A device and method for hydrophobic modification of insulator surface by wide-width plasma treatment

Abstract

The present invention provides a device and method for hydrophobic modification of the surface of an insulator by wide-width plasma treatment, the device comprising: a flow control unit and an insulating support unit, wherein a high-voltage pulse power supply, a high-voltage electrode, a grounding electrode and a gas supply unit are arranged in the insulating support unit; the flow control unit is used to input a mixed gas of a set flow into the gas supply unit to form a hydrophobic medium, and the high-voltage pulse power supply is used to apply a high-voltage pulse to the high-voltage electrode, so that a dielectric barrier occurs between the high-voltage electrode and the grounding electrode to form a discharge area; after the hydrophobic medium passes through the discharge area, it is deposited on the surface of the insulator to be treated under the dual effects of plasma and gas flow, and the insulator to be treated is placed under the insulating support unit. The device of the present invention not only improves the hydrophobicity and weather resistance of the insulator surface, but also effectively improves the insulation performance of the insulator surface, achieving the improvement of multiple performances.

Description

Technical Field

[0001] The invention relates to the technical field of insulators, and in particular to a device and a method for hydrophobic modification of the surface of an insulator by wide-width plasma treatment. Background Art

[0002] As an important component in the power transmission line of the power system, insulators can play the role of insulation and support. Their safety and reliability have a huge impact on the safe operation of the power system. However, during the long-term operation of the power grid, insulators are prone to accumulate dirt in a humid environment. The pollutants on the surface of the insulators will also increase their conductivity in a humid environment, thereby greatly reducing the flashover voltage of the insulator under normal working conditions. Flashover may occur under power frequency voltage, which has a huge impact on the safe and stable operation of the power grid. In view of the above reasons, cleaning pollutants, preventing pollutants from accumulating on the surface of insulators, and ensuring that the insulation performance of insulators is not affected by the external environment are of great significance to ensure the safe and stable operation of transmission lines and reduce the maintenance cost of line operation.

[0003] At present, the main methods for preventing and controlling flashover of transmission line insulators are as follows: regular cleaning, increasing creepage distance, using expensive composite insulators, applying hydrophobic coatings, etc.

[0004] 1) Regular cleaning is to arrange relevant personnel to clean the dirty insulators, which is a common method currently used in power systems. However, the cleaning process increases a lot of labor costs and is also dangerous. In addition, during the cleaning stage, the corresponding area needs to be shut down;

[0005] 2) Increasing the creepage distance means increasing the number of insulators to increase the creepage distance on the insulator surface. However, due to the influence of the mechanical strength of the insulator and the height of the conductor, the number of insulators can only be appropriately increased within a certain range;

[0006] 3) Composite insulators are composed of glass fiber resin core rods (or core tubes) and organic material sheaths and sheds. The hydrophobicity of their low polarity surfaces makes their surfaces excellent in terms of resistance to dirt and moisture. However, composite insulators are expensive, bear little radial stress, and are easily damaged, making them unsuitable for large-scale applications.

[0007] 4) If hydrophobic anti-fouling paint is used, the long-term operating cost is low and power outages caused by manual cleaning can be avoided. Its advantages are relatively obvious and its development prospects are the greatest. Among them, the application of hydrophobic paint is an important technical measure to prevent pollution flashover on transmission lines. However, a large number of application practices have shown that the coating has poor bonding performance with the surface of the insulator, the effective time is short, and it cannot completely avoid the adhesion of dirt. Some even aggravate the accumulation of dirt on the surface of the insulator.

[0008] In summary, except for the technology of using hydrophobic anti-fouling coating to achieve hydrophobic properties on the surface of insulators, other methods have disadvantages such as high cost and low efficiency, and cannot meet the pollution removal needs of my country's large power grid.

[0009] As an emerging molecular activation method, atmospheric pressure low-temperature plasma, with its unique non-equilibrium characteristics, can enable reactions that are difficult to occur under thermodynamic equilibrium conditions to be realized under relatively mild conditions, and has achieved good results in applications such as material surface modification. Since the electron temperature in the system is much higher than the heavy particle temperature, it can maintain a gas temperature close to room temperature while achieving high chemical activity. The special properties of atmospheric pressure low-temperature plasma enable it to perform surface modification on glass, ceramics, polymer materials, etc. At present, material modification technology based on atmospheric pressure low-temperature plasma has become one of the hot issues in the field of surface modification of insulating materials.

