A test apparatus and test system

Abstract

The application discloses a test device and a test system. The test device is provided with a first electronic element for testing a to-be-tested device on one side surface of a first plate body, and a first electric connector for electrically connecting with the to-be-tested device on the other side surface of the first plate body. The test device can be loaded above a preset area of a target electronic element of the to-be-tested device based on the first electric connector. The preset area of the to-be-tested device is provided with the target electronic element and a second electronic element. The height of the first electric connector is greater than the height of the second electronic element, so that a gap is formed between the first plate body and the second electronic element in the preset area. When the to-be-tested device is tested by the test device, the test device can be directly loaded above the preset area based on the gap, and the test device does not collide with the second electronic element. The electric connection between the to-be-tested device and the test device is realized without a soldering wire or other switching structure.

Description

Technical Field

[0001] This application relates to the field of electronic equipment testing devices, and more specifically, to a testing device and a testing system. Background Technology

[0002] With the continuous development of science and technology, more and more electronic devices are being widely used in people's daily lives and work, bringing great convenience to people's daily lives and work, and becoming an indispensable tool for people today.

[0003] To ensure the normal operation of electronic devices, it is necessary to use the electronic devices as test devices and test them to measure the operating parameters of the electronic components. Based on these operating parameters, the performance of the electronic devices can be determined.

[0004] In the prior art, in order to avoid collisions between the test equipment and the electronic components in the test equipment, the test equipment cannot be directly loaded onto the electronic equipment for testing. The test equipment needs to be placed on the same plane as the device under test, and the electrical connection between the device under test and the test equipment needs to be achieved through bonding wires or other adapter structures, which is inconvenient to use. Summary of the Invention

[0005] In view of the above, this application provides a testing device and a testing system, the solution of which is as follows:

[0006] A testing device, comprising:

[0007] A first plate having opposing first and second surfaces;

[0008] The first electronic component is disposed on the first surface;

[0009] A first electrical connector is disposed on the second surface. The first electrical connector is used to carry the first board body to be loaded onto a preset area of ​​the device under test, so as to replace the target electronic component in the preset area to perform a test on the device under test. The preset area is provided with a target electronic component and a second electronic component placed around the target electronic component.

[0010] The first electrical connector has a first height, and the second electronic component has a second height. The first height is greater than the second height, so that when the test equipment is loaded above the preset area, there is a gap between the first plate and the second electronic component.

[0011] Optionally, in the above-mentioned testing equipment, the first electrical connector has a pad and a conductive pad fixed on the side of the pad away from the first plate, so that the first electrical connector has a first height.

[0012] Optionally, in the above-mentioned test equipment, the first electrical connector includes an input terminal and an output terminal;

[0013] The distance between the input and output terminals is adapted to the distance between the input and output pins of the target electronic component, so that the test equipment can replace the target electronic component and make electrical connections with the device under test.

[0014] Optionally, the above-mentioned testing equipment also includes: a cover, which forms a shielding space with the first plate to prevent the first electronic component from being subjected to electromagnetic interference;

[0015] The first surface is also provided with an output port located outside the cover to output the electrical parameters collected by the test equipment to the external testing equipment.

[0016] Optionally, in the above-mentioned test equipment, the target electronic component is a target power inductor; when the test equipment is loaded above the preset area, it is used to replace the target power inductor in order to test the electrical parameters of the power chip connected to the target power inductor.

[0017] Optionally, in the above-mentioned testing equipment, the first electronic component includes:

[0018] Sampling resistor;

[0019] The power inductor is calibrated by connecting one end to the input terminal and the other end to the output terminal through a sampling resistor.

[0020] The first surface is provided with an output port connected to the sampling resistor to output the electrical parameters collected by the test equipment to the external testing equipment.

[0021] Optionally, in the above-mentioned test equipment, the sampling resistor includes multiple resistive elements;

[0022] Among them, the first sampling resistor obtained based on the combination of multiple resistive elements can be adapted to the output parameters of the power supply chip;

[0023] Alternatively, the sampling resistor is an adjustable resistor, wherein the second sampling resistor obtained based on the adjustable resistor can be adapted to the output parameters of the power supply chip.

