Vibration stress extreme value detection method, device, computer equipment and storage medium

Abstract

The present application relates to a method, device, computer equipment, storage medium and computer program product for detecting extreme values ​​of vibration stress. The method comprises: applying vibration stress to a target solder joint according to a plurality of vibration stress parameters; wherein a target vibration stress parameter among the plurality of vibration stress parameters is positively correlated with the time of applying the vibration stress, and the target solder joint is a solder joint of qualified quality formed by welding between a gold-plated pin of an electronic component and a printed circuit board; applying a detection electrical signal to the target solder joint, and obtaining a feedback electrical signal output by the target solder joint; obtaining the extreme value of vibration stress of the target solder joint when it is determined that the target solder joint has cracked and failed according to the feedback electrical signal; wherein the extreme value of vibration stress is the value of the target vibration stress parameter when the target solder joint has cracked and failed. The method can monitor the welding state of the target solder joint in real time, improve the detection efficiency, and also realize the detection of the extreme value of vibration stress of the target solder joint.

Description

Technical Field

[0001] The present application relates to the field of integrated circuit technology, and in particular to a method, device, computer equipment and storage medium for detecting extreme values ​​of vibration stress. Background Art

[0002] Electronic components are the smallest basic units of electronic devices. After the components are assembled with PCB (Printed Circuit Board) to form solder joints, the reliability of the solder joints, especially in a vibration environment, will directly determine the technical performance and service life of the electronic equipment.

[0003] Gold plating is a highly resistant to oxidation, which can well protect the device pins and has good wettability with solder. Currently, gold plating on the pin surface has become a common way of surface treatment of component pins.

[0004] However, gold is a soluble metal in the molten tin-lead alloy and dissolves very quickly, easily combining with the tin metal in the solder to form a gold-tin alloy with brittle characteristics. Due to the presence of gold-tin alloy in the solder joint, when the solder joint is subjected to vibration stress, the risk of solder joint cracking failure is greater in gold-plated pin devices compared to non-gold-plated devices, which seriously affects the reliability of the product in later use. Therefore, it is necessary to develop a method for detecting extreme vibration stress of solder joints of gold-plated pin devices. Summary of the invention

[0005] Based on this, it is necessary to provide a vibration stress extreme value detection method, device, computer equipment and storage medium to address the above technical problems, which can detect in real time whether the solder joint has cracked and failed, and obtain the vibration stress extreme value when the solder joint has cracked and failed.

[0006] In a first aspect, the present application provides a method for detecting a vibration stress extreme value, the method comprising:

[0007] Applying vibration stress to a target solder joint according to a plurality of vibration stress parameters; wherein a target vibration stress parameter among the plurality of vibration stress parameters is positively correlated with the time of applying the vibration stress, and the target solder joint is a solder joint of qualified quality formed by welding between a gold-plated pin of an electronic component and a printed circuit board;

[0008] Applying a detection electrical signal to the target welding point, and obtaining a feedback electrical signal output by the target welding point;

[0009] When it is determined that the target solder joint has cracked and failed according to the feedback electrical signal, the extreme value of the vibration stress of the target solder joint is obtained; wherein the extreme value of the vibration stress is the value of the target vibration stress parameter when the target solder joint has cracked and failed.

[0010] In one embodiment, the method further comprises:

[0011] Soldering the plurality of gold-plated pins of the electronic components to the printed circuit board respectively to form a plurality of corresponding solder joints;

[0012] Acquire welding images between the plurality of welding points and the printed circuit board respectively;

[0013] A soldering point that is seamlessly connected to the printed circuit board among the plurality of soldering points is determined as the target soldering point according to the soldering image.

[0014] In one embodiment, the method further comprises:

[0015] Obtaining the thickness of the gold-plated layer of the plurality of gold-plated pins;

[0016] Obtain the corresponding vibration stress extreme values ​​when multiple target solder joints with different gold plating layer thicknesses fail due to cracking.

[0017] In one of the embodiments, the vibration stress extreme value includes at least one of a vibration stress time extreme value, a vibration stress amplitude extreme value, a vibration stress direction extreme value, a vibration stress frequency extreme value and a peak acceleration extreme value.

[0018] In one embodiment, the vibration stress extreme value includes the vibration stress time extreme value, and applying vibration stress to the target solder joint according to the multiple vibration stress parameters includes:

[0019] Applying vibration stress to the target welding point according to a preset vibration stress direction, vibration stress frequency, peak acceleration and vibration stress amplitude, and starting timing;

[0020] When the target solder joint is determined to be cracked and failed according to the feedback electrical signal, obtaining the extreme value of the vibration stress of the target solder joint comprises:

[0021] When it is determined that the target solder joint has cracked and failed according to the feedback electrical signal, the timing is stopped and the timing value is determined as the vibration stress time extreme value of the target solder joint.

[0022] In one embodiment, the vibration stress extreme value includes the peak acceleration extreme value, and applying vibration stress to the target solder joint according to the plurality of vibration stress parameters includes:

[0023] Applying vibration stress to the target welding point according to a preset vibration stress direction, vibration stress frequency and vibration stress amplitude, and linearly increasing the peak acceleration from zero;

[0024] When the target solder joint is determined to be cracked and failed according to the feedback electrical signal, obtaining the extreme value of the vibration stress of the target solder joint comprises:

[0025] In the case where the target weld spot is determined to be cracked and failed according to the feedback electrical signal, the current peak acceleration is determined as the peak acceleration extreme value of the target weld spot.

