 100 remains unchanged. Specifically, as shown... Figure 2 As shown, before placing the tube, the assembly plate 200 of the matching tube housing positioning stage 400 can be rotated to be directly below the working hole. Then, the remaining assembly plates 200 can be rotated to be below the cover plate 300. The cover plate 300 can also be semi-circular. The function of the cover plate 300 is to form an inert atmosphere space at the working hole so that welding can be carried out.

[0043] In addition to the rotating connection, the assembly plate 200 and the base 100 can also be connected by a sliding connection. By translating the assembly plate 200, the relative position of the assembly plate 200 and the machining hole can be changed.

[0044] To prevent the assembly plate 200 from rotating during welding, two limiting grooves 220 recessed outward in the circumferential direction are provided on the inner wall of the shaft hole 210, and the two limiting grooves 220 are arranged opposite to each other; the side wall of the rotating shaft 500 has multiple sets of limiting structures, the number of the limiting structures is the same as that of the assembly plate 200, and they correspond one-to-one. The limiting structure includes two limiting protrusions 510 located in the same axial position and protruding in opposite directions;

[0045] The rotating shaft 500 and the assembly plate 200 can slide relative to each other in the axial direction; the rotating shaft 500 is fixed relative to the base 100 in the circumferential direction, but can move up and down relative to the base 100, and has a first state and a second state. In the first state, the limiting structure and the limiting groove 220 are located on the same horizontal plane, and the two limiting protrusions 510 are respectively located in the two limiting grooves 220. The tube shell positioning platform 400 on the assembly plate 200 where the limiting groove 220 is located is in a ready-to-work state or a non-working state. In the second state, the limiting structure and the limiting groove 220 are misaligned in the direction perpendicular to the base 100, and the assembly plate 200 can rotate relative to the rotating shaft 500.

[0046] Taking one of the assembly plates 200 and its matching limiting structure as an example, such as... Figure 3 As shown, the rotating shaft 500 can be pulled upwards, and the mounting plate 200 remains in a position perpendicular to the base 100. The limiting structure separates from the limiting groove 220, and the mounting plate 200 can rotate freely. When rotated to the working position (directly below the working hole) or the non-working position (directly below the cover plate 300), the rotating shaft 500 is pushed downwards, as shown. Figure 2 As shown, the limiting protrusion 510 is inserted into the limiting groove 220 to prevent the assembly plate 200 from continuing to rotate, thereby making the welding process more stable.

[0047] The tube housing positioning platform 400 includes a slot 410, which includes two slot walls that are parallel and spaced apart in the horizontal direction, and a slot bottom surface 411 connecting the two slot walls. The slot bottom surface 411 is connected to the end of the slot wall away from the rotating shaft 500. The extending direction of the slot wall is perpendicular to the rotating shaft 500, and the extension path of the gap formed by the two slot walls passes through the rotating shaft 500. The side wall of the rotating shaft 500 and the slot bottom surface 411 are used to stop at the opposite ends of the tube housing 600 that matches the tube housing positioning platform 400.

[0048] The size of the slot 410 corresponds to the size of the short side of the corresponding tube shell 600. The distance between the bottom surface 411 of the slot 410 and the rotating shaft 500 also corresponds to the size of the long side of the tube shell 600. The rotating shaft 500 plays a positioning role here. Compared with the groove-type positioning groove with the same cross-sectional area as the tube shell 600, the open slot 410 structure is simpler and has a lower manufacturing cost.

[0049] The tube housing positioning platform 400 is detachably connected to the assembly plate 200. The bottom surface of the tube housing positioning platform 400 has a protrusion 420, and the assembly plate 200 has a groove. The extension direction of the groove is perpendicular to the straight side of the semi-circular assembly plate 200. The protrusion 420 is inserted into the groove and can slide along the groove. A locking bolt 700 is threaded onto the assembly plate 200. The locking bolt 700 can move relative to the assembly plate 200 in a direction perpendicular to the base 100. The bolt head of the locking bolt 700 can press the tube housing positioning platform 400 to stop its movement relative to the assembly plate 200 at a desired position.

[0050] The number of the tube shell positioning platforms 400 can be multiple, but there are at least two tube shell positioning platforms 400. These two tube shell positioning platforms 400 are used to install different types of tube shells 600. By assembling and disassembling the tube shell positioning platforms 400, different types of tube shells 600 can be clamped, thereby improving the usability of the fixture. Different types of tube shells 600 can be clamped without disassembling the fixture.

[0051] Loosening the locking bolt 700 allows the tube housing positioning platform 400 to move along the groove. The distance between the groove and the rotating shaft 500 is adjustable, thus matching the dimensions of the corresponding tube housing 600. Because the tube housing positioning platform 400 is detachably connected to the assembly plate 200, in the event of a large-scale upgrade, all tube housing positioning platforms 400 can be removed and replaced as a whole. In this case, only the tube housing positioning platforms 400 need to be replaced, without replacing the entire fixture. Rotate the locking bolt 700 until its nut presses against the tube housing positioning platform 400 to secure it.

