A silicon wafer cleaning and drying system and operating process under high-purity nitrogen atmosphere

Abstract

This invention relates to the field of silicon wafer cleaning technology and discloses a silicon wafer cleaning and drying system and operating process under a high-purity nitrogen environment. The system includes a dryer, table legs, and a conveying device. A base plate is fixedly connected to the top of the table legs. A left plate is fixedly connected to one side of the base plate, and a right plate is fixedly connected to the other side. A top plate is fixedly connected to the top of the right plate, which is then fixedly connected to the left plate via the top plate. Two feeding devices are provided on one side of the left plate. Cleaning reagent is placed in the reagent tank of the feeding device. The cleaning reagent flows from the water inlet column to a third pipe, then to a second pipe, then to a first pipe, and finally reaches the inside of the connecting block. It then flows through a small hole above the fifth rotating shaft to the nozzle for spraying. When the disc moves to the second spraying device, the silicon wafer undergoes a second cleaning. After cleaning, the wafer is moved to the dryer for drying, thus achieving multiple cleaning processes and avoiding reagent contamination.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer cleaning technology, specifically to a silicon wafer cleaning and drying system and operating process under a high-purity nitrogen atmosphere. Background Technology

[0002] Silicon is a gray, brittle, tetravalent nonmetallic chemical element. Silicon wafers, also known as silicon wafers, are made from silicon ingots. Through specialized processes, millions of transistors can be etched onto silicon wafers, which are widely used in the manufacture of integrated circuits. In the production of semiconductor devices, silicon wafers must undergo rigorous cleaning. Even trace amounts of contamination can lead to device failure. The purpose of cleaning is to remove surface contaminants, including organic and inorganic substances. Some of these impurities exist on the surface of the silicon wafer in atomic or ionic states, while others exist in thin film or particle form, which can lead to various defects. During the cleaning process, the dirt removed during each entry and exit of the cleaning tank is stirred up and mixed in with the cleaning solution, resulting in poor cleaning effectiveness. Summary of the Invention

[0003] (a) Technical problems to be solved

[0004] To address the shortcomings of existing technologies, this invention provides a silicon wafer cleaning and drying system under a high-purity nitrogen atmosphere.

[0005] (II) Technical Solution

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solution: a silicon wafer cleaning and drying system under a high-purity nitrogen atmosphere, comprising:

[0007] Dryer;

[0008] The table legs are fixedly connected at the top to the base plate, one side of the base plate is fixedly connected to the left plate, the other side of the base plate is fixedly connected to the right plate, the top of the right plate is fixedly connected to the top plate, and the right plate is fixedly connected to the left plate through the top plate.

[0009] A conveying device is installed on top of the base plate;

[0010] A feeding device is provided on one side of the left plate. The feeding device is rectangular, and there are two feeding devices in total. The feeding device includes a fifth fixed column. One side of the fifth fixed column is fixedly connected to the reagent tank, and the other side of the fifth fixed column is fixedly connected to the left plate. A spraying device is provided on the other side of the left plate, and there are two spraying devices in total. The middle part of the left plate near the right plate is fixedly connected to the first interlayer plate. The middle part of the right plate near the left plate is fixedly connected to the second interlayer plate. The bottom of the left plate near the right plate is movably connected to the first rotating shaft. The first rotating shaft passes through the conveyor and is fixedly connected to the first rotating wheel. The side of the first rotating shaft passing through the first rotating wheel is movably connected to the right plate. There are two first rotating shafts, located at both ends of the conveyor. The surface of the first rotating wheel is movably connected to the belt. The first rotating wheel is connected to the second rotating wheel through the belt for transmission.

[0011] Preferably, the second rotating wheel is fixedly connected to the surface of the second rotating shaft, and a first gear is fixedly connected to the surface of the second rotating shaft. One end of the second rotating shaft passing through the first gear is movably connected to the right plate, and the first gear is located between the second rotating shaft and the right plate. A conveyor belt is movably connected to the surface of the first gear, and the first gear is connected to the second gear and the third gear through the conveyor belt. The second gear is fixedly connected to the surface of the third rotating shaft, and one end of the third rotating shaft passing through the second gear is movably connected to the right plate. A first conical tooth is fixedly connected to the other end of the third rotating shaft. A support column is movably connected to the surface of the third rotating shaft, and a support frame is fixedly connected to the bottom of the support column. The bottom of the support frame is fixedly connected to the right plate. The third gear is fixedly connected to the surface of the fourth rotating shaft, and one end of the fourth rotating shaft passing through the third gear is movably connected to the right plate.

[0012] Preferably, the spraying device includes a first fixed column, one end of which is fixedly connected to a left plate. A first clamping plate is movably connected to the surface of the first fixed column. A second clamping plate is fixedly connected to the end of the first fixed column that passes through the first clamping plate. A connecting block is movably connected to the bottom of one side of the second clamping plate. A second connecting column is movably connected to the top of the connecting block. One side of the second connecting column is fixedly connected to one end of a third clamping plate. The other side of the second connecting column that passes through the connecting block is movably connected to a helical gear. The third clamping plate is movably connected to the helical gear via the second connecting column. The other end of the third clamping plate is fixedly connected to the first connecting column. The third clamping plate is connected to the first clamping plate via the first connecting column. The plate is movably connected, and a fifth rotating shaft is movably connected to the bottom of the connecting block. A third conical tooth is fixedly connected to one end of the fifth rotating shaft, and a connecting block is fixedly connected to the other end of the fifth rotating shaft. A fixing plate is movably connected to the surface of the fifth rotating shaft, and the fixing plate is located between the third conical tooth and the connecting block. The top of the fixing plate is fixedly connected to the bottom of the top plate, and the fifth rotating shaft can swing up and down with the fixing plate as a support point. A nozzle is fixedly connected to the surface of the connecting block, and a threaded column is fixedly connected to the surface of the fifth rotating shaft between the connecting block and the connecting block. The threaded column can mesh with the helical gear. The third conical tooth meshes with the first conical tooth and the second conical tooth.

