Temperature-pressure multi-correction system based on MEMS pressure sensor

Abstract

The application discloses a temperature-pressure multiple correction system based on a MEMS pressure sensor and relates to the technical field of temperature-pressure correction.The technical problem that the temperature-pressure correction deviates in the prior art because of the incapability of combination and analysis is solved.The temperature-pressure influence on the MEMS pressure sensor is analyzed, and whether the temperature-pressure value influence is normal when the surrounding environment of the MEMS pressure sensor changes is judged.The temperature-pressure controllability of a monitoring object is analyzed, and whether the temperature-pressure controllability during the operation of the monitoring object meets the actual demand is judged, so that the monitoring accuracy of the monitoring object is ensured, and the temperature-pressure correction of the monitoring object is reasonably supervised and controlled.The temperature-pressure influence on the monitoring object and the control efficiency are combined and analyzed, and whether the temperature-pressure control or the temperature-pressure influence monitoring of the monitoring object is accurate is judged, so that the temperature-pressure control or the temperature-pressure influence abnormality under multiple influence conditions is avoided, the temperature-pressure correction deviates, and the temperature-pressure correction accuracy of the monitoring object is reduced.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of temperature and pressure correction, in particular to a temperature and pressure multiple correction system based on a MEMS pressure sensor. BACKGROUND

[0002] Micro-electro-mechanical system (MEMS) is also called micro-electronic mechanical system, micro system or micro machine, and refers to a high-tech device with a size of several millimeters or even smaller; the internal structure of the micro-electro-mechanical system is generally in micrometer or even nanometer, and is an independent intelligent system.

[0003] However, in the prior art, the temperature and pressure influence and temperature and pressure controllability cannot be analyzed when the MEMS internal pressure sensor is running, so that the temperature and pressure correction accuracy is low, and the temperature and pressure correction deviation is caused due to the incapability of combination analysis, in addition, the MEMS system internal influence in the temperature and pressure correction process cannot be analyzed, and the temperature and pressure correction operation efficiency is reduced.

[0004] In view of the above technical defects, a solution is provided. SUMMARY

[0005] The application aims to solve the above problems, and provides a temperature and pressure multiple correction system based on a MEMS pressure sensor.

[0006] The application can be realized by the following technical scheme.

[0007] The temperature and pressure multiple correction system based on the MEMS pressure sensor comprises a server, and the server is communicatively connected with a temperature and pressure controllability analysis unit, a temperature and pressure influence analysis unit, a combination influence analysis unit, a measurement deviation analysis unit and a temperature and pressure correction influence analysis unit.

[0008] The temperature and pressure influence analysis unit performs temperature and pressure influence analysis on the MEMS pressure sensor, marks the MEMS pressure sensor as a monitoring object, generates a high temperature and pressure influence signal or a low temperature and pressure influence signal through temperature and pressure influence analysis; the temperature and pressure controllability analysis unit performs temperature and pressure controllability analysis on the monitoring object, generates a non-controllable signal or a controllable signal through temperature and pressure controllability analysis; after the temperature and pressure influence analysis and the temperature and pressure controllability analysis are completed, the combination influence analysis unit performs combination analysis on the temperature and pressure influence and control efficiency of the monitoring object.

[0009] The measurement deviation analysis unit performs deviation analysis on the measurement of the monitoring object, and after the measurement deviation analysis is completed, the temperature and pressure correction influence analysis unit performs influence analysis on the internal environment of the monitoring object in the temperature and pressure correction process.

[0010] As a preferred embodiment of the application, the operation process of the temperature and pressure influence analysis unit is as follows:

[0011] The probability of the internal temperature and pressure value fluctuation of the monitoring object when the surrounding environment parameter fluctuates during the operation of the monitoring object and the ratio of the duration that the fluctuation trend of the internal temperature and pressure value of the monitoring object is consistent with the fluctuation trend of the surrounding environment parameter to the total operation duration are obtained, and the probability of the internal temperature and pressure value fluctuation of the monitoring object when the surrounding environment parameter fluctuates during the operation of the monitoring object and the ratio of the duration that the fluctuation trend of the internal temperature and pressure value of the monitoring object is consistent with the fluctuation trend of the surrounding environment parameter to the total operation duration are compared with the value fluctuation probability threshold value and the duration ratio threshold value respectively.

[0012] As a preferred embodiment of the present application, if the probability of the internal temperature and pressure value fluctuation of the monitoring object when the surrounding environment parameter fluctuates during the operation of the monitoring object exceeds the value fluctuation probability threshold value, or the ratio of the duration that the fluctuation trend of the internal temperature and pressure value of the monitoring object is consistent with the fluctuation trend of the surrounding environment parameter to the total operation duration exceeds the duration ratio threshold value, a high temperature and pressure influence signal is generated and sent to the server;

[0013] If the probability of the internal temperature and pressure value fluctuation of the monitoring object when the surrounding environment parameter fluctuates during the operation of the monitoring object does not exceed the value fluctuation probability threshold value, and the ratio of the duration that the fluctuation trend of the internal temperature and pressure value of the monitoring object is consistent with the fluctuation trend of the surrounding environment parameter to the total operation duration does not exceed the duration ratio threshold value, a low temperature and pressure influence signal is generated and sent to the combined influence analysis unit.