[0024] This application also provides a testing system, including:

[0025] The first test device includes: a first plate having opposing first and second surfaces; a first electronic component disposed on the first surface; and a first electrical connector disposed on the second surface.

[0026] The device under test includes a first preset area, in which a first target electronic component and a second electronic component are placed around the first target electronic component.

[0027] The first electrical connector is used to carry the first board body and load it onto the first preset area of ​​the device under test, so as to replace the first target electronic component in the first preset area to perform testing on the device under test; the first electrical connector has a first height and the second electronic component has a second height, the first height being greater than the second height, so that when the test device is loaded onto the first preset area, there is a gap between the first board body and the second electronic component.

[0028] Optionally, in the above testing system,

[0029] The device under test includes a second preset area, and a second target electronic component is disposed in the second preset area;

[0030] The testing system also includes a second testing device, which includes: a second board having opposing third and fourth surfaces; a fourth electronic component disposed on the third surface; and a second electrical connector disposed on the fourth surface.

[0031] The second electrical connector is used to carry the second board body and load it onto the second preset area of ​​the device under test, so as to replace the second target electronic component in the second preset area to perform testing on the device under test;

[0032] The first distance between the input and output ends of the first electrical connector is adapted to the distance between the input pin and the output pin of the first target electronic component, and the second distance between the input and output ends of the second electrical connector is adapted to the distance between the input pin and the output pin of the second target electronic component. The first distance and the second distance are different.

[0033] Optionally, in the above testing system, the first surface is also provided with a first output port to output the electrical parameters collected by the first testing device to an external testing device;

[0034] The third surface is also provided with a second output port to output the electrical parameters collected by the second test device to an external testing device for simultaneous testing of the device under test.

[0035] As described above, the present application provides a testing device and a testing system. A first electronic component for testing the device under test is disposed on one side surface of a first board, and a first electrical connector for electrical connection with the device under test is disposed on the other side surface of the first board. Based on the first electrical connector, the testing device can be loaded onto a preset area corresponding to the target electronic component of the device under test to replace the target electronic component in the preset area for testing. The device under test also includes a second electronic component, and the height of the first electrical connector is greater than the height of the second electronic component. Because the height of the first electrical connector is greater than the height of the second electronic component, a gap is created between the second surface of the first board and the second electronic component in the preset area. When testing the device under test, based on this gap, the testing device can be directly loaded onto the preset area without colliding with the second electronic component. No soldering wires or other adapter structures are needed to achieve electrical connection between the device under test and the testing device, facilitating testing of the device under test. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0037] The structures, proportions, sizes, etc., shown in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this application can produce, should still fall within the scope of the technical content disclosed in this application.

[0038] Figure 1 This is a schematic diagram of the structure of a testing device provided in an embodiment of this application;

[0039] Figure 2 This is a schematic diagram of the structure of a device under test provided in an embodiment of this application;

[0040] Figure 3 For based on Figure 1 The test equipment shown Figure 2 The diagram shows the principle of testing the device under test.

[0041] Figure 4 This is a schematic diagram of another testing device provided in an embodiment of this application;

[0042] Figure 5 This is a schematic diagram of the structure of another testing device provided in an embodiment of this application;

[0043] Figure 6 A top view of a device under test provided in an embodiment of this application;

[0044] Figure 7 A top view of a testing device facing a first surface, provided in an embodiment of this application;

[0045] Figure 8 A top view of a testing device facing a second surface, provided in an embodiment of this application;

[0046] Figure 9 A top view of a testing system provided in an embodiment of this application;

[0047] Figure 10 A top view of another testing system provided in an embodiment of this application. Detailed Implementation

[0048] The embodiments of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0049] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0050] refer to Figures 1-3 As shown, Figure 1 This is a schematic diagram of the structure of a testing device provided in an embodiment of this application. Figure 2 This is a schematic diagram of the structure of a device under test provided in an embodiment of this application. Figure 3 For based on Figure 1 The test equipment shown Figure 2 The diagram shows the principle of testing the device under test. The testing device includes:

[0051] The first plate 10 has a first surface 101 and a second surface 102 opposite to each other;

[0052] The first electronic component 11 is disposed on the first surface 101;

[0053] A first electrical connector 12 is disposed on the second surface 102. The first electrical connector 12 is used to carry the first plate 10 and load it onto a preset area of ​​the device under test 20 to replace the target electronic component 22 in the preset area to perform testing on the device under test. The preset area is provided with the target electronic component 22 and a second electronic component 21 placed around the target electronic component 22. The target electronic component 22 and the second electronic component 21 are different types of electronic components in the device under test 20.

