Immersion Server Vapor-Liquid Two-Phase Cooling System and Its Application

Abstract

The present application relates to an immersion server vapor-liquid two-phase cooling system and a method for using the same. The above-mentioned immersion server phase change liquid cooling system includes: multiple server casings, a liquid cooling module, a steam return module, a liquid storage module, a condensation module and a power module. The above-mentioned immersion server vapor-liquid two-phase cooling system is used to cool the electronic components of multiple servers, thereby cooling the electronic components inside the casings of different servers in a targeted manner, improving the use efficiency and operating economy of the cooling system, and ensuring that the cooling medium inside the server casing is fully discharged when the cover needs to be opened for maintenance.

Description

Technical Field

[0001] The present application relates to the technical field of server cooling, and in particular to an immersion server vapor-liquid two-phase cooling system and a method of using the same. Background Art

[0002] In recent years, as server equipment continues to develop towards high integration, miniaturization and high frequency, the maximum power consumption of server chips can reach 700W, and the density of a single cabinet has generally increased to 50kW. Two-phase immersion liquid cooling is increasingly favored by server manufacturers in the industry because it can solve the heat dissipation problem of high heat flux density chips within a limited space.

[0003] The two-phase immersion liquid cooling server supply and drain, steam return system mainly includes: server casing, liquid cooling module and steam return module. Generally, in order to improve the server installation density, multiple server casings usually share a set of liquid cooling modules including a liquid supply part and a liquid drain part as a server casing assembly to respectively supply and drain liquid, and return steam through the steam return module. The server casing is a sealed cavity that integrates multiple server electronic components and supporting sensor monitoring devices, and the sealed cavity is filled with cooling medium. The heat generated by the electronic components during operation is absorbed by the liquid cooling medium around them, and the cooling medium changes from liquid to gas. The gaseous cooling medium is then collected to the condensation module through the steam return module. The condensation module condenses the gaseous cooling medium into liquid, and then pumps it back into the liquid supply part through the liquid supply pump. The liquid supply part distributes the cooling medium to each server casing of the server casing assembly.

[0004] In the prior art, the server casing components of the server are cooled simultaneously in the same container. Although the server casing components can be fully immersed in cooling, this results in the server casing that does not need to be cooled also being supplied with liquid, so that the liquid supply exceeds the demand, causing a large amount of coolant to circulate back and forth in the cooling system without playing a role, thereby reducing the use efficiency and operating economy of the cooling system. Summary of the invention

[0005] Based on this, it is necessary to provide an immersion server vapor-liquid two-phase cooling system and a method of using the same system to address the problem that in the prior art, the server casing components of the server are cooled simultaneously in the same container, resulting in the server casing that does not need to be cooled also being supplied with liquid, so that the liquid supply exceeds the demand, causing a large amount of coolant to circulate back and forth in the cooling system without taking any effect, thereby reducing the use efficiency and operating economy of the cooling system.

[0006] An immersion server vapor-liquid two-phase cooling system is used to cool electronic devices of multiple servers, and the immersion server vapor-liquid two-phase system includes: multiple server casings, a liquid cooling module, a steam return module, a liquid storage module, a condensation module and a power module;

[0007] The electronic components of the multiple servers are located in the multiple server housings in a one-to-one correspondence, and the top of the server housing is provided with a steam exhaust port, and the bottom is provided with a liquid discharge port and a liquid inlet;

[0008] The liquid cooling module comprises a main liquid supply pipe, a main liquid return pipe, a plurality of liquid discharge heads, a plurality of liquid return heads and a plurality of valve assemblies, and the plurality of server housings, the plurality of liquid discharge heads, the plurality of liquid return heads and the plurality of valve assemblies correspond to each other one by one; one end of the liquid discharge head is connected to the main liquid supply pipe, and the other end is connected to the liquid inlet of the corresponding server housing; one end of the liquid return head is connected to the main liquid return pipe, and the other end is connected to the liquid discharge port of the corresponding server housing, and the valve assembly is arranged between the liquid return head and the main liquid return pipe and / or between the liquid discharge head and the main liquid supply pipe;

[0009] The steam return module includes a total steam return pipe and a plurality of steam return heads corresponding to the exhaust ports one by one, one end of the steam return head is connected to the total steam return pipe, and the other end is connected to the corresponding exhaust port, the total liquid supply pipe, the total liquid return pipe, and the total steam return pipe are all connected to the liquid storage module; the condensing module is located in the liquid storage module, and is used to condense the coolant in the liquid storage module; the power module is arranged between the liquid storage module and the liquid cooling module, and is used to provide power for the coolant to enter or discharge from the server casing.

