A method for regulating regular distribution of laser energy emitted by a galvanometer for diamond processing

By adjusting the energy distribution of the laser emitted by the galvanometer, the problem of uneven energy density in diamond laser processing was solved, enabling high-precision diamond planarization and complex shape processing, while reducing the difficulty and cost of equipment manufacturing.

CN118123230BActive Publication Date: 2026-08-04ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
Filing Date
2024-04-02
Publication Date
2026-08-04

AI Technical Summary

Technical Problem

In diamond laser processing, the uneven energy density distribution caused by the laser emitted by the galvanometer affects the processing accuracy and yield, especially when processing complex shapes, it is impossible to guarantee the surface accuracy.

Method used

By regulating the energy distribution of the laser emitted by the galvanometer, using laser software processing control system, and combining linewidth testing and graphic sensors, the position and defocus of the laser head are adjusted to achieve a uniform and regular distribution of laser energy on the focal plane.

Benefits of technology

It significantly improves the planarization accuracy of diamond processing, enabling the processing of complex shapes such as curved surfaces, angled surfaces, and concave surfaces, without increasing equipment costs and reducing the requirements for the installation accuracy of the laser square head.

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Patent Text Reader

Abstract

The application provides a method for regulating regular distribution of laser energy emitted by a galvanometer for diamond processing, which comprises the following steps: setting laser emitter parameters, drawing a line segment in a laser software processing control system, and determining the incident angle between the laser beam and the horizontal plane of the processing platform; amplifying the different trends of the line width of the marked line segment on the line width test object, regulating the laser trajectory emitted by the galvanometer, and performing marking; measuring the line width, determining the energy density according to the measurement result, regulating the energy uniformity distribution of the drawn line segment, regulating the regular and non-uniform distribution of the drawn line segment according to the shape characteristics of the pre-processed object, drawing and importing a new graph, and processing the diamond by laser. The application can eliminate energy errors and improve the precision to a very high level by regulating the uniformity of the energy distribution on the diamond surface, and can realize the processing of special appearances by regulating the regular and non-uniform distribution of the laser energy on the diamond surface.
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Description

Technical Field

[0001] This invention relates to the field of laser processing technology, and in particular to a method for controlling the regular distribution of laser spot energy on the focal plane after the laser spot is emitted by oscillating a galvanometer. Background Technology

[0002] Currently, the mainstream processing method for diamond is mechanical grinding. However, due to the high hardness and brittleness of diamond, traditional grinding methods are inefficient and cannot guarantee a high yield. Laser processing technology, due to its unique processing characteristics, is widely used in the mechanical manufacturing field, such as surface treatment and cutting. It is not limited by the hardness or brittleness of materials and has high removal efficiency and excellent yield for high-hardness and high-brittle materials. Patent document CN11317234 discloses a laser processing device and method for diamond surface planarization. It includes a laser system component for planarizing the high points of the diamond surface to be processed, a processing platform component for fixing the diamond to be processed and being able to move along the X and Y axes and rotate itself, a coaxial optical displacement sensor for detecting the surface morphology of the diamond to be processed, and a CNC system for controlling the processing and detection process and processing and analyzing data. By utilizing the laser tilt angle to expand the defocus range, it achieves high-efficiency planarization of the diamond surface, solving the current problems of difficult diamond surface processing, low efficiency, and easy damage. However, this patent has not yet effectively solved the processing of special shapes, such as curved surfaces, angled surfaces, concave surfaces, and conical surfaces.

[0003] The laser beam energy is strongest, resulting in high material removal rate and highest processing efficiency only when the object being processed is located at the laser focal point. Conversely, at non-focal points, the laser beam energy decreases, leading to lower material removal rate and slower processing efficiency. For example, patent document CN11209141 discloses a focal length correction method for a laser marking system. This method adjusts the thinnest line to the center of the grid, thereby correcting the marking focal length. It can be seen that when the line width is the thinnest, it represents the laser focal length position. At this point, the laser beam at the focal plane is the smallest, with high energy density. Conversely, when the line width is too thin, the laser beam is off-focus, the laser beam becomes larger, the energy density decreases, and the line width becomes thicker. This invention is convenient to use and effectively corrects the focal length of the marking laser. However, this patent mainly discloses a method for adjusting the focal length and does not address the method for controlling the regular distribution of the beam energy on the focal plane after the beam is emitted by the galvanometer.

[0004] The laser beam is focused to the focal point by a lens, and a thermal reaction occurs with the workpiece, resulting in material removal. This focal point is broadly defined as the point where a laser spot is focused through the center of the lens. However, when the laser spot is oscillated by a galvanometer to form a pattern and focus on the material surface, due to various factors such as the installation accuracy of the laser head and the structure of the optical lens, the distance from the laser head to different positions within the focal plane is not the same, and the corresponding laser beam path length is also different. Consequently, the defocusing amount at each position is also different. This results in uneven energy density of the laser spot at different positions, inconsistent material removal rates at different positions of the pattern, and ultimately, the processing accuracy cannot be guaranteed.

[0005] There are two main factors contributing to this energy deviation at different positions within the same focal plane. First, the energy deviation is caused by the F-Theta lens structure. At the focal plane, the beam path emanating from the center of the F-Theta lens is the shortest, resulting in the finest marking lines and the highest energy density. When the emission point is not at the center of the F-Theta lens, the beam path from the spot to the focal plane becomes longer, increasing the defocus, resulting in thicker marking lines and lower energy density. Theoretically, if the emission point is around the perimeter of the F-Theta lens and equidistant from its center, this energy deviation is constant. Second, the energy deviation is caused by errors in the laser head installation. Due to installation precision issues, the laser head will not be perfectly parallel to the focal plane, but will have a small angle with it. Regardless of the direction the laser head is tilted, it will affect the length of the laser beam path from the spot to the focal plane, causing different defocus and energy densities at different positions on the focal plane surface, thus creating processing errors.

[0006] In laser processing, the energy deviation caused by the F-Theta lens structure can significantly affect the processing accuracy. When the laser head is tilted and the galvanometer is oscillating in a straight line to process the diamond surface and flatten it, the energy density of the light spot emanating from the center of the F-Theta lens is the highest, resulting in the highest material removal rate. The energy density of the light spot emanating from a location other than the center of the F-Theta lens is lower, resulting in a lower material removal rate. This causes uneven energy density and inconsistent material removal rates at different locations on the diamond surface, ultimately preventing the diamond from being processed flat and compromising surface accuracy.