[0054] The first electrical connector 12 has a first height H1, and the second electronic component 21 has a second height H2. The first height H1 is greater than the second height H2. When the test equipment is loaded above the preset area, a gap 30 is formed between the first plate 10 and the second electronic component 21.

[0055] In the testing equipment provided in this application embodiment, a first electrical connector 12 for electrical connection with the device under test 20 is provided on one side surface of the first plate 10 (i.e., the second surface 102 mentioned above). Based on the first electrical connector 12, the testing equipment can be loaded above a preset area corresponding to the target electronic component 22 of the device under test 20. The height of the first electrical connector 12 is set to be greater than the height of the second electronic component 21, so that there is a gap 30 between the second surface 102 of the first plate 10 and the second electronic component 21 in the preset area. When the device under test 20 is tested by the testing equipment, based on the gap 30, the testing equipment can be directly loaded above the preset area without colliding with the second electronic component 21. The electrical connection between the device under test 20 and the testing equipment is realized through the first electrical connector, which facilitates the testing of the device under test 20. At the same time, the above-mentioned testing equipment can be reused, which greatly reduces the testing cost compared with the prior art.

[0056] In this embodiment of the application, when testing the device under test 20 with the testing equipment, the target electronic component 22 in the device under test 20 needs to be removed so that the target electronic component 22 can be replaced by the testing equipment and electrically connected to the device under test 20.

[0057] refer to Figure 4 As shown, Figure 4 This is a schematic diagram of another testing device provided in an embodiment of this application. Based on the above method, combined with... Figure 1 , Figure 2 and Figure 4 As shown, the first electrical connector 12 has a pad 13 and a conductive pad 14 fixed to the side of the pad 13 away from the first plate 10, so that the first electrical connector has the first height H1.

[0058] exist Figure 4In the manner shown, a conductive pad 14 is provided on the surface of the pad 13. By setting the height of the conductive pad 14, the first electrical connector 14 can have the required first height H1.

[0059] Optionally, the first electrical connector 12 includes an input terminal 121 and an output terminal 122. The distance between the input terminal 121 and the output terminal 122 is adapted to the distance between the input pin 221 and the output pin 222 of the target electronic component 22, so as to facilitate the test equipment to replace the target electronic component 22 and electrically connect it to the device under test 20.

[0060] It can be configured with two first electrical connectors 12, serving as an input terminal 121 and an output terminal 122 respectively. When both first electrical connectors 12 are in operation... Figure 4 When the pads 13 and conductive pads 14 are included, the distance L1 between the two conductive pads 14 is adapted to the distance L2 between the input pin 221 and the output pin 222 of the target electronic component 22. The two conductive pads 14 are used to connect the input pin 221 and the output pin 222 respectively, so that the test equipment can replace the target electronic component 22 and electrically connect it to the device under test 20.

[0061] Optionally, the height of the conductive pad 14 can be in the range of 1mm to 20mm. This height can be set according to requirements, and this embodiment does not limit it.

[0062] The distance L1 between the two conductive pads 14 is adapted to the distance L2 between the input pin 221 and the output pin 222 of the target electronic component 22, meaning that L1 is equal to L2, or L1 is approximately equal to L2. This is so that when the device under test 20 is tested by the test equipment, after the target electronic component 22 is removed, the two conductive pads 14 can be connected to the two electrical connection positions of the device under test 20 for connecting the input pin 221 and the output pin 222, respectively, so that the test equipment replaces the target electronic component 22 and electrically connects to the device under test 20.