[0010] In actual use, the above-mentioned immersion server vapor-liquid two-phase cooling system is first connected to the drain port on the server casing with one of the liquid return heads, and the drain head corresponding to the above-mentioned liquid return head is connected to the liquid inlet on the server casing, and then the steam exhaust port of the server casing is connected to one of the steam return heads, and then multiple server casings are connected to the liquid cooling module and the steam return module in turn, and then the main liquid supply pipe, the main liquid return pipe, and the main steam return pipe are all connected to the liquid storage module. When it is necessary to cool the electronic components in a certain server casing, the power module is started to provide power for the coolant to enter the server casing. By controlling the valve assembly, the coolant is only allowed to pass through the drain head corresponding to the server casing that needs to be cooled, and then through the liquid inlet of the server casing that needs to be cooled to enter the server casing that needs to be cooled to cool the internal electronic components. The steam generated by the evaporation of the coolant during the cooling process enters the main steam return pipe through the steam return head, and then enters the liquid storage module and is condensed by the condensation module and remains in the liquid storage module. After the cooling treatment of the server casing that needs to be cooled is completed, the channel between the liquid cooling module discharge head and the main liquid supply pipe is closed by controlling the valve assembly, and the channel between the liquid cooling module return head and the main liquid return pipe is opened. The power module is started to provide power for the coolant to be discharged from the server casing, so that the coolant inside the server casing that has completed the cooling treatment is returned to the liquid storage module through the liquid return head and the main liquid return pipe and is cooled by the condensation module. Therefore, through the above-mentioned immersion server vapor-liquid phase change cooling system, the electronic devices inside different server casings are cooled in a targeted manner, thereby improving the utilization efficiency and operation economy of the cooling system.

[0011] In one embodiment, a first liquid level sensor is disposed inside each of the server casings. The first liquid level sensor is installed at the top of the server casing to monitor the liquid level at the exhaust port.

[0012] In one embodiment, a second liquid level sensor is disposed inside each of the server casings. The second liquid level sensor is installed at the bottom of the server casing to monitor the lowest liquid level of the coolant in the server casing.

[0013] In one embodiment, the submerged server vapor-liquid two-phase cooling system further includes a control module;

[0014] The first liquid level sensor, the second liquid level sensor, and the valve assembly correspond one to one and are simultaneously connected to the control module signal. The control module is used to receive the liquid level signals of the first liquid level sensor and the second liquid level sensor, and control the state of the corresponding valve assembly to control the liquid supply and drainage to the server housing.

[0015] In one embodiment, the valve assembly includes a drain valve and a supply valve, the drain valve is arranged between the liquid return head of the liquid cooling module and the main liquid return pipe, and the supply valve is arranged between the liquid drain head of the liquid cooling module and the main liquid supply pipe.

[0016] In one embodiment, the valve assembly further includes a backup valve, and the backup valve is disposed between the liquid drain head of the liquid cooling module and the main liquid supply pipe.

[0017] In one embodiment, a clearing pipe is further provided inside the server casing; one end of the clearing pipe is connected to the drain port of the server casing, and the other end is in contact with the bottom wall of the server casing to extract the accumulated liquid at the bottom of the server casing.

[0018] In one embodiment, a cleaning groove is formed on the bottom wall of the server housing, and one end of the cleaning pipe away from the drain port abuts against the bottom of the cleaning groove.

[0019] In one embodiment, the steam return module further includes an air leakage component, and the air leakage component is connected to the plurality of steam return heads or the main steam return pipe.

