An automatic feeding and testing device and method for optical waveguide chips

Abstract

This invention discloses an automatic loading and testing device for optical waveguide chips, comprising a bottom horizontal plate. A front-to-back moving mechanism is installed below the bottom horizontal plate, and the front-to-back moving mechanism is located in a mounting groove formed on the ground below the bottom horizontal plate and extending front-to-back. The top surface of the moving block of the front-to-back moving mechanism is fixed to the bottom surface of the bottom horizontal plate. It can automatically place optical waveguide chips on the loading rack onto the top surface of a metal testing platform for automatic testing, and automatically unload the optical waveguide chips tested on the metal testing platform onto the unloading rack. It can realize continuous loading, testing and unloading, greatly improving the automated connection testing effect, increasing testing efficiency and reducing manual labor.

Description

Technical Field

[0001] This invention relates to the field of optical waveguide chip product testing technology, and more specifically to an automatic feeding and testing device and method for optical waveguide chips. Background Technology

[0002] In the development of planar optical waveguide devices, chip testing is an extremely critical technical step, holding the same importance as design and fabrication. Therefore, obtaining accurate and rapid test results for optical waveguide chips is of great significance for determining their performance. Currently, the traditional testing process for optical waveguide chips involves manual loading to fix the chip on the test stage; then, automated performance testing of the chip is performed using a laser and power meter on a six-axis fiber-coupled displacement stage; finally, the tested chip is manually unloaded.

[0003] The main shortcomings of this operating procedure are the low testing efficiency during manual loading and unloading, and the fact that the test results can change due to human factors, leading to errors in the test results of the optical waveguide chip. Summary of the Invention:

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide an automatic feeding and testing device for optical waveguide chips. It can automatically place optical waveguide chips on the feeding rack onto the top surface of the metal testing platform for automatic testing, and automatically unload the tested optical waveguide chips from the metal testing platform onto the unloading rack. It can realize continuous feeding, testing and unloading, greatly improve the effect of automated connection testing, increase testing efficiency and reduce manual labor.

[0005] The solution of the present invention to the aforementioned technical problem is:

[0006] An automatic feeding and testing device for optical waveguide chips includes a bottom horizontal plate. A front-to-back moving mechanism is installed below the bottom horizontal plate. The front-to-back moving mechanism is located in a mounting groove formed on the ground below the bottom horizontal plate and extends front-to-back. The top surface of the moving block of the front-to-back moving mechanism is fixed to the bottom surface of the bottom horizontal plate.

[0007] A metal test platform is fixed to the middle of the top surface of the bottom horizontal plate, and clamping cylinders are fixed to the front and rear of the top surface of the metal test platform.

[0008] Support frames are fixed on the ground-fixed connecting plates on the left and right sides of the top surface of the bottom horizontal plate. A double-output shaft pusher cylinder is fixed on the top of the left support frame. The same push block is fixed on the two push rods of the double-output shaft pusher cylinder. A rear connecting plate is fixed on the ground behind the bottom horizontal plate. Vertical lifting mechanisms are fixed on the left and right sides of the top surface of the rear connecting plate. An upper feeding frame is fixed on the lifting block of the left vertical lifting mechanism, and an lower feeding frame is fixed on the lifting block of the right vertical lifting mechanism. The upper feeding frame and the lower feeding frame are located on the left and right sides of the metal testing platform. Multiple partitions are fixed on the upper feeding frame, and a discharge cavity is formed between adjacent partitions. Multiple transverse partitions are fixed on the lower feeding frame, and a rear placement cavity is formed between adjacent transverse partitions. The bottom surfaces of the discharge cavity and the rear placement cavity correspond to the top surface of the metal testing platform.

[0009] A dual-output shaft material-picking cylinder is fixed to the top of the right support frame. The two push rods of the dual-output shaft material-picking cylinder are fixedly connected to suction cups by bolts, and the suction cups face the unloading frame.

[0010] The bottom surface of the left and right sides of the bottom horizontal plate has sliders, and the ground below the left and right sides of the bottom horizontal plate has guide rail grooves that extend forward and backward. The guide rails are fixed on the bottom surface of the guide rail grooves, and the upper part of the guide rails is inserted into the guide grooves that extend forward and backward in the middle of the bottom surface of the corresponding sliders.

