A PVD device prevents empty loading system and loading method

Abstract

The application discloses a PVD equipment empty-load prevention loading system and a loading method, and relates to the technical field of silicon wafer processing. The application can code and place silicon wafers on real loading plates while supplying false loading plates to the PVD equipment, avoids the empty-load condition of the PVD equipment, improves the processing efficiency, and has compact structure and small floor space.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer processing technology, specifically to a PVD equipment anti-dry loading system and loading method. Background Technology

[0002] Silicon is refined from quartz sand. Silicon wafers are made by purifying silicon. Then, these pure silicon are made into silicon crystal rods, which become the material for manufacturing quartz semiconductors for integrated circuits. With the development of large-scale integrated circuits, silicon wafers are widely used as the main substrate material for semiconductors and other electronic products.

[0003] When processing silicon wafers, PVD (Physical Vapor Deposition) equipment typically arranges the wafers onto a carrier plate using a feeder, and then sends the carrier plate into the PVD equipment for processing. Because the feeder's speed cannot match the PVD equipment's processing speed, the PVD equipment may experience periods of no load, leading to equipment malfunctions. To prevent this, a dummy carrier plate is used. This means that when the actual carrier plate (the plate holding the silicon wafers) is not fully loaded, but the silicon wafers in the PVD equipment have finished processing, a dummy carrier plate (the plate without any silicon wafers) is sent into the PVD equipment to prevent it from running dry.

[0004] In existing technologies, there are generally two methods for feeding real and dummy substrates into PVD equipment. One method is to use two separate feeders to feed the real and dummy substrates, which is very inconvenient and requires a large area. The other method is to use a single feeder to feed the dummy and real substrates. Although the latter method requires a smaller area, the movement trajectories of the dummy and real substrates are the same, which affects the silicon wafer stacking efficiency of the real substrate. Therefore, there is an urgent need for a PVD equipment anti-dry loading system. Summary of the Invention

[0005] To address the problems existing in the prior art, the present invention solves this problem using the following technical structure.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A PVD equipment anti-air loading system includes: a frame, on which a carrier plate loading area, a silicon wafer stacking area, a processing area and a carrier plate transfer device are provided, wherein the silicon wafer stacking area and the processing area are respectively located on both sides of the carrier plate loading area.

[0008] The carrier board loading area is used to receive real carrier boards or dummy carrier boards and to transfer real carrier boards to the silicon wafer stacking area.

[0009] The silicon wafer stacking area is used to stack silicon wafers on a carrier plate and transfer the carrier plate containing the silicon wafers back to the carrier plate loading area.

[0010] The carrier transfer device is used to transfer the real carrier board, which is loaded with a dummy carrier board or silicon wafer, from the carrier board loading area to the processing area.

[0011] Its further feature is that,

[0012] The silicon wafer stacking area includes a buffer area, a stacking area, a lifting area, and a silicon wafer loading device. The stacking area is located above the buffer area, and the buffer area and the stacking area are located on one side of the carrier plate loading area. The lifting area is located on the side of the buffer area away from the carrier plate loading area.

[0013] The buffer area is used to buffer the actual carrier plates from the carrier plate loading area and transfer the actual carrier plates to the lifting area;

[0014] The lifting area is used to lift the physical substrate from the buffer area and transfer it to the stacking area;

[0015] The material stacking area is used to place the real carrier plates from the lifting area and to transfer the real carrier plates containing silicon wafers to the carrier plate loading area.

[0016] The silicon wafer loading device is used to transfer silicon wafers to the carrier plate in the stacking area.

[0017] The buffer zone includes multiple rotating first conveyor rollers, which are respectively placed on both sides of the buffer zone.

[0018] The stacking area includes multiple rotating second conveyor rollers and two parallel silicon wafer alignment assemblies. The multiple second conveyor rollers are respectively placed on both sides of the stacking area, and the silicon wafer alignment assemblies include multiple UVW alignment platforms evenly divided into two columns.

[0019] The UVW alignment platforms in the same column of the same silicon wafer alignment assembly correspond to the silicon wafer slots in the same column on the carrier plate.

[0020] The UVW alignment platforms on the two silicon wafer alignment assemblies are misaligned.

