Devices including sound boxes equipped with at least one amplifier

Abstract

The present invention relates to a device (0) comprising a housing (1) wherein: a box (2) is positioned within the housing (1); a first speaker (3a) disposed inside the box (2) and arranged to play sound outward from the housing (1); a main electronic board (4) disposed in the housing (1) outside the box (2) and having at least one power module (41) mounted on its front, the power module generating a first power supply voltage; a connecting device (5) passing through the wall (2a) of the box; and a secondary electronic board (6) disposed inside the box (2) and having at least one first amplifier (6a) connected to the first speaker (3a) mounted thereon, the secondary electronic board (6) being connected to the main electronic board (4) via the connecting device (5) to power the first amplifier (6a) with the first voltage.

Description

Technical Field

[0001] The present invention relates to the field of devices comprising a housing containing a box and having at least one first speaker disposed inside the box for playing sound outward from the housing. Background Technology

[0002] This device integrates a box with special sound quality into a housing containing an electronic board. This makes the device particularly compact (because the box is integrated into the housing, which is not an external cavity) and has improved sound quality, because on the one hand, the sound characteristics provided by the box are directly present in the housing, and on the other hand, a first speaker receives an audio signal generated directly in the housing, which is used by the first speaker, which is also located in the housing.

[0003] However, it has been observed that the presence of these components in the same housing can cause the electronic components to heat up.

[0004] In some cases, such as during high-power listening, the heat generated by certain electronic components may impair their performance.

[0005] To avoid the disadvantage of overheating, it is sometimes necessary to limit the power delivered to the first speaker, which can impair the listening experience.

[0006] Purpose of the invention

[0007] The object of the present invention is to provide a device comprising a housing, wherein the housing comprises: a box; a first speaker disposed inside the box; and a main electronic board disposed in the housing outside the box. The device can solve or at least mitigate all or part of the disadvantages of the prior art described above. Summary of the Invention

[0008] Therefore, according to the present invention, a device is provided, the device comprising a housing, wherein the following are positioned:

[0009] -box;

[0010] - A first loudspeaker, which is disposed inside the enclosure and mounted on the wall of the enclosure, and is arranged to play sound outward from the enclosure;

[0011] - Main electronic board, the main electronic board is placed in the outer casing of the box, and at least one power module is installed on the main electronic board, the power module is arranged to generate a first power supply voltage;

[0012] - Connecting device, the connecting device passes through the wall of the box;

[0013] - A secondary electronic board, which is placed inside the box and has at least one first amplifier connected to the first speaker mounted on it. The secondary electronic board is electrically connected to the main electronic board via a connecting device, so that the first amplifier is powered by a first voltage.

[0014] The enclosure of the device according to the invention is a sound enclosure containing at least one first speaker, and the enclosure is therefore intended for playing sound from the first speaker outward from the enclosure, and more specifically, outward from the outer casing of the device.

[0015] As is the case with this invention, the first amplifier and the first speaker are positioned in the enclosure, away from the main electronic board and away from the power module, which are inside the housing but outside the enclosure.

[0016] In this way, the first amplifier is less affected by the thermal effects generated at the main electronic board (power module heating), and conversely, the main electronic board is less affected by the thermal effects generated at the first amplifier.

[0017] This invention can minimize the need to limit the increase in amplification factor during the operation of the first amplifier to avoid overheating.

[0018] Correspondingly, the present invention significantly minimizes the need to limit the acoustic power output by the first loudspeaker to avoid overheating.

[0019] Furthermore, the greater the distance between the first amplifier and the first speaker, the greater the electromagnetic interference transmitted or received along the connecting line between the first amplifier and the first speaker.

[0020] By placing the first amplifier and the first speaker in the same enclosure, the present invention can minimize the distance between the first amplifier and the first speaker, which limits the level of electromagnetic interference emitted or received at the connection between the connected first amplifier and the first speaker. Attached Figure Description

[0021] Other features and advantages of the invention will become apparent in the description with reference to the accompanying drawings, which are described below for informational purposes and in a manner that is not limiting at all, in which:

[0022] Figure 1 This is an exploded view of the device according to the present invention;

[0023] Figure 2 This is a perspective view of the device 0 according to the present invention;

[0024] Figure 3a This is a bottom view of the cover 19 of the device casing, which shows the positions of microphones 14a, 14b, 14c, 14d and the main heat sink 11, which allows heat generated at the four locations on the motherboard to be dissipated.

[0025] Figure 3b This is a perspective bottom view of the upper cover 19 of the outer casing 1 of device 0, in which the main electronic board 4 and the connectors 43 and 44 mounted on the board 4 can be seen, and device 0 can be connected to external components.

[0026] Figure 3c yes Figure 3b The side view of the cover 19 shown shows a ridge 13 with a groove 13a, which can be wedged into the rear part of the housing 1 formed by the rear surface (back side) 18 of the upper cover 19, and the motherboard 4 can be wedged in.

[0027] Figure 4 This is a 3D view of box 2 of equipment 0;

[0028] Figure 5a This is a perspective view of the interior of box 2 with sub-board 6, which carries the first amplifier 6a (in this...). Figure 5a In this process, component 24 forming the cover of box 2 was removed. The outer shell includes the upper wall, right wall, left wall, front wall, and rear wall of the box.

[0029] Figure 5b yes Figure 5a The side view of the component shown. Figure 5b The illustration shows a typical tilt of the speaker (in this case, the front end 3b) relative to the bottom plane Px defined by the bottom 1f of the housing 1;

[0030] Figure 6 This is a top view of the bottom of the enclosure, which serves as a heat sink and includes bosses 2f1, 2f2 and 2f3 for receiving heat exchange materials, designed to establish heat transfer via conduction from the components to be cooled toward the bottom of the enclosure. The figure also shows the inner wall 25 at enclosure 2, each defining enclosed chambers 20a, 20, 20d and 20e, each of which receives a loudspeaker.

[0031] Figure 7a It is device 0 along plane P0 (which can be accessed from) Figure 5a (See the perspective view shown in the image) The device is illustrated without its top cover 19 to show the electrical connection between the main board 4 and the sub-board 6 via the intermediate board 5.

[0032] Figure 7b It is device 0 along plane P0 (which can be accessed from) Figure 5a (See the perspective view shown in the image) The device is illustrated without its top cover and without the main board, and is used to assemble the intermediate plate 5 onto the sub-plate 6b before the box is closed by the components that define the upper wall, right wall, left wall, front wall and rear wall of the box.

