A lithographic ink and its preparation method

A modified fluorosilicone-based light-sensitive composition addresses the challenge of high resolution and precision in semiconductor manufacturing, enhancing pattern transfer and stability while reducing environmental impact.

CN118359960BActive Publication Date: 2025-07-15HUNAN HULIDA PAINT TECH
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Patent Information

Application Number
CN202410590992.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-05-13
Publication Date
2025-07-15
Estimated Expiration
2044-05-13

AI Technical Summary

Technical Problem

Existing photolithographic inks have insufficient resolution and accuracy in semiconductor manufacturing, making it difficult to meet the ever-increasing demand for integrated circuits.

Method used

Modified fluoropolysiloxane, polyether ether ketone and polybutylene terephthalate are used as main components, combined with environmentally friendly solvents, and photolithography inks are prepared through specific proportions and preparation methods to improve wetting, curing speed and stability.

Benefits of technology

It improves the resolution and accuracy of the lithographic ink, ensures the stability and accuracy of the pattern, and reduces the emission of volatile organic compounds, and meets environmental protection requirements.

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Abstract

The present invention provides a lithographic ink and a preparation method thereof. The lithographic ink of the present invention, by weight, comprises: modified fluorinated polysiloxane: 100 parts, polyether ether ketone: 10 parts to 30 parts, polybutylene terephthalate: 10 parts to 30 parts, photosensitizer: 5 parts to 10 parts, solvent: 10 parts to 200 parts. The preparation raw materials of the modified fluorinated polysiloxane are ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate. The lithographic ink of the present invention has excellent forming effect, ensuring the resolution and precision of the pattern. The present invention also provides a preparation method of the lithographic ink.
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Description

Technical Field

[0001] The present invention belongs to the field of lithography technology, and particularly relates to a lithographic ink and a preparation method thereof. Background Art

[0002] Lithography technology is a key process for manufacturing microelectronic devices. Its basic principle is to place a template called a mask above a silicon wafer covered with a photosensitive material (usually lithographic ink), and then irradiate the mask with a light source such as ultraviolet light or laser. The pattern is projected onto the surface of the photosensitive material through the light-transmitting part of the mask to form the required pattern. Lithographic ink acts as a medium for transferring the pattern in this process. Lithographic ink plays an important role in the semiconductor manufacturing process. It is widely used in the lithography technology in the semiconductor industry to transfer patterns onto silicon wafers or other semiconductor materials.

[0003] Lithographic ink usually consists of polymers, solvents, photosensitizers, etc. Among them, the polymer is the main component of the ink, which determines the viscosity, fluidity and other properties of the ink; the solvent is used to adjust the viscosity and drying speed of the ink; the photosensitizer enables the ink to cure after exposure.

[0004] Although lithographic ink plays a crucial role in semiconductor manufacturing, there are still some challenges and problems to be solved. One of the main problems is the resolution and accuracy of lithographic ink. As the size of integrated circuits continues to shrink, the requirements for higher resolution and more precise patterns are also increasing. Therefore, how to further improve the resolution and accuracy of lithographic ink to meet the ever-developing semiconductor manufacturing needs is one of the urgent problems to be solved at present. Summary of the Invention

[0005] The present invention aims to at least solve one of the above technical problems existing in the prior art. For this purpose, the present invention provides a lithographic ink with excellent forming effect, ensuring the resolution and accuracy of the pattern.

[0006] The present invention also provides a preparation method of the lithographic ink.

[0007] The first aspect of the present invention provides a lithographic ink, which comprises, by weight:

[0008] Modified fluorinated polysiloxane: 100 parts,

[0009] Polyetheretherketone: 10 parts to 30 parts,

[0010] Polybutylene terephthalate: 10 parts to 30 parts,

[0011] Photosensitizer: 5 parts to 10 parts,

[0012] Solvent: 10 parts to 200 parts,

[0013] The raw materials for preparing the modified fluorinated polysiloxane are ethyl fluoroacrylate, polyether-modified polydimethylsiloxane, and epoxy acrylate.