[0013] Preferably, the top of the conveying device is movably connected to the base, the top of the base is fixedly connected to a sliding block, one side of the sliding block is movably connected to a first interlayer plate, the other side of the sliding block is movably connected to a second interlayer plate, the top of the sliding block is fixedly connected to a disc, the bottom of the disc is fixedly connected to a first serrated plate, the top of the disc is movably connected to a central column, the surface of the central column is fixedly connected to a hollow gear, and the top of the central column is fixedly connected to a storage slot.

[0014] Preferably, the surface of the central column is fixedly connected to the side wing, and the side wing is located above the hollow gear. A sliding groove is provided on the upper surface of the side wing, and a locking plate is slidably connected to the surface of the sliding groove. A spring is fixedly connected to one side of the bottom of the locking plate, and the locking plate is fixedly connected to the side wing through the spring. An elastic rope is fixedly connected to the other side of the bottom of the locking plate, and the side of the elastic rope away from the locking plate is fixedly connected to the side wing. A fixing block is fixedly connected to the top of one side of the locking plate, and a fixing clamp is fixedly connected to the end of the fixing block away from the locking plate.

[0015] Preferably, the bottom of one side of the connecting block is movably connected to the first pipe, and the other end of the first pipe is fixedly connected to the second pipe. The end of the second pipe away from the first pipe is fixedly connected to the third pipe, and one end of the third pipe is fixedly connected to the water inlet column. The end of the water inlet column away from the third pipe is fixedly connected to the reagent tank. A locking device is movably connected inside the water inlet column, and the locking device can move left and right inside the water inlet column. Two connecting posts are fixedly connected to the surface of the locking device.

[0016] Preferably, the first interlayer plate has a groove inside. A sixth rotating shaft is movably connected to one side of the first interlayer plate. A fifth gear is fixedly connected to the side of the sixth rotating shaft that passes through the first interlayer plate, and the fifth gear is located at the groove. There are a total of four fifth gears. A third rotating wheel is fixedly connected to the other side of the sixth rotating shaft. A third connecting post is fixedly connected to the side of the third rotating wheel away from the sixth rotating shaft. The third rotating wheel is fixedly connected to the fourth interlayer plate through the third connecting post. A movable buckle is fixedly connected to one side of the top of the fourth interlayer plate. A fifth interlayer plate is movably connected to the surface of the movable buckle. A movable plate is fixedly connected to one side of the top of the fifth interlayer plate. A U-shaped groove is opened inside the movable plate. A second fixed post is movably connected to the surface of the U-shaped groove. One side of the second fixed post is fixedly connected to the left plate. A connecting post is fixedly connected to the side of the movable plate away from the fifth interlayer plate.

[0017] Preferably, the bottom of the left plate is fixedly connected to the third fixing post near the right plate. There are two third fixing posts in total. The left plate is fixedly connected to the second sawtooth plate through the third fixing posts. The bottom of the right plate is fixedly connected to the fourth fixing post near the left plate. There are two fourth fixing posts in total. The right plate is fixedly connected to the third sawtooth plate through the fourth fixing posts. Both the second sawtooth plate and the third sawtooth plate are engaged with the hollow gear.

[0018] An operating procedure for a silicon wafer cleaning and drying system under a high-purity nitrogen atmosphere includes the following steps:

[0019] Step 1, placing the silicon wafer: Open the two side clamps, so that the bottom plate moves backward along with the elastic cord and spring, and puts the silicon wafer into the placement slot. The elastic cord and spring are squeezed, so that the clamps hold the silicon wafer stably on both sides.

[0020] The second step is the metering of the cleaning fluid: The base moves with the conveyor, which moves the first serrated plate at the bottom of the base. The first serrated plate moves to the fifth gear, which rotates the fifth gear. The fifth gear drives the third rotating wheel to rotate through the sixth rotating shaft. The third rotating wheel drives the fourth clamping plate to rotate through the third connecting column located on it. The rotation of the fourth clamping plate pushes the fifth clamping plate to move upward. The fifth clamping plate drives the moving plate to move to the right. The moving plate pushes the connecting column to move. The connecting column pushes the locking pin to move to one side, allowing the liquid in the water column to flow out. Similarly, when the disc moves forward, it can push the locking pin in the opposite direction, preventing the liquid in the water column from flowing out.

[0021] The third step is silicon wafer rotation: the base moves, which drives the disc on the sliding plate to move. A hollow gear is fixed on the disc. When the disc moves forward, the hollow gear touches the third and second sawtooth plates located on both sides inside the cleaning machine, thereby causing the hollow gear to drive the disc to rotate.