[0033] Figure 8This is a schematic diagram of a device according to the invention, which allows for the illustration of a specific embodiment in which the housing 2 includes a radiator 10 disposed abutting against the bottom 2f of the housing 2. Figure 8 The diagram also illustrates a sound path 26 for playing the sound generated by the first speaker 3a. Detailed Implementation

[0034] Reference Figure 1 This invention mainly relates to a device 0 comprising a housing 1, wherein the following are positioned:

[0035] -Box 2;

[0036] - A first speaker 3a is disposed inside the housing 2 and mounted on the wall 2a of the housing 2. The first speaker 3a is arranged to play sound from the housing 1 outward.

[0037] - Main electronic board (main circuit board) 4, which is placed outside the box 2 and inside the housing 1, and at least one power module 41 is mounted thereon, the power module being arranged to generate a first power supply voltage;

[0038] - Connecting device 5, which passes through the wall 2a of the box 2;

[0039] - Sub-electronic board 6, which is placed inside the box 2 and at least one amplifier 6a is mounted on it, the amplifier being connected to the first speaker 3a.

[0040] According to the present invention, the secondary electronic board 6 is electrically connected to the main electronic board 4 via the connecting device 5, such that the first amplifier 6a is powered by the first power supply voltage.

[0041] Therefore, amplifier 6a (and the second amplifier 6b, which will be described below) is placed in the housing 2 at a certain distance from the main electronic board 4 that carries the power supply module 4. The main electronic board is a "hot plate" (i.e., a plate whose components have significant heat dissipation).

[0042] Because these amplifiers 6a and 6 are not heated by the motherboard 4 and are cooled better, they are protected from heating caused by components present on the board 4, and more powerful amplifiers can be used without the risk of overheating.

[0043] For example, the amplifier's 12V power supply voltage can be converted to 16V to better utilize the first speaker 3a, in which case the first speaker is a woofer (woofers are typically speakers designed to reproduce frequencies below 1kHz, such as frequencies below 500Hz).

[0044] Because amplifiers are better cooled and less affected by heat release from other components, they can be operated at higher power, and it is also possible to choose amplifiers with higher power but less yield (and therefore more heat release when playing the same audio power).

[0045] This can be useful, for example, if you are looking to change the reference of an amplifier or component while having a limited risk of overheating of those components.

[0046] The main electronic board 4 carries at least one processor 4b with decoding function, a memory, a power supply module 41 for generating at least one first power supply voltage, and an audio module 42.

[0047] As from Figure 1 , Figure 7a , Figure 7b and Figure 8 As can be seen from the diagram, the connecting device 5 includes an intermediate plate 5 that carries a first plurality of electrical conductors 50 to power the first amplifier 6a with a first power supply voltage.

[0048] The intermediate plate 5 and the electrical conductor 50 pass through the opening 20, which is formed through the wall 2a of the box 2.

[0049] This intermediate plate 5 (preferably a printed circuit board type) is more advantageous than the electrical conductor layer because plate 5 is rigid and it allows for a larger cross-section of the electrical conductor 50 to achieve better current carrying capacity.

[0050] Furthermore, compared to the assembly of "flexible" layers that require manual intervention, the "rigid" intermediate board 5 is easier to automate in terms of layer assembly. The main electronic board 4 carries the first mechanical connector 40, and the secondary electronic board 6 carries the second mechanical connector 60.

[0051] Middle plate 5:

[0052] - On one hand, it carries a first mechanical connector 51, which is removably connected to a first mechanical connector 40 carried by the main electronic board 4; and

[0053] - On the other hand, the second mechanical connector 52 carrying the intermediate plate 5 is removably connected to the second mechanical connector 60 carried by the sub-electronic plate 6;

[0054] The first power supply voltage is transmitted to the first amplifier 6a by means of the following:

[0055] - First mechanical connector 40, which is carried by main electronic board 4;

[0056] - First and second mechanical connectors 51 and 52, which are carried by intermediate card 5; and

[0057] - Second mechanical connector 60, which is carried by sub-electronic board 6.

[0058] These mechanical connectors 40, 51, 52, and 60 are connected in series for electrical connection.

[0059] In this case, the connectors 51 and 52 of the intermediate plate 5 are made by simple electrical rails formed on the terminal end portions of the intermediate plate 5, and in this case, these connectors 51 and 52 are male.

[0060] Although these connectors 51 and 52 are simple tracks in this case, they can also be made with other more complex connector types, including additional components with interlocking and / or keys.

[0061] Each of the electrical conductors 50 in the first plurality of electrical conductors is carried by an intermediate plate 5 having:

[0062] - A first specific end, which is electrically connected to a first mechanical connector 51 carried by an intermediate plate 5; and

[0063] - A second specific end, which is electrically connected to a second mechanical connector 52 carried by an intermediate plate 5.

[0064] Thus, the electrical connection between the main electronic board 4 and the secondary electronic board 6 is achieved in a reversible manner via mechanical connectors 51 and 52, which are electrically connected to each other via a first plurality of electrical conductors 50.

[0065] Since the intermediate plate 5 is rigid, its connection to the second mechanical connector 60 carried by the sub-plate 6 allows the first mechanical connector 51 of the intermediate plate 5 to be spatially positioned relative to the main electronic board 4.

[0066] Therefore, the electrical connection between the main electronic board 4 and the auxiliary electronic board 6 is particularly easy to implement automatically.

[0067] exist Figure 7a In the preferred embodiment shown, one of the first mechanical connectors 51 is a male connector, interlocked with the other of the first mechanical connectors 40, which is a female connector.

[0068] In this configuration, the first mechanical connectors 40 and 51 are connected to each other, thus having a first gap that allows relative movement between the first mechanical connectors 40 and 51.

[0069] Similarly, one of the second mechanical connectors 52 is a male connector, interlocked with the other of the second mechanical connectors 60, which is a female connector.

[0070] In this configuration, the second mechanical connectors 52 and 60 are connected to each other, thus having a second gap that allows relative movement between the second mechanical connectors 52 and 60.

[0071] These first and second gaps between the connectors enable:

[0072] - Better resistance in the event of an accidental drop; and

[0073] - The intermediate board 5 facilitates the assembly of the main electronic board 4 and the secondary electronic board 6 (the main electronic board 4 and the secondary electronic board 6 facilitate the automation of the assembly process).

[0074] Preferably, the intermediate plate 5 extends in length and width (in both length and width directions) in a plane that is perpendicular to the main plane of the main plate 4 on one hand and perpendicular to the front surface 1b of the outer casing 1 on the other hand.

[0075] The 90° orientation of the middle plate 5 relative to the front 1b of the outer casing 1 helps to resist the device 0 from falling.

[0076] In fact, in the event of a device drop, the impact most often occurs on the front of the housing, that is, along the plane of the middle plate 5 (in the event of a drop, the connector and plate 5 are usually preserved).

[0077] By preventing plates 4 and 6 from moving closer to each other during an impact, the rigid plate 5 can also contribute to the robustness of the equipment in the event of a fall.

