Control module for computing device and computing device

Abstract

The embodiment of the utility model provides a control module for a computing device and the computing device, the computing device comprises a shell assembly, the control module comprises a control box, an installation cavity is defined in the control box, and the control box is detachably installed on the shell assembly; and the control circuit board is arranged in the mounting cavity, and the control circuit board is used for being electrically connected with a calculation module and a power module in the shell assembly. According to the technology of the embodiment of the invention, on one hand, the control circuit board and other modules of the computing device are decoupled, modular setting of the control module is realized, the expandability of the computing device is improved, on the other hand, the control module and other modules of the computing device are physically isolated, and the expandability of the computing device is improved. According to the invention, adverse effects on the control circuit board caused by heating of the computing module can be eliminated, stable operation of the computing device is facilitated, internal space occupation of the shell assembly is reduced, and the integration level of the computing device is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of computing devices, and particularly relates to a control module for a computing device and the computing device. BACKGROUND

[0002] In the related art, the control circuit board and other functional modules of a computing device are collectively integrated in the interior of a housing. Due to the limited space in the interior of the computing device housing, the control circuit board on one hand occupies the installation space of other modules, reduces the space utilization in the interior of the device, limits the expansion capability of the device, and on the other hand causes heat accumulation in the interior of the device, and reduces the heat dissipation efficiency. In a high-performance computing device, heat accumulation can cause the temperature of components to be excessively high, affecting the performance and service life of the computing device. CONTENT OF THE UTILITY MODEL

[0003] Embodiments of the present application provide a control module for a computing device and the computing device to solve or alleviate one or more technical problems in the prior art.

[0004] As an aspect of the embodiments of the present application, the embodiments of the present application provide a control module for a computing device, the computing device comprising a housing assembly, and the control module comprising: a control box, an installation cavity being defined in the interior of the control box, the control box being detachably installed in the housing assembly; and a control circuit board, the control circuit board being arranged in the installation cavity, the control circuit board being configured to be electrically connected with a computing module and a power module in the housing assembly.

[0005] In an embodiment, the control box comprises a housing and a side cover plate, the housing defines the installation cavity and a side opening communicating with the installation cavity, and the side cover plate is detachably installed in the side opening.

[0006] In an embodiment, a through hole is formed in the side cover plate, the through hole is configured to allow a cable of the power module to pass through and be electrically connected with the control circuit board.

[0007] In an embodiment, the computing device further comprises a fan arranged in the housing assembly, an end portion of the fan has a clamping protrusion; a clamping hole is further formed in the side cover plate, a shape of the clamping hole is adapted to a shape of the clamping protrusion, and the clamping hole is configured to form a clamping fit with the clamping protrusion.

[0008] In an embodiment, the side cover plate has a recessed portion, the recessed portion is recessed in a direction towards the installation cavity, and the recessed portion defines a cable receiving groove, the through hole and the clamping hole are arranged in the recessed portion.

[0009] In an embodiment, a clamping hole is formed on a side of the shell assembly adjacent to the control box, and a clamping protrusion is arranged on a side of the side cover plate adjacent to the shell assembly, and the clamping protrusion is arranged in clamping cooperation with the clamping hole; or, a clamping protrusion is arranged on a side of the shell assembly adjacent to the control box, and a clamping hole is formed on the side cover plate, and the clamping hole is arranged in clamping cooperation with the clamping protrusion.

[0010] In an embodiment, the shell comprises an upper shell and a lower shell, and the bottom of the upper shell is connected to the top of the lower shell; and the material of the upper shell is transparent.

[0011] In an embodiment, the control module further comprises a display screen, the display screen is arranged in the mounting cavity and is electrically connected to the control circuit board, and the display area of the display screen is arranged opposite to the upper shell.

[0012] In an embodiment, the upper shell and the lower shell are integrally formed by an integral molding process.

[0013] In an embodiment, a clamping cooperation part is arranged on the outer side wall of the control box, and the clamping cooperation part is arranged in correspondence with a clamping part on the cover side plate of the shell assembly.

[0014] In an embodiment, the clamping part is a protrusion structure, and the clamping cooperation part is a groove structure; or, the clamping part is a groove structure, and the clamping cooperation part is a protrusion structure.

[0015] In an embodiment, the control module further comprises a communication module electrically connected to the control circuit board; and a mounting through hole is formed on the bottom of the control box, and the mounting through hole is used for mounting the communication module.

[0016] As another aspect of the embodiments of the present application, the embodiments of the present application further provide a computing device comprising: a shell assembly used for integrally mounting a computing module and a power module; and the control module for the computing device of any one of the above embodiments, which is detachably mounted on the shell assembly and is electrically connected to the computing module and the power module.

[0017] According to the control module of the embodiments of the present application, by arranging the control box used for mounting the control circuit board, and detachably mounting the control box on the shell assembly, on the one hand, the control circuit board can be decoupled from other modules of the computing device, the modularization of the control module is realized, which is beneficial for subsequent users to maintain and upgrade according to requirements, improves the expandability of the computing device, on the other hand, the physical isolation of the control module and other modules of the computing device is realized, which can prevent the adverse effects of heat generated by the computing module on the control circuit board, is beneficial for improving the stability of the computing device, and reduces the occupation of the internal space of the shell assembly, so as to reduce the size of the shell assembly, and is beneficial for improving the integration of the computing device.

[0018] The above summary is intended to illustrate, but not limit, the present application. Further aspects, implementations and features of the present application will be apparent from the detailed description and drawings that follow. BRIEF DESCRIPTION OF DRAWINGS

[0019] In the drawings, like numerals refer to like elements throughout the various drawings. The drawings are not necessarily to scale, the emphasis instead being placed on the relation between the various elements. It should be understood that the drawings are merely schematic and that the application can be embodied in many different forms.

[0020] Figure 1 An exploded structural schematic view of a control module of the computing device according to an embodiment of the present application is shown.

[0021] Figure 2 A perspective structural schematic view of the computing device according to an embodiment of the present application is shown.