[0010] As shown in publication numbers CN105750229B, CN111530804B, and CN107088543B, cleaning robots or drones are used to regularly clean dirt on the surface of insulators to prevent the accumulation of dirt on the surface of insulators; as shown in CN207068565U, glue is used to bond the metal rings of insulators together to increase the creepage distance of the insulators and to prevent flashover accidents caused by environmental pollution to a certain extent; anti-flashover coatings are used, as shown in CN102618138A, CN103614044B, and CN103736645A, silicone rubber coatings or other hydrophobic coatings are used to form a hydrophobic coating on the surface of the insulators to improve the hydrophobicity of the insulator surface and prevent flashover accidents on the insulator surface. ; Composite insulators are used, such as those shown in CN208607979U, CN112759936B, and CN103123832B, and the outer insulating structure of the insulator is made of silicone rubber material. Its special umbrella-shaped structure and surface hydrophobicity effectively improve the pollution flashover resistance of the insulator surface; auxiliary umbrella covers are used, such as CN103545062A, and umbrella covers with hydrophobic surfaces are used to completely cover the original insulator umbrella skirt surface to prevent dirt from accumulating on the insulator surface, thereby preventing the occurrence of pollution flashover on the insulator surface; the invention patent with publication number CN108281243B discloses a device for treating the surface of micro-stack structure insulating materials with discharge plasma, which can only treat insulators of fixed shapes. Therefore, the corresponding device has a limited scope of application. Summary of the invention

[0011] Purpose of the invention: In view of the problems existing in the above-mentioned prior art, the present invention constructs a device for hydrophobic modification of the surface of an insulator by wide-width plasma treatment. The present invention also proposes a method for hydrophobic modification of the surface of an insulator by wide-width plasma treatment.

[0012] Technical solution: In one aspect of the present invention, a device for hydrophobic modification of the surface of an insulator by wide-width plasma treatment is provided, the device comprising a flow control unit and an insulating support unit, wherein a high-voltage pulse power supply, a high-voltage electrode, a grounding electrode and a gas supply unit are arranged in the insulating support unit;

[0013] The flow control unit is used to input the mixed gas of the set flow into the gas supply unit to form a hydrophobic medium, and the high-voltage pulse power supply is used to apply a high-voltage pulse to the high-voltage electrode, so that the high-voltage electrode and the ground electrode are dielectrically blocked to form a discharge area; wherein the pulse width is 0.6μs to 1μs, the discharge power is 20w to 50w, and the voltage amplitude is 8kV to 14kV;

[0014] After passing through the discharge area, the hydrophobic medium is deposited on the surface of the insulator to be processed under the dual effects of plasma and airflow, and the insulator to be processed is placed under the insulating support unit.

[0015] Further, including:

[0016] The distance between the insulator to be processed and the lower surface of the insulating support unit is no more than 2 cm.

[0017] Further, including:

[0018] The grounding electrode is a fixed-position electrode, the high-voltage electrode is an adjustable-position electrode, and the high-voltage electrode is a smooth arc. The distance between the high-voltage electrode and the grounding electrode is set to 1-2 cm.

[0019] Further, including:

[0020] The air supply unit comprises a ventilation cavity and a gas mixing cavity which are arranged in sequence. The ventilation cavity is provided with a plurality of vertically arranged ventilation holes which are connected to the gas mixing cavity. The working gas and the modified hydrophobic reagent are input into the gas mixing cavity through the ventilation holes.

[0021] Further, including:

[0022] The ventilation cavity comprises three ventilation pipes arranged side by side, wherein the middle ventilation pipe serves as an inlet for the working gas, and the ventilation pipes on both sides serve as feed ports for the modified hydrophobic reagent.

[0023] Further, including:

[0024] The lower surface of the mixing chamber is provided with opposite baffles, and an air outlet is provided between the two baffles. A sponge is provided in the mixing chamber, and the sponge is a 35ppi porous sponge, so that the working gas and the modified hydrophobic reagent are fully contacted in the chamber and mixed evenly.

[0025] Further, including:

[0026] The modified hydrophobic agent adopts a small dose of hydrophobic agent.

[0027] Further, including:

[0028] The mixed gas includes: a working gas and a modified hydrophobic reagent, and the flow rate setting specifically includes: the working gas is argon gas, the flow rate is 1L / min, and the modified hydrophobic reagent is PDMS polydimethylsiloxane or HMDSO hexamethyldisiloxane, and the corresponding flow rate is 3-9mL / min.