[0078] Preferably, the first mechanical connector 51 and the second mechanical connector 52 are identical to each other (in this case, they are male connectors of the bus type (PCI Express type)), and the first mechanical connector 40 and the second mechanical connector 60, which are respectively carried by the main electronic board 4 and the sub electronic board 6, are also identical to each other (in this case, they are female connectors of the serial bus type).

[0079] Having identical mechanical connectors makes it possible to reduce the number of types of components required for electrical connections between boards.

[0080] like Figure 5a , Figure 7a , Figure 7b and Figure 8As shown, the intermediate plate 5 is preferably asymmetrical, such that the electrical connection between the main electronic plate 4 and the sub-electronic plate 6 via the first plurality of electrical conductors 50 carried by the intermediate plate 5 is possible in a single position / orientation of the intermediate plate 5 relative to the main electronic plate 4 and the sub-electronic plate 6.

[0081] The asymmetrical form of the intermediate plate 5 can only achieve electrical connection between the plates when the intermediate plate is in its unique position.

[0082] This asymmetrical form prohibits positioning the intermediate plate 5 in any location / orientation other than the unique position shown in the figure.

[0083] The asymmetrical form of the intermediate board 5 enables mechanical bonding, which facilitates the assembly of the intermediate board and allows for the allocation of unique functions in the electrical connection between the main board 4 and the sub-board 6 for each electrical conductor 50.

[0084] Therefore, each electrical conductor 50 can be specially developed / sized to transmit a given current / signal / voltage dedicated to it.

[0085] In this case, such as Figure 1 , Figure 5a , Figure 7a , Figure 7b and Figure 8 As shown, the asymmetry of the intermediate plate 5 is achieved by an axial offset Dx between the two longitudinal ends of the intermediate plate 5 (see, for example, see...). Figure 8 ).

[0086] The first longitudinal end of the intermediate plate 5 is mainly on one side of the longitudinal axis D of the intermediate plate 5, while the other longitudinal end of the intermediate plate is mainly located on the other side of the longitudinal axis D of the intermediate plate 5.

[0087] To enhance the asymmetry of the intermediate plate 5 and facilitate identification of the unique location where the intermediate plate must be assembled, the intermediate plate 5 also includes:

[0088] - A first longitudinal plate, cut into steps, formed along the longitudinal axis of the intermediate plate and on one side of the longitudinal axis; and

[0089] - A second longitudinal edge formed along the longitudinal axis and on the second side of the longitudinal axis, the second edge having a portion cut at 45° relative to the longitudinal axis of the intermediate plate.

[0090] As in Figure 7a and Figure 8 It can be understood that when the middle plate 5 is in a unique position different from that shown in the figure, the shape of the box wall is determined to be adjacent to the part cut at 45°.

[0091] Preferably, in Figure 7a and Figure 4 The compressible seal 7 visible in the middle is configured to block the air passage between the inside and outside of the box 2 via the opening 20 formed through the wall of the box 2.

[0092] The seal 7 ensures a sound seal at the opening 20 through which the intermediate plate 5 passes.

[0093] Preferably, the seal 7 abuts against the main electronic board 4, thus "closing" the sound volume of the box 2.

[0094] The seal 7 is preferably an annular seal, in which case it extends around the first mechanical connector 40 carried by the main electronic board 4.

[0095] In this case, the seal 7 includes a first surface and a second surface formed on both sides of the seal.

[0096] The first side of the seal abuts against the annular bearing surface supported by the main electronic board 4, and the second side of the seal abuts against the annular bearing surface supported by the wall 2a of the housing 2.

[0097] The compression of the seal 7 between the annular bearing surface supported by the main electronic board and the annular bearing surface supported by the wall 2a of the enclosure also allows for the absorption of vibration / slight movement of the main electronic board and the enclosure 2.

[0098] The disturbance vibration can therefore be absorbed by the seal 7.

[0099] like Figure 7a As shown, inside the opening 20 formed through the wall 2a of the box 2, an elastically deformable element 8, preferably made of foam, extends around the longitudinal portion of the intermediate plate 5 in a complete circle.

[0100] This elastically deformable element 8 can prevent contact between the intermediate plate 5 and the wall of the box 2.

[0101] In this case, the elastic deformation element 8 (in this case, a foam sleeve) surrounds the longitudinal portion of the intermediate plate 5 so that the intermediate plate 5 can be aligned with the opening 20.

[0102] This facilitated the assembly of the intermediate plate 5.

[0103] The sleeve 8 thus allows for the absorption / dissipation of vibrations and also allows for the obstruction of air passage along the intermediate plate via the opening 20.

[0104] The audio module 42 is placed inside the housing 1, outside the box 2, and is arranged to generate the main audio signal.

[0105] More specifically, the audio module 42 is mounted on the main electronic board 4 and is powered by the power module 41 via an electrical connection connecting the power module 41 and the audio module 42.

[0106] The audio module 42 is also connected to the sub-electronic board 6, such that when the main audio signal is applied to the input of the first amplifier 6a and the first amplifier 6a is powered by the first voltage, the first amplifier 6a generates a first amplified audio signal from the main audio signal and sends it to the first speaker 3a.

[0107] The sound played by the first speaker 3a is therefore based on the first amplified audio signal ground, which is amplified in the box 2, closest to the first speaker 3a and at a certain distance from the main electronic board 4.

[0108] Therefore, the risk of electromagnetic interference to the first amplified audio signal is limited, which is beneficial to the quality of the sound played by device 0.

[0109] The audio module 42 is electrically connected to the secondary electronic board 6 via the connecting device 5, so that the main audio signal is transmitted from the audio module 42 to the first amplifier 6a via the connecting device 5.

[0110] More specifically, the audio module 42 is electrically connected to the sub-electronic board 6 via an audio conductor carried by the intermediate board 5, so that the main audio signal is transmitted from the audio module 42 to the first amplifier 6a through a specific audio conductor.

[0111] In this way, the intermediate plate 5 carries electrical connectors specifically for transmitting power supply voltage to the first amplifier 6a and audio conductors specifically for transmitting the main audio signal to the first amplifier 6a, thus limiting the risk of quality interference to the main audio signal.

[0112] Such as different Figure 1 , Figure 4 , Figures 5a to 8 As shown, device 0 also includes:

[0113] -Right speaker 3d, which is disposed in the right inner cavity 20d of the housing 2 and opens on the right side 2d of the wall of the housing 2;

[0114] -Left speaker 3e, which is disposed in the left inner cavity 20e of housing 2 and opens onto the left side 2e of the wall of housing 2; and

[0115] - Front speaker 3b, which is located in the front cavity 20b of the housing 2 and opens onto the front wall 2b of the housing 2.

[0116] The number and arrangement of these speakers can vary, but remain within the scope of this invention.

