Acrylate pressure-sensitive adhesive and preparation method thereof

Abstract

The present application discloses an acrylate pressure-sensitive adhesive and a preparation method thereof, belonging to the field of adhesive materials. An acrylate pressure-sensitive adhesive is prepared from the following raw materials in parts by weight: 10 to 25 parts of a hard monomer; 60 to 80 parts of a soft monomer; 5 to 12 parts of a functional monomer; 0.5 to 2 parts of a first initiator; 70 to 90 parts of a solvent; 3 to 8 parts of a conductive filler; 0.25 to 0.6 parts of a silane coupling agent; 1.2 to 3 parts of an acrylate monomer; 0.55 to 1.7 parts of vinyl laurate; 0.4 to 0.9 parts of N-phenyl maleimide; and 0.05 to 0.15 parts of a second initiator. The present application has the effect of improving the antistatic ability of the acrylate pressure-sensitive adhesive while maintaining good mechanical properties.

Description

Technical Field

[0001] The present application relates to the field of adhesive materials, and in particular to an acrylic pressure-sensitive adhesive and a preparation method thereof. Background Art

[0002] Pressure-sensitive adhesive, also known as self-adhesive adhesive, has both the viscous properties of liquid and the elastic properties of solid. Pressure-sensitive adhesive is very sensitive to pressure during the bonding process and does not contaminate the surface of the adherend.

[0003] The classification of pressure-sensitive adhesives includes elastomeric pressure-sensitive adhesives, natural rubber pressure-sensitive adhesives and acrylic pressure-sensitive adhesives, etc. Among them, acrylic pressure-sensitive adhesives have the advantages of high viscosity and strong adhesion. They can be made into products such as acrylic pressure-sensitive adhesive tapes and acrylic pressure-sensitive films, and can be used in the electronics industry.

[0004] In the electronics industry, static electricity can easily damage electronic components, so for some acrylic pressure-sensitive adhesives used in the electronics industry, anti-static capabilities are increasingly required. To this end, people add conductive fillers to acrylic pressure-sensitive adhesives to improve the conductivity of acrylic pressure-sensitive adhesives and conduct away static electricity. However, due to the lack of fluidity of conductive fillers and the poor compatibility of conductive fillers with acrylic pressure-sensitive adhesives, the mechanical properties of acrylic pressure-sensitive adhesives will decrease and the stability will be poor. Summary of the invention

[0005] In order to improve the antistatic ability of acrylate pressure-sensitive adhesive while maintaining good mechanical properties, the present application provides an acrylate pressure-sensitive adhesive and a preparation method thereof.

[0006] In the first aspect, the present application provides an acrylic pressure-sensitive adhesive using the following technical solution:

[0007] An acrylic pressure-sensitive adhesive is prepared from the following raw materials in parts by weight:

[0008] 10-25 parts of hard monomer;

[0009] Soft monomer 60-80 parts;

[0010] 5 to 12 parts of functional monomer;

[0011] 0.5 to 2 parts of the first initiator;

[0012] 70-90 parts of solvent;

[0013] 3 to 8 parts of conductive filler;

[0014] Silane coupling agent 0.25-0.6 parts;

[0015] 1.2-3 parts of acrylate monomer;

[0016] 0.68-1.7 parts of vinyl laurate;

[0017] 1 to 2.6 parts of N-phenylmaleimide;

[0018] The second initiator is 0.05 to 0.15 parts.

[0019] By adopting the above technical scheme, the silane coupling agent modifies the surface of the conductive filler, and at the same time, under the action of the second initiator, N-phenylmaleimide, vinyl laurate, and acrylate monomers are copolymerized and grafted on the surface of the conductive filler, wherein the segment structure formed by vinyl laurate and acrylate monomers can modify the surface of the conductive filler to have characteristics compatible with the interface of the acrylic pressure-sensitive adhesive system, thereby improving the dispersion and uniformity of the conductive filler, better forming a conductive path, playing a role in static dissipation, and reducing the rejection of the acrylic pressure-sensitive adhesive system to the conductive filler, reducing the agglomeration of the conductive filler, and improving the mechanical properties and bonding ability of the pressure-sensitive adhesive.