[0011] A testing method for an automated loading and testing device for optical waveguide chips includes the following steps:

[0012] (1) Place the optical waveguide chips to be tested one by one into the feeding cavity corresponding to the loading rack; at this time, the loading rack is in its original position, that is, the top surface of the metal test platform and the bottom surface of the feeding cavity at the top of the loading rack are on the same horizontal line, and the bottom surface of the rear placement cavity at the top of the unloading rack is on the same horizontal line as the top surface of the metal test platform. At this time, the loading is completed.

[0013] (2) The push rod of the dual-output shaft pusher cylinder pushes the push bar to move horizontally to the right and contact the left side wall of the top optical waveguide chip, applying a rightward force to it, so that it is successfully pushed to the top surface of the metal test platform. It blocks the top of the two proximity switches on the top surface of the metal test platform. The proximity switches detect the chip and send its signal to the control host. After the control host receives the signal, it proves that the optical waveguide chip has reached the top surface of the metal test platform, thus realizing the feeding.

[0014] (3) The metal test platform is moved forward and away from the loading rack and unloading rack by the operation of the forward and backward moving mechanism; a six-axis fiber-coupled displacement stage is installed on the ground outside the loading rack and unloading rack, and the laser and power meter installed on the two six-axis fiber-coupled displacement stages perform performance tests on the optical waveguide chip.

[0015] (4) After the test is completed, the forward and backward moving mechanism runs, moving the metal test platform back to its original position. Then, the push rod of the dual-axis pick-up cylinder on the right side pushes the suction cup through the rear placement cavity of the unloading rack and presses against the right side wall of the optical waveguide chip to adsorb it. The push rod of the dual-axis pick-up cylinder retracts, moving the tested optical waveguide chip to the right into the corresponding rear placement cavity. The suction pump connected to the suction cup stops suctioning. At this time, the suction cup just moves out of the rear placement cavity of the unloading rack, and the optical waveguide chip is in the rear placement cavity, completing the unloading.

[0016] (5) By operating two vertical lifting mechanisms simultaneously, the loading rack and unloading rack are raised to one position at the same time, so that the bottom surface of the second unloading chamber above is on the same horizontal line as the top surface of the metal test bench, and the bottom surface of the second rear placement chamber above is on the same horizontal line as the top surface of the metal test bench.

[0017] (6) Repeat steps (2) to (4) to complete the detection and unloading of the second optical waveguide chip; repeat this process in sequence to complete the detection of all optical waveguide chips.

[0018] (7) After the test is completed, remove all optical waveguide chips to complete the test.

[0019] The outstanding effects of this invention are:

[0020] It can automatically place the optical waveguide chips on the loading rack onto the top surface of the metal testing station for automatic testing, and automatically unload the optical waveguide chips that have been tested on the metal testing station onto the unloading rack. It can realize continuous loading, testing and unloading functions, which greatly improves the effect of automated connection testing, increases testing efficiency and reduces manual labor.

[0021] During the automatic loading and unloading process, the forward and backward moving mechanism and the vertical lifting mechanism work together, both of which use electric slides, ensuring high operating precision and enabling accurate loading and unloading of optical waveguide chips.

[0022] The loading and unloading racks adopt a vertical stacked structure, which saves storage space and avoids damage caused by the pressure and friction of multiple optical waveguide chips being directly in contact with each other, making it easier to manage and store multiple chips. Attached image description:

[0023] Figure 1 This is a partial structural schematic diagram of the present invention;

[0024] Figure 2 This is a partial structural diagram of the metal testing stage of the present invention;

[0025] Figure 3 This is a schematic diagram of the angle-changing partial structure of the metal test stage of the present invention;

[0026] Figure 4 This is a partial structural diagram of the bottom at the bottom horizontal plate.