[0007] Currently, there is no method for controlling the energy density of the material surface after the laser is emitted from the galvanometer in diamond laser processing. Summary of the Invention

[0008] To address the technical problem in diamond laser processing where the energy density distribution at different locations on the diamond surface is uneven after laser emission, and the energy density cannot be controlled according to processing requirements, leading to difficulties in diamond processing and inability to guarantee surface accuracy, this invention proposes a method for controlling the regular distribution of laser energy emitted by a galvanometer in diamond processing. By controlling the uniformity of the energy density distribution on the diamond surface, energy errors can be eliminated, and accuracy can be improved to an extremely high level.

[0009] The purpose of this invention is to provide a method for different arrangements of laser energy on the focal plane after laser emission from a galvanometer. First, the energy density on the diamond surface is determined by the difference in linewidth at the focal plane, which indirectly reflects the material removal effect at different locations. Then, by controlling the energy arrangement, a uniform energy arrangement method is adopted to eliminate the energy density difference error in diamond laser processing, significantly improving the planarization processing accuracy. It can also control the regular and non-uniform energy arrangement method to achieve the processing of complex diamond shapes (such as angular surfaces, conical surfaces, etc.).

[0010] To achieve the above objectives, the technical solution of the present invention is implemented as follows:

[0011] A method for controlling the regular distribution of laser energy emitted by a galvanometer for diamond processing includes the following steps:

[0012] S1: Setting laser emitter processing parameters and drawing processing graphics: First, set the processing parameters according to the characteristics of the workpiece; then, based on the pre-processed surface structure and shape characteristics of the workpiece, draw a symmetrical line segment in the drawing software of the laser processing control system; finally, determine the incident angle between the laser beam and the horizontal plane of the processing platform based on the pre-processed morphological characteristics of the workpiece.

[0013] S2: Marking on the line width test object: Select the line width test object, place the line width test object horizontally on the processing platform, magnify the different trends of the thickness of the pre-marked line segment on the line width test object, adjust the laser trajectory emitted by the galvanometer, and mark on the surface of the line width test object. After marking, a marked line segment is obtained on the line width test object.

[0014] S3: Energy density difference detection: Place the line width test object at the measurement station of the graphic sensor. The graphic sensor collects the measurement value of the line width of the marking line segment and determines the energy density based on the measurement value of the line width of the marking line segment.

[0015] S4: Energy regularity distribution control: Based on the morphological characteristics of the pre-processed material, select to control the uniformity of energy distribution of the drawn line segment, or, under the premise of controlling the uniformity of energy distribution of the drawn line segment, control the regularity and non-uniformity of energy distribution of the drawn line segment.

[0016] S5: Draw and import new graphics: Re-import the drawn line segments after energy regularity distribution regulation and optimization into the laser software processing control system, repeat steps S2 to S3, and determine whether the energy density on the marking line segments on the surface of the test object meets the requirements of the morphological characteristics of the pre-processed object after processing. If it meets the requirements, proceed to step S6; otherwise, repeat steps S4 to S5.

[0017] S6: Laser processing of diamond: Keep the incident angle between the laser beam incident direction and the horizontal plane of the processing platform unchanged, readjust the position of the laser head, and perform laser processing according to the pre-processed surface structure of the workpiece.

[0018] The method for determining the different trends in line width thickness of the pre-marked line segments in the enlarged line width test object is as follows:

[0019] The laser spot diameter R, the incident angle θ between the laser beam incident direction and the horizontal plane of the processing platform, and the actual line width L of the marking line segment on the test object satisfy the following relationship condition:

[0020]

[0021] By adjusting the laser beam head, the incident angle θ between the laser beam incident direction and the horizontal plane of the processing platform can be reduced. Alternatively, by adjusting the laser beam head, the defocusing amount can be increased, thereby increasing the line width of the entire marking segment and increasing the difference in line width between different positions of the marking segment.

[0022] The method for determining energy density based on the measured value of the line width of the marking line segment is as follows: calculate the percentage deviation of the measured value of the line width of the marking line segment, use the measured value of the line width of the marking line segment as the criterion for determining the difference in energy density on the marking line segment on the surface of the test object, and use the percentage deviation as the criterion for evaluating whether the energy density on the marking line segment is uniform.

[0023] The steps for regulating the uniformity of energy distribution are: first, tilt correction is performed on the drawn line segments, and then the line structure is optimized.

[0024] The method of energy law and non-uniformity control is: to select the line segment to be drawn for linear distribution control of energy law or non-uniform distribution control of energy law according to the shape characteristics of the pre-processed material.

[0025] The tilt correction method is as follows:

[0026] In the laser software processing control system, the defocusing amount and spot path of the marking line segment located on the surface of the line width test object are adjusted by controlling the overall rotation of the drawn line segment with zero point as the center.

[0027] When the overall line width of the marking line segment on the surface of the line width test object in the Y+ direction is greater than the line width in the Y- direction, the laser software processing control system controls the drawn line segment to rotate around the zero point to reduce the defocusing amount in the Y+ direction and the light spot path in the Y+ direction. When the overall line width of the marking line segment on the surface of the line width test object in the Y+ direction is less than the line width in the Y- direction, the laser software processing control system controls the drawn line segment to rotate, increasing the defocusing amount in the Y+ direction and decreasing the defocusing amount in the Y- direction. A marking line segment with the same line width at a symmetrical position centered on the zero point is formed on the line width test object, and an adjusted drawn line segment is formed in the laser software processing control system.

[0028] The method for optimizing the linear structure is as follows:

[0029] In the laser software processing control system, the line segment is drawn with the two ends as the starting point and the center point as the ending point. The line segment is adjusted step by step, and the laser beam corresponding to each point on the line segment is gradually and symmetrically increased to reach the laser beam path and defocus amount of the marking line segment on the surface of the line width test object. This forms an approximately arc-shaped marking line segment on the line width test object. In the laser software processing control system, an approximately arc-shaped drawing line segment is formed.

[0030] The method for regulating the linear distribution of energy is as follows:

[0031] In the laser software processing control system, a line segment that is approximately an arc after being optimized and adjusted for energy uniformity distribution is controlled to rotate as a whole around the zero point. The rotation direction and rotation angle of the line segment are adjusted according to the morphological characteristics of the workpiece to be processed and the position of the laser pointer relative to the line width test object.