[0020] The introduction of N-phenylmaleimide chain segments can improve the heat stability of acrylic pressure-sensitive adhesives, and N-phenylmaleimide is copolymerized with vinyl laurate. The long-chain properties of vinyl laurate are used to balance the rigidity and flexibility of the conductive filler surface polymer. The pressure-sensitive adhesive exhibits good tolerance in both hot and cold environments and better weather resistance.

[0021] Optionally, the conductive filler is one or more of tin oxide, zinc oxide and titanium oxide.

[0022] By adopting the above technical solution, the above metal oxide has the advantages of good structural stability and low density, and is stably dispersed in the acrylic pressure-sensitive adhesive.

[0023] Optionally, the silane coupling agent is a vinyl silane coupling agent.

[0024] By adopting the above technical scheme, after the vinyl silane coupling agent is grafted onto the surface of the conductive filler, a basis for grafting polymerization with acrylate monomers, vinyl laurate, and N-phenylmaleimide is provided on the surface of the conductive filler, thereby better forming the grafting of the conductive filler, thereby obtaining conductivity, dissipating static electricity, and improving the mechanical properties of the pressure-sensitive adhesive.

[0025] Optionally, the acrylic acid ester monomer is one or more of n-butyl acrylate, n-butyl methacrylate, n-hexyl acrylate and n-hexyl methacrylate.

[0026] By adopting the above technical scheme, soft monomer acrylate monomers are copolymerized on the surface of the conductive filler, so that the contact interface between the conductive filler and the pressure-sensitive adhesive is more reasonable, thereby giving full play to the conductive properties of the conductive filler, while improving the dispersibility of the conductive filler and improving the mechanical properties of the pressure-sensitive adhesive.

[0027] Optionally, the hard monomer is one or more of methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate and vinyl acetate.

[0028] Optionally, the soft monomer is selected from one or more of n-butyl acrylate, n-butyl methacrylate, n-hexyl acrylate, n-hexyl methacrylate and polyethylene glycol monomethyl ether acrylate.

[0029] Optionally, the functional monomer is one or more of acrylic acid, methacrylic acid and β-carboxyethyl acrylate.

[0030] By adopting the above technical solution, the carboxyl groups on the functional monomers can be combined with the active groups on the surface of the substrate, thereby improving the bonding activity between the pressure-sensitive adhesive and the substrate and improving the bonding strength.

[0031] Optionally, the hard monomer is methyl methacrylate, the soft monomer is n-hexyl acrylate and polyethylene glycol monomethyl ether acrylate in a weight ratio of 1:(0.4-0.6), and the functional monomer is β-carboxyethyl acrylate.

[0032] By adopting the above technical scheme, β-carboxyethyl acrylate can improve the bonding activity between the pressure-sensitive adhesive and the substrate and improve the bonding strength. At the same time, the carbon chain structure of β-carboxyethyl acrylate is relatively long, which is suitable for combining with long-chain soft monomers such as n-hexyl acrylate and polyethylene glycol monomethyl ether acrylate, and then entangled with the long-chain vinyl laurate chain segments on the surface of the conductive filler, making the internal space of the pressure-sensitive adhesive denser, thereby obtaining good water resistance and moisture resistance, and improving durability.

[0033] In a second aspect, the present application provides a method for preparing an acrylic pressure-sensitive adhesive using the following technical solution:

[0034] A method for preparing an acrylic pressure-sensitive adhesive comprises the following steps:

[0035] The conductive filler is dispersed in a mixed solvent of alcohol and water, a silane coupling agent is added and heated for reaction, and after the reaction is completed, the mixture is filtered, washed, and dried to obtain a pretreated conductive filler;

[0036] Dispersing the pretreated conductive filler, acrylate monomer, vinyl laurate and N-phenylmaleimide in an ester solvent, slowly adding a second initiator after heating, continuing the reaction, and concentrating the reaction solution to a solid content of 50-60wt% after the reaction is completed to obtain a modified conductive filler slurry;