[0022] Figure 3 An assembly schematic view of the control module and the housing assembly of the computing device according to an embodiment of the present application is shown.

[0023] Figure 4 An exploded structural schematic view of the computing device according to an embodiment of the present application is shown.

[0024] Figure 5 An exploded structural schematic view of the computing device according to an embodiment of the present application is shown.

[0025] Figure 6A A perspective structural schematic view of the computing device according to an embodiment of the present application is shown.

[0026] Figure 6B A perspective structural schematic view of the computing device according to an embodiment of the present application is shown.

[0027] Figure 7 A longitudinal sectional view of the computing device according to an embodiment of the present application is shown.

[0028] Figure 8 A bottom view of the computing device according to an embodiment of the present application is shown.

[0029] BRIEF DESCRIPTION OF DRAWINGS

[0030] 1 - computing device;

[0031] 100 - housing assembly; 10 - inner shell; 20 - outer shell; 20b - air outlet; 20c - air inlet; 30 - mounting side plate; 30b - clamping hole;

[0032] 40 - cover side plate; 41 - clamping portion;

[0033] 60 - wireless communication unit;

[0034] 70 - ambient temperature detection unit;

[0035] 200 - fan; 210 - clamping protrusion;

[0036] 300 - power module; 301 - power input unit; 302 - switch unit;

[0037] 400 - computing module;

[0038] 500 - control module; 510 - control box; 511 - housing; 511a - mounting cavity; 5111 - upper shell; 5112 - lower shell; 5113 - positioning column; 512 - side cover plate; 512a - wire passing hole; 512b - clamping hole; 512c - mounting hole; 5121 - clamping protrusion; 5122 - recessed portion; 513 - clamping matching portion;

[0039] 520 - display screen;

[0040] 530 - control circuit board; 530a - positioning hole;

[0041] L1 - first direction; L2 - second direction. DETAILED DESCRIPTION

[0042] Hereinafter, only certain exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present application. Therefore, the drawings and the description are considered to be exemplary in nature rather than limiting.

[0043] In the related art, the control circuit board and other functional modules of a computing device are collectively integrated inside the housing. Since the space inside the housing of the computing device is limited, the control circuit board arranged inside the housing will occupy the mounting space of other modules on the one hand, reduce the space utilization inside the device, limit the expansion capability of the device, and on the other hand, can cause local heat accumulation, and reduce the heat dissipation efficiency of the device. In high-performance devices, heat accumulation can cause the temperature of the components to be too high, affecting the performance and life of the computing device.

[0044] Based on the above defects existing in the related art, the embodiment of the present application provides a control module for a computing device. The control module is provided with a control box for mounting a control circuit board. The control box is detachably mounted to a housing assembly. On the one hand, the control circuit board is decoupled from other modules of the computing device, and the modularization of the control module is realized, which is beneficial for subsequent users to maintain and upgrade according to requirements, improves the expandability of the computing device, and on the other hand, the physical isolation of the control module and other modules of the computing device is realized, which can prevent the adverse effects of heat generated by the computing module on the control circuit board, is beneficial to improve the stability of the computing device, reduces the occupation of the internal space of the housing assembly, thereby reducing the size of the housing assembly, and is beneficial to improve the integration of the computing device.

[0045] Figure 1 An exploded structural schematic diagram of the control module of the embodiment of the present application is exemplarily provided, Figure 2 An assembly schematic diagram of the control module of the computing device and the housing assembly of the embodiment of the present application is exemplarily provided, Figure 3 An assembly schematic diagram of the control module of the computing device and the housing assembly of the embodiment of the present application is exemplarily provided. As Figures 1 to 3 shown, in the embodiment of the present application, the computing device 1 can include a housing assembly 100 and a control module 500. The control module 500 provided by the embodiment of the present application can include a control box 510 and a control circuit board 530. The inside of the control box 510 can be defined with a mounting cavity 511a, and the control box 510 is detachably mounted to the housing assembly 100 of the computing device 1. The control circuit board 530 can be arranged in the mounting cavity 511a, and the control circuit board 530 is used to be electrically connected with the computing module 400 and the power module 300 in the housing assembly 100.

[0046] In the embodiment of the present application, the control box 510 is detachably mounted to the housing assembly 100 and located outside the cavity of the housing assembly 100. In this way, the control circuit board 530 does not occupy the internal space of the housing assembly 100, thereby isolating the control circuit board 530 from the computing module 400, the power module 300 and the fan 200.

[0047] In some examples, the control box 510 and the housing assembly 100 can be detachably connected through screws or other types of fasteners.

[0048] In other examples, the control box 510 and the housing assembly 100 can be detachably connected through a clamping structure.

[0049] It should be noted that the above description of the detachable connection between the control box 510 and the shell assembly 100 is only exemplary and should not be construed as limiting the present application. Those skilled in the art can flexibly set it according to the actual situation. For example, in other examples of the present application, the control box 510 and the shell assembly 100 can be detachably connected by magnetic attraction components.

[0050] In some examples, the shell 511 of the control box 510 can be made of metal material, such as aluminum alloy or steel material, etc. The use of metal material can ensure that the control box 510 has high strength and effectively protects the internal components.

[0051] In other examples, the shell 511 of the control box 510 can be made of high polymer material, such as plastic or resin, etc. The use of high polymer material can make the control box 510 have lighter weight and lower cost, which is suitable for application scenarios with high requirements for weight and cost control.

[0052] It should be noted that the above description of the material selection of the shell 511 of the control box 510 is only exemplary and does not constitute a limitation of the present application. Those skilled in the art can flexibly set it according to the actual situation.

[0053] According to the control module 500 of the embodiment of the present application, by setting the control box 510 for mounting the control circuit board 530, the control box 510 is detachably mounted on the shell assembly 100. On the one hand, it can decouple the control circuit board 510 from other modules of the computing device 1, realize the modularization of the control module 500, and facilitate subsequent user maintenance and upgrade according to demand, improve the expandability of the computing device 1. On the other hand, it realizes the physical isolation of the control module 500 and other modules of the computing device 1, can prevent the adverse effects of the heating of the computing module 400 on the control circuit board 530, is conducive to improving the stability of the computing device 1, reduces the occupation of the internal space of the shell assembly 100, thereby reducing the size of the shell assembly 100, and is conducive to improving the integration of the computing device 1.