[0021] The lifting area includes two first support frames, a first lifting frame slidably disposed between the two first support frames, a first drive assembly for driving the first lifting frame to perform lifting movements, and a plurality of third conveying rollers, the plurality of third conveying rollers being rotatably disposed on both sides of the top surface of the first lifting frame.

[0022] The silicon wafer feeding device includes a plurality of first slide rails, a sliding frame slidably disposed on the plurality of first slide rails, a second driving component for driving the sliding frame to slide, and a plurality of adsorption components disposed in parallel on the sliding frame;

[0023] The adsorption assembly includes multiple silicon wafer adsorption elements arranged in a straight line, and each silicon wafer adsorption element includes multiple silicon wafer adsorption heads;

[0024] The first slide rail extends from above the material feeding area to the external silicon wafer feeding device.

[0025] The loading area of ​​the carrier plate includes two second support frames, a second lifting frame slidably disposed between the two second support frames, a third drive assembly for driving the second lifting frame to perform lifting and lowering movements, and a plurality of fourth conveying rollers, the plurality of fourth conveying rollers being rotatably disposed on both sides of the top surface of the second lifting frame.

[0026] The loading area of ​​the carrier plate also includes a sensor installed on the second lifting frame to determine whether the carrier plate is a real carrier plate or a fake carrier plate. The sensor makes the determination by the number of marking holes on the carrier plate.

[0027] The carrier plate transfer device includes multiple second slide rails, a transfer frame slidably disposed on the multiple second slide rails, a fourth drive assembly for driving the transfer frame to slide, and multiple carrier plate adsorption heads disposed on the transfer frame.

[0028] The second slide rail extends from above the loading area of ​​the carrier plate to the processing area.

[0029] A method for preventing empty loading of PVD equipment includes the following steps: placing a carrier plate at the loading area of ​​the carrier plate, and the sensor detecting the number of marking holes on the carrier plate;

[0030] If the substrate placed in the substrate loading area is a real substrate, the substrate loading area will transfer the real substrate to the silicon wafer stacking area, the silicon wafer stacking area will stack the silicon wafers on the real substrate, and transfer the real substrate containing the silicon wafers to the substrate loading area, and the substrate transfer device will transfer the real substrate containing the silicon wafers in the substrate loading area to the processing area.

[0031] If the plate placed in the loading area of ​​the carrier plate is a dummy plate, the carrier plate transfer device will transfer the dummy plate in the loading area of ​​the carrier plate to the processing area.

[0032] The following beneficial effects can be achieved by using the structure described above in this invention:

[0033] 1) This device can stack silicon wafers on a real substrate while simultaneously supplying a dummy substrate to the PVD equipment, thus avoiding the PVD equipment being idle and improving processing efficiency.

[0034] 2) This device transitions and judges between real and fake carriers through the carrier loading area. If it is a real carrier, it is transferred to the silicon wafer stacking area for silicon wafer stacking. If it is a fake carrier, it is directly adsorbed by the carrier transfer device and transferred to the processing area, and finally sent to the PVD equipment. The movement trajectory of the fake carrier is short and will not interfere with the movement of the real carrier, making the device compact and occupying a small area. Attached Figure Description

[0035] Figure 1This is a three-dimensional structural diagram of this embodiment;

[0036] Figure 2 This is a schematic diagram of the internal structure of the rack in this embodiment;

[0037] Figure 3 This is a schematic diagram of the structure of the buffer area and the code area in this embodiment;

[0038] Figure 4 for Figure 3 Enlarged structural diagram at point A;

[0039] Figure 5 This is a schematic diagram of the lifting area in this embodiment;

[0040] Figure 6 This is a schematic diagram of the silicon wafer feeding device in this embodiment;

[0041] Figure 7 This is a schematic diagram of the loading area on the carrier plate in this embodiment;

[0042] Figure 8 This is a schematic diagram of the carrier plate transfer device in this embodiment.