[0037] Mix hard monomer, soft monomer and functional monomer as mixed monomer, mix 70-80% of the total mass of mixed monomer, 50-60% of the total mass of first initiator and 50-60% of the total mass of solvent evenly, heat to 80-90°C, react for 0.8-1.2h, then add the remaining mixed monomer, 20-30% of the total mass of first initiator and 20-30% of the total mass of solvent to the reaction system, continue to react for 0.5-0.8h, then add modified conductive filler slurry, the remaining first initiator and the remaining solvent to the reaction system, continue to react for 1.5-2h, discharge and obtain glue;

[0038] The adhesive solution is coated on the release material and dried to obtain the acrylic pressure-sensitive adhesive.

[0039] By adopting the above technical solution, a modified conductive filler slurry is prepared to keep the conductive filler well dispersed, which helps to improve the dispersibility of the conductive filler in the pressure-sensitive adhesive system.

[0040] In summary, this application has the following beneficial effects:

[0041] 1. In the present application, N-phenylmaleimide, vinyl laurate, and acrylate monomers are copolymerized and grafted onto the surface of a conductive filler, wherein the segment structure formed by vinyl laurate and acrylate monomers can modify the surface of the conductive filler to have characteristics compatible with the interface of the acrylic pressure-sensitive adhesive system, thereby improving the dispersion and uniformity of the conductive filler, better forming a conductive path, playing a role in static dissipation, and reducing the rejection of the acrylic pressure-sensitive adhesive system to the conductive filler, reducing the agglomeration of the conductive filler, and improving the mechanical properties and bonding ability of the pressure-sensitive adhesive; the introduction of N-phenylmaleimide segments can improve the heat stability of the acrylic pressure-sensitive adhesive, and N-phenylmaleimide is copolymerized with vinyl laurate, and the rigidity and flexibility of the polymer on the surface of the conductive filler are balanced by the long-chain properties of vinyl laurate, and the pressure-sensitive adhesive exhibits good tolerance in both hot and cold environments and better weather resistance.

[0042] 2. The present application also specifically selects methyl methacrylate as the hard monomer, a compound of n-hexyl acrylate and polyethylene glycol monomethyl ether acrylate as the soft monomer, and β-carboxyethyl acrylate as the functional monomer, so that the pressure-sensitive adhesive has further moisture resistance and durability. DETAILED DESCRIPTION

[0043] The present application is described in further detail below.

[0044] Example 1

[0045] Acrylic pressure-sensitive adhesive, comprising the following preparation raw materials:

[0046] 1kg of hard monomer, 6kg of soft monomer, 0.5kg of functional monomer, 0.05kg of first initiator, 7kg of solvent, 0.3kg of conductive filler, 0.025kg of silane coupling agent, 0.12kg of acrylate monomer, 0.07kg of vinyl laurate, 0.1kg of N-phenylmaleimide and 0.005kg of second initiator.

[0047] The hard monomer is methyl acrylate; the soft monomer is n-butyl acrylate; the functional monomer is acrylic acid; the first initiator is benzoyl peroxide; the first solvent is ethyl acetate; the conductive filler is nano zinc oxide; the silane coupling agent is KH-570; the acrylate monomer is n-butyl acrylate; and the second initiator is benzoyl peroxide.

[0048] The preparation method of acrylic pressure-sensitive adhesive comprises the following steps:

[0049] Preparation of pretreated conductive filler:

[0050] The conductive filler was dispersed in 5 L of a mixed solvent prepared by ethanol and water in a volume ratio of 8:1. After adding a silane coupling agent, it was heated to 60°C and reacted for 1 hour. After the reaction was completed, it was filtered, washed with ethanol and water respectively, and dried to obtain a pretreated conductive filler.

[0051] Preparation of modified conductive filler slurry:

[0052] The pretreated conductive filler, acrylate monomer, vinyl laurate and N-phenylmaleimide were dispersed in 45 L of ethyl acetate, heated to 70°C, and the second initiator was added dropwise. After the addition was completed, the reaction was continued for 2 hours. After the reaction was completed, the reaction solution was concentrated under reduced pressure to a solid content of 50 wt% to obtain a modified conductive filler slurry.