[0022] The fourth step is the oscillation of the cleaning device: When the transmission device is running, it drives the first rotating wheel on the right to rotate. The first rotating wheel drives the second rotating shaft to rotate through the leather, thereby causing the conveyor belt located on the second rotating shaft to rotate. The conveyor belt drives the first conical tooth on the third rotating shaft to rotate through the second gear. The first conical tooth drives the threaded column on the fifth rotating shaft to rotate through the third conical tooth, causing the helical gear meshing with the threaded column to rotate, allowing the connecting block to oscillate up and down based on the fixed plate.

[0023] Step 5, silicon wafer cleaning: The liquid in the water column passes through the third pipe, then through the second pipe, and finally flows into the interior of the connecting block from the first pipe. It then enters the interior of the connecting block through several small holes on the fifth rotating shaft and is sprayed by the nozzle.

[0024] (III) Beneficial Effects

[0025] Compared with the prior art, the present invention provides a silicon wafer cleaning and drying system in a high-purity nitrogen environment, which has the following beneficial effects:

[0026] 1. This silicon wafer cleaning and drying system in a high-purity nitrogen environment operates by a conveyor that drives the first rotating wheel on the right side. The first rotating wheel drives the second rotating shaft via a belt, which in turn drives the conveyor belt. This causes the second and third gears on the conveyor belt to rotate. The second gear drives the first conical tooth to rotate via the third rotating shaft, which in turn drives the third conical tooth to rotate. The third conical tooth drives the threaded column via the third rotating shaft, which meshes with the helical gear, causing the helical gear to rotate. The helical gear drives the third clamping plate to rotate, causing the connecting block to swing up and down based on the fixed plate. The fifth rotating shaft rotates, causing the connecting block to rotate, thus achieving a swinging and rotating spraying effect.

[0027] 2. This silicon wafer cleaning and drying system in a high-purity nitrogen environment uses a conveyor to move the upper base. When the base moves, it moves the upper sliding block, which in turn moves the disc. When the disc moves forward, the hollow gear contacts the third and second sawtooth plates on both sides, causing the hollow gear to rotate. The rotation of the hollow gear causes the central column to rotate, which in turn causes the side wings on both sides to rotate, thus enabling multi-faceted cleaning of the silicon wafers during the cleaning process.

[0028] 3. This silicon wafer cleaning and drying system in a high-purity nitrogen environment moves the upper base by activating the conveyor device. As the base moves, the upper sliding block moves, which in turn moves the disc. This moves the clamping plates on both sides of the central column, placing the silicon wafer into the storage slot. The wafer is held in place by the fixing clamps on both sides. The clamping plates move the elastic rope and spring backward, causing the elastic rope and spring to be compressed, thus fixing the silicon wafer more stably in the storage slot. This achieves an adjustable size and increased stability.

[0029] 4. This silicon wafer cleaning and drying system in a high-purity nitrogen environment works by moving a disc forward, which in turn moves the first serrated plate at the bottom of the disc forward. During this movement, the first serrated plate rotates the fifth gear, which in turn rotates the third wheel via the sixth rotating shaft. The third wheel, via the third connecting column, rotates the fourth clamping plate. The rotation of the fourth clamping plate pushes the fifth clamping plate upward, which in turn moves the moving plate to the right. The moving plate then moves the connecting column, which in turn moves the locking mechanism to one side, allowing the liquid in the water inlet column to flow out. Similarly, when the disc moves forward, it can push the locking mechanism in the opposite direction, preventing the liquid in the water inlet column from flowing out. This allows for controlled release and shut-off of the cleaning reagent, achieving a reagent-saving effect.

[0030] 5. This silicon wafer cleaning and drying system under a high-purity nitrogen atmosphere involves placing cleaning reagent into the reagent tank of the feeding device. The cleaning reagent flows from the water inlet column to the third pipe, then from the third pipe to the second pipe, then from the second pipe to the first pipe, and finally reaches the inside of the connecting block. It then flows into the nozzle through a small hole above the fifth rotating shaft for spraying. There are two feeding devices in total, one containing cleaning reagent and the other containing pure water. When the disc moves to the second spraying device, the silicon wafer will be cleaned a second time. After cleaning, it is moved to the dryer for drying, thus achieving multiple cleaning and avoiding the effect of chemical contamination. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of the present invention;

[0032] Figure 2 For the present invention Figure 1 Structural analysis diagram;

[0033] Figure 3 This is a schematic diagram of the transmission device structure of the present invention;

[0034] Figure 4 This is a schematic diagram of the spraying device of the present invention;

[0035] Figure 5 For the present invention Figure 4 Schematic diagram of the partial structure of the spraying device;

[0036] Figure 6 For the present invention Figure 2 Schematic diagram of the mobile device structure;

[0037] Figure 7 For the present invention Figure 6 Schematic diagram of the structure of the mobile device;

[0038] Figure 8 For the present invention Figure 6 Schematic diagram of the structure of the mobile device;

[0039] Figure 9 This is a schematic diagram of the regulating switch structure of the present invention;

[0040] Figure 10 For the present invention Figure 9 A schematic diagram showing the structural analysis of the central regulating switch section.

