Encapsulation substrate, manufacturing method thereof, and substrate structure

Abstract

The present invention provides a packaging substrate, a manufacturing method thereof, and a substrate structure. The packaging substrate includes a core layer, a first circuit layer disposed on the core layer, a first target bar code disposed on the core layer, an additional layer portion disposed on the core layer, and a second target bar code combined with the additional layer portion. Therefore, all process flow records of a single packaging substrate can be traced by means of the first and second target bar codes.

Description

Technical Field

[0001] The present invention relates to a semiconductor packaging substrate, and more particularly to a substrate structure with a two-dimensional barcode pattern, a manufacturing method thereof, and a packaging substrate. Background Art

[0002] Currently, in the production of packaging substrates, product data such as product part numbers, production lot numbers, production dates, etc. are formed only at the outermost board edge position of the packaging substrate after circuit processing.

[0003] As Figure 1A shown, on the existing packaging substrate 9, a solder mask layer 93 is formed on the outermost circuit layer 92 of the substrate body 90, and then a product data pattern 91 is made on the solder mask layer 93 by laser ablation or inkjet printing (as Figure 1B shown).

[0004] However, when a certain batch of products needs to be traced and failure analysis operations are required during the final inspection before shipment (or when functional problems occur after shipment), it is often difficult to identify which machine (such as the process) or which production line made a mistake on that day. Therefore, it is impossible to remove the packaging substrates 9 with potential risks, resulting in the scrapping of the entire batch of packaging substrates on that day. Thus, full-process quality control of the automated production management system cannot be achieved.

[0005] Furthermore, making the product data pattern 91 by laser ablation or inkjet printing not only increases the costs of equipment and labor, but also has a long manufacturing time, and even poor clarity, resulting in difficult identification by the reading device.

[0006] In addition, in the subsequent packaging process of the existing packaging substrate 9, the product data pattern 91 on the removal area S at the board edge is cut off together during the singulation operation. Therefore, the relevant data of the packaging substrate 9 cannot be traced during the packaging process.

[0007] Therefore, how to overcome the above-mentioned various problems of the existing technology has actually become an urgent issue to be solved at present. Summary of the Invention

[0008] In view of the above-mentioned various defects of the existing technology, the present invention provides a substrate structure, a manufacturing method thereof, and a packaging substrate, which can at least partially solve the problems of the existing technology.

[0009] The packaging substrate of the present invention includes: a core layer; a first circuit layer disposed on the core layer; a first target barcode disposed on the core layer; a build-up portion disposed on the core layer and including at least one insulating layer and a second circuit layer formed on the insulating layer and electrically connected to the first circuit layer; and a second target barcode disposed on the insulating layer.

[0010] In the foregoing packaging substrate, the first and / or second target barcode is a two-dimensional barcode pattern.

[0011] The present invention also provides a substrate structure, comprising: a core layer, which defines at least one wiring area and a non-wiring area adjacent to the wiring area, and a first reference bar code is formed on the non-wiring area, and a first circuit layer and a first target bar code are formed on the wiring area; and an additional layer part, which is arranged on the core layer and comprises at least one insulating layer and a second circuit layer formed on the insulating layer and electrically connected to the first circuit layer, and a second target bar code and a second reference bar code are further formed on the insulating layer, wherein the second target bar code is correspondingly located on the wiring area, and the second reference bar code is correspondingly located on the non-wiring area.

[0012] In the foregoing substrate structure, the first and / or second target bar code is a two-dimensional bar code pattern.

[0013] In the foregoing substrate structure, the first and / or second reference bar code is a two-dimensional bar code pattern.