[0026] In one embodiment, determining the target solder joint crack failure according to the feedback electrical signal includes:

[0027] Acquire a voltage variation between a first feedback electrical signal and a second feedback electrical signal output by the target welding point at two adjacent moments; wherein the output time of the first feedback electrical signal is later than the output time of the second feedback electrical signal;

[0028] When the ratio between the voltage variation and the second feedback electrical signal is greater than or equal to a preset ratio threshold, it is determined that the target solder joint has cracked and failed.

[0029] In a second aspect, the present application provides a device for detecting a vibration stress extreme value, the device comprising:

[0030] A vibration module, used for applying vibration stress to a target solder joint according to a plurality of vibration stress parameters; wherein a target vibration stress parameter among the plurality of vibration stress parameters is positively correlated with a time of applying the vibration stress, and the target solder joint is a solder joint of qualified quality formed by welding a gold-plated pin of an electronic component to a printed circuit board;

[0031] An acquisition module is used to apply a detection electrical signal to the target solder joint, obtain a feedback electrical signal output by the target solder joint, and obtain a vibration stress extreme value of the target solder joint when it is determined that the target solder joint has cracked and failed according to the feedback electrical signal; wherein the vibration stress extreme value is the value of the target vibration stress parameter when the target solder joint has cracked and failed.

[0032] In a third aspect, the present application provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the above method when executing the computer program.

[0033] In a fourth aspect, the present application provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program implements the steps of the above method when executed by a processor.

[0034] The above-mentioned vibration stress extreme value detection method, device, computer equipment, storage medium and computer program product apply vibration stress to the target solder joint according to multiple vibration stress parameters, obtain the feedback electrical signal output by the target solder joint by inputting the detection electrical signal to the target solder joint, and obtain the vibration stress extreme value of the target solder joint when the target solder joint is determined to be cracked and failed according to the feedback electrical signal. Since the feedback electrical signal represents the welding state of the target solder joint, the real-time monitoring of the welding state of the target solder joint is achieved by real-time monitoring of the feedback electrical signal during the test process. Compared with the method of applying vibration stress to the solder joint with fixed vibration stress parameters and detecting whether the welding state of the solder joint is cracked and failed after the stress test is completed, the detection efficiency is improved. Furthermore, since the target vibration stress parameter among the multiple vibration stress parameters is positively correlated with the time of applying the vibration stress, the target vibration stress parameter changes dynamically during the test process. Based on this, when the target solder joint is determined to be cracked and failed, the value of the corresponding target vibration stress parameter is obtained, which is the vibration stress extreme value, and the detection of the vibration stress extreme value of the target solder joint is achieved, which can provide accurate data support for the application of electronic components with gold-plated pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is one of the flow charts of the detection method of the vibration stress extreme value in one embodiment;

[0036] Figure 2 The second flowchart of a method for detecting a vibration stress extreme value in one embodiment;

[0037] Figure 3 The third flowchart of a method for detecting a vibration stress extreme value in one embodiment;

[0038] Figure 4 The fourth flowchart of a method for detecting a vibration stress extreme value in one embodiment;

[0039] Figure 5 is a schematic diagram of a cross-sectional structure of a first surface of a packaged chip in one embodiment;

[0040] Figure 6 is a schematic diagram of the cross-sectional structure of the second surface of the packaged chip in one embodiment;

[0041] Figure 7 FIG5 is a fifth flow chart of a method for detecting a vibration stress extreme value in one embodiment;

[0042] Figure 8 is a structural block diagram of a device for detecting extreme values ​​of vibration stress in one embodiment;

[0043] Fig. 9 FIG. 4 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0045] At present, there is no method or means for detecting the extreme value of vibration stress of solder joints of gold-plated pin devices. The closest method for testing vibration stress of solder joints of gold-plated pin devices is to refer to relevant standards, apply vibration stress of fixed time or fixed intensity to the solder joints, and conduct vibration testing. After the test, the solder joints are tested by non-destructive or destructive testing means, and by analyzing whether quality defects such as cracking appear in the solder joints after the vibration test, it is determined whether the pin solder joints pass the stress conditions specified in the standard. However, this method can only determine whether the solder joints pass the vibration stress values ​​specified in the standard, and cannot obtain the extreme value of vibration stress when the solder joints of gold-plated pin devices crack and fail in a vibration environment. In this regard, the present application provides a method, device, computer equipment and storage medium for detecting extreme values ​​of vibration stress, which can obtain the extreme value of vibration stress when the solder joints of gold-plated pins crack and fail in a vibration environment.

[0046] In one embodiment, Figure 1 As shown, a method for detecting extreme values ​​of vibration stress is provided, and the method includes the following steps S102 to S106.

[0047] S102: Applying vibration stress to the target solder joint according to a plurality of vibration stress parameters.

