A thermoelectric semiconductor laser welding integrated machine

Abstract

The present invention relates to the field of semiconductor technology, and particularly to a thermoelectric semiconductor laser welding integrated machine. Aiming at the problems of low efficiency, poor accuracy, occupation of human resources and harm to the physical health of workers in manual welding operations, a thermoelectric semiconductor laser welding integrated machine is provided, which includes an operation table. The wire feeding device includes a driving seat that can move left and right. A plurality of clamping rods are provided at the upper end of the driving seat, and the wires are respectively clamped on the corresponding clamping rods. When the driving seat moves left to a specified position, a structure can be formed in which the clamping rods move outward and the pressing strip moves downward; a laser welding machine for welding semiconductor chips and wires is provided at the welding station; when the rotating disk rotates to make the workbench reach the blanking station, a structure can be formed in which the fixture seat opens and the pressing strip moves upward; it can replace manual assembly and welding of semiconductor chips and wires, reduce the occupation of human resources, improve production efficiency, have high accuracy and reduce labor costs.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and more particularly to a thermoelectric semiconductor laser welding integrated machine. Background Art

[0002] A semiconductor thermoelectric power generation chip is a device that can convert thermal energy into electrical energy. It utilizes the thermoelectric effect to generate a voltage difference through a temperature difference, thereby achieving the conversion and utilization of energy. The semiconductor thermoelectric power generation chip has the advantages of small volume, light weight, high reliability, etc., and thus has important significance in some specific application fields. The working principle of the semiconductor thermoelectric power generation chip is that when there is a temperature difference at the contact of two different materials, an electric potential difference will be generated. During the processing of semi-finished thermoelectric chips, wires need to be welded to the positive and negative electrodes of the chip. Currently, the welding process is usually manual operation by workers holding a welding torch. This process not only has low efficiency and poor accuracy, but also occupies a large amount of human resources. In the long run, it is also harmful to the physical health of workers. Therefore, a thermoelectric semiconductor laser welding integrated machine is designed to solve the problems mentioned above. Summary of the Invention

[0003] Aiming at the low efficiency, poor accuracy, occupation of human resources, and harm to the physical health of workers in manual welding operations, the present invention provides a thermoelectric semiconductor laser welding integrated machine, which can replace manual operation to assemble and weld semiconductor chips and wires, reduce the occupation of human resources, improve production efficiency, have high accuracy, reduce labor costs, and effectively solve the problems mentioned in the above background art.

[0004] The technical solution adopted by the present invention to solve the above problems is as follows:

[0005] A thermoelectric semiconductor laser welding integrated machine includes an operating table. A rotatable turntable is provided at the upper end of the operating table. There are also a loading station, an assembly station, a welding station, and an unloading station on the operating table that cooperate with the turntable. There are a plurality of evenly distributed workbenches on the operating table. Clamp seats for loading and fixing semiconductor chips are provided on the workbenches, and are evenly distributed. Pressure bars that cooperate with the semiconductor chips are also provided on the workbenches respectively. A wire feeding device is provided at the assembly station. The wire feeding device includes a driving seat that can move left and right. A plurality of groups of clamping rods are provided at the upper end of the driving seat. Wires are respectively clamped on the corresponding clamping rods. When the driving seat moves left to a specified position, a structure can be formed in which the clamping rods move outward and the pressure bars move downward. A laser welding machine for welding semiconductor chips and wires is provided at the welding station. When the turntable rotates to make the workbench reach the unloading station, a structure can be formed in which the clamp seats open and the pressure bars move upward.

[0006] Four uniformly distributed support columns are fixedly connected to the inner wall of the rotating disk, and the operating table is fixedly connected to the upper surface of the support columns. The fixture seats are respectively fixedly connected to the upper surfaces of the corresponding operating tables. First trapezoidal wedges are respectively slidably connected to the inner walls on both sides of the fixture seats. First springs are respectively fixedly connected to the outer end faces of the two first trapezoidal wedges. Two short guide rods are respectively fixedly connected to the end faces on both sides of the fixture seats. A connecting plate is slidably connected to the outer surface of each of the two short guide rods. The other ends of the first springs are respectively fixedly connected to the corresponding connecting plates. First sliding pins are respectively fixedly connected to the inner walls of the connecting plates. Movable T-shaped push plates are respectively arranged on the upper surface of the operating table. A plurality of short inclined grooves matching the first sliding pins are respectively formed in the T-shaped push plates.

[0007] The T-shaped push plates are respectively slidably connected to the upper surface of the operating table. First long pins are respectively fixedly connected to the lower surface of the T-shaped push plates. A circular ring plate is fixedly connected to the upper surface of the operating table. A circular ring groove matching the first long pins is formed in the circular ring plate. The circular ring groove includes an arc groove and a V-shaped groove. When the operating table moves circumferentially, the T-shaped push plates can be kept relatively stationary with the operating table under the engagement of the first long pins and the arc groove. When the operating table moves circumferentially, the T-shaped push plates can move inward or outward on the upper surface of the operating table under the engagement of the first long pins and the V-shaped groove.