[0014] As a preferred embodiment of the present application, the operation process of the temperature and pressure controllability analysis unit is as follows:

[0015] According to the rated value threshold of the temperature and pressure value of the monitoring object, 1 to 1.3 times of the real-time exceeding of the rated value threshold is set as a first fluctuation interval, and more than 1.3 times of the real-time exceeding of the rated value threshold is set as a second fluctuation interval;

[0016] The deviation value of the average time consumption of the temperature and pressure value control corresponding to the first fluctuation interval and the second fluctuation interval during the operation of the monitoring object and the continuous appearance frequency of the temperature and pressure control period of the first fluctuation interval being lower than that of the second fluctuation interval during the operation of the monitoring object are obtained, and the deviation value of the average time consumption of the temperature and pressure value control corresponding to the first fluctuation interval and the second fluctuation interval during the operation of the monitoring object and the continuous appearance frequency of the temperature and pressure control period of the first fluctuation interval being lower than that of the second fluctuation interval during the operation of the monitoring object are compared with the average time consumption deviation value threshold and the continuous appearance frequency threshold respectively.

[0017] As a preferred embodiment of the present application, if the deviation value of the average time consumption of the temperature and pressure value control corresponding to the first floating interval and the second floating interval during the operation of the monitoring object exceeds the average time consumption deviation value threshold, or the continuous occurrence frequency of the temperature and pressure control period of the first floating interval being lower than that of the second floating interval during the operation of the monitoring object exceeds the continuous occurrence frequency threshold, a non-controllable signal is generated and sent to the server;

[0018] If the deviation value of the average time consumption of the temperature and pressure value control corresponding to the first floating interval and the second floating interval during the operation of the monitoring object does not exceed the average time consumption deviation value threshold, and the continuous occurrence frequency of the temperature and pressure control period of the first floating interval being lower than that of the second floating interval during the operation of the monitoring object does not exceed the continuous occurrence frequency threshold, a controllable signal is generated and sent to the combined influence analysis unit.

[0019] As a preferred embodiment of the present application, the operation process of the combined influence analysis unit is as follows:

[0020] The average span difference of the influence of the temperature and pressure value fluctuation of the surrounding environment on the temperature and pressure value fluctuation of the internal environment before and after the temperature and pressure control of the internal running environment of the monitoring object, and the maximum difference of the time consumption of the internal temperature and pressure value control before and after the temperature and pressure value fluctuation of the surrounding running environment of the monitoring object are obtained, and compared with the average span difference threshold and the maximum time consumption difference threshold respectively:

[0021] If the average span difference of the influence of the temperature and pressure value fluctuation of the surrounding environment on the temperature and pressure value fluctuation of the internal environment before and after the temperature and pressure control of the internal running environment of the monitoring object exceeds the average span difference threshold, or the maximum difference of the time consumption of the internal temperature and pressure value control before and after the temperature and pressure value fluctuation of the surrounding running environment of the monitoring object exceeds the maximum time consumption difference threshold, a combined influence analysis abnormal signal is generated and sent to the server;

[0022] If the average span difference of the influence of the temperature and pressure value fluctuation of the surrounding environment on the temperature and pressure value fluctuation of the internal environment before and after the temperature and pressure control of the internal running environment of the monitoring object does not exceed the average span difference threshold, and the maximum difference of the time consumption of the internal temperature and pressure value control before and after the temperature and pressure value fluctuation of the surrounding running environment of the monitoring object does not exceed the maximum time consumption difference threshold, a combined influence analysis normal signal is generated and sent to the server.

[0023] As a preferred embodiment of the present application, the operation process of the measurement deviation analysis unit is as follows:

[0024] obtaining the interval time length floating span value of the floating time of the temperature and pressure value of the monitoring object in the running process and the monitoring and early warning time of the monitoring object and the deviation value of the alarm temperature and pressure floating value corresponding to the real-time monitoring time and the actual temperature and pressure value floating value of the monitoring object in the running process, and comparing the interval time length floating span value and the deviation value of the floating value with the interval time length floating span threshold value and the floating value deviation value threshold value respectively:

[0025] If the interval time length floating span value of the floating time of the temperature and pressure value of the monitoring object in the running process and the monitoring and early warning time of the monitoring object exceeds the interval time length floating span threshold value, or the deviation value of the alarm temperature and pressure floating value corresponding to the real-time monitoring time and the actual temperature and pressure value floating value of the monitoring object in the running process exceeds the floating value deviation value threshold value, a measurement deviation analysis abnormal signal is generated and sent to the server;

[0026] If the interval time length floating span value of the floating time of the temperature and pressure value of the monitoring object in the running process and the monitoring and early warning time of the monitoring object does not exceed the interval time length floating span threshold value, and the deviation value of the alarm temperature and pressure floating value corresponding to the real-time monitoring time and the actual temperature and pressure value floating value of the monitoring object in the running process does not exceed the floating value deviation value threshold value, a measurement deviation analysis normal signal is generated and sent to the server.

