Server architecture

Abstract

The invention relates to the technical field of servers, in particular to a server architecture, which comprises a case; the middle back plate is vertically arranged in the case so as to divide the interior of the case into a first space close to the front window and a second space close to the rear window; the first power supply module is arranged in the lower layer area of the first space; the first processor module is arranged in a middle layer area above the first power supply module; the second processor module is arranged in an upper layer area above the first processor module; wherein the upper layer area is provided with a front area close to the front window and a rear area far away from the front window, and the second processor module is at least located in the rear area.

Description

Technical Field

[0001] This application relates to the technical field of servers, and particularly to a server architecture. Background Art

[0002] In the design process of liquid-cooled servers, based on the differential design of processor modules, for example, the configured graphics processor modules often have different heights and depths, and the number of expansion slots and the number of hard disks in the server architecture also have their own emphases. For different usage scenarios, the currently configured server architectures are often designed into large and comprehensive structures, that is, server architectures configured with both more expansion slots and hard disks. Or, several different server products are designed specifically, that is, some server architectures are configured with more expansion slots, while other server architectures are configured with more hard disks, etc. However, both of the above two methods will cause duplicate development, which in turn leads to higher costs and lower demand satisfaction. Summary of the Invention

[0003] In view of the above problems in the background art, this application provides a server architecture to at least solve the problem of insufficient applicability of the server architecture in related technologies.

[0004] This application provides a chassis mechanism, including: a chassis; a middle backplane, vertically arranged in the chassis to divide the interior of the chassis into a first space near the front window and a second space near the rear window; a first power module, arranged in the lower layer area of the first space; a first processor module, arranged in the middle layer area above the first power module; a second processor module, arranged in the upper layer area above the first processor module; wherein, the upper layer area has a front area near the front window and a rear area far from the front window, and the second processor module is at least located in the rear area.

[0005] Based on the above server architecture, the front area in the chassis is above the middle layer area and in front of the rear area. Therefore, the front area adjacent to the middle layer area and the rear area respectively can be used as the expansion areas of the middle layer area and the rear area respectively, and can be used to configure hard disk modules or the second processor module. Through such a design, without adjusting other areas in the server architecture, only by configuring different modular modules in the upper layer area and the middle layer area, the server architecture can be adapted to the second processor modules with different heights and / or depths, and different numbers of expansion slots and / or hard disks can be configured for this server architecture by configuring suitable modules, so as to improve the design flexibility, thereby avoiding duplicate design of the server architecture and reducing the design cost. Brief Description of the Drawings

[0006] To more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0007] Figure 1 is a schematic cross-sectional view of the server architecture of the embodiment of the present application;

[0008] Figure 2 is a schematic structural view of the server architecture of the embodiment of the present application configured with the first box cover;

[0009] Figure 3 is a schematic structural view of the server architecture of the embodiment of the present application configured with the second box cover;

[0010] Figure 4 is based on Figure 1 a schematic structural view of the second processor module configured according to the first embodiment of the server architecture shown;

[0011] Figure 5 is based on Figure 4 an exploded view of the parts of the server architecture shown;

[0012] Figure 6 is based on Figure 5 a schematic view of the first air-cooling unit configured according to the server architecture shown;

[0013] Figure 7 is based on Figure 1 a schematic structural view of the second processor module configured according to the second embodiment of the server architecture shown;

[0014] Figure 8 is based on Figure 7 an exploded view of the parts of the server architecture shown;

[0015] Figure 9 is based on Figure 1 a schematic structural view of the second processor module configured according to the third embodiment of the server architecture shown;

[0016] Figure 10 is based on Figure 9 an exploded view of the parts of the server architecture shown;

[0017] Figure 11 is based on Figure 9 a schematic view of the first air-cooling unit and the second air-cooling unit configured according to the server architecture shown;

[0018] Figure 12 is a perspective view of the insertion box mechanism of the embodiment of the present application;

[0019] Figure 13 is Figure 12 a perspective view of another angle of the card cage mechanism shown;

[0020] Figure 14 is Figure 13 a partial enlarged view of the first fan board and the first beam-shaped part shown;

[0021] Figure 15 is Figure 12 a perspective view of the first fan module in the low position shown;

[0022] Figure 16 is Figure 12 a perspective view of the first fan module in the high position shown;

[0023] Figure 17 is Figure 13 a partial enlarged view of the second fan board, the second beam-shaped part and the third beam-shaped part shown;

[0024] Figure 18 is Figure 17 a perspective view from the bottom view of

[0025] Figure 19 is Figure 17 an exploded view of the second beam-shaped part and the third beam-shaped part shown;

[0026] Figure 20 is Figure 12 a perspective view of the second fan module shown;

[0027] Figure 21 is Figure 13 a perspective view of the card cage mechanism configured with a middle backplane shown;

[0028] Figure 22 is Figure 21 a partial enlarged view of the middle backplane shown;

[0029] Figure 23 is Figure 21 an exploded view of the backplane support shown;

[0030] Figure 24 is Figure 12 a perspective view of the main frame part of the card cage mechanism shown;

[0031] Figure 25 is Figure 24 a partial enlarged view of the support plate part shown;

[0032] Figure 26 is Figure 24 a partial enlarged view of the assembly part of the support and the support plate of the card cage mechanism shown;

[0033] Figure 27 is Figure 24 a partial enlarged view of the baffle and elastic member parts of the plug-in box mechanism shown;

[0034] Figure 28 is Figure 24 a partial enlarged view of the first space of the plug-in box mechanism shown, showing the stop portion;

[0035] Figure 29 is Figure 12 a perspective view of the second power supply module shown;

[0036] Figure 30 is Figure 29 a partial enlarged view of the fixing piece part shown;

[0037] Figure 31 is a perspective view of the server architecture according to an embodiment of the present application.

[0038] Among them, the above-mentioned drawings include the following reference numerals:

[0039] 100, plug-in box mechanism;

[0040] 110, main body frame; 111, bracket; 1111, partition; 1112, stop pin; 112, base; 1121, groove; 1122, screw hole; 113, first installation space; 114, stop portion; 115, second installation space;

[0041] 120, first air-cooling unit; 121, first fan module; 1211, first limiting portion; 1212, first electrical mating portion; 122, first fan board; 1221, first electrical connection portion; 1222, third electrical mating portion A; 123, first beam-shaped member;

[0042] 130, second air-cooling unit; 131, second fan board; 1311, second electrical connection portion; 1312, third electrical mating portion B; 132, second fan module; 1321, second limiting portion; 1322, second electrical mating portion; 133, second beam-shaped member; 134, third beam-shaped member; 1341, card slot;

[0043] 140, support plate; 141, pipe-passing hole; 142, stop groove; 143, fixing hole;

[0044] 150, second power supply module; 151, housing; 152, power supply main body; 153, assist handle; 1531, transition section; 1532, bending section; 1533, limiting groove; 1534, fixing piece; 154, fastener;

[0045] 160, baffle, 161, elastic member;

[0046] 200, chassis; 201, box body; 202, box cover; 2021, first box cover; 2022, second box cover; 203, I-shaped nail; 204, fastener hole position;

[0047] 210, first space; 211, lower area; 212, middle area; 213, upper area;

[0048] 220, Second Space;

[0049] 230. A first power module;

[0050] 240. A second processor module;

[0051] 250. a first processor module;

[0052] 260, hard disk module;

[0053] 270, exchange board;

[0054] 280, motherboard;

[0055] 290. Power distribution module;

[0056] 2100, communication card;

[0057] 300, center back panel; 310, back panel bracket; 311, first plate-shaped member; 312, second plate-shaped member. DETAILED DESCRIPTION

[0058] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0059] It should be noted that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. The terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular", "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, and the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of either one of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0060] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0061] Figure 1 It is a cross-sectional schematic diagram of the server architecture of the embodiment of the present application.

[0062] The present application provides a server architecture. Referring to Figure 1As shown, it includes a chassis 200, a middle backplane 300, a first power module 230, a first processor module 250, and a second processor module 240. The middle backplane 300 is vertically disposed in the chassis 200 to divide the interior of the chassis 200 into a first space 210 near the front window and a second space 220 near the rear window. The first power module 230 is disposed in the lower layer area 211 of the first space 210. The first processor module 250 is disposed in the middle layer area 212 above the first power module 230. The second processor module 240 is disposed in the upper layer area 213 above the first processor module 250. Among them, the upper layer area 213 has a front area near the front window and a rear area away from the front window, and the second processor module 240 is at least located in the rear area 2132.

[0063] First of all, it should be noted that the chassis 200 in this application has depth (direction), height (direction), and width (direction) that are pairwise orthogonal. Among them, the depth can be understood as the extension direction between the front window and the rear window of the chassis 200, the height can be understood as the extension direction between the bottom end (such as the bottom plate of the chassis 200) and the top end (such as the top plate of the case cover) of the chassis 200, and the width can be understood as the extension direction between the left end and the right end of the chassis 200. Unless otherwise specified, the depth (direction), height (direction), and width (direction) in the following embodiments can be understood in this way.

[0064] In some exemplary embodiments, with reference to Figure 1 As shown, the chassis 200 is divided into a first space 210 and a second space 220 along the depth direction with the middle backplane 300 as the boundary. Specifically, in the first space 210, the lower layer area 211, the middle layer area 212, and the upper layer area 213 are stacked from bottom to top, and the upper layer area 213 is further divided into a front area 2131 and a rear area 2132 according to the position relative to the front window (which can be regarded as a window opened on the left side of the chassis as shown in Figure 1 As shown, the second processor module 240 can be located only in the rear area 2132 according to the different depths of different second processor modules 240.