[0014] The present invention further provides a method for manufacturing a packaging substrate, comprising: providing a core layer, which defines at least one wiring area and a non-wiring area adjacent to the wiring area; forming a first reference bar code on the non-wiring area of the core layer; forming a first reference bar code covering the first reference bar code on the non-wiring area, and forming a first circuit layer and a first target bar code on the wiring area; and forming an additional layer part on the core layer, the additional layer part comprises at least one insulating layer having a second reference bar code and a second circuit layer formed on the insulating layer and electrically connected to the first circuit layer, and when forming the second circuit layer, a second target bar code is formed at a position corresponding to the wiring area of the insulating layer, and a second reference bar code covering the second reference bar code is formed on the insulating layer corresponding to the non-wiring area.

[0015] In the foregoing method, the first and / or second reference bar code is manufactured by means of laser ablation.

[0016] In the foregoing method, the first and / or second reference bar code is manufactured by means of etching a metal material.

[0017] In the foregoing method, the first and / or second target bar code is manufactured by means of etching a metal material.

[0018] In the foregoing method, it further comprises removing the non-wiring area of the core layer and the structures thereon.

[0019] As can be seen from the above, in the packaging substrate and the manufacturing method thereof of the present invention, mainly by using highly recognizable bar code patterns as the first and second target bar codes to track all process records of a single packaging substrate, therefore, compared with the prior art, the first and second target bar codes can be used as production record tracking of the packaging substrate before and after shipment, so as to facilitate the operation of troubleshooting defects, and thus it can realize uploading the product identification of all processes to the production management system for automatic quality control operation.

[0020] Furthermore, since the circuit layer and the target bar code are formed simultaneously in the same layer process in the encapsulation substrate, there is no need to fabricate the target bar code by laser ablation after the circuit layer is fabricated. Therefore, compared with the prior art, the manufacturing method of the present invention can significantly save the process time.

[0021] In addition, by fabricating bar code patterns (the first and second target bar codes or the first and second reference bar codes) in each layer in the substrate structure, the problem that the first and second reference bar codes cannot be recognized due to being blurred after electroplating the metal layer can be effectively avoided. Moreover, even if the non-wiring area is cut off through the singulation operation, in the subsequent encapsulation process, the relevant data of the encapsulation substrate can still be traced through the first and second target bar codes in the substrate structure or the encapsulation substrate. Description of the Drawings

[0022] Figure 1A is a schematic cross-sectional view of a conventional flip-chip semiconductor package.

[0023] Figure 1B is Figure 1A a partially enlarged schematic view of

[0024] Figures 2A to 2F is a schematic cross-sectional view of the first embodiment of the manufacturing method of the electronic package of the present invention, wherein Figure 2A-1 is a schematic view of the substrate structure.

[0025] Figure 2E-1 is Figure 2E a top view schematic of other embodiments of

[0026] The reference numerals are as follows:

[0027] 1 Substrate structure

[0028] 1a Substrate part

[0029] 10 Core layer

[0030] 100 Conductive through hole

[0031] 11 First reference bar code

[0032] 12 First circuit layer

[0033] 13 First target bar code

[0034] 14, 24, 34 Metal layer

[0035] 15 First reference bar code

[0036] 2, 9 Encapsulation substrate

[0037] 2a Build-up part

[0038] 20,30 Insulation layer

[0039] 21,31 Second reference bar code

[0040] 22,32 Second circuit layer

[0041] 220,320 Conductive blind hole

[0042] 23,33 Second target bar code

[0043] 25,35 Second control bar code

[0044] 90 Substrate body

[0045] 91 Product data pattern

[0046] 92 Circuit layer

[0047] 93 Solder mask layer

[0048] A1, A2, A3 Wiring areas

[0049] B1, B2, B3 Non - wiring areas

[0050] S Removal area Detailed implementation manner

[0051] The following illustrates the implementation manners of the present invention through specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0052] It should be noted that the structures, ratios, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented. Therefore, they do not have technical essence. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present invention. At the same time, the terms such as "upper", "first", "second", and "one" cited in this specification are only for the convenience of clear narration and are not used to limit the scope under which the present invention can be implemented. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope within which the present invention can be implemented.

[0053] Figures 2A to 2F It is a cross - sectional schematic view of the manufacturing method of the packaging substrate 2 of the present invention.

