A robotic arm compatible with two sizes of wafers

Abstract

The present invention discloses a robotic arm compatible with two sizes of wafers, which includes a robotic arm main body, a wafer gripper and a limiting mechanism arranged on the robotic arm main body. The limiting mechanism includes a first limiting component and a second limiting component. The first limiting component is located at the standard clamping position, and a driving mechanism is connected to the second limiting component. The driving mechanism drives the limiting component to approach or move away from the standard position. The wafer gripper is provided with a first limiting bayonet and a second limiting bayonet. The first limiting component cooperates with the first limiting bayonet to clamp a wafer of one size, and the second limiting component cooperates with the second limiting bayonet to clamp a wafer of another size. The robotic arm of this solution can be used for the transfer of wafers of two sizes. For the transfer of wafers of two sizes, the robotic arm can be flexibly switched without disassembling parts. The switching process is realized through the driving mechanism, which improves the versatility of the robotic arm and simultaneously improves the processing efficiency.

Description

Technical Field

[0001] The present invention relates to the field of wafer transfer robots. More specifically, it relates to a robot compatible with two sizes of wafers. Background Art

[0002] In the wafer processing technology, the movement of wafers between different positions relies on robots. Wafers have different sizes, such as 6 / 8 / 12 inches. For different sizes, the robots are set with different opening and closing angles. The existing robots can only pick up wafers of one size. If it is necessary to transfer wafers of another size, the entire robot needs to be replaced. After replacement, debugging is also required, which takes a long time. Summary of the Invention

[0003] The purpose of the present invention is to provide a robot compatible with two sizes of wafers to solve the technical problems existing in the above background art.

[0004] The technical solution of the present invention provides a robot compatible with two sizes of wafers, including a robot main body, a wafer gripper and a limiting mechanism arranged on the robot main body;

[0005] The limiting mechanism includes a first limiting component and a second limiting component. The first limiting component is located at the standard clamping position. A driving mechanism is connected to the second limiting component, and the driving mechanism drives the second limiting component to approach or move away from the standard position;

[0006] The wafer gripper is provided with a first limiting notch and a second limiting notch. The first limiting component cooperates with the first limiting notch to clamp wafers of one size, and the second limiting component cooperates with the second limiting notch to clamp wafers of another size.

[0007] In a preferred embodiment, the first limiting component includes a first stop block and two arc-shaped clamping arms symmetrically arranged on both sides of the first stop block; the second limiting component includes a second stop block and two arc-shaped clamping arms symmetrically arranged on both sides of the second stop block.

[0008] In a preferred embodiment, the driving mechanism includes a lifting driving component and a telescopic driving component. The lifting driving component is connected to the arc-shaped clamping arm two, and the telescopic driving component is connected to the second stop block. The lifting driving component and the telescopic driving component respectively drive the arc-shaped clamping arm two and the second stop block to move to the standard clamping position.

[0009] In a preferred embodiment, a limiting groove is arranged at the bottom of the arc-shaped clamping arm one, and a limiting notch is correspondingly arranged on the arc-shaped clamping arm two. When the lifting driving component drives the arc-shaped clamping arm one to the position where the limiting notch is clamped with the limiting groove, the arc-shaped clamping arm two is located at the standard clamping position.

[0010] In a preferred embodiment, the telescopic driving assembly includes a pneumatic cavity, a connecting rod extending from the pneumatic cavity, a return spring located in the pneumatic cavity and sleeved on the connecting rod, and a piston located in the pneumatic cavity and fixed to the end of the connecting rod. The connecting rod is connected to a second stopper outside the pneumatic cavity, and a driving cylinder is connected to the pneumatic cavity.

[0011] In a preferred embodiment, the wafer gripper is slidably disposed on the main body of the robotic arm, and the first stopper and the second stopper move synchronously with the wafer gripper.

[0012] In a preferred embodiment, the first stopper has a first arc surface adapted to cooperate with the first limiting bayonet, and the second stopper has a second arc surface adapted to cooperate with the second limiting bayonet.