[0027] Figure 5 This is a partial structural diagram of the bottom horizontal plate and the forward and backward moving mechanism. Detailed implementation method:

[0028] For example, see below. Figures 1 to 5 As shown, an automatic feeding and testing device for optical waveguide chips includes a bottom horizontal plate 10. A front-to-back moving mechanism 20 is installed below the bottom horizontal plate 10. The front-to-back moving mechanism 20 is located in an installation groove formed on the ground below the bottom horizontal plate 10 and extends front-to-back. The top surface of the moving block 21 of the front-to-back moving mechanism 20 is fixed on the bottom surface of the bottom horizontal plate 10.

[0029] A metal test platform 30 is fixed in the middle of the top surface of the bottom horizontal plate 10. Clamping cylinders 31 are fixed in the front and rear of the top surface of the metal test platform 30. The clamping cylinder 31 is a double push rod cylinder, and the ends of its two push rods are fixed to the same end clamping block 311.

[0030] Support frames 40 are fixed on the ground-fixed connecting plates on the left and right sides of the top surface of the bottom horizontal plate 10. A double-outlet pusher cylinder 41 is fixed on the top of the left support frame 40. The same push block 411 is fixed on the two push rods of the double-outlet pusher cylinder 41. A rear connecting plate is fixed on the ground behind the bottom horizontal plate 10. Vertical lifting mechanisms 50 are fixed on the left and right sides of the top surface of the rear connecting plate. A loading rack 60 is fixed on the lifting block 51 of the left vertical lifting mechanism 50. A unloading rack 70 is fixed on the lifting block 51 of the right vertical lifting mechanism 50. The loading rack 60 and the unloading rack 70 are located on the left and right sides of the metal testing platform 30. Multiple partitions 61 are fixed on the loading rack 60. A discharge cavity is formed between adjacent partitions 61. Multiple transverse partitions 71 are fixed on the unloading rack 70. A rear placement cavity is formed between adjacent transverse partitions 71. The bottom surfaces of the discharge cavity and the rear placement cavity correspond to the top surface of the metal testing platform 30.

[0031] A dual-output shaft material-picking cylinder 42 is fixed to the top of the right-side support frame 40. The ends of the two push rods of the dual-output shaft material-picking cylinder 42 are fixedly connected to suction cups 43 by bolts. The suction cups 43 face the unloading frame 70. A groove is formed in the middle of the inner wall of the suction cup 43, and multiple suction holes are formed on the inner end face of the groove. The air outlet of the suction cup 43 is connected to the suction pump of the pneumatic system through a connecting pipe to realize air suction.

[0032] The forward and backward moving mechanism 20 is a horizontally arranged electric slide, and the vertical lifting mechanism 50 is a vertically arranged electric slide. These are conventional structures and will not be described in detail here.

[0033] In this embodiment, the bottom horizontal plate 10 can be moved back and forth by the operation of the forward and backward moving mechanism 20, which in turn enables the metal test platform 30 to move back and forth.

[0034] The vertical lifting mechanism 50 can adjust the height of the loading rack 60 or the unloading rack 70.

[0035] Furthermore, the bottom surface of the left and right sides of the bottom horizontal plate 10 has sliders 1, and the ground below the left and right sides of the bottom horizontal plate 10 has guide rail grooves extending forward and backward. The guide rails are fixed to the bottom surface of the guide rail grooves, and the upper part of the guide rails is inserted into the guide grooves that extend forward and backward in the middle of the bottom surface of the corresponding sliders 1. The guide rails can ensure the stable forward and backward movement of the bottom horizontal plate 10.

[0036] Furthermore, the front and rear of the top surface of the metal test platform 30 are both formed with screw holes, and the proximity switch 2 is screwed into the corresponding screw holes. The top of the proximity switch 2 does not extend beyond the top of the screw hole, and the proximity switch 2 is close to the end of the push rod of the corresponding clamping cylinder 31.

[0037] Furthermore, multiple elastic conical blocks 412 are fixed to the right side wall of the push block 411, and the right end of all the elastic conical blocks 412 is fixed to the same push bar 413.

[0038] The proximity switch 2 and the control valves and air pumps related to the pneumatic system are all electrically connected to the control host via electrical connection lines and are controlled by the control host. The pneumatic system and other components are of conventional structure and will not be described in detail here.