[0043] In the diagram: 1. Buffer area; 11. First conveyor roller; 2. Stacking area; 21. Second conveyor roller; 22. UVW alignment platform; 3. Lifting area; 31. First support frame; 32. First lifting frame; 33. Third conveyor roller; 4. Silicon wafer loading device; 41. First slide rail; 42. Sliding frame; 43. Silicon wafer adsorption component; 5. Carrier plate loading area; 51. Second support frame; 52. Second lifting frame; 53. Fourth conveyor roller; 54. Sensor; 6. Carrier plate transfer device; 61. Second slide rail; 62. Transfer frame; 63. Carrier plate adsorption head; 7. Processing area. Detailed Implementation

[0044] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0045] It should be noted that the terms "comprising" and "having" and any variations thereof in the specification, claims, and accompanying drawings of this invention are intended to cover non-exclusive inclusion. For example, a process, method, area, product, or device that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such process, method, product, or device.

[0046] The following is in conjunction with the appendix Figure 1-8 And further detailed description of this application.

[0047] Example 1, as Figure 1 and 2 As shown, a PVD equipment anti-air loading system includes: a frame, on which a carrier plate loading area 5, a silicon wafer stacking area, a processing area 7 and a carrier plate transfer device 6 are provided, with the silicon wafer stacking area and the processing area being placed on both sides of the carrier plate loading area 5.

[0048] Based on the above structure, during material feeding, the carrier plate is placed in the carrier plate feeding area 5. When the carrier plate is a real carrier plate, the carrier plate feeding area 5 transfers the real carrier plate to the silicon wafer stacking area. The silicon wafer stacking area stacks the silicon wafers on the real carrier plate, and then the real carrier plate containing the silicon wafers is transferred to the carrier plate feeding area 5. Then, the carrier plate transfer device 6 transfers the real carrier plate containing the silicon wafers in the carrier plate feeding area 5 to the processing area 7. When the carrier plate is a dummy carrier plate, the carrier plate transfer device 6 directly transfers the dummy carrier plate in the carrier plate feeding area 5 to the processing area 7. The carrier plate feeding area 5 is used to transition between the real and dummy carrier plates, completing the material supply to the PVD equipment and avoiding the situation of the PVD equipment being unloaded.

[0049] Among them, such as Figure 2-5 As shown, the silicon wafer stacking area includes a buffer area 1, a stacking area 2, a lifting area 3, and a silicon wafer loading device 4. The stacking area 2 is located above the buffer area 1. The buffer area 1 and the stacking area 2 are located on one side of the carrier plate loading area 5. The lifting area 3 is located on the side of the buffer area 1 away from the carrier plate loading area 5.

[0050] In actual use, buffer area 1 is used to buffer the actual carrier board from carrier board loading area 5 and transfer the actual carrier board to lifting area 3. Lifting area 3 lifts the actual carrier board from buffer area 1 to the stacking area 2 and then transfers the carrier board to stacking area 2. Then the silicon wafer loading device 4 transfers the silicon wafer to the actual carrier board at stacking area 2 and then stacking area 2 transfers the actual carrier board containing the silicon wafer to carrier board loading area 5.

[0051] Among them, such as Figure 2 and 3 As shown, the buffer zone 1 includes a plurality of rotating first conveying rollers 11, which are respectively placed on both sides of the buffer zone 1.

[0052] In actual use, the first conveying rollers 11, which are set to rotate on both sides, form a carrier plate placement platform. When multiple first conveying rollers 11 rotate, the carrier plate is moved.

[0053] Among them, such as Figure 3 and 4 As shown, the stacking area 2 includes multiple rotating second conveyor rollers 21 and two parallel silicon wafer alignment components. The multiple second conveyor rollers 21 are respectively placed on both sides of the stacking area 2 (with the same function as the first conveyor roller 11). The silicon wafer alignment components include multiple UVW alignment platforms 22 evenly divided into two columns (UVW alignment platform 22 is a kind of prior art, consisting of an upper plate, a lower plate and four individual groups. UVW corresponds to three power axes, two motors in the X-axis direction (VW axis), one motor in the Y-axis direction (U). The two motors in the X-axis move together to achieve X-axis movement. By controlling the three motors, the movement of X and Y is achieved, and the rotation of the θ-axis achieves alignment).

[0054] In the same silicon wafer alignment assembly, the UVW alignment platform 22 in the same column corresponds to the silicon wafer slot in the same column on the carrier. The UVW alignment platforms 22 on the two silicon wafer alignment assemblies are staggered (corresponding to the odd-numbered rows and even-numbered rows of silicon wafer slots on the carrier, respectively).