[0053] Preparation of glue:

[0054] The hard monomer, the soft monomer and the functional monomer are mixed as a mixed monomer, 80% of the total mass of the mixed monomer, 60% of the total mass of the first initiator and 60% of the total mass of the solvent are evenly mixed, heated to 90°C, and reacted for 0.8h, and then the remaining mixed monomer, 30% of the total mass of the first initiator and 30% of the total mass of the solvent are added to the reaction system, and the reaction is continued for 0.8h, and then the modified conductive filler slurry, the remaining first initiator and the remaining solvent are added to the reaction system, and the reaction is continued for 2h, cooled, discharged, and a glue solution is obtained.

[0055] Preparation of pressure sensitive adhesive:

[0056] The adhesive solution is coated on the release material and dried to obtain the acrylic pressure-sensitive adhesive.

[0057] Example 2

[0058] Acrylic pressure-sensitive adhesive, comprising the following preparation raw materials:

[0059] 2.5kg of hard monomer, 8kg of soft monomer, 1.2kg of functional monomer, 0.2kg of first initiator, 9kg of solvent, 0.8kg of conductive filler, 0.06kg of silane coupling agent, 0.3kg of acrylate monomer, 0.17kg of vinyl laurate, 0.26kg of N-phenylmaleimide and 0.015kg of second initiator.

[0060] The hard monomer is methyl acrylate; the soft monomer is n-butyl acrylate; the functional monomer is acrylic acid; the first initiator is benzoyl peroxide; the solvent is ethyl acetate; the conductive filler is nano zinc oxide; the silane coupling agent is KH-570; the acrylate monomer is n-butyl acrylate; and the second initiator is benzoyl peroxide.

[0061] The preparation method of acrylic pressure-sensitive adhesive comprises the following steps:

[0062] Preparation of pretreated conductive filler:

[0063] The conductive filler was dispersed in 5 L of a mixed solvent prepared by ethanol and water in a volume ratio of 8:1. After adding a silane coupling agent, it was heated to 60°C and reacted for 1 hour. After the reaction was completed, it was filtered, washed with ethanol and water respectively, and dried to obtain a pretreated conductive filler.

[0064] Preparation of modified conductive filler slurry:

[0065] The pretreated conductive filler, acrylate monomer, vinyl laurate and N-phenylmaleimide were dispersed in 50 L of ethyl acetate, heated to 70°C, and the second initiator was added dropwise. After the addition was completed, the reaction was continued for 2 hours. After the reaction was completed, the reaction solution was concentrated under reduced pressure to a solid content of 60 wt% to obtain a modified conductive filler slurry.

[0066] Preparation of glue:

[0067] The hard monomer, the soft monomer and the functional monomer are mixed as a mixed monomer, and 70% of the total mass of the mixed monomer, 50% of the total mass of the first initiator and 50% of the total mass of the solvent are evenly mixed, heated to 80°C, and reacted for 1.2 hours, and then the remaining mixed monomer, 20% of the total mass of the first initiator and 20% of the total mass of the solvent are added to the reaction system, and the reaction is continued for 0.5 hours, and then the modified conductive filler slurry, the remaining first initiator and the remaining solvent are added to the reaction system, and the reaction is continued for 1.5 hours, cooled, discharged, and a glue solution is obtained.

[0068] Preparation of pressure sensitive adhesive:

[0069] The adhesive solution is coated on the release material and dried to obtain the acrylic pressure-sensitive adhesive.

[0070] Example 3

[0071] The difference between this embodiment and embodiment 1 is that the weight parts of raw materials for preparing the acrylic pressure-sensitive adhesive are different.

[0072] 1.6kg of hard monomer, 7kg of soft monomer, 0.8kg of functional monomer, 0.1kg of first initiator, 8kg of solvent, 0.5kg of conductive filler, 0.05kg of silane coupling agent, 0.2kg of acrylate monomer, 0.11kg of vinyl laurate, 0.17kg of N-phenylmaleimide and 0.01kg of second initiator.