[0014] One technical solution in the technical solution of the photolithographic ink of the present invention has at least the following beneficial effects:

[0015] In the photolithographic ink of the present invention, the modified fluorinated polysiloxane has excellent surface tension and wettability, which helps to improve the coating uniformity of the ink on the surface of the silicon wafer, thereby achieving higher resolution and more accurate pattern transfer. The raw materials for preparing the modified fluorinated polysiloxane are ethyl fluoroacrylate, polyether-modified polydimethylsiloxane, and epoxy acrylate. Among them, ethyl fluoroacrylate has better optical properties and chemical stability, which can improve the wettability and corrosion resistance of the modified fluorinated polysiloxane in the photolithographic ink. Polyether-modified polydimethylsiloxane has better solubility and fluidity, which can enhance the dispersibility and coating performance of the modified fluorinated polysiloxane in the photolithographic ink. Epoxy acrylate has higher reactivity and curing speed, which can improve the curing efficiency and stability of the modified fluorinated polysiloxane in the photolithographic ink.

[0016] Secondly, polyether ether ketone and polybutylene terephthalate as the main polymer bases have low coefficient of linear expansion and good mechanical properties, which helps to maintain the stability and accuracy of the pattern.

[0017] Thirdly, the photosensitizer has a highly sensitive ultraviolet light response performance, which can achieve rapid curing in a short exposure time and improve the process efficiency.

[0018] Fourthly, polyether ether ketone and polybutylene terephthalate as the base polymers can be well compatible with the photosensitizer and promote the curing reaction.

[0019] Fifthly, the modified fluorinated polysiloxane has excellent high-temperature resistance and chemical stability, which can maintain the stability of the ink and the clarity of the pattern in a high-temperature environment, and at the same time improve the durability and reliability of the circuit board.

[0020] Sixthly, the photolithographic ink of the present invention uses an environmentally friendly solvent and has a low content in the formula, which helps to reduce the emission of volatile organic compounds, reduce environmental pollution, and meet the modern environmental protection requirements.

[0021] Ethyl fluoroacrylate is a fluorine-containing monomer, and its main function is to introduce fluorine elements into the polysiloxane chain, thereby enhancing the hydrophobicity and chemical corrosion resistance of polysiloxane. The fluorine group of ethyl fluoroacrylate has extremely strong electronegativity, which can reduce the surface energy of the modified polysiloxane, making it have good anti-adhesion and wettability. Polyether-modified polydimethylsiloxane is a kind of silicone polymer, and its main function is to thicken and enhance the viscosity and rheological properties of the modified fluorinated polysiloxane. Polyether modification can introduce a certain number of ether groups, improving the solubility and dispersibility of polysiloxane, so that it is more easily dispersed and coated in the ink, and improving the stability and adhesion of the ink. Epoxy acrylate is an epoxy-functional monomer, and its main function is to form a cross-linked structure through an epoxidation reaction with ethyl fluoroacrylate and polyether-modified polydimethylsiloxane, thereby enhancing the wear resistance and mechanical strength of the modified fluorinated polysiloxane. The epoxidation reaction can also promote the curing and hardening process of the modified polysiloxane, improving the durability and stability of the ink.

[0022] The modified fluorinated polysiloxane prepared from ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate. The fluorine element introduced by ethyl fluoroacrylate enhances the hydrophobicity of the modified polysiloxane, making it have good wettability and anti-adhesion, which is beneficial to the coating and curing of the ink on the silicon wafer surface. And polyether-modified polydimethylsiloxane improves the viscosity and rheological properties of the modified polysiloxane, helps to adjust the fluidity and stability of the ink, and improves the uniformity and accuracy of the ink in the lithography process. The cross-linked structure of epoxy acrylate enhances the hardness and durability of the modified polysiloxane, helps to improve the curing speed and surface hardness of the ink, and thus realizes higher-quality lithography patterns.

[0023] According to some embodiments of the present invention, the mass ratio of ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate is 1-3:1-3:1.