[0052] The cover plate 300 is fixed relative to the base 100. The half of the base 100 with the cover plate 300 is provided with heat dissipation holes 110, and the half of the base 100 with processing holes is provided with a heating mechanism.

[0053] The half of the base 100 with the cover plate 300 can be the unused half, and the half with the machining hole is the working half. The working housing positioning stage 400 moves to the working half, that is, directly below the machining hole, to perform the soldering operation between the housing 600 and the chip. At this time, a heating mechanism is required to heat the surrounding area so that the temperature at the housing 600 is maintained at approximately 440°C. Meanwhile, the assembly plate 200 of the remaining unused housing positioning stages 400 rotates to the unused half, that is, below the cover plate 300, and uses the heat dissipation holes 110 to dissipate heat and prevent the temperature from rising excessively, thereby enabling the housing positioning stages 400 with different temperatures to be used alternately.

[0054] Example 2

[0055] like Figure 7 and Figure 8 As shown, the difference from Embodiment 1 is that in this embodiment, the assembly plate 200 is fixed relative to the base 100, and the cover plate 300 is rotatable.

[0056] Specifically, the assembly plate 200 is fixed relative to the base 100, the cover plate 300 is rotatable relative to the base 100, and the shell positioning platforms 400 on the multiple assembly plates 200 are staggered in a direction perpendicular to the base 100. In two adjacent layers of assembly plates 200, the downward projection of the upper assembly plate 200 falls on the outer side of the shell positioning platform 400 of the lower assembly plate 200. By rotating the cover plate 300, the working hole can be aligned with one of the shell positioning platforms 400.

[0057] The welding method provided in this embodiment of the invention uses the aforementioned eutectic welding fixture.

[0058] The soldering method includes the following steps: S1. Identify the type of chip to be processed;

[0059] The system can acquire images of the chip to be processed, compare the acquired pattern with a pre-stored pattern to determine the chip type, and then transmit the information to the controller.

[0060] S2. Depending on the type of chip to be processed, switch the corresponding housing positioning stage 400 to the area below the processing hole.

[0061] After identifying the housing positioning stage 400 that matches the type of chip to be processed, the assembly plate 200 is rotated so that the housing positioning stage 400 is located below the processing hole, while the other remaining assembly plates 200 are located below the cover plate 300.

[0062] S3. The chip is soldered onto the housing 600 inside the housing positioning stage 400. When the housing 600 is soldered to the chip, the temperature range provided by the base 100 is 400℃-500℃. The flow rate of nitrogen gas introduced during soldering is 1.5-3L / Min, the vibration time of the nozzle holding the chip is 3-12ms, and the nozzle temperature is 60℃-85℃.

[0063] The new product is welded onto the shell 600 using friction welding. By controlling the temperature of the shell 600, the porosity can be reduced.

[0064] S4. After the chip soldering is completed, the housing positioning stage 400 located below the processing hole is switched to the area below the cover plate 300 and heat dissipation treatment is performed on it; another housing positioning stage 400 corresponding to the type of chip to be processed is switched to the area below the processing hole.

[0065] After a chip is soldered, the assembly plate 200 can be rotated so that the assembly plate 200 and the housing 600 on which the chip is soldered can be moved together to the bottom of the cover plate 300. The heat dissipation holes 110 are used to dissipate heat from the housing 600. At the same time, another housing positioning stage 400 corresponding to the type of chip to be processed can be switched to the bottom of the processing hole to perform the soldering of the next chip, thereby realizing continuous processing.

[0066] Specifically, the temperature range for welding the 600 casing to the chip using a eutectic welder can be 440℃-450℃. Vibration frequency: 5-7 levels; nitrogen flow rate: 2-2.5L / Min; vibration time: 4-10ms; chip nozzle temperature: 70℃-80℃.

[0067] After batch soldering, two chips were randomly selected from each batch for shear force testing. The shear force test values ​​all met the chip shear force requirements in GJB548-96 Method 2019.2. Some specific shear force values ​​are shown in the table below:

[0068] Table 1:

[0069]

[0070] By combining the above-mentioned fixtures and methods, the void ratio and shear force of the eutectic bonding process products can be fully met.