[0048] In the application, a vibration test device can be used to apply vibration stress to the target solder joint for vibration testing. The target solder joint is a solder joint of qualified quality formed by welding between the gold-plated pin of the electronic component and the printed circuit board (PCB). The gold-plated pin of the electronic component includes a gold-plated layer (or referred to as a gold-plated layer). The material of the target solder joint includes a gold alloy, and the material of the target solder joint can be determined according to the welding material. Exemplarily, the welding material is tin metal, and the target solder joint includes a gold-tin alloy. Qualified quality means that the welding between the solder joint and the printed circuit board can meet the electrical connection requirements.

[0049] Vibration stress refers to stress whose value changes over time and is a form of dynamic stress. Vibration stress parameters are used to characterize vibration stress, and multiple vibration stress parameters are used to characterize vibration stress from multiple different dimensions. Exemplarily, vibration stress parameters include multiple of vibration stress direction, vibration stress frequency, vibration stress amplitude, peak acceleration, and vibration stress time. Among them, vibration stress direction refers to the direction in which vibration stress is applied to the target solder joint. Vibration stress frequency refers to the frequency of applying vibration stress to the target solder joint. Vibration stress amplitude refers to the amplitude of vibration stress applied to the target solder joint. Peak acceleration refers to the peak value of acceleration of applying vibration stress to the target solder joint. Vibration stress time refers to the duration of applying vibration stress to the target solder joint.

[0050] The target vibration stress parameter among the multiple vibration stress parameters is positively correlated with the time of applying the vibration stress. Among them, the target vibration stress parameter is at least one of the multiple vibration stress parameters. The target vibration stress parameter changes with the time of applying the vibration stress, that is, the target vibration stress parameter is a dynamically changing parameter, and as the time of applying the vibration stress increases, the target vibration stress parameter also increases accordingly. In the application, the remaining vibration stress parameters other than the target vibration stress parameters among the multiple vibration stress parameters can be pre-set, and the target vibration stress parameters can be adjusted in real time during the test process, and vibration stress is applied to the target solder joint for vibration testing. Among them, the remaining vibration stress parameter is a fixed parameter, that is, the remaining vibration stress parameter is not related to the application of the applied vibration stress. It should be noted that the remaining vibration stress parameter is a fixed parameter in the same test process, relative to the target vibration stress parameter. In multiple different test processes, the remaining vibration stress parameter can be adjusted according to actual test requirements to obtain the vibration stress extreme value of the solder joint under multiple test conditions.

[0051] S104: applying a detection electrical signal to the target welding point, and obtaining a feedback electrical signal output by the target welding point.

[0052] In the application, the device solder joint crack detection device can be used to apply an electrical signal to the solder joint, and the electrical signal fitting software can be used to analyze the electrical signal output at the solder joint to achieve real-time monitoring of the solder joint cracking in a vibration environment. Among them, the detection electrical signal is the signal input to the target solder joint, and the feedback electrical signal is the signal output by the target solder joint based on the feedback of the detection electrical signal. The feedback electrical signal is used to indicate the welding state of the target solder joint. In the application, the electrical signal can be continuously applied to the target solder joint, and the feedback electrical signal output by the target solder joint can be obtained accordingly, and the state of the target solder joint can be detected in real time through the feedback electrical signal.

[0053] S106: When it is determined that the target solder joint has cracked and failed according to the feedback electrical signal, an extreme value of vibration stress of the target solder joint is obtained.

[0054] In the application, data analysis devices such as data processing computers and related analysis software can be used to record and analyze data such as extreme values ​​of vibration stress during the test. The extreme value of vibration stress is the value of the target vibration stress parameter when the target solder joint cracks and fails. Among them, the target solder joint cracking failure refers to the cracking of the target solder joint, resulting in the welding between the gold-plated pins of the electronic components and the printed circuit board not meeting the electrical connection requirements, and the target solder joint becomes a failed solder joint.

[0055] It is understandable that, in the process of applying vibration stress to the target solder joint for testing, the target vibration stress parameter changes dynamically, and the vibration stress extreme value is the value of the target vibration stress parameter corresponding to the crack failure of the target solder joint.

[0056] The above-mentioned vibration stress extreme value detection method applies vibration stress to the target solder joint according to multiple vibration stress parameters, obtains the feedback electrical signal output by the target solder joint by inputting the detection electrical signal to the target solder joint, and obtains the vibration stress extreme value of the target solder joint when the target solder joint is determined to be cracked and failed according to the feedback electrical signal. Since the feedback electrical signal represents the welding state of the target solder joint, the real-time monitoring of the welding state of the target solder joint is achieved by real-time monitoring of the feedback electrical signal during the test process. Compared with the method of applying vibration stress to the solder joint with fixed vibration stress parameters and detecting whether the welding state of the solder joint is cracked and failed after the stress test is completed, the detection efficiency is improved. Furthermore, since the target vibration stress parameter among the multiple vibration stress parameters is positively correlated with the time of applying the vibration stress, the target vibration stress parameter changes dynamically during the test process. Based on this, when the target solder joint is determined to be cracked and failed, the value of the corresponding target vibration stress parameter is obtained, which is the vibration stress extreme value, and the detection of the vibration stress extreme value of the target solder joint is achieved, which can provide accurate data support for the application of electronic components with gold-plated pins.

[0057] In one embodiment, Figure 2 As shown, the method for detecting the extreme value of vibration stress also includes the following steps S202 to S206.

[0058] S202: Soldering a plurality of gold-plated pins of electronic components to the printed circuit board respectively to form a plurality of corresponding solder joints.