[0054] As Figure 2A shown, at least one wiring area A1 and a non - wiring area B1 adjacent to the wiring area A1 are defined on opposite sides of an insulating material core layer 10, and a first reference bar code 11 is formed on the non - wiring area B1.

[0055] In this embodiment, the core layer 10 is of a substrate specification, such as a rectangular plate body. The non-wiring area B1 surrounds the wiring area A1, and a plurality of substrate portions 1a are defined within the wiring area A1, such as Figure 2A-1 as shown. For example, the wiring area A1 includes three substrate portions 1a to form a substrate strip, and a plurality of wiring areas A1 arranged in an array and separated from each other are disposed on the core layer 10.

[0056] Furthermore, the first reference barcode 11 is of a two-dimensional (2D) barcode specification, and square dots or circular dot two-dimensional barcodes are made by laser ablation. For example, the access data of the first reference barcode 11 records all current processing procedures of the core layer 10.

[0057] such as Figure 2B as shown, a computer (not shown) of a processing device first obtains the access data of the first reference barcode 11 by scanning, and then performs a patterning process to form a metal layer 14 on opposite sides of the core layer 10. Then, a first circuit layer 12 and at least one first target barcode 13 are formed on the wiring area A1 by means of the metal layer 14, and the first reference barcode 11 is covered on the non-wiring area B1 by means of the metal layer 14 to form a first control barcode 15 corresponding to the first reference barcode 11 on the metal layer 14 of the non-wiring area B1.

[0058] In this embodiment, the first circuit layer 12 and the first target barcode 13 are formed on each of the substrate portions 1a, and the first circuit layer 12 adopts a Redistribution layer (RDL) specification. For example, the first circuit layer 12, the first target barcode 13, and the metal layer 14 are made of a metal material such as copper, so that when the first circuit layer 12 is made by Tenting (or MSAP), the first target barcode 13 is etched and made together, and at least one conductive via 100 is formed in the wiring area A1 of the core layer 10 to electrically connect the first circuit layers 12 on opposite sides of the core layer 10.

[0059] Furthermore, the first target barcode 13 and the first control barcode 15 are of a two-dimensional (2D) barcode specification of square dots or circular dot two-dimensional barcodes, so that the access data of the first control barcode 15 is the same as the access data of the first target barcode 13. For example, the first target barcode 13 records all relevant processing procedure records of the first circuit layer 12 (including the access data of the first reference barcode 11) to trace all current processing procedures of the substrate portion 1a. Among them, the access data of the first target barcode 13 includes blanking, drilling, pre-treatment of copper plating, copper plating, electroplating, pre-treatment of the circuit, covering a photoresist such as dry film, exposure, development, etching, stripping, or others (such as the access data of the first reference barcode 11), etc.

[0060] In addition, the position of the first reference barcode 11 overlaps with the position of the first comparison barcode 15. For example, since the first reference barcode 11 is covered by the metal layer 14, it is difficult for the barcode scanning device to identify the first reference barcode 11. Therefore, during the patterning process of the first circuit layer 12, the metal layer 14 can be etched to form the first comparison barcode 15 at the position of the first reference barcode 11 through processes such as exposure, development, etching, and stripping film.

[0061] It should be understood that while manufacturing the first comparison barcode 15, the first target barcode 13 can be simultaneously formed on all substrate portions 1a in the wiring area A1. Therefore, both the first comparison barcode 15 and the first target barcode 13 can be etched and manufactured using circuit processes, without the need for laser ablation.

[0062] As Figure 2C shown, the computer (not shown in the figure) of the processing device first obtains the access data of the first comparison barcode 15 in a scanning manner (such as X-ray reading), and then performs a circuit build-up operation to form an insulating layer 20 covering the first circuit layer 12 on opposite sides of the core layer 10. And according to the wiring area A1 and the non-wiring area B1 defined by the core layer 10, at least one wiring area A2 and a non-wiring area B2 adjacent to the wiring area A2 are defined at the overlapping positions of each insulating layer 20. Then, a second reference barcode 21 is formed on the non-wiring area B2 of the insulating layer 20.