[0063] Optionally, in the same first electrical connector 12, the conductive pad 14 is soldered to the conductive surface of the corresponding pad 13 via a solder layer. In the direction of the connection between the two pads 13 ( Figure 4 In the horizontal direction, the width of the pad 13 is greater than the width of the conductive pad 14. Preferably, the width of the pad 13 is not less than 1.5 times the width of the conductive pad 14. Since the width of the pad 13 is greater than the width of the conductive pad 14, the value of L1 can be adjusted based on the soldering position of the conductive pad 14 on the surface of the pad 13 to adapt to preset areas corresponding to different L2 values. In addition, the conductive pad 14 is soldered to the conductive surface of the corresponding pad 13 through a solder layer, and the conductive pad 14 of the required height can be replaced as needed to adapt to the second electronic component 21 with different heights.

[0064] refer to Figure 5 As shown, Figure 5 This is a schematic diagram of another testing device provided in an embodiment of this application, based on any of the above-described implementation methods of the testing device. Figure 5 The test device shown also includes: a cover 15, which forms a shielding space 16 with the first plate 10 to prevent the first electronic component 11 from being subjected to electromagnetic interference; wherein, the first surface 101 is also provided with an output port 17 located outside the cover 15 to output the electrical parameters collected by the test device to an external testing device.

[0065] The cover 15 is a metal shell. The first plate 10 can be provided with a grounding layer. The grounding layer and the cover 15 form an electromagnetic shielding space 16, which can not only prevent external electromagnetic signals from causing electromagnetic interference to the first electronic component 11, but also prevent the first electronic component 11 from causing electromagnetic interference to the electronic components in the device under test 20 below.

[0066] refer to Figure 6 As shown, Figure 6 This is a top view of a device under test (DUT) provided in an embodiment of this application. The DUT 20 provided in this embodiment includes a system-on-a-chip (SoC) 23, which has n power input ports, numbered sequentially from the first power input port D1 to the nth power input port Dn, where n is a positive integer greater than 1. Each power input port is connected to a power supply line. Each power supply line includes a target power inductor 24 and a power chip 25. Within the same power supply line, the power chip 25 provides power to the corresponding power input port through the corresponding target power inductor 24. The power chip 25 can be a buck-boost converter. In different power supply lines, the distance between the input and output pins of the target power inductor 24 can be the same or different.

[0067] In one embodiment of this application, the target electronic component 22 is a target power inductor. When the test equipment is loaded above a preset area, it is used to replace the target power inductor to test the electrical parameters of the power chip 25 connected to the target power inductor. Using the test equipment provided in this application embodiment, the electrical parameters of the power chip 25 in the device under test 20 can be tested, facilitating the verification and debugging of the chip power consumption in the device under test 20. In one embodiment, the electrical parameters can be current parameters, thus allowing an external detection device to detect the current waveform of the device under test to optimize the power consumption level of the test equipment.

[0068] When the target electronic component 22 is a target power inductor, the corresponding test equipment package can be adapted to the target power inductor. The test equipment is compatible with the existing common packaging methods of power inductors. The test equipment is a standardized test module that can support multiple packaging standards and can be adapted to target power inductors with different packaging methods.

[0069] The target power inductor 24 can be a surface mount inductor in any of the following packages: 1210, 1218, 2010, 2512, and 2520. When the target electronic component 22 is the target power inductor 24, each target power inductor 24 corresponds to a preset region. The target power inductors 24 in different preset regions can be the same or different.

[0070] When the target electronic component 22 is a target power inductor, the test equipment is loaded above the preset area corresponding to the target power inductor 24 based on two first electrical connectors 12 adapted to the input and output pins of the target power inductor 24. This raises the height of the test equipment above the preset area, preventing collisions between the test equipment and the second electronic component 21 within the preset area. Furthermore, the aforementioned test equipment is a modular test piece that can be reused, significantly reducing testing costs compared to existing technologies.

[0071] Optionally, the device under test 20 includes a system-on-a-chip (SoC), a type of chip commonly used in electronic devices. As the integration level of SoCs increases, their performance also becomes more powerful, leading to a growing demand for power-saving SoCs. To achieve energy-efficient SoC design, power consumption needs to be verified and debugged using test equipment. The industry practice is to fabricate a separate power consumption board as a test device for SoC power consumption debugging. However, current power consumption boards are large, costly to manufacture, and difficult to design. Furthermore, to avoid collisions between the power consumption board and electronic components on the surface of the device under test 20, they are typically placed on the same plane. The power consumption board needs to be electrically connected to the device under test 20 via soldered wires or other adapter structures (such as connectors), requiring a large test space and making it inconvenient to use.