[0024] According to some embodiments of the present invention, the preparation method of the modified fluorinated polysiloxane includes the step of mixing and reacting the ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate in the presence of a catalyst.

[0025] According to some embodiments of the present invention, the temperature of the reaction is 25°C to 50°C.

[0026] According to some embodiments of the present invention, the reaction time is 8h to 12h.

[0027] According to some embodiments of the present invention, the catalyst includes at least one of dibutyltin dilaurate, sodium hydroxide and hydrogen peroxide.

[0028] According to some embodiments of the present invention, the preparation method of the modified fluorinated polysiloxane is as follows:

[0029] (1) Pretreatment of ethyl fluoroacrylate:

[0030] In a dry reaction vessel, add ethyl fluoroacrylate and remove moisture through a desiccant to ensure the dry purity of ethyl fluoroacrylate.

[0031] (2) Preparation of reaction solution:

[0032] Add polyether-modified polydimethylsiloxane and epoxy acrylate to ethyl fluoroacrylate according to the ratio, and add a small amount of dichloromethane as a solvent to maintain the fluidity of the reaction solution.

[0033] (3) Addition of catalyst:

[0034] Add an appropriate amount of dibutyltin dilaurate as a catalyst to the reaction solution to promote the reaction.

[0035] (4) Reaction:

[0036] Seal the reaction vessel and carry out stirring and heating reactions at an appropriate temperature. The reaction temperature is generally between room temperature and 50 °C, and the reaction time is 8 h to 12 h.

[0037] (5) Removal of solvent:

[0038] After the reaction is completed, remove the solvent by distillation or volatilization to concentrate the reaction product.

[0039] (6) Purification:

[0040] Subject the obtained product to purification steps such as filtration or solidification and washing to remove unreacted impurities.

[0041] (7) Drying:

[0042] Finally, dry the purified modified fluorinated polysiloxane product to remove residual solvent and moisture to obtain the final product.

[0043] According to some embodiments of the present invention, the addition amount of the catalyst dibutyltin dilaurate is 0.1 wt% to 0.5 wt% of the total amount of ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate.

[0044] According to some embodiments of the present invention, the photosensitizer includes one of PI-784, PI-1173 and PI-369.

[0045] According to some embodiments of the present invention, the solvent includes at least one of acetone, isopropyl alcohol and ethyl acetate.

[0046] The second aspect of the present invention provides a method for preparing a lithographic ink, which includes the step of first mixing the modified fluorinated polysiloxane, polyetheretherketone, and polybutylene terephthalate, and then adding the photosensitizer and solvent and mixing them evenly.

[0047] A technical solution in the method for preparing a lithographic ink according to the present invention has at least the following beneficial effects:

[0048] The preparation method of the present invention does not require expensive equipment and complex process control, the reaction conditions are not harsh, the raw materials are easily available, the production cost is low, and it is easy to industrialize production. Specifically:

[0049] By first mixing the modified fluorinated polysiloxane, polyetheretherketone, and polybutylene terephthalate, the full dissolution and uniform dispersion of these solid components can be promoted. This helps to ensure the consistency and stability of the ink components and avoid the aggregation or precipitation of solid particles. Adding the photosensitizer and solvent to the mixture of solid components can more easily control the properties such as the viscosity, fluidity, and drying speed of the ink, which helps to adjust the printing performance of the ink and make it suitable for different printing equipment and process requirements.

[0050] By adding the photosensitizer and solvent after mixing the solid components, the preparation process can be simplified, the production links can be reduced, and the production efficiency can be improved. This helps to reduce the preparation cost and improve the production quantity and quality stability of the ink. The preparation method of the present invention can more flexibly adjust the formula and performance of the ink and make adjustments according to specific printing requirements and application needs. For example, the ratio of the photosensitizer and solvent can be adjusted as needed to achieve different curing speeds and lithography precisions. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 is an optical micrograph of the two-photon polymerization test of the ink prepared in Example 1. DETAILED DESCRIPTION OF THE INVENTION

[0052] The following are specific examples of the present invention, and the technical solutions of the present invention are further described in combination with the examples, but the present invention is not limited to these examples.