[0063] In this embodiment, the material for forming the insulating layer 20 is such as polyimide (PI for short), polybenzoxazole (PBO for short), prepreg (PP for short), Ajinomotobuild-up film (ABF for short), or other dielectric materials.

[0064] Furthermore, the second reference barcode 21 is a two-dimensional (2D) barcode with a square dot or circular dot two-dimensional barcode specification, which is manufactured by laser ablation. For example, the access data of the second reference barcode 21 records all the current processing flows of the insulating layer 20, which includes the access data of the first comparison barcode 15.

[0065] As Figure 2DAs shown, the computer (not shown in the figure) of the processing equipment first obtains the access data of the second reference barcode 21 in a scanning manner, and then performs a patterning process to form another metal layer 24 on opposite sides of the insulating layer 20. Then, a second circuit layer 22 and at least one second target barcode 23 are formed on the wiring area A2 of the insulating layer 20 by means of the metal layer 24 to form an additional layer portion 2a, and the second reference barcode 21 is covered by the metal layer 24 on the non-wiring area B2 of the insulating layer 20 to form a second comparison barcode 25 corresponding to the second reference barcode 21 on the metal layer 24 on the non-wiring area B2 of the insulating layer 20.

[0066] In this embodiment, the second circuit layer 22 and the second target barcode 23 are formed on each of the substrate portions 1a corresponding to the insulating layer 20, and the second circuit layer 22 adopts the Redistribution layer (RDL) specification. For example, the second circuit layer 22, the second target barcode 23, and the metal layer 24 are made of a metal material such as copper, so that when the second circuit layer 22 is fabricated, the second target barcode 23 is etched and fabricated together, and at least one conductive blind hole 220 is formed in the wiring area A2 of the insulating layer 20 to electrically connect the first circuit layer 12 and the second circuit layer 22.

[0067] Furthermore, the second target barcode 23 and the second comparison barcode 25 are two-dimensional (2D) barcodes with a square dot or circular dot two-dimensional barcode specification, so that the access data of the second comparison barcode 25 is the same as that of the second target barcode 23. For example, the second target barcode 23 records all relevant processing flow records of the second circuit layer 22 (including the access data of the second reference barcode 21) to trace all current processing flows. Among them, the access data of the second target barcode 23 includes blanking, drilling, pre-treatment of copper plating, copper plating, electroplating, pre-treatment of the circuit, covering a photoresist such as dry film, exposure, development, etching, stripping, or others (such as the access data of the second reference barcode 21), etc.

[0068] In addition, the position of the second comparison barcode 25 overlaps the position of the second reference barcode 21. For example, since the second reference barcode 21 is covered by the metal layer 24, it is difficult for a barcode scanning device to identify the second reference barcode 21. Therefore, when performing the patterning process of the second circuit layer 22, the second comparison barcode 25 can be etched on the position of the second reference barcode 21 after processes such as exposure, development, etching, and stripping of the metal layer 24.

[0069] It should be understood that the second target barcode 23 can be formed synchronously while the second comparison barcode 25 is being fabricated. Therefore, both the second comparison barcode 25 and the second target barcode 23 can be fabricated by etching using a circuit process, rather than by laser ablation.

[0070] In addition, the position of the second reference barcode 25 does not overlap with the position of the first reference barcode 15, facilitating identification by the barcode scanning device.

[0071] As Figure 2E shown, the circuit layer addition operation can be configured with the number of layers as required to form the substrate structure 1. Another insulating layer 30 and another second reference barcode 31 are formed on the insulating layer 20. Then, another second circuit layer 32, at least one second target barcode 33, and a second reference barcode 35 are formed on the wiring area A3 and the non-wiring area B3 of the insulating layer 30 by means of a metal layer 34. At least one conductive blind hole 320 is formed in the wiring area A3 of the insulating layer 30, electrically connecting the conductive blind hole 320 to the second circuit layer 32 and the second circuit layer 22.

