Substrate module and display device

Abstract

The application provides a substrate module and a display device. The substrate module has a folding area and a non-folding area connected with the folding area. The substrate module comprises a rigid layer, an adhesive structure, a protective layer, a glue overflow hole in the folding area and a glue overflow groove in the non-folding area arranged in sequence. The glue overflow groove is arranged on the surface of the adhesive structure. The application improves the glue stacking condition by arranging the glue overflow hole and the glue overflow groove, thereby reducing the generation of folds.

Description

Technical Field

[0001] This invention relates to the field of display devices, and in particular to a substrate module and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) display modules, as flexible displays, have unique bending and folding characteristics, which can be used to manufacture various foldable display devices that are easy to carry and store, and have attracted widespread attention in the market.

[0003] However, after repeated bending, OLED flexible displays are prone to developing creases in their bending areas, affecting the display performance of foldable display devices. Summary of the Invention

[0004] The purpose of this invention is to provide a substrate module and a display device to solve the problem of creases that easily occur in existing foldable display devices.

[0005] To achieve the above objectives, the present invention provides a substrate module having a folded region and a non-folded region connected to the folded region. The substrate module includes a rigid layer, a protective layer, an adhesive structure, an overflow hole, and an overflow groove. The rigid layer covers the folded region and the non-folded region. The protective layer is disposed on one side of the rigid layer. The adhesive structure is disposed between the rigid layer and the protective layer. The overflow hole is disposed in the adhesive structure and located in the folded region. The overflow groove is disposed on at least one surface of the adhesive structure and located in the non-folded region.

[0006] Furthermore, the diameter of the overflow groove opening is smaller than the diameter of the overflow groove bottom. Preferably, the cross-section of the overflow groove in the substrate module stacking direction is at least one of trapezoidal, T-shaped, and L-shaped.

[0007] Further, the adhesive structure includes a first adhesive layer, a second adhesive layer, and a support film. The first adhesive layer is disposed on a surface of the rigid layer facing the protective layer. The second adhesive layer is disposed on a surface of the protective layer facing the rigid layer. The support film is disposed between the first adhesive layer and the second adhesive layer.

[0008] Preferably, the first adhesive layer, the second adhesive layer, and the support film all have the overflow holes. Preferably, the overflow groove is located on a surface of the first adhesive layer facing the rigid layer and / or on a surface of the second adhesive layer facing the protective layer. Preferably, the depth of the overflow groove is less than the thickness of the first adhesive layer or the second adhesive layer.

[0009] Further, the overflow hole includes a first through-hole, a second through-hole, and a third through-hole. The first through-hole is disposed in the first adhesive layer. The second through-hole is disposed in the second adhesive layer. The third through-hole is disposed in the support membrane. Preferably, the orthographic projection of the third through-hole on the rigid layer does not coincide with the orthographic projections of the first through-hole and the second through-hole on the rigid layer. Preferably, the orthographic projection of the first through-hole on the rigid layer coincides with the orthographic projection of the second through-hole on the rigid layer, which are axially symmetrical to each other.

[0010] Furthermore, the overflow groove is disposed on a surface of the first adhesive layer facing the rigid layer and a surface of the second adhesive layer facing the protective layer, and the overflow groove includes a first groove and a second groove. The first groove is disposed in the first adhesive layer. The second groove is disposed in the second adhesive layer. Preferably, the orthographic projection of the first groove on the rigid layer coincides with the orthographic projection of the second groove on the rigid layer.

[0011] Furthermore, the substrate module further includes a mating block disposed in the adhesive overflow groove and connected to the rigid layer and / or the protective layer. The mating block includes a first bump and a second bump. The first bump is connected to the rigid layer and disposed in the first groove. The second bump is connected to the protective layer and disposed in the second groove. Preferably, the material of the first bump is the same as the material of the rigid layer, and the material of the second bump is the same as the material of the protective layer. Preferably, the number of mating blocks is less than the number of adhesive overflow grooves, and at least one adhesive overflow groove is provided between two adjacent mating blocks.