[0041] In the diagram: 1. Dryer; 2. Fixed plate; 10. Table leg; 11. Base plate; 12. Left plate; 13. Right plate; 14. Top plate; 15. Feeding device; 16. Conveying device; 17. First rotating shaft; 18. First wheel; 19. Belt; 20. Second wheel; 21. Second rotating shaft; 22. First gear; 23. Conveyor belt; 24. Second gear; 25. Third rotating shaft; 26. First conical tooth; 27. Third gear; 28. Fourth rotating shaft; 29. ​​Second conical tooth; 30. Support frame; 31. Support column; 32. First fixed column; 33. First clamping plate; 34. Second clamping plate; 35. Connecting block; 36. First connecting column; 37. Third clamping plate; 38. Second connecting column; 39. Helical gear; 40. Fifth rotating shaft; 41. Threaded column; 42. Connecting block; 43. Nozzle; 44. Third conical tooth; 4 5. Disc; 46. Central column; 47. Hollow gear; 48. Storage slot; 49. Side wing; 50. Clamping plate; 51. Fixing block; 52. Fixing clamp; 53. Sliding groove; 54. Elastic rope; 55. Spring; 56. Sliding block; 57. Base; 58. First serrated plate; 59. First pipe; 60. Second pipe; 61. First interlayer plate; 62. Sixth rotating shaft; 63. Fifth gear; 64. Third rotating wheel 65. Third connecting post; 66. Fourth clamping plate; 67. Movable buckle; 68. Fifth clamping plate; 69. Moving plate; 70. U-shaped groove; 71. Second fixing post; 72. Connecting post; 73. Lock; 74. Water inlet column; 75. Third pipe; Second interlayer plate; 77. Second serrated plate; 78. Third fixing post; 79. Fourth fixing post; 80. Third serrated plate; 151. Reagent tank; 152. Fifth fixing post. Detailed Implementation

[0042] The present invention will be further described in detail below with reference to the accompanying drawings, wherein the same parts are indicated by the same reference numerals. It should be noted that the terms “front”, “rear”, “left”, “right”, “upper” and “lower”, “bottom surface” and “top surface” used in the following description refer to the directions in the drawings, and the terms “inner” and “outer” refer to the directions toward or away from the geometric center of a specific part, respectively.

[0043] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] Please see Figure 1-10 A silicon wafer cleaning and drying system under a high-purity nitrogen atmosphere, comprising:

[0045] Dryer 1;

[0046] The table legs 10 are straight legs, and their tops are fixedly connected to the base plate 11. One side of the base plate 11 is fixedly connected to the left plate 12, and the other side of the base plate 11 is fixedly connected to the right plate 13. The top of the right plate 13 is fixedly connected to the top plate 14, and the right plate 13 is fixedly connected to the left plate 12 through the top plate 14, thus constructing the cleaning machine housing.

[0047] Conveying device 16 is disposed on the top of base plate 11;

[0048] A feeding device 15 is provided on one side of the left plate 12. There are two feeding devices 15 in total. Each feeding device 15 includes a fifth fixed column 152. One side of the fifth fixed column 152 is fixedly connected to the reagent tank 151. The reagent tank is rectangular. The other side of the fifth fixed column 152 is fixedly connected to the left plate 12. A spraying device is provided on the other side of the left plate 12. There are two spraying devices in total. The middle part of the left plate 12 near the right plate 13 is fixedly connected to the first interlayer plate 61. The middle part of the right plate 13 near the left plate 12 is fixedly connected to the second interlayer plate. The bottom of the left plate 12 near the right plate 13 is movably connected to the first rotating shaft 17. The first rotating shaft 17 passes through the conveying device 16 and is fixedly connected to the first rotating wheel 18. The first rotating shaft 17 passes through the first rotating wheel 18 and is movably connected to the right plate 13. There are two first rotating shafts 17 located at both ends of the conveying device 16. The surface of the first rotating wheel 18 is movably connected to the belt 19. The first rotating wheel 18 is connected to the second rotating wheel 20 through the belt 19.

[0049] The second rotating wheel 20 is fixedly connected to the surface of the second rotating shaft 21. A first gear 22 is fixedly connected to the surface of the second rotating shaft 21. One end of the second rotating shaft 21 passing through the first gear 22 is movably connected to the right plate 13, and the first gear 22 is located between the second rotating shaft 21 and the right plate 13. A conveyor belt 23 is movably connected to the surface of the first gear 22. The first gear 22 is connected to the second gear 24 and the third gear 27 through the conveyor belt 23. The second gear 24 is fixedly connected to the surface of the third rotating shaft 25. One end of the third rotating shaft 25 passing through the second gear 24 is movably connected to the right plate 13. A first conical tooth 26 is fixedly connected to the other end of the third rotating shaft 25. A support column 31 is movably connected to the surface of the third rotating shaft 25. The support column is a hollow semi-cylinder. A support frame 30 is fixedly connected to the bottom of the support column 31. The bottom of the support frame 30 is fixedly connected to the right plate 13. The third gear 27 is fixedly connected to the surface of the fourth rotating shaft 28. One end of the fourth rotating shaft 28 passing through the third gear 27 is movably connected to the right plate 13.