[0072] In this embodiment, the second reference barcode 31 is a two-dimensional (2D) barcode with a square dot or circular dot two-dimensional barcode specification. Its stored data records all current processing procedures of the insulating layer 30, including the stored data of the second reference barcode 25.

[0073] Furthermore, the second target barcode 33 and the second reference barcode 35 are two-dimensional (2D) barcodes with a square dot or circular dot two-dimensional barcode specification, so that the stored data of the second reference barcode 35 is the same as the stored data of the second target barcode 33, and the second target barcode 33 records all relevant processing procedure records of the second circuit layer 32 (including the stored data of the second reference barcode 31).

[0074] In addition, the position of the second reference barcode 35 overlaps with the position of the second reference barcode 31, and the position of the second reference barcode 35 does not overlap with the positions of the first reference barcode 15 and the second reference barcode 25, as Figure 2E-1 shown, facilitating identification by the barcode scanning device (such as an automatic optical identification device or a manual barcode scanning device) coordinated with the computer (not shown) of the processing equipment.

[0075] In addition, both the second reference barcode 35 and the second target barcode 33 can be fabricated by etching using circuit processes, without the need for laser ablation.

[0076] Furthermore, multiple first reference barcodes 15 and second reference barcodes 25, 35 can be formed at the corners of the substrate structure 1 as required, as Figure 2E-1 shown, and another identical first reference barcode 15 and second reference barcodes 25, 35 can be formed at the diagonal corners for backup and anti-fooling purposes.

[0077] Therefore, by fabricating bar code patterns (the first target bar code 13 and the second target bar codes 23, 33 or the first reference bar code 15 and the second reference bar codes 25, 35) in each layer, the substrate structure 1 can effectively avoid the problem that the first reference bar code 11 and the second reference bar codes 21, 31 cannot be recognized due to being blurred after electroplating the metal layers 14, 24, 34. Moreover, the first target bar code 13 and the second target bar codes 23, 33 or the first reference bar code 15 and the second reference bar codes 25, 35 are applicable to an automatic optical recognition device or a manual bar code scanning device.

[0078] Furthermore, during the subsequent outgoing inspection operation of the substrate structure 1, since only the first target bar code 13 and the second target bar codes 23, 33 or the first reference bar code 15 and the second reference bar codes 25, 35 are retained and the first reference bar code 11 and the second reference bar codes 21, 31 have been erased, it can be ensured that the X-RAY of the automatic optical recognition device (or manual bar code scanning device) can clearly recognize and read the first target bar code 13 and the second target bar codes 23, 33 or the first reference bar code 15 and the second reference bar codes 25, 35 without being interfered by the first reference bar code 11 and the second reference bar codes 21, 31 and misread.

[0079] In addition, the substrate structure 1 fabricates the first reference bar code 15 and the second reference bar codes 25, 35 in each layer, and simultaneously etches and forms the first target bar code 13 and the second target bar codes 23, 33 at the positions corresponding to the substrate portion 1a, so as to form bar code patterns at multiple places in one circuit process without separately fabricating the reference bar code and the target bar code. Therefore, compared with the prior art, the manufacturing method of the present invention can effectively reduce the process time significantly.

[0080] In addition, the first reference bar code 15 and the second reference bar codes 25, 35 are formed at the diagonal corners of the substrate structure 1 for anti-fooling purposes, so as to avoid the front and back sides of the packaging substrate 2 being placed in reverse when an operator or a machine automatically picks and places the substrate structure 1.

[0081] As Figure 2F shown, after shipment, a packaging process is carried out to remove the non-wiring areas B1, B2, B3 along the cutting path and separate each substrate portion 1a, so that the first target bar code 13 and the second target bar codes 23, 33 are retained on the packaging substrate 2.

[0082] It should be understood that there are various types of the packaging substrate 2, not limited to the above, and the number of wiring layers can be designed according to requirements, not limited to the six-layer wiring specification above.