[0012] Furthermore, the first adhesive layer and the second adhesive layer contain optical adhesive, and the support film contains a film material. Preferably, the film material can be at least one of polyimide and polyester materials.

[0013] Furthermore, the central axis of each of the overflow holes is parallel to the stacking direction of the substrate module.

[0014] Furthermore, the rigid layer has a perforated pattern located within the folded area.

[0015] The present invention also provides a display device, the display device comprising a substrate module as described above and a display panel disposed on the substrate module.

[0016] The advantages of this invention are: In the substrate module and display device provided by this invention, by adding an overflow hole at the folded part of the substrate module to improve the glue accumulation, the generation of creases is reduced, and the display effect of the display device is improved. At the same time, the cooperation between the overflow groove and the interlocking block in the non-folded part of the substrate module increases the bonding force between the adhesive structure and the rigid layer and the protective layer, preventing film peeling. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the layered structure of the display device provided in the embodiments of the present invention;

[0019] Figure 2 This is a schematic diagram of the layered structure of the substrate module provided in an embodiment of the present invention;

[0020] Figure 3 This is an enlarged schematic diagram of the layered structure of the substrate module within the folded region in an embodiment of the present invention;

[0021] Figure 4 This is an enlarged schematic diagram of the layered structure of the substrate module in the non-folded region in an embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the layered structure of the substrate module provided in another embodiment of the present invention;

[0023] Figure 6 This is an enlarged schematic diagram of the layered structure of the substrate module in the non-folded region in another embodiment of the present invention;

[0024] Figure 7 This is a schematic diagram of the layered structure of the substrate module provided in another embodiment of the present invention.

[0025] The components in the diagram are shown below:

[0026] Display device 1; Display panel 10;

[0027] PAS adhesive layer 20; Substrate module 30;

[0028] Folded area 30A; Non-folded area 30B;

[0029] Rigid layer 31; Hollowed-out pattern 311;

[0030] Adhesive structure 32; First adhesive layer 321;

[0031] Second adhesive layer 322; Support film 323;

[0032] Protective layer 33; Excess adhesive hole 34;

[0033] First via 341; Second via 342;

[0034] Third via 343; Glue overflow groove 35;

[0035] First groove 351; Second groove 352;

[0036] Interlocking block 36; First protrusion 361;

[0037] Second bump 362. Detailed Implementation

[0038] The following description, with reference to the accompanying drawings, illustrates preferred embodiments of the present invention, demonstrating its implementability. These embodiments provide a complete overview of the invention for those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments mentioned herein.

[0039] In the accompanying drawings, components with the same structure are indicated by the same numerical designation, and components with similar structures or functions are indicated by similar numerical designations. The dimensions and thicknesses of each component shown in the drawings are arbitrary, and the present invention does not limit the dimensions and thicknesses of each component. To make the illustrations clearer, the thickness of components is appropriately exaggerated in some places in the drawings.

[0040] Furthermore, the following descriptions of the embodiments of the invention are made with reference to the accompanying illustrations, illustrating specific embodiments in which the invention can be implemented. Directional terms used in this invention, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," and "side," are merely directional references to the accompanying drawings. Therefore, the use of directional terms is for better and clearer explanation and understanding of the invention, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0041] When a component is described as being "on" another component, the component may be placed directly on the other component; alternatively, there may be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "installed to" or "connected to" another component, both can be understood as being directly "installed" or "connected" to, or as being indirectly "installed to" or "connected to" another component via an intermediate component.

[0042] In existing foldable display devices, creases easily form on the bending sections after repeated bending, severely affecting the display effect. The inventors' research revealed that the main cause of these creases is that the adhesive layer used to bond the film layer in the display device experiences bending fatigue after repeated bending, resulting in irreversible deformation and adhesive buildup at the bending points. This gradually leads to bulging and creases in the bending area, thus affecting the display effect. In severe cases, it can even cause the film layer to peel off, further compromising the display.