[0032] The method for regulating the non-uniform distribution of energy is as follows:

[0033] In the laser software processing control system, a line segment that is approximately an arc after being optimized and adjusted for energy uniformity distribution is divided into several equal segments. Two adjacent equally divided line segments are rotated in opposite directions by the same angle. The two equal divisions form a cycle, forming a shape similar to a sine curve.

[0034] The laser beam path and defocus amount corresponding to each point on the line segment drawn within each division of the sine-like curve will first decrease and then increase or first increase and then decrease depending on the rotation direction and the size of the rotation angle. The energy density on the marking line segment obtained on the line width test object will first decrease and then increase or first increase and then decrease.

[0035] The beneficial effects of this invention are:

[0036] This invention provides a method for determining and controlling the energy density difference of the laser spot at different positions within the focal plane after laser emission; using this method to achieve uniform arrangement and control of laser energy within the focal plane can significantly improve the accuracy of diamond planarization processing;

[0037] It can also control the energy patterns and non-uniform distribution within the focal plane, and develop processing methods for complex diamond surface shapes to achieve processing of special morphologies, such as curved surfaces, angled surfaces, concave surfaces, and conical surfaces.

[0038] This method is highly versatile and applicable to various types of laser emitters;

[0039] Meanwhile, this method can achieve regular energy distribution control without modifying equipment or increasing costs; it also reduces the requirements for the installation accuracy of the laser head, greatly reducing the manufacturing difficulty and cost of diamond laser processing equipment. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is a schematic diagram illustrating the energy difference in the laser emission principle of the present invention.

[0042] Figure 2 This is a schematic diagram of energy distribution regulation according to the present invention.

[0043] Figure 3 This is a flowchart of the method steps of the present invention.

[0044] Among them, 1 is the laser head, 2 is the galvanometer, 3 is the F-Theta lens, 4 is the linewidth test object, 5 is the image sensor, and 6 is the laser emitter. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] Example 1:

[0047] A method for controlling the regular distribution of laser energy emitted by a galvanometer in diamond processing, such as... Figure 1 As shown, the detection device used includes a laser software processing control system, a laser square head 1, a linewidth test object 4, a graphics sensor 5, and a processing platform. The laser software processing system contains drawing software. The laser software processing control system is connected to the laser square head 1 and the graphics sensor 5. The linewidth test object 4 is located on the processing platform, and the laser square head 1 is located above the linewidth test object 4. The laser square head 1 internally includes a galvanometer 2, an F-Theta lens 3, and a laser emitter 6. The galvanometer 2 is located in the middle of the laser square head 1, and the laser emitter 6 and the F-Theta lens 3 are located on both sides of the galvanometer 2. The F-Theta lens 3 is located on the light-emitting side of the laser square head 1. The galvanometer 2 and the laser emitter 6 are connected to the laser software processing control system. Figure 2 As shown, the drawing software is used to draw line segments in the laser software processing control system. The laser software processing control system controls the laser head 1 to emit light to mark the surface of the line width test object 4. Then, the line width of the marked line segment is detected by the graphic sensor 5. The graphic sensor 5 sends the detection data to the laser software processing control system, which performs calculations and uses the calculation results as the judgment standard for energy density difference. According to the judgment standard, the laser software processing control system adjusts the drawn line segments to finally complete the regulation of energy regularity distribution.

[0048] like Figure 3 As shown, the specific steps are as follows:

[0049] S1: Setting laser processing parameters and drawing processing graphics: First, select appropriate processing parameters based on the characteristics of the workpiece, such as the scanning speed, Q frequency, pulse width, and power of the laser emitter 6. Then, based on the pre-processed surface structure and shape characteristics of the workpiece, use drawing software in the laser software processing control system to draw a line segment that coincides with the Y-axis, is perpendicular to the X-axis, and is symmetrical about the X-axis. After the laser beam is emitted, it will form a marking line segment along the Y-axis direction on the focal plane after passing through the F-Theta lens 3. Finally, determine the incident angle between the laser beam and the horizontal plane of the processing platform based on the shape characteristics of the workpiece.

[0050] S2: Marking on the line width test object: Since energy density difference is the only factor affecting the final processing accuracy, it is particularly important to measure the line width of the marking segment more accurately. To facilitate comparison and detection of energy density differences and amplify the different trends in the thickness of the pre-marked line width, this can be achieved by increasing the defocusing amount and decreasing the incident angle θ between the laser beam incident direction and the horizontal plane of the processing platform during marking.

[0051] The laser spot diameter R, the incident angle θ between the laser beam incident direction and the horizontal plane of the processing platform, and the actual line width L of the marking line segment on the surface of the test object 4 should simultaneously satisfy the relationship condition shown in (1):

[0052]

[0053] As can be seen from equation (1), when the incident angle θ between the laser beam incident direction and the horizontal plane of the processing platform is 90°, the line width of the marking line segment at the focal position is the same as the diameter of the laser spot. When the diameter R of the laser spot remains unchanged, as the incident angle between the laser beam incident direction and the horizontal plane of the processing platform decreases, the line width of the marking line segment at the focal position becomes larger than the diameter of the laser spot, which allows for more accurate measurement of the line width of the marking line segment and determination of the energy density difference on the marking line segment.

[0054] Given a fixed detection accuracy, increasing the width of the marking line segment reduces the impact of detection errors, thereby improving the accuracy of judging the thickness of the line at different positions. Similarly, when the incident angle between the laser beam incident direction and the horizontal plane of the processing platform remains unchanged, increasing the defocusing amount increases the laser spot diameter R, thus increasing the width of the entire marking line segment. This amplifies the difference in line thickness at different positions and improves the judgment accuracy.

[0055] Select linewidth test object 4, such as a thin aluminum sheet with a uniformly coated surface. Place linewidth test object 4 horizontally on the processing platform. Adjust the laser square head 1 according to the measurement accuracy requirements to determine the incident angle between the laser beam incident direction and the horizontal plane of the processing platform. The angle is 10° to 90°. Adjust the flatness of linewidth test object 4 to within 0.01m. Adjust the laser square head 1 to select a defocus amount that can meet the material removal requirements and is not lower than the material removal threshold. Adjust the galvanometer 2 to emit the laser trajectory and mark the surface of linewidth test object 4. Due to the energy density difference caused by the structure of F-Theta lens 3 and the installation error of the laser square head, a marking line segment of varying thickness will appear on the surface of linewidth test object 4.