[0039] A testing method for an automated loading and testing device for optical waveguide chips includes the following steps:

[0040] (1) Place the optical waveguide chips to be tested one by one into the corresponding feeding chambers of the loading rack 60; at this time, the loading rack 60 is in its original position, that is, the top surface of the metal test stage 30 and the bottom surface of the top feeding chamber of the loading rack 60 are on the same horizontal line, and the bottom surface of the top rear placement chamber of the unloading rack 70 is on the same horizontal line as the top surface of the metal test stage 30. At this time, the loading is completed.

[0041] (2) The push rod of the dual-output shaft pusher cylinder 41 pushes the push bar 413 to move horizontally to the right and contact the left side wall of the top optical waveguide chip, applying a rightward force to it, so that it is successfully pushed to the top surface of the metal test platform 30. It blocks the top of the two proximity switches 2 on the top surface of the metal test platform 30. The proximity switches 2 detect the chip and send its signal to the control host. After the control host receives the signal, it proves that the optical waveguide chip has reached the top surface of the metal test platform 30, thus realizing the feeding.

[0042] (3) The metal test stage 30 is moved forward and away from the loading rack 60 and unloading rack 70 by the operation of the forward and backward moving mechanism 20. A six-axis fiber-coupled displacement stage 100 is installed on the ground outside the loading rack 60 and unloading rack 70. The laser and power meter installed on the two six-axis fiber-coupled displacement stages 100 perform performance tests on the optical waveguide chip.

[0043] (4) After the test is completed, the forward and backward moving mechanism 20 runs, moves the metal test platform 30 back to its original position, and then pushes the push rod of the dual-axis pick-up cylinder 41 on the right side, so that the suction cup 43 passes through the rear placement cavity of the unloading rack 70 and presses against the right side wall of the optical waveguide chip, adsorbing it. The push rod of the dual-axis pick-up cylinder 41 retracts, and moves the tested optical waveguide chip to the right into the corresponding rear placement cavity. The suction pump connected to the suction cup 43 stops suctioning. At this time, the suction cup 43 just moves out of the rear placement cavity of the unloading rack 70, and the optical waveguide chip is in the rear placement cavity, completing the unloading.

[0044] (5) By operating the two vertical lifting mechanisms 20 simultaneously, the loading rack 60 and the unloading rack 70 are raised to one position at the same time, so that the bottom surface of the second unloading chamber above is on the same horizontal line as the top surface of the metal test bench 30, and the bottom surface of the second rear placement chamber above is on the same horizontal line as the top surface of the metal test bench 30.

[0045] (6) Repeat steps (2) to (4) to complete the detection and unloading of the second optical waveguide chip; repeat this process in sequence to complete the detection of all optical waveguide chips.

[0046] (7) After the test is completed, remove all optical waveguide chips to complete the test.

[0047] After the material is loaded in step (2), the optical waveguide chip is clamped between the two end clamping blocks 311 by pushing the push rods of the two clamping cylinders 31.

[0048] A six-axis fiber-coupled displacement stage 100 is used to adjust the position of the left and right optical fibers so that the fiber channel is aligned with the channel of the optical waveguide chip during testing. The laser connected to the left fiber and the power meter connected to the right fiber are used for light transmission and power measurement during testing, respectively. During the fiber zeroing step and the optical waveguide chip performance testing step, a laser of a certain wavelength and power is emitted by the laser and transmitted to the left fiber. The power meter connected to the right fiber measures the optical power of the transmitted laser. The laser and power meter are electrically connected to the control host via electrical connection cables. The control host obtains a series of performance parameters of the optical waveguide chip by using the laser emitted by the laser and the optical power measured by the power meter.

[0049] The performance testing of optical waveguide chips mainly includes the following steps:

[0050] 1. Adjust the fiber position by adjusting the six-axis fiber coupling displacement stage 100 to align the end faces of the fiber channels at both ends, facilitating the recording of fiber zeroing data. The zeroing method involves first inputting a laser of a certain wavelength and power into the left fiber using a laser, and then recording the corresponding optical power using a power meter connected to the right fiber. This allows recording the fiber optical loss before testing the optical waveguide chip. During testing, the received optical power after passing through the optical waveguide chip represents a secondary loss under the original optical loss conditions. This method more accurately reflects the insertion loss of the optical waveguide chip device.