[0043] This invention provides a display device 1, which is a flexible foldable display device. For example... Figure 1 As shown, the display device 1 includes a display panel 10 and a substrate module 30, with the display panel 10 disposed on a surface of the substrate module 30. The display panel 10 and the substrate module 30 are bonded together using a PAS (Pressure Sensitive Adhesive) layer 20. The display panel 10 provides a display image, and the substrate module 30 provides rigid support and protection for the display panel 10.

[0044] like Figure 2 As shown, the substrate module 30 has a folded region 30A and non-folded regions 30B located on both sides of the folded region 30A and connected to it. The folded region 30A of the substrate module 30 can be bent. The substrate module 30 includes a rigid layer 31 and a protective layer 33, which are bonded together by an adhesive structure 32.

[0045] The rigid layer 31 is a metal support layer that provides rigid support for the display panel 10. The rigid layer 31 can be a single metal layer or an alloy layer. Preferably, the rigid layer 31 is made of a corrosion-resistant metal, such as SUS (stainless steel) or titanium (Ti). In the folding area 30A, the rigid layer 31 has a perforated pattern 311, which is a through-hole penetrating the rigid layer 31. The perforated pattern 311 effectively avoids stress concentration or unevenness during bending of the rigid layer 31, resulting in lower bending stress throughout the module and reducing the risk of film cracking in the folding display device 1, thereby improving the flexibility and stability of the folding display device 1. Simultaneously, the perforated pattern 311 effectively alleviates bending fatigue after repeated bending of the rigid layer 31, preventing breakage and extending its service life.

[0046] The protective layer 33 is disposed on the surface of the rigid layer 31 facing the display panel 10. Specifically, the display panel 10 is fixed to the surface of the protective layer 33 away from the rigid layer 31 by a PAS adhesive layer 20. The protective layer 33 is a BPF (Barrier Protect Film) layer, which is a thin layer structure made of rigid plastic and metal materials. The protective layer 33 can make the bonding area of ​​the display panel 10 have better flatness, thereby facilitating the bonding (bending) connection between the flexible circuit board and the display panel 10. At the same time, the protective layer 33 can also block moisture, preventing moisture from corroding the film layer in the display panel 10, thereby extending the service life of the display panel 10.

[0047] The adhesive structure 32 includes a first adhesive layer 321, a second adhesive layer 322, and a support film 323. The first adhesive layer 321 and the second adhesive layer 322 are respectively disposed on both sides of the support film 323.

[0048] The first adhesive layer 321 is bonded to the rigid layer 31 on one surface opposite to the support film 323, and the second adhesive layer 322 is bonded to the protective layer 33 on one surface opposite to the support film 323, thereby firmly attaching the protective layer 33 to the rigid layer 31 through the adhesive structure 32. Further, the first adhesive layer 321 and the second adhesive layer 322 can be optical adhesives, such as solid optical adhesive (Optical Clear Adhesive, OCA) or liquid optical adhesive (Optical Clear Resin, OCR). Preferably, the first adhesive layer 321 and the second adhesive layer 322 are solid optical adhesives to facilitate subsequent opening operations.

[0049] The support film 323 is located between the two adhesive layers. It is a soft film structure with impact resistance. When the flexible display device 1 is impacted, the protective layer 33 can absorb the impact energy, thus protecting the flexible display device 1. Furthermore, the support film 323 is made of one or more materials selected from polyimide (PI) and polyester materials. The polyester material can be one or more of polyethylene terephthalate-1,4-cyclohexyldimethyl terephthalate (PECT), polyethylene terephthalate (PET), and polyethylene terephthalate-1,4-cyclohexanedimethyl terephthalate (PCT).