[0027] As a preferred embodiment of the present application, the running process of the temperature and pressure correction influence analysis unit is as follows:

[0028] obtaining the instantaneous increase span value of the floating amount of the power parameter corresponding to the internal circuit where the monitoring object is located in the temperature and pressure correction process and the failure rate rising speed of the internal circuit where the monitoring object is located in the temperature and pressure correction process in the operation and maintenance cycle, and comparing the instantaneous increase span value of the floating amount of the power parameter corresponding to the internal circuit where the monitoring object is located in the temperature and pressure correction process and the failure rate rising speed of the internal circuit where the monitoring object is located in the temperature and pressure correction process in the operation and maintenance cycle with the instantaneous increase span threshold value and the failure rate rising speed threshold value respectively.

[0029] As a preferred embodiment of the present application, if the instantaneous increase span value of the floating amount of the power parameter corresponding to the internal circuit where the monitoring object is located in the temperature and pressure correction process exceeds the instantaneous increase span threshold value, or the failure rate rising speed of the internal circuit where the monitoring object is located in the temperature and pressure correction process in the operation and maintenance cycle exceeds the failure rate rising speed threshold value, it is determined that the influence analysis is abnormal in the temperature and pressure correction process, a correction influence abnormal signal is generated and sent to the server, and the server receives the correction influence abnormal signal and re-adjusts the temperature and pressure correction while monitoring the real-time influence of the temperature and pressure;

[0030] If the instantaneous increase span value of the floating amount of the power parameter of the internal circuit where the monitored object is located in the temperature and pressure correction process does not exceed the instantaneous increase span threshold value, and the failure rate rising speed of the internal circuit where the monitored object is located in the temperature and pressure correction process is in the operation and maintenance cycle does not exceed the failure rate rising speed threshold value, it is determined that the influence analysis in the temperature and pressure correction process is normal, a correction influence normal signal is generated and sent to the server.

[0031] Compared with the prior art, the beneficial effects of the present application are:

[0032] 1、In the present application, the temperature and pressure influence of the MEMS pressure sensor is analyzed to determine whether the temperature and pressure value is normal when the surrounding environment of the MEMS pressure sensor changes, thereby improving the temperature and pressure correction accuracy of the MEMS pressure sensor and avoiding the deviation of the temperature and pressure correction caused by the influence of the environment on the temperature and pressure value; the temperature and pressure controllability of the monitored object is analyzed to determine whether the temperature and pressure controllability of the monitored object during operation meets the actual demand, thereby improving the operation feasibility of the monitored object, ensuring the monitoring accuracy of the monitored object, and reasonably monitoring and controlling the temperature and pressure correction of the monitored object; the temperature and pressure influence and control efficiency of the monitored object are combined and analyzed to determine whether the temperature and pressure control or temperature and pressure influence monitoring of the monitored object is accurate, thereby avoiding the abnormal temperature and pressure control or temperature and pressure influence under multiple influence conditions, causing the temperature and pressure correction to deviate, and reducing the temperature and pressure correction accuracy of the monitored object.

[0033] 2、In the present application, the deviation of the measurement of the monitored object is analyzed to determine whether the measurement of the monitored object during real-time operation exists deviation, thereby ensuring the monitoring accuracy of the monitored object, and being able to timely operate and maintain the monitored object when the monitoring deviates, thereby improving the operation efficiency of the monitored object; the influence of the internal environment of the monitored object in the temperature and pressure correction process is analyzed to determine whether the influence of the internal environment of the monitored object in the temperature and pressure correction process is normal, thereby causing the temperature and pressure correction efficiency to be low and affecting the normal operation of the MEMS system. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to facilitate the understanding of those skilled in the art, the present application will be further described below with reference to the accompanying drawings.

[0035] Figure 1 The present application is a schematic diagram of the principle. DETAILED DESCRIPTION

[0036] In order to better understand the technical scheme of the present application, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0037] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment nor are they necessarily mutually exclusive or alternative embodiments. It is explicitly contemplated that embodiments described herein can be combined with other embodiments.