[0051] 2. To ensure maximum alignment and optimal coupling efficiency between the optical fiber and the optical waveguide chip, a dynamic six-axis fiber coupling displacement stage 100 is used, adjusting its left-right and front-back positions (X-axis and Y-axis directions) based on real-time data collected by the optical power meter. This ensures the measured optical power is at its peak. An optimized hill-climbing algorithm is employed to find the peak power. Specifically, the optical fiber moves from the starting point in the positive direction, moving a fixed distance each step. The power change between consecutive steps is compared. If the power continuously increases, the direction is correct. As the fiber continues forward, it passes the point of maximum power along the path, and the power decreases. After several decreases, the location sought in this scan is confirmed. If the power does not increase after moving a certain distance, the fiber is moved in the negative direction to continue searching until the maximum value is found. To prevent the peak value from getting trapped in local maxima, an iterative algorithm is used to find the global maximum value. Once the maximum value is found, the positions of the left and right sides of the six-axis fiber coupling displacement stage 100 at that moment are recorded.

[0052] 3. After finding the location of the maximum peak power, connect the optical fiber on the left side of the optical waveguide chip to the laser, send a scanning command to the laser to perform scanning, and at the same time, the power is measured by the fiber optic power meter on the right side of the optical waveguide chip, and the power value is recorded and saved by the software.

[0053] 4. Plot the scanned data into graphs, perform calculations and analyses according to the chip's optical performance indicators, and display the results in a list format, mainly including center wavelength, wavelength accuracy, 1dB bandwidth, 3dB bandwidth, 20dB bandwidth, insertion loss, flatness, insertion loss uniformity, crosstalk between adjacent channels, crosstalk between non-adjacent channels, polarization-dependent loss, etc.

[0054] The performance testing method is structured the same as the existing method, so it will not be described in detail here.

[0055] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An automatic feeding and testing device for optical waveguide chips, comprising a bottom horizontal plate (10), characterized in that: A front-to-back moving mechanism (20) is installed below the bottom horizontal plate (10). The front-to-back moving mechanism (20) is located in a mounting groove formed on the ground below the bottom horizontal plate (10) and extends front-to-back. The top surface of the moving block (21) of the front-to-back moving mechanism (20) is fixed on the bottom surface of the bottom horizontal plate (10). A metal test platform (30) is fixed in the middle of the top surface of the bottom horizontal plate (10), and clamping cylinders (31) are fixed in the front and rear of the top surface of the metal test platform (30). Support frames (40) are fixed on the connecting plates on the left and right sides of the top surface of the bottom horizontal plate (10). A double-shaft pusher cylinder (41) is fixed on the top of the left support frame (40). The same push block (411) is fixed on the two push rods of the double-shaft pusher cylinder (41). A rear connecting plate is fixed on the ground behind the bottom horizontal plate (10). A vertical lifting mechanism (50) is fixed on the left and right sides of the top surface of the rear connecting plate. A feeding device is fixed on the lifting block (51) of the left vertical lifting mechanism (50). The frame (60) has a lifting block (51) fixed on the right side of the vertical lifting mechanism (50) with a material unloading frame (70). The material loading frame (60) and the material unloading frame (70) are located on the left and right sides of the metal test bench (30). Multiple partitions (61) are fixed on the material loading frame (60), and a material discharge cavity is formed between adjacent partitions (61). Multiple horizontal partitions (71) are fixed on the material unloading frame (70), and a rear placement cavity is formed between adjacent horizontal partitions (71). The bottom surfaces of the material discharge cavity and the rear placement cavity correspond to the top surface of the metal test bench (30). The top of the support frame (40) on the right side is fixed with a double-output shaft picking cylinder (42). The ends of the two push rods of the double-output shaft picking cylinder (42) are fixedly connected to a suction cup (43) by bolts. The suction cup (43) faces the unloading frame (70).

2. The automatic feeding and testing device for optical waveguide chips according to claim 1, characterized in that: The forward and backward moving mechanism (20) is a horizontally arranged electric slide, and the vertical lifting mechanism (50) is a vertically arranged electric slide.