[0053] In some embodiments of the first aspect, the present invention provides a lithographic ink, which includes, by weight:

[0054] Modified fluorinated polysiloxane: 100 parts,

[0055] Polyetheretherketone: 10 parts to 30 parts,

[0056] Polybutylene terephthalate: 10 parts to 30 parts,

[0057] Photosensitizer: 5 parts to 10 parts,

[0058] Solvent: 10 parts to 200 parts,

[0059] The raw materials for preparing the modified fluorinated polysiloxane are ethyl fluoroacrylate, polyether-modified polydimethylsiloxane, and epoxy acrylate.

[0060] It should be noted that in the lithographic ink of the present invention, the modified fluorinated polysiloxane has excellent surface tension and wettability, which helps to improve the coating uniformity of the ink on the surface of the silicon wafer, thereby achieving higher resolution and more accurate pattern transfer. The raw materials for preparing the modified fluorinated polysiloxane are ethyl fluoroacrylate, polyether-modified polydimethylsiloxane, and epoxy acrylate. Among them, ethyl fluoroacrylate has better optical properties and chemical stability, which can improve the wettability and corrosion resistance of the modified fluorinated polysiloxane in the lithographic ink. Polyether-modified polydimethylsiloxane has better solubility and fluidity, which can enhance the dispersibility and coating performance of the modified fluorinated polysiloxane in the lithographic ink. Epoxy acrylate has higher reactivity and curing speed, which can improve the curing efficiency and stability of the modified fluorinated polysiloxane in the lithographic ink.

[0061] Secondly, polyetheretherketone and polybutylene terephthalate as the main polymer bases have low coefficient of linear expansion and good mechanical properties, which helps to maintain the stability and accuracy of the pattern.

[0062] Thirdly, the photosensitizer has highly sensitive ultraviolet light response performance, which can achieve rapid curing in a short exposure time and improve the process efficiency.

[0063] Fourthly, polyetheretherketone and polybutylene terephthalate as the base polymers can be well compatible with the photosensitizer and promote the curing reaction.

[0064] Fifthly, the modified fluorinated polysiloxane has excellent high-temperature resistance and chemical stability, which can maintain the stability of the ink and the clarity of the pattern in a high-temperature environment, and at the same time improve the durability and reliability of the circuit board.

[0065] Sixthly, the lithographic ink of the present invention selects an environmentally friendly solvent and has a low content in the formula, which helps to reduce the emission of volatile organic compounds, reduce environmental pollution, and meet modern environmental protection requirements.

[0066] Ethyl fluoroacrylate is a fluorinated monomer, and its main function is to introduce fluorine elements into the polysiloxane chain, thereby enhancing the hydrophobicity and chemical corrosion resistance of polysiloxane. The fluorine group of ethyl fluoroacrylate has extremely strong electronegativity, which can reduce the surface energy of the modified polysiloxane, making it have good anti-adhesion and wettability. Polyether-modified polydimethylsiloxane is a kind of silicone polymer, and its main function is to thicken and enhance the viscosity and rheological properties of the modified fluorinated polysiloxane. Polyether modification can introduce a certain number of ether groups, improving the solubility and dispersibility of polysiloxane, so that it is more easily dispersed and coated in the ink, and improving the stability and adhesion of the ink. Epoxy acrylate is an epoxy-functional monomer, and its main function is to form a cross-linked structure by undergoing an epoxidation reaction with ethyl fluoroacrylate and polyether-modified polydimethylsiloxane, thereby enhancing the wear resistance and mechanical strength of the modified fluorinated polysiloxane. The epoxidation reaction can also promote the curing and hardening process of the modified polysiloxane, improving the durability and stability of the ink.