[0038] Please refer to Figure 1 As shown in the drawings, the temperature and pressure multiple correction system based on the MEMS pressure sensor includes a server, and the server is communicatively connected with a temperature and pressure controllability analysis unit, a temperature and pressure influence analysis unit, a combination influence analysis unit, a measurement deviation analysis unit, and a temperature and pressure correction influence analysis unit. In the system, data are collected by using conventional sensors or conventional data collection means in the prior art. For example, a pressure value is collected by using a pressure sensor, and a temperature value is collected by using a temperature sensor.

[0039] The server generates a temperature and pressure influence analysis signal and sends the temperature and pressure influence analysis signal to the temperature and pressure influence analysis unit. After receiving the temperature and pressure influence analysis signal, the temperature and pressure influence analysis unit performs temperature and pressure influence analysis on the MEMS pressure sensor to determine whether the temperature and pressure values are normal when the surrounding environment of the MEMS pressure sensor changes. Thus, the accuracy of temperature and pressure correction of the MEMS pressure sensor is improved, and deviation in temperature and pressure correction caused by the influence of the environment on the temperature and pressure values is avoided.

[0040] The MEMS pressure sensor is marked as a monitoring object. The probability of fluctuation of the internal temperature and pressure values of the monitoring object when the surrounding environment parameters fluctuate during the operation of the monitoring object, and the ratio of the duration during which the fluctuation trend of the internal temperature and pressure values of the monitoring object is consistent with the fluctuation trend of the surrounding environment parameters to the total operation duration are obtained. The probability of fluctuation of the internal temperature and pressure values of the monitoring object when the surrounding environment parameters fluctuate during the operation of the monitoring object, and the ratio of the duration during which the fluctuation trend of the internal temperature and pressure values of the monitoring object is consistent with the fluctuation trend of the surrounding environment parameters to the total operation duration are compared with a value fluctuation probability threshold and a duration ratio threshold, respectively. The surrounding environment parameters refer to the surrounding operation environment parameters of the MEMS pressure sensor, such as the environmental temperature value and the environmental humidity value.

[0041] If the probability of the internal temperature and pressure value fluctuation of the monitoring object exceeds the value fluctuation probability threshold when the surrounding environment parameter fluctuates during the operation of the monitoring object, or the ratio of the duration that the internal temperature and pressure value fluctuation trend is consistent with the surrounding environment parameter fluctuation trend to the total operation duration exceeds the duration ratio threshold, it is determined that the temperature and pressure influence analysis during the operation of the monitoring object is abnormal, a high temperature and pressure influence signal is generated and sent to the server, and the server receives the high temperature and pressure influence signal and monitors the operating environment of the monitoring object in real time, and monitors the surrounding environment when the temperature and pressure of the monitoring object is corrected;

[0042] If the probability of the internal temperature and pressure value fluctuation of the monitoring object does not exceed the value fluctuation probability threshold when the surrounding environment parameter fluctuates during the operation of the monitoring object, and the ratio of the duration that the internal temperature and pressure value fluctuation trend is consistent with the surrounding environment parameter fluctuation trend to the total operation duration does not exceed the duration ratio threshold, it is determined that the temperature and pressure influence analysis during the operation of the monitoring object is normal, a low temperature and pressure influence signal is generated and sent to the combined influence analysis unit; wherein the internal temperature and pressure data are collected by conventional temperature measurement means such as temperature sensors in the prior art;

[0043] The server generates a temperature and pressure controllability analysis signal and sends it to the temperature and pressure controllability analysis unit, and the temperature and pressure controllability analysis unit receives the temperature and pressure controllability analysis signal and performs temperature and pressure controllability analysis on the monitoring object to determine whether the temperature and pressure controllability of the monitoring object during operation meets the actual demand, thereby improving the operation feasibility of the monitoring object and ensuring the monitoring accuracy of the monitoring object, while reasonably supervising and controlling the temperature and pressure correction of the monitoring object;

[0044] According to the rated value threshold of the temperature and pressure value of the monitoring object, 1 to 1.3 times of the real-time value exceeding the rated value threshold is set as a first floating interval, and more than 1.3 times of the real-time value exceeding the rated value threshold is set as a second floating interval;

[0045] The deviation value of the average time consumption of the temperature and pressure value control corresponding to the first floating interval and the second floating interval during the operation of the monitoring object and the continuous appearance frequency of the temperature and pressure control period of the first floating interval being lower than that of the second floating interval during the operation of the monitoring object are obtained, and the deviation value of the average time consumption of the temperature and pressure value control corresponding to the first floating interval and the second floating interval during the operation of the monitoring object and the continuous appearance frequency of the temperature and pressure control period of the first floating interval being lower than that of the second floating interval during the operation of the monitoring object are compared with the average time consumption deviation threshold and the continuous appearance frequency threshold, respectively:

[0046] If the deviation value of the average time consumption of the temperature and pressure value control corresponding to the first floating interval and the second floating interval during the running process of the monitoring object exceeds the average time consumption deviation value threshold, or the frequency of the duration of the temperature and pressure control period of the first floating interval being lower than that of the second floating interval during the running process of the monitoring object continuously appears more than the continuous appearance frequency threshold, it is determined that the temperature and pressure controllability analysis of the monitoring object is unqualified, a non-controllable signal is generated and sent to the server, and after the server receives the non-controllable signal, the temperature and pressure value floating during the running process of the monitoring object is controlled in advance to avoid untimely temperature and pressure control;

[0047] If the deviation value of the average time consumption of the temperature and pressure value control corresponding to the first floating interval and the second floating interval during the running process of the monitoring object does not exceed the average time consumption deviation value threshold, and the frequency of the duration of the temperature and pressure control period of the first floating interval being lower than that of the second floating interval during the running process of the monitoring object continuously appears does not exceed the continuous appearance frequency threshold, it is determined that the temperature and pressure controllability analysis of the monitoring object is qualified, a controllable signal is generated and sent to the combined influence analysis unit;

[0048] After the combined influence analysis unit receives the controllable signal and the temperature and pressure low influence signal, it performs combined analysis on the temperature and pressure influence and control efficiency of the monitoring object, judges whether the temperature and pressure control or temperature and pressure influence monitoring of the monitoring object is accurate, avoids abnormal temperature and pressure control or temperature and pressure influence under multiple influence conditions, causes deviation of temperature and pressure correction, and reduces the accuracy of temperature and pressure correction of the monitoring object;

[0049] The average span difference of the influence of the temperature and pressure value floating of the surrounding environment on the temperature and pressure value floating of the internal environment of the monitoring object before and after temperature and pressure control, and the maximum difference of the time consumption of the internal temperature and pressure value control before and after the temperature and pressure value floating of the surrounding running environment of the monitoring object are obtained, and the average span difference of the influence of the temperature and pressure value floating of the surrounding environment on the temperature and pressure value floating of the internal environment of the monitoring object before and after temperature and pressure control, and the maximum difference of the time consumption of the internal temperature and pressure value control before and after the temperature and pressure value floating of the surrounding running environment of the monitoring object are compared with the average span difference threshold and the maximum time consumption difference threshold respectively: wherein the average span difference is represented as the average value of the internal temperature and pressure value floating span difference before and after temperature and pressure control, and the internal temperature and pressure value control time consumption is represented as the consumption time of controlling the internal temperature and pressure value;

[0050] If the average span difference of the influence of the ambient temperature and pressure value fluctuation on the internal temperature and pressure value fluctuation before and after the internal operating environment of the monitoring object is controlled by temperature and pressure exceeds the average span difference threshold, or the maximum difference of the internal temperature and pressure value control time before and after the ambient operating environment temperature and pressure value fluctuation of the monitoring object exceeds the maximum time difference threshold, it is determined that the combined influence analysis of the monitoring object is abnormal, a combined influence analysis abnormal signal is generated and sent to the server, and the server receives the combined influence analysis abnormal signal. Before and after the temperature and pressure correction of the monitoring object, both influence analysis and controllability analysis are performed;

[0051] If the average span difference of the influence of the ambient temperature and pressure value fluctuation on the internal temperature and pressure value fluctuation before and after the internal operating environment of the monitoring object is controlled by temperature and pressure does not exceed the average span difference threshold, and the maximum difference of the internal temperature and pressure value control time before and after the ambient operating environment temperature and pressure value fluctuation of the monitoring object does not exceed the maximum time difference threshold, it is determined that the combined influence analysis of the monitoring object is normal, a combined influence analysis normal signal is generated and sent to the server;

[0052] After the server receives the combined influence analysis normal signal, a measurement deviation analysis signal is generated and sent to the measurement deviation analysis unit. After the measurement deviation analysis unit receives the measurement deviation analysis signal, the measurement deviation of the monitoring object is analyzed, it is judged whether the measurement of the monitoring object in real-time operation process exists deviation, the monitoring accuracy of the monitoring object is ensured, at the same time, the monitoring object can be timely operated and maintained when the monitoring deviation occurs, and the operation efficiency of the monitoring object is improved;

[0053] The interval time length fluctuation span value of the temperature and pressure value fluctuation time of the monitoring object in the operation process and the monitoring and early warning time of the monitoring object, and the deviation value of the alarm temperature and pressure fluctuation value corresponding to the real-time monitoring time and the actual temperature and pressure value fluctuation value in the operation process of the monitoring object are obtained, and the interval time length fluctuation span value of the temperature and pressure value fluctuation time of the monitoring object in the operation process and the monitoring and early warning time of the monitoring object, and the deviation value of the alarm temperature and pressure fluctuation value corresponding to the real-time monitoring time and the actual temperature and pressure value fluctuation value in the operation process of the monitoring object are compared with the interval time length fluctuation span threshold and the fluctuation value deviation threshold respectively:

[0054] If the interval length floating span value of the temperature and pressure value floating time in the running process of the monitoring object and the monitoring and early warning time of the monitoring object exceeds the interval length floating span threshold value, or the deviation value of the alarm temperature and pressure floating value corresponding to the real-time monitoring time in the running process of the monitoring object and the actual temperature and pressure value floating value exceeds the floating value deviation threshold value, it is determined that the measurement deviation analysis is abnormal in the running process of the monitoring object, a measurement deviation analysis abnormal signal is generated and sent to the server, and the server receives the measurement deviation analysis abnormal signal, and the performance of the monitoring object is maintained, and the running cycle of the monitoring object is adjusted in real time;

[0055] If the interval length floating span value of the temperature and pressure value floating time in the running process of the monitoring object and the monitoring and early warning time of the monitoring object does not exceed the interval length floating span threshold value, and the deviation value of the alarm temperature and pressure floating value corresponding to the real-time monitoring time in the running process of the monitoring object and the actual temperature and pressure value floating value does not exceed the floating value deviation threshold value, it is determined that the measurement deviation analysis is normal in the running process of the monitoring object, a measurement deviation analysis normal signal is generated and sent to the server;

[0056] The server generates a temperature and pressure correction influence analysis signal and sends it to the temperature and pressure correction influence analysis unit. After receiving the temperature and pressure correction influence analysis signal, the temperature and pressure correction influence analysis unit analyzes the influence of the internal environment of the monitoring object in the temperature and pressure correction process, and determines whether the internal environment of the monitoring object in the temperature and pressure correction process is normal, thereby causing low temperature and pressure correction efficiency and affecting the normal operation of the MEMS system.

[0057] The instantaneous increase span value of the corresponding power parameter floating amount of the internal circuit of the monitoring object in the temperature and pressure correction process and the failure rate rising speed of the internal circuit of the monitoring object in the temperature and pressure correction process are obtained, and the instantaneous increase span value of the corresponding power parameter floating amount of the internal circuit of the monitoring object in the temperature and pressure correction process and the failure rate rising speed of the internal circuit of the monitoring object in the temperature and pressure correction process are compared with the instantaneous increase span threshold value and the failure rate rising speed threshold value respectively. The power parameter is represented as the voltage, current and other parameters in the MEMS circuit.

[0058] If the instantaneous increase span value of the corresponding power parameter floating amount of the internal circuit of the monitoring object in the temperature and pressure correction process exceeds the instantaneous increase span threshold value, or the failure rate rising speed of the internal circuit of the monitoring object in the temperature and pressure correction process exceeds the failure rate rising speed threshold value, it is determined that the influence analysis is abnormal in the temperature and pressure correction process, a correction influence abnormal signal is generated and sent to the server, and the server receives the correction influence abnormal signal, and the temperature and pressure correction is re-adjusted and the real-time influence of the temperature and pressure is monitored.

[0059] If the instantaneous increase span value of the floating amount of the power parameter corresponding to the internal circuit where the monitoring object is located does not exceed the instantaneous increase span threshold value in the temperature and pressure correction process, and the failure rate rising speed of the internal circuit where the monitoring object is located in the operation and maintenance period does not exceed the failure rate rising speed threshold value, it is determined that the influence analysis in the temperature and pressure correction process is normal, a correction influence normal signal is generated and sent to the server.

[0060] In use, the temperature and pressure influence analysis unit performs temperature and pressure influence analysis on the MEMS pressure sensor, marks the MEMS pressure sensor as a monitoring object, and generates a high temperature and pressure influence signal or a low temperature and pressure influence signal through temperature and pressure influence analysis; the temperature and pressure controllability analysis unit performs temperature and pressure controllability analysis on the monitoring object, generates a non-controllable signal or a controllable signal through temperature and pressure controllability analysis; after completing the temperature and pressure influence analysis and the temperature and pressure controllability analysis, the temperature and pressure influence and control efficiency of the monitoring object are combined and analyzed by the influence analysis unit; the measurement deviation analysis unit analyzes the measurement deviation of the monitoring object, and after completing the measurement deviation analysis, the temperature and pressure correction influence analysis unit analyzes the influence of the internal environment of the monitoring object in the temperature and pressure correction process.