[0055] In actual use, due to process requirements, when the lifting area 3 conveys the carrier plate to multiple second conveying rollers 21, when the carrier plate passes through two silicon wafer alignment components, the silicon wafer loading device 4 places the silicon wafers on the silicon wafer slots corresponding to multiple UVW alignment platforms 22, respectively completing the placement of silicon wafers in the odd-numbered and even-numbered rows of silicon wafer slots on the carrier plate, and adjusting the position of the silicon wafers on the silicon wafer slots through the UVW alignment platform 22.

[0056] Among them, such as Figure 3 As shown, the lifting area 3 includes two first support frames 31, a first lifting frame 32 slidably disposed between the two first support frames 31, a first drive assembly for driving the first lifting frame 32 to perform lifting movements (the first drive assembly includes multiple chains and multiple motors, which drive the chains to rotate through the motors, causing the first lifting frame 32 connected to the chains to perform lifting movements), and multiple third conveying rollers 33, which are respectively rotatably disposed on both sides of the top surface of the first lifting frame 32 (with the same function as the first conveying roller 11).

[0057] In actual use, when the multiple first conveying rollers 11 of the buffer area 1 rotate, the carrier plate is transferred to the upper part of the multiple third conveying rollers 33. Then the first drive assembly drives the first lifting frame 32 to move upward until the third conveying roller 33 and the second conveying roller 21 are on the same horizontal plane. At this time, the third conveying roller 33 rotates and transfers the carrier plate to the second conveying roller 21.

[0058] Among them, such as Figure 6 As shown, the silicon wafer feeding device 4 includes a plurality of first slide rails 41, a sliding frame 42 slidably disposed on the plurality of first slide rails 41, a second driving assembly (with the same structure as the first driving assembly) for driving the sliding frame 42 to slide, and a plurality of adsorption assemblies arranged in parallel on the sliding frame 42; the adsorption assembly includes a plurality of silicon wafer adsorption elements 43 arranged in a straight line, each silicon wafer adsorption element 43 including a plurality of silicon wafer adsorption heads; the first slide rails 41 extend from above the material stacking area 2 to the external silicon wafer feeding device.

[0059] In actual use, the sliding frame 42 is driven to slide on the first slide rail 41 by the second driving component. Multiple adsorption components are arranged in parallel to obtain silicon wafers from the outside and then transfer them to the stacking area 2 to load the carrier board at the stacking area 2.

[0060] Among them, such as Figure 7 As shown, the loading area 5 on the carrier plate includes two second support frames 51, a second lifting frame 52 slidably disposed between the two second support frames 51, a third drive assembly (with the same structure as the first drive assembly) for driving the second lifting frame 52 to perform lifting and lowering movements, and a plurality of fourth conveying rollers 53, which are respectively rotatably disposed on both sides of the top surface of the second lifting frame 52.

[0061] The loading area 5 of the carrier plate also includes a sensor 54 installed on the second lifting frame 52 for determining whether the carrier plate is a real carrier plate or a fake carrier plate. The sensor 54 makes the determination by the number of marking holes on the carrier plate (the sensor 54 is an infrared sensor, which detects the difference in the number of detection holes on the real carrier plate and the fake carrier plate to achieve the purpose of detecting the real carrier plate and the fake carrier plate).

[0062] In actual use, by placing a real or dummy carrier plate on multiple fourth conveyor rollers 53, the sensor 54 detects whether it is a real or dummy carrier plate. If it is a dummy carrier plate, the third drive assembly drives the second lifting frame 52 to rise, so that it is attracted and transported to the processing area 7 by the carrier plate transfer device 6. If it is a real carrier plate, the multiple fourth conveyor rollers 53 are rotated to transport the real carrier plate to the buffer area 1 (at this time, the fourth conveyor rollers 53 and the first conveyor roller 11 are at the same height). After the silicon wafers are stacked in the stacking area 2, the third drive assembly drives the second lifting frame 52 to rise, so that the fourth conveyor rollers 53 and the second conveyor roller 21 are at the same height. At this time, the carrier plate containing the silicon wafers is transferred to the carrier plate loading area 5, and finally transferred to the processing area 7 by the carrier plate transfer device 6.