[0067] The modified fluorinated polysiloxane prepared from ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate. The fluorine elements introduced by ethyl fluoroacrylate enhance the hydrophobicity of the modified polysiloxane, making it have good wettability and anti-adhesion, which is beneficial to the coating and curing of the ink on the silicon wafer surface. And polyether-modified polydimethylsiloxane improves the viscosity and rheological properties of the modified polysiloxane, helping to adjust the fluidity and stability of the ink, and improving the uniformity and precision of the ink during the lithography process. The cross-linked structure of epoxy acrylate enhances the hardness and durability of the modified polysiloxane, helping to increase the curing speed and surface hardness of the ink, so as to achieve higher-quality lithography patterns.

[0068] Combined with the first aspect, in some embodiments of the present invention, the mass ratio of ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate is 1-3:1-3:1.

[0069] Combined with the first aspect, in some embodiments of the present invention, the preparation method of the modified fluorinated polysiloxane includes the step of mixing and reacting ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate in the presence of a catalyst.

[0070] Combined with the first aspect, in some embodiments of the present invention, the reaction temperature is 25°C to 50°C.

[0071] Combined with the first aspect, in some embodiments of the present invention, the reaction time is 8h to 12h.

[0072] Combined with the first aspect, in some embodiments of the present invention, the catalyst includes at least one of dibutyltin dilaurate, sodium hydroxide and hydrogen peroxide.

[0073] In combination with the first aspect, in some embodiments of the present invention, the preparation method of the modified fluorinated polysiloxane is as follows:

[0074] (1) Pretreat ethyl fluoroacrylate:

[0075] In a dry reaction vessel, add ethyl fluoroacrylate and remove moisture through a desiccant to ensure the dry purity of ethyl fluoroacrylate.

[0076] (2) Prepare the reaction solution:

[0077] Add polyether-modified polydimethylsiloxane and epoxy acrylate to ethyl fluoroacrylate according to the ratio, and add a small amount of dichloromethane as a solvent to maintain the fluidity of the reaction solution.

[0078] (3) Add a catalyst:

[0079] Add an appropriate amount of dibutyltin dilaurate as a catalyst to the reaction solution to promote the reaction.

[0080] (4) React:

[0081] Seal the reaction vessel and carry out stirring and heating reactions at an appropriate temperature. The reaction temperature is generally between room temperature and 50 °C, and the reaction time is 8 h to 12 h.

[0082] (5) Remove the solvent:

[0083] After the reaction is completed, remove the solvent by distillation or volatilization to concentrate the reaction product.

[0084] (6) Purify:

[0085] Subject the obtained product to purification steps such as filtration or coagulation, washing, etc. to remove unreacted impurities.

[0086] (7) Dry:

[0087] Finally, dry the purified modified fluorinated polysiloxane product to remove residual solvent and moisture to obtain the final product.

[0088] In combination with the first aspect, in some embodiments of the present invention, the addition amount of the catalyst dibutyltin dilaurate is 0.1 wt% to 0.5 wt% of the total amount of ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate.

[0089] In combination with the first aspect, in some embodiments of the present invention, the photosensitizer includes one of PI-784, PI-1173 and PI-369.

[0090] In combination with the first aspect, in some embodiments of the present invention, the solvent includes at least one of acetone, isopropyl alcohol and ethyl acetate.

[0091] In a second aspect, in some embodiments of the present invention, a method for preparing a lithographic ink is provided, which includes the step of first mixing a modified fluorinated polysiloxane, a polyetheretherketone, and a polybutylene terephthalate, and then adding a photosensitizer and a solvent and mixing them evenly.

[0092] It can be understood that the preparation method of the present invention does not require expensive equipment and complex process control, the reaction conditions are not harsh, the raw materials are easily available, the production cost is low, and it is easy to industrialize production. Specifically:

[0093] By first mixing the modified fluorinated polysiloxane, the polyetheretherketone, and the polybutylene terephthalate, the full dissolution and uniform dispersion of these solid components can be promoted. This helps to ensure the consistency and stability of the ink components and avoid the aggregation or precipitation of solid particles. Adding the photosensitizer and the solvent to the mixture of the solid components can more easily control the properties such as the viscosity, fluidity, and drying speed of the ink, which helps to adjust the printing performance of the ink and make it adapt to different printing equipment and process requirements.