[0061] The preferred embodiments disclosed above are only used to help explain the present application. The preferred embodiments do not describe all the details, nor limit the present application to the specific embodiments. Obviously, many modifications and variations can be made according to the content of the present application. The present application is selected and described in detail to better explain the principles and practical applications of the present application, so that those skilled in the art can well understand and utilize the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A temperature and pressure multiple correction system based on a MEMS pressure sensor, characterized in that, It includes a server, and the server communication connection includes a temperature and pressure controllability analysis unit, a temperature and pressure influence analysis unit, a combined influence analysis unit, a measurement deviation analysis unit, and a temperature and pressure correction influence analysis unit; The temperature and pressure influence analysis unit performs temperature and pressure influence analysis on the MEMS pressure sensor, marking the MEMS pressure sensor as the monitoring object, and generating either high or low temperature and pressure influence signals through the analysis. The temperature and pressure controllability analysis unit performs temperature and pressure controllability analysis on the monitoring object, generating either uncontrollable or controllable signals through the analysis. After completing the temperature and pressure influence analysis and temperature and pressure controllability analysis, the influence analysis unit combines the temperature and pressure influence of the monitoring object with the control efficiency for a combined analysis. The operation process of the influence analysis unit is as follows: The average span difference in the impact of ambient temperature and pressure fluctuations on the internal temperature and pressure fluctuations before and after temperature and pressure control of the internal operating environment of the monitored object, as well as the maximum difference in the control time of the internal temperature and pressure values ​​before and after the fluctuations of ambient temperature and pressure values ​​of the monitored object, are obtained and compared with the average span difference threshold and the maximum time difference threshold, respectively. If the average span difference of the fluctuation of the temperature and pressure values ​​of the surrounding environment before and after the temperature and pressure control of the internal operating environment of the monitored object exceeds the average span difference threshold, or if the maximum difference in the control time of the internal temperature and pressure values ​​before and after the fluctuation of the temperature and pressure values ​​of the surrounding operating environment of the monitored object exceeds the maximum difference in the control time threshold, then a combined influence analysis anomaly signal will be generated and sent to the server. If the average span difference of the fluctuation of the temperature and pressure values ​​of the surrounding environment before and after the temperature and pressure control of the internal operating environment of the monitored object does not exceed the average span difference threshold, and the maximum difference in the control time of the internal temperature and pressure values ​​before and after the fluctuation of the temperature and pressure values ​​of the surrounding operating environment of the monitored object does not exceed the maximum difference in the control time threshold, then a combined influence analysis normal signal is generated and sent to the server. The measurement deviation analysis unit performs deviation analysis on the measurement of the monitored object. After the measurement deviation analysis is completed, the temperature and pressure correction influence analysis unit performs influence analysis on the internal environment of the monitored object during the temperature and pressure correction process.

2. The temperature and pressure multiple correction system based on a MEMS pressure sensor according to claim 1, characterized in that, The operation process of the temperature and pressure influence analysis unit is as follows: The probability of fluctuation in the internal temperature and pressure values ​​of the monitored object when the surrounding environmental parameters fluctuate during the operation of the monitored object, as well as the ratio of the duration during which the fluctuation trend of the internal temperature and pressure values ​​of the monitored object is consistent with the fluctuation trend of the surrounding environmental parameters to the total operation time, are obtained. The probability of fluctuation in the internal temperature and pressure values ​​of the monitored object when the surrounding environmental parameters fluctuate during the operation of the monitored object, as well as the ratio of the duration during which the fluctuation trend of the internal temperature and pressure values ​​of the monitored object is consistent with the fluctuation trend of the surrounding environmental parameters to the total operation time, are compared with the value fluctuation probability threshold and the duration ratio threshold, respectively.

3. The temperature and pressure multiple correction system based on a MEMS pressure sensor according to claim 2, characterized in that, If the probability of fluctuation of internal temperature and pressure values ​​of the monitored object exceeds the value fluctuation probability threshold when the surrounding environmental parameters fluctuate during the operation of the monitored object, or if the ratio of the duration during which the internal temperature and pressure value fluctuation trend of the monitored object is consistent with the fluctuation trend of the surrounding environmental parameters to the total operation time exceeds the duration ratio threshold, then a high temperature and pressure influence signal will be generated and sent to the server. If the probability of fluctuation in the internal temperature and pressure values ​​of the monitored object does not exceed the value fluctuation probability threshold when the surrounding environmental parameters fluctuate during the operation of the monitored object, and the ratio of the duration during which the internal temperature and pressure value fluctuation trend is consistent with the fluctuation trend of the surrounding environmental parameters to the total operation duration does not exceed the duration ratio threshold, then a low-impact temperature and pressure signal is generated and sent to the combined impact analysis unit.