[0059] The welding technology may be any suitable technology. For example, multiple gold-plated pins of electronic components may be welded to a printed circuit board using welding technologies such as reflow soldering, wave soldering or manual soldering, and multiple corresponding solder joints may be formed respectively. No limitation is made here.

[0060] S204: Acquire welding images between the plurality of welding points and the printed circuit board.

[0061] The imaging technology may be any suitable technology. For example, optical imaging and / or X-RAY imaging technology may be used to obtain welding images between the plurality of welding points and the printed circuit, without any limitation herein.

[0062] S206: Determine, according to the welding image, a welding point that is seamlessly connected to the printed circuit board among the plurality of welding points as a target welding point.

[0063] When there is no gap between the solder joint and the printed circuit board, it is determined that the soldering quality between the solder joint and the printed circuit board is qualified, and the solder joint is determined as the target solder joint. In the application, the device solder joint quality screening device can use optical imaging and X-RAY imaging technology to detect and analyze the solder joint quality of the pin gold-plated device after welding, so as to eliminate solder joints with welding defects, such as cold welding, false welding, voids and other problems, so as to use the target solder joint to detect the extreme value of vibration stress, ensure that there is no welding quality problem in the solder joint of the subsequent vibration stress test, avoid the influence of unqualified welding quality on the extreme value of vibration stress, and thus improve the detection accuracy and reliability of the extreme value of vibration stress.

[0064] In the application, when it is determined based on the welding image that there are gaps in the connections between multiple solder joints and the printed circuit board, that is, the welding quality of multiple solder joints is unqualified, the electronic components can be reselected and steps S202 to S206 can be executed again to perform vibration stress testing on the target solder joints with qualified quality.

[0065] In one embodiment, Figure 3 As shown, the method for detecting the extreme value of vibration stress may further include the following steps S302 and S304.

[0066] S302: Obtain the thickness of the gold-plated layer of the plurality of gold-plated pins.

[0067] For example, the thickness of the gold-plated layer of the pins can be obtained by using cross-sectional analysis and X-RAY imaging techniques. In the application, the thickness of the gold-plated layer of the multiple gold-plated pins of the electronic components can be obtained before the multiple gold-plated pins of the electronic components are respectively soldered to the printed circuit board in step S402 to form multiple solder joints.

[0068] S304: Obtaining vibration stress extreme values ​​corresponding to crack failure of multiple target solder joints with different gold plating layer thicknesses.

[0069] Since the gold-plated layer of the pin will form a gold alloy such as a gold-tin alloy with the welding material during the welding process, and the gold alloy has a brittle characteristic, the risk of solder joint cracking failure is greater in gold-plated pin devices compared to non-gold-plated pins. In addition, the thickness of the gold-plated layer of the pin is related to the strength of the solder joint. Based on the above method, the extreme values ​​of vibration stress of gold-plated pins with different gold-plated layer thicknesses can be obtained, thereby obtaining the correlation between the thickness of the gold-plated layer of the gold-plated pin and the extreme values ​​of vibration stress. This can be used as a basis to guide and control the gold-plated thickness of the pins of electronic components, and provide a reference for the selection of electronic components for different usage scenarios.

[0070] In one embodiment, the vibration stress extreme value includes at least one of a vibration stress time extreme value, a vibration stress amplitude extreme value, a vibration stress direction extreme value, a vibration stress frequency extreme value, and a peak acceleration extreme value. The vibration stress extreme value corresponds to the target vibration stress parameter. Exemplarily, if the target vibration stress parameter includes a vibration stress time parameter, then the vibration stress extreme value includes a vibration stress time extreme value; if the target vibration stress parameter includes a vibration stress amplitude, then the vibration stress extreme value includes a vibration stress amplitude extreme value; if the target vibration stress parameter includes a vibration stress frequency, then the vibration stress extreme value includes a vibration stress frequency extreme value; if the target vibration stress parameter includes a peak acceleration, then the vibration stress extreme value includes a peak acceleration extreme value. In the application, the target vibration stress parameter can be selected according to the test requirements to obtain the corresponding vibration stress extreme value, which is not limited here.

[0071] In one embodiment, the vibration stress extreme value includes the vibration stress time extreme value. Based on this, step S204, applying vibration stress to the target solder joint according to multiple vibration stress parameters, may include: applying vibration stress to the target solder joint according to a preset vibration stress direction, vibration stress frequency, peak acceleration and vibration stress amplitude, and starting the timing step. Among them, the vibration stress direction, vibration stress frequency, peak acceleration and vibration stress amplitude are pre-set and are fixed values. The vibration stress time is a variable value, and the vibration stress time starts to increase from the time when the stress is applied to the target solder joint.

[0072] Step S206, when the target solder joint is determined to have cracked and failed according to the feedback electrical signal, obtaining the vibration stress extreme value of the target solder joint, may include: when the target solder joint is determined to have cracked and failed according to the feedback electrical signal, stopping the timing and determining the timing value as the vibration stress time extreme value of the target solder joint. The vibration stress time extreme value is the duration from the start of applying vibration stress to the target solder joint to the determination of the crack failure of the target solder joint. In this way, the maximum duration of the solder joint of the gold-plated pin to maintain a normal welding state under the conditions of the preset vibration stress direction, vibration stress frequency, peak acceleration and vibration stress amplitude can be obtained, thereby providing data support for the use of the device.

