A device for detecting the folding length of a flip chip film

Abstract

The embodiment of the present invention discloses a detection device for the folded length of a chip-on-chip film, comprising: an image acquisition module and a data processing module; the image acquisition module is used to acquire images of the side of the chip-on-chip film coated on the surface of the electronic screen on the sample platform, and transmit the acquired side images to the data processing module; the data processing module is used to use a visual algorithm to determine the side regions of the chip-on-chip film from the side images, and determine the midpoint and the folded pole of the folded edge line in the side region, and calculate the folded length of the chip-on-chip film using the midpoint of the folded edge line and the folded pole. The above detection device greatly improves the detection efficiency.

Description

Technical Field

[0001] The invention belongs to the field of automation technology, and in particular relates to a device for detecting the folding length of a flip chip film. Background Art

[0002] COF (Chip On Flex, or Chip On Film) is a chip soft film packaging technology that fixes the driver IC on a flexible circuit board. It is a technology that uses a soft additional circuit board as a packaging chip carrier to connect the chip to the flexible substrate circuit.

[0003] The folded length of the flip chip film affects the product yield and the execution of subsequent processes. Detecting the folded length can also reflect the stability of the processing equipment. Currently, the COF folded length is mainly detected manually, which has problems such as low detection efficiency. Summary of the invention

[0004] The embodiment of the present invention provides a device for detecting the folding length of a flip chip film, comprising: an image acquisition module and a data processing module;

[0005] The image acquisition module is used to acquire images of the side edges of the chip-on-chip film coated on the surface of the electronic screen placed on the sample platform, and transmit the acquired side edge images to the data processing module;

[0006] The data processing module is used to use a visual algorithm to determine the side area of ​​the flip chip film from the side image, determine the midpoint and the inflection pole of the inflection edge line in the side area, and calculate the inflection length of the flip chip film using the midpoint of the inflection edge line and the inflection pole.

[0007] Furthermore, the data processing module is used to measure the length of the flip chip film in the side area in the thickness direction to obtain the midpoint of the inverted edge line.

[0008] Furthermore, the data processing module is used to binarize the image of the side area to segment the foreground and the background, and perform connected area detection to obtain the inflection poles in the Blob block.

[0009] Furthermore, the data processing module is used to fit the horizontal line of the reference panel through the grayscale changes in the side area and the preset caliper properties, calculate the distance between the midpoint of the inflected edge line and the two perpendicular feet of the inflection pole to the horizontal line of the reference panel, and obtain the inflection length of the flip chip film.

[0010] Further, the image acquisition module includes: a first AOI camera, a first AOI lens, a first coaxial light source and a first horizontal prism;

[0011] The first AOI camera, the first AOI lens and the first horizontal prism are sequentially placed along the same vertical axis, and the first coaxial light source is adjacent to the first horizontal prism and faces a first side of the electronic screen with a chip-on-film coated on the surface.

[0012] Further, the image acquisition module includes: a second AOI camera, a second AOI lens, a second coaxial light source and a second horizontal prism;

[0013] The second AOI camera, the second AOI lens and the second horizontal prism are sequentially placed along the same vertical axis, and the second coaxial light source is adjacent to the second horizontal prism and faces the second side of the electronic screen with the chip-on-film coated on the surface.

[0014] Furthermore, the first coaxial light source is opposite to the second coaxial light source.

[0015] Furthermore, it also includes: a carrier for placing an electronic screen with a chip-on-chip film coated on its surface.

[0016] Furthermore, the first AOI camera and the second AOI camera are on the same horizontal line.

[0017] Furthermore, the carrier is vacuum adsorbed.

[0018] The embodiment of the present invention provides a detection device for the folded length of a chip-on-chip film, wherein an image acquisition module is used to acquire images of the side of the chip-on-chip film coated on the surface of the electronic screen on the sample platform, and transmit the acquired side images to a data processing module; the data processing module is used to use a visual algorithm to determine the side regions of the chip-on-chip film from the side images, determine the midpoint and the folded pole of the folded edge line in the side region, and calculate the folded length of the chip-on-chip film using the midpoint and the folded pole of the folded edge line. The above detection device greatly improves efficiency through automated detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 A schematic structural diagram of a device for detecting the folded length of a flip chip film provided by an embodiment of the present invention;

[0021] Figure 2 A structural schematic diagram of an image acquisition module provided by an embodiment of the present invention;

[0022] Figure 3 An operational schematic diagram of data processing performed by a data processing module provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0024] The embodiment of the present invention provides a device for detecting the folded length of a flip chip film, such as Figure 1 As shown, it includes: an image acquisition module 1 and a data processing module 2;

[0025] The image acquisition module 1 is used to acquire images of the side edges of the chip-on-film coated on the surface of the electronic screen placed on the sample platform, and transmit the acquired side edge images to the data processing module 2;

[0026] The data processing module 2 is used to use a visual algorithm to determine the side area of ​​the flip chip film from the side image, determine the midpoint and the inflection pole of the inflection edge line in the side area, and calculate the inflection length of the flip chip film using the midpoint of the inflection edge line and the inflection pole.