[0072] The testing equipment provided in this application embodiment can be used to verify and debug the power consumption of system-on-a-chip. Through an integrated structure, a standard and modular testing module is formed as the testing equipment, allowing it to also function as a power consumption board. Furthermore, the aforementioned testing equipment is a modular test component that can be reused, significantly reducing testing costs compared to existing technologies. Additionally, since the height of the first electrical connector 12 is greater than the height of the second electronic component 21, when testing the device under test 20, the testing equipment can be directly loaded above a preset area of ​​the device under test 20. This achieves a relative vertical arrangement between the testing equipment and the device under test 20, enabling three-dimensional testing of the device under test 20, reducing the space occupied during the testing process, and facilitating testing of the device under test 20.

[0073] refer to Figure 7 and Figure 8 As shown, Figure 7 This is a top view of a testing device facing a first surface, provided in an embodiment of this application. Figure 8 This is a top view of a test device provided in an embodiment of the present application, facing the second surface. In the test device provided in any of the above embodiments, the second surface 102 is provided with two first electrical connectors 12, which serve as the output terminal 122 and the input terminal 121 of the test device, respectively.

[0074] The first electronic component 11 includes: a sampling resistor 112; a calibration power inductor 111, one end of which is connected to the input terminal 121 of the test equipment, and the other end of which is connected to the output terminal 122 of the test equipment through the sampling resistor 112; wherein, the first surface 101 is provided with an output port 17 connected to both ends of the sampling resistor 112 to output the electrical parameters collected by the test equipment to an external testing device.

[0075] Output port 17 can be a standard test port for an ADC (analog-to-digital converter). Output port 17 includes at least two pins for connecting to the two ends of sampling resistor 112, respectively. Optionally, a cover 15 can be fixed on the first surface 101, with sampling resistor 112 and calibration power inductor 111 located inside the cover 15, and output port 17 located outside the cover 15.

[0076] The test equipment is a standardized test module including a calibration power inductor 111 and a sampling resistor 112. The resistance value of the sampling resistor 112 is adjustable, so that the test equipment can be adapted to the current required to connect to the power chip 25.

[0077] In the testing equipment, the size of the first plate 10 is larger than the size of the target electronic component 22 in the corresponding preset area. The first surface 101 integrates a sampling resistor 112 and a calibration electronic component that is the same as the target electronic component 22. When the target electronic component 22 is the target power inductor 24, the calibration electronic component is the calibration power inductor 111.

[0078] The testing equipment can be configured with input terminals 121 and output terminals 122 at an appropriate distance based on the corresponding target component 22, and a first electrical connector 12 with an appropriate height based on the height of the second electronic component 21 in a preset area, making the testing equipment suitable for different testing environments. External testing equipment can sample by plugging into the ADC standard test port without affecting the voltage stability or differential traces in the testing system. External testing equipment includes testing instruments that can be directly plugged into the ADC standard test port to obtain sampling data without soldering.

[0079] In one embodiment of this application, such as Figure 7 As shown, the sampling resistor 112 includes multiple resistive elements 18. The combination of these multiple resistive elements 18 ensures that the first sampling resistor is compatible with the output parameters of the power chip 25. For example, a required number of resistive elements 18 can be connected in parallel between the output terminal 122 of the test equipment and the calibration power inductor 111 to serve as the first sampling resistor; the resistance value of the first sampling resistor is compatible with the output parameters of the power chip 25. Based on the output parameters of the connected power chip 25, the resistance value of the sampling resistor 112 connected to the power supply line in the test equipment is set so that the resistance value of the sampling resistor 112 connected to the circuit is compatible with the power supply capability of the power chip 25, thereby ensuring that the test equipment can normally test the electrical parameters of the power chip 25, which can be the voltage and / or current output by the power chip 25.