[0117] In this case, the first speaker 3a is a bass-type speaker (bass sound is mainly between 20 and 500 Hz) and is located in the central cavity 20a of the housing 2, which is located between the left cavity 20d and the right cavity 20e of the housing 2.

[0118] The central cavity 20a opens onto the upper (partial) surface 2a of the box in the direction of the main electronic board 4.

[0119] The housing 1 includes a rear face (back side) 1c that opens outward from the housing 1 to play sound from the first subwoofer 3a outward from the housing.

[0120] The airflow generated by the sound from the first speaker 3a thus helps to cool the main electronic board 4.

[0121] The right inner cavity 20a, left inner cavity 20d, front inner cavity 20d and central inner cavity 20e of the box are sealed relative to each other.

[0122] In this way, each chamber has an internal volume suitable for the main frequency of the loudspeaker it houses.

[0123] In addition, the sealing between the chambers helps to separate the sounds generated by different speakers.

[0124] Best location:

[0125] - The right speaker 3D has its own specific main sound axis, and the sound it generates is played primarily along that sound axis;

[0126] - The left speaker 3e has its own specific main sound axis, and the sound it generates is played primarily along that sound axis;

[0127] - The front speaker 3b has a specific main sound axis Ax, and the sound it generates is played primarily along that sound axis Ax;

[0128] As shown in the perspective drawings of shells 1, 4, 7a and 7b, and Figure 5b This can be understood from the cross-sectional view:

[0129] - On one hand, the outer casing 1 includes a base 1f, which defines a support plane Px for the casing (in this case, the plane Px is defined by legs of the casing for supporting the equipment on a flat, modular piece of furniture); and

[0130] - On the other hand, at least one of the main sound axes of the right speaker, left speaker and front speaker is oriented relative to the support plane Px such that the sound mainly played along the at least one sound axis Ax gradually moves away from the support plane Px.

[0131] As from Figure 5b Understandably, the main sound axis Ax of the front speaker 3b extends into a plane perpendicular to the support plane Px, where the main sound axis may optionally form a front angle A relative to the support plane Px.

[0132] The angle is between 2° and 40°, for example, between 2° and 15°, and preferably has an angle of 3°.

[0133] Similarly, the main sound axis of the right speaker 3d extends into a second plane perpendicular to the support plane Px, where the main sound axis may optionally form a right-side angle relative to the support plane Px, which is between 2° and 50°, for example between 2° and 15°, preferably an angle of 3°.

[0134] Symmetrically, the main sound axis of the left speaker 3e extends into the second plane perpendicular to the support plane Px, where the main sound axis may optionally form a left angle relative to the support plane Px, which is between 2° and 50°, for example between 2° and 15°, preferably an angle of 3°.

[0135] Ideally, the right-side angle and the left-side angle have the same angle value.

[0136] When the main sound axis of a given loudspeaker forms an angle A in a plane perpendicular to the support plane Px, for example, when the angle A is between 2° and 15° relative to the support plane Px, the sound tends to be played upward relative to the support plane Px, that is, by extending gradually away from the support plane Px.

[0137] Since the device according to the invention is designed to be positioned at the foot of a television screen, the device is most often located at a very low position (between 50 and 80 cm) relative to the head of the user viewing the television screen.

[0138] The positive vertical angle A allows for partial compensation of the height difference.

[0139] Optionally, a side angle significantly greater than angle A can be used to improve the spatial reproduction (replay) of the sound emitted by the speakers 3d and 3e (e.g., by utilizing sound reflections from the walls and ceiling of the room), while preserving the direct sound path between the front speaker 3b and the listener.

[0140] Alternatively, loudspeakers 3d and 3e have an angle between their main sound axis and the supporting plane Px, while the front loudspeaker 3b has no angle between its main sound axis and the supporting plane Px, with the main sound axis and the supporting plane Px being parallel to each other.

[0141] The angles of speakers 3d and 3e can be, for example, between 15° and 90° (relative to plane Px), while the angle of the front speaker 3b will be, for example, between 0° and 20° (relative to plane Px).

[0142] Preferably, in order to limit sound interference at the interface between the speaker and the housing:

[0143] - The main sound axis of the front speaker is perpendicular to the front of the housing; and / or

[0144] - The main sound axis of the right speaker is perpendicular to the right side face of the housing or perpendicular to the top face of the housing; and / or

[0145] - The main sound axis of the left speaker is perpendicular to the left side of the housing or perpendicular to the top side of the housing; and / or

[0146] - The main sound axis of the first loudspeaker is perpendicular to the upper surface 1a of the housing defined by the upper cover 19 of the housing.

[0147] Best location:

[0148] - The front 1b of the housing 1 has multiple sound playback perforations, defining a front grille opposite the front speaker 3b;

[0149] - The right side 1d of the housing 1 has multiple sound playback perforations, defining a right-side grille opposite the right speaker 3d;

[0150] - The left side 1e of the housing 1 has multiple sound playback perforations, defining the left grille opposite the left speaker 3e; and

[0151] - The rear surface 1c of the housing 1 has multiple sound playback perforations, defining a rear grille for playing sound generated by the first speaker 3a (a central speaker of the type of woofer, whose diaphragm is oriented toward the main electronic board 4).

[0152] Box 2 includes a lower (partial) surface 2f that extends primarily into the bottom plane of the box, and wherein:

[0153] - A flat portion 2d on the right side wall of the enclosure, on which the right speaker 3d is fixed. The flat portion forms an angle with the bottom plane of the enclosure. Measured inside the enclosure, this angle is between 50° and 88°, preferably 77°.

[0154] - A flat portion on the left side 2e of the enclosure wall, on which the left speaker is fixed. This flat portion forms an angle with the bottom plane of the enclosure. Measured inside the enclosure, this angle is between 50° and 88°, preferably 77°.

[0155] like Figure 4As shown, the enclosure 2 includes a lower surface 2f that extends mainly into the bottom plane of the enclosure, a flat portion of the front wall 2b of the enclosure, and a front speaker 3b fixed to the flat portion. The flat portion forms an angle with the bottom surface 2f, which, when measured inside the enclosure, is between 50° and 88°, preferably 77°, but can also be 90°, for example, when there is no intention to orient the sound axis upwards.

[0156] As from Figure 4 , 5a As can be understood, the flat sections on the left, right, and front sides of the enclosure wall, on which the right speaker, left speaker, and front speaker are respectively fixed, are inclined relative to the bottom plane 2f of the enclosure. This makes it easy to obtain the vertical tilt of each speaker while moving it toward the interior of the enclosure.

[0157] This particular embodiment allows for a slightly upward-directional sound while maximizing the internal volume of the enclosure.

[0158] This embodiment is particularly economical because it does not involve custom fitting for each given speaker, nor does it use wedge-shaped components that are tilted between the enclosure and each given speaker.