[0094] By adding the photosensitizer and the solvent after mixing the solid components, the preparation process can be simplified, the production links can be reduced, and the production efficiency can be improved. This helps to reduce the preparation cost and improve the production volume and quality stability of the ink. The preparation method of the present invention can more flexibly adjust the formula and performance of the ink and make adjustments according to specific printing requirements and application needs. For example, the ratio of the photosensitizer and the solvent can be adjusted as needed to achieve different curing speeds and lithography accuracies.

[0095] Next, the technical solution of the present invention will be better understood by combining specific embodiments.

[0096] Unless otherwise specifically stated, various raw materials, reagents, instruments, and equipment used in the present invention can be obtained through market purchase or prepared by existing methods.

[0097] Example 1

[0098] A kind of lithographic ink, in parts by weight, the raw materials are:

[0099] Modified fluorinated polysiloxane: 100 parts,

[0100] Polyetheretherketone: 10 parts,

[0101] Polybutylene terephthalate: 10 parts,

[0102] Photosensitizer: 5 parts,

[0103] Solvent: 100 parts,

[0104] Among them, the modified fluorinated polysiloxane is prepared from ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate with a mass ratio of 2:3:1. The specific preparation method is as follows:

[0105] (1) Pretreat ethyl fluoroacrylate:

[0106] In a dry reaction vessel, add ethyl fluoroacrylate and remove moisture through a desiccant to ensure the dry purity of ethyl fluoroacrylate.

[0107] (2) Prepare the reaction solution:

[0108] Add polyether-modified polydimethylsiloxane and epoxy acrylate to ethyl fluoroacrylate according to the ratio, and add dichloromethane as a solvent to maintain the fluidity of the reaction solution.

[0109] (3) Add a catalyst:

[0110] Add dibutyltin dilaurate as a catalyst to the reaction solution to promote the reaction.

[0111] (4) React:

[0112] Seal the reaction vessel and carry out stirring and heating reactions at an appropriate temperature. The reaction temperature is 40 °C and the reaction time is 10 h.

[0113] (5) Remove the solvent:

[0114] After the reaction is completed, remove the solvent by distillation or volatilization to concentrate the reaction product.

[0115] (6) Purify:

[0116] Subject the obtained product to purification steps such as filtration or solidification and washing to remove unreacted impurities.

[0117] (7) Dry:

[0118] Finally, dry the purified modified fluorinated polysiloxane product to remove residual solvent and moisture to obtain the final product.

[0119] The addition amount of the catalyst dibutyltin dilaurate is 2 wt% of the total amount of ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate.

[0120] The photosensitizer is PI-784.

[0121] The solvent is ethyl acetate.

[0122] The preparation method of the lithographic ink is as follows: First, mix the modified fluorinated polysiloxane, polyether ether ketone and polybutylene terephthalate, and then add the photosensitizer and the solvent and mix well.

[0123] Example 2

[0124] The difference from Example 1 is that the raw material contents of the ink are different, specifically:

[0125] Modified fluorinated polysiloxane: 100 parts,

[0126] Polyetheretherketone: 20 parts,

[0127] Polybutylene terephthalate: 20 parts,

[0128] Photosensitizer: 5 parts,

[0129] Solvent: 100 parts.

[0130] Example 3

[0131] The difference from Example 1 is that the raw material contents of the ink are different, specifically:

[0132] Modified fluorinated polysiloxane: 100 parts,

[0133] Polyetheretherketone: 30 parts,

[0134] Polybutylene terephthalate: 30 parts,

[0135] Photosensitizer: 10 parts,

[0136] Solvent: 200 parts.

[0137] Comparative Example 1

[0138] The difference from Example 1 is that the modified fluorinated polysiloxane in it is replaced by polyether-modified polydimethylsiloxane (Dayi brand, serial number DY-ET348).

[0139] Comparative Example 2

[0140] The difference from Example 1 is that in the preparation raw materials of the modified fluorinated polysiloxane in it, the mass ratio of ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate is 1:1:3.