[0027] One embodiment of the present invention, as Figure 2 As shown, the image acquisition module 1 includes: a first AOI camera 111, a first AOI lens 112, a first coaxial light source 113 and a first horizontal prism 114;

[0028] The first AOI camera 111, the first AOI lens 112 and the first horizontal prism 114 are sequentially placed along the same vertical axis, and the first coaxial light source 113 is adjacent to the first horizontal prism 114 and faces the first side of the electronic screen coated with a chip-on-film.

[0029] Further, the image acquisition module 1 includes: a second AOI camera 121, a second AOI lens 122, a second coaxial light source 123 and a second horizontal prism 124;

[0030] The second AOI camera 121, the second AOI lens 122 and the second horizontal prism 124 are sequentially placed along the same vertical axis, and the second coaxial light source 123 is adjacent to the second horizontal prism 124 and directly faces the second side of the electronic screen coated with a chip-on-film. The first coaxial light source 113 is opposite to the second coaxial light source 123. The first AOI camera 111 and the second AOI camera 121 are on the same horizontal line.

[0031] Furthermore, the image acquisition module 1 also includes: a carrier 12 for placing an electronic screen coated with a chip-on-chip film on the surface. The carrier 13 is a vacuum-adsorbed XY placement platform that can be adjusted in position. In this way, this module can better shoot the object to be measured by adjusting the position of the lens, prism and XY placement platform; by adjusting the position of the light source, clear photos can be taken as required in a dark environment; the XY placement platform can be vacuum-adsorbed to ensure that the measured object is not easy to slide.

[0032] In another embodiment of the present invention, the data processing module 2 is used to measure the length of the flip chip film in the side area in the thickness direction to obtain the midpoint of the inflected edge line.

[0033] The data processing module is also used to binarize the image of the side area, segment the foreground and the background, and perform connected area detection to obtain the inflection poles in the Blob block.

[0034] The data processing module is also used to fit the horizontal line of the reference panel through the grayscale changes in the side area and the preset caliper properties, calculate the distance between the midpoint of the inflected edge line and the two perpendicular feet of the inflection pole to the horizontal line of the reference panel, and obtain the inflection length of the flip chip film.

[0035] In one embodiment of the present invention, the data processing module can perform automatic optical inspection (AOI, Automated Optical Inspection) on two sides of the electronic screen, such as Figure 3 As shown, specifically: in the [1] platform selection box, select the inflection detection platform that needs to be adjusted, read the collected image, and use the edge measurement tool to measure the upper, middle, and lower areas of the edge line in the thickness direction in the [2] electronic screen side area ROI to obtain the [8] vertical edge line, that is, the midpoint of the inflection edge line, and record the coordinates of the midpoint of the inflection edge line. Use the edge measurement tool to determine the [3] panel horizontal line, and the extension line of the panel horizontal line is used to convert the inflection length. Then, use the Blob analysis tool in the [5] detection tool box to find the [4] Blob analysis area, binarize the image, segment it to obtain the foreground and background, and then perform connected area detection to obtain the Blob block, and select the position of the inflection pole in the Blob block according to actual needs, record the [9] inflection pole coordinates, and finally record the coordinates of the perpendiculars formed by the midpoint and the inflection pole and the extension line of the panel horizontal line, and calculate the distance between the two perpendiculars, that is, the inflection length. Obtain the inflection pole.