[0159] Preferably, the second amplifier 6b is mounted on the secondary electronic board 6 and connected to at least one of the right speaker, left speaker and front speaker. The second amplifier 6b is electrically connected to the power module 41 via the connection device 5 (in this case, via board 5), such that the second amplifier 6b is powered by the power module 41 mounted on the main electronic board 4.

[0160] The power of the second amplifier 6b passes through the electrical conductor 50 carried by the intermediate plate 5 and each of the mechanical connectors 40, 51, 52, and 60.

[0161] The audio module 42 is preferably arranged to generate a secondary audio signal.

[0162] The audio module 42 is connected to the sub-electronic board 6 such that when the sub-audio signal is applied to the input of the second amplifier 6b and the second amplifier is powered by the power module 41, the second amplifier 6b thus generates a second amplified audio signal from the sub-audio signal, which is sent to at least one of the right speaker, left speaker and front speaker.

[0163] To address the specific current consumption of one and / or the other of amplifiers 6a and 6b, sub-board 6 carries at least one energy storage capacitor 6d (also referred to as a power capacitor) powered by power module 41 via connection device 5 passing through wall 2a of housing 2.

[0164] Furthermore, the at least one capacitor 6d is electrically connected to the at least one first amplifier 6a, thereby supplying energy to the at least one first amplifier and optionally to a second amplifier.

[0165] In an embodiment of the invention, the sub-board carries two amplifiers 6a and 6b, preferably each amplifier having a capacitor to avoid interference between the specific current consumption of the first amplifier 6a, which is dedicated to the woofer 3a, and the operation of the second amplifier 6b, which powers the other speakers.

[0166] Therefore, device 0 includes at least one other energy storage capacitor, which is also mounted on sub-board 6 and powered via a power module through a connection device.

[0167] Another storage capacitor may be electrically connected to at least one of the first amplifier 6a and / or the second amplifier 6b, and to supply energy to these amplifiers.

[0168] Each of the energy storage capacitors mounted on the sub-board enables the storage of electrical energy from the power module 41 carried by the main electronic board, and in the event that current is drawn (consumed) by at least one amplifier, directly available energy is supplied into the box at the sub-board 6, closest to the amplifier and speaker.

[0169] One or more storage capacitors mounted on sub-board 6 allow for a shorter electrical path between the storage capacitors and amplifier(s).

[0170] - This limits the current consumption at the power module (so the power module 41 can be smaller);

[0171] - Limits energy loss between capacitors and amplifiers;

[0172] - Improved response time to current consumption; and

[0173] Electromagnetic interference was limited, especially during the transmission of power to (multiple) amplifiers.

[0174] In other words, the storage capacitor 6d is configured to be the closest to the amplifier in terms of capacitance, in response to significant peak consumption during current draw by the amplifier.

[0175] These capacitors / capacitors are large (e.g., 2*2200uF (microfarads) instead of the 2*400uF required in a "stable" system), thereby reducing current consumption on the at least one power module 41.

[0176] In addition to enabling the reduction of costs for smaller power modules, this is beneficial for reducing electromagnetic interference (CEM).

[0177] Another effect of the proximity between (one or more) capacitors and (one or more) amplifiers is that the audio dynamics (peak power) are improved due to the reduced voltage drop caused by resistance loss on the power supply path.

[0178] The device 0 according to the present invention mainly consists of a "set-top box (digital video converter)" which is designed to receive external signals containing audio and video components, decode these signals, and play the audio components via a speaker contained in the set-top box, and play the video components via a display device outside the device.

[0179] For this purpose, device 0 includes a decoder placed in housing 1, outside box 2, mounted on main electronic board 4, or on another electronic board away from main electronic board 4. The decoder may optionally be integrated into a component that combines several functions (e.g., a "SoC - System on Chip" type component).

[0180] The decoder has:

[0181] - At least one input connector 43 for receiving signals from outside the device, including video and audio components; and

[0182] - At least one output connector 44 for playing an output signal generated by the decoder based on the external signal, the output signal having at least one video component.

[0183] For example, the at least one input connector 43 is an optical input for receiving optical signals transmitted via optical fiber from an Internet server, and / or an Ethernet / RJ45 input for receiving electrical signals from an Internet server, and / or a coaxial input for receiving electrical signals from a satellite receiver.

[0184] The video signal output connector 44 is, for example, an HDMI output unit, which can be connected to an external display device, such as a television or video projector, as well as any other type of connector suitable for playing video streams.

[0185] The decoder is connected to the audio module 42 and is arranged as follows:

[0186] - Generate a decoded signal comprising at least one audio component based on the external signal received by the decoder; and

[0187] - Transmit the decoded signal to the audio module 42.

[0188] The audio module 42 is arranged to generate the main audio signal based on the decoded signal.

[0189] It is important to note that the audio decoding and audio processing applications (performed by the audio processing function of audio module 42) can be performed by the same electronic component (usually a DSP) or by multiple independent electronic components.

[0190] The audio module 42 may be integrated with the main processor 4b (in this case, the SoC), or it may not be integrated.

[0191] In other words, the functions performed by the decoder and audio module 42 can be performed on the same electronic component, or they can be distributed across multiple electronic components that are different from each other.

[0192] The input connector 43 and output connector 44 of the decoder are each accessible from the outside of the housing 1 via a connection opening made through the wall of the housing 1.

[0193] More specifically, each input connector 43 or output connector 44 is fixed to the rear edge of the main electronic board 4, and the connection opening is formed through the rear portion 18 of the upper cover 19 of the housing 1.

[0194] Because of these features, the assembly of the device according to the invention is greatly facilitated.

[0195] In a single step of securing the main electronic board 4 to the housing 1, the input connector 43 and the output connector 44 are also positioned relative to the housing 1.

[0196] In a single step of securing the cover 19 of the outer casing 1 to the rest of the outer casing 1, the following can be performed:

[0197] - The motherboard 4 is wedged into the cover 19 (because the recessed ridge 13 limits the risk of vibration between the board 4 and the housing 1); and

[0198] - Position each connector 43, 44 facing its corresponding connection opening (in this case, the connection opening is made in the rear portion 19 of the cover 19).

[0199] Now refer to Figure 1 , Figure 3a , Figure 5a , Figure 5b , Figure 6 , Figure 7a , Figure 7b and Figure 8 A detailed explanation of heat dissipation is provided.

[0200] Preferably, the device 0 includes at least one first heat exchanger material block 91, which is:

[0201] -The lower surface of the sub-electronic plate 6 is in contact with one side; and

[0202] - On the other side, it contacts the upper surface of the heat sink 10, which is fixed to the housing 2, to dissipate the heat generated at the sub-electronic board 6 from the housing 2 to the outside.

[0203] In this case, the radiator 10 is the bottom 2f of the box 2.