[0054] Figure 4 An example of the computing device of the embodiment of the present application is provided, and an exploded structure schematic diagram of the computing device after removing the shell is shown in Figure 5 An example of the computing device of the embodiment of the present application is provided, and an exploded structure schematic diagram of the computing device after removing the shell is shown in Figure 4 And Figure 5 As shown in the figures, the computing device 1 can also include a computing module 400, a power module 300, a fan 200, and other functional modules. The control module 500, the computing module 400, the power module 300, and the fan 200 can be integrally arranged in the shell assembly 100. The shell assembly 100 can be used to provide an installation base and external protection for the functional modules of the computing device 1.

[0055] The control module 500 is an example of a module for implementing power control, temperature monitoring and management, data communication, and the like. The power module 300, the computing module 400, the heat dissipation module, and the like can be electrically connected to the control module 500 through a cable, and the system monitoring and task management can be performed by the control module 500.

[0056] The computing module 400, the power module 300, and the fan 200 can be integrally arranged in the interior of the housing assembly 100. The interior of the housing assembly 100 defines a cavity, an air inlet, and an air outlet in communication with the cavity. The fan 200 is arranged in the cavity and is configured to generate an airflow flowing from the air inlet to the air outlet. The airflow flows through the computing module 400 and the power module 300, thereby carrying away the heat generated by the computing module 400 and the power module 300 during operation, and achieving cooling of the computing module 400 and the power module 300. Meanwhile, the airflow after being heated forms warm air and flows out of the air outlet, which can be used to heat the external environment of the computing device 1, thereby achieving effective utilization of the heat generated by the computing module 400 and the power module 300.

[0057] In the embodiments of the present application, the control circuit board 530 is electrically connected to the computing module 400, the power module 300, and the fan 200. The power module 300 is configured to supply power to the control circuit board 530, the computing module 400, and the power module 300. The control circuit board 530 is configured to control the operating parameters of the computing module 400 and the fan 200, such as the operating frequency of the computing module 400 and the rotating speed of the fan 200.

[0058] The control circuit board 530 can control the rotating speed of the fan 200 according to the operating frequency of the computing module 400. For example, when the operating frequency of the computing module 400 is increased, the rotating speed of the fan 200 is increased accordingly to increase the flow rate of the airflow, thereby improving the heat dissipation efficiency of the computing module 400 when the heat generation is increased due to the increase of the operating frequency of the computing module 400. Conversely, when the operating frequency of the computing module 400 is decreased, the rotating speed of the fan 200 is decreased accordingly to decrease the flow rate of the airflow, thereby reducing the heat dissipation efficiency of the computing module 400 when the heat generation is decreased due to the decrease of the operating frequency of the computing module 400, thereby saving the energy consumption of the computing device.

[0059] It should be noted that the above control mode of the control circuit board 530 is only an example of the description, and should not be construed as a limitation of the present application. Those skilled in the art can flexibly set the control mode of the control circuit board 530 according to the actual situation.

[0060] In other examples of the present application, the control circuit board 530 can also control the working parameters of the computing module 400 and the fan 200 according to the external ambient temperature of the computing device 400. For example, when the external ambient temperature is lower than a preset temperature, the control circuit board 530 can increase the heat generation of the computing power board 410 and the flow rate of the airflow generated by the fan 200 by increasing the operation frequency of the computing power board 410 and the rotation speed of the fan 200, thereby increasing the air output and the air temperature of the computing device 1, and further improving the heating effect of the computing device 1.

[0061] In the embodiments of the present application, the control circuit board 530 can be a printed circuit board (PCB). The control circuit board 530 can be electrically connected to the computing module 400 and the power module 300 in the shell assembly 100 through a flexible printed circuit (FPC) or other flexible cable. By using a thin, bend-resistant and high-transmission-rate FPC or other flexible cable, the complex layout of the modules inside the shell assembly 100 can be adapted, and electrical connection failures caused by cable bending or stretching can be avoided, while the wiring structure can be simplified. The control circuit board 530 can be connected to the computing module 400 and the power module 300 in the shell assembly 100 through a standardized electrical connection interface.

[0062] For example, the control circuit board 530 can further be provided with a vertical connector with a self-locking function. The cables of the functional modules such as the computing module 400 and the power module 300 can be electrically connected to the control circuit board 530 through the gold fingers matched with the vertical connector, so as to ensure stable and efficient signal transmission.

[0063] It should be noted that the above examples of the control circuit board 530 electrically connected to the computing module 400 and the power module 300 are only illustrative and do not limit the present application. Those skilled in the art can flexibly set according to the actual situation.

[0064] In some examples, the fan 200 can be used as a cooling device for the computing device 1 by setting reasonable control logic for the control circuit board 530 to dynamically adjust the working parameters of each module of the computing module 4001 according to the real-time load condition of the computing device 1. The control module 500 can be used to form an electrical connection with the computing module 400, the power module 300 and the fan 200 in the shell assembly 100, and can be used to perform control coordination of each module of the computing device 1 to achieve dynamic adjustment of the cooling system. Specifically, a plurality of load detection modules such as temperature sensors, current sensors, etc. can be installed at key positions of the computing module 400 and the power module 300 to monitor the load condition of the computing module 400 and the power module 300 in real time and feedback to the control circuit board 530. When the temperature or current load condition reaches the set threshold, the control module 500 can adjust the speed of the fan 200 or start additional cooling devices to improve the cooling efficiency. Conversely, when the load decreases, the control module 500 can send a signal to reduce the fan speed or temporarily shut down the air cooling system, thereby saving energy and reducing noise. It should be noted that the above is only an example and does not constitute a limitation on the present application.