[0050] The spraying device includes a first fixed post 32, one end of which is fixedly connected to the left plate 12. A first clamping plate 33 is movably connected to the surface of the first fixed post 32. A second clamping plate 34 is fixedly connected to the end of the first fixed post 32 that passes through the first clamping plate 33. A connecting block 35 is movably connected to the bottom side of one side of the second clamping plate 34. The connecting block is an irregular rectangle and hollow inside. A second connecting post 38 is movably connected to the top side of the connecting block 35. One side of the second connecting post 38 is fixedly connected to one end of a third clamping plate 37. The other side of the second connecting post 38 that passes through the connecting block 35 is movably connected to a helical gear 39. The third clamping plate 37 is movably connected to the helical gear 39 through the second connecting post 38. A first connecting post 36 is fixedly connected to the other end of the third clamping plate 37. The third clamping plate 37 is movably connected to the first clamping plate 33 through the first connecting post 36. A fifth rotating shaft 40 is movably connected to the bottom of 35. The fifth rotating shaft is a hollow shaft, and several small slots are opened in the part of the fifth rotating shaft 40 inside 35. A third conical tooth 44 is fixedly connected to one end of the fifth rotating shaft 40, and a connecting block 42 is fixedly connected to the other end of the fifth rotating shaft 40. A fixing plate 2 is movably connected to the surface of the fifth rotating shaft 40. The fixing plate 2 is located between the third conical tooth 44 and the connecting block 35. The top of the fixing plate 2 is fixedly connected to the bottom of the top plate 14, and the fifth rotating shaft 40 can swing up and down with the fixing plate 2 as the support point. A nozzle 43 is fixedly connected to the surface of the connecting block 42. A threaded column 41 is fixedly connected to the surface of the fifth rotating shaft 40 between the connecting block 42 and the connecting block 35, and the threaded column 41 can mesh with the helical gear 39. The third conical tooth 44 meshes with the first conical tooth 26 and the second conical tooth 29.

[0051] The top of the conveying device 16 is movably connected to the base 57. A sliding block 56 is fixedly connected to the top of the base 57. One side of the sliding block 56 is movably connected to the first interlayer plate 61, and the other side of the sliding block 56 is movably connected to the second interlayer plate. A disc 45 is fixedly connected to the top of the sliding block 56. A first serrated plate 58 is fixedly connected to the bottom of the disc 45. A central column 46 is movably connected to the top of the disc 45. A hollow gear 47 is fixedly connected to the surface of the central column 46. A storage slot 48 is fixedly connected to the top of the central column 46. The storage slot 48 is crescent-shaped.

[0052] The surface of the central column 46 is fixedly connected to the side wing 49, and the side wing 49 is located above the hollow gear 47. A sliding groove 53 is provided on the upper surface of the side wing 49. A clamping plate 50 is slidably connected to the surface of the sliding groove 53. A spring 55 is fixedly connected to one side of the bottom of the clamping plate 50. The clamping plate 50 is fixedly connected to the side wing 49 through the spring 55. An elastic rope 54 is fixedly connected to the other side of the bottom of the clamping plate 50. The side of the elastic rope 54 away from the clamping plate 50 is fixedly connected to the side wing 49, so that the clamping plate 50 can be clamped. A fixing block 51 is fixedly connected to the top of one side of the clamping plate 50. A fixing clamp 52 is fixedly connected to the end of the fixing block 51 away from the clamping plate 50.

[0053] One bottom side of the connecting block 35 is movably connected to the first pipe 59, and the other end of the first pipe 59 is fixedly connected to the second pipe 60. The end of the second pipe 60 away from the first pipe 59 is fixedly connected to the third pipe 75, and one end of the third pipe 75 is fixedly connected to the water inlet column 74. The end of the water inlet column 74 away from the third pipe 75 is fixedly connected to the reagent tank 151. A locking lock 73 is movably connected inside the water inlet column 74. The locking lock 73 has a small opening in the center and can move left and right inside the water inlet column 74. Two connecting posts 72 are fixedly connected to the surface of the locking lock 73.

[0054] The first interlayer plate 61 has four slots inside. A sixth rotating shaft 62 is movably connected to one side of the first interlayer plate 61. A fifth gear 63 is fixedly connected to the side of the sixth rotating shaft 62 that passes through the first interlayer plate 61, and the fifth gear 63 is located at the slot. There are four fifth gears 64 in total. A third rotating wheel 64 is fixedly connected to the other side of the sixth rotating shaft 62. A third connecting post 65 is fixedly connected to the side of the third rotating wheel 64 away from the sixth rotating shaft 62. The third rotating wheel 64 is fixedly connected to the fourth interlayer plate 66 through the third connecting post 65. The top of the fourth interlayer plate 66... A movable buckle 67 is fixedly connected to one side, and a fifth clamping plate 68 is movably connected to the surface of the movable buckle 67. The fifth clamping plate 68 can be moved through the fourth clamping plate 66. A movable plate 69 is fixedly connected to one side of the top of the fifth clamping plate 68. A U-shaped groove 70 is opened inside the movable plate 69. A second fixed post 71 is movably connected to the surface of the U-shaped groove 70. One side of the second fixed post 71 is fixedly connected to the left plate 12. A connecting post 72 is fixedly connected to the side of the movable plate 69 away from the fifth clamping plate 68, and the movement range of the movable plate 69 is limited by the second fixed post 71 on the surface of the U-shaped groove 70.