[0204] The upper surface of the radiator 10 includes at least one local boss 2f1 that contacts and abuts against the first heat exchanger material block 91.

[0205] The protrusion 2f1, sometimes also called the disbursement, allows the bottom 1f of the box 2 to be moved to the area closest to the sub-electronic plate 6, from which heat seeks to be dissipated.

[0206] The second heat exchanger material block 92 is:

[0207] -The lower surface of the first speaker 3a is contacted on one side (in this case, the lower surface of the permanent magnet of the speaker); and

[0208] - On the other side, it contacts the upper surface of the radiator 10, which is fixed to the housing 2, to dissipate the heat generated by the first speaker 3a from the housing 2 to the outside.

[0209] The radiator 10, fixed to the box 2, is arranged to dissipate heat from the inside of the box 2 to the outside.

[0210] In addition to its function of transferring heat from the first speaker 3a to the radiator 10, the second heat exchanger material block 92 also enables the rigidity of the assembly between the first speaker 3a and the housing 2 to be improved.

[0211] This is useful for speaker models with a chassis that is too flexible / deformable, also known as a "bowl".

[0212] The base / cup of the loudspeaker 3a forms an annular collar that gradually widens from the edge of the first ring attached to the permanent magnet to the edge of the second ring on which the diaphragm of the loudspeaker 3a is attached.

[0213] It has been noted that speaker performance typically degrades between 60°C and 80°C, resulting in sound distortion.

[0214] At even higher temperatures, the ultimate degradation of the loudspeaker can be observed as its permanent magnets lose their magnetic properties.

[0215] Proper cooling of the components / first speaker housed in box 2 allows for maintaining optimal audio quality even under high power conditions, while also protecting the electronic components.

[0216] The lifespan of device 0 is thus improved.

[0217] Each heat exchanger material block 91, 92 preferably has the form of a pad, but it can also be achieved by hot paste casting during installation against a radiator fixed to the casing.

[0218] The radiator 10 fixed to the box 2 can be formed by the bottom 2f of the box 2, or by a plate assembled on the bottom of the box.

[0219] Depending on the amount of heat to be dissipated and the size of the radiator 10 fixed to the box, the radiator can be made of polymer materials, metals (e.g., aluminum or copper), or any combination of these materials.

[0220] like Figure 6 As shown, the bottom 2f of the box 2 preferably includes several bosses 2f1, 2f2, 2f3 (also called output sections), each boss being arranged opposite to one of the heat exchanger material blocks 91, 92, that is, the material block corresponds to the boss and is disposed in the box 2.

[0221] Each boss 2f1, 2f2, 2f3 is formed to locally move closer to the bottom of the box opposite to the heat exchanger material blocks 91, 92 corresponding to it.

[0222] In this way, the heat flow through the bottom of the box is localized and optimized for the position of the boss.

[0223] In the Figure 6 In the illustrated embodiment, the bottom 2f includes three bosses / output portions 2f1, 2f2, and 2f3, one of which faces the lower surface of the first speaker 3a, and the other two bosses / output portions face the lower surface of the sub-electronic board 6 (one boss / output portion is located at the implantation portion of the first amplifier 6a, and the other boss / output portion is located at the implantation portion of the second amplifier 6b mounted on the sub-electronic board 6).

[0224] Finally, at least one third heat exchanger material block 94 is:

[0225] - On one side, it contacts and abuts against the upper surface of at least one electronic component carried by the main electronic board 4 (in this case, against the processor 4b); and

[0226] - On the other side, it contacts and abuts the lower surface of the main heat sink 11, which extends between the main electronic board 4 and the upper cover 19 of the housing 1, to dissipate the heat generated at the main electronic board 4 from the housing 1 to the outside.

[0227] According to another aspect, the device is also equipped with a microphone, which is used, for example, to capture sounds in the device's environment to generate a sound space image, which helps to construct the operation of the speaker and / or capture commands issued by the user (the device is capable of having voice recognition and voice assistant functions).

[0228] For this purpose, the device includes multiple microphones 14a, 14b, 14c, and 14d, which are housed inside the casing and connected to the main electronic board 4 via a single microphone connector, thereby:

[0229] -On one hand, power is supplied to the multiple microphones; and

[0230] - On the other hand, the micro-signal representing the sound captured by the microphone is transmitted to the microphone module carried by the main electronic board 4.

[0231] The first pair of microphones 14a and 14b are mounted on the same first layer of electrical conductor 15, and the second pair of microphones 14c and 14d are mounted on the same second layer of electrical conductor 16.

[0232] The second layer 16 is electrically connected to the first layer 15.

[0233] The first layer 15 extends along the first layer axis, and the second layer 16 extends along the second layer axis, the second layer axis being oriented at 90° relative to the first layer axis.

[0234] In this way, multiple microphones 14a, 14b, 14, and 14d are connected to the main electronic board 4 via a single microphone connector, which is particularly economical (simplifies assembly).

[0235] The microphone connector is located on the lower surface of motherboard 4 and is not visible in the diagram.

[0236] Furthermore, since the first layer 15 and the second layer 16 are set at 90° relative to each other, the first pair of microphones 14a and 14b are spatially positioned relative to the second pair of microphones 14c and 14d.

[0237] The precision of the microphone's spatial positioning enables accurate capture of sound emitted into the environment surrounding the housing 1.

[0238] The first pair of microphones 14a and 14b allows for the capture and differentiation of sound from the right or left side of the housing, while the second pair of microphones 14c and 14d allows for the capture and differentiation of sound from the front or rear of the housing.

[0239] In such a situation, such as Figure 3aAs shown, the first layer 15 and the second layer 16, which carry two pairs of microphones, are mounted on the main heat sink 11 (as described above), and the main heat sink can dissipate heat from the main electronic board 4.

[0240] In this way, the microphone is positioned closer to the top cover 19 of the device, which is beneficial for sound capture quality.

[0241] Each microphone is preferably positioned above the main heat exchanger 11, that is, between the main heat exchanger 11 and the cover 1a of the housing 1.

[0242] In addition, in order to achieve sound capture, each microphone is positioned facing the corresponding perforation 21, which passes through the cover 19.

[0243] Preferably, the second layer 16 is removably connected to the first layer 15 via a connector.

[0244] Alternatively, the second layer 16 is connected to the first layer 15 by a fixed connection, such as by welding.

[0245] Thus, the second layer 16 and the microphones it carries can be optional depending on whether the desired variation of device 0 includes only the first pair of microphones 14a, 14b, or the variation includes two pairs of microphones 14a, 14b, 14c, 14d.

[0246] The two possible variations of the embodiment with this device are particularly economical for implementation.

[0247] Preferably, the microphones of the first pair of microphones are spaced at least 50mm apart, more preferably 70mm apart.