[0065] In other examples, the computing module 400 and the fan 200 are used as a heating device by configuring reasonable control logic for the control circuit board 530 to effectively use the heat generated by the computing module 400 for heating while achieving the cooling of the computing device 1. It should be noted that the control module 500 can be used to form an electrical connection with the computing module 400, the power module 300 and the fan 200 in the shell assembly 100, and can be used to perform intelligent heating system of each module of the computing device 1 to achieve the heating function. The airflow generated by the fan 200 can flow through the computing module 400 to form warm air, which can be discharged through the air outlet 20b of the shell 20 of the shell assembly 100 for heating. Specifically, the air inlet of the shell assembly 100 can be provided on the bottom wall of the shell 20, and the air outlet 20b can be provided on the side wall of the shell 20. A plurality of temperature sensors can be installed at key positions of the air inlet 20 and the air outlet 20b of the shell assembly 100 to detect the inlet air temperature at the air inlet of the shell assembly 100 and the outlet air temperature at the air outlet 20b in real time and feedback to the control module 500 of the control module 500. In addition, temperature detection units can also be provided at other positions of the computing device, such as the inside of the control module 500.

[0066] In the application scenario where the computing device 1 is used as a heating device, the fan 200, the computing module 400, and the power supply module 300 can be connected to the control circuit board 530 of the control module 500. The control circuit board 530 can automatically adjust the operating power of the computing module 400 and the rotating speed of the fan 200, or control the on-off of the power supply, according to the specified temperature requirement input by the user and the real-time temperature monitoring data, so as to meet the corresponding heating demand within the normal operating range of the computing device 1.

[0067] For example, in the case where the outlet air temperature does not reach the user-specified temperature, the control module 500 can appropriately increase the computing load, or reduce the rotating speed of the fan 200 or temporarily shut down the air cooling system within the normal operating range of the computing device 1, so as to meet the user's heating demand. In the case where the outlet air temperature is higher than the user-specified temperature, the control module 500 can appropriately reduce the computing load, or increase the rotating speed of the fan 200 within the normal operating range of the computing device 1, so as to meet the user's temperature requirement. In other examples, when the user has no heating demand, the environmental temperature is low, and the computing load is low, the control module 500 can send a signal to indicate to reduce the fan speed or temporarily shut down the air cooling system, so as to reduce energy consumption and improve energy efficiency. In some specific examples, an electric heating device can be arranged at the air outlet 20b of the shell assembly 100, to supplement the heating of the discharged warm air.

[0068] In other specific examples, a hot air guide pipe or other heat collecting device can be arranged at the air outlet 20b to concentrate the heat of the discharged warm air for heating. An auxiliary fan can also be installed at the air outlet 20b to enhance the flow of hot air and ensure that the heat can be effectively transmitted to the position that needs to be heated.

[0069] It should be noted that the above heating methods and structures are only examples and do not limit the present application.

[0070] In this way, the control module 500 for the computing device 1 can be electrically connected with other functional modules of the computing device 1, and can dynamically adjust the cooling system according to the real-time load of the other functional modules and the user's heating demand, so as to ensure stable operation of the computing device 1 while achieving heating.

[0071] For example, the fan 200 can adopt a cross-flow fan, and the air inlet direction is perpendicular to the air outlet direction.

[0072] In some examples, the cross-flow fan 200 can be housed within the cavity of the housing assembly 100 and can be used to generate airflow from the inlet to the outlet. The inlet direction and outlet direction can be perpendicular to each other. Specifically, the cross-flow fan can be equipped with a cylindrical impeller with internally arranged blades. A motor drives the impeller to rotate, causing airflow to enter from the inlet and exit from the outlet. During operation, the airflow generated by the cross-flow fan rises from the bottom of the housing assembly 100, flows through the computing module 400 and power module 300 into the inlet of the fan 200, and then exits through the outlet to the outside of the housing assembly 100, thus carrying away the heat generated by the computing module 400 and power module 300.

[0073] It is understandable that a cross-flow fan, also known as a tangential flow fan or cross-flow fan, is a type of fan with a special structure. Its working principle involves causing air inside the impeller to flow radially along the impeller. Through the action of the impeller, the airflow bends within the impeller and exits at both sides of the impeller. Cross-flow fans typically have a relatively long cylindrical impeller with a relatively small diameter. Because cross-flow fans offer advantages such as uniform airflow, low noise, and compact structure, using a cross-flow fan as the fan 200 can improve the uniformity of the warm air blown from the outlet, reduce noise during the operation of the computing device 1, and also help reduce the overall size of the computing device 1, thus reducing its space occupation.

[0074] It should be noted that in other examples of this application, the fan 200 is not limited to a cross-flow fan, but may also be other types of fans such as axial flow fans, centrifugal fans, mixed flow fans, cross-flow fans or bladeless fans, to generate airflow from the air inlet to the air outlet.

[0075] In one implementation, such as Figure 1 As shown, the control box 510 may include a housing 511 and a side cover 512. The housing 511 may define a mounting cavity 511a and a lateral opening communicating with the mounting cavity 511a. The side cover 512 is detachably mounted to the lateral opening.

[0076] Exemplarily, the control box 510 is detachably mounted on the outside of the inner shell 10 of the shell assembly 100 on one side of the first direction L1. The inner shell 10 of the shell assembly 100 can be a cuboid frame structure, and the first direction L1 can be a direction parallel to the length direction of the inner shell 10, wherein the length direction of the inner shell 10 can be understood as a straight line direction extending from one end of the longest side of the inner shell 10 to the other end. The control box 510 can include a shell 511 and a side cover plate 512, and the inside of the shell 511 can define a mounting cavity 511a, and the control circuit board 530 can be mounted in the mounting cavity 511a of the shell 511. The shell 511 can be provided with a side opening on one side in the first direction L1, and the side cover plate 512 can be detachably mounted on the side opening to achieve the closure of the control box 510. It should be noted that the above description of the structure of the inner shell 10 and the direction is only exemplary and does not constitute a limitation on the present application.