[0050] In the folded area 30A, the first adhesive layer 321, the second adhesive layer 322, and the support film 323 are all provided with adhesive overflow holes 34. Specifically, as shown... Figure 3 As shown, the overflow hole 34 includes a first through hole 341, a second through hole 342, and a third through hole 343. The first through hole 341 is disposed in the first adhesive layer 321 and penetrates the first adhesive layer 321. The second through hole 342 is disposed in the second adhesive layer 322 and also penetrates the second adhesive layer 322. The third through hole 343 is disposed in the support film 323 and penetrates the support film 323. When the substrate module 30 is bent, the excess adhesive material generated by the first adhesive layer 321 and the second adhesive layer 322 due to multiple bends can flow into the corresponding overflow hole 34, thereby reducing or eliminating the accumulated adhesive material, improving the phenomenon of adhesive buildup on the rigid layer 31, and achieving the purpose of improving the crease of the display device 1.

[0051] The central axes of the first via 341, the second via 342, and the third via 343 are parallel to the stacking direction of the substrate module 30, that is, the penetration direction of the first via 341, the second via 342, and the third via 343 is parallel to the stacking direction of the substrate module 30.

[0052] Furthermore, the orthographic projection of the third via 343 on the rigid layer 31 does not coincide with the orthographic projections of the first via 341 and the second via 342 on the rigid layer 31. That is, the third via 343 is not connected to the first via 341 and the second via 342, which causes the third via 343 to be misaligned with the first via 341 and the second via 342. The third via 343 can reduce glue buildup on the adhesive layer above and below it. Therefore, by misaligning the third via 343 with other overflow holes 34, the best effect of eliminating glue pushing can be achieved with a smaller number of overflow holes 34.

[0053] Furthermore, the orthographic projection of the first via 341 onto the rigid layer 31 coincides with the orthographic projection of the second via 342 onto the rigid layer 31, and the shape of the first via 341 is the same as the shape of the second via 342. Therefore, the first via 341 and the second via 342 can be made into an overflow hole 34 through the same mask, thereby achieving the effect of reducing production costs.

[0054] In the non-folded region 30B, the substrate module 30 also has a plurality of adhesive overflow grooves 35. For example... Figure 4 As shown, the overflow groove 35 is provided on one surface of the first adhesive layer 321 facing the rigid layer 31 and on one surface of the second adhesive layer 322 facing the protective layer 33.

[0055] Specifically, the adhesive overflow groove 35 includes a first groove 351 and a second groove 352. The first groove 351 is disposed on the surface of the first adhesive layer 321 facing the rigid layer 31, and the second groove 352 is disposed on the surface of the second adhesive layer 322 facing the protective layer 33. The depth of the first groove 351 is less than the thickness of the first adhesive layer 321, and the depth of the second groove 352 is less than the thickness of the second adhesive layer 322. When the substrate module 30 is bent, the first adhesive layer 321 and the second adhesive layer 322 in the non-folded area 30B are stretched towards the folded area 30A under the influence of the folded area 30A and are also compressed by the rigid layer 31 and the protective layer 33. Therefore, under the dual influence of stretching and compression, the adhesive material of the first adhesive layer 321 and the second adhesive layer 322 in the non-folded area 30B will also flow into the folded area 30A, causing adhesive buildup in the folded area 30A. The overflow groove 35 can contain the overflow adhesive in the non-folded area 30B, which can effectively prevent the overflow adhesive in the non-folded area 30B from flowing into the folded area 30A, thereby further reducing the adhesive buildup in the folded area 30B. At the same time, the overflow groove 35 can also release the stress on the first adhesive layer 321 and the second adhesive layer 322 during bending, prevent the first adhesive layer 321 and the second adhesive layer 322 in the non-folded area 30B from tearing during bending, and extend the service life of the adhesive structure 32.

[0056] In another embodiment of the invention, the substrate module 30 further includes a plurality of interlocking blocks 36 in the non-folded region 30B. For example... Figure 5 and Figure 6As shown, the fitting block 36 is disposed on the surfaces of the rigid layer 31 and the protective layer 33 facing the adhesive structure 32. Each overflow groove 35 has a corresponding fitting block 36, the shape of which matches the shape of the overflow groove 35 and is embedded within it. The overflow groove 35 and the fitting block 36 increase the contact area between the adhesive structure 32 and the rigid layer 31 and the protective layer 33, thereby increasing the bonding force between the adhesive structure 32 and the rigid layer 31 and the protective layer 33.