[0055] The bottom of the left plate 12 is fixedly connected to the third fixing post 78 near the right plate 13. There are two third fixing posts 78. The left plate 12 is fixedly connected to the second serrated plate 77 through the third fixing posts 78. The bottom of the right plate 13 is fixedly connected to the fourth fixing post 79 near the left plate 12. There are two fourth fixing posts 79. The right plate 13 is fixedly connected to the third serrated plate 80 through the fourth fixing posts 79. Both the second serrated plate 77 and the third serrated plate 80 mesh with the hollow gear 47.

[0056] An operating procedure for a silicon wafer cleaning and drying system under a high-purity nitrogen atmosphere includes the following steps:

[0057] The first step is to place the silicon wafer: by activating the conveyor device 16, the upper base 57 is moved. When the base 57 moves, the upper sliding block 56 moves. The sliding block 56 moves the disc 45. The clamping plates 50 on both sides of the central column 46 are moved to place the silicon wafer into the storage slot 48. The two sides are clamped by the fixing clamps 52. The clamping plates 50 move the elastic rope 54 and spring 55 backward, so that the elastic rope 54 and spring 55 are compressed to generate squeezing force, so that the silicon wafer is more stably fixed on the storage slot 48, thereby achieving an effect of adjustable size and increased stability.

[0058] The second step involves the oscillation of the cleaning device: the operation of the conveyor 16 drives the first rotating wheel 18 on the right side to rotate. The first rotating wheel 18 drives the second rotating shaft 21 to rotate via the belt 19. The second rotating shaft 21 drives the conveyor belt 23 to rotate, causing the second gear 24 and the third gear 27 on the conveyor belt 23 to rotate. The second gear 24 drives the first conical tooth 26 to rotate via the third rotating shaft 25. The rotation of the first conical tooth 26 drives the third conical tooth 44 to rotate. The third conical tooth 44 drives the threaded column 41 to rotate via the fifth rotating shaft 40. The threaded column 41 meshes with the helical gear 39, causing the helical gear 39 to rotate. The helical gear 39 drives the third clamping plate 37 to rotate, causing the connecting block 35 to oscillate up and down based on the fixed plate 2. The operation of the fifth rotating shaft 40 drives the connecting block 42 to rotate, thereby achieving an effect of oscillation and rotational spraying.

[0059] The third step is silicon wafer rotation: the conveyor 16 drives the upper base 57 to move, and the upper sliding block 56 moves when the base 57 moves. The sliding block 56 drives the disc 45 to move. When the disc 45 moves forward, the hollow gear 47 touches the third serrated plate 80 and the second serrated plate 77 located on both sides, causing the hollow gear 47 to rotate. The rotation of the hollow gear 47 drives the central column 46 to rotate, which in turn drives the side wings on both sides to rotate, thus enabling the silicon wafer to be rotated and cleaned from multiple sides during the cleaning process.

[0060] The fourth step is the quantitative dispensing of the cleaning solution: The disc 45 moves forward, causing the first serrated plate 58 at its bottom to move forward as well. During this movement, the first serrated plate 58 drives the fifth gear 63 to rotate. The fifth gear 63, through the sixth rotating shaft 62, drives the third rotating wheel 64 to rotate. The third rotating wheel 64, through the third connecting column 65 located on it, drives the fourth clamping plate 66 to rotate. The rotation of the fourth clamping plate 66 pushes the fifth clamping plate 68 upward. The fifth clamping plate 68 drives the moving plate 69 to move to the right. The moving plate 69 pushes the connecting column 72 to move, and the connecting column 72 pushes the locking pin 73 to move to one side, allowing the liquid in the water inlet column 74 to flow out. Similarly, when the disc 45 moves forward, it can push the locking pin 73 in the opposite direction, preventing the liquid in the water inlet column 74 from flowing out. This allows for controlled release and shut-off of the cleaning reagent, achieving a reagent-saving effect.

[0061] The fifth step is silicon wafer cleaning: cleaning reagent is placed into the reagent tank 151 in the feeding device 15. The cleaning reagent flows from the water inlet column 74 to the third pipe 75, from the third pipe 75 to the second pipe 60, from the second pipe 60 to the first pipe 59, and finally reaches the inside of the connecting block 35. It flows into the nozzle 43 through the small hole above the fifth rotating shaft 40 for spraying. There are two feeding devices 15, one containing cleaning reagent and the other containing pure water. When the disc 45 moves to the second spraying device, the silicon wafer will be cleaned a second time, thereby avoiding chemical contamination and achieving the effect of multiple cleaning.