[0065] Taking the first processor module 250 as the central processing unit (hereinafter referred to as CPU for short) module and the second processor module 240 as the graphics processing unit (hereinafter referred to as GPU for short) module as an example, the GPU module is arranged in the upper layer area 213 above the CPU module. Through such a design, compared with the related technologies in which the CPU module and / or the hard disk module are arranged above the GPU module, since the height of the GPU module is not restricted by other modules arranged above the GPU module in the related technologies. Therefore, the arrangement of the GPU module (i.e., the second processor module 240) in the height direction can be more flexible. For example, it can meet the height requirements of full-height GPU cards and / or half-height GPU cards vertically arranged in the GPU module; it can also meet the width requirements (such as single-width or double-width) for placing different numbers of GPU cards horizontally.

[0066] In addition, continue to refer to Figure 1 As shown, the front area 2131 and the rear area 2132 in the upper layer area 213 are arranged adjacent to each other. Therefore, the arrangement of the GPU module (i.e., the second processor module 240) in the depth direction can also be more flexible. For example, if the GPU card configured in the GPU module is a GPU card with a shorter depth (which can be a GPU card with a depth less than or equal to 580 mm), or a half-length GPU card, the GPU module can only occupy the rear area 2132, while the front area 2131 can be used to configure other modules; on the contrary, if the GPU card configured in the GPU module is a GPU card with a longer depth (which can be a GPU card with a depth greater than 580 mm, such as a GPU card with a depth of 680 mm), or a full-length GPU card, a part of the GPU card can extend into the front area 2131 to meet the assembly requirements of GPU modules with different depths.

[0067] The above-mentioned GPU card can be understood as a standard card that conforms to the PCI-E specification. On the basis of the standard card, the GPU card is often configured with a variety of common specifications. Among them, the height is halved to a half-height GPU card, the length (which can be understood as the depth direction along the chassis) is halved to a half-length GPU card, and the width is doubled to a double-width GPU card.

[0068] Figure 2 It is a schematic structural diagram of the first cover of the server architecture according to the embodiment of the present application. Figure 3 It is a schematic structural diagram of the second cover of the server architecture according to the embodiment of the present application.

[0069] According to the embodiment of the present application, refer to Figure 2 and Figure 3As shown, the chassis 200 includes a box body 201 and a box cover 202. An opening is formed in the upper part of the box body 201. The box cover 202 is detachably arranged on the box body 201. The box cover 202 has a top plate and side plates symmetrically arranged on both sides of the top plate, and the side plates extend downward. Among them, the box cover 202 includes a first box cover 2021 and a second box cover 2022. The first box cover 2021 and the second box cover 2022 are alternatively arranged on the box body 201, and the side plates of the second box cover 2022 are at least 1U higher than the side plates of the first box cover 2021.

[0070] In some exemplary embodiments, referring to Figure 2 and Figure 3 As shown, an opening is formed in the upper part of the box body 201. Taking the rear window of the chassis 200 as the projection plane, in the projection along the depth direction of the chassis 200, the box cover 202 is configured as an inverted U-shaped structure, and the box cover 202 is buckled on the opening position of the chassis 200 to enclose the box body 201. Specifically, the box body 201 itself is configured to have a height of 4U. Further, the first box cover 2021 is correspondingly configured to have a height of 1U, while the second box cover 2022 is correspondingly configured to have a height of 2U. That is to say, when the first box cover 2021 is assembled on the box body 201, the overall height of the chassis 200 is 5U. Similarly, when the second box cover 2022 is assembled on the box body 201, the overall height of the chassis 200 is 6U. Among them, U is the abbreviation of unit, which represents the unit of rack size or server external dimension, and 1U is equal to 4.445 cm.

[0071] Taking the chassis with a height of 5U as an example, the lower layer area 211 can be understood as the area with a height of approximately 1U at the bottom of the chassis, the middle layer area 212 can be understood as the area with a height of approximately 3U above the lower layer area 211, and the upper layer area 213 can be understood as the area with a height of approximately 1U above the middle layer area 212. Similarly, taking the chassis 200 with a height of 6U as an example, the lower layer area 211 can be understood as the area with a height of approximately 1U at the bottom of the chassis 200, the middle layer area 212 can be understood as the area with a height of approximately 3U above the lower layer area 211, and the upper layer area 213 can be understood as the area with a height of approximately 2U above the middle layer area 212.

[0072] In such an implementation manner, compared with the related art where the box cover 202 is configured as a substantially rectangular plate-like structure, through the design of the inverted U-shaped box cover in this application, the overall height of the chassis 200 is expanded. On the basis of sharing the same box body 201, the height space of the box body 201 can be expanded only by replacing the box cover 202, thus making the design of the server architecture more flexible.

[0073] Figure 4 is based on Figure 1Schematic structural diagram of the second processor module configured in the first embodiment of the server architecture shown. Figure 5 is based on Figure 4 Exploded view of the parts of the server architecture shown.

[0074] Referring to Figure 4 and Figure 5 In the first embodiment shown, the server architecture further includes a hard disk module 260. The hard disk module 260 is disposed in the front region 2131. Among them, when the hard disk module 260 is in the front region 2131, the second processor module 240 is in the rear region 2132. Among them, the implementation manner in which the hard disk module 260 is disposed in the middle region 212 will be described in the following second and third embodiments.

[0075] According to an embodiment of the present application, referring to Figure 4 and Figure 5 shown, the server architecture further includes a main board 280, a switch board 270, and a communication card 2100. The main board 280 is disposed in the middle region 212, the first processor module 250 is disposed on the main board 280 and is interconnected with the main board 280. The switch board 270 is disposed in the middle region 212, is connected to the main board 280, and is interconnected with the first processor module 250 through the main board 280. The communication card 2100 is disposed in the middle region 212 and is connected to the expansion slot of the switch board 270.

[0076] According to an embodiment of the present application, referring to Figure 4 and Figure 5 shown, the second processor module 240 is connected to the expansion slot of the switch board 270.

[0077] According to an embodiment of the present application, referring to Figure 4 and Figure 5 shown, the hard disk module 260 is disposed above the communication card 2100 and is in the front region 2131.

[0078] According to the first embodiment, referring to Figure 4 shown, the chassis 200 is configured as a 5U chassis. In the first space 210 in front of the middle backplane 300, the first power module 230 is in the lower layer region 211; the main board 280, the switch board 270, the first processor module 250, and the communication card 2100 are in the middle layer region 212; the hard disk module 260 is in the front region 2131 of the upper layer region 213, and the second processor module 240 is in the rear region 2132 of the upper layer region 213.

[0079] In this first embodiment, the middle layer region 212 may include at least one of a main board 280, a switching board 270, a hard disk module 260, and a communication card 2100. Among them, the main board 280 includes, but is not limited to, a dual-CPU main board, that is, two CPUs may be provided on the main board 280. It should be understood that the embodiments of the present application are not limited thereto, and in other embodiments, other numbers of CPUs may also be provided on the main board 280.

[0080] On this basis, the switching board 270 may specifically be a PCIe Switch board. The switching unit of the switching board 270 may be electrically connected to at least one of the second processor module 240 and the communication card 2100. The second processing module 240 may be the above-mentioned GPU, and the communication card 2100 may be a network card (that is, Network Interface Card, hereinafter simply referred to as NIC). In this way, the CPU on the main board 280 may be interconnected with at least one of the communication card 2100 and the second processor module 240 via the switching unit of the switching board 270. It should be understood that the embodiments of the present application are not limited thereto, and in other embodiments, the second processing module 240 may also be interconnected with other main boards via the switching board 270 and the communication card 2100.

[0081] Furthermore, the switching board 270 may also be electrically connected to multiple hard disks of the above-mentioned hard disk module 260, and at least a part of the hard disks are arranged on the hard disk backplane. In this way, the CPU may perform read operations or write operations on the hard disks of the hard disk module 260 via the switching board 270 (specifically, the switching unit connected to the CPU) to expand the memory of the CPU. The second processor module 240 may also perform read operations or write operations on the hard disks of the hard disk module 260 via the switching board 270. Based on this, the switching board 270 may exchange data of at least two of the first processor module 250 (that is, the above-mentioned CPU), the second processor module 240 (that is, the above-mentioned GPU), the communication card 2100, or the hard disk based on the PCIe protocol.

[0082] Even further, the middle layer region 212 may further include expansion cards, specifically 4 x16 Risers. The CPU of the main board is interconnected with the switching unit of the switching board 270 via the x16 Riser. It should be understood that the embodiments of the present application are not limited thereto, and in other embodiments, the number of expansion cards may also be other, and / or, bandwidths of other channel numbers may also be provided.

[0083] Based on the topological relationships among the above-mentioned devices in the first embodiment, continue to refer to Figure 5As shown, the hard disk module 260, the main board 280, and the switching board 270 are assembled on the same frame. Taking the width direction of the chassis 200 as the projection direction, the hard disk module 260, the main board 280, and the frame form a substantially L-shaped structure, and the frame of this L-shaped structure can be slidably installed in the chassis 200 through the front window. In the state where the frame of this L-shaped structure is assembled in the chassis 200, the part of the main board 280 and the switching board 270 arranged in its lower part is located in the middle layer area 212, the part with the hard disk module 260 arranged in its upper part is located in the front area 2131, and the second processor module 240 can be located in the rear area 2132. That is to say, the second processor module 240 (i.e., GPU) is blocked by the hard disk module 260 and cannot be exposed to the front window.

[0084] On this basis, for the server architecture of the first embodiment, the hard disk module 260 includes but is not limited to having 18 2.5-inch hard disks. Among them, 10 2.5-inch hard disks are arranged in the front area 2131. These 10 2.5-inch hard disks are arranged in two rows along the height direction, and 5 2.5-inch hard disks in each row are arranged horizontally at intervals along the width direction of the chassis 200; in addition, 8 2.5-inch hard disks are arranged vertically at a position near the front window in the middle layer area 212 and are arranged side by side along the width direction of the chassis 200.