[0057] Specifically, the interlocking block 36 includes a first protrusion 361 and a second protrusion 362. The first protrusion 361 is connected to the rigid layer 31 and embedded in a corresponding first groove 351, while the second protrusion 362 is connected to the protective layer 33 and embedded in a corresponding second groove 352. The first protrusion 361 is made of the same material as the rigid layer 31, thus forming an integrated structure with the rigid layer 31. The first protrusion 361 can be formed on the surface of the rigid layer 31 through an etching process. The second protrusion 362 is made of the same material as the protective layer 33, thus forming an integrated structure with the protective layer 33. The second protrusion 362 can be formed on the surface of the protective layer 33 through a patterning process. Compared to a separate structure, the integrated structure formed by the first protrusion 361 and the second protrusion 362 with the rigid layer 31 and the protective layer 33 provides higher structural stability, further strengthens the bonding force between film layers, and reduces the risk of film layer detachment.

[0058] Optionally, such as Figure 7 As shown, the number of the fitting blocks 36 is less than the number of the overflow grooves 35, and an empty overflow groove 35 is provided between two adjacent fitting blocks 36, that is, the fitting blocks 36 and the empty overflow grooves 35 can be spaced apart. In other embodiments of the present invention, the number of empty overflow grooves 35 between two adjacent fitting blocks 36 is not limited. Two, three or more empty overflow grooves 35 can be provided between two adjacent fitting blocks 36, and their number can be adjusted according to actual production needs.

[0059] The diameter of the opening of the adhesive overflow groove 35 is smaller than the diameter of the bottom of the adhesive overflow groove 35. This causes the diameter of the end of the interlocking block 36 that contacts the bottom of the adhesive overflow groove 35 to be larger than the diameter of the opening of the adhesive overflow groove 35. Therefore, the interlocking block 36 is less likely to separate from the interlocking block 35, thereby further increasing the bonding force between the adhesive structure 32 and the rigid layer 31 and the protective layer 33. Preferably, the cross-section of the adhesive overflow groove 35 in the stacking direction of the substrate module 30 is at least one of an inverted trapezoid, a T-shape, and an L-shape.

[0060] Furthermore, the orthographic projection of the first groove 351 onto the rigid layer 31 coincides with the orthographic projection of the second groove 352 onto the rigid layer 31, and the shape of the first groove 351 is the same as the shape of the second groove 352. Therefore, the first groove 351 and the second groove 352 can be made into an overflow groove 35 by using the same mask, thereby achieving the effect of reducing production costs.

[0061] In this embodiment of the invention, both the overflow hole 34 and the overflow groove 35 can be prepared by an etching process. The overflow hole 34 and the overflow groove 35 can be prepared separately in the same adhesive layer by two etching processes, or they can be prepared together in the same adhesive layer by a single etching process. Preferably, the overflow hole 34 and the overflow groove 35 can be prepared simultaneously using a half-tone mask, thereby improving preparation efficiency and reducing production costs.

[0062] In the substrate module and display device provided in the embodiments of the present invention, by adding an overflow hole at the folded part of the substrate module to accommodate the adhesive, the adhesive buildup is improved, thereby reducing the formation of creases and improving the display effect of the display device. Simultaneously, in the embodiments of the present invention, an interlocking structure is added to the non-folded part of the substrate module to increase the bonding force between the adhesive layer and the rigid and protective layers, preventing the adhesive structure from peeling off after repeated bending, thereby extending the service life of the display device.

[0063] In other embodiments of the present invention, the adhesive overflow groove may be disposed only between the rigid layer and the adhesive structure or between the protective layer and the adhesive structure, and its film structure is similar to that of the substrate module provided in this embodiment, so it will not be described in detail here. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0064] While the invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood that different dependent claims and features described herein can be combined in ways different from those described in the original claims. It is also understood that features described in conjunction with individual embodiments can be used in other described embodiments.