[0013] In a preferred embodiment, the first limiting bayonet and the first stopper form a first wafer slot for placing wafers of one size, and the second limiting bayonet and the second stopper form a second wafer slot for placing wafers of another size. The first wafer slot and the second wafer slot are concentrically arranged.

[0014] In a preferred embodiment, the height of the first arc-shaped clamping arm is adapted to the height of the first wafer slot, and the height of the second arc-shaped clamping arm is adapted to the height of the second wafer slot.

[0015] In a preferred embodiment, the distances between the first stopper, the second stopper and the wafers of their respective adapted sizes are both 2 - 3 mm.

[0016] The beneficial effects of the technical solution of the present invention are as follows:

[0017] The robotic arm of the present solution can be used for the transfer of wafers of two sizes. For the transfer of wafers of two sizes, the robotic arm can be flexibly switched without disassembling parts. The switching process is realized by a driving mechanism, which improves the versatility of the robotic arm and simultaneously improves the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of the overall structure of the present invention,

[0019] Figure 2 is a schematic diagram of the structure when the present invention transports 8-inch wafers,

[0020] Figure 3 is a schematic diagram of the structure when the present invention transports 6-inch wafers,

[0021] Figure 4 is a cross-sectional view of the telescopic driving assembly of the present invention.

[0022] Description of the reference numerals: 1 Main body of the robotic arm; 2 Wafer gripper; 21 First limit bayonet; 22 Second limit bayonet; 3 First limit assembly; 31 First stop block; 32 First arc-shaped clamping arm; 33 Limit groove; 4 Second limit assembly; 41 Second stop block; 42 Second arc-shaped clamping arm; 43 Notch of the limit groove; 5 Lifting drive assembly; 6 Telescopic drive assembly; 61 Pneumatic cavity; 62 Connecting rod; 63 Return spring; 64 Piston; 7 6-inch wafer; 8 8-inch wafer. Detailed implementation manners

[0023] The present invention will be further described in detail below with reference to the drawings and specific implementation manners. The embodiments of the present invention are given for the convenience of illustration and description, and are not exhaustive or limit the present invention to the disclosed form. Many modifications and variations will be obvious to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and enable those of ordinary skill in the art to understand the present invention and design various embodiments with various modifications suitable for specific purposes.

[0024] As Figures 1-4 shown, the technical solution of the present invention provides a robotic arm compatible with two sizes of wafers, including a main body 1 of the robotic arm, a wafer gripper 2 provided on the main body 1 of the robotic arm, and a limiting mechanism. The wafer gripper 2 is used to extend out of the main body 1 of the robotic arm to obtain wafers. After the wafer gripper 2 returns to the main body 1 of the robotic arm, the obtained wafers are limited by the limiting mechanism, so that the wafers are stably and accurately placed on the wafer gripper 2. The robotic arm of this solution can be used for the transfer of two sizes of wafers, such as 6-inch wafers 7 and 8-inch wafers 8. For the transfer of two sizes of wafers, the robotic arm can be flexibly switched, improving the versatility of the robotic arm and at the same time improving the processing efficiency.

[0025] The limiting mechanism includes a first limit assembly 3 and a second limit assembly 4. The first limit assembly 3 is located at the standard clamping position. A driving mechanism is connected to the second limit assembly 4, and the driving mechanism drives the second limit assembly 4 to approach or move away from the standard position. The wafer gripper 2 is provided with a first limit bayonet 21 and a second limit bayonet 22. The first limit assembly 3 cooperates with the first limit bayonet 21 to clamp one size of wafer, and the second limit assembly 4 cooperates with the second limit bayonet 22 to clamp the other size of wafer.

[0026] The position of the first limiting component 3 is fixed, and the second limiting component 4 can be driven by a driving mechanism. In this solution, taking a 6-inch wafer and an 8-inch wafer as examples, when transporting an 8-inch wafer, the first limiting component 3 is used for limiting, and the driving mechanism drives the second limiting component 4 away from the first limiting component 3 so that its clamping of the first limiting component 3 has no obstruction or blockage. When transporting a 6-inch wafer, the driving mechanism drives the second limiting component 4 to the standard clamping position, and the standard position here refers to the position when cooperating with the wafer fork 2. The switching is achieved through the driving mechanism without disassembling parts.