[0085] Furthermore, on both sides of the 8 vertically arranged 2.5-inch hard disks, including but not limited to, 6 PCIe slots are respectively arranged (that is, a total of 12 PCIe slots are arranged on both sides). These PCIe slots can be full-height half-length (that is, Full-Height, Half-Length, hereinafter simply referred to as FHHL) PCIe slots. Among them, 2 of the 6 PCIe slots on the same side are connected to the CPU, and the other 4 slots are connected to the GPU.

[0086] According to the embodiment of the present application, continue to refer to Figure 4 and Figure 5 As shown, the server architecture further includes a power distribution module 290. The power distribution module 290 is arranged in the middle layer area 212 and is plugged into the middle backplane 300. Among them, the first power module 230 is interconnected with the power distribution module 290.

[0087] According to the embodiment of the present application, continue to refer to Figure 4 and Figure 5As shown, the server architecture further includes a cartridge mechanism 100 detachably disposed in the second space 220 of the chassis 200. The cartridge mechanism 100 includes a main body frame 110, an air cooling unit, and a second power module 150. The air cooling unit is disposed in the main body frame 110 and at least faces the second processor module 240. The second power module 150 is disposed in the main body frame 110 and is located below the air cooling unit. The second power module 150 is interconnected with the power distribution module 290 through a midplane backplane 300. Among them, the first power module 230 is configured to supply power to at least the second processor module 240, and the second power module 150 is configured to supply power to at least the first processor module 250.

[0088] In some illustrative embodiments, referring to Figure 4 As shown, the first power module 230 is disposed in the lower layer area 211 of the chassis 200. The second power module 150 is disposed in the second space 220. For example, it can be disposed in the base part of the cartridge mechanism 100, which will be specifically described in the following embodiments. Further, the power distribution module 290 is connected to the midplane backplane 300 through a busbar (also called a bus, or busbar). Among them, the power distribution module 290 can be a power distribution unit (i.e., Power Distribution Unit, abbreviated as PDU).

[0089] In some illustrative embodiments, the first power module 230 includes, but is not limited to, 5 power supply units (i.e., Power Supply Unit, abbreviated as PSU) configured with 54V. The second power module 150 includes, but is not limited to, 2 power supply units (i.e., Power Supply Unit, abbreviated as PSU) configured with 12V. Specifically, the 5 54V PSUs in the first power module 230 are arranged side by side along the width direction of the chassis 200, and the 2 12V PSUs in the second power module 150 are stacked along the height direction of the chassis 200. Further, the first power module 230 includes, but is not limited to, being configured to supply power to the second processor module 240 (i.e., GPU) and the air cooling unit (which can be the following first air cooling unit 120 and / or second air cooling unit 130), and the second power module 150 includes, but is not limited to, being configured to supply power to the first processor module 250.

[0090] In some illustrative embodiments, five 54V PSUs in the first power supply module 230 are electrically connected to the PDU via a dual-input AC power supply cable to achieve a 54V input. Further, two 12V PSUs of the second power supply module 150 are connected in a blind pluggable manner via a bus bar to provide a 12V input to the midplane 300. Further, the power of the 54V PSU includes but is not limited to being configured as 3300W, and the power of the 12V PSU includes but is not limited to being configured as 3200W. Among them, the power that can be provided by the five 54V PSUs is 16.5kW, but the actual required rated power of the electrical equipment is configured to be less than or equal to 13.2 kW. For this reason, a redundant design is formed by the five 54V PSUs. Even when one 54V PSU fails, the other four 54V PSUs can still meet the power requirements of the electrical equipment; the two 12V PSUs adopt a CRPS redundant design, that is, the two 12V PSUs work simultaneously, and when any one of the 12V PSUs fails, the system will automatically switch to the other PSU to ensure power supply continuity. It should be understood that the embodiments of the present application are not limited thereto. For example, the above-mentioned first power supply module 230 and / or the second power supply module 150 may adopt a power supply unit with other rated powers and rated voltages, or may also be configured with other different numbers of power supply units.

[0091] According to an embodiment of the present application, the hard disk module 260 is disposed on the side of the communication card 2100 and is located in the middle layer area 212. Specifically, reference may be made to the following second embodiment and third embodiment.

[0092] Figure 6 is based on Figure 5 Schematic diagram of the first air-cooling unit configured according to the server architecture shown. Figure 7 is based on Figure 1 Schematic diagram of the structure of the second processor module configured according to the second embodiment of the server architecture shown. Figure 8 is based on Figure 7 Exploded view of the parts of the server architecture shown.

[0093] According to the second embodiment, referring to Figure 6 shown, the chassis 200 is configured as a 5U chassis. In the first space 210 before the midplane 300, the first power supply module 230 is located in the lower layer area 211; the motherboard 280, the switch board 270, the first processor module 250, the hard disk module 260, and the communication card 2100 are located in the middle layer area 212; the second processor module 240 is located in the rear area 2132 of the upper layer area 213 and extends to the front area 2131.

[0094] In this second embodiment, the middle layer region 212 may include at least one of a main board 280, a switching board 270, a hard disk module 260, and a communication card 2100. Among them, the main board 280 includes, but is not limited to, a dual-CPU main board, that is, two CPUs can be provided on the main board. In the second embodiment, the topological relationship among the main board 280, the switching board 270, the hard disk module 260, and the communication card 2100 is similar to that of the above-mentioned first embodiment, and therefore will not be elaborated here.

[0095] Furthermore, the middle layer region 212 may further include expansion cards, specifically, two x16 FHHL Risers. The CPUs of the main board are interconnected with the switching units of the switching board 270 via the FHHL Risers.

[0096] Based on the second embodiment, with reference to Figure 6 and Figure 7 as shown, the hard disk module 260, the main board 280, and the switching board 270 are assembled in the same frame, which is different from the above-mentioned first embodiment and is in the shape of a roughly cube. In the state where the roughly cube-shaped frame is assembled in the chassis 200, the hard disk module 260, the main board 280, and the switching board 270 are all located in the middle layer region 212, and the second processor module 240 is located in the upper layer region and spans the front region 2131 and the rear region 2132. That is to say, the second processor module 240 (i.e., the GPU) is exposed to the front window. Since the second processor module 240 is exposed to the front window, the second processor module 240 can be interconnected with the devices configured in other server architectures through interconnection cables.

[0097] On this basis, for the server architecture of the second embodiment, it includes, but is not limited to, two PCIe slots arranged horizontally, and the two PCIe slots are connected to the CPU. In addition, four vertically arranged PCIe slots (i.e., a total of eight PCIe slots are arranged on both sides) are respectively arranged on both sides of the two slots, and the four PCIe slots are connected to the GPU.

[0098] Further, on the same side of the vertically arranged PCIe slots, four E1.S disk hard disk backplanes are arranged at intervals along the height direction of the chassis 200 (i.e., a total of eight E1.S disk hard disk backplanes are arranged on both sides).

[0099] Figure 6 is a schematic diagram of the first air-cooling unit configured based on the Figure 5 shown server architecture.

[0100] Based on the 5U chassis of the above-mentioned first embodiment and second embodiment, with reference to Figure 6As shown, a first air cooling unit 120 is configured within the chassis mechanism of the server architecture. Further descriptions regarding the relevant features of the first air cooling unit 120 will be provided in the following embodiments.

[0101] Figure 9 is based on Figure 1 The structural schematic diagram of configuring the second processor module according to the third embodiment of the server architecture shown. Figure 10 is based on Figure 9 The exploded view of the parts of the server architecture shown.

[0102] According to the third embodiment, with reference to Figure 9 As shown, the chassis 200 is configured as a 6U chassis. In the first space 210 before its middle backplane 300, the first power module 230 is located in the lower layer area 211; the motherboard 280, the switch board 270, the first processor module 250, the hard disk module 260, and the communication card 2100 are located in the middle layer area 212; the second processor module 240 is located in the rear area 2132 of the upper layer area 213 and extends to the front area 2131.

[0103] In this third embodiment, the middle layer area 212 may include at least one of the motherboard 280, the switch board 270, the hard disk module 260, and the communication card 2100. Among them, the motherboard 280 includes but is not limited to a dual-way CPU motherboard, that is, two CPUs can be set on the motherboard. In the third embodiment, the topological relationship among the motherboard 280, the switch board 270, the hard disk module 260, and the communication card 2100 is similar to that of the above first embodiment and the second embodiment, so details will not be repeated here.

[0104] Based on the third embodiment, with reference to Figure 9 and 10 As shown, the hard disk module 260, the motherboard 280, and the switch board 270 are assembled in the same frame. The hard disk module 260, the motherboard 280, and the switch board 270 are all located in the middle layer area 212, and the second processor module 240 is located in the upper layer area and spans the front area 2131 and the rear area 2132. That is to say, the second processor module 240 (i.e., GPU) is exposed to the front window. Due to the second processor module 240 being exposed to the front window, the second processor module 240 can be interconnected with the devices configured in other server architectures through interconnection cables.

[0105] On this basis, for the server architecture of the third embodiment, the hard disk module 260 includes but is not limited to having an 8-slot U.2 disk hard disk backplane, and the 8-slot U.2 disk hard disk backplane is vertically arranged and distributed side by side along the width direction of the chassis 200.

[0106] Further, on both sides of the vertically arranged 8 U.2 disk hard drive backplanes, including but not limited to, 6 PCIe slots are respectively provided (i.e., a total of 12 PCIe slots are provided on both sides). These PCIe slots can be full-height, half-length (i.e., Full-Height, Half-Length, hereinafter simply referred to as FHHL) PCIe slots. Among them, 2 of the 6 PCIe slots on the same side are connected to the CPU, and the other 4 slots are connected to the GPU.