[0029] Another aspect of the present invention provides a method for treating the surface of an insulator using a device for treating the surface of an insulator for hydrophobic modification using a wide-width plasma, the method comprising the following steps:

[0030] Step 1, assembling a device for wide-width plasma treatment of hydrophobic modification of insulator surface;

[0031] Step 2: Place the insulator to be processed under the insulating support unit, and adjust the position of the high-voltage electrode so that the distance between the high-voltage electrode and the ground electrode is appropriate;

[0032] Step 3, turning on the high-voltage pulse power supply, so that the high-voltage electrode and the ground electrode are dielectrically blocked to form a discharge area; wherein the pulse width is 0.6μs to 1μs, the discharge power is 20w to 50w, and the voltage amplitude is 8kV to 14kV;

[0033] Step 4: The mixed gas is set by the flow control unit and input into the gas supply unit to form a hydrophobic medium, and is deposited on the surface of the insulator to be treated under the dual action of plasma and airflow;

[0034] Step 5: Perform hydrophobic treatment on the surface of the insulator to be treated.

[0035] Further, including:

[0036] The method of making the distance between the high-voltage electrode and the ground electrode appropriate specifically includes: the distance between the insulator to be processed and the lower surface of the insulating support unit is not greater than 2 cm.

[0037] Beneficial effects: Compared with the prior art, the present invention has the following advantages:

[0038] (1) The present invention uses a small dose of hydrophobic reagent to avoid the use of a large amount of chemical reagents such as coating liquid, which is low in cost, energy-saving and environmentally friendly. At the same time, the hydrophobic modification has good uniformity, does not require a dust-free environment, and has good adaptability; and the present invention uses plasma modification technology to quickly achieve hydrophobic modification of insulators, with a short processing time and high efficiency. After the treatment, the surface of the insulator has a self-waterproof effect.

[0039] (2) The present invention is different from the traditional dielectric barrier discharge, and adopts the indirect discharge form to achieve wide-range hydrophobic modification similar to jets. The traditional dielectric barrier discharge can only perform material modification between two plate electrodes and cannot process complex shapes. This invention can process complex shapes.

[0040] (3) Compared with the existing dielectric barrier discharge, the device and method of the present invention greatly improve the processing efficiency of some complex hollow objects and objects with large curvature. The existing method cannot completely process narrow gaps, but this method can perfectly process narrow areas such as the gap between insulators to be processed, which is fast and convenient with a high processing rate;

[0041] (4) The present invention can be adjusted according to the surface characteristics of the object to be treated for flexible treatment. A 35ppi porous ventilation sponge is added inside the reactor so that the inert gas and the hydrophobic precursor can be fully contacted and evenly mixed in the reactor;

[0042] (5) The device and treatment method of the present invention not only improve the hydrophobicity and weather resistance of the insulator surface, but also effectively improve the insulation performance of the insulator surface according to experimental results, thereby achieving the improvement of multiple performances. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a schematic diagram of the structure of the device for hydrophobic modification of the surface of an insulator by wide-width plasma treatment according to the present invention;

[0044] Figure 2 is a schematic structural diagram of the air supply unit of the present invention;

[0045] Figure 3 It is a side view of the structure of the device for hydrophobic modification of the surface of an insulator by wide-width plasma treatment according to the present invention;

[0046] Figure 4 It is a schematic diagram of the use of the device for hydrophobic modification of the surface of an insulator by wide-width plasma treatment according to the present invention;

[0047] Figure 5 These are discharge image renderings of the device for treating hydrophobic modification of insulator surfaces with wide-width plasma according to the present invention, wherein the first one is a rendering with an insulator to be treated below, and the second and third ones are discharge renderings at different distances;

[0048] Figure 6 It is a relationship diagram between current, voltage and time of the device for hydrophobic modification of the surface of insulator by wide-width plasma treatment according to the present invention;

[0049] Figure 7 It is a comparison diagram of the test results of the water contact angle change of the untreated and treated samples in the present invention;

[0050] Figure 8It is a comparison diagram of the flashover voltage detected by sampling without treatment and after treatment according to the present invention;

[0051] Fig. 9 It is a comparison diagram of the changes in trap energy levels of the sampled insulators to be treated before and after the treatment of the present invention;

[0052] In the figure, 1-high voltage electrode; 2-ground electrode; 3-insulating support unit; 4-air supply unit; 5-treated insulator; 41-ventilation chamber; 42-mixing chamber; 421-sponge; 411-ventilation pipe; 422-baffle. DETAILED DESCRIPTION

[0053] In order to better understand the present invention, the technical solution of the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0054] Example 1

[0055] like Figure 1-4 As shown, the present invention proposes a device for hydrophobic modification of the surface of an insulator by wide-width plasma treatment, the device comprising a flow control unit and an insulating support unit 3, wherein the insulating support unit 3 is provided with a high-voltage pulse power supply, a high-voltage electrode 1, a grounding electrode 2 and a gas supply unit 3.