[0062] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer cleaning and drying system under a high-purity nitrogen atmosphere, characterized in that: include: Dryer (1); The table legs (10) are fixedly connected to the top plate (11) at their top, and to the left plate (12) on one side of the bottom plate (11) and to the right plate (13) on the other side. The top of the right plate (13) is fixedly connected to the top plate (14), and the right plate (13) is fixedly connected to the left plate (12) through the top plate (14). A conveying device (16) is disposed on top of the base plate (11); A feeding device (15) is provided on one side of the left plate (12). There are two feeding devices (15). Each feeding device (15) includes a fifth fixed column (152). One side of the fifth fixed column (152) is fixedly connected to the reagent tank (151), and the other side of the fifth fixed column (152) is fixedly connected to the left plate (12). A spraying device is provided on the other side of the left plate (12). There are two spraying devices. The middle part of the left plate (12) near the right plate (13) is fixedly connected to the first interlayer plate (61), and the middle part of the right plate (13) near the left plate (12) is fixedly connected to the second interlayer plate (61). The shelves are fixedly connected. The bottom of the left plate (12) near the right plate (13) is movably connected to the first rotating shaft (17). The first rotating shaft (17) passes through the conveyor (16) and is fixedly connected to the first wheel (18). The first rotating shaft (17) passes through the first wheel (18) and is movably connected to the right plate (13). There are two first rotating shafts (17) located at both ends of the conveyor (16). The surface of the first wheel (18) is movably connected to the belt (19). The first wheel (18) is connected to the second wheel (20) through the belt (19). The spraying device includes a first fixed column (32), one end of which is fixedly connected to the left plate (12). A first clamping plate (33) is movably connected to the surface of the first fixed column (32). A second clamping plate (34) is fixedly connected to one end of the first fixed column (32) that passes through the first clamping plate (33). A connecting block (35) is movably connected to the bottom of one side of the second clamping plate (34). A second connecting column (38) is movably connected to one side of the top of the connecting block (35). One side of the second connecting column (38) is fixedly connected to one end of a third clamping plate (37). The other side of the second connecting column (38) that passes through the connecting block (35) is movably connected to a helical gear (39). The third clamping plate (37) is movably connected to the helical gear (39) through the second connecting column (38). A first connecting column (36) is fixedly connected to the other end of the third clamping plate (37). The third clamping plate (37) is connected to the first clamping plate (33) through the first connecting column (36). The fifth rotating shaft (40) is movably connected to the bottom of the connecting block (35). One end of the fifth rotating shaft (40) is fixedly connected to the third conical tooth (44), and the other end of the fifth rotating shaft (40) is fixedly connected to the connecting block (42). The surface of the fifth rotating shaft (40) is movably connected to the fixing plate (2). The fixing plate (2) is located between the third conical tooth (44) and the connecting block (35). The top of the fixing plate (2) is fixedly connected to the bottom of the top plate (14), and the fifth rotating shaft (40) can swing up and down with the fixing plate (2) as the support point. The surface of the connecting block (42) is fixedly connected to the nozzle (43). The surface of the fifth rotating shaft (40) is fixedly connected to the threaded column (41) between the connecting block (42) and the connecting block (35), and the threaded column (41) can mesh with the helical gear (39). The third conical tooth (44) meshes with the first conical tooth (26) and the second conical tooth (29). The top of the conveying device (16) is movably connected to the base (57). A sliding block (56) is fixedly connected to the top of the base (57). One side of the sliding block (56) is movably connected to the first interlayer plate (61), and the other side of the sliding block (56) is movably connected to the second interlayer plate. A disc (45) is fixedly connected to the top of the sliding block (56). A first serrated plate (58) is fixedly connected to the bottom of the disc (45). A central column (46) is movably connected to the top of the disc (45). A hollow gear (47) is fixedly connected to the surface of the central column (46). A storage slot (48) is fixedly connected to the top of the central column (46).

2. The silicon wafer cleaning and drying system under high-purity nitrogen atmosphere according to claim 1, characterized in that: The second rotating wheel (20) is fixedly connected to the surface of the second rotating shaft (21), and the second rotating shaft (21) is fixedly connected to the surface of the first gear (22). One end of the second rotating shaft (21) passing through the first gear (22) is movably connected to the right plate (13), and the first gear (22) is located between the second rotating shaft (21) and the right plate (13). The surface of the first gear (22) is movably connected to the conveyor belt (23), and the first gear (22) is connected to the second gear (24) and the third gear (27) through the conveyor belt (23). The second gear (24) is fixedly connected to the third gear (27). The third rotating shaft (25) is movably connected to the right plate (13) at one end, which passes through the second gear (24). The other end of the third rotating shaft (25) is fixedly connected to the first conical tooth (26). The surface of the third rotating shaft (25) is movably connected to the support column (31). The bottom of the support column (31) is fixedly connected to the support frame (30). The bottom of the support frame (30) is fixedly connected to the right plate (13). The third gear (27) is fixedly connected to the surface of the fourth rotating shaft (28). The fourth rotating shaft (28) is movably connected to the right plate (13) at one end, which passes through the third gear (27).

3. The silicon wafer cleaning and drying system under a high-purity nitrogen atmosphere according to claim 2, characterized in that: The surface of the central column (46) is fixedly connected to the side wing (49), and the side wing (49) is located above the hollow gear (47). A sliding groove (53) is provided on the upper surface of the side wing (49). A card plate (50) is slidably connected to the surface of the sliding groove (53). A spring (55) is fixedly connected to one side of the bottom of the card plate (50). The card plate (50) is fixedly connected to the side wing (49) through the spring (55). An elastic rope (54) is fixedly connected to the other side of the bottom of the card plate (50). The side of the elastic rope (54) away from the card plate (50) is fixedly connected to the side wing (49). A fixing block (51) is fixedly connected to the top of one side of the card plate (50). A fixing clip (52) is fixedly connected to the end of the fixing block (51) away from the card plate (50).