[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A eutectic soldering fixture, characterized by, include: The base (100), the assembly plate (200) and the cover plate (300) are provided with a through-hole on the top and bottom. The assembly plate (200) and the cover plate (300) are arranged from bottom to top. There are multiple assembly plates (200). The multiple assembly plates (200) are arranged sequentially in a direction perpendicular to the base (100). Each assembly plate (200) is equipped with a shell positioning stage (400), and at least two assembly plates (200) have different types of shell positioning stages (400). The assembly plate (200) and / or cover plate (300) are movably connected to the base (100) so that the downward projection of the machining hole can fall on the tube shell positioning stage (400) to be worked. The assembly plate (200) is semi-circular, the base (100) is cylindrical, and the base (100) is provided with a rotating shaft (500) extending in a direction perpendicular to the base (100). The assembly plate (200) has a shaft hole (210) located at the center of the semi-circular assembly plate (200) so that the assembly plate (200) and the rotating shaft (500) are rotatably connected. The inner wall of the shaft hole (210) is provided with two limiting grooves (220) that are recessed outward in a circumferential direction, and the two limiting grooves (220) are arranged opposite to each other; the side wall of the rotating shaft (500) has multiple sets of limiting structures, the number of the limiting structures is the same as that of the assembly plate (200), and they correspond one to one. The limiting structure includes two limiting protrusions (510) located in the same axial position and protruding in opposite directions. The rotating shaft (500) and the assembly plate (200) can slide relative to each other in the axial direction; the rotating shaft (500) is fixed relative to the base (100) in the circumferential direction, but can move up and down relative to the base (100), and has a first state and a second state. In the first state, the limiting structure and the limiting groove (220) are located on the same horizontal plane, and the two limiting protrusions (510) are respectively located in the two limiting grooves (220). The tube shell positioning stage (400) on the assembly plate (200) where the limiting groove (220) is located becomes a working state or a non-working state. In the second state, the limiting structure and the limiting groove (220) are misaligned in the direction perpendicular to the base (100), and the assembly plate (200) can rotate relative to the rotating shaft (500).

2. The eutectic welding fixture according to claim 1, characterized in that, The tube shell positioning platform (400) includes a slot (410), the slot (410) includes two slot walls that are parallel and spaced apart in the horizontal direction, and a slot bottom surface (411) that connects the two slot walls. The slot bottom surface (411) is connected to the end of the slot wall away from the rotating shaft (500). The extension direction of the groove wall is perpendicular to the rotating shaft (500), and the extension path of the gap formed by the two groove walls passes through the rotating shaft (500). The sidewall of the rotating shaft (500) and the bottom surface (411) of the groove are used to stop at the opposite ends of the tube shell (600) that are matched with the tube shell positioning platform (400).

3. The eutectic welding fixture according to claim 2, characterized in that, The tube housing positioning platform (400) is detachably connected to the assembly plate (200).

4. The eutectic welding fixture according to claim 3, characterized in that, The number of the shell positioning platforms (400) is multiple, and there are at least two shell positioning platforms (400) for installing different types of shells (600).

5. The eutectic welding fixture according to claim 3, characterized in that, The bottom surface of the tube positioning platform (400) has a protrusion (420), and the assembly plate (200) has a groove, the extension direction of which is perpendicular to the straight side of the semi-circular assembly plate (200). The protrusion (420) is inserted into the groove and can slide along the groove; The assembly plate (200) is threaded with a locking bolt (700), which is movable relative to the assembly plate (200) in a direction perpendicular to the base (100). The bolt head of the locking bolt (700) can press against the housing positioning table (400) so that it stops moving relative to the assembly plate (200) at the expected position.

6. The eutectic welding fixture according to claim 1, characterized in that, The assembly plate (200) is fixed relative to the base (100), the cover plate (300) rotates relative to the base (100), and the shell positioning platforms (400) on the multiple assembly plates (200) are staggered in a direction perpendicular to the base (100). Among the two adjacent layers of assembly plates (200), the downward projection of the upper assembly plate (200) falls on the outside of the shell positioning platform (400) of the lower assembly plate (200).

7. The eutectic welding fixture according to claim 1, characterized in that, The cover plate (300) is fixed relative to the base (100). The half of the base (100) with the cover plate (300) is provided with heat dissipation holes (110), and the half of the base (100) with processing holes is provided with a heating mechanism.

8. A welding method, characterized in that, The eutectic welding fixture described in any one of claims 1-7 is used.

9. The welding method according to claim 8, characterized in that, Including the following steps: S1. Identify the type of chip to be processed; S2. Depending on the type of chip to be processed, switch the corresponding housing positioning stage (400) to the area below the processing hole.

10. The welding method according to claim 9, characterized in that, It also includes the following steps: S3. The chip is soldered onto the housing (600) inside the housing positioning stage (400), and when the housing (600) is soldered to the chip, the temperature range provided by the base (100) is 400℃-500℃; the flow rate of nitrogen gas introduced during soldering is 1.5-3L / Min, the vibration time of the nozzle holding the chip is 3~12ms, and the temperature of the nozzle is 60℃~85℃.

11. The welding method according to claim 10, characterized in that, It also includes the following steps: S4. After the chip soldering is completed, the housing positioning stage (400) located below the processing hole is switched to the cover plate (300) and heats it; another housing positioning stage (400) corresponding to the type of chip to be processed is switched to the area below the processing hole.

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