[0056] Before discharge, the flow control unit is used to input the mixed gas of the set flow into the gas supply unit to form a hydrophobic medium in order to obtain a wide-width plasma. The wide-width plasma refers to a plasma with a larger lateral dimension, which is a type of large-area plasma. The wide-width dielectric barrier discharge in the devices involved in the current prior art only introduces inert gas for discharge treatment such as cleaning or sterilization. There is no device that has been subjected to hydrophobic modification treatment. Therefore, the device of the present invention performs a wide-width indirect hydrophobic modification treatment, and the wide-width plasma can effectively solve the problem that the material being treated cannot be treated due to abnormal shape.

[0057] The set flow rate and the corresponding mixed gas specifically include:

[0058] The mixed gas includes: a working gas and a modified hydrophobic reagent. The flow rate setting specifically includes: the working gas is an inert gas, such as argon, helium, etc. In this embodiment, argon is used because of its low cost. The flow rate is set to 1L / min. The modified hydrophobic reagent selects PDMS polydimethylsiloxane or HMDSO hexamethyldisiloxane, and the corresponding flow rate is 3 to 9mL / min.

[0059] The high-voltage pulse power supply is used to apply high-voltage pulses to the high-voltage electrode 1, so that the high-voltage electrode 1 and the ground electrode 2 are dielectrically blocked to form a discharge area, thereby achieving hydrophobic treatment of the insulator; and the high-voltage electrode must ensure that there are no sharp corners at the edge but a smooth arc, and maintain a distance of 1 to 2 cm from the ground electrode.

[0060] Among them, the pulse width is set to 0.6μs~1μs, the discharge power is 20w~50w, and the voltage amplitude is 8kV~14kV; in this embodiment, the optimal set flow rate and related power supply parameters are: pulse width: 0.8μs, device discharge power: 30w, voltage amplitude: 12kV, argon: 1L / min, hydrophobic medium: 3~9ml / min.

[0061] Then, after the hydrophobic medium passes through the discharge area, it is deposited on the surface of the insulator to be treated under the dual action of plasma and airflow, and the insulator to be treated is placed under the insulating support unit. Specifically: the water medium passes into the discharge area of ​​the device, is broken and decomposed, and agglomerated and combined, and finally deposited on the surface of the material under the dual action of plasma and airflow.

[0062] In this embodiment, the distance between the insulator to be treated and the lower surface of the insulating support unit is no more than 2 cm. The device structure uses airflow to blow the active substances in the plasma out from between the high-voltage electrode and the ground electrode, and can perform hydrophobic treatment on the materials within 2 cm below the device. Compared with the traditional DBD and jet device structures, the treatment method is more flexible and the treatment efficiency is higher.

[0063] The device structure of the present invention separates the discharge area and the material processing area, and blows the plasma out of the discharge space through the airflow, thereby enabling wide-area plasma surface treatment to be applied to various complex shapes.

[0064] In addition, wide-width plasma hydrophobic treatment is not seen in the prior art, and its application in the surface treatment of insulating materials such as insulators is limited. In the structure of the present invention, a porous structure such as sponge is added to homogenize the airflow distribution, thereby greatly improving the uniformity of wide-width plasma hydrophobic treatment.

[0065] Furthermore, it includes: the air supply unit 4 includes a ventilation chamber 41 and a mixing chamber 42 arranged in sequence, the ventilation chamber 41 is provided with a plurality of vertically arranged ventilation holes, the ventilation holes are connected to the mixing chamber, and the working gas and the modified hydrophobic reagent are input into the mixing chamber 42 through the ventilation holes.