[0107] Figure 11 is based on Figure 9 Schematic diagrams of the first air-cooling unit and the second air-cooling unit configured based on the server architecture shown. Figure 12 Stereogram of the chassis mechanism of the embodiment of the present application. Figure 13 is Figure 12 Stereogram of another perspective of the chassis mechanism shown.

[0108] Referring to Figures 11 to 13 As shown, the air-cooling unit in the server architecture provided by the present application includes a first air-cooling unit 120. The first air-cooling unit 120 includes a first fan board 122 and at least two first fan modules 121. The first fan board 122 is disposed on the main body frame 110, and the first fan board 122 is provided with a first electrical connection portion 1221. At least two first fan modules 121 are disposed on the main body frame 110 and have a first electrical mating portion 1212 connected to the first electrical connection portion 1221. At least one first fan module 121 is at a different height from the other first fan modules 121. Among them, the first electrical mating portions 1212 of the first fan module 121 at the high position and the first fan module 121 at the low position are both connected to the same first fan board 122.

[0109] In such an embodiment, the chassis mechanism 100 arranges at least two first fan modules 121 in the first air-cooling unit 120 at different heights. The first fan modules 121 at the high position and / or the low position and the main body frame 110 can utilize the height difference between the first fan modules 121 to form a space for coupling with the liquid-cooling unit configured in the server. The liquid-cooling unit in the server architecture cools at least components, pipelines, pumps and other devices. Among them, the cooling component can be a cold plate, and the cold plate can be disposed on the above-mentioned first processor module 250 and / or the second processor module 240. Specifically, the cold plate can be abutted against the CPU or GPU to form heat exchange; and the pipeline connected to the cold plate passes through the rear window of the server architecture by the chassis mechanism 100.

[0110] Based on the chassis structure configured as 5U in the above first embodiment and the second embodiment, reference can be made to Figure 6The layout of the first air-cooling unit 120 shown; based on the chassis structure configured as 5U in the above-mentioned third embodiment, reference can be made to Figures 11 to 13 The layout of the first air-cooling unit 120 and the second air-cooling unit 130 shown. It should be noted that Figure 12 and Figure 13 The embodiments shown together show the first air-cooling unit 120 and the second air-cooling unit 130, wherein Figure 6 、 Figure 12 and Figure 13 In the embodiments shown, the first air-cooling unit 120 adopts a similar design. Therefore, by Figure 12 and Figure 13 The first air-cooling unit 120 shown is used to illustrate Figure 6 The embodiment shown.

[0111] On this basis, the first air-cooling unit 120 is arranged at a position in the upper layer area 213 of the second space 220 facing the first space 210. The lower space formed between the lower part of the first fan module 121 at a high position and the chassis mechanism 100 can also be the upper space formed between the upper part of the first fan module 121 and the chassis mechanism 100 (which will be specifically described in the following embodiments). Since there is no need to avoid the pipeline of the air-cooling unit in the horizontal direction, the blind area in the server that cannot be air-cooled can be effectively reduced, so as to make full use of the space in the chassis mechanism 100 and the server chassis. In this way, the layout of the first fan module 121 in the first air-cooling unit 120 can be more flexible, and it is beneficial to dissipate heat from electronic devices at different heights in the server.

[0112] In addition, in the related art, different fan boards are often configured to form electrical connections for fan modules at different heights. In this embodiment, by connecting the first fan modules 121 at different heights to the same first fan board 122, the number of the first fan boards 122 to be arranged is correspondingly reduced. This not only saves the space in the server occupied by arranging multiple fan boards, but also reduces the coupling difficulty caused by the interference of arranging multiple fan boards to the pipeline of the liquid-cooling unit.

[0113] According to the embodiment of the present application, with reference to Figure 12 and Figure 13 shown, the first air-cooling unit 120 includes at least three first fan modules 121. Among them, at least two first fan modules 121 are arranged at the same height and are arranged side by side.

[0114] In some exemplary embodiments, with reference to Figure 12 and Figure 13As shown, the first air-cooling unit 120 includes, but is not limited to, five first fan modules 121. Specifically, four of the first fan modules 121 are arranged side by side at the same height position of the main body frame 110, that is, the first fan module 121 at the lower position; the other first fan module 121 is arranged at a height position of the main body frame 110 higher than the other first fan modules 121, that is, the first fan module 121 at the higher position.

[0115] In some exemplary embodiments, the first fan module 121 at the higher position is arranged in the middle of the first air-cooling unit 120. For example, for the first air-cooling unit 120 having five first fan modules 121, the first fan module 121 at the higher position can be arranged between the other four first fan modules 121 at the lower positions. Specifically, the distance between the first fan module 121 at the higher position and the bottom of the main body frame 110 should be configured to be greater than the pipeline diameter of the liquid-cooling unit configured in the server architecture, so that the space defined by the first air-cooling unit 120 and the main body frame 110 can be coupled with the liquid-cooling unit (such as the liquid-cooling unit) of the server. It should be understood that the embodiments of the present application are not limited thereto.

[0116] For example, the first air-cooling unit 120 may include two, three, four, five, six, seven, eight, nine, or any other number of first fan modules 121.

[0117] Again, in the first air-cooling unit 120, at least two first fan modules 121 may be configured to be higher than the other first fan modules 121.

[0118] Also, the first fan module 121 at the higher position may be arranged at a position other than the middle of the first air-cooling unit 120.

[0119] Figure 14 is Figure 13 The partial enlarged view of the first fan plate and the first beam-shaped member part shown.

[0120] According to the embodiments of the present application, with reference to Figure 13 and Figure 14 As shown, the first air-cooling unit 120 further includes a first beam-shaped member 123. The first beam-shaped member 123 is horizontally arranged between two opposite end faces of the main body frame 110. Among them, the first fan plate 122 is stacked on the first beam-shaped member 123.

[0121] In some exemplary embodiments, with reference to Figure 13 and Figure 14As shown, the first beam-shaped member 123 includes but is not limited to a sheet structure configured to be approximately rectangular, which can be a metal sheet. The approximately rectangular shape can be understood as that the first beam-shaped member 123 has a short side and a long side that is obviously longer than the short side, and visually the long side and the short side surround a quadrilateral sheet structure, but based on the assembly requirements of the first beam-shaped member 123 with the main frame 110 and / or the first fan plate 122, one or some end faces of the first beam-shaped member 123 are provided with grooves, through holes, protrusions and other structures, resulting in that the first beam-shaped member 123 does not meet the strict definition of a rectangle in geometry. In detail, the two ends of the first beam-shaped member 123 in the long direction are connected to the facing end faces of the main frame 110 (specifically, the end faces of the base 112), and the first beam-shaped member 123 is connected to the main frame 110 by riveting, welding, bolt connection, snap connection and any other methods. Furthermore, a limiting structure corresponding to the first fan plate 122 is also provided on the end surface of the first beam-shaped member 123 facing the first fan plate 122 .

[0122] In some exemplary embodiments, the first fan plate 122 is stacked on the first beam-shaped member 123. Specifically, an I-shaped nail is disposed on the upper end surface of the first beam-shaped member 123, and a gourd hole is disposed at a position of the first fan plate 122 facing the I-shaped nail, so that the first fan plate 122 and the first beam-shaped member 123 can be accurately assembled through the cooperation of the gourd hole and the I-shaped nail, so that the first electrical connection portion 1221 provided on the first fan plate 122 and the first electrical matching portion 1212 provided on the first fan module 121 can be accurately positioned.

[0123] Furthermore, the first beam-shaped member 123 is further provided with screw holes, so that after the first fan plate 122 is assembled on the first beam-shaped member 123 , the first fan plate 122 is tightly fixed to the first beam-shaped member 123 by fasteners (such as screws, etc.).

[0124] According to the embodiments of the present application, referring to Figure 13 and Figure 14 As shown, the first fan plate 122 has a first end surface and a second end surface which are separated from each other, and the first end surface and the second end surface are respectively provided with a first electrical connection portion 1221. The first electrical connection portion 1221 located at the first end surface is connected to the first electrical matching portion 1212 of the first fan module 121 at a lower position, and the first electrical connection portion 1221 located at the second end surface is connected to the first electrical matching portion 1212 of the first fan module 121 at a higher position.

[0125] In some exemplary embodiments, the first fan plate 122 and the first beam-shaped member 123 are stacked, the first end surface of the first fan plate 122 is in contact with the first beam-shaped member 123, and the second end surface of the first fan plate 122 is away from the first beam-shaped member 123.Figure 13 and Figure 14 In the embodiment shown, the first beam member 123 is horizontally disposed on the main body frame 110, and the first fan plate 122 is disposed above the first beam member 123. For this reason, the first end face can be understood as the lower end face of the first fan plate 122, and the second end face can be understood as the upper end face of the first fan plate 122.

[0126] It should be noted that the above-mentioned first end face and second end face are only for distinguishing different end faces of the first fan plate 122. For this reason, in view of different usage scenarios, the above-mentioned first end face can also be understood as the upper end face of the first fan plate 122, and the second end face can also be understood as the lower end face of the first fan plate 122.

[0127] In some exemplary embodiments, a plurality of first electrical connection portions 1221 are respectively disposed on the upper end face of the first fan plate 122. Specifically, the number of the first electrical connection portions 1221 configured on the first fan plate 122 should be configured to be greater than or equal to the number of the first electrical cooperation portions 1212 provided on the first fan module 121 that needs to be connected to the first fan plate 122. Continuing to refer to Figure 13 and Figure 14 In the embodiment shown, in order to connect the above-mentioned five first fan modules 121 to the same first fan plate 122, at least five first electrical connection portions 1221 need to be configured on the first fan plate 122. Among them, the four first fan modules 121 at the lower position can be connected to the first electrical connection portions 1221 provided on the second end face (i.e., the upper end face) of the first fan plate 122, and the one first fan module 121 at the upper position can be connected to the first electrical connection portions 1221 provided on the first end face (i.e., the lower end face) of the first fan plate 122. It should be understood that the embodiments of the present application are not limited thereto.