[0056] S3: Energy Density Difference Detection: The line width of the marked line segments on the surface of the test object is used as the criterion for judging energy density differences. Higher energy results in thinner lines, and lower energy results in wider lines. The test object 4 is removed from the processing platform and placed at the graphic sensor measurement station. The graphic sensor measurement parameters are set to ensure that each measurement point is equally spaced and centrally symmetrical on the marked line segments on the surface of the test object 4. The graphic sensor is connected to the laser software processing control system. The laser software processing control system automatically imports the line width measurement values ​​of each marked line segment into a table, and then calculates the percentage deviation of the line width measurement values ​​based on the values ​​in the table. This percentage deviation is used as the criterion for evaluating the uniformity of energy density.

[0057] S4: Energy regularity distribution control: Based on the morphological characteristics of the pre-processed material, select to control the uniformity of energy distribution of the drawn line segment, or, under the premise of controlling the uniformity of energy distribution of the drawn line segment, control the regularity and non-uniformity of energy distribution of the drawn line segment.

[0058] S4.1: Energy Uniformity Control Method: During the marking process, the linewidth test object 4 is placed horizontally. After laser emission, a marking line segment along the Y-axis is formed on the surface of the linewidth test object 4. Due to the influence of the light emission principle of the F-Theta lens 3 and the installation error of the laser square head 1, the linewidth of the marking line segment on the linewidth test object 4 will not be consistent, resulting in uneven energy distribution on the marking line segment and making it impossible to achieve high-precision diamond planarization. The higher the energy uniformity on the marking line segment on the surface of the linewidth test object 4, the more consistent the linewidth of the marking line segment, and the higher the flatness of the processed diamond. The following methods address tilt correction and line structure optimization for the two factors of the light emission principle of the F-Theta lens 3 and the installation error of the laser square head 1, respectively:

[0059] S4.1.1: Tilt Correction: During the installation of laser equipment, especially the laser square head 1, the laser square head 1 will not be absolutely horizontal, but there will be a slight angle between it and the horizontal plane of the processing platform. This angular error will cause the energy density at various positions on both sides of the marking line segment centered on the zero point of the Y-axis to be inconsistent, which will greatly reduce the processing accuracy.

[0060] When the overall width of the marking line segment on the surface of the linewidth test object 4 in the Y+ direction is greater than that in the Y- direction, meaning the overall energy density of the marking line segment in the Y+ direction is lower than that in the Y- direction, the laser software processing control system should control the drawn line segment to rotate around the zero point. This reduces the defocusing amount of the marking line segment in the Y+ direction and increases the defocusing amount of the marking line segment in the Y- direction, thus reducing the spot path of the marking line segment in the Y+ direction and increasing the spot path of the marking line segment in the Y- direction. Consequently, the energy density of the marking line segment in the Y+ direction on the linewidth test object 4 will increase, and the linewidth of the marking line segment will decrease. Similarly, the energy density of the marking line segment in the Y- direction on the linewidth test object 4 will decrease, and the linewidth of the marking line segment will increase. This achieves the goal of consistent energy density on both sides of the marking line segment centered at the zero point. Similarly, when the overall width of the marking line segment on the surface of the linewidth test object 4 in the Y+ direction is smaller than the overall width of the marking line segment in the Y- direction, meaning the overall energy density of the marking line segment in the Y+ direction is higher than the energy density in the Y- direction, the laser software processing control system can control the rotation of the drawn line segment to increase the defocusing amount of the marking line segment in the Y+ direction and decrease the defocusing amount of the marking line segment in the Y- direction. After tilt correction is completed, the width of the marking line segment will be symmetrically positioned with the zero point as the center, and the energy density on the marking line segment will also be symmetrically positioned with the zero point as the center. After tilt correction is completed, a marking line segment with the same width symmetrically positioned with the zero point as the center is formed on the linewidth test object, and an adjusted drawn line segment is formed in the laser software processing control system.

[0061] S4.1.2: Linear Structure Optimization: Due to the limitations of the optical structure of the laser emitter 6, the laser beam is focused on the surface of the line width test object 4 by the F-Theta lens 3. The laser beam emanating from the center of the F-Theta lens 3 has the shortest path to the surface of the line width test object 4, and the corresponding laser spot energy density, energy, and line width on the surface of the line width test object 4 are the highest. On the other hand, the laser beam emanating from the non-center of the F-Theta lens 3 has a longer path to the surface of the line width test object 4, and the defocusing amount is relatively increased. Similarly, as the laser beam gradually moves away from the center of the F-Theta lens 3, the path of the laser beam to the surface of the line width test object 4 gradually increases, the defocusing amount gradually increases, the spot energy density continuously decreases, and the line width becomes wider.

[0062] To ensure a uniform energy distribution on the surface of the linewidth test object 4 after adjustment, based on tilt correction, the laser software processing control system controls the drawing of the line segment, using both ends as the starting point and the center point as the ending point, in a step-by-step adjustment process. Specifically, during the adjustment from the starting point to the ending point of the line segment, the laser beam's spot path and defocus amount to the starting points of the marking line segment on the surface of the linewidth test object 4 remain constant. The laser beam's spot path and defocus amount to the marking line segment at each point on the linewidth test object 4 are gradually increased, achieving consistent linewidth and energy density at each corresponding position on the linewidth test object 4. Ultimately, an approximately arc-shaped marking line segment is formed on the linewidth test object 4, which is also reflected in the laser software processing control system.

[0063] By judging the uniformity of the line width of the marked line segments on the surface of the line width test object 4, and by correcting the tilt of the laser marked line segments and optimizing the line structure, the path of the laser beam corresponding to each point on the drawn line segment to the marked line segment on the surface of the line width test object 4 was changed. The marked line segment changed from a line segment that coincided with the Y axis and had inconsistent line width to a line segment that was approximately an arc with an angle to the Y axis. The line width of the marked line segments on the surface of the line width test object 4 tended to be consistent, thus achieving the purpose of energy uniformity control.