[0066] Furthermore, in this embodiment:

[0067] The ventilation cavity 41 includes three ventilation pipes 411 arranged side by side, wherein the middle ventilation pipe 411 serves as an inlet for the working gas, and the ventilation pipes on both sides serve as feed ports for the modified hydrophobic reagent, that is, the modified hydrophobic reagent is introduced through two ventilation holes, and the working gas is introduced through one ventilation hole.

[0068] Further, including:

[0069] The lower surface of the mixing chamber is provided with opposite baffles 422, and the outlet is between the two baffles 422. The mixing chamber is provided with a sponge 421, and the sponge is a 35ppi porous sponge, so that the working gas and the modified hydrophobic reagent are fully contacted and mixed in the chamber. That is, the working gas enters the discharge space composed of the high-voltage electrode, the ground electrode unit 1, and the insulating support unit 3 through the 35ppi ventilation sponge, meeting the specific atmosphere requirements of the discharge space.

[0070] Among them, the pore size of sponge is divided into large and small pores. The pore size from large pores to small pores is 5ppi, 10ppi, 15ppi, 18ppi, 20ppi, 25ppi, etc. PPI refers to the number of holes on one square inch. A 30ppi filter sponge means there are 30 small holes on one square inch. The larger the value, the smaller the pores. Generally, 15-20ppi refers to large pores, 25-30ppi refers to medium pores, and 35ppi and above refer to small pores. After experimental verification, it must be ensured that the air mixes evenly, so a 35ppi porous sponge is selected.

[0071] like Figure 5 As shown, it is a discharge image of a wide-width plasma device and method for hydrophobic modification of the surface of an insulator. The discharge image shows that this device has a uniform wide-width discharge. Wide-width plasma refers to plasma with a larger lateral dimension and is a type of large-area plasma.

[0072] The device of the present invention is designed to generate a plasma plume with a larger area outside the discharge space to increase the processing efficiency of plasma on the surface of insulating materials with complex shapes.

[0073] Figure 6 This is the discharge waveform of a wide-width plasma device used for hydrophobic modification of the insulator surface. The waveform shows that the device has stable discharge, a discharge voltage of 12kV, and a discharge current of 4A.

[0074] Figure 7 The water contact angle change diagram is taken for sampling and testing. It can be seen from the diagram that the water contact angle has been significantly improved, and the weather resistance has been improved. This result test diagram shows that after the device is treated, the treated insulator is sampled and tested to verify the effectiveness of the experimental device; the improvement of hydrophobicity mentioned above means this. The verification of hydrophobicity is verified by the water contact angle, that is, the larger the water contact angle, the better the hydrophobicity.

[0075] Figure 8 In order to sample and detect the flashover voltage change diagram, the surface flashover voltage of the insulator after treatment by this device is 10.2kV, and it is 9.5kV when not treated. The flashover voltage value is relatively discrete. After treatment, the surface flashover voltage increases by 7.3%. The surface flashover voltage value is relatively stable, without obvious and large changes.

[0076] Fig. 9 In order to sample and detect the change of surface trap energy level, the surface trap energy level of the insulator treated by this device becomes lower, the surface shallow traps increase, the surface charge binding capacity decreases, the charge cannot accumulate, the flashover is not easy to occur, and the flashover voltage increases. This is related to Figure 7 The results shown are consistent.

[0077] That is, after the plasma thin film deposition treatment, the surface will undergo physical and chemical reactions to deposit thin films to a certain extent. After the treatment, the trap energy level on the material surface gradually decreases, and the trap density also decreases significantly, which indicates that the plasma etching produces a large number of physical traps on the surface, which in turn promotes the increase of shallow surface traps. At this time, the plasma etching and the deposition of Si-containing groups produce a good synergistic effect.

[0078] Example 2

[0079] Another aspect of the present invention provides a method for treating the surface of an insulator using a device for treating the surface of an insulator for hydrophobic modification using a wide-width plasma, the method comprising the following steps:

[0080] Step 1, assembling a device for wide-width plasma treatment of hydrophobic modification of insulator surface;

[0081] Step 2: Place the insulator to be processed under the insulating support unit, and adjust the position of the high-voltage electrode so that the distance between the high-voltage electrode and the ground electrode is appropriate;

[0082] Step 3, turning on the high-voltage pulse power supply, so that the high-voltage electrode and the ground electrode are dielectrically blocked to form a discharge area; wherein the pulse width is 0.6μs to 1μs, the discharge power is 20w to 50w, and the voltage amplitude is 8kV to 14kV;

[0083] Step 4: The mixed gas is set by the flow control unit and input into the gas supply unit to form a hydrophobic medium, and is deposited on the surface of the insulator to be treated under the dual action of plasma and airflow;

[0084] Step 5: Perform hydrophobic treatment on the surface of the insulator to be treated.