[0020] The present application also provides a method for using a vapor-liquid two-phase cooling system for an immersion server, wherein the vapor-liquid two-phase cooling system for an immersion server is used to cool a plurality of the servers, and the method for using the vapor-liquid two-phase cooling system for an immersion server comprises the following steps:

[0021] Connecting a plurality of the server housings, the liquid cooling module, the steam return module, the liquid storage module, the condensation module and the power module to each other;

[0022] When any of the servers needs to be cooled, the corresponding valve assembly, the power module and the condensing module are started and supply liquid into the server casing;

[0023] When the liquid level detected by the corresponding first liquid level sensor approaches the exhaust port, the valve assembly stops supplying liquid, and the coolant cools the corresponding server;

[0024] When the corresponding server does not need to be cooled, the corresponding valve assembly, the power module and the condensing module are started to discharge the coolant in the server casing, and the second liquid level sensor monitors whether the coolant in the corresponding server casing is emptied.

[0025] When using the immersion server vapor-liquid two-phase cooling system to cool the electronic components in the server casing, the above-mentioned method of using the immersion server vapor-liquid two-phase cooling system is adopted to perform targeted cooling treatment on the electronic components inside different server casings, thereby improving the use efficiency and operation economy of the cooling system, and when the cover needs to be opened for maintenance, it is ensured that the cooling medium inside the server casing is fully discharged. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the connection relationship of a vapor-liquid two-phase cooling system for an immersion server according to an embodiment.

[0027] Figure 2 for Figure 1 Schematic diagram of the structure of the vapor-liquid two-phase cooling system of the immersed server.

[0028] Figure 3 for Figure 2 Schematic diagram of the structure of the liquid cooling module from another perspective.

[0029] Figure 4 for Figure 2 Schematic diagram of the structure inside the server casing.

[0030] Description of Figure Numbers:

[0031] 100-Immersed server vapor-liquid two-phase cooling system;

[0032] 110-server housing; 111-exhaust port; 112-liquid discharge port; 113-liquid inlet; 114-first liquid level sensor; 115-second liquid level sensor; 116-clearing pipe;

[0033] 120-liquid cooling module; 121-main liquid supply pipe; 122-main liquid return pipe; 123-liquid discharge head; 124-liquid return head; 125-valve assembly; 126-liquid supply valve; 127-liquid discharge valve; 128-spare valve;

[0034] 130-steam return module; 131-main steam return pipe; 132-steam return head; 134-air release component; 135-air release head;

[0035] 140-liquid storage module;

[0036] 150-condensation module;

[0037] 160-power module; 161-discharge pump; 162-supply pump;

[0038] 210-Electronic devices;

[0039] Q-Liquid level. DETAILED DESCRIPTION

[0040] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0041] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0042] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0043] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0044] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0045] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0046] In order to minimize the contact between the human body and coolants such as fluorocarbons that are not friendly to the human body and the environment, and to reduce the loss of coolants, when the electronic device 210 in the server housing 110 needs to be shut down for maintenance, the cooling medium inside it needs to be fully drained before the cover is opened for maintenance.

[0047] During the actual operation and maintenance of the server, the existing server casing 110 components are generally separately provided with a liquid supply device and a manual liquid drain device, which results in complex server system equipment and occupies a large space. In addition, the cooling effect of the server in the server casing 110 is not ideal, the manual liquid draining is cumbersome, the system integration is low, and it is impossible to realize online real-time monitoring and intelligent control of the liquid inlet and liquid draining of the server casing 110.

[0048] See also Figure 1 , Figure 1 A structural schematic diagram of an immersion server vapor-liquid two-phase cooling system 100 in an embodiment of the present application is shown. The immersion server vapor-liquid two-phase cooling system 100 provided in an embodiment of the present application includes: multiple server housings 110, a liquid cooling module 120, a steam return module 130, a liquid storage module 140, a condensing module 150 and a power module 160.