[0073] Further, step S304, obtaining the vibration stress extreme values ​​corresponding to the cracking failure of multiple target solder joints with different gold plating layer thicknesses, may include: the step of obtaining the vibration stress time extreme values ​​corresponding to the cracking failure of multiple target solder joints with different gold plating layer thicknesses. Based on this, the correlation between the gold plating layer thickness of the pin and the vibration stress time extreme value can be obtained, thereby providing data support for guiding and controlling the gold plating layer thickness of the gold-plated pins of electronic components.

[0074] In one embodiment, the vibration stress extreme value includes the peak acceleration extreme value. Based on this, step S204, applying vibration stress to the target solder joint according to multiple vibration stress parameters, may include: applying vibration stress to the target solder joint according to a preset vibration stress direction, vibration stress frequency and vibration stress amplitude, and linearly increasing the peak acceleration from zero. Among them, the vibration stress direction, vibration stress frequency and vibration stress amplitude are preset and are fixed values. The peak acceleration is a variable value, and the peak acceleration is proportional to the time of applying the vibration stress. Among them, the step amount of the peak acceleration can be preset and is not limited here.

[0075] Step S206, when the target solder joint is determined to have cracked and failed according to the feedback electrical signal, obtaining the vibration stress extreme value of the target solder joint, may include: when the target solder joint is determined to have cracked and failed according to the feedback electrical signal, determining the current peak acceleration as the peak acceleration extreme value of the target solder joint. In this way, the maximum value of the peak acceleration that the solder joint of the gold-plated pin can withstand under the conditions of the preset vibration stress direction, vibration stress frequency and vibration stress amplitude can be obtained, thereby providing data support for the use of the device.

[0076] Further, step S304, obtaining the vibration stress extreme values ​​corresponding to the cracking failure of multiple target solder joints with different gold plating layer thicknesses, may include: the step of obtaining the peak acceleration extreme values ​​corresponding to the cracking failure of multiple target solder joints with different gold plating layer thicknesses. Based on this, the correlation between the gold plating layer thickness of the pin and the peak acceleration extreme value can be obtained, thereby providing data support for guiding and controlling the gold plating layer thickness of the gold-plated pins of electronic components.

[0077] It should be noted that, in the case where the vibration stress extreme value includes at least one of the vibration stress amplitude extreme value and the vibration stress frequency extreme value, it is also similar to the process of obtaining the peak acceleration extreme value described above. Exemplarily, the vibration stress extreme value includes the vibration stress amplitude extreme value, and step S204 may include: applying vibration stress to the target solder joint according to the preset vibration stress direction, vibration stress frequency (or amplitude) and peak acceleration, and increasing the vibration stress amplitude (or frequency) linearly from zero. Among them, the vibration stress direction, vibration stress frequency (or amplitude) and peak acceleration are preset and are fixed values. The vibration stress amplitude (or frequency) is a variable value, and the vibration stress amplitude (or frequency) is proportional to the time of applying the vibration stress. Among them, the step amount of the vibration stress amplitude (or frequency) can be preset and is not limited here. Step S206 may include: in the case of determining that the target solder joint has cracked and failed according to the feedback electrical signal, determining the current vibration stress amplitude (or frequency) as the vibration stress amplitude (or frequency) extreme value of the target solder joint. Step S304 may include: obtaining the vibration stress amplitude (or frequency) extreme values ​​corresponding to the crack failure of multiple target solder joints with different gold plating layer thicknesses. Based on this, the correlation between the gold plating layer thickness of the pin and the vibration stress amplitude extreme value and the vibration stress frequency extreme value can also be obtained, thereby providing data support for guiding and controlling the gold plating layer thickness of the gold-plated pins of electronic components.

[0078] In one embodiment, Figure 4 As shown, step S204, determining the crack failure of the target solder joint according to the feedback electrical signal, may include the following steps S402 and S404.

[0079] S402: Obtain the voltage change between the first feedback electrical signal and the second feedback electrical signal output by the target solder joint at two adjacent moments. The feedback electrical signal is used to represent the voltage across the target solder joint. The output time of the first feedback electrical signal is later than the output time of the second feedback electrical signal. For example, the first feedback electrical signal is used to represent the voltage U1 across the target solder joint at t1, and the second feedback electrical signal is used to represent the voltage U2 across the target solder joint at t2, where t1>t2. The voltage change is the voltage difference ΔU=U2-U1 between the first feedback electrical signal and the second feedback electrical signal.

[0080] S404: When the ratio between the voltage variation and the second feedback electrical signal is greater than or equal to a preset ratio threshold, determine that the target solder joint has cracked and failed.

[0081] The preset ratio threshold is preset. Exemplarily, the preset ratio threshold is greater than or equal to 20%, for example, the preset ratio threshold is 25%, 30%, 50%, 75%, 90%, etc., and may also be any other value greater than 20%. For example, when the preset ratio threshold is 20%, when (U2-U1) / U1≥20%, it is determined that the target solder joint has cracked and failed.