[0064] S4.2: Energy Pattern and Non-uniform Distribution Control Methods: Based on the completed energy uniformity control, further adjustments are made to the defocus amount and spot path at different positions of the marking line segment on the surface of the linewidth test object 4 through tilt correction or linear structure optimization. This achieves linear and non-uniform energy pattern control on the surface of the linewidth test object 4. Tilt correction or linear structure optimization can be flexibly selected according to the different pre-processed morphologies of the diamond. The specific control methods are as follows:

[0065] S4.2.1: The method for controlling the linear distribution of energy can be implemented in the laser software processing control system by rotating an approximately circular arc-shaped line segment, after optimization and adjustment of energy uniformity, around the zero point. This causes the line width of the marking segment on the test object 4 to exhibit a linear variation trend depending on the rotation direction and angle. The energy density of the marking segment on the test object 4 will also exhibit a linear variation trend. This linear variation trend refers to the fact that, after adjusting the drawn line segment, the line width of the irradiated marking segment on the test object 4 will linearly increase or decrease from the center to both ends of the segment. The originally uniform marking segment can be processed into angled surfaces or bevels using this control method. The larger the rotation angle, the greater the trend of energy density change; different angled surfaces or bevels can be processed according to different energy density change trends.

[0066] S4.2.2: The non-uniform energy distribution control method divides an approximately circular arc drawing line segment, after optimization and adjustment of energy uniformity, into several equal segments. In the laser software processing control system, two adjacent equally divided drawing line segments are rotated in opposite directions by the same angle. Two equal divisions constitute one cycle, forming a drawing line segment with an angle to the Y-axis, similar to a sine curve. Depending on the rotation direction and angle, the laser beam path and defocus amount corresponding to each point on the drawing line segment within each division will first decrease and then increase or increase and then decrease on the surface of the line width test object 4. The energy density of the marking line segment on the surface of the line width test object 4 will also have a periodic trend of first decreasing and then increasing or increasing and then decreasing, thereby realizing the processing of diamond convex and concave bevels.

[0067] S5: Draw and import new graphics: Re-import the drawn line segments after energy regularity distribution control into the laser software processing control system, repeat steps S2 to S3, and determine whether the energy density of the marked line segments on the surface of the line width test object 4 meets the requirements of the morphological characteristics of the pre-processed object after processing based on the numerical distribution of the line width of the marked line segments on the surface of the line width test object 4. If it meets the requirements, proceed to step S6 laser diamond processing; if it does not meet the requirements, repeat steps S4-S5.

[0068] S6: Laser processing of diamond: The object to be processed is placed in the processing area of ​​the processing platform. The incident angle between the laser beam incident direction and the horizontal plane of the processing platform remains unchanged. The position of the laser head 1 is readjusted according to the thickness of the diamond. Based on the processing surface shape, the workpiece is moved back and forth and rotated to perform laser processing.

[0069] Based on the above-described method of the present invention, the following embodiments are given for processing examples such as diamond sheet planarization, diamond square sheet angle surface machining, and diamond square sheet forming:

[0070] Example 2:

[0071] A method for controlling the regular distribution of laser energy emitted by a galvanometer in diamond processing, used for high-precision planarization of diamond wafers, comprises the following steps:

[0072] I. Processing parameters and drawing of graphics: First, set the scanning speed, Q frequency, pulse width, power and other parameters of laser emitter 6 according to the characteristics of diamond; then, draw a line segment with a length greater than the diameter of the diamond wafer in the control software of laser emitter 6 according to the diameter of the diamond wafer; finally, rotate laser square head 1 to the required angle to maintain the incident angle between the laser beam and the horizontal plane of the processing platform.

[0073] II. Marking on the Line Width Test Object: Select an aluminum sheet as the line width test object 4. Place the line width test object 4 on the processing platform and adjust the flatness of the aluminum sheet surface to within 0.01m. According to the measurement accuracy requirements, adjust the laser square head 1 to determine the incident angle θ between the laser beam incident direction and the horizontal plane of the processing platform. Adjust the position of each working axis. The processing platform is located on the x and y axes of the machine tool, and the laser square head 1 is on the z axis. Adjusting the position of the working axes is to emit the laser beam emitted by the laser square head 1 onto the surface of the aluminum sheet. Adjust the laser square head 1 to select a defocus amount that can meet the material removal requirements and is not lower than the material removal threshold. Control the focus of the laser emitter 6 to focus on the surface of the aluminum sheet. Then control the laser emitter 6 to complete one light emission to complete the marking work on the surface of the aluminum sheet.

[0074] III. Energy Density Difference Detection: Remove the aluminum sheet and place it at the measurement station of the graphic sensor 5. Set the measurement parameters of the graphic sensor 5 to ensure that each measurement point is evenly spaced on the marking line segment on the aluminum sheet surface and that all measurement points are symmetrical. Simultaneously, connect the graphic sensor 5 to the laser software processing system. The laser software processing system automatically imports the measured values ​​of the line width of each marking line segment into the corresponding table. The value of the line width of the marking line segment is used as the criterion for judging the energy density difference on the aluminum sheet surface. The larger the value, the smaller the energy density at that location; the smaller the value, the larger the energy density at that location. Then, calculate the percentage deviation of the line width value of the marking line segment based on the values ​​in the table. The percentage deviation is used as a quantitative standard for evaluating whether the energy density is uniform.

[0075] IV. Regulation of energy regularity distribution: The zero point of the coordinate is the center of the marking line segment. In the line width data detected in step three, the line width value of the center part of the marking line segment is the smallest, and the line width values ​​of the two sides of the marking line segment symmetrical about the zero point center are slightly larger and unequal.

[0076] Tilt Correction: First, based on the line width values ​​at various positions symmetrically centered on the line segment on both sides and the position of the laser pointer 1 relative to the aluminum sheet, determine the rotation direction of the line segment drawn in the laser software processing control system. Then, control the drawn line segment to rotate a certain angle in the determined direction, reducing the defocus and spot path at positions with larger line width values ​​and increasing the defocus and spot path at positions with smaller line width values, thus completing tilt correction. At this time, the line width values ​​of the marked line segment should gradually approach and become the same at various symmetrical positions centered on the zero point during the rotation of the drawn line segment, and the line width values ​​of the marked line segment should become larger and larger at positions further away from the zero point.

[0077] Linear structure optimization: After tilt correction, the laser beam path emanating from both ends of the drawn line segment is the longest, with the largest defocusing amount; the laser beam path emanating from the center of the drawn line segment is the shortest, with the smallest defocusing amount. When optimizing the linear structure, the adjustment direction of the drawn line segment is determined based on the position of the laser head 1 relative to the aluminum sheet. Then, in the laser software processing control system, the two ends of the drawn line segment are used as the starting point and the zero point as the ending point. The adjustment is performed step by step, gradually and symmetrically increasing the spot path and defocusing amount of the laser beam corresponding to each point on the drawn line segment to the aluminum sheet surface. This forms an approximately arc-shaped marking line segment on the aluminum sheet surface, completing the control of the laser energy on the aluminum sheet surface after it exits through the galvanometer 2.