[0049] The electronic devices 210 of the multiple servers in the above-mentioned immersion server vapor-liquid two-phase cooling system 100 are located in multiple server housings 110 in a one-to-one correspondence. The top of the server housing 110 is provided with a steam exhaust port 111, and the bottom is provided with a liquid discharge port 112 and a liquid inlet 113. Among them, the liquid cooling module 120 includes a main liquid supply pipe 121, a main liquid return pipe 122, multiple liquid discharge heads 123, multiple liquid return heads 124 and multiple valve assemblies 125. The multiple server housings 110, the multiple liquid discharge heads 123, the multiple liquid return heads 124 and the multiple valve assemblies 125 correspond to each other. One end of the liquid discharge head 123 is connected to the main liquid supply pipe 121, and the other end is connected to the liquid inlet 113 of the corresponding server housing 110. One end of the liquid return head 124 is connected to the main liquid return pipe 122, and the other end is connected to the corresponding liquid discharge port 112 of the server housing 110. The valve assembly 125 is arranged between the liquid return head 124 and the main liquid return pipe 122 and between the liquid discharge head 123 and the main liquid supply pipe 121, or different components in the valve assembly 125 are respectively arranged between the liquid return head 124 and the main liquid return pipe 122 and between the liquid discharge head 123 and the main liquid supply pipe 121. The steam return module 130 includes a main steam return pipe 131 and a plurality of steam return heads 132 corresponding to the steam discharge ports 111. One end of the steam return head 132 is connected to the main steam return pipe 131, and the other end is connected to the corresponding steam discharge port 111. The condensation module 150 is located in the liquid storage module 140, and is used to condense the coolant in the liquid storage module 140. The power module 160 is disposed between the liquid storage module 140 and the liquid cooling module 120 to provide power for the cooling liquid to enter or be discharged from the server housing 110 .

[0050] In actual use, the above-mentioned immersion server vapor-liquid two-phase cooling system 100 is first connected to the drain port 112 on the server housing 110 with one of the liquid return heads 124, and the drain head 123 corresponding to the above-mentioned liquid return head 124 is connected to the liquid inlet 113 on the server housing 110, and then the steam exhaust port 111 of the server housing 110 is connected to one of the steam return heads 132, and then multiple server housings 110 are connected to the liquid cooling module 120 and the steam return module 130 in sequence, and then the main liquid supply pipe 121, the main liquid return pipe 122, and the main steam return pipe 131 are all connected to the liquid storage module 140. When the electronic device 210 is cooled, the power module 160 starts to provide power for the coolant to enter the server casing 110. By controlling the valve assembly 125, the coolant is only passed through the discharge head 123 corresponding to the server casing 110 that needs to be cooled, and then through the liquid inlet 113 of the server casing 110 that needs to be cooled to enter the server casing 110 that needs to be cooled to cool the internal electronic device 210. The steam generated by the evaporation of the coolant during the cooling process enters the main return steam pipe 131 through the return steam head 132, and then enters the liquid storage module 140 and is condensed by the condensation module 150 and remains in the liquid storage module 140. After the cooling treatment of the server casing 110 that needs to be cooled is completed, the channel between the discharge head 123 and the main liquid supply pipe 121 is closed by controlling the valve assembly 125, and the channel between the return head 124 and the main return pipe 122 is opened. The power module 160 starts to provide power for the coolant to be discharged from the server casing 110, so that the coolant inside the server casing 110 that has completed the cooling treatment is returned to the liquid storage module 140 through the return head 124 and the main return pipe 122 and cooled by the condensing module 150. Therefore, through the above-mentioned immersion server phase change liquid cooling system 100, the electronic devices 210 inside different server casings 110 are cooled in a targeted manner, thereby improving the use efficiency and operation economy of the cooling system.

[0051] Among them, quick-plug structures are provided between the liquid discharge head 123 and the liquid inlet 113, between the liquid return head 124 and the liquid discharge port 112, and between the steam return head 132 and the steam exhaust port 111. For example, the steam exhaust port 111, the liquid inlet 113, and the liquid discharge port 112 are provided with male heads, and the liquid discharge head 123, the liquid return head 124, and the steam return head 132 are female heads, or are provided with a snap-on structure or a threaded connection structure, so as to facilitate the quick connection of the server housing 110 with the liquid cooling module 120 and the steam return module 130. The specific structure can refer to the existing quick-plug connector related technology, which will not be elaborated on here.

[0052] Specifically, the steam exhaust port 111 , the liquid exhaust port 112 , and the liquid inlet 113 are located on the same side of the server housing 110 .

[0053] In one embodiment, the liquid discharge port 112 and the liquid inlet 113 are arranged horizontally.

[0054] In another embodiment, the liquid inlet 113 is located above the liquid outlet 112 .

[0055] Specifically, the power module 160 includes a liquid supply pump 162 and a liquid discharge pump 161. The liquid supply pump 162 is arranged between the main liquid supply pipe 121 and the liquid storage module 140, and the liquid discharge pump 161 is arranged between the main liquid discharge pipe and the liquid storage module 140. When liquid supply is needed, the liquid supply pump 162 is started to ensure the liquid supply power. When liquid discharge is needed, the liquid discharge pump 161 is started to ensure that the accumulated liquid inside the server casing 110 is fully extracted into the liquid storage module 140.