[0082] When the target solder joint cracks or even fails, the resistance of the target solder joint will increase. In this case, the voltage change between the first feedback electrical signal and the second feedback electrical signal can be obtained. When the ratio between the voltage change and the second feedback electrical signal is greater than or equal to a preset ratio threshold, it can be determined that the target solder joint is cracked and failed, thereby achieving real-time monitoring of the welding status of the target solder joint.

[0083] In one embodiment, a method for detecting extreme values ​​of vibration stress is provided. The device used in the method includes a gold plating thickness measuring device, a device solder joint quality screening device, a vibration test device, a device solder joint crack detection device, and a data analysis device. The electronic components include a packaged chip, the packaged chip includes a plurality of gold-plated pins with different gold plating layer thicknesses, the size of the packaged chip is 20mm*20mm, the pin spacing is 0.15mm, and the length of the solderable end of the pin is 0.6mm. Figure 5 and Figure 6 It is a schematic diagram of the cross-sectional structure of the two opposite sides of the packaged chip. Taking the detection of the extreme value of the vibration stress time as an example, Figure 7 As shown, the method includes the following steps S702 to S712.

[0084] S702: The gold plating thickness measuring device measures the thickness of the gold plating layer of multiple gold-plated pins of the packaged chip using cross-sectional analysis and X-RAY imaging technology, and the data analysis device records the measurement data.

[0085] S704: Using reflow soldering, wave soldering or manual soldering technology, soldering the plurality of gold-plated pins of the packaged chip to the printed circuit board respectively to form a plurality of corresponding solder joints.

[0086] S706: The device solder joint quality screening device uses optical imaging and X-RAY imaging technology to obtain the welding images between the multiple solder joints and the printed circuit board, and determines whether there is a gap in the connection between the solder joints and the printed circuit board based on the welding images. If so, it is determined that the solder joint quality is unqualified, and step S702 is re-selected and executed again. If not, the following step S708 is executed.

[0087] S708: The vibration test device applies vibration stress to the solder joint according to the target vibration stress parameter and the preset fixed vibration stress parameter, wherein the target vibration stress parameter is positively correlated with the time of applying the vibration stress.

[0088] S710: The device solder joint crack detection device applies a detection electrical signal to the target solder joint and obtains a feedback electrical signal output by the target solder joint. In the application, when the vibration test device applies vibration stress to the target solder joint, the device solder joint crack detection device monitors the solder joint cracking in the vibration environment in real time. If the target solder joint cracking failure is detected according to the feedback electrical signal, the vibration test is terminated.

[0089] S712: When the device solder joint crack detection device determines that the target solder joint has cracked and failed, the data analysis device obtains the extreme value of vibration stress corresponding to the target solder joint, and obtains the extreme value of vibration stress when the pin solder joints with different gold plating layer thicknesses under the same vibration environment fail to crack.

[0090] Based on the above steps, different test conditions and results are as follows:

[0091] (1) Vibration time extreme value test: Apply fixed vibration test conditions to the sample under test, as shown in Table 1. The plane formed by the XY axis is Figure 5 and Figure 6 The plane where the cross section is shown, the Z axis is the direction perpendicular to the plane where the XY axis is located. The time condition is a variable, and the vibration time extreme values ​​of the vibration failure of the solder joint are measured as shown in Table 2.

[0092] Table 1 Vibration test conditions

[0093]

[0094] Table 2 Test results

[0095]

[0096] (2) Vibration peak acceleration extreme value test: Fixed vibration test conditions are applied to the sample under test, as shown in Table 3. The peak acceleration value is changed, the peak acceleration starts at 0g and increases linearly, and the peak acceleration extreme value of the vibration failure of the solder joint is measured as shown in Table 4.

[0097] Table 3 Vibration test conditions

[0098]

[0099] Table 4 Test results

[0100]

[0101] Based on the above experimental data, it can be seen that the extreme value of vibration stress time is negatively correlated with the thickness of the pin gold-plated layer, and the extreme value of peak acceleration is negatively correlated with the thickness of the pin gold-plated layer. This is because the thicker the gold-plated layer, the greater the gold content in the gold-tin alloy of the solder joint, the higher the brittleness of the solder joint, and the smaller the strength that the solder joint can withstand.

[0102] The above detection method can detect different vibration stress extremes when the solder joints of gold-plated pin devices fail in a vibration environment, such as vibration stress intensity extremes, vibration stress time extremes, vibration stress direction extremes, etc.; and, the detection method can correlate the measured extremes with the pin gold plating layer thickness results, and analyze the vibration stress extremes of pin solder joints with different gold plating layer thicknesses; in addition, the results obtained by the detection method can be used as a basis to guide component development units to control the gold plating thickness of devices, and can provide a reference for component users to select components for different usage scenarios.

[0103] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0104] Based on the same inventive concept, the embodiment of the present application also provides a vibration stress extreme value detection device for implementing the vibration stress extreme value detection method involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in the embodiments of one or more vibration stress extreme value detection devices provided below can refer to the limitations of the vibration stress extreme value detection method above, and will not be repeated here.

[0105] In one embodiment, Figure 8 As shown, a vibration stress extreme value detection device 800 is provided, including: a vibration module 801 and an acquisition module 802.

[0106] The vibration module 801 is used to apply vibration stress to the target solder joint according to multiple vibration stress parameters; wherein the target vibration stress parameter among the multiple vibration stress parameters is positively correlated with the time of applying the vibration stress, and the target solder joint is a solder joint of qualified quality formed by welding the gold-plated pin of the electronic component to the printed circuit board.