[0073] The hard monomer is methyl acrylate; the soft monomer is n-butyl acrylate; the functional monomer is acrylic acid; the first initiator is benzoyl peroxide; the first solvent is ethyl acetate; the conductive filler is nano zinc oxide; the silane coupling agent is KH-570; the acrylate monomer is n-butyl acrylate; and the second initiator is benzoyl peroxide.

[0074] Example 4

[0075] The difference between this embodiment and embodiment 3 is that the raw materials for preparing the acrylic pressure-sensitive adhesive are different. The acrylic acid ester monomer in this embodiment is methyl acrylate.

[0076] Example 5

[0077] The difference between this embodiment and embodiment 3 is that the raw materials for preparing the acrylic pressure-sensitive adhesive are different. The soft monomer in this embodiment is polyethylene glycol monomethyl ether acrylate, and the molecular weight of polyethylene glycol monomethyl ether acrylate is 1000.

[0078] Example 6

[0079] The difference between this embodiment and embodiment 3 is that the raw materials for preparing the acrylic pressure-sensitive adhesive are different. The functional monomer in this embodiment is β-carboxyethyl acrylate.

[0080] Example 7

[0081] The difference between this embodiment and embodiment 3 is that the raw materials for preparing the acrylic pressure-sensitive adhesive are different. The soft monomer in this embodiment is compounded with n-hexyl acrylate and polyethylene glycol monomethyl ether acrylate in a weight ratio of 1:0.4, the molecular weight of polyethylene glycol monomethyl ether acrylate is 1000, and the functional monomer is β-carboxyethyl acrylate.

[0082] Example 8

[0083] The difference between this embodiment and embodiment 3 is that the raw materials for preparing the acrylic pressure-sensitive adhesive are different. The soft monomer in this embodiment is compounded with n-hexyl acrylate and polyethylene glycol monomethyl ether acrylate in a weight ratio of 1:0.6, the molecular weight of polyethylene glycol monomethyl ether acrylate is 1000, and the functional monomer is β-carboxyethyl acrylate.

[0084] Comparative Example 1

[0085] The difference between this comparative example and Example 3 is that the step of preparing the modified conductive filler slurry is not provided, that is, the modified conductive filler slurry in the step of preparing the glue solution is replaced by the pretreated conductive filler.

[0086] Comparative Example 2

[0087] The difference between this comparative example and Example 3 is that the raw materials for preparing the acrylic pressure-sensitive adhesive are different. In this comparative example, no acrylic acid ester monomer is added, and the amount of vinyl laurate added is 0.34 kg.

[0088] Comparative Example 3

[0089] The difference between this comparative example and Example 3 is that the raw materials for preparing the acrylic pressure-sensitive adhesive are different. In this comparative example, no vinyl laurate is added, and 0.053 kg of vinyl acetate is used to replace the vinyl laurate in the step of preparing the modified conductive filler slurry.

[0090] Comparative Example 4

[0091] The difference between this comparative example and Example 3 is that the raw materials for preparing the acrylic pressure-sensitive adhesive are different. In this comparative example, no N-phenylmaleimide is added, and 0.045 kg of styrene is used to replace the N-phenylmaleimide in the step of preparing the modified conductive filler slurry.

[0092] Performance Testing

[0093] Surface resistivity test: The acrylate pressure-sensitive adhesives prepared in each embodiment and comparative example were tested using a surface resistivity tester. The test results are shown in Table 1.

[0094] Peel strength test: Referring to GB / T 2792-2014 “Test method for peel strength of adhesive tape”, the acrylic pressure-sensitive adhesives prepared in each embodiment and comparative example were tested on a 180° stainless steel plate. The test results are shown in Table 1.

[0095] Shear strength test: The acrylate pressure-sensitive adhesives prepared in the examples and comparative examples were tested with reference to GBT 7754-1987 “Test method for shear strength of pressure-sensitive adhesive tapes”. The test results are shown in Table 1.