[0085] Further, including:

[0086] The distance between the high-voltage electrode and the ground electrode is made appropriate, specifically including: the distance between the insulator to be processed and the lower surface of the insulating support unit is not greater than 2 cm.

[0087] The device structure uses airflow to blow active substances in the plasma out from between the high-voltage electrode and the ground electrode, and can perform hydrophobic treatment on materials within 2 cm below the device. Compared with traditional DBD and jet device structures, the treatment method is more flexible and the treatment efficiency is higher.

[0088] Other technical features of this method are similar to those of the corresponding device for wide-width plasma treatment of hydrophobic modification of insulator surface, and will not be described in detail here.

[0089] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0090] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if these modifications and variations of the embodiments of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A device for hydrophobic modification of insulator surface by wide-width plasma treatment, characterized in that: The device comprises a flow control unit and an insulating support unit, wherein a high-voltage pulse power supply, a high-voltage electrode, a grounding electrode and a gas supply unit are arranged in the insulating support unit; The flow control unit is used to input the mixed gas of the set flow into the gas supply unit to form a hydrophobic medium, and the high-voltage pulse power supply is used to apply a high-voltage pulse to the high-voltage electrode, so that the high-voltage electrode and the ground electrode are dielectrically blocked to form a discharge area; wherein the pulse width is 0.6 μs ~1 μs , the discharge power is 20 w ~50 w , the voltage amplitude is 8 kV ~14 kV The mixed gas includes: a working gas and a modified hydrophobic reagent, and the flow rate setting specifically includes: the working gas is argon, and the flow rate is 1L / min The modified hydrophobic reagent is PDMS polydimethylsiloxane or HMDSO hexamethyldisiloxane, and the corresponding flow rate is 3~9 mL / min ; After passing through the discharge area, the hydrophobic medium is deposited on the surface of the insulator to be treated under the dual action of plasma and airflow, and the insulator to be treated is placed under the insulating support unit; The distance between the insulator to be processed and the lower surface of the insulating support unit is not greater than 2 cm ; The ground electrode is a fixed-position electrode, the high-voltage electrode is an adjustable-position electrode, and the high-voltage electrode is a smooth arc. The distance between the high-voltage electrode and the ground electrode is set to 1-2 cm ; The air supply unit comprises a ventilation cavity and a gas mixing cavity which are arranged in sequence, wherein a plurality of vertically arranged ventilation holes are arranged in the ventilation cavity, and the ventilation holes are connected to the gas mixing cavity, and the working gas and the modified hydrophobic reagent are input into the gas mixing cavity through the ventilation holes; The lower surface of the mixing chamber is provided with opposite baffles, and the air outlet is between the two baffles. A sponge is provided in the mixing chamber, and the sponge is 35 ppi The porous sponge allows the working gas and the modified hydrophobic reagent to fully contact and mix evenly in the cavity.

2. The device for hydrophobic modification of insulator surface by wide-width plasma treatment according to claim 1, characterized in that: The ventilation cavity comprises three ventilation pipes arranged side by side, wherein the middle ventilation pipe serves as an inlet for the working gas, and the ventilation pipes on both sides serve as feed ports for the modified hydrophobic reagent.

3. A method for treating the surface of an insulator using the device for treating the surface of an insulator with wide-width plasma for hydrophobic modification according to claim 1 or 2, characterized in that: The method comprises the following steps: Step 1, assembling a device for wide-width plasma treatment of hydrophobic modification of insulator surface; Step 2: Place the insulator to be processed under the insulating support unit, and adjust the position of the high-voltage electrode so that the distance between the high-voltage electrode and the ground electrode is appropriate; Step 3, turn on the high-voltage pulse power supply, so that the high-voltage electrode and the ground electrode are dielectrically blocked to form a discharge area; wherein the pulse width is 0.6 μs ~1 μs , the discharge power is 20 w ~50 w , the voltage amplitude is 8 kV ~14 kV ; Step 4: The mixed gas is set by the flow control unit and input into the gas supply unit to form a hydrophobic medium, and is deposited on the surface of the insulator to be treated under the dual action of plasma and airflow; Step 5: Perform hydrophobic treatment on the surface of the insulator to be treated.

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