[0056] In one embodiment, a first liquid level sensor 114 is provided inside each server casing 110. The first liquid level sensor 114 is installed on the top of the server casing 110 to monitor the liquid level Q at the exhaust port 111, so that the operator can know the liquid level Q at the exhaust port 111 in each server casing 110 in real time. When the liquid level Q at the exhaust port 111 in a certain server casing 110 is close to the exhaust port 111, the operator controls the valve assembly 125 to switch from an open state to a closed state, and the liquid cooling module 120 stops supplying liquid to the server casing 110, thereby preventing excessive coolant from being supplied into the main return steam pipe 131 through the exhaust port 111, thereby affecting the coolant vapor returning to the liquid storage module 140 through the main return steam pipe 131.

[0057] In one embodiment, a second liquid level sensor 115 is provided inside each server casing 110. The second liquid level sensor 115 is installed at the bottom of the server casing 110 to monitor the minimum liquid level Q of the coolant in the server casing 110, so that the operator can know the minimum liquid level Q in each server casing 110 in real time, that is, whether the coolant is drained, so as to facilitate the operator to control the valve assembly 125 and the power module 160 in a targeted manner to continue draining the server casing 110 that has not drained the coolant.

[0058] In one embodiment, the immersion server vapor-liquid two-phase cooling system 100 further includes a control module. The first liquid level sensor 114, the second liquid level sensor 115, and the valve assembly 125 correspond to each other and are simultaneously connected to the control module signal. The control module is used to receive the liquid level Q signal of the first liquid level sensor 114 and the second liquid level sensor 115, and control the state of the corresponding valve assembly 125 to control the liquid supply and liquid discharge to the server housing 110. When the first liquid level sensor 114 in a server housing 110 detects that the liquid level Q at the exhaust port 111 is close to the exhaust port 111, the control module immediately controls the valve assembly 125 to stop supplying liquid to the server housing 110 after receiving the signal of the first liquid level sensor 114.

[0059] In one embodiment, the valve assembly 125 includes a drain valve 127 and a supply valve 126. The drain valve 127 is disposed between the liquid return head 124 and the main liquid return pipe 122, and the supply valve 126 is disposed between the drain head 123 and the main liquid supply pipe 121, so that when supplying liquid to the inside of the server housing 110 that needs to be cooled, the supply valve 126 corresponding to the server housing 110 is opened, and the drain valve 127 corresponding to the server housing 110 is kept closed, so that liquid is only supplied to the server housing 110. When draining liquid from the inside of the server housing 110 that needs to be cooled, the supply valve 126 corresponding to the server housing 110 is closed, and the drain valve 127 corresponding to the server housing 110 is kept open, so that liquid is only drained from the server housing 110.

[0060] In one embodiment, the valve assembly 125 further includes a backup valve 128 , which is disposed between the liquid discharge head 123 and the main liquid supply pipe 121 . When the liquid supply valve 126 fails, the backup valve 128 is controlled to supply liquid to the corresponding server housing 110 .

[0061] In one embodiment, a clearing pipe 116 is further provided inside the server housing 110. One end of the clearing pipe 116 is connected to the drain port 112, and the other end abuts against the bottom wall of the server housing 110, so that when the liquid level Q is lower than the drain port 112, the end of the clearing pipe 116 away from the drain port 112 abuts against the bottom wall inside the server housing 110, and the end of the clearing pipe 116 away from the drain port 112 is still located below the liquid level, so that the accumulated liquid at the bottom of the server housing 110 can be extracted through the power module 160.

[0062] Specifically, one end of the clearing pipe 116 away from the drain port 112 abuts against the bottom wall of the server housing 110 , and one end of the clearing pipe 116 away from the drain port 112 abuts against the bottom wall of the server housing 110 with a gap.

[0063] In another embodiment, a pipe groove is formed on the end surface of the clearing pipe 116 away from the drain port 112 to provide an opening for extracting the accumulated liquid.