Claims

1. A substrate module, characterized in that, It has a folded area and a non-folded area connected to the folded area; The substrate module includes: A rigid layer covers both the folded area and the non-folded area; A protective layer is disposed on one side of the rigid layer; An adhesive structure is provided between the rigid layer and the protective layer; An overflow hole is provided in the adhesive structure and located in the folded area; An overflow groove is provided on at least one surface of the adhesive structure and located in the non-folded area; The adhesive structure includes: A first adhesive layer is disposed on the surface of the rigid layer facing the protective layer; The second adhesive layer is disposed on a surface of the protective layer facing the rigid layer; A support film is disposed between the first adhesive layer and the second adhesive layer; Both the first adhesive layer and the second adhesive layer are provided with the overflow hole.

2. The substrate module as described in claim 1, characterized in that, The diameter of the opening of the overflow tank is smaller than the diameter of the bottom of the overflow tank.

3. The substrate module as described in claim 2, characterized in that, The cross-section of the overflow groove in the substrate module stacking direction is at least one of trapezoidal, T-shaped, and L-shaped.

4. The substrate module as described in claim 1, characterized in that, The first adhesive layer, the second adhesive layer, and the support film are all provided with the overflow holes.

5. The substrate module as described in claim 1, characterized in that, The overflow groove is provided on one surface of the first adhesive layer facing the rigid layer and / or on one surface of the second adhesive layer facing the protective layer.

6. The substrate module as described in claim 5, characterized in that, The depth of the overflow groove is less than the thickness of the first adhesive layer or the second adhesive layer.

7. The substrate module as described in claim 4, characterized in that, The overflow hole includes: The first through hole is provided in the first adhesive layer; A second via is provided in the second adhesive layer; The third through hole is located in the support membrane.

8. The substrate module as described in claim 7, characterized in that, The orthographic projection of the third via on the rigid layer does not coincide with the orthographic projections of the first via and the second via on the rigid layer.

9. The substrate module as described in claim 7, characterized in that, The orthographic projection of the first via on the rigid layer coincides with the orthographic projection of the second via on the rigid layer.

10. The substrate module as described in claim 5, characterized in that, The adhesive overflow groove is disposed on a surface of the first adhesive layer facing the rigid layer and a surface of the second adhesive layer facing the protective layer. The adhesive overflow groove includes: The first groove is provided in the first adhesive layer; The second groove is provided in the second adhesive layer.

11. The substrate module as described in claim 10, characterized in that, The orthographic projection of the first groove on the rigid layer coincides with the orthographic projection of the second groove on the rigid layer.

12. The substrate module as described in claim 10, characterized in that, Also includes: An interlocking block is disposed in the overflow groove and connected to the rigid layer and / or the protective layer; The interlocking block includes: The first protrusion is connected to the rigid layer and is disposed in the first groove; The second protrusion is connected to the protective layer and is disposed in the second groove.

13. The substrate module as described in claim 12, characterized in that, The material of the first bump is the same as the material of the rigid layer.

14. The substrate module as described in claim 12, characterized in that, The material of the second bump is the same as the material of the protective layer.

15. The substrate module as described in claim 12, characterized in that, The number of the interlocking blocks is less than the number of the overflow grooves, and at least one of the overflow grooves is provided between two adjacent interlocking blocks.

16. The substrate module as described in claim 1, characterized in that, The first adhesive layer and the second adhesive layer contain optical adhesive; The supporting membrane contains a membrane material.

17. The substrate module as described in claim 16, characterized in that, The membrane material comprises at least one of polyimide and polyester material.

18. The substrate module as described in claim 1, characterized in that, The central axis of each overflow hole is parallel to the stacking direction of the substrate module.

19. The substrate module as described in claim 1, characterized in that, The rigid layer has a hollowed-out pattern, which is located in the folded area.

20. A display device, characterized in that, include: The substrate module as described in any one of claims 1-19; The display panel is disposed on the substrate module.

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