[0077] Exemplarily, the shell 511 can be provided with a plurality of positioning columns 5113 extending in the direction towards the side cover plate 512, and the plurality of positioning columns 5113 can be symmetrically arranged on both sides of the second direction L2. The control circuit board 530 can be provided with a plurality of positioning holes 530a corresponding to the plurality of positioning columns 5113, and the positioning holes 530a can be used for the positioning columns 5113 to pass through. The cross-sectional shape of the positioning hole 530a can be circular or elliptical.

[0078] Exemplarily, the number of positioning columns 5113 can be 4, and each can be arranged adjacent to the four corners of the control circuit board 530. The positioning holes 530a on the control circuit board 530 can be arranged as four, and each can be arranged corresponding to the four positioning columns 5113, for the corresponding positioning column 5113 to pass through, so as to realize the mounting and fixing of the control circuit board 530 relative to the shell 511. The side cover plate 512 can be provided with a plurality of mounting holes 512c, and the plurality of mounting holes 512c can be arranged corresponding to the plurality of positioning columns 5113. In the process of mounting the side cover plate 512 on the shell 511, the positioning column 5113 can be inserted into the mounting hole 512c to realize the mounting and sealing of the control box as a whole.

[0079] Through the above embodiment, detachable connection between the shell 511 and the side cover plate 512 is realized, and the disassembly convenience between the two is improved.

[0080] In an embodiment, as shown in Figure 1 and Figure 4 The side cover plate 512 can be provided with a through wire hole 512a, and the through wire hole 512a can be used for the cable of the power supply module 300 to pass through and electrically connect with the control circuit board 530. The size and shape of the through wire hole 512a can be optimized according to the actual application requirements, and the present application embodiment is not limited.

[0081] In some examples, the inner periphery of the wire passing hole 512a can adopt a circular arc shape, for example, can be circular or elliptical. In this way, the inner periphery of the wire passing hole 512a can be prevented from having an angular structure, thereby preventing the inner periphery from abrading the cable, and thus protecting the cable.

[0082] In other examples, the inner periphery of the wire passing hole 512a can be provided with a soft material and insulated to prevent the cable from being abraded or short-circuited.

[0083] In yet other examples, the inner periphery of the wire passing hole 512a can also be attached with a dustproof gasket to prevent dust from entering the inside of the shell 511, ensure the cleanliness of the inside of the control module 500, and protect the safety and reliability of the internal electronic components. It should be noted that the above is only an exemplary description and should not be construed as limiting the embodiments of the present application. In order to prevent the wire passing hole 512a from damaging the cable, the skilled person can flexibly set the setting mode of the inner periphery of the wire passing hole 512a according to the actual situation.

[0084] In one embodiment, as shown in Figure 1 and Figure 4 The computing device 1 can also include a fan 200 provided on the shell assembly 100, and the end of the fan 200 can have a clamping protrusion 210. The side cover plate 512 can also have a clamping hole 512b formed therein, and the shape of the clamping hole 512b can be adapted to the shape of the clamping protrusion 210 to form a clamping fit with the clamping protrusion 210.

[0085] Exemplarily, after the fan 200 is installed on the shell assembly 100 in the first direction L1, the clamping protrusion 210 of the fan 200 can protrude from one side of the shell assembly 100 in the first direction L1. The clamping hole 512b on the side cover plate 512 can be aligned with the clamping protrusion 210 at the end of the fan 200, and the clamping protrusion 210 can be embedded in the clamping hole 512b by applying a certain pressure to form a stable clamping fit, thereby ensuring that the control module 500 is stably installed on the shell assembly 100, and facilitating the subsequent disassembly and maintenance of the control module 500.

[0086] In some examples, the clamping protrusion 210 can have a circular or elliptical shape, and the clamping hole 512b can have a circular or elliptical shape adapted to the clamping protrusion 210.

[0087] In other examples, the clamping protrusion 210 can have a polygonal shape, for example, can be triangular or quadrilateral, and the clamping hole 512b can have a circular or elliptical shape adapted to the clamping protrusion 210.

[0088] It should be noted that the shapes of the clamping hole 512b and the clamping protrusion 210 are only illustrative and do not constitute a limitation on the present application. Those skilled in the art can flexibly set the shapes of the clamping hole 512b and the clamping protrusion 210 according to actual conditions to achieve the effect that the two can form a plug-in fit.

[0089] In an embodiment, as shown in Figure 1 The side cover plate 512 can have a recessed portion 5122, which can be recessed in a direction towards the mounting cavity 511a, and the recessed portion 5122 can define a cable receiving groove, and the through hole 512a and the clamping hole 512b can be arranged in the recessed portion 5122.

[0090] Illustratively, the recessed portion 5122 can be recessed in a direction towards the mounting cavity 511a by a portion of the side cover plate 512 adjacent to the central region. The side away from the mounting cavity 511a of the cable receiving groove defined by the recessed portion 5122 is open, and the mounting side plate 30 of the shell assembly 100 is used to close the opening, so that the cable receiving groove forms a relatively closed space.

[0091] Through the above-mentioned embodiments, the cable receiving groove can provide additional space for arranging and receiving cables, so that the cables are more orderly during wiring.

[0092] In an embodiment, as shown in Figure 1 and Figure 4 The side adjacent to the control box 510 of the shell assembly 100 can be provided with a clamping hole 30b, and the side adjacent to the shell assembly 100 of the side cover plate 512 is provided with a clamping protrusion 5121, which can be used to form a clamping fit with the clamping hole 30b; or, the side adjacent to the control box 510 of the shell assembly 100 can be provided with a clamping protrusion, and the side cover plate 512 can be provided with a clamping hole, which is used to form a clamping fit with the clamping protrusion.

[0093] Illustratively, in the case that the side adjacent to the control box 510 of the shell assembly 100 is provided with the clamping hole 30b and the side cover plate 512 is provided with the clamping protrusion 5121, the clamping protrusion 5121 of the control box 510 can be aligned with the clamping hole 30b on the side adjacent to the control box 510 of the shell assembly 100, and the clamping protrusion 5121 can be embedded in the clamping hole 30b by applying a certain pressure to form a stable clamping fit. The number, shape and arrangement position of the clamping hole 30b and the clamping protrusion 5121 are not limited in the present application.