[0080] In another embodiment of this application, the sampling resistor 112 may include an adjustable resistor, wherein the second sampling resistor obtained based on the adjustable resistor can be adapted to the output parameters of the power chip 25. In this method, the adjustable resistor connected between the output terminal 122 of the test equipment and the calibration power inductor 111 forms the second sampling resistor, so that the resistance value of the sampling resistor 112 connected in the circuit is adapted to the power supply capability of the power chip 25, thereby ensuring that the test equipment can normally test the electrical parameters of the power chip 25, which can be the voltage and / or current output by the power chip 25. The adjustable resistor includes a knob for adjusting the resistance value. In this method, the test equipment can be adapted to power chips 25 with different output parameters.

[0081] The test equipment provided in this application embodiment can be used to sample and test the device under test 20. This eliminates the need for separate, high-cost power consumption boards for each device under test 20. The test equipment is flexibly disassembled and reusable, reducing testing costs and saving product development time and testing expenses. Multiple power supply lines in the device under test 20 can be tested simultaneously to obtain electrical parameters for power consumption analysis. The test equipment can replace the target electronic component 22. When the target electronic component 22 is the target power inductor 24 connected to the power chip 25, replacing the target power inductor 24 with the test equipment connected to the corresponding power supply line does not affect the stability of the output voltage of the power chip 25.

[0082] In another embodiment of this application, a testing system is also provided, which can, as follows: Figure 9 As shown.

[0083] refer to Figure 9 As shown, Figure 9 A top view of a testing system provided in an embodiment of this application, in conjunction with the accompanying drawings of the above embodiments and... Figure 9 As shown, the test system includes:

[0084] The first test device 41 includes: a first plate 10 having a first surface 101 and a second surface 102 opposite to each other; a first electronic component 11 disposed on the first surface 101; and a first electrical connector 12 disposed on the second surface 102. The first test device can be the test device provided in any of the above embodiments.

[0085] The device under test 20 includes a first preset area 51, where a first target electronic component and a second electronic component are disposed around the first target electronic component. The device under test 20 includes at least one preset area, which serves as the first preset area 51. The target electronic component 22 in the preset area is the first target electronic component.

[0086] The first electrical connector 12 is used to carry the first board 10 and load it onto the first preset area 51 of the device under test 20 to replace the first target electronic component in the first preset area 51 to perform testing on the device under test 20. The first electrical connector 12 has a first height H1 and the second electronic component 21 has a second height H2. The first height H1 is greater than the second height H2. When the test device is loaded onto the first preset area 51, a gap 30 is formed between the first board 10 and the second electronic component 21.

[0087] refer to Figure 10 As shown, Figure 10This is a top view of another testing system provided in an embodiment of this application. The device under test includes a second preset area 52, and a second target electronic component is disposed in the second preset area 52. The second preset area 52 is another preset area in the device under test, and the target electronic component 22 in the preset area is the second target electronic component.

[0088] The testing system also includes a second testing device 42, which includes: a second plate having opposing third and fourth surfaces; a fourth electronic component disposed on the third surface; and a second electrical connector disposed on the fourth surface. The second testing device 42 may have a structure similar to that of the first testing device 41, and therefore the second testing device 42 may be a testing device provided in any of the above embodiments.

[0089] The second electrical connector is used to carry the second board body and load it onto the second preset area 52 of the device under test 20, so as to replace the second target electronic component in the second preset area 52 to perform testing on the device under test 20.

[0090] The first distance between the input end 121 and the output end 122 of the first electrical connector 12 is adapted to the distance between the input pin 221 and the output pin 222 of the first target electronic component, and the second distance between the input end 121 and the output end 122 of the second electrical connector is adapted to the distance between the input pin 221 and the output pin 222 of the second target electronic component. The first distance and the second distance are different.

[0091] Figure 9 The two dashed boxes represent the first preset area 51 and the second preset area 52, respectively. The first preset area 51 can be used to load the first test device 41, and the second preset area 52 can be used to load the second test device 42. For ease of illustration, the test device is set to be located within the corresponding preset area. In other ways, the two can be set to completely overlap, or the test device can be set to completely cover the corresponding preset area, and there is a gap between the edge of the test device and the edge of the preset area.

[0092] Both the first test device 41 and the second test device 42 can be the test devices provided in any of the above embodiments. The structure of the test devices and the corresponding preset areas, as well as the relative loading method, can be referred to the description in the above embodiments, and will not be repeated in the test system embodiments.