[0083] Therefore, the manufacturing method of the present invention mainly uses highly recognizable bar code graphics as the first target bar code 13 and the second target bar codes 23, 33 (or the first reference bar code 15 and the second reference bar codes 25, 35) to effectively track all the process records of a single-piece package substrate 2 (even the substrate structure 1). Therefore, compared with the prior art, the first target bar code 13 and the second target bar codes 23, 33 can be used to track the production records of the package substrate 2 or the substrate structure 1 before and after shipment, which is conducive to the operation of troubleshooting defects. Thus, it can realize uploading the product identification of all processes to the production management system for automated quality control operations. Further, even if the non-wiring areas B1, B2, B3 are cut off through the order-splitting operation, in the subsequent packaging process, the substrate structure 1 or the package substrate 2 can still trace the relevant data of the package substrate 2 through the first target bar code 13 and the second target bar codes 23, 33.

[0084] Furthermore, the manufacturing method of the present invention transmits the graphics and access data of the first reference bar code 11 and the second reference bar codes 21, 31 to the circuit process machine tool through a scanning and reading machine, so that the circuit process machine tool forms bar code graphics through steps such as exposure, development, and etching, which includes the access data of the first reference bar code 11 and the second reference bar codes 21, 31, and is used as the first target bar code 13 and the second target bar codes 23, 33. Therefore, the manufacturing method of the present invention only needs to spend the cost of a one-time software (the interoperability application software between the scanning and reading machine and the circuit process machine tool), and there is no need to purchase machine tools separately for each process workstation. Thus, it can save the normal costs such as machine tool maintenance and management.

[0085] In addition, the package substrate 2 forms the first and second circuit layers 12, 22, 32 and the first target bar code 13 and the second target bar codes 23, 33 in the same layer process. Therefore, there is no need to use the laser ablation method to make the first target bar code 13 and the second target bar codes 23, 33 after the first and second circuit layers 12, 22, 32 are made. Therefore, compared with the prior art, the manufacturing method of the present invention can greatly save the process time.

[0086] The present invention also provides a package substrate 2, including: a core layer 10, a first circuit layer 12 provided on the core layer 10, a first target bar code 13 provided on the core layer 10, an additional layer part 2a provided on the core layer 10, and a second target bar code 23, 33 combined with the additional layer part 2a.

[0087] The additional layer part 2a includes at least one insulating layer 20, 30 and a second circuit layer 22, 32 formed on the insulating layer 20, 30 and electrically connected to the first circuit layer 12.

[0088] The second target bar code 23, 33 is provided on the insulating layer 20, 30.

[0089] In one embodiment, the first target barcode 13 and / or the second target barcodes 23, 33 are two-dimensional barcode graphics which are two-dimensional barcodes with square dots or circular dots.

[0090] The present invention also provides a substrate structure 1, comprising: a core layer 10 and an additional layer part 2a disposed on the core layer 10.

[0091] The core layer 10 is defined with at least one wiring area A1 and a non-wiring area B1 adjacent to the wiring area A1. A first reference barcode 15 is formed on the non-wiring area B1, and a first circuit layer 12 and a first target barcode 13 are formed on the wiring area A1.

[0092] The additional layer part 2a includes at least one insulating layer 20, 30 and second circuit layers 22, 32 formed on the insulating layer 20, 30 and electrically connected to the first circuit layer 12. Second target barcodes 23, 33 and second reference barcodes 25, 35 are further formed on the insulating layer 20, 30. Among them, the second target barcodes 23, 33 are correspondingly located on the wiring areas A1, A2, A3, and the second reference barcodes 25, 35 are correspondingly located on the non-wiring areas B1, B2, B3.

[0093] In one embodiment, the first target barcode 13 and / or the second target barcodes 23, 33 are two-dimensional barcode graphics which are two-dimensional barcodes with square dots or circular dots.