[0107] The acquisition module 802 is used to apply a detection electrical signal to the target solder joint, and obtain a feedback electrical signal output by the target solder joint, and when it is determined that the target solder joint has cracked and failed according to the feedback electrical signal, obtain the vibration stress extreme value of the target solder joint; wherein the vibration stress extreme value is the value of the target vibration stress parameter when the target solder joint has cracked and failed.

[0108] The above-mentioned vibration stress extreme value detection device 800 applies vibration stress to the target solder joint according to multiple vibration stress parameters through the vibration module 801, inputs the detection electrical signal to the target solder joint through the acquisition module 802, obtains the feedback electrical signal output by the target solder joint, and obtains the vibration stress extreme value of the target solder joint when the target solder joint is determined to be cracked and failed according to the feedback electrical signal. Since the feedback electrical signal represents the welding state of the target solder joint, the real-time monitoring of the welding state of the target solder joint is achieved by real-time monitoring of the feedback electrical signal during the test process. Compared with the method of applying vibration stress to the solder joint with fixed vibration stress parameters and detecting whether the welding state of the solder joint is cracked and failed after the stress test is completed, the detection efficiency is improved. Furthermore, since the target vibration stress parameter among the multiple vibration stress parameters is positively correlated with the time of applying the vibration stress, the target vibration stress parameter changes dynamically during the test process. Based on this, when the target solder joint is determined to be cracked and failed, the value of the corresponding target vibration stress parameter is obtained, which is the vibration stress extreme value, and the detection of the vibration stress extreme value of the target solder joint is achieved, which can provide accurate data support for the application of electronic components with gold-plated pins.

[0109] In one embodiment, the acquisition module is further used to acquire welding images between the plurality of welding points and the printed circuit board, wherein the plurality of welding points are formed by welding the plurality of gold-plated pins of the electronic components to the printed circuit board. The vibration stress extreme value detection device also includes a determination module, which is used to determine the welding point that is seamlessly connected to the printed circuit board among the plurality of welding points as the target welding point according to the welding image.

[0110] In one embodiment, the acquisition module is further used to: acquire the thickness of the gold-plated layer of multiple gold-plated pins; and acquire the corresponding extreme vibration stress values ​​when multiple target solder joints with different gold-plated layer thicknesses crack and fail.

[0111] In one embodiment, the vibration stress extreme value includes the vibration stress time extreme value, and the vibration module is further used to apply vibration stress to the target solder joint according to the preset vibration stress direction, vibration stress frequency, peak acceleration and vibration stress amplitude, and start timing. The acquisition module is also used to stop timing and determine the timing value as the vibration stress time extreme value of the target solder joint when it is determined that the target solder joint has cracked and failed according to the feedback electrical signal.

[0112] In one embodiment, the vibration stress extreme value includes a peak acceleration extreme value, and the vibration module is further used to apply vibration stress to the target weld according to a preset vibration stress direction, vibration stress frequency, and vibration stress amplitude, and to linearly increase the peak acceleration from zero. The acquisition module is also used to determine the current peak acceleration as the peak acceleration extreme value of the target weld when the target weld is determined to have cracked and failed according to the feedback electrical signal.

[0113] In one embodiment, the acquisition module is also used to obtain the voltage change between the first feedback electrical signal when the target weld fails due to cracking and the second feedback electrical signal when the target weld fails due to not cracking; when the ratio between the voltage change and the second feedback electrical signal is greater than or equal to a preset ratio threshold, it is determined that the target weld fails due to cracking.

[0114] Each module in the above-mentioned vibration stress extreme value detection device can be implemented in whole or in part by software, hardware and a combination thereof. Each of the above-mentioned modules can be embedded in or independent of a processor in a computer device in the form of hardware, or can be stored in a memory in a computer device in the form of software, so that the processor can call and execute the operations corresponding to each of the above modules.

[0115] In one embodiment, a computer device is provided. The computer device may be a terminal, and its internal structure diagram may be as follows: Fig. 9 As shown. The computer device includes a processor, a memory, a communication interface, a display screen and an input device connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The communication interface of the computer device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner can be achieved through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. When the computer program is executed by the processor, a method for detecting a vibration stress extreme value is implemented. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covered on the display screen, or a key, trackball or touchpad set on the computer device shell, or an external keyboard, touchpad or mouse, etc.

[0116] Those skilled in the art will understand that Fig. 9 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0117] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps of the above-mentioned vibration stress extreme value detection method when executing the computer program.

[0118] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps of the above-mentioned vibration stress extreme value detection method are implemented.

[0119] In one embodiment, a computer program product is provided, comprising a computer program, which implements the steps of the above-mentioned vibration stress extreme value detection method when executed by a processor.

[0120] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties.