[0027] The first limiting component 3 includes a first stopper 31 and two arc-shaped clamping arms 32 symmetrically arranged on both sides of the first stopper 31; the second limiting component 4 includes a second stopper 41 and two arc-shaped clamping arms 42 symmetrically arranged on both sides of the second stopper 41.

[0028] The wafer fork 2 is slidably arranged on the robot arm main body 1, and the first stopper 31 and the second stopper 41 move synchronously with the wafer fork 2. The first stopper 31 has a first arc surface that cooperates with the first limiting bayonet 21, and the second stopper 41 has a second arc surface that cooperates with the second limiting bayonet 22. The first limiting bayonet 21 and the first stopper 31 form a first wafer slot for placing wafers of one size, and the second limiting bayonet 22 and the second stopper 41 form a second wafer slot for placing wafers of another size. The first wafer slot and the second wafer slot are concentrically arranged.

[0029] When the wafer fork 2 moves to the wafer receiving place to obtain a wafer, the first stopper 31 and the second stopper 41 move together with the wafer fork 2. The position of the first stopper 31 is fixed, and the position of the second stopper 41 is adjusted according to the usage requirements. When receiving wafers of the corresponding size, the wafers fall into the wafer slots of the corresponding size. During this process, the positions of the arc-shaped clamping arms 32 and the arc-shaped clamping arms 42 are fixed. The height of the arc-shaped clamping arm 32 is adapted to the height of the first wafer slot, and the height of the arc-shaped clamping arm 42 is adapted to the height of the second wafer slot. When the wafer fork 2 receives the wafer and returns to the main body position, the arc-shaped clamping arms of the corresponding size will contact the wafer and limit the wafer through their arc surfaces.

[0030] The distances between the first stopper 31, the second stopper 41 and the wafer with their adapted sizes are both 2 - 3 mm. Taking an 8-inch wafer as an example, when the wafer gripper 2 acquires the wafer, the wafer moves downward from above the wafer gripper 2 and falls between the first stopper 31 and the wafer gripper 2. If the distance between the first stopper 31 and the center of the wafer is the radius of the wafer, then it requires an extremely small error when the wafer falls, otherwise the wafer will be stuck obliquely; if the distance between the first stopper 31 and the center of the wafer is too large, then when the wafer gripper 2 returns to the main body position, the displacement distance of the wafer is too large, resulting in the wafer flying out. Therefore, in this solution, a certain distance deviation is set, which is 2 - 3 mm. After the wafer gripper 2 acquires the wafer and returns to the initial position, the arc-shaped clamping arm 32 will limit and position the wafer to ensure that the wafer is placed stably and accurately.

[0031] The driving mechanism in this solution includes a lifting driving component 5 and a telescopic driving component 6. The lifting driving component 5 is connected to the arc-shaped clamping arm 42, the telescopic driving component 6 is connected to the second stopper 41, and the lifting driving component 5 and the telescopic driving component 6 respectively drive the arc-shaped clamping arm 42 and the second stopper 41 to move to the standard clamping position.

[0032] A limiting groove 33 is provided at the bottom of the arc-shaped clamping arm 32, and a corresponding limiting notch 43 is provided on the arc-shaped clamping arm 42. When the lifting driving component 5 drives the arc-shaped clamping arm 32 to be clamped with the limiting notch 43 and the limiting groove 33, the arc-shaped clamping arm 42 is located at the standard clamping position. In this solution, the lifting driving component 5 is set as a cylinder, and other mechanisms that can achieve the lifting function in the prior art can also be used.