[0094] In one embodiment, the first reference barcode 15 and / or the second reference barcodes 25, 35 are two-dimensional barcode graphics which are two-dimensional barcodes with square dots or circular dots.

[0095] In summary, for the substrate structure, its manufacturing method and the packaging substrate of the present invention, by using highly recognizable barcode graphics as the first and second target barcodes, all process flow records of a single-piece packaging substrate can be effectively traced. Therefore, the first and second target barcodes can be used as the production record tracking of the packaging substrate before and after shipment, which is conducive to carrying out defective product troubleshooting operations. Thus, it can realize uploading the product identification of all processes to the production management system for automated quality control operations.

[0096] Furthermore, since the circuit layer and the target barcode are simultaneously formed in the same layer process for the packaging substrate, there is no need to use a laser ablation method to make the target barcode after the circuit layer is fabricated. Therefore, the process time can be significantly saved.

[0097] In addition, barcode patterns (first and second target barcodes or first and second reference barcodes) are fabricated in each layer of the substrate structure, effectively avoiding the problem that the first and second reference barcodes become unrecognizable due to blurring after electroplating the metal layer. Moreover, even if the non-wiring area is cut off through the singulation operation, during subsequent packaging processes, the substrate structure or the packaged substrate can still trace the relevant data of the packaged substrate through the first and second target barcodes.

[0098] The above embodiments are only used to illustrate the principles and effects of the present invention by way of example, and are not intended to limit the present invention. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of the claimed protection of the present invention shall be as set forth in the claims.

Claims

1. A substrate structure, comprising: A core layer, which defines at least one wiring area and a non-wiring area adjacent to the wiring area, and a first reference bar code is formed on the non-wiring area, and a first circuit layer and a first target bar code are formed on the wiring area, wherein the access data of the first reference bar code is the same as the access data of the first target bar code; and An additional layer part, disposed on the core layer and comprising at least one insulating layer and a second circuit layer formed on the insulating layer and electrically connected to the first circuit layer, and a second target bar code and a second reference bar code are further formed on the insulating layer, wherein the second target bar code is correspondingly located on the wiring area, the second reference bar code is correspondingly located on the non-wiring area, and the access data of the second reference bar code is the same as the access data of the second target bar code.

2. The substrate structure according to claim 1, wherein, The first target bar code and / or the second target bar code is a two-dimensional bar code pattern.

3. The substrate structure according to claim 1, wherein, The first reference bar code and / or the second reference bar code is a two-dimensional bar code pattern.

4. A method for manufacturing a packaged substrate, comprising: Providing a core layer, which defines at least one wiring area and a non-wiring area adjacent to the wiring area; Forming a first reference bar code on the non-wiring area of the core layer; Forming a first reference bar code covering the first reference bar code on the non-wiring area, and forming a first circuit layer and a first target bar code on the wiring area, wherein the access data of the first reference bar code is the same as the access data of the first target bar code; and Forming an additional layer part on the core layer, the additional layer part comprising at least one insulating layer having a second reference bar code and a second circuit layer formed on the insulating layer and electrically connected to the first circuit layer, and when forming the second circuit layer, a second target bar code is formed at a position corresponding to the wiring area of the insulating layer, and a second reference bar code covering the second reference bar code is formed on the non-wiring area corresponding to the insulating layer, wherein the access data of the second reference bar code is the same as the access data of the second target bar code.

5. The manufacturing method of the encapsulated substrate as described in claim 4, wherein, The first reference bar code and / or the second reference bar code is manufactured by a laser ablation method.

6. The manufacturing method of the encapsulation substrate according to claim 4, wherein, The first reference bar code and / or the second reference bar code is manufactured by an etching metal material method.

7. The manufacturing method of the encapsulated substrate as described in claim 4, wherein, The first target bar code and / or the second target bar code is manufactured by an etching metal material method.

8. The manufacturing method of the encapsulation substrate as described in claim 4, wherein, The method further comprises removing the non-wiring area of the core layer and the structure thereon.

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