[0128] For example, the number of the first electrical connection portions 1221 configured on the first fan plate 122 can be more than that of the first electrical cooperation portions 1212 of the first air-cooling unit 120. That is to say, after each first fan module 121 is connected to the first fan plate 122, there are still some first electrical connection portions 1221 that are idle. In this way, the first fan plate 122 can also be applicable to other embodiments or usage scenarios, so that the first fan plate 122 can be replaced and reused in different scenarios to expand the applicability of the first fan plate 122.

[0129] Figure 15 is Figure 12 The perspective view of the first fan module at the lower position shown. Figure 16 is Figure 12 The perspective view of the first fan module at the upper position shown.

[0130] According to the embodiment of the present application, referring to Figure 15and Figure 16 As shown, the first electrical mating portion 1212 of the first fan module 121 at the high position is disposed at the bottom of the first fan module 121.

[0131] According to an embodiment of the present application, referring to Figure 15 and Figure 16 As shown, the first electrical mating portion 1212 of the first fan module 121 at the low position is disposed at the top of the first fan module 121.

[0132] In some exemplary embodiments, referring to Figure 15 and Figure 16 As shown, the first fan module 121 includes a housing and a fan main body disposed in the housing. The housing is the mounting base of the first fan module 121 and is adapted to connect the fan main body to the main frame 110 of the chassis mechanism 100 (such as the first installation space described below). The fan main body includes a motor and components such as a fan blade mounted on the output end of the motor, and is adapted to direct air to form an air flow. Further, the first electrical mating portion 1212 is disposed on the housing, and the first electrical mating portion 1212 is also electrically connected to the fan main body (such as the motor) so that the first fan module 121 can be powered externally. Among them, the electrical connection portion and the electrical mating portion can adopt electrical connectors. Specifically, one of the electrical connection portion and the electrical mating portion includes, but is not limited to, using a female terminal connector, and the other can adopt a male terminal connector.

[0133] In some exemplary embodiments, the first electrical mating portion 1212 of the first fan module 121 at the high position is connected to the first electrical connection portion 1221 located on the first end face (i.e., the lower end face) of the first fan plate 122. Further, the first electrical mating portion 1212 of the first fan module 121 at the low position is connected to the first electrical connection portion 1221 located on the second end face (i.e., the upper end face) of the first fan plate 122. It can be understood that in the projection with the housing of the first fan module 121 as the projection plane and the axial direction of the fan main body as the projection direction, the projections of the first fan module 121 at the low position and the first fan module 121 at the high position on the first fan plate 122 partially overlap.

[0134] That is to say, the first fan module 121 at the high position and the first fan module 121 at the low position are misaligned and connected to the first fan board 122. Among them, the first electrical mating part 1212 of the first fan module 121 at the high position extends downward below the first fan board 122, while the first electrical mating part 1212 of the first fan module 121 at the low position extends upward above the first fan board 122. For this reason, the first fan module 121 at the high position, the first fan module 121 at the low position, and the first fan board 122 effectively utilize the height space. In this embodiment, the space occupied by the first air-cooling unit 120 in the height direction is less than the sum of the heights of the two first fan modules 121 and the thickness of the first fan board 122. In this way, a large amount of space can be saved in the height direction, and there is no need to redesign the height of the main frame 110.

[0135] Furthermore, the difference between the first fan module 121 at the high position and the first fan module 121 at the low position lies only in the position where the first electrical mating part 1212 is set. For this reason, it can be understood that the first fan module 121 at the high position and the first fan module 121 at the low position can adopt the same first fan module 121. When connecting the first fan module 121 to different first electrical connection parts 1221 of the first fan board 122, only by rotating the first fan module 121 by 180° around the axis, for this reason, the usage scenarios of the first fan module 121 are expanded, making the first fan module 121 reusable.

[0136] In such an embodiment, through the cooperation of the first fan module 121 at the high position, the first fan module 121 at the low position, and the first fan board 122, the height space is saved. Moreover, through the position design of the first electrical mating part 1212 of the first fan module 121, the first fan module 121 and the first fan board 122 are reusable, further reducing the cost and assembly difficulty of the server architecture.

[0137] Based on the chassis structure configured as 6U in the above-mentioned third embodiment, continue to refer to Figure 12 and Figure 13 As shown, the insertion box mechanism 100 further includes a second air-cooling unit 130. The second air-cooling unit 130 is arranged in the upper space of the first air-cooling unit 120. The second air-cooling unit 130 includes a second fan board 131 and a second fan module 132. The second fan board 131 is arranged on the main frame 110, and the second fan board 131 is provided with a second electrical connection part 1311. The second fan module 132 is arranged on the main frame 110 and has a second electrical mating part 1322 connected to the second electrical connection part 1311.

[0138] In some illustrative embodiments, continue to refer to Figure 12 andFigure 13 As shown, the first fan module 121 in the first air-cooling unit 120 is arranged side by side in a row array. Similarly, the second fan module 132 in the second air-cooling unit 130 is also arranged in a row array, and each second fan module 132 is stacked on at least one first fan module 121 to form a column array. Specifically, in at least one column of fan modules arranged in a column array (i.e., the first fan module 121 and / or the second fan module 132), a space can be formed between the upper part of the fan module and the main body frame 110, or a space can be formed between the lower part of the fan module and the main body frame 110, or spaces can be formed between both the upper and lower parts of the fan module and the main body frame 110. That is to say, the pipeline of the liquid-cooling unit can pass through the upper part of the fan module (i.e., the first fan module 121 and / or the second fan module 132), or through the lower part of the fan module, or through the upper and lower parts of the fan module respectively, so as to couple the air-cooling unit and the liquid-cooling unit. How to pass, limit, and support the pipeline of the liquid-cooling unit will be described in the following embodiments.

[0139] Figure 17 is Figure 13 A partial enlarged view of the second fan plate, the second beam member, and the third beam member shown. Figure 18 is Figure 17 A perspective view from the bottom view. Figure 19 is Figure 17 An exploded view of the second beam member and the third beam member shown.

[0140] According to an embodiment of the present application, referring to Figures 17 to 19 As shown, the second fan plate 131 has a third end face, and a second electrical connection portion 1311 is provided on the third end face. And / or, the second electrical mating portion 1322 of the second fan module 132 is provided at the bottom of the second fan module 132.

[0141] According to an embodiment of the present application, referring to Figures 17 to 19 As shown, the second air-cooling unit 130 further includes a second beam member 133 and / or a third beam member 134. The second beam member 133, the third beam member 134, and the second fan plate 131 are stacked. Among them, at least one of the second beam member 133 and the third beam member 134 is horizontally arranged between two opposite end faces of the main body frame 110.

[0142] In some exemplary embodiments, as Figures 17 to 19 shown, the second air-cooling unit 130 may only include the second beam member 133, or only include the third beam member 134, or include both the second beam member 133 and the third beam member 134 at the same time.

[0143] Taking the second air cooling unit 130 including the second beam-shaped member 133 and the third beam-shaped member 134 as an example, the second beam-shaped member 133, the third beam-shaped member 134 and the second fan plate 131 are stacked from top to bottom. In this way, it is beneficial to improve the supporting strength of the second fan plate 131 and the main frame 110 (such as the base 112). In addition, the second beam-shaped member 133 and the third beam-shaped member 134 are used in combination, and the thickness is also large, which can be conveniently provided with a structure such as a slot 1341 for assembly with the main frame 110 at both ends of the third beam-shaped member 134, so as to meet the assembly requirements of the second fan plate 131 and the main frame 110.

[0144] Furthermore, the second beam-shaped member 133 and / or the third beam-shaped member 134 may also be designed similarly with reference to the shape of the first beam-shaped member 123 of the above embodiment, and the first beam-shaped member 133 and the third beam-shaped member 134 may be interlocked to reduce the overall thickness. In addition, the surface of the third beam-shaped member 134 facing the second fan plate 131 may be provided with a limiting structure corresponding to the second fan plate 131. The limiting structure includes but is not limited to providing an I-shaped nail 203 on the lower end surface of the third beam-shaped member 134 and providing a gourd hole on the second fan plate 131 to accurately assemble with the I-shaped nail 203, and then fixing the second beam-shaped member 133 and / or the third beam-shaped member 134 to the second fan plate 131 by fasteners.

[0145] In some exemplary embodiments, the second air cooling unit 130 includes but is not limited to being provided with two second fan modules 132. In detail, the second electrical matching portions 1322 of the two second fan modules 132 are connected to different second electrical connection portions 1311 of the same second fan plate 131. It should be understood that the embodiments of the present application are not limited thereto.

[0146] For example, the second air cooling unit 130 may include 2, 3, 4, 5, 6, 7, 8, 9, or any other number of second fan modules 132 .

[0147] Referring to the above embodiment, the first fan plate 122 is a reusable embodiment, and the second fan plate 131 can be understood as the first fan plate 122 flipped 180 degrees in the vertical direction. In other words, the first fan plate 122 and the second fan plate 131 are only used to distinguish different installation spaces in the above plug-in mechanism 100. In some usage scenarios, the first fan plate 122 and the second fan plate 131 are interchangeable.

[0148] For example, when a certain fan board is disposed at the bottom of the main body frame 110, it can be regarded as the first fan board 122; and when the fan board is disposed at the top of the main body frame 110, by rotating the fan board 180°, it can be regarded as the second fan board 131. In this way, the fan board can be interchangeable in different installation spaces, improving the convenience of assembly and reducing the cost of manufacturing multiple fan boards with different specifications.