[0096] Hot and cold cycle test: The acrylic pressure-sensitive adhesives prepared in each embodiment and comparative example were respectively attached to the glass plates for testing, and then the glass plates were placed in a hot and cold shock chamber, the humidity was maintained at 60±1% RH, and the temperature was cycled between -20°C and 70°C. Each cycle was 20 minutes and lasted for 24 hours. After the cycle, the acrylic pressure-sensitive adhesive was peeled off from the surface of the glass plate to observe whether there was residual adhesive. The residual adhesive conditions were divided into no residual adhesive, residual adhesive volume <30%, 30%≤residual adhesive volume <60% and 60%≤residual adhesive volume. The test results are shown in Table 2.

[0097] Moisture and heat resistance test: The acrylic pressure-sensitive adhesives prepared in each embodiment and comparative example were respectively attached to the glass plates for testing, and then the glass plates were placed in a constant temperature and humidity test box, the humidity was maintained at 95±1% RH, the temperature was 70±2°C, and the test was performed for 72 hours. After the test, the acrylic pressure-sensitive adhesive was peeled off from the surface of the glass plate to observe whether there was residual adhesive. The residual adhesive conditions were divided into no residual adhesive, residual adhesive volume <30%, 30%≤residual adhesive volume <60% and 60%≤residual adhesive volume. The test results are shown in Table 2.

[0098] Table 1

[0099]

[0100]

[0101] Combined with the test results in Table 1, the surface resistivity of the acrylic pressure-sensitive adhesive prepared in Examples 1-3 is between 105Ω / □ and 1012Ω / □, which meets the requirements of electrostatic dissipation and maintains good peel strength and shear strength. This shows that the use of N-phenylmaleimide, vinyl laurate and acrylic acid ester monomers to graft the conductive filler makes the conductive filler well dispersed and combined in the pressure-sensitive adhesive system, which can make the use of the acrylic pressure-sensitive adhesive better.

[0102] Compared with Example 1, Example 3 uses a conductive filler that has only been modified with a silane coupling agent but not copolymerized and grafted. Although the conductivity of Example 1 is slightly improved, Example 3 performs significantly better in terms of mechanical properties of peel strength and shear strength, meeting the requirements of bonding ability and resistance to external force damage.

[0103] Compared with Comparative Examples 2-4, Example 3 replaces the copolymer forms of acrylate monomer, vinyl laurate and N-phenylmaleimide in Comparative Examples 2-4 respectively. It can be found that the obtained acrylate pressure-sensitive adhesive is inferior to Example 3 in conductivity and mechanical properties. It also shows that the conductive filler may affect the conductive properties of the pressure-sensitive adhesive after copolymerization and grafting, and the specific selection of the copolymer monomer can reduce the negative impact on the conductive properties of the pressure-sensitive adhesive after copolymerization and grafting, while improving the mechanical properties of the pressure-sensitive adhesive.

[0104] Compared with Example 4, the acrylate monomer of Example 4 uses a hard monomer such as methyl acrylate, and the acrylate monomer of Example 3 uses a soft monomer such as n-butyl acrylate. It can be seen that Example 3 is better than Example 4 in terms of conductive properties and mechanical properties.

[0105] Compared with Examples 5-8, by comparing the combinations of hard monomers, soft monomers and functional monomers in the pressure-sensitive adhesive system, it can be found that when the hard monomer is methyl methacrylate, the soft monomer is a compound of n-hexyl acrylate and polyethylene glycol monomethyl ether acrylate, and the functional monomer is β-carboxyethyl acrylate, the dispersibility and stability of the conductive filler in the pressure-sensitive adhesive system are further improved, thereby improving the conductivity and shear strength of the pressure-sensitive adhesive.

[0106] Table 2

[0107]

[0108]

[0109] Combined with the test results in Table 2, compared with Comparative Examples 1-4, the acrylic pressure-sensitive adhesive prepared in Example 3 can meet the requirement of peeling without residual adhesive in the hot and cold cycle test, indicating that the pressure-sensitive adhesive has good high and low temperature resistance, and is adaptable to the hot and cold alternating environment, and has outstanding durability. In addition, the acrylic pressure-sensitive adhesive prepared in Example 3 has a small amount of residual adhesive peeled off in the moisture and heat resistance test, indicating that it has a certain moisture and heat resistance.