[0078] V. Drawing and Importing New Graphics: Re-import the drawn line segments, after optimization and adjustment based on energy distribution regularity, into the laser software processing control system. Repeat steps two and three. Determine whether the energy density on the marking line segments on the surface of the aluminum sheet meets the requirements for high-precision planarization of the diamond wafer based on the line width values ​​at various locations. If not, proceed to steps four and five. When the percentage deviation of the line width at all measurement positions on the marking line segment is less than 2%, proceed to step six.

[0079] VI. Laser Planarization of Diamond Wafers: The object to be processed is placed in the processing area of ​​the processing platform. The incident angle between the laser beam incident direction and the horizontal plane of the processing platform remains unchanged. The position of the laser head 1 is readjusted according to the thickness of the diamond. The worktable drives the diamond wafer to move back and forth and rotate. The laser beam is focused on the surface of the diamond wafer to remove material. The worktable repeats the back and forth and rotation process to complete the high-precision planarization of the diamond wafer.

[0080] Other implementation methods not mentioned in this embodiment are the same as in Embodiment 1.

[0081] Example 3:

[0082] A method for controlling the regular distribution of laser energy emitted by a galvanometer in diamond processing, specifically for machining the angular surfaces of square diamond sheets, comprises the following steps:

[0083] I. Processing parameters and line segment drawing: First, set the scanning speed, Q frequency, pulse width, power and other parameters of the laser emitter 6 according to the characteristics of diamond; then, draw a line segment with a length greater than the diameter of the diamond wafer in the laser emitter 6 control software according to the diameter of the diamond wafer; finally, rotate the laser square head 1 to the required angle to maintain the incident angle between the laser beam and the horizontal plane of the processing platform.

[0084] II. Marking on the Line Width Test Object: Select an aluminum sheet as the line width test object 4. Place the line width test object 4 on the processing platform and adjust the flatness of the aluminum sheet surface to within 0.01m. According to the measurement accuracy requirements, adjust the laser square head 1 to determine the incident angle θ between the laser beam incident direction and the horizontal plane of the processing platform. Adjust the position of each working axis. The processing platform is located on the x and y axes of the machine tool, and the laser square head is on the z axis. Adjusting the working axis position is to emit the laser beam emitted by the laser square head 1 onto the surface of the aluminum sheet. Adjust the laser square head 1 to select a defocus amount that can meet the material removal requirements and is not lower than the material removal threshold. Control the focus of the laser emitter 6 to focus on the surface of the aluminum sheet. Then control the laser emitter 6 to complete one light emission to complete the marking work on the surface of the aluminum sheet.

[0085] III. Energy Density Difference Detection: Remove the aluminum sheet and place it at the measurement station of the graphic sensor 5. Set the measurement parameters of the graphic sensor 5 to ensure that each measurement point is evenly spaced on the marking line segment on the aluminum sheet surface and that all measurement points are symmetrical. Simultaneously, connect the graphic sensor 5 to the laser software processing system. The laser software processing system automatically imports the measured values ​​of the line width of each marking line segment into the corresponding table. The value of the line width of the marking line segment is used as the criterion for judging the energy density difference on the aluminum sheet surface. The larger the value, the smaller the energy density at that location; the smaller the value, the larger the energy density at that location. Then, calculate the percentage deviation of the line width value of the marking line segment based on the values ​​in the table. The percentage deviation is used as a quantitative standard for evaluating whether the energy density is uniform.

[0086] IV. Regulation of Regular Energy Distribution:

[0087] 1) Energy uniformity distribution control: The zero point of the coordinate is the center of the marking line segment. In the line width data detected in step three, the line width value of the center part of the marking line segment is the smallest, and the line width values ​​of the two sides of the marking line segment symmetrical about the zero point are slightly larger and unequal.

[0088] Tilt Correction: First, based on the line width values ​​at various positions symmetrically centered on the line segment on both sides of the marking line segment and the position of the laser pointer 1 relative to the aluminum sheet, determine the rotation direction of the line segment drawn in the laser software processing control system. Then, control the drawn line segment to rotate a certain angle in the determined direction, reducing the defocus and spot path at positions with larger line width values ​​and increasing the defocus and spot path at positions with smaller line width values, thus completing tilt correction. At this time, the line width values ​​of the marking line segment should gradually approach and become the same at various symmetrical positions centered on the zero point during the rotation of the drawn line segment, and become increasingly larger at positions farther from the zero point.

[0089] Linear structure optimization: After tilt correction, the laser beam path emanating from both ends of the drawn line segment is the longest, with the largest defocus amount; the laser beam path emanating from the center of the drawn line segment is the shortest, with the smallest defocus amount. When optimizing the linear structure, the adjustment direction of the drawn line segment is determined based on the position of the laser head 1 relative to the aluminum sheet. Then, in the laser software processing control system, the two ends of the drawn line segment are used as the starting point and the zero point as the ending point. The adjustment is performed step by step, gradually and symmetrically increasing the defocus amount and spot path of the laser beam corresponding to each point on the drawn line segment to the aluminum sheet surface. This forms an approximately arc-shaped marking line segment on the aluminum sheet surface, and in the laser software processing control system, an approximately arc-shaped drawing line segment is formed, completing the control of the laser energy on the aluminum sheet surface after it exits through the galvanometer 2.

[0090] 2) Regulation of linear distribution of energy:

[0091] Tilting rotation: Further, in the laser software processing control system, the drawn line segment of an approximate arc adjusted in step 1) is rotated as a whole around the zero point, and the rotation angle and rotation direction are determined according to the diamond angle surface angle.

[0092] V. Drawing and Importing New Line Segments: Re-import the drawn line segments, after optimization and adjustment based on the energy distribution, into the laser software processing control system. Repeat steps two and three. Determine whether the laser energy density on the marking line segments on the surface of the aluminum sheet meets the requirements for diamond square sheet angle surface processing based on the line width values ​​at various locations. If not, proceed to steps four and five. When the line width values ​​at various locations on the aluminum sheet surface meet the requirements for diamond square sheet angle surface processing, proceed to step six.