[0093] Optional, such as Figure 9As shown, the first surface is also provided with a first output port to output the electrical parameters collected by the first test device 41 to the external testing device 43; the third surface is also provided with a second output port to output the electrical parameters collected by the second test device 42 to the external testing device 43, so as to simultaneously test the device under test. Both the first test device 41 and the second test device 42 have an output port 17, where the output port 17 in the first test device 41 is the first output port, and the output port 17 in the second test device 42 is the second output port.

[0094] Based on the testing system provided in this application embodiment, the testing device can test the device under test 20 and obtain electrical parameters related to the device under test 20. Since the height of the electrical connector in the testing device is greater than the height of the second electronic component 21, a gap 30 can be formed between the board of the testing device and the second electronic component 21 in the preset area. When testing the device under test 20, based on the aforementioned gap 30, the testing device can be directly loaded above the corresponding preset area without colliding with the second electronic component 21. No soldering wires or other adapter structures are needed to achieve an electrical connection between the device under test 20 and the testing device, facilitating the testing of the device under test 20.

[0095] The testing system has at least two testing devices, which are respectively loaded above the first preset region 51 and the second preset region 52. The distance between the input terminal 121 and the output terminal 122 of each testing device is adapted to the distance between the input pin 221 and the output pin 222 of the target electronic component 22 in the corresponding preset region. In this way, the first preset region 51 and the second preset region 52 can be loaded with the adapted testing devices, thereby enabling the target electronic component 22 in the first preset region 51 and the second preset region 52 to be replaced simultaneously, so as to simultaneously measure the electrical parameters of the corresponding power chip 25.

[0096] When the device under test 20 has multiple preset areas, it can simultaneously load multiple test devices, with different test devices loaded on different preset areas; the test devices are connected to the same external detection device 43. For example, the electrical parameters of multiple power chips 25 can be tested based on the same external detection device 43. The external detection device 43 can be a current acquisition card; the ADC standard test ports of different test devices can be connected to the same current acquisition card to achieve multi-channel synchronous testing and data acquisition.

[0097] As described above, the device under test 20 includes a system-on-a-chip 23, which typically requires a dozen or even dozens of power supply lines. Different power supply lines require independent power supplies from different power chips 25, resulting in limited mounting space for electronic components on the circuit board 201. Due to the high density of electronic components on the circuit board 201, conventional power consumption boards cannot simultaneously test the electrical parameters of multiple power supply lines. The testing device provided in this embodiment, based on the set gap 30, can directly load the testing device above the corresponding preset area, enabling three-dimensional testing of the device under test 20 in the vertical direction. Simultaneously, testing devices with adapted input terminal 121 and output terminal 122 spacings can be set for different preset areas, achieving simultaneous testing of multiple power supply lines. For example, the current values ​​in multiple power supply lines can be measured simultaneously, thereby determining the chip power consumption of that power supply line.

[0098] In the aforementioned testing system, all electrical connectors in the testing equipment can have the same height, and the height of the electrical connector is not less than the height of the second electronic component 21 with the largest height in the device under test 20. Alternatively, if the heights of the second electronic component 21 in two preset areas are different, testing equipment with electrical connectors of the same height can be used respectively.

[0099] In other ways, the height of the electrical connector in each test device can be set to be related to the height of the second electronic component 21 in the corresponding preset area. The greater the height of the second electronic component 21 in the corresponding preset area, the greater the height of the electrical connector. In this way, if the heights of the second electronic component 21 in the two preset areas are different, they can correspond to test devices with electrical connectors of different heights.

[0100] The various embodiments in this application are described in a progressive, parallel, or combined manner. Each embodiment focuses on its differences from other embodiments, and similar or identical parts between embodiments can be referred to interchangeably. The implementation methods provided in this application can be combined with each other without contradiction.

[0101] It should be noted that, in the description of this application, the accompanying drawings and embodiments are illustrative rather than restrictive. The same reference numerals throughout the embodiments identify the same structures. Additionally, for ease of understanding and description, the thicknesses of some layers, films, panels, regions, etc., may be exaggerated in the drawings. It is also understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element may be directly on the other element or there may be intermediate elements. Furthermore, "on" means positioning an element on or below another element, but does not inherently mean positioning it above another element according to the direction of gravity.