[0094] Through the above-mentioned embodiments, the control module 500 can be stably fixed on the shell assembly 100, and the control module 500 can be easily disassembled and maintained subsequently.

[0095] In an embodiment, as shown inFigure 1 As shown, the shell 511 can include an upper shell 5111 and a lower shell 5112, and the bottom of the upper shell 5111 can be connected to the top of the lower shell 5112. The material of the upper shell 5111 can be transparent material.

[0096] Exemplarily, part or all of the upper shell 5111 can be made of transparent material, which can specifically be tempered glass, plastic, etc., so that at least part of the upper shell 5111 can transmit light to form a transparent upper shell. In some examples, the upper shell 5111 can be made of tempered glass material, which is suitable for application scenarios with higher requirements for transparency and strength.

[0097] In other examples, the upper shell 5111 can be made of transparent plastic material, which is suitable for application scenarios with higher requirements for cost control.

[0098] The embodiments of the present application do not make specific limitations on the material of the upper shell 5111, and those skilled in the art can flexibly set it according to actual conditions.

[0099] In one embodiment, the upper shell 5111 and the lower shell 5112 can be detachably connected by screws or other fasteners.

[0100] In one embodiment, the upper shell 5111 and the lower shell 5112 can be integrally formed by an integral molding process.

[0101] In some examples, the upper shell 5111 and the lower shell 5112 can be separately processed and formed, and then integrally formed by a secondary injection molding process.

[0102] In other examples, the upper shell 5111 and the lower shell 5112 can be integrally formed by an injection molding process.

[0103] Through the above embodiments, the connection tightness between the upper shell 5111 and the lower shell 5112 can be improved, without the need for assembly, and the sealing performance of the control module 500 can also be improved.

[0104] In one embodiment, as shown, the control module 500 can further include a display screen 520, which can be disposed in the mounting cavity 511a and electrically connected to the control circuit board 530. The display area of the display screen 520 is disposed opposite the upper shell 5111. Figure 1

[0105] Exemplarily, the shell 511 of the control box 510 can include an upper shell 5111 and a lower shell 5112. The control module 500 can further include a display screen 520, which can be disposed in the mounting cavity 511a and electrically connected to the control circuit board 530. The transparent upper shell 5111 and the display area of the display screen 520 can be disposed opposite each other, so as to display the working information of the control module 500. ​

[0106] In the embodiments of the present application, the display screen 520 can adopt an LED display screen or a liquid crystal display screen, etc. In some examples, the display screen 520 can adopt an LED display screen, which has high brightness, fast response speed, and wide viewing angle, and is suitable for application scenarios with high demands for high brightness and fast response.

[0107] In other examples, the display screen 520 can adopt a liquid crystal display screen, which has low power consumption, rich color performance, and high resolution, and is suitable for application scenarios with high demands for display effect.

[0108] The embodiments of the present application do not specifically limit the type of the display screen 520, and a person skilled in the art can flexibly set it according to the actual situation.

[0109] Through the above implementation, the display screen 520 can be electrically connected with the control circuit board 530 through the flexible printed circuit board, which can adapt to the limited space in the control box 510 and ensure stable and efficient signal transmission. The integrated design of the display screen 520 in the control module 500 realizes the intuitive display of information and improves the operation experience of the user.

[0110] In an implementation, the housing assembly 100 reserves a mounting space 25 for the control module 500, the bottom of the mounting space 25 can be formed by extending the bottom wall and the side wall of the outer shell 20 to provide support for the installation of the control module 500, and the top of the mounting space 25 can be open to display the working information of the control module 500 in cooperation with the transparent upper shell 5111 of the control box 510. In this way, the visual degree and the aesthetic degree of the control module 500 can be increased.

[0111] In this way, the computing device 1 provided by the embodiments of the present application can detachably install the control module 500 in the housing assembly 100 of the computing device 1, which realizes the modularization of the system control of the computing device 1 and is conducive to the subsequent maintenance and upgrade of the user according to the demand, thereby improving the expandability of the computing device 1.

[0112] Figure 6A Fig. 1 shows a perspective structural schematic view of a computing device according to an embodiment of the present application from one viewing angle, Figure 6B Fig. 1 shows a perspective structural schematic view of a computing device according to an embodiment of the present application from one viewing angle, Figure 6A and Figure 6B As shown in Fig. 1, in an implementation, the outer side wall of the control box 510 of the control module 500 is provided with a clamping matching part 513, and the clamping matching part 513 is correspondingly arranged with a clamping part 41 on the cover side plate 40 of the housing assembly 100.

[0113] Exemplarily, the shell assembly 100 further comprises a cover side plate 40 detachably mounted on a mounting opening of the outer shell 20 on one side thereof in the first direction L1, for forming a closure on the mounting opening. The cover side plate 40 and the control module 500 can be respectively located on opposite sides of the outer shell 20 in the first direction L1, and the cover side plate 40 is provided with a clamping portion 41, and the outer side wall of the control box 510 is provided with a clamping matching portion 513. In two adjacent computing devices 1 arranged in the first direction L1, the clamping portion 41 of one of the computing devices 1 can be clamped and matched with the clamping matching portion 513 of the other computing device 1.

[0114] In the embodiments of the present application, a plurality of computing devices 1 can be integrally arranged to form a computing device cluster. Exemplarily, the plurality of computing devices 1 can be arranged adjacent to each other in the first direction L1, and each computing device 1 has a first end and a second end in the first direction, respectively, wherein the control module 500 of the computing device 1 is arranged at the first end, and the cover side plate 40 of the computing device 1 is arranged at the second end. In two adjacent computing devices 1, the second end of the first computing device is adjacent to the first end of the second computing device, and the clamping portion 41 on the cover side plate 40 of the first computing device is clamped and matched with the clamping matching portion 513 on the control box 510 of the second computing device.