[0093] VI. Machining of Diamond Square Wafers: Place the object to be processed into the processing area of ​​the processing platform, keeping the incident angle between the laser beam incident direction and the horizontal plane of the processing platform unchanged. Readjust the position of the laser square head 1 according to the size of the object to be processed. The worktable drives the diamond wafer to move back and forth and rotate. The laser beam focuses on the surface of the diamond wafer to remove material. The worktable repeats the back and forth and rotation process to complete the high-precision planarization of the diamond wafer.

[0094] Other implementation methods not mentioned in this embodiment are the same as in Embodiment 1.

[0095] Example 4:

[0096] A method for controlling the regular distribution of laser energy emitted by a galvanometer in diamond processing, used for forming square diamond sheets, comprises the following steps:

[0097] I. Processing parameters and drawing of graphics: First, set the scanning speed, Q frequency, pulse width, power and other parameters of laser emitter 6 according to the characteristics of diamond; then, draw a line segment with a length greater than the diameter of the diamond wafer in the control software of laser emitter 6 according to the diameter of the diamond wafer; finally, rotate laser square head 1 to the required angle to maintain the incident angle between the laser beam and the horizontal plane of the processing platform.

[0098] II. Marking on the Line Width Test Object: Select an aluminum sheet as the line width test object 4. Place the line width test object 4 on the processing platform and adjust the flatness of the aluminum sheet surface to within 0.01m. According to the detection accuracy requirements, adjust the laser square head 1 to determine the incident angle θ between the laser beam incident direction and the horizontal plane of the processing platform. Adjust the position of each working axis. The processing platform is located on the x and y axes of the machine tool, and the laser square head is on the z axis. Adjusting the working axis position is to emit the laser beam emitted by the laser square head 1 onto the surface of the aluminum sheet. Adjust the laser square head to select a defocus amount that can meet the material removal requirements and is not lower than the material removal threshold. Control the focus of the laser emitter 6 to focus on the surface of the aluminum sheet. Then control the laser emitter 6 to complete one light emission to complete the marking work on the surface of the aluminum sheet.

[0099] III. Energy Density Difference Detection: Remove the aluminum sheet and place it at the measurement station of the graphic sensor 5. Set the measurement parameters of the graphic sensor 5 to ensure that each measurement point is evenly spaced on the marking line segment on the aluminum sheet surface and that all measurement points are symmetrical. Simultaneously, connect the graphic sensor 5 to the laser software processing system. The laser software processing system automatically imports the measured values ​​of the line width of each marking line segment into the corresponding table. The value of the line width of the marking line segment is used as the criterion for judging the energy density difference on the aluminum sheet surface. The larger the value, the smaller the energy density at that location; the smaller the value, the larger the energy density at that location. Then, calculate the percentage deviation of the line width value of the marking line segment based on the values ​​in the table. The percentage deviation is used as a quantitative standard for evaluating whether the energy density is uniform.

[0100] IV. Regulation of Regular Energy Distribution:

[0101] 1) Energy uniformity distribution control: The zero point of the coordinate is the center of the marking line segment. In the line width data detected in step three, the line width value of the center part of the marking line segment is the smallest, and the line width values ​​of the two sides of the marking line segment symmetrical about the zero point are slightly larger and unequal.

[0102] Tilt Correction: First, based on two factors—the line width values ​​at various positions symmetrically centered on the line segment on both sides of the unadjusted marking segment and the position of the laser pointer 1 relative to the aluminum sheet—determine the rotation direction of the drawn line segment in the laser software processing control system. Then, control the drawn line segment to rotate a certain angle in the determined direction, reducing the defocus and spot path at positions with larger line width values ​​and increasing the defocus and spot path at positions with smaller line width values, thus completing tilt correction. At this time, the line width values ​​of the marking segment should gradually approach and become the same at various symmetrical positions centered on the zero point during the rotation of the drawn line segment, and become increasingly larger at positions farther from the zero point.

[0103] Linear structure optimization: After tilt correction, the laser beam path emanating from both ends of the drawn line segment is the longest, with the largest defocus amount; the laser beam path emanating from the center of the drawn line segment is the shortest, with the smallest defocus amount. When optimizing the linear structure, the adjustment direction of the drawn line segment is determined based on the position of the laser head 1 relative to the aluminum sheet. Then, in the laser software processing control system, the two ends of the drawn line segment are used as the starting point and the zero point as the ending point. The adjustment is performed step by step, gradually and symmetrically increasing the defocus amount and spot path of the laser beam corresponding to each point on the drawn line segment to the aluminum sheet surface. This forms an approximately arc-shaped marking line segment on the aluminum sheet surface, and in the laser software processing control system, an approximately arc-shaped drawing line segment is formed, completing the control of the laser energy on the aluminum sheet surface after it exits through the galvanometer 2.

[0104] 2) Non-uniform regulation of energy patterns:

[0105] Linear structure optimization: Further, the approximately circular arc drawn line segment adjusted in step 1) is divided into several equal segments. Two adjacent equally divided line segments are rotated in opposite directions by the same angle. Two equal divisions constitute one cycle, forming a line segment with an angle to the Y-axis, similar to a sine curve. Depending on the direction of rotation, the laser beam path and defocus amount corresponding to each point on the drawn line segment within each division will first decrease and then increase or first increase and then decrease on the surface of the line width test object 4. The energy density on the marking line segment on the surface of the line width test object 4 will also have a periodic trend of first decreasing and then increasing or first increasing and then decreasing.

[0106] V. Drawing and Importing New Graphics: Re-import the drawn line segments, after tilt correction and line structure optimization, into the laser software processing control system. Repeat steps two and three. Determine whether the laser energy on the marking line segments on the surface of the aluminum sheet meets the requirements for forming and processing diamond square sheets based on the line width values ​​at various points on the aluminum sheet surface. If not, proceed to steps four and five. When the line width values ​​at various points on the aluminum sheet surface meet the requirements for forming and processing diamond square sheets, proceed to step six.

[0107] VI. Diamond Square Sheet Processing: Import the corrected drawn line segments into the laser processing system, place the object to be processed into the processing area, readjust the position of the laser square head 1 according to the size of the object to be processed, i.e., adjust the appropriate focal length, the worktable drives the diamond wafer to move back and forth, the laser beam focuses on the surface of the diamond wafer to remove material, the worktable repeats the reciprocating motion to complete the forming processing of the diamond square sheet.