3. The automatic feeding and testing device for optical waveguide chips according to claim 1, characterized in that: The bottom surfaces of the left and right sides of the bottom horizontal plate (10) have sliders (1), and the ground below the left and right sides of the bottom horizontal plate (10) has guide rail grooves extending forward and backward. The guide rails are fixed on the bottom surface of the guide rail grooves, and the upper part of the guide rails is inserted into the guide groove formed in the middle of the bottom surface of the corresponding slider (1) and extends forward and backward.

4. The automatic feeding and testing device for optical waveguide chips according to claim 1, characterized in that: The metal test bench (30) has screw holes formed on the front and rear of its top surface. The proximity switch (2) is screwed into the corresponding screw hole. The top of the proximity switch (2) does not extend beyond the top of the screw hole. The proximity switch (2) is close to the push rod end of the corresponding clamping cylinder (31).

5. The automatic feeding and testing device for optical waveguide chips according to claim 1, characterized in that: Multiple elastic conical blocks (412) are fixed on the right side wall of the push block (411), and the same push bar (413) is fixed to the right end of all elastic conical blocks (412).

6. A testing method for an automatic loading and testing device for optical waveguide chips according to any one of claims 1 to 5, characterized in that: It includes the following steps: (1) Place the optical waveguide chips to be tested one by one into the corresponding feeding cavity of the loading rack (60); at this time, the loading rack (60) is in its original position, that is, the top surface of the metal test stage (30) and the bottom surface of the feeding cavity at the top of the loading rack (60) are on the same horizontal line, and the bottom surface of the rear placement cavity at the top of the unloading rack (70) and the top surface of the metal test stage (30) are on the same horizontal line. At this time, the loading is completed. (2) The push rod of the double-outlet pusher cylinder (41) pushes the same push block (411) on the two push rods of the double-outlet pusher cylinder (41). Multiple elastic cone blocks (412) are fixed on the right side wall of the push block (411). The same push bar (413) is fixed on the right end of all elastic cone blocks (412). The push bar (413) moves horizontally to the right and contacts the left side wall of the topmost optical waveguide chip, applying a rightward force to it, so that it is successfully pushed to the top surface of the metal test platform (30). It blocks the top of the two proximity switches (2) on the top surface of the metal test platform (30). The proximity switches (2) detect the chip and send its signal to the control host. After the control host receives the signal, it proves that the optical waveguide chip has reached the top surface of the metal test platform (30), thus realizing the loading. (3) The metal test stage (30) is moved forward and away from the loading rack (60) and unloading rack (70) by the operation of the forward and backward moving mechanism (20); a six-axis fiber-coupled displacement stage (100) is installed on the ground outside the loading rack (60) and unloading rack (70); the laser and power meter installed on the two six-axis fiber-coupled displacement stages (100) perform performance testing on the optical waveguide chip; (4) After the test is completed, the forward and backward moving mechanism (20) runs, moves the metal test platform (30) back to its original position, and then pushes the push rod of the right-side dual-axis material picking cylinder (41) so that the suction cup (43) passes through the rear placement cavity of the unloading rack (70) and presses against the right side wall of the optical waveguide chip to adsorb it. The push rod of the dual-axis material picking cylinder (41) retracts and moves the tested optical waveguide chip to the right into the corresponding rear placement cavity. The suction pump connected to the suction cup (43) stops suction. At this time, the suction cup (43) just moves out of the rear placement cavity of the unloading rack (70), and the optical waveguide chip is in the rear placement cavity, completing the unloading. (5) By operating two vertical lifting mechanisms (20) simultaneously, the loading rack (60) and unloading rack (70) are simultaneously raised to one position, so that the bottom surface of the second unloading chamber above is on the same horizontal line as the top surface of the metal test bench (30), and the bottom surface of the second rear placement chamber above is on the same horizontal line as the top surface of the metal test bench (30). (6) Repeat steps (2) to (4) to complete the detection and unloading of the second optical waveguide chip; repeat this process in sequence to complete the detection of all optical waveguide chips; (7) After the test is completed, remove all the optical waveguide chips to complete the test.

7. The test method according to claim 6, characterized in that: After the material is loaded in step (2), the optical waveguide chip is clamped between the two end clamping blocks (311) by pushing the push rods of the two clamping cylinders (31).

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