[0063] Among them, such as Figure 8 As shown, the carrier plate transfer device 6 includes a plurality of second slide rails 61, a transfer frame 62 slidably disposed on the plurality of second slide rails 61, a fourth drive assembly for driving the transfer frame 62 to slide, and a plurality of carrier plate adsorption heads 63 disposed on the transfer frame 62.

[0064] The second slide rail 61 extends from above the loading area 5 on the carrier plate to the processing area 7.

[0065] In actual use, the carrier plate is adsorbed by multiple carrier plate adsorption heads 63, and then the fourth drive component drives the transfer frame 62 to slide on the second slide rail 61 to transfer the carrier plate to the processing area 7.

[0066] Example 2: A feeding method based on a PVD equipment anti-air loading system, the steps include: when the carrier plate is placed at the carrier plate loading area 5, the sensor 54 detects the number of marked holes on the carrier plate (the difference is determined by the number of holes on the real carrier plate and the dummy carrier plate. For example, if the real carrier plate has one hole and the dummy carrier plate has two holes, when the sensor 54 detects two holes, it is a dummy carrier plate, and when it detects one hole, it is a real carrier plate. The detection is done by marking the holes. The method is simple and easy to implement. It does not affect the processing, does not require changes to the size of the carrier plate, and does not affect the stacking of silicon wafers).

[0067] If the substrate placed in the substrate loading area 5 is a real substrate, the substrate loading area 5 will transfer the real substrate to the silicon wafer stacking area. The silicon wafer stacking area will stack the silicon wafers on the real substrate and transfer the real substrate containing the silicon wafers to the substrate loading area 5. The substrate transfer device 6 will transfer the real substrate containing the silicon wafers in the substrate loading area 5 to the processing area 7.

[0068] If the plate placed in the loading area 5 is a dummy plate, the plate transfer device 6 will transfer the dummy plate in the loading area 5 to the processing area 7.

[0069] In summary, this device can simultaneously stack silicon wafers on a real substrate and supply dummy substrates to the PVD equipment, avoiding the PVD equipment being idle and improving processing efficiency.

[0070] This device uses the carrier plate loading area 5 to transition and judge between real and fake carrier plates. If it is a real carrier plate, it is transferred to the silicon wafer stacking area for silicon wafer stacking. If it is a fake carrier plate, it is directly adsorbed by the carrier plate transfer device 6 and transferred to the processing area 7, and finally sent into the PVD equipment. The movement trajectory of the fake carrier plate is short and will not interfere with the movement of the real carrier plate, making the device compact and occupying a small area.

[0071] The above are merely preferred embodiments of this application, and the present invention is not limited to the above embodiments. It is understood that other improvements and variations that are directly derived or conceived by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included within the protection scope of the present invention.

Claims

1. A PVD apparatus anti-idle loading system, characterized in that, include: The frame is provided with a carrier board loading area (5), a silicon wafer stacking area, a processing area (7) and a carrier board transfer device (6). The silicon wafer stacking area and the processing area are respectively located on both sides of the carrier board loading area (5). The carrier board loading area (5) is used to receive real carrier boards or dummy carrier boards and transfer the real carrier boards to the silicon wafer stacking area; The silicon wafer stacking area is used to stack silicon wafers on a carrier plate and transfer the carrier plate containing the silicon wafers back to the carrier plate stacking area (5). The carrier transfer device (6) is used to transfer the real carrier board with dummy carrier board or silicon wafer loaded in the carrier board loading area (5) to the processing area (7).

2. The PVD apparatus anti-idle loading system according to claim 1, wherein: The silicon wafer stacking area includes a buffer area (1), a stacking area (2), a lifting area (3), and a silicon wafer loading device (4). The stacking area (2) is located above the buffer area (1). The buffer area (1) and the stacking area (2) are located on one side of the carrier plate loading area (5). The lifting area (3) is located on the side of the buffer area (1) away from the carrier plate loading area (5). The buffer area (1) is used to buffer the real carrier plate from the carrier plate loading area (5) and transfer the real carrier plate to the lifting area (3); The lifting area (3) is used to lift the substrate from the buffer area (1) and transfer it to the stacking area (2); The material stacking area (2) is used to place the real carrier board from the lifting area (3) and transfer the real carrier board containing silicon wafers to the carrier board loading area (5); The silicon wafer loading device (4) is used to transfer the silicon wafers to the carrier plate in the stacking area (2).