[0110] Compared with Example 3, the acrylic pressure-sensitive adhesive prepared in Examples 7-8 meets the requirement of peeling without residual adhesive in the moisture and heat resistance test, indicating that the specific combination of hard monomers, soft monomers and functional monomers in the pressure-sensitive adhesive system can make the internal space of the pressure-sensitive adhesive denser and improve its moisture and heat resistance.

[0111] This specific implementation manner is merely an explanation of the present application and is not a limitation of the present application. After reading this specification, those skilled in the art may make non-creative modifications to the specific implementation manner as needed, but such modifications are protected by the patent law as long as they are within the scope of the claims of the present application.

Claims

1. An acrylic pressure-sensitive adhesive, characterized in that: It is prepared from the following raw materials in parts by weight: 10~25 parts of hard monomer; Soft monomer 60~80 parts; 5~12 copies of functional monomer; 0.5~2 parts of the first initiator; 70-90 parts of solvent; 3~8 parts of conductive filler; Silane coupling agent 0.25~0.6 parts; 1.2~3 parts of acrylate monomer; Vinyl laurate 0.68-1.7 parts; 1-2.6 parts of N-phenylmaleimide; 0.05-0.15 parts of the second initiator; The silane coupling agent is a vinyl silane coupling agent; The method for preparing the acrylic pressure-sensitive adhesive comprises the following steps: The conductive filler is dispersed in a mixed solvent of alcohol and water, a silane coupling agent is added and heated for reaction, and after the reaction is completed, the mixture is filtered, washed, and dried to obtain a pretreated conductive filler; The pretreated conductive filler, acrylate monomer, vinyl laurate and N-phenylmaleimide are dispersed in an ester solvent, and a second initiator is slowly added after heating to continue the reaction. After the reaction is completed, the reaction solution is concentrated to a solid content of 50-60wt% to obtain a modified conductive filler slurry; Mix the hard monomer, the soft monomer and the functional monomer as a mixed monomer, evenly mix 70-80% of the total mass of the mixed monomer, 50-60% of the total mass of the first initiator and 50-60% of the total mass of the solvent, heat to 80-90°C, react for 0.8-1.2h, then add the remaining mixed monomer, 20-30% of the total mass of the first initiator and 20-30% of the total mass of the solvent to the reaction system, continue to react for 0.5-0.8h, then add the modified conductive filler slurry, the remaining first initiator and the remaining solvent to the reaction system, continue to react for 1.5-2h, discharge, and obtain a glue solution; The adhesive solution is coated on the release material and dried to obtain the acrylic pressure-sensitive adhesive.

2. The acrylic pressure-sensitive adhesive according to claim 1, characterized in that: The conductive filler is selected from one or more of tin oxide, zinc oxide and titanium oxide.

3. The acrylic pressure-sensitive adhesive according to claim 1, characterized in that: The acrylic acid ester monomer is selected from one or more of n-butyl acrylate, n-butyl methacrylate, n-hexyl acrylate and n-hexyl methacrylate.

4. The acrylic pressure-sensitive adhesive according to claim 1, characterized in that: The hard monomer is selected from one or more of methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate and vinyl acetate.

5. The acrylic pressure-sensitive adhesive according to claim 1, characterized in that: The soft monomer is selected from one or more of n-butyl acrylate, n-butyl methacrylate, n-hexyl acrylate, n-hexyl methacrylate and polyethylene glycol monomethyl ether acrylate.

6. The acrylic pressure-sensitive adhesive according to claim 1, characterized in that: The functional monomer is selected from one or more of acrylic acid, methacrylic acid and β-carboxyethyl acrylate.

7. The acrylic pressure-sensitive adhesive according to claim 1, characterized in that: The hard monomer is methyl methacrylate, the soft monomer is n-hexyl acrylate and polyethylene glycol monomethyl ether acrylate in a weight ratio of 1: (0.4-0.6), and the functional monomer is β-carboxyethyl acrylate.

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