[0149] Figure 20 Yes Figure 1 is a perspective view of the second fan module shown.

[0150] In some exemplary embodiments, referring to Figure 20 shown, the second fan module 132 includes a housing and a fan body disposed in the housing, which is specifically similar to the first fan module 121, and thus will not be described in detail herein. Further, the second electrical mating portion 1322 of the second fan module 132 is disposed at the bottom of the housing of the second fan module 132, and its arrangement is similar to that of the first fan module 121 at a high position in the above embodiment.

[0151] It should be noted that the above first fan module 121 and second fan module 132 are only for distinguishing different installation spaces in the above-mentioned chassis mechanism 100. In some usage scenarios, the first fan module 121 and the second fan module 132 are interchangeable.

[0152] For example, when a certain fan module is disposed at the bottom of the main body frame 110, it can be regarded as the first fan module 121, and when the fan module is disposed at the top of the main body frame 110, by rotating the fan module 180° about the axis, it can be regarded as the second fan module 132. In this way, the fan module can be interchangeable in different installation spaces, improving the convenience of assembling the fan module and the main body frame 110. And since the first fan module 121 at a low position, the first fan module 121 at a high position and the second fan module 132 are only distinguished by the difference in the installation direction, therefore, the cost of using at least two different specifications of fan modules is also reduced.

[0153] Figure 21 Yes Figure 13 is a perspective view of the chassis mechanism configured with a midplane shown. Figure 22 Yes Figure 21 is a partial enlarged view of the midplane shown.

[0154] According to an embodiment of the present application, referring to Figure 21 and Figure 22As shown, the chassis mechanism 100 further includes a middle backplane 300. The middle backplane 300 is vertically disposed on the main frame 110, and a third electrical connection portion is provided on a side of the middle backplane 300 facing the main frame 110. The first fan board 122 and the second fan board 131 are also provided with a third electrical mating portion for connecting to the third electrical connection portion.

[0155] According to an embodiment of the present application, referring to Figure 21 and Figure 22 As shown, a backplane bracket 310 is vertically disposed between two opposite end faces of the main frame 110, and the middle backplane 300 is disposed on the backplane bracket 310.

[0156] In some illustrative embodiments, referring to Figure 21 As shown, the middle backplane 300 is connected between two opposite end faces of the main frame 110 and is disposed in the vertical direction. Specifically, a third electrical connection portion is provided on an end face of the middle backplane 300 facing the air-cooling unit (such as the above-mentioned first fan board 122 and second fan board 131). Correspondingly, the first fan board 122 is provided with a third electrical mating portion A1222, and the second fan board 131 is also provided with a third electrical mating portion B1312 to connect to third electrical connection portions (blocked and not shown) at different heights of the middle backplane 300 and form an electrical connection, so that the first fan module 121 and the second fan module 132 can obtain power from the second power module 150 through the middle backplane 300. Specifically, one of the electrical connection portion and the electrical mating portion includes, but is not limited to, using a female terminal connector, and the other can use a male terminal connector. Further, in addition to the above-mentioned third electrical connection portion, the middle backplane 300 is also provided with other electrical connectors on its end face to connect different electronic devices in the server.

[0157] Figure 23 is Figure 21 an exploded view of the backplane bracket shown.

[0158] According to an embodiment of the present application, referring to Figure 21 and Figure 23 As shown, the backplane bracket 310 includes a first plate-like member 311 and a second plate-like member 312. Two ends of the first plate-like member 311 are respectively connected to the main frame 110, and the second plate-like member 312 and the middle backplane 300 are respectively connected to opposite end faces of the first plate-like member 311. Among them, the elastic modulus of the second plate-like member 312 is configured to be greater than the elastic modulus of the first plate-like member 311. Among them, the first plate-like member 311, the second plate-like member 312, and the middle backplane 300 may have hollow areas, such as through heat dissipation holes provided.

[0159] In some illustrative embodiments, referring to Figure 21 and Figure 23As shown, the backplane bracket 310 is configured as a double-layer structure, including a first plate member 311 and a second plate member 312. The first plate member 311 and the second plate member 312 have different elastic moduli. Since the elastic modulus of the second plate member 312 is configured to be greater than that of the first plate member 311, therefore, the first plate member 311 is more likely to deform compared to the second plate member 312.

[0160] In some exemplary embodiments, the first plate member 311 is provided with a step nut for connecting (such as riveting) a board card. Further, the second plate member 312 is connected (such as riveted) to the first plate member 311. Among them, the first plate member 311 includes but is not limited to being made of materials such as aluminum alloy and steel. Specifically, it can be integrally formed from profiles made of the above materials; the second plate member 312 includes but is not limited to being made of alloy materials formed by components such as iron, carbon, and silicon. Specifically, it can be formed by casting the above materials.

[0161] In such an embodiment, the first plate member 311 is more likely to deform than the second plate member 312. Therefore, holes and grooves can be made using its lower elastic modulus to facilitate the installation of the middle backplane 300 on the main frame 110. On the contrary, the second plate member 312 is less likely to deform than the first plate member 311. Therefore, it can support the first plate member 311 and the middle backplane 300. For example, when the middle backplane 300 (pre-installed on the backplane bracket 310) is inserted into the main frame 110 from front to back (such as pushed from the front window to the back window direction), the second plate member 312 can effectively prevent the first plate member 311 and the main frame 110 from deforming.

[0162] Figure 24 is Figure 1 A perspective view of the main frame part of the chassis mechanism shown.

[0163] According to an embodiment of the present application, referring to Figure 24 As shown, the main frame 110 includes a bracket 111. A partition is provided inside the bracket 111 to divide the inside of the bracket 111 into a plurality of first installation spaces 113 in the horizontal and vertical directions. Among them, a part of the first installation spaces 113 is provided with a first fan module 121, or a second fan module 132, and another part of the first installation spaces 113 is provided with a support plate 140.

[0164] In some exemplary embodiments, referring to Figure 24As shown, the main body frame 110 includes a bracket 111 located at the upper part and a base 112 at least partially below the bracket 111. A plurality of partition plates are arranged in the bracket 111 in the horizontal direction and / or the vertical direction respectively to divide the internal space of the bracket 111 into a plurality of through first installation spaces 113. Specifically, the first fan module 121 and the second fan module 132 are slidably arranged in the first installation space 113 to assemble the first fan module 121 and the second fan module 132 on the main body frame 110.

[0165] In some illustrative embodiments, referring to Figure 24 As shown, the plurality of first installation spaces 113 separated by the partition plates may be non-uniform.

[0166] For example, the volume of the first installation space 113 for assembling the first fan module 121 or the second fan module 132 may be larger than the volume of the first installation space for assembling the support plate 140. Of course, these first installation spaces 113 may also be uniformly arranged.

[0167] Further referring to Figure 24 As shown, at least a part of the support plate 140 is arranged in the lower space of the first fan module 121 at a high position. And / or, at least another part of the support plate 140 is arranged in the upper space of the first fan module 121 at a high position. And / or, at least another part of the support plate 140 is arranged offset in the height direction from the first fan module 121 at a high position and is located horizontally between the second fan module 132 and the first fan module 121 at a high position.

[0168] In some illustrative embodiments, referring to Figure 24 As shown, at least one support plate 140 is arranged below the first fan module 121 at a high position and is located in the lower space between two first fan modules 121 at a low position.

[0169] In some illustrative embodiments, referring to Figure 24 As shown, at least two support plates 140 are symmetrically arranged on both sides of the first fan module 121 at a high position and are located horizontally between the first fan module 121 at a high position and the adjacent second fan module 132.

[0170] In such an embodiment, the space above or below the fan module (such as the first fan module 121 and / or the second fan module 132) is utilized to accommodate the support plate 140 for threading the pipeline. In this way, when the chassis mechanism 100 couples the air-cooling unit with the liquid-cooling unit, each of the first fan modules 121 can still be arranged side by side. Since there is no need to omit a certain fan module to avoid the pipeline, the blind area in the server where air cooling cannot be performed can be effectively reduced, so as to make full use of the space in the chassis mechanism 100 and the chassis 200 of the server.

[0171] Figure 25 Yes Figure 24 Partial enlarged view of the support plate part shown. Figure 26 Yes Figure 24 Partial enlarged view of the assembly part of the bracket and the support plate of the chassis mechanism shown.

[0172] According to an embodiment of the present application, referring to Figure 25 and Figure 26 shown, the chassis mechanism 100 further includes a support plate 140 disposed on the main body frame 110, and the support plate 140 is provided with a pipe-passing hole 141 for threading the pipeline.

[0173] In some exemplary embodiments, referring to Figure 25 and Figure 26 shown, the support plate 140 includes, but is not limited to, a sheet-like structure with a cross-section configured to be substantially rectangular and adapted to the first installation space 113. Specifically, a pipe-passing hole 141 is provided in the middle of the sheet-like support plate 140 to accommodate the pipeline of the liquid-cooling unit to pass through. Among them, the pipe-passing hole 141 can be one (to accommodate the inlet pipe or the outlet pipe to pass through), or multiple (to accommodate the inlet pipe and the outlet pipe to pass through respectively). Further, at least one fixing hole 143 is provided around the pipe-passing hole 141 of the support plate 140 to connect the joint of the pipeline when the pipeline is threaded through the support plate 140.

[0174] In some exemplary embodiments, referring to Figure 25 shown, the support plate 140 further has a flanging structure bent towards the first installation space 113. Specifically, a stop groove 142 facing the first installation space 113 is provided in the flanging structure. Correspondingly, a stop pin 1112 is provided in the first installation space 113 formed by the bracket 111. In this way, when the support plate 140 is installed in the first installation space 113, the support plate 140 can be effectively limited by the cooperation of the stop groove 142 and the stop pin 1112, so that it is vertically installed on the bracket 111.