[0064] In one embodiment, a cleaning groove is provided on the bottom wall of the server case 110, and one end of the cleaning tube 116 away from the drain port 112 abuts against the bottom of the cleaning groove, so that the lowest position of the accumulated liquid inside the server case 110 is the bottom wall of the cleaning groove. Therefore, in the process of extracting the accumulated liquid through the cleaning tube 116, the last accumulated liquid in the server case 110 will be located in the cleaning groove, and the end of the cleaning tube 116 away from the drain port 112 abuts against the bottom wall of the cleaning groove, so that the accumulated liquid in the server case 110 can be fully extracted.

[0065] In one embodiment, the steam return module 130 further includes a venting component 134, which is connected to a plurality of steam return heads 132 or a total steam return pipe 131. Thus, when a large amount of coolant evaporates in a server casing 110 due to excessive temperature before cooling of the server casing 110, causing the air pressure in the server casing 110 and the steam return module 130 to increase, the venting component 134 is opened to allow the coolant vapor to be discharged from the venting component 134, so as to protect the submerged server vapor-liquid two-phase cooling system 100 and the server casing 110 from being damaged due to excessive air pressure.

[0066] Specifically, the vent assembly 134 includes a plurality of vent heads 135, which correspond one-to-one to and are connected to a plurality of exhaust ports 111. When the temperature inside one of the server casings 110 is too high, resulting in excessive air pressure, the vent head 135 corresponding to the server casing 110 is opened, thereby discharging the steam inside the server casing 110 through the corresponding vent head 135.

[0067] The present application also provides a method for using the immersion server vapor-liquid two-phase cooling system 100, wherein the immersion server vapor-liquid two-phase cooling system 100 is used to cool multiple servers. The method for using the immersion server vapor-liquid two-phase cooling system 100 comprises the following steps:

[0068] S100: Connecting a plurality of server housings 110, a liquid cooling module 120, a steam return module 130, a liquid storage module 140, a condensing module 150 and a power module 160 to each other.

[0069] S200 : When any server needs to be cooled, the corresponding valve assembly 125 , power module 160 , and condensing module 150 are started and supply liquid into the server housing 110 .

[0070] S300: When the liquid level Q detected by the corresponding first liquid level sensor 114 is close to the exhaust port 111, the valve assembly 125 stops supplying liquid, and the coolant cools the corresponding server.

[0071] S400: When the corresponding server does not need cooling, the corresponding valve assembly 125, the power module 160 and the condensing module 150 are started to discharge the coolant in the server casing 110, and the second liquid level sensor 115 monitors whether the coolant in the corresponding server casing 110 is emptied.

[0072] When using the submerged server vapor-liquid two-phase cooling system 100 to cool the electronic device 210 in the server housing 110, the above-mentioned method of using the submerged server vapor-liquid two-phase cooling system 100 is adopted, S100: multiple server housings 110, liquid cooling modules 120, return steam modules 130, liquid storage modules 140, condensation modules 150 and power modules 160 are connected to each other. S200: When any of the servers needs to be cooled, the corresponding valve assembly 125 and the power module 160 and the condensation module 150 are started and supply liquid into the server housing 110. S300: When the liquid level Q detected by the corresponding first liquid level sensor 114 is close to the exhaust port 111, the valve assembly 125 stops supplying liquid, and the coolant cools the corresponding server. S400: When the corresponding server does not need to be cooled, the corresponding valve assembly 125, the power module 160 and the condensing module 150 are started to discharge the coolant in the server casing 110, and the second liquid level sensor 115 monitors whether the coolant in the corresponding server casing 110 is emptied, so that the electronic devices 210 inside different server casings 110 are cooled in a targeted manner through the above-mentioned immersion server vapor-liquid two-phase cooling system 100, thereby improving the use efficiency and operation economy of the cooling system, and when the cover needs to be opened for maintenance, it is ensured that the cooling medium inside the server casing 110 is fully discharged.