[0036] It should be noted that in actual applications, since the COF inflection arc captured is divided into left and right (the COF inflection arc is the location of the inflection pole), if it is a picture on the left, the COF inflection arc is on the right, then the position of the inflection pole in the Blob analysis block should be selected as right; if it is a picture on the right, the COF inflection arc is on the left, then the position of the inflection pole in the Blob analysis block should be selected as left. After obtaining the inflection pole according to the features in the Blob analysis block, the position coordinates are automatically obtained by the compilation software, that is, the pixel coordinates of the inflection pole in the picture. In the process of measuring the inflection edge line, the edge line can also be obtained according to the designated ROI area by analyzing the change in grayscale value from dark to bright in the image, the set caliper polarity (for example, from white to black, from black to white, all) and the caliper order (such as the first, the last, all). When fitting the horizontal line of the reference panel, Figure 3 The horizontal line of the panel [3] in the figure is the ROI area in green. From the image, we know that if we observe the horizontal line of the panel from top to bottom, its feature is the first line that changes from white to black. Based on this, we can find and fit the edge extension line.

[0037] In the embodiment of the present invention, an automatic optical detection device for the double-sided COF inversion length is provided. By placing the product on the platform and under the premise of clear imaging, the AOI software uses a high-resolution camera to collect images, and the visual algorithm is used to find the edge, find the midpoint: the midpoint of the vertical edge of the side, the foot of the perpendicular: the foot of the perpendicular between the extreme point of the inversion R angle and the extension line of the horizontal line of the panel, and calculate the distance between the midpoint and the foot of the perpendicular, which is the corresponding COF inversion length.

[0038] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

[0039] The above descriptions are only some embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A device for detecting the folded length of a flip chip film, characterized in that: include: Image acquisition module and data processing module; The image acquisition module is used to acquire images of the side edges of the chip-on-chip film coated on the surface of the electronic screen placed on the sample platform, and transmit the acquired side edge images to the data processing module; The data processing module is used to use a visual algorithm to determine the side area of ​​the flip chip film from the side image, determine the midpoint and the inflection pole of the inflection edge line in the side area, and calculate the inflection length of the flip chip film using the midpoint and the inflection pole of the inflection edge line; select the inflection detection platform that needs to adjust parameters in the platform selection box, read the collected image, and use the edge measurement tool to measure the upper, middle and lower areas of the edge line in the thickness direction determined in the side area ROI of the electronic screen to obtain the vertical edge line, that is, the midpoint of the inflection edge line, and record the coordinates of the midpoint of the inflection edge line; find the Blob analysis area using the Blob analysis tool in the detection tool box, binarize the image, segment it to obtain the foreground and background, and then perform connected area detection; select the position of the inflection pole in the Blob block according to actual needs, record the coordinates of the inflection pole, and finally record the coordinates of the perpendiculars formed by the midpoint and the inflection pole and the extension line of the horizontal line of the panel, and calculate the distance between the two perpendiculars, that is, the inflection length.

2. The detection device according to claim 1, characterized in that: The data processing module is used to measure the length of the flip chip film in the side area in the thickness direction to obtain the midpoint of the inverted edge line.

3. The detection device according to claim 1, characterized in that: The data processing module is used to binarize the image of the side area, segment the foreground and the background, and perform connected area detection to obtain the inflection poles in the Blob block.

4. The detection device according to claim 1, characterized in that: The data processing module is used to fit the horizontal line of the reference panel through the grayscale changes in the side area and the preset caliper properties, calculate the distance between the midpoint of the inflected edge line and the two perpendicular feet of the inflection pole to the horizontal line of the reference panel, and obtain the inflection length of the flip chip film.

5. The detection device according to claim 1, characterized in that: The image acquisition module includes: a first AOI camera, a first AOI lens, a first coaxial light source and a first horizontal prism; The first AOI camera, the first AOI lens and the first horizontal prism are sequentially placed along the same vertical axis, and the first coaxial light source is adjacent to the first horizontal prism and faces a first side of the electronic screen with a chip-on-film coated on the surface.

6. The detection device according to claim 5, characterized in that: The image acquisition module includes: a second AOI camera, a second AOI lens, a second coaxial light source and a second horizontal prism; The second AOI camera, the second AOI lens and the second horizontal prism are sequentially placed along the same vertical axis, and the second coaxial light source is adjacent to the second horizontal prism and faces the second side of the electronic screen with the chip-on-film coated on the surface.

7. The detection device according to claim 6, characterized in that: The first coaxial light source is opposite to the second coaxial light source.

8. The detection device according to claim 5, characterized in that: Also includes: The carrier is used to place the electronic screen with the chip-on-chip film coated on the surface.

9. The detection device according to claim 6, characterized in that: The first AOI camera and the second AOI camera are on the same horizontal line.

10. The detection device according to claim 8, characterized in that: The carrier is vacuum adsorbed.

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