[0248] The same applies to the second pair of microphones.

[0249] As from Figure 1 and Figure 7a As can be seen, the device also includes a communication electronic board 12 placed in the outer casing 1 outside the box 2.

[0250] The communication board 12 is electrically connected to the main electronic board 4 via a secondary connection device (in this case, a deformable layer, not shown, and comprising a plurality of deformable electrical conductors), thereby supplying power to at least one communication electronic component mounted on the communication board 12.

[0251] The at least one communication electronic component belongs to a group of communication electronic components, which includes:

[0252] - At least one LED for transmitting light signals via at least one first optical path formed through the wall of the housing; and / or

[0253] - Optionally, at least one infrared receiver is used to receive infrared signals from the device's remote control, the infrared receiver being positioned to face at least one second optical path formed through a front portion of the housing wall; and / or

[0254] - Optionally, at least one camera is used to generate an image of an object located outside the housing, said at least one camera being positioned to face a third optical path formed through the front portion of the wall of the housing.

[0255] Having a communication board 12 that is different from and located far away from the main electronic board 4 allows for limiting the heating of the at least one communication electronic component mounted on the communication board 12.

[0256] Because the communication electronic components are less affected by the heat release from the motherboard 4 (“hot plate”), the lifespan / aging of these communication electronic components is improved.

[0257] In addition, the cooling of the communication electronics board 12 (“cold board”) has also been improved.

[0258] The mounting of communication components on a dedicated and unique electronic board on the main electronic board also makes it easy to change the spatial positioning / height of each of the communication electronics (LEDs, infrared receivers, and optional cameras) relative to the front of the housing.

[0259] In fact, since these communication electronic components are not subordinate to the main electronic board 4, they can be positioned in different locations within the housing 1 without having to move or adapt to the main electronic board 4.

[0260] exist Figures 1 to 7b In the embodiment shown, the communication board 12 is installed in the reinforcement portion 25 of the outer wall of the box 2 and abuts against the outer area of ​​the box wall.

[0261] This saves space inside the casing while allowing each communication electronic component carried by the communication board to be precisely positioned opposite the front portion of the casing wall, which has multiple optical paths.

[0262] In such a situation, if from Figure 7a As understood in the cross-section, each optical path 17 corresponds to only one communication electronic element and is integrated with an optical lens to form a light flow guide through the front wall 1b of the housing.

[0263] Preferably, the communication electronics board 12 extends into a plane perpendicular to the main plane of the main electronics board 4, and the communication electronic components are mounted on the flat main (surface) surface of the communication electronics board 12, which facilitates the positioning and assembly of these electronic components.

[0264] like Figure 3a , 3b As shown in 3c, ridges 13 supported by the rear surface 1c of the housing 1 extend inside the housing 1, and each of these ridges 13 includes at least one groove 13a.

[0265] The rear edge of the main electronic board penetrates these grooves internally, thereby wedging the main electronic board by wedging the rear edge of the main electronic board into these grooves 13a.

[0266] The rear edge of the motherboard 4 is wedged into the groove 13a of the ridge 13, which limits the risk of vibration of the motherboard 4 relative to the housing 1 and also limits sound interference.

[0267] Alternatively, an elastic compressible foam piece can be placed between the rear edge of the main electronic board and at least a portion of the recess 13a or the bottom of the housing, thereby simplifying the adjustment of the main board in the ridge 13 and allowing vibration to be dissipated in the foam piece.

[0268] More specifically, in this case, the rear surface 1c of the outer casing 1 is partially constructed by the rear portion 18 of the upper cover 19, which extends vertically relative to the flat main (surface) surface of the upper cover 19.

[0269] In this case, the ridge 13 supported by the rear surface 1c of the outer casing 1 is carried by the rear portion 18 of the cover 19.

[0270] The invention is not limited to the examples described above, and it also includes any variations that fall within the scope defined by the claims.

[0271] It must be pointed out that the existence of certain advantages of the enclosure is independent of whether the enclosure contains an audio amplifier and the number of speakers contained in the enclosure.

[0272] Therefore, another aspect of the invention can also be based on a box, which includes a lower surface extending primarily in the bottom plane of the box, and includes:

[0273] - The flat portion of the front wall of the enclosure, on which the front speaker is fixed, forms an angle with the bottom plane of the enclosure, which, when measured inside the enclosure, is 90° or between 50° and 88°.

[0274] - A flat portion on the right side wall of the enclosure, on which the right speaker is mounted, forming an angle with the bottom plane of the enclosure, which, when measured inside the enclosure, has an angle between 50° and 88°; and / or

[0275] - A flat portion on the left side of the enclosure wall, on which the left speaker is fixed. This flat portion forms an angle with the bottom plane of the enclosure, which, when measured inside the enclosure, has an angle between 50° and 88°.

[0276] As described above, this embodiment enables sound to be played upwards, directing the sound towards a horizontal level above the user's head.

[0277] Similarly, it is preferably achieved such that each given sidewall of the housing in which the enclosure is located is parallel to the main plane defined by one of the speakers, which is carried by the enclosure and faces that given sidewall of the housing.

[0278] This embodiment helps to limit sound distortion caused by the speaker playing through perforations made in the walls of the housing.

[0279] Any other placement and / or angle of the enclosure walls described above is possible, regardless of whether the enclosure contains an audio amplifier or the number of speakers contained in the enclosure.

[0280] In all embodiments of the device according to the present invention described above, the connecting device 5 can be any type other than the intermediate plate.

[0281] For example, the connecting device 5 may be a flexible connecting layer that carries a first plurality of electrical conductors 50.

Claims

1. A sound playback device (0) comprising a housing (1), wherein: - Box (2); - A first speaker (3a), which is disposed inside the housing (2) and mounted on the wall of the housing (2), and is arranged to play sound outward from the housing (1); - Main electronic board (4), which is placed in the outer shell (1) outside the box (2) and at least one power module (41) is mounted on the main electronic board, which is arranged to generate a first power supply voltage; - Connecting device (5), which passes through the wall (2a) of the box; - A secondary electronic board (6), which is placed inside the housing (2) and is equipped with at least one first amplifier (6a) connected to the first speaker (3a). The secondary electronic board (6) is electrically connected to the main electronic board (4) via the connecting device (5), such that the first amplifier (6a) is powered by the first power supply voltage. The secondary electronic board (6) is characterized in that... The connecting device (5) includes an intermediate plate (5) that carries a first plurality of electrical conductors (50) to power the first amplifier (6a) with the first power supply voltage, the intermediate plate (5) and the electrical conductors (50) of the first plurality of electrical conductors passing through an opening (20) formed to pass through the wall of the box (2).