[0141] Performance Test

[0142] The surface tension and dynamic contact angle of the lithographic inks prepared in Examples 1 to 3 and Comparative Examples 1 and 2 were measured using a KF100 full-automatic surface tension meter for watches. 0.5 μL of the lithographic inks prepared in Examples 1 to 3 and Comparative Examples 1 and 2 was dropped on a silicon wafer, and the contact angle of the ink composition was measured 100 ms and 5100 ms after the ink adhered to the silicon wafer. The measurement was carried out under the conditions of 25 °C and 50% humidity. Ion-exchanged water was measured under the same measurement conditions for the dynamic surface tension as that of the ink. The value of this silicon wafer was 80° at 100 msec and 76° at 5100 msec. The results are shown in Table 1.

[0143] Table 1

[0144] 100msec 5100msec Tension / mN / m Example 1 18 5 128 Example 2 20 7 125 Example 3 21 7 123 Comparative Example 1 42 18 130 Comparative Example 2 25 10 135 Ion-exchanged water 80° 76° 73

[0145] In Comparative Example 1, polyether-modified polydimethylsiloxane was used, and the wettability of the ink was significantly reduced. Since polydimethylsiloxane has a certain viscosity and surface tension, adding polydimethylsiloxane will slightly increase the tension of the ink.

[0146] In the preparation raw materials of the modified fluorosilicone in Comparative Example 2, the mass ratio of ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate was 1:1:3. Epoxy acrylate has a relatively high molecular weight and viscosity, and adding an excessive amount will increase the tension of the ink. In contrast, ethyl fluoroacrylate and polyether-modified polydimethylsiloxane usually have good wettability, but if the ratio with epoxy acrylate is unbalanced, the wettability will decrease.

[0147] The two-photon polymerization test was carried out on the ink prepared in Example 1. The three-dimensional structure used was a conventional wooden stick stack structure, the laser power was 50 mW, the scanning speed was 5000 μm / s, the wavelength was 780 ± 10 nm, and the repetition frequency was 80 MHz. Its optical micrograph is as Figure 1 shown. It can be seen that the ink prepared in Example 1 has excellent molding effects, ensuring the resolution and accuracy of the pattern.

[0148] The present invention has been described in detail above in combination with the embodiments. However, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the scope of knowledge possessed by those of ordinary skill in the art.

Claims

1. A lithographic ink, characterized in that, By weight parts, it includes: Modified fluorinated polysiloxane: 100 parts, Polyetheretherketone: 10 parts to 30 parts, Polybutylene terephthalate: 10 parts to 30 parts, Photosensitizer: 5 parts to 10 parts, Solvent: 10 parts to 200 parts, The preparation raw materials of the modified fluorinated polysiloxane are ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate; The mass ratio of the ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate is 2:3:1; The modified fluorinated polysiloxane is prepared by the following method: mixing and reacting the ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate in the presence of a catalyst, and the catalyst is dibutyltin dilaurate, sodium hydroxide and hydrogen peroxide.

2. The lithographic ink according to claim 1, characterized in that, The temperature of the reaction is 25°C to 50°C.

3. The lithographic ink according to claim 1, characterized in that, The time of the reaction is 8h to 12h.

4. The photolithographic ink according to claim 1, characterized in that, The addition amount of the catalyst is 0.1wt% to 0.5wt% of the total amount of ethyl fluoroacrylate, polyether-modified polydimethylsiloxane and epoxy acrylate.

5. The lithographic ink according to claim 1, characterized in that, The photosensitizer includes one of PI-784, PI-1173 and PI-369.

6. The photolithographic ink according to claim 1, characterized in that, The solvent includes at least one of acetone, isopropyl alcohol and ethyl acetate.

7. A method for preparing a lithographic ink according to any one of claims 1 to 6, characterized in that, It includes the step of first mixing the modified fluorinated polysiloxane, polyetheretherketone and polybutylene terephthalate, and then adding the photosensitizer and solvent and mixing evenly.

Citation Information

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