4. The silicon wafer cleaning and drying system under high-purity nitrogen atmosphere according to claim 1, characterized in that: The bottom of one side of the connecting block (35) is movably connected to the first pipe (59), and the other end of the first pipe (59) is fixedly connected to the second pipe (60). The end of the second pipe (60) away from the first pipe (59) is fixedly connected to the third pipe (75). One end of the third pipe (75) is fixedly connected to the water inlet column (74). The end of the water inlet column (74) away from the third pipe (75) is fixedly connected to the reagent tank (151). The inside of the water inlet column (74) is movably connected to the locking mechanism (73), and the locking mechanism (73) can move left and right inside the water inlet column (74). The surface of the locking mechanism (73) is fixedly connected to the connecting column (72), and there are a total of two connecting columns (72).

5. A silicon wafer cleaning and drying system under high-purity nitrogen atmosphere according to claim 4, characterized in that: The first interlayer plate (61) has a slot inside. A sixth rotating shaft (62) is movably connected to one side of the first interlayer plate (61). A fifth gear (63) is fixedly connected to the side of the sixth rotating shaft (62) that passes through the first interlayer plate (61), and the fifth gear (63) is located at the slot. There are a total of four fifth gears (63). A third rotating wheel (64) is fixedly connected to the other side of the sixth rotating shaft (62). A third connecting post (65) is fixedly connected to the side of the third rotating wheel (64) away from the sixth rotating shaft (62). The third rotating wheel (64) passes through the third connecting post (65). 5) Fixedly connected to the fourth clamping plate (66), a movable buckle (67) is fixedly connected to one side of the top of the fourth clamping plate (66), a fifth clamping plate (68) is movably connected to the surface of the movable buckle (67), a movable plate (69) is fixedly connected to one side of the top of the fifth clamping plate (68), a U-shaped groove (70) is opened inside the movable plate (69), a second fixed post (71) is movably connected to the surface of the U-shaped groove (70), one side of the second fixed post (71) is fixedly connected to the left plate (12), and a connecting post (72) is fixedly connected to the side of the movable plate (69) away from the fifth clamping plate (68).

6. The silicon wafer cleaning and drying system under a high-purity nitrogen atmosphere according to claim 1, characterized in that: The bottom of the left plate (12) is connected to the third fixing post (78) on the side near the right plate (13). There are two third fixing posts (78). The left plate (12) is fixedly connected to the second sawtooth plate (77) through the third fixing post (78). The bottom of the right plate (13) is fixedly connected to the fourth fixing post (79) on the side near the left plate (12). There are two fourth fixing posts (79). The right plate (13) is fixedly connected to the third sawtooth plate (80) through the fourth fixing post (79). Both the second sawtooth plate (77) and the third sawtooth plate (80) are meshed with the hollow gear (47).

7. The operating process of a silicon wafer cleaning and drying system under a high-purity nitrogen environment according to claim 6 includes the following operating steps: Step 1, placing the silicon wafer: open the two side clamps (52), so that the bottom plate (50) moves the elastic rope (54) and spring (55) backward, and put the silicon wafer into the storage slot (48). The elastic rope (54) and spring (55) are squeezed, so that the clamps (52) stably hold the silicon wafer on both sides. The second step is to measure the cleaning fluid: the base (57) moves with the conveyor (16), which drives the first serrated plate (58) at the bottom of the base (57) to move. The first serrated plate (58) moves to the fifth gear (63) and drives the fifth gear (63) to rotate. The fifth gear (63) drives the third rotating wheel (64) to rotate through the sixth rotating shaft (62). The third rotating wheel (64) drives the fourth clamping plate (66) to rotate through the third connecting column (65) located on it. The rotation of the fourth clamping plate (66) pushes the fifth clamping plate (68) to move upward. The fifth clamping plate (68) drives the moving plate (69) to move to the right. The moving plate (69) pushes the connecting column (72) to move. The connecting column (72) pushes the lock (73) to move to one side, so that the liquid in the water inlet column (74) flows out. Similarly, when the disc (45) moves forward, the lock (73) can be pushed in the opposite direction, so that the liquid in the water inlet column (74) cannot flow out. The third step is silicon wafer rotation: the base (57) moves and drives the disc (45) on the sliding block (56) to move. A hollow gear (47) is fixed on the disc (45). When the disc (45) moves forward, the hollow gear (47) touches the third sawtooth plate (80) and the second sawtooth plate (77) located on both sides inside the cleaning machine, so that the hollow gear (47) drives the disc (45) to rotate. Fourth step, the cleaning device swings: When the transmission device (16) is running, it drives the first rotating wheel (18) on the right side to rotate. The first rotating wheel (18) drives the second rotating shaft (21) to rotate through the belt (19), thereby causing the conveyor belt (23) located on the second rotating shaft (21) to rotate. The conveyor belt (23) drives the first conical tooth (26) on the third rotating shaft (25) to rotate through the second gear (24). The first conical tooth (26) drives the threaded column (41) on the fifth rotating shaft (40) to rotate through the third conical tooth (44), causing the helical gear (39) meshing with the threaded column (41) to rotate, allowing the connecting block (35) to swing up and down based on the fixed plate (2); Fifth step, silicon wafer cleaning: The liquid in the water column (74) passes through the third pipe (75), then through the second pipe (60), and finally flows into the interior of the connecting block (35) from the first pipe (59). It enters the interior of the connecting block (42) through several small holes on the fifth rotating shaft (40) and is sprayed by the nozzle (43).

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