[0108] Other implementation methods not mentioned in this embodiment are the same as in Embodiment 1.

[0109] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for controlling the regular distribution of laser energy emitted by a galvanometer used in diamond processing, characterized in that, Includes the following steps: S1: Setting laser emitter processing parameters and drawing processing graphics: First, set the processing parameters according to the characteristics of the workpiece; then, based on the pre-processed surface structure and shape characteristics of the workpiece, draw a symmetrical line segment in the drawing software of the laser processing control system; finally, determine the incident angle between the laser beam and the horizontal plane of the processing platform based on the pre-processed morphological characteristics of the workpiece. S2: Marking on the line width test object: Select the line width test object, place the line width test object horizontally on the processing platform, magnify the different trends of the thickness of the pre-marked line segment on the line width test object, adjust the laser trajectory emitted by the galvanometer, and mark on the surface of the line width test object. After marking, a marked line segment is obtained on the line width test object. S3: Energy difference detection: Place the line width test object at the measurement station of the graphic sensor. The graphic sensor collects the measurement value of the line width of the marking line segment and determines the energy density based on the measurement value of the line width of the marking line segment. S4: Energy regularity distribution control: Based on the morphological characteristics of the pre-processed material, select to control the uniformity of energy distribution of the drawn line segment, or, under the premise of controlling the uniformity of energy distribution of the drawn line segment, control the regularity and non-uniformity of energy distribution of the drawn line segment. S5: Draw and import new graphics: Re-import the drawn line segments after energy regularity distribution regulation and optimization into the laser software processing control system, repeat steps S2 to S3, and determine whether the energy density on the marking line segments on the surface of the test object meets the requirements of the morphological characteristics of the pre-processed object after processing. If it meets the requirements, proceed to step S6; otherwise, repeat steps S4 to S5. S6: Laser processing of diamond: Keep the incident angle between the laser beam incident direction and the horizontal plane of the processing platform unchanged, readjust the position of the laser head, and perform laser processing according to the pre-processed surface structure of the workpiece; The steps for regulating the uniformity of energy distribution are: first, tilt correction is performed on the drawn line segments, and then the line structure is optimized; The method of energy law and non-uniformity control is: to select the line segment to be drawn for linear distribution control of energy law or non-uniform distribution control of energy law according to the shape characteristics of the pre-processed material.

2. The method for controlling the regular distribution of laser energy emitted by a galvanometer for diamond processing according to claim 1, characterized in that, The method for determining the different trends in line width thickness of the pre-marked line segments in the enlarged line width test object is as follows: The laser spot diameter R, the incident angle θ between the laser beam incident direction and the horizontal plane of the processing platform, and the actual line width L of the marking line segment on the test object satisfy the following relationship condition: ; By adjusting the laser beam head, the incident angle θ between the laser beam incident direction and the horizontal plane of the processing platform can be reduced. Alternatively, by adjusting the laser beam head, the defocusing amount can be increased, thereby increasing the line width of the entire marking segment and increasing the difference in line width between different positions of the marking segment.

3. The method for controlling the regular distribution of laser energy emitted by a galvanometer for diamond processing according to claim 2, characterized in that, The method for determining energy density based on the measured value of the line width of the marking line segment is as follows: calculate the percentage deviation of the measured value of the line width of the marking line segment, use the measured value of the line width of the marking line segment as the criterion for determining the difference in energy density on the marking line segment of the test object, and use the percentage deviation as the criterion for evaluating whether the energy density on the marking line segment is uniform.

4. The method for controlling the regular distribution of laser energy emitted by a galvanometer for diamond processing according to claim 3, characterized in that, The tilt correction method is as follows: In the laser software processing control system, the defocusing amount and spot path of the marking line segment on the surface of the line width test object are adjusted by controlling the overall rotation of the drawn line segment around the zero point. When the overall line width of the marking line segment on the surface of the line width test object in the Y+ direction is greater than the line width in the Y- direction, the laser software processing control system controls the overall rotation of the drawn line segment around the zero point to reduce the defocusing amount in the Y+ direction and the spot path in the Y+ direction. When the overall line width of the marking line segment on the surface of the line width test object in the Y+ direction is less than the line width in the Y- direction, the laser software processing control system controls the rotation of the drawn line segment to increase the defocusing amount in the Y+ direction and decrease the defocusing amount in the Y- direction. A marking line segment with the same line width at a symmetrical position centered on the zero point is formed on the line width test object, and an adjusted drawing line segment is formed in the laser software processing control system.

5. The method for controlling the regular distribution of laser energy emitted by a galvanometer for diamond processing according to claim 4, characterized in that, The method for optimizing the linear structure is as follows: In the laser software processing control system, the line segment is drawn with the two ends as the starting point and the center point as the ending point. The line segment is adjusted step by step, and the laser beam corresponding to each point on the line segment is gradually and symmetrically increased to reach the laser beam path and defocus amount of the marking line segment on the surface of the line width test object. This forms an approximately arc-shaped marking line segment on the line width test object. In the laser software processing control system, an approximately arc-shaped drawing line segment is formed.

6. The method for controlling the regular distribution of laser energy emitted by a galvanometer for diamond processing according to claim 5, characterized in that, The method for regulating the linear distribution of energy is as follows: In the laser software processing control system, a line segment that is approximately an arc after being optimized and adjusted for energy uniformity distribution is controlled to rotate as a whole around the zero point. The rotation direction and rotation angle of the line segment are adjusted according to the morphological characteristics of the workpiece to be processed and the position of the laser pointer relative to the line width test object.

7. The method for controlling the regular distribution of laser energy emitted by a galvanometer for diamond processing according to claim 6, characterized in that, The method for regulating the non-uniform distribution of energy is as follows: In the laser software processing control system, a line segment that is approximately an arc after being optimized and adjusted for energy uniformity distribution is divided into several equal segments. Two adjacent equally divided line segments are rotated in opposite directions by the same angle. The two equal divisions form a cycle, forming a shape similar to a sine curve.

8. The method for controlling the regular distribution of laser energy emitted by a galvanometer for diamond processing according to claim 7, characterized in that, The laser beam path and defocus amount corresponding to each point on the line segment drawn within each division of the sine-like curve will first decrease and then increase or first increase and then decrease depending on the rotation direction and the size of the rotation angle. The energy density on the marking line segment obtained on the line width test object will first decrease and then increase or first increase and then decrease.