[0175] Figure 27 Yes Figure 24 Partial enlarged view of the baffle and elastic member part of the chassis mechanism shown.

[0176] According to an embodiment of the present application, with reference to Figure 24 and Figure 27 as shown, the first fan module 121 and / or the second fan module 132 are detachably disposed in the first installation space 113. The chassis mechanism 100 further includes a baffle 160 disposed in the first installation space 113, and the baffle 160 is configured to move between a closed position for closing the first installation space 113 and an open position for opening the first installation space 113.

[0177] According to an embodiment of the present application, with reference to Figure 24 and Figure 27 as shown, the baffle 160 is pivotally disposed on the wall of the first installation space 113. The chassis mechanism 100 further includes an elastic member 161, and the elastic member 161 abuts against the baffle 160 and the wall of the first installation space 113, and is configured to apply a pressure to the baffle 160 towards the closed position to reset the baffle 160 to the closed position.

[0178] In some illustrative embodiments, with reference to Figure 24 and Figure 27 as shown, the baffle 160 includes but is not limited to being disposed in the first installation space 113 for assembling the first fan module 121 or the second fan module 132. Specifically, the baffle 160 is rotatably connected to the partition by a shaft. Further, the elastic member 161 includes but is not limited to a torsion spring, wherein the middle of the torsion spring is sleeved outside the shaft, and the two arms (such as the upper arm and the short arm) of the torsion spring respectively abut against the baffle 160 and the partition to apply a force to the baffle 160 from the open position to the closed position, so as to keep the first installation space 113 in the closed position.

[0179] In some illustrative embodiments, with reference to Figure 27As shown, the baffle 160 includes but is not limited to an inward-turning structure, that is, when the baffle 160 is in the closed position, the baffle 160 is located within the first installation space 113. Further, the first fan module 121 and / or the second fan module 132 are / is included but is not limited to being detachably arranged in the first installation space 113 in a sliding manner. When the first fan module 121 (or the second fan module 132) is pushed into the first installation space 113, the first fan module 121 (or the second fan module 132) abuts against the baffle 160 to overcome the elastic force of the elastic member 161, so that the baffle 160 swings to an open position substantially parallel to the inner wall (such as the side wall) of the first installation space 113. Similarly, when the first fan module 121 (or the second fan module 132) is removed from the first installation space 113, the baffle 160 resets to a closed position forming an angle with the inner wall (such as the side wall) of the first installation space 113 under the pressure exerted by the elastic member 161. In this way, when the first fan module 121 (or the second fan module 132) is removed from the first installation space 113, the backflow of the cold air flow direction can be prevented to block heat dissipation.

[0180] Figure 28 is Figure 24 A partial enlarged view of the first space of the chassis mechanism shown, showing the stop portion.

[0181] According to an embodiment of the present application, referring to Figure 28 As shown, a stop portion 114 is provided in the first installation space 113, and the first fan module 121 and the second fan module 132 are provided with limiting portions. The stop portion 114 provided in the first installation space 113 for accommodating the first fan module 121 at a high position and the stop portion 114 provided in the first installation space 113 for accommodating the first fan module 121 at a low position are provided at different end faces of the first installation space 113. And / or, the stop portion 114 provided in the first installation space 113 for accommodating the first fan module 121 at a low position and the stop portion 114 provided in the first installation space 113 for accommodating the second fan module 132 are provided at different end faces of the first installation space 113.

[0182] According to an embodiment of the present application, referring to Figure 28 As shown, one of the stop portion 114 and the limiting portion is configured as a concave portion, and the other is configured as a convex portion that fits with the concave portion.

[0183] In some exemplary embodiments, referring to Figure 28 As shown, a stop portion 114 is provided in the first installation space 113 for assembling the first fan module 121 (or the second fan module 132). The frame of the corresponding first fan module 121 is provided with a first limiting portion 1211, and the frame of the second fan module 132 is provided with a second limiting portion 1321.

[0184] In some exemplary embodiments, referring to Figure 28 as shown, the stop portion 114 disposed in the first installation space 113 forms a convex portion, and correspondingly, the concave portion formed by the limiting portion disposed in the first fan module 121 (or the second fan module 132). The convex portion may specifically be a stop pin protruding from the inner wall surface of the first installation space 113, and the concave portion may be a positioning hole. In this way, when the first fan module 121 (or the second fan module 132) is pushed into the first installation space 113, the positioning hole is fitted and abutted against the stop pin to limit the first fan module 121 (or the second fan module 132). Among them, the stop portion 114 corresponding to the first fan module 121 and the second fan module 132 at the high position includes but is not limited to being disposed at the upper part of the first installation space 113, and the stop portion 114 corresponding to the first fan module 121 at the low position includes but is not limited to being disposed at the bottom of the first installation space 113. It should be understood that the embodiments of the present application are not limited thereto.

[0185] For example, the stop portions 114 provided for different first installation spaces 113 may also be respectively disposed on the left and right portions. Specifically, as long as the positions of different stop portions 114 relative to the first installation space 113 are different, they can be distinguished to achieve the anti-mistake effect.

[0186] In addition, for the above embodiments in which the first fan module 121 and the second fan module 132 are only used to distinguish different installation spaces in the above-mentioned chassis mechanism 100, it can be known that the difference between the first fan module 121 at the low position and the first fan module 121 at the high position, as well as the second fan module 132, is only that the installation direction rotates 180° around the axis. Therefore, by disposing the stop portions 114 in different positions in different first installation spaces 113, the anti-mistake function can be achieved. That is, when the first fan module 121 (or the second fan module 132) is inserted into the first installation space 113 in the correct direction, the positions of the stop portion 114 and the limiting portion correspond to each other, so that the first fan module 121 (or the second fan module 132) can be pushed into the first installation space 113; when the first fan module 121 (or the second fan module 132) is inserted into the first installation space 113 in the wrong direction, the stop portion 114 abuts against the liquid cooling unit other than the limiting portion, thereby blocking the first fan module 121 (or the second fan module 132) from being pushed into the first installation space 113. In this way, it is convenient to install the first fan module 121 and the second fan module 132 on the main body frame 110.

[0187] Figure 29 is Figure 1 the perspective view of the second power module shown.

[0188] According to an embodiment of the present application, with reference to Figure 24 and Figure 29 As shown, the main body frame 110 further includes a base 112, a bracket 111 is disposed on the base 112, and a second installation space 115 is defined between the bracket 111 and the base 112. The chassis mechanism 100 further includes a second power module 150, and the second power module 150 is detachably disposed in the second installation space 115.

[0189] In some illustrative embodiments, a surrounding area between the lower part of the bracket 111 of the main body frame 110 and the base 112 further forms a second installation space 115, and the second installation space 115 is used to accommodate the second power module 150 to perform insertion installation operations and extraction and disassembly operations in a reciprocating linear movement manner.

[0190] According to an embodiment of the present application, with reference to Figure 24 and Figure 29 As shown, the opposite inner walls of the base 112 are provided with limit posts. The bent section 1532 is provided with a limit groove 1533 having an opening. When the assisting handle 153 is in the first position, the opening of the limit groove 1533 extends along the loading direction of the battery module into the base 112. When the assisting handle 153 is in the second position, the opening of the limit groove 1533 extends along a direction forming an angle with the loading direction.

[0191] Figure 30 is Figure 29 a partial enlarged view of the fixed piece portion shown.

[0192] According to an embodiment of the present application, with reference to Figure 29 and Figure 30 As shown, the second power module 150 includes a housing 151, a power supply main body 152, an assisting handle 153 and a fastener 154. The housing 151 has a first surface disposed opposite to each other and a second surface located between the two first surfaces. The power supply main body 152 is disposed in the housing 151. The assisting handle 153 has a transition section 1531 and bent sections 1532 formed at both ends of the transition section 1531 away from each other. The bent sections 1532 are pivotally connected to the first surface, and the assisting handle 153 is configured to swing the transition section 1531 between a first position away from the second surface and a second position abutting against the second surface. The fastener 154 is disposed between the transition section 1531 and the second surface to hold the assisting handle 153 in the second position.

[0193] In some illustrative embodiments, with reference to Figure 24 and Figure 29As shown, the assisting handle 153 is pivotally connected to two opposite first surfaces of the housing 151 through a bending section 1532, such that the assisting handle 153 can swing relative to the housing 151 of the second power supply module 150, facilitating the staff to hold the transition section 1531, thereby pushing (or taking out) the second power supply module 150 into (or from) the second installation space 115. Meanwhile, through the swing of the assisting handle 153, the limiting groove 1533 formed by the bending section 1532 can be adjusted to face the loading direction, or the direction forming an angle with the base. When the limiting groove 1533 faces the loading direction, the limiting groove 1533 can be engaged with the limiting post to accurately load the second power supply module 150 into the second installation space 115. After the second power supply module 150 is installed in place, the staff can swing the transition section 1531 to a position abutting against the second surface. At this time, the limiting groove 1533 forms an angle with the loading direction, thereby preventing the second power supply module 150 from being disengaged from the second installation space 115. In this state, by further connecting the fixing piece 1534 to the second surface by using a fastening member 154 (such as a screw, etc.), the second power supply module 150 can be effectively maintained in this state to prevent the second power supply module 150 from being separated from the plug-in box mechanism 100.

[0194] Figure 31 is a perspective view of the server architecture according to an embodiment of the present application.

[0195] The present application further provides a server architecture. Referring to Figure 31 As shown, it includes a chassis 200 and a plug-in box mechanism 100, and the plug-in box mechanism 100 is arranged at the rear window of the chassis 200.