[0102] The terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the middle.

[0103] It should also be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or apparatus comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or apparatus that includes the aforementioned element.

[0104] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A testing device, characterized in that, include: A first plate having opposing first and second surfaces; A first electronic component disposed on the first surface; A first electrical connector disposed on the second surface is used to carry the first board body onto a preset area of ​​the device under test, so as to replace the target electronic component in the preset area to perform a test on the device under test. The preset area is provided with the target electronic component and a second electronic component placed around the target electronic component. The first electrical connector has a first height, and the second electronic component has a second height. The first height is greater than the second height, so that when the test equipment is loaded above the preset area, there is a gap between the first plate and the second electronic component.

2. The testing equipment according to claim 1, characterized in that, The first electrical connector has a solder pad and a conductive pad fixed to the side of the solder pad facing away from the first plate, such that the first electrical connector has the first height.

3. The testing equipment according to claim 1, characterized in that, The first electrical connector includes an input terminal and an output terminal; The distance between the input terminal and the output terminal is adapted to the distance between the input pin and the output pin of the target electronic component, so that the test equipment can replace the target electronic component and electrically connect to the device under test.

4. The testing equipment according to claim 1, characterized in that, Also includes: A cover, which together with the first plate forms a shielding space to prevent the first electronic component from being subjected to electromagnetic interference; The first surface is also provided with an output port located outside the cover to output the electrical parameters collected by the test equipment to an external testing device.

5. The testing equipment according to claim 1, characterized in that, The target electronic component is a target power inductor; when the test equipment is loaded above the preset area, it is used to replace the target power inductor in order to test the electrical parameters of the power chip connected to the target power inductor.

6. The testing equipment according to claim 3, characterized in that, The first electronic component includes: Sampling resistor; A calibrated power inductor is connected at one end to the input terminal and at the other end to the output terminal through the sampling resistor. The first surface is provided with an output port connected to the sampling resistor to output the electrical parameters collected by the test equipment to an external testing device.

7. The testing equipment according to claim 6, characterized in that, The sampling resistor includes multiple resistive elements; Among them, the first sampling resistor obtained based on the combination of the multiple resistive elements can be adapted to the output parameters of the power chip; Alternatively, the sampling resistor may include an adjustable resistor, wherein the second sampling resistor obtained based on the adjustable resistor can be adapted to the output parameters of the power supply chip.

8. A testing system, characterized in that, include: A first testing device, comprising: a first plate having opposing first and second surfaces; a first electronic component disposed on the first surface; and a first electrical connector disposed on the second surface. The device under test includes a first preset area, wherein a first target electronic component and a second electronic component are disposed around the first target electronic component. The first electrical connector is used to carry the first board body onto a first preset area of ​​the device under test, so as to replace the first target electronic component in the first preset area to perform testing on the device under test; the first electrical connector has a first height, the second electronic component has a second height, the first height is greater than the second height, and when the test device is loaded onto the first preset area, there is a gap between the first board body and the second electronic component.

9. The testing system according to claim 8, characterized in that, The device under test includes a second preset area, and a second target electronic component is disposed in the second preset area; The testing system further includes a second testing device, which includes: a second plate having opposing third and fourth surfaces; a fourth electronic component disposed on the third surface; and a second electrical connector disposed on the fourth surface. The second electrical connector is used to carry the second board body and load it onto the second preset area of ​​the device under test, so as to replace the second target electronic component in the second preset area to perform testing on the device under test; Wherein, the first distance between the input end and the output end of the first electrical connector is adapted to the distance between the input pin and the output pin of the first target electronic component, and the second distance between the input end and the output end of the second electrical connector is adapted to the distance between the input pin and the output pin of the second target electronic component, wherein the first distance and the second distance are different.

10. The testing system according to claim 9, characterized in that, The first surface is also provided with a first output port to output the electrical parameters collected by the first test device to an external testing device; The third surface is also provided with a second output port to output the electrical parameters collected by the second test device to the external detection device for simultaneous detection of the device under test.

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