[0033] The telescopic driving component 6 includes a pneumatic cavity 61, a connecting rod 62 extending from the pneumatic cavity 61, a return spring 63 located in the pneumatic cavity 61 and sleeved on the connecting rod 62, and a piston 64 located in the pneumatic cavity 61 and fixed at the end of the connecting rod 62. The connecting rod 62 is connected to the second stopper 41 outside the pneumatic cavity 61. The piston 64 drives the second stopper 41 to displace through the connecting rod 62. The displacement force for its extension comes from the pressure of the gas filled in the pneumatic cavity 61, and the return force comes from the elastic force of the return spring 63. A cylinder is connected to the outside of the pneumatic cavity 61 to inflate and deflate the pneumatic cavity 61.

[0034] Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art and related fields without creative work shall fall within the protection scope of the present invention. The structures, devices, and operation methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the art without special instructions and limitations.

Claims

1. A robotic arm compatible with two sizes of wafers, characterized in that: It includes a robotic arm main body, a wafer gripper and a limiting mechanism arranged on the robotic arm main body; The limiting mechanism includes a first limiting component and a second limiting component. The first limiting component is located at a first standard clamping position. A driving mechanism is connected to the second limiting component, and the driving mechanism drives the second limiting component to approach or move away from the first standard clamping position; The wafer gripper is provided with a first limiting bayonet and a second limiting bayonet. The first limiting component cooperates with the first limiting bayonet to clamp wafers of one size, and the second limiting component cooperates with the second limiting bayonet to clamp wafers of another size. The first standard clamping position is the standard position when the first limiting component cooperates with the first limiting bayonet; The first limiting component includes a first stopper and two arc-shaped clamping arms symmetrically arranged on both sides of the first stopper; the second limiting component includes a second stopper and two arc-shaped clamping arms symmetrically arranged on both sides of the second stopper; The driving mechanism includes a lifting driving component and a telescopic driving component. The lifting driving component is connected to the arc-shaped clamping arm two, and the telescopic driving component is connected to the second stopper. The lifting driving component and the telescopic driving component respectively drive the arc-shaped clamping arm two and the second stopper to move to a second standard clamping position. The second standard clamping position is the standard position when the second limiting component cooperates with the second limiting bayonet; The first limiting bayonet and the first stopper form a first wafer slot for placing wafers of one size, and the second limiting bayonet and the second stopper form a second wafer slot for placing wafers of another size. The first wafer slot and the second wafer slot are concentrically arranged.

2. The robotic arm compatible with two sizes of wafers according to claim 1, wherein: A limiting groove is arranged at the bottom of the arc-shaped clamping arm one, and a limiting notch is correspondingly arranged on the arc-shaped clamping arm two. When the lifting driving component drives the arc-shaped clamping arm two to the limiting notch to be clamped with the limiting groove, the arc-shaped clamping arm two is located at the second standard clamping position.

3. The robotic arm compatible with two sizes of wafers according to claim 1, characterized in that: The telescopic driving component includes a pneumatic cavity, a connecting rod extending from the pneumatic cavity, a return spring located in the pneumatic cavity and sleeved on the connecting rod, and a piston located in the pneumatic cavity and fixed at the end of the connecting rod. The connecting rod is connected to the second stopper outside the pneumatic cavity, and a driving cylinder is connected to the pneumatic cavity.

4. The robotic arm compatible with two sizes of wafers according to claim 1, characterized in that: The wafer gripper is slidably arranged on the robotic arm main body, and the first stopper and the second stopper move synchronously with the wafer gripper.

5. A robotic arm compatible with two sizes of wafers according to claim 1, characterized in that: The first stopper has a first arc surface that cooperates with the first limiting bayonet, and the second stopper has a second arc surface that cooperates with the second limiting bayonet.

6. The robotic arm compatible with two sizes of wafers according to claim 1, wherein: The height of the arc-shaped clamping arm one is adapted to the height of the first wafer slot, and the height of the arc-shaped clamping arm two is adapted to the height of the second wafer slot.

7. The robotic arm compatible with two sizes of wafers according to claim 1, characterized in that: The distances between the first stopper, the second stopper and the wafers of their adapted sizes are both 2-3 mm.

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