[0196] According to an embodiment of the present application, referring to Figure 31 As shown, the middle backplane 300 of the plug-in box mechanism 100 and the chassis 200 define a first installation cavity, and the middle backplane 300 and the frame body of the plug-in box mechanism 100 define a second installation cavity. Among them, a liquid cooling unit is arranged in the first installation cavity, and at least part of the pipeline of the liquid cooling unit passes through the main frame 110 of the plug-in box mechanism 100.

[0197] In some illustrative embodiments, referring to Figure 31As shown, the chassis insertion mechanism 100 can be inserted into the rear window of the chassis 200. Among them, in the state where the chassis insertion mechanism 100 is inserted into the chassis 200, the central backplane 300 (and the backplane bracket 310) provided on the chassis insertion mechanism 100 divides the interior of the server into two installation cavities (i.e., the above-mentioned first installation cavity and the second installation cavity). Among them, the area including the front window is used to install various electronic devices, specifically, it can be a central processing unit node, an image processing unit node, a hole data exchange node, etc. At least a part of the above-mentioned electronic devices is configured to be electrically connected to the electrical connection part provided on the central backplane 300. Further, the above-mentioned electronic devices can be arranged in layers in the server to meet the design requirements of 4U or 6U, so that the server has a large expansion area.

[0198] In some exemplary embodiments, to meet the heat dissipation requirements of high-power-consuming electronic devices in the server, a liquid cooling unit is also configured in the server architecture. The liquid cooling unit at least includes devices such as cooling elements, pipelines, and pumps. Specifically, the cooling element includes, but is not limited to, a cold plate. The cooling element is arranged in the first installation cavity and is closely attached to the high-power-consuming electronic device to achieve heat exchange; the pipeline at least includes an inlet water pipe connected to the liquid inlet end of the cooling element and an outlet water pipe connected to the liquid outlet end of the cooling element. The pump is respectively connected to the inlet water pipe and the outlet water pipe, so that the medium can form a cycle in the cooling element. Among them, in order to guide the medium at a higher temperature after heat exchange with the high-power-consuming electronic device outside the server, a support plate 140 needs to be provided on the chassis insertion mechanism 100 to lead the outlet water pipe and / or the inlet water pipe of the liquid cooling unit outside the server to release heat.

[0199] In such an implementation, the chassis insertion mechanism 100 arranges at least two first fan modules 121 in the first air cooling unit 120 at different heights. The first fan modules 121 at high and / or low positions and the main body frame 110 can utilize the height difference between the first fan modules 121 to form a space for coupling with the liquid cooling unit configured in the server. Since there is no need to avoid the pipelines arranged by the liquid cooling unit in the horizontal direction, the blind area that cannot be air-cooled in the server can be effectively reduced, so as to make full use of the space inside the chassis insertion mechanism and the chassis of the server. In this way, the arrangement of the first fan modules 121 in the first air cooling unit 120 can be made more flexible.

[0200] In addition, in the related art, different fan plates are often configured to form electrical connections for fan modules at different heights. In this implementation, by connecting the first fan modules 121 at different heights to the same first fan plate 122, the number of first fan plates 122 to be arranged is correspondingly reduced. This not only saves the space inside the server occupied by arranging multiple fan plates, but also reduces the coupling difficulty caused by the interference of arranging multiple fan plates to other devices.

[0201] Other technical features of the server architecture have been described in detail in the above embodiments of the plug-in mechanism, and the server architecture has similar technical effects as the plug-in mechanism. Therefore, they will not be described in detail.

[0202] According to some exemplary embodiments of the present application, referring to Figure 31 As shown, the inserting mechanism 100 is detachably disposed on the chassis 200 .

[0203] In some exemplary embodiments, referring to Figure 31 As shown, the box insertion mechanism 100 is configured to be pushed into the chassis 200 along the rear window of the chassis 200. In detail, the bottom surface of the chassis 200 is provided with an I-shaped nail 203, and the base 112 of the box insertion mechanism 100 correspondingly is provided with a groove 1121. When the box insertion mechanism 100 is pushed into the chassis 200, the I-shaped nail 203 provided in the chassis 200 can be embedded in the groove 1121 to limit the depth of the box insertion mechanism 100 inserted into the chassis 200. Furthermore, the side panels of the chassis 200 are also provided with fastener holes 204, and correspondingly, the side walls of the base 112 of the plug-in mechanism 100 are provided with screw holes 1122. When the I-nail 203 of the chassis 200 is embedded in the groove 1121, the fastener hole 204 is exactly opposite to the screw hole 1122. The staff can insert fasteners (such as screws) into the fastener holes 204 to connect the plug-in mechanism 100 with the chassis 200.

[0204] According to some other exemplary embodiments of the present application, which are not shown in the figures, the box insertion mechanism 100 is integrally provided in the chassis 200 .

[0205] In some exemplary implementations, not shown in the figures, the box insertion mechanism 100 may be integrally disposed in the chassis 200 , that is, the box insertion mechanism 100 cannot be removed from the chassis 200 .

[0206] The above is a detailed introduction to an immersion liquid cooling device and electronic device provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A server architecture, characterized in that, Comprising: A chassis (200); A middle backplane (300), vertically disposed in the chassis (200) to divide the interior of the chassis (200) into a first space (210) near the front window and a second space (220) near the rear window; A first power module (230), disposed in the lower layer area (211) of the first space (210); A first processor module (250), disposed in the middle layer area (212) above the first power module (230); A second processor module (240), disposed in the upper layer area (213) above the first processor module (250); Wherein, the upper layer area (213) has a front area (2131) near the front window and a rear area (2132) far from the front window, and the second processor module (240) is at least located in the rear area (2132).

2. The server architecture according to claim 1, wherein Further comprising: A hard disk module (260), disposed in the middle layer area (212) or the front area (2131); Wherein, when the hard disk module (260) is in the front area (2131), the second processor module (240) is in the rear area (2132), and when the hard disk module (260) is in the middle layer area (212), a part of the second processor module (240) is in the front area (2131).

3. The server architecture according to claim 2, wherein Further comprising: A main board (280), disposed in the middle layer area (212), the first processor module (250) is disposed on the main board (280) and interconnected with the main board (280).

4. The server architecture according to claim 3, characterized in that, Further comprising: A switch board (270), disposed in the middle layer area (212), connected to the main board (280), and interconnected with the first processor module (250) through the main board (280).

5. The server architecture according to claim 4, characterized in that, The second processor module (240) is connected to the expansion slot of the switch board (270).

6. The server architecture according to claim 4, characterized in that, Further comprising: A communication card (2100), disposed in the middle layer area (212), and connected to the expansion slot of the switch board (270).

7. The server architecture according to claim 6, characterized in that The hard disk module (260) is disposed above the communication card (2100) and in the front area (2131).

8. The server architecture according to claim 6, wherein The hard disk module (260) is disposed on the side of the communication card (2100) and in the middle layer area (212).

9. The server architecture according to claim 1 or 2, characterized in that The chassis (200) includes: A box body (201), an opening is formed in the upper part of the box body (201); A box cover (202), detachably disposed on the box body (201), the box cover (202) has a top plate and side plates symmetrically disposed on both sides of the top plate, and the side plates extend downward; Wherein, the box cover (202) includes a first box cover (2021) and a second box cover (2022), the first box cover (2021) and the second box cover (2022) are alternatively disposed on the box body (201), and the side plates of the second box cover (2022) are at least 1U higher than the side plates of the first box cover (2021).

10. The server architecture according to claim 1 or 2, characterized in that Further comprising: A power distribution module (290) is disposed in the middle layer area (212) and plugged into the middle backplane (300). Among them, the first power module (230) is interconnected with the power distribution module (290).

11. The server architecture according to claim 10, characterized in that, It further includes: A chassis mechanism (100) is detachably disposed in the second space (220) of the chassis (200). The chassis mechanism (100) includes: A main frame (110); An air-cooling unit is disposed on the main frame (110) and at least faces the second processor module (240). A second power module (150) is disposed on the main frame (110) and is located below the air-cooling unit. The second power module (150) is interconnected with the power distribution module (290) through the middle backplane (300). Among them, the first power module (230) is configured to supply power to at least the second processor module (240), and the second power module (150) is configured to supply power to at least the first processor module (250).

12. The server architecture according to claim 11, characterized in that, The air-cooling unit includes a first air-cooling unit (120). The first air-cooling unit includes: A first fan board (122) is disposed on the main frame (110). The first fan board (122) is provided with a first electrical connection portion (1221). At least two first fan modules (121) are disposed on the main frame (110) and have a first electrical mating portion (1212) connected to the first electrical connection portion (1221). At least one of the first fan modules (121) is at a different height from the other first fan modules (121). Among them, the first electrical mating portions (1212) of the first fan module (121) at the high position and the first fan module (121) at the low position are both connected to the same first fan board (122).

13. The server architecture according to claim 12, characterized in that, The first fan board (122) has a first end face and a second end face facing away from each other. The first end face and the second end face are respectively provided with the first electrical connection portion (1221). Among them, the first electrical connection portion (1221) located on the first end face is connected to the first electrical mating portion (1212) of the first fan module (121) at the low position, and the first electrical connection portion (1221) located on the second end face is connected to the first electrical mating portion (1212) of the first fan module (121) at the high position.

14. The server architecture according to claim 12, wherein, The first electrical mating portion (1212) of the first fan module (121) at the high position is disposed at the bottom of the first fan module (121). And / or, the first electrical mating portion (1212) of the first fan module (121) at the low position is disposed at the top of the first fan module (121).

15. The server architecture according to claim 12, characterized in that, The air-cooling unit further includes a second air-cooling unit (130) disposed in the upper space of the first air-cooling unit (120). The second air-cooling unit (130) includes: The second fan board (131) is disposed on the main body frame (110), and the second fan board (131) is provided with a second electrical connection portion (1311); The second fan module (132) is disposed on the main body frame (110) and has a second electrical mating portion (1322) connected to the second electrical connection portion (1311).

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