[0073] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0074] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. An immersion server vapor-liquid two-phase cooling system for cooling electronic components of multiple servers, characterized in that: The immersion server phase change liquid cooling system comprises: a plurality of server casings, a liquid cooling module, a steam return module, a liquid storage module, a condensation module and a power module; The electronic components of the plurality of servers are located in the plurality of server housings in a one-to-one correspondence, and the top of the server housing is provided with a steam exhaust port, and the bottom is provided with a liquid discharge port and a liquid inlet; The liquid cooling module comprises a main liquid supply pipe, a main liquid return pipe, a plurality of liquid discharge heads, a plurality of liquid return heads and a plurality of valve assemblies, and the plurality of server housings, the plurality of liquid discharge heads, the plurality of liquid return heads and the plurality of valve assemblies correspond to each other one by one; one end of the liquid discharge head is connected to the main liquid supply pipe, and the other end is connected to the liquid inlet of the corresponding server housing; one end of the liquid return head is connected to the main liquid return pipe, and the other end is connected to the liquid discharge port of the corresponding server housing, and the valve assembly is arranged between the liquid return head and the main liquid return pipe and / or between the liquid discharge head and the main liquid supply pipe; The steam return module includes a total steam return pipe and a plurality of steam return heads corresponding to the exhaust ports one by one, one end of the steam return head is connected to the total steam return pipe, and the other end is connected to the corresponding exhaust port, the total liquid supply pipe, the total liquid return pipe, and the total steam return pipe are all connected to the liquid storage module; the condensing module is located in the liquid storage module, and is used to condense the coolant in the liquid storage module; the power module is arranged between the liquid storage module and the liquid cooling module, and is used to provide power for the coolant to enter or discharge from the server casing.

2. The vapor-liquid two-phase cooling system for an immersion server according to claim 1 is characterized in that: A first liquid level sensor is arranged inside each server casing, and the first liquid level sensor is installed at the top of the server casing to monitor the liquid level at the exhaust port.

3. The vapor-liquid two-phase cooling system for an immersion server according to claim 2, characterized in that: A second liquid level sensor is arranged inside each of the server casings. The second liquid level sensor is installed at the bottom of the server casing to monitor the lowest liquid level of the coolant in the server casing.

4. The vapor-liquid two-phase cooling system for an immersion server according to claim 3, characterized in that: The immersion server vapor-liquid two-phase cooling system also includes a control module; The first liquid level sensor, the second liquid level sensor, and the valve assembly correspond one to one and are simultaneously connected to the control module signal. The control module is used to receive the liquid level signals of the first liquid level sensor and the second liquid level sensor, and control the state of the corresponding valve assembly to control the liquid supply and drainage to the server housing.

5. The vapor-liquid two-phase cooling system for an immersion server according to claim 1, characterized in that: The valve assembly comprises a drain valve and a supply valve. The drain valve is arranged between the liquid return head of the liquid cooling module and the main liquid return pipe, and the supply valve is arranged between the drain head of the liquid cooling module and the main liquid supply pipe.

6. The vapor-liquid two-phase cooling system for an immersion server according to claim 5, characterized in that: The valve assembly also includes a backup valve, which is arranged between the liquid discharge head of the liquid cooling module and the main liquid supply pipe.

7. The vapor-liquid two-phase cooling system for an immersion server according to claim 1, characterized in that: A clearing pipe is also provided inside the server housing; one end of the clearing pipe is communicated with the drain port, and the other end abuts against the bottom wall of the server housing to extract the accumulated liquid at the bottom of the server housing.

8. The vapor-liquid two-phase cooling system for an immersion server according to claim 7, characterized in that: The bottom wall of the server housing is provided with a cleaning groove, and one end of the cleaning pipe away from the drain port abuts against the bottom of the cleaning groove.

9. The vapor-liquid two-phase cooling system for an immersion server according to claim 1, characterized in that: The steam return module further includes an air leakage component, which is connected to the plurality of steam return heads or the main steam return pipe.

10. A method for using a vapor-liquid two-phase cooling system for an immersion server, using the vapor-liquid two-phase cooling system for an immersion server as claimed in any one of claims 3 to 9 to cool a plurality of the servers, characterized in that: The method for using the vapor-liquid two-phase cooling system of the immersion server comprises the following steps: Connecting a plurality of the server housings, the liquid cooling module, the steam return module, the liquid storage module, the condensation module and the power module to each other; When any of the servers needs to be cooled, the corresponding valve assembly, the power module and the condensing module are started and supply liquid into the server casing; When the liquid level detected by the corresponding first liquid level sensor approaches the exhaust port, the valve assembly stops supplying liquid, and the coolant cools the corresponding server; When the corresponding server does not need to be cooled, the corresponding valve assembly, the power module and the condensing module are started to discharge the coolant in the server casing, and the second liquid level sensor monitors whether the coolant in the corresponding server casing is emptied.

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