3. The PVD apparatus anti-idle loading system of claim 2, wherein: The buffer area (1) includes a plurality of rotating first conveying rollers (11), which are respectively placed on both sides of the buffer area (1).

4. The PVD apparatus anti-idle loading system of claim 2, wherein: The stacking area (2) includes multiple rotating second conveying rollers (21) and two parallel silicon wafer alignment components. The multiple second conveying rollers (21) are respectively placed on both sides of the stacking area (2). The silicon wafer alignment components include multiple UVW alignment platforms (22) evenly divided into two columns. The UVW alignment platform (22) in the same column of the same silicon wafer alignment assembly corresponds to the silicon wafer slot in the same column on the carrier. The UVW alignment platforms (22) on the two silicon wafer alignment components are misaligned.

5. The PVD apparatus anti-idle loading system of claim 2, wherein: The lifting area (3) includes two first support frames (31), a first lifting frame (32) slidably disposed between the two first support frames (31), a first driving component for driving the first lifting frame (32) to perform lifting movements, and a plurality of third conveying rollers (33), wherein the plurality of third conveying rollers (33) are respectively rotatably disposed on both sides of the top surface of the first lifting frame (32).

6. The PVD apparatus anti-idle loading system of claim 2, wherein: The silicon wafer feeding device (4) includes a plurality of first slide rails (41), a sliding frame (42) slidably disposed on the plurality of first slide rails (41), a second driving component for driving the sliding frame (42) to slide, and a plurality of adsorption components arranged in parallel on the sliding frame (42); The adsorption assembly includes a plurality of silicon wafer adsorption elements (43) arranged in a straight line, and each silicon wafer adsorption element (43) includes a plurality of silicon wafer adsorption heads; The first slide rail (41) extends from above the material feeding area (2) to the external silicon wafer feeding device.

7. The system according to claim 1, wherein the system further comprises a load lock chamber. The loading area (5) of the carrier plate includes two second support frames (51), a second lifting frame (52) slidably disposed between the two second support frames (51), a third drive assembly for driving the second lifting frame (52) to perform lifting and lowering movements, and a plurality of fourth conveying rollers (53), wherein the plurality of fourth conveying rollers (53) are respectively rotatably disposed on both sides of the top surface of the second lifting frame (52).

8. The PVD apparatus anti-idle loading system of claim 7, wherein: The loading area (5) of the carrier plate also includes a sensor (54) installed on the second lifting frame (52) for determining whether the carrier plate is a real carrier plate or a fake carrier plate. The sensor (54) makes the determination by the number of marking holes on the carrier plate.

9. The PVD apparatus anti-idle loading system of claim 1, wherein: The carrier plate transfer device (6) includes a plurality of second slide rails (61), a transfer frame (62) slidably disposed on the plurality of second slide rails (61), a fourth drive assembly for driving the transfer frame (62) to slide, and a plurality of carrier plate adsorption heads (63) disposed on the transfer frame (62); The second slide rail (61) extends from above the loading area (5) of the carrier plate to the processing area (7).

10. A method for preventing empty loading of a PVD device, applied to the PVD device empty loading prevention system of claim 8, characterized in that the steps of include: The carrier plate is placed at the loading area (5) of the carrier plate, and the sensor (54) detects the number of marking holes on the carrier plate; If the substrate placed in the substrate loading area (5) is a real substrate, the substrate loading area (5) will transfer the real substrate to the silicon wafer stacking area, the silicon wafer stacking area will stack the silicon wafers on the real substrate and transfer the real substrate containing the silicon wafers to the substrate loading area (5), and the substrate transfer device (6) will transfer the real substrate containing the silicon wafers in the substrate loading area (5) to the processing area (7). If the plate placed in the loading area (5) of the carrier plate is a dummy plate, the carrier plate transfer device (6) will transfer the dummy plate in the loading area (5) of the carrier plate to the processing area (7).

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