2. The device (0) according to claim 1, characterized in that, The main electronic board (4) carries a first mating mechanical connector (40) and the sub-electronic board (6) carries a second mating mechanical connector (60). The intermediate board (5) carries a first mechanical connector (51) removably connected to the first mating mechanical connector (40) carried by the main electronic board (4) and a second mechanical connector (52) removably connected to the second mating mechanical connector (60) carried by the sub-electronic board (6), such that the first power supply voltage is transmitted to the first amplifier (6a) through the first mating mechanical connector (40) carried by the main electronic board (4), the first and second mechanical connectors carried by the intermediate board (5), and the second mating mechanical connector (60) carried by the sub-electronic board (6).

3. The device (0) according to claim 2, characterized in that: - One of the first mechanical connectors (51) is a male connector, interlocked with the first mating mechanical connector (40), and the other of the first mechanical connectors (51) is a female connector. The first mating mechanical connector (40) and the first mechanical connector (51) are connected to each other, thereby having a first gap that allows relative movement between the first mating mechanical connector (40) and the first mechanical connector (51). Similarly - One of the second mechanical connectors (52) is a male connector that is interlocked with the second mating mechanical connector (60), and the other of the second mechanical connectors (52) is a female connector. The second mechanical connectors (52) and the second mating mechanical connectors (60) are connected to each other, thereby having a second gap that allows relative movement between the second mechanical connectors (52) and the second mating mechanical connectors (60).

4. The device (0) according to claim 2 or 3, characterized in that, The intermediate plate (5) extends in length and width into the plane of the intermediate plate (5), which is perpendicular to the main plane of the main plate (4) on one hand and perpendicular to the front (1b) of the outer shell (1) on the other hand.

5. The device (0) according to claim 2 or 3, characterized in that, The first mechanical connector (51) and the second mechanical connector (52) carried by the intermediate board (5) are identical to each other, and the first mating mechanical connector (40) carried by the main electronic board (4) and the second mating mechanical connector (60) carried by the sub-electronic board (6) are also identical to each other.

6. The device (0) according to any one of claims 1 to 3, characterized in that, The intermediate plate (5) is asymmetrical, making it possible to establish an electrical connection between the main electronic board (4) and the secondary electronic board (6) via a first plurality of electrical conductors (50) carried by the intermediate plate (5) in a single position relative to the main electronic board (4) and the secondary electronic board (6).

7. The device (0) according to any one of claims 1 to 3, characterized in that, A compressible seal (7) is provided to block the air passage between the inside and outside of the box via an opening (20) formed through the wall of the box (2).

8. The device (0) according to any one of claims 1 to 3, characterized in that, Preferably, an elastically deformable element (8) made of foam extends around the longitudinal portion of the intermediate plate (5) within the opening (20) formed through the wall (2a) of the box (2) to prevent contact between the intermediate plate (5) and the wall of the box (2).

9. The device (0) according to claim 1, characterized in that, The device further includes an audio module (42) placed outside the box (2) and inside the housing (1), and configured to generate a main audio signal. The audio module (42) is connected to the sub-electronic board (6) such that when the main audio signal is applied to the input of the first amplifier (6a) and the first amplifier (6a) is powered by the first power supply voltage, the first amplifier (6a) generates a first amplified audio signal that is sent to the first speaker (3a).

10. The device (0) according to claim 9, characterized in that, The audio module (42) is electrically connected to the sub-electronic board (6) via the connection device (5), so that the main audio signal is transmitted from the audio module (42) to the first amplifier (6a) via the connection device (5).

11. The device (0) according to claim 9 or 10, characterized in that, The audio module (42) is mounted on the main electronic board (4).

12. The device (0) according to any one of claims 1 to 3, characterized in that, The device also includes: - Right speaker (3d), the right speaker is disposed in the right inner cavity (20d) of the housing (2) and opens on the right side (2d) of the wall of the housing (2); - A left loudspeaker (3e), the left loudspeaker being disposed in the left inner cavity (20e) of the housing (2), opening onto the left side (2e) of the wall of the housing (2); and optionally - Front speaker (3b), the front speaker is disposed in the front inner cavity (20b) of the housing (2) and opens on the front side (2b) of the wall of the housing (2); The first loudspeaker (3a) is a bass-type loudspeaker and is disposed in the central cavity (20a) of the enclosure (2), the central cavity being disposed between the left cavity (20e) and the right cavity (20d) of the enclosure (2). The central cavity (20a) of the enclosure opens onto the upper surface (2a) of the enclosure. The right cavity (20d), the left cavity (20e), the front cavity (20b) and the central cavity (20a) of the enclosure abut against each other and are sealed. The right loudspeaker (3d) has a primary sound axis specific to the right loudspeaker, and the sound generated by the right loudspeaker is played primarily along the primary sound axis specific to the right loudspeaker. - The left speaker (3e) has a primary sound axis specific to the left speaker, and the sound generated by the left speaker is played primarily along the primary sound axis specific to the left speaker; - The front speaker (3b) has a primary sound axis (Ax) specific to the front speaker, and the sound generated by the front speaker is played primarily along the primary sound axis specific to the front speaker; - The housing (1) includes a housing bottom (1f) defining a support plane (Px) of the housing; and - At least one of the main sound axes of the right speaker, the left speaker and the front speaker is oriented relative to the support plane (Px) such that the sound mainly played along the at least one sound axis (Ax) gradually moves away from the support plane (Px).

13. The device (0) according to claim 12, characterized in that, The main sound axis (Ax) of the front speaker (3b) extends into a plane perpendicular to the support plane (Px), and the main sound axis forms a front angle (A) relative to the support plane (Px), the front angle being an angle between 2° and 40°.

14. The device (0) according to claim 13, characterized in that, The front angle is 3°.

15. The device according to any one of claims 1 to 3, characterized in that, The subplate carries at least one energy storage capacitor (6d), which is powered by a power module (41) via the connection device (5) through the wall (2a) of the box (2). At least one of the capacitors (6d) is also electrically connected to the at least one first amplifier (6a) in order to supply energy to the at least one first amplifier.

16. The device according to any one of claims 1 to 3, characterized in that, Multiple microphones (14a, 14b, 14c, 14d) are housed inside the housing and connected to the main electronic board (4) via a single microphone connector. The main electronic board (4) supplies power to the microphones and transmits micro-signals representing the sounds captured by the microphones to the microphone module carried by the main electronic board (4). The first pair of microphones (14a, 14b) are mounted on the same first layer conductor (15), and the second pair of microphones (14c, 14d) are mounted on the same second layer conductor (16). The second layer conductor (16) is electrically connected to the first layer conductor (15). The first layer conductor (15) extends along the first layer axis, and the second layer conductor (16) extends along the second layer axis, which is oriented at 90° relative to the first layer axis.

17. The device according to claim 16, characterized in that, The second layer of electrical conductor (16) is removably connected to the first layer of electrical conductor (15).

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