[0115] In some examples, the clamping portion 41 can be protruded outwardly from the outer side wall of the cover side plate 40 to form a protruding structure, and the clamping matching portion 513 can be recessed inwardly from the outer side wall of the control box 510 to form a recessed structure. Thus, the clamping portion 41 can be inserted into the clamping matching portion 513 to form a clamping and matching.

[0116] In other examples, the clamping portion 41 can be recessed inwardly from the outer side wall of the cover side plate 40 to form a recessed structure, and the clamping matching portion 513 can be protruded outwardly from the outer side wall of the control module 500 to form a protruding structure. Thus, the clamping matching portion 513 can be inserted into the clamping portion 41 to form a clamping and matching.

[0117] It should be noted that the above is only an exemplary description and should not be construed as a limitation on the present application. In other examples of the present application, the clamping portion 41 and the clamping matching portion 513 can also adopt other arbitrary structures, which can be flexibly arranged by those skilled in the art according to actual conditions. For example, one of the clamping portion 41 and the clamping matching portion 513 is a protruding structure, and the other can be a matching clamping hole structure. For another example, the clamping portion 41 and the clamping matching portion 513 can also adopt magnetic members having magnetic attraction to each other, and the two are attracted to each other by magnetic force to enable the adjacent two computing devices 1 to be relatively fixed.

[0118] In addition, the number of the clamping portion 41 and the clamping matching portion 513 can be one or more sets of corresponding arrangement, and those skilled in the art can flexibly arrange according to the actual situation. For example, the number of the clamping portion 41 and the clamping matching portion 513 can be one respectively, and the clamping portion 41 is arranged at the central area of the cover side plate 40, and the clamping matching portion 513 is arranged at the central area of the control box 510. For another example, the number of the clamping portion 41 can be multiple, and multiple clamping portions 41 are arranged circumferentially adjacent to the outer periphery of the cover side plate 40, and the number of the clamping matching portion 513 can be multiple, and multiple clamping matching portions 513 are arranged circumferentially adjacent to the outer periphery of the control box 510.

[0119] In this way, the multi-point clamping design improves the installation stability of the control module 500, and the corresponding arrangement of the clamping portion 41 and the clamping matching portion 513 enables the computing device 1 to be quickly disassembled in occasions where frequent disassembly is required, and multiple computing devices 1 can be assembled through the cooperation of the clamping portion 41 and the clamping matching portion 513, thereby improving the expandability of the computing device 1.

[0120] In an embodiment, the control module 500 can further include a communication module electrically connected to the control circuit board 530; and the bottom of the control box 510 can be provided with a mounting through hole, which can be used to mount the communication module.

[0121] For example, the control module 500 can further include a restart module, a clock module, a communication module, etc. electrically connected to the control circuit board 530, and the above-mentioned modules can be integrally arranged at the bottom of the shell assembly 100. It should be noted that the above-mentioned is only for example and does not constitute a limitation to the present application.

[0122] Figure 7 For example, the control module 500 can further include a restart module, a clock module, a communication module, etc. electrically connected to the control circuit board 530, and the above-mentioned modules can be integrally arranged at the bottom of the shell assembly 100. It should be noted that the above-mentioned is only for example and does not constitute a limitation to the present application. Figure 8 For example, the control module 500 can further include a restart module, a clock module, a communication module, etc. electrically connected to the control circuit board 530, and the above-mentioned modules can be integrally arranged at the bottom of the shell assembly 100. It should be noted that the above-mentioned is only for example and does not constitute a limitation to the present application. Figure 7 For example, the control module 500 can further include a restart module, a clock module, a communication module, etc. electrically connected to the control circuit board 530, and the above-mentioned modules can be integrally arranged at the bottom of the shell assembly 100. It should be noted that the above-mentioned is only for example and does not constitute a limitation to the present application. Figure 8 As shown in FIG. 6, the power module 300 can have a power input unit 301 and a switch unit 302. The power input unit 301 can adopt a three-phase input interface for electrical connection with a power plug. The switch unit 302 is used to enable or disable the computing device 1. Wherein, the power input unit 301 and the switch unit 302 can be arranged at the bottom of the shell assembly 100.

[0123] Exemplarily, the control module 500 can further include a wireless communication unit 60 and an ambient temperature detection unit 70 electrically connected with the power module 300. The bottom of the shell assembly 100 is provided with a mounting area for mounting the wireless communication unit 60 and the ambient temperature detection unit 70. The wireless communication unit 60 can be a Bluetooth device or a wireless WIFI connection device, and the ambient temperature detection unit 70 can be a temperature sensor for detecting the ambient temperature of the environment where the computing device 1 is located and feeding back the ambient temperature detection result to the control module 500. The control module 500 can control the computing power of the computing module 400 and / or the rotating speed of the fan 200 according to the ambient temperature detection result.

[0124] For example, in the case that the ambient temperature detection result is lower than the temperature threshold value, the control module 500 can control the fan 200 to increase the rotating speed to improve the heat exchange efficiency of the airflow and the computing module 400, or the control module 500 can control the computing module 400 to increase the operating frequency to increase the heat generation of the computing module 400, improve the air outlet temperature of the computing device 1, and thus improve the heating effect in the low-temperature environment. For another example, in the case that the ambient temperature detection result is higher than the temperature threshold value, the control module 500 can control the computing module 400 to reduce the operating frequency or control the fan 200 to increase the rotating speed to reduce the heat generation of the computing power board 410 or improve the air cooling effect of the fan 200 on the computing power board 410.

[0125] Exemplarily, referring to Figure 8 The wireless communication unit 60, the ambient temperature detection unit 70 and the air inlet 20c can be arranged at intervals on the bottom of the shell assembly 100.

[0126] As another aspect of the embodiments of the present application, the embodiments of the present application also provide a computing device 1.

[0127] As shown in Figures 2 to 5 The computing device 1 of the embodiments of the present application can include a shell assembly 100 and the control module 500 of the above-mentioned embodiments of the present application. The shell assembly 100 is used for integrated installation of the computing module 400 and the power module 300. The control module 500 can adopt the control module 500 for the computing device 1 of any one of the above-mentioned embodiments of the present application, and the control module 500 is detachably mounted on the shell assembly 100 and electrically connected with the computing module 400 and the power module 300.