[0121] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0122] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0123] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for detecting extreme values ​​of vibration stress, characterized in that: The method comprises: Applying vibration stress to a target solder joint according to a plurality of vibration stress parameters; wherein a target vibration stress parameter among the plurality of vibration stress parameters is positively correlated with the time of applying the vibration stress, and the target solder joint is a solder joint of qualified quality formed by welding between a gold-plated pin of an electronic component and a printed circuit board; Continuously applying a detection electrical signal to the target solder joint, and correspondingly acquiring a feedback electrical signal output by the target solder joint; wherein the feedback electrical signal is used to detect the state of the target solder joint in real time during the test process; When the target solder joint is determined to have cracked and failed according to the feedback electrical signal, obtaining a vibration stress extreme value of the target solder joint; wherein the vibration stress extreme value is a value of the target vibration stress parameter when the target solder joint has cracked and failed; Obtain the thickness of the gold-plated layer of multiple gold-plated pins; obtain the vibration stress extreme values ​​corresponding to the cracking and failure of multiple target solder joints with different gold-plated layer thicknesses; wherein, The vibration stress extreme value includes a vibration stress time extreme value. Vibration stress is applied to the target solder joint according to a preset vibration stress direction, vibration stress frequency, peak acceleration and vibration stress amplitude, and timing is started. When it is determined that the target solder joint is cracked and failed according to the feedback electrical signal, timing is stopped and the timing value is determined as the vibration stress time extreme value of the target solder joint; the vibration stress time extreme value is negatively correlated with the thickness of the pin gold plating layer; The vibration stress extreme value also includes a peak acceleration extreme value. Vibration stress is applied to the target solder joint according to a preset vibration stress direction, vibration stress frequency and vibration stress amplitude, and the peak acceleration is linearly increased from zero. When it is determined that the target solder joint has cracked and failed according to the feedback electrical signal, the current peak acceleration is determined as the peak acceleration extreme value of the target solder joint; the peak acceleration extreme value is negatively correlated with the thickness of the pin gold plating layer.

2. The method according to claim 1, characterized in that The method further comprises: Soldering the plurality of gold-plated pins of the electronic components to the printed circuit board to form a plurality of corresponding solder joints; Acquire welding images between the plurality of welding points and the printed circuit board respectively; A soldering point among the plurality of soldering points that is seamlessly connected to the printed circuit board is determined as the target soldering point according to the soldering image.

3. The method according to claim 1, characterized in that The vibration stress extreme value also includes at least one of a vibration stress amplitude extreme value, a vibration stress direction extreme value and a vibration stress frequency extreme value.

4. The method according to claim 1, characterized in that: The step of determining the target solder joint crack failure according to the feedback electrical signal comprises: Acquire a voltage variation between a first feedback electrical signal and a second feedback electrical signal output by the target welding point at two adjacent moments; wherein the output time of the first feedback electrical signal is later than the output time of the second feedback electrical signal; When the ratio between the voltage variation and the second feedback electrical signal is greater than or equal to a preset ratio threshold, it is determined that the target solder joint has cracked and failed.

5. A device for detecting extreme values ​​of vibration stress, characterized in that: The device comprises: A vibration module, used for applying vibration stress to a target solder joint according to a plurality of vibration stress parameters; wherein a target vibration stress parameter among the plurality of vibration stress parameters is positively correlated with a time of applying the vibration stress, and the target solder joint is a solder joint of qualified quality formed by welding a gold-plated pin of an electronic component to a printed circuit board; an acquisition module, for continuously applying a detection electrical signal to the target solder joint, and correspondingly acquiring a feedback electrical signal output by the target solder joint, and acquiring a vibration stress extreme value of the target solder joint when it is determined that the target solder joint has cracked and failed according to the feedback electrical signal; wherein the feedback electrical signal is used to detect the state of the target solder joint in real time during the test; and the vibration stress extreme value is the value of the target vibration stress parameter when the target solder joint has cracked and failed; The acquisition module is also used to acquire the thickness of the gold-plated layer of multiple gold-plated pins; to acquire the corresponding extreme values ​​of vibration stress when multiple target solder joints with different gold-plated layer thicknesses crack and fail; wherein, The vibration stress extreme value includes a vibration stress time extreme value; the vibration module is further used to apply vibration stress to the target solder joint according to a preset vibration stress direction, vibration stress frequency, peak acceleration and vibration stress amplitude, and start timing; the acquisition module is further used to stop timing and determine the timing value as the vibration stress time extreme value of the target solder joint when it is determined according to the feedback electrical signal that the target solder joint has cracked and failed; the vibration stress time extreme value is negatively correlated with the thickness of the pin gold plating layer; The vibration stress extreme value also includes a peak acceleration extreme value; the vibration module is also used to apply vibration stress to the target solder joint according to a preset vibration stress direction, vibration stress frequency and vibration stress amplitude, and to linearly increase the peak acceleration from zero; the acquisition module is also used to determine the current peak acceleration as the peak acceleration extreme value of the target solder joint when it is determined that the target solder joint has cracked and failed according to the feedback electrical signal; the peak acceleration extreme value is negatively correlated with the thickness of the pin gold plating layer.

6. The device for detecting extreme values ​​of vibration stress according to claim 5, characterized in that: The acquisition module is also used to acquire welding images between a plurality of welding points and the printed circuit board respectively; wherein the plurality of welding points are formed by welding a plurality of gold-plated pins of electronic components to the printed circuit board respectively; The device for detecting extreme values ​​of vibration stress further comprises a determination module, wherein the determination module is used to determine, according to the welding image, a welding point among the plurality of welding points that is seamlessly connected to the printed circuit board as the target welding point.

7. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 4 are implemented.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 4 are implemented.

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