4. The temperature and pressure multiple correction system based on a MEMS pressure sensor according to claim 1, characterized in that, The operation process of the temperature and pressure controllability analysis unit is as follows: Based on the rated threshold values ​​of the temperature and pressure values ​​of the monitored objects, the first-level floating range is set for real-time values ​​exceeding the rated threshold by 1 to 1.3 times, and the second-level floating range is set for real-time values ​​exceeding the rated threshold by more than 1.3 times. The deviation values ​​of the average time consumed by the temperature and pressure control corresponding to the first-level floating range and the second-level floating range during the operation of the monitored object are obtained, as well as the frequency of the continuous occurrence of the temperature and pressure control period of the first-level floating range being lower than that of the second-level floating range during the operation of the monitored object. The deviation values ​​of the average time consumed by the temperature and pressure control corresponding to the first-level floating range and the second-level floating range during the operation of the monitored object, as well as the frequency of the continuous occurrence of the temperature and pressure control period of the first-level floating range being lower than that of the second-level floating range during the operation of the monitored object, are compared with the average time deviation value threshold and the continuous occurrence frequency threshold, respectively.

5. The temperature and pressure multiple correction system based on a MEMS pressure sensor according to claim 4, characterized in that, If the deviation of the average time spent controlling the temperature and pressure values ​​of the first-level floating range and the second-level floating range during the operation of the monitored object exceeds the average time deviation threshold, or if the frequency of the continuous occurrence of the temperature and pressure control period of the first-level floating range being lower than that of the temperature and pressure control period of the second-level floating range during the operation of the monitored object exceeds the continuous occurrence frequency threshold, then an uncontrollable signal will be generated and sent to the server. If the deviation of the average time consumed by the temperature and pressure values ​​of the first-level floating range and the second-level floating range during the operation of the monitored object does not exceed the average time deviation threshold, and the frequency of the continuous occurrence of the temperature and pressure control period of the first-level floating range being lower than that of the temperature and pressure control period of the second-level floating range during the operation of the monitored object does not exceed the continuous occurrence frequency threshold, then a controllable signal is generated and sent to the combined influence analysis unit.

6. The temperature and pressure multiple correction system based on a MEMS pressure sensor according to claim 1, characterized in that, The operation process of the measurement deviation analysis unit is as follows: The system obtains the interval between the temperature and pressure fluctuation times during the operation of the monitored object and the monitoring and early warning times, as well as the deviation between the alarm temperature and pressure fluctuation values ​​corresponding to the real-time monitoring times and the actual temperature and pressure fluctuation values. These values ​​are then compared with the interval fluctuation span threshold and the fluctuation value deviation threshold, respectively. If the interval between the temperature and pressure value fluctuation time and the monitoring warning time of the monitored object exceeds the interval fluctuation span threshold, or if the deviation between the alarm temperature and pressure value at the real-time monitoring time and the actual temperature and pressure value fluctuation value exceeds the fluctuation value deviation threshold, a measurement deviation analysis abnormal signal will be generated and sent to the server. If the interval between the temperature and pressure fluctuation time and the monitoring warning time of the monitored object does not exceed the interval fluctuation span threshold, and the deviation between the alarm temperature and pressure fluctuation value corresponding to the real-time monitoring time and the actual temperature and pressure fluctuation value does not exceed the fluctuation value deviation threshold, then a measurement deviation analysis normal signal is generated and sent to the server.

7. The temperature and pressure multiple correction system based on a MEMS pressure sensor according to claim 1, characterized in that, The operation process of the temperature and pressure correction effect analysis unit is as follows: The instantaneous growth span of the power parameter fluctuation corresponding to the internal circuit of the monitored object during the temperature and pressure correction process, as well as the failure rate increase rate of the internal circuit of the monitored object within the operation and maintenance cycle during the temperature and pressure correction process, are obtained. The instantaneous growth span of the power parameter fluctuation corresponding to the internal circuit of the monitored object during the temperature and pressure correction process, as well as the failure rate increase rate of the internal circuit of the monitored object within the operation and maintenance cycle during the temperature and pressure correction process, are compared with the instantaneous growth span threshold and the failure rate increase rate threshold, respectively.

8. The temperature and pressure multiple correction system based on a MEMS pressure sensor according to claim 7, characterized in that, If the instantaneous increase span of the power parameter fluctuation value corresponding to the internal circuit of the monitored object exceeds the instantaneous increase span threshold during the temperature and pressure correction process, or if the failure rate increase rate of the internal circuit of the monitored object within the operation and maintenance cycle exceeds the failure rate increase rate threshold during the temperature and pressure correction process, then the impact analysis during the temperature and pressure correction process is determined to be abnormal, a correction impact abnormal signal is generated and sent to the server. After receiving the correction impact abnormal signal, the server readjusts the temperature and pressure correction and monitors the real-time impact of temperature and pressure. If the instantaneous increase span of the power parameter fluctuation corresponding to the internal circuit of the monitored object does not exceed the instantaneous increase span threshold during the temperature and pressure correction process, and the failure rate increase rate of the internal circuit of the monitored object within the operation and maintenance cycle does not exceed the failure rate increase rate threshold during the temperature and pressure correction process, then the impact analysis during the temperature and pressure correction process is determined to be normal, a correction impact normal signal is generated, and the correction impact normal signal is sent to the server.

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