[0128] According to the computing device 1 provided in the embodiments of the present application, by adopting the control module 500 provided in the embodiments of the present application, on one hand, the control circuit board 510 can be decoupled from other modules of the computing device 1, the modularization of the control module 500 is realized, the subsequent user can be facilitated to maintain and upgrade according to the demand, the expandability of the computing device 1 is improved, on the other hand, the physical isolation of the control module 500 and other modules of the computing device 1 is realized, the adverse effects of the heat generated by the computing module 400 on the control circuit board 530 can be prevented, the stability of the computing device 1 in operation can be improved, the occupation of the internal space of the shell assembly 100 is reduced, so that the size of the shell assembly 100 can be reduced, and the integration of the computing device 1 can be improved. In addition, the control module 500 can dynamically adjust the heat dissipation system according to the real-time load of other functional modules and the heating demand of the user, so that the stable operation of the computing device 1 is ensured and the heating is realized.

[0129] The control module 500 for the computing device 1 and other components of the computing device 1 in the above embodiments can adopt various technical solutions known to those skilled in the art at present and in the future, which will not be described in detail here.

[0130] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0131] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0132] In the present application, unless specifically defined otherwise, the terms "mount", "connected", "connecting", "fixed", and "fixedly" mean to be connected by any means, for example, fixed connection, detachable connection, or integral, mechanical connection, electrical connection, or communication, direct or indirect, between elements. The above terms can be understood by those of ordinary skill in the art in light of the detailed description.

[0133] In the present application, unless specifically defined otherwise, the terms "mount", "connected", "connecting", "fixed", and "fixedly" mean to be connected by any means, for example, fixed connection, detachable connection, or integral, mechanical connection, electrical connection, or communication, direct or indirect, between elements. The above terms can be understood by those of ordinary skill in the art in light of the detailed description.

[0134] It should be noted that, although the various steps of the methods of the present application are described in a particular order in the accompanying drawings, this does not require or imply that the steps must be performed in that particular order, or that all of the steps shown must be performed to achieve the desired result. Additionally or alternatively, certain steps can be omitted, multiple steps can be combined into a single step, a single step can be divided into multiple steps, and the like. The above-described drawings are merely schematic illustrations of the processes included in the methods according to the exemplary embodiments of the present application, and are not intended to be limiting. It will be readily understood that the processes shown in the above-described drawings do not indicate or limit the time order of the processes. Additionally, it will be readily understood that the processes can be performed synchronously or asynchronously, for example, in multiple modules.

[0135] The above disclosure provides many different embodiments or examples for implementing different structures of the present application. For simplicity of the present application, the previous description of the certain embodiments or examples has not provided specific details and settings in order to avoid obscuring the application. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application can repeatedly refer to reference numerals and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and / or settings discussed.

[0136] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of various changes or replacements within the technical range disclosed by the present application, and these should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A control module for a computing device, the control module comprising: The computing device comprises a shell assembly; the control module comprises: a control box, which defines an installation cavity inside, and is detachably mounted on the shell assembly; a control circuit board, which is arranged in the installation cavity, and is electrically connected with the computing module and the power module in the shell assembly.

2. The control module for a computing device of claim 1, wherein, The control box comprises a shell and a side cover plate, the shell defines the installation cavity and a lateral opening communicating with the installation cavity, and the side cover plate is detachably mounted on the lateral opening.

3. The control module of claim 2, wherein, A through hole is formed on the side cover plate, and the through hole is used for the cable of the power module to pass through and be electrically connected with the control circuit board.

4. The control module of claim 3, wherein, The computing device further comprises a fan arranged on the shell assembly, and an end of the fan is provided with a clamping protrusion; a clamping hole is further formed on the side cover plate, the shape of the clamping hole is matched with the shape of the clamping protrusion, and the clamping hole is used for clamping cooperation with the clamping protrusion.

5. The control module of claim 4, wherein, The side cover plate has a recessed part, the recessed part is recessed in a direction towards the installation cavity, and the recessed part defines a cable receiving groove; the through hole and the clamping hole are arranged on the recessed part.

6. The control module of claim 2, wherein, A clamping hole is formed on a side of the shell assembly adjacent to the control box, and a clamping protrusion is arranged on a side of the side cover plate adjacent to the shell assembly, and the clamping protrusion is used for clamping cooperation with the clamping hole; or, A clamping protrusion is formed on a side of the shell assembly adjacent to the control box, and a clamping hole is formed on the side cover plate, and the clamping hole is used for clamping cooperation with the clamping protrusion.

7. The control module of claim 2, wherein, The shell comprises an upper shell and a lower shell, the bottom of the upper shell is connected with the top of the lower shell; and the material of the upper shell is transparent.

8. The control module of claim 7, wherein, The control module further comprises a display screen, the display screen is arranged in the installation cavity and is electrically connected with the control circuit board, and the display area of the display screen is arranged opposite to the upper shell.

9. The control module of claim 7, wherein, The upper shell and the lower shell are integrally formed by an integral forming process.

10. The control module of claim 1, wherein, A clamping cooperation part is arranged on the outer side wall of the control box, and the clamping cooperation part is correspondingly arranged with a clamping part on the cover side plate of the shell assembly.

11. The control module of claim 10, wherein, The clamping part is a protrusion structure, and the clamping cooperation part is a groove structure; or the clamping part is a groove structure, and the clamping cooperation part is a protrusion structure.

12. The control module of claim 1, wherein, The control module further comprises a communication module electrically connected with the control circuit board; and a mounting through hole is formed on the bottom of the control box, and the mounting through hole is used for mounting the communication module.

13. A computing device, comprising: The shell assembly is used for integrally mounting a computing module and a power module; and The control module according to any one of claims 1 to 12 is detachably mounted on the shell assembly and is electrically connected with the computing module and the power module. ​ ​

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