[0008] The wire feeding device further includes a T-shaped seat fixedly connected to the operating table. Long guide rods are respectively slidably connected to the inner walls at the left and right ends of the T-shaped seat. A clutch platform is fixedly connected to the left end surfaces of the two long guide rods. Two telescopic rods are fixedly connected to the inner wall of the middle part of the T-shaped seat. The driving seat is fixedly connected to the telescopic ends of the two telescopic rods. A vertical plate is fixedly connected to the upper surface of the driving seat. Positioning springs are respectively fixedly connected to the left and right end surfaces of the vertical plate. Spring retaining seats fixedly connected to the clutch platform are respectively fixedly connected to the outer ends of the two positioning springs. The vertical plate is also slidably connected to the inner wall of the clutch platform. U-shaped frames are respectively fixedly connected to the left and right sides of the upper surface of the clutch platform. Clamping rods are respectively arranged on the corresponding U-shaped frames. A structure in which the clamping rods open or close can be formed when the vertical plate slides left and right in the inner wall of the clutch platform.

[0009] A guide plate is fixedly connected to the upper surface of the vertical plate. The guide plate is also slidably connected to the lower surfaces of the two U-shaped frames. The clamping rods are respectively slidably connected to the inner walls of the U-shaped frames. Second sliding pins are respectively arranged at the lower ends of the clamping rods. A plurality of guide grooves matching the second sliding pins are formed in the guide plate.

[0010] Box bodies are respectively fixedly connected to the lower surface of the clamping rods. The second sliding pins are respectively slidably connected to the inner walls of the corresponding box bodies. Second springs matching the second sliding pins are respectively fixedly connected to the bottom inner walls of the box bodies. The guide grooves respectively include short horizontal grooves, long horizontal grooves, first inclined grooves and second inclined grooves. The short horizontal grooves, first inclined grooves, long horizontal grooves and second inclined grooves are connected end to end to form a closed space. First wedge blocks matching the second sliding pins are respectively fixedly connected to the bottom inner walls of the first inclined grooves. Second wedge blocks matching the second sliding pins are respectively fixedly connected to the bottom inner walls of the long horizontal grooves.

[0011] The inner walls of the support columns are respectively slidably connected with support plates. On both sides of the upper surface of each support plate, extension rods slidably connected with the operating table are respectively fixedly connected. The pressure strips are respectively fixedly connected to the corresponding extension rods. The inner walls of the bottom ends of the support columns are respectively fixedly connected with tension springs, and the upper surfaces of the tension springs are respectively fixedly connected to the corresponding support plates. The inner walls of the support columns are also respectively provided with engaging devices that cooperate with the support plates.

[0012] The engaging devices respectively include second trapezoidal wedges that cooperate with the support plates. The second trapezoidal wedges are respectively slidably connected to the inner walls of the corresponding support columns. On one side end faces of the second trapezoidal wedges, pull rods are respectively fixedly connected. Third springs that cooperate with the second trapezoidal wedges are respectively sleeved on the outer surfaces of the pull rods. The two ends of the outer surface of the support column are respectively slidably connected with first guide rods. The inner ends of the two first guide rods are respectively fixedly connected with T-shaped connection seats, and the pull rods are respectively fixedly connected to the corresponding T-shaped connection seats. The outer ends of the two first guide rods are respectively fixedly connected with a guide plate that cooperates with the driving seat.

[0013] The lower surfaces of the support plates are respectively fixedly connected with second long pins slidably connected to the support columns. An arc-shaped wedge that cooperates with the second long pins is provided at the blanking station.

[0014] The structure of the present invention is novel and ingenious, and has the following advantages compared with the prior art:

[0015] During use, after the operation at the loading station is completed, that is, when the semiconductor chip is fixed on the corresponding fixture seat, the rotating disk rotates to make the corresponding operating table, fixture seat, semiconductor chip, etc. rotate to reach the assembly station area. When the wire feeding device works, that is, when the driving seat, clamping rod, wire, etc. move synchronously to the left, it can drive the wire to reach the specified position above the corresponding semiconductor chip, that is, the solder joint of the semiconductor chip. When the driving seat moves to the specified position to the left, it can make the clamping rod move outward, and the corresponding clamping rod no longer clamps and fixes the wire. The pressure strip moves downward, and when the pressure strip moves downward, it can squeeze and fix the wire downward, so that the wire contacts the solder joint position. At this time, under the extrusion of the pressure strip, the wire can be temporarily fixed at the upper position of the semiconductor chip and can move synchronously with the semiconductor chip. When the rotating disk continues to rotate to the welding station, through the provided laser welding machine, the wire and the semiconductor chip can be welded and fixed. After the welding work is completed, when the rotating disk continues to rotate to make the operating table, semiconductor chip, and wire move to the blanking station, at this time the corresponding fixture seat will open, no longer fix the semiconductor chip, and the pressure strip moves upward and no longer squeezes the semiconductor chip and the wire. When the blanking manipulator works, the unloading work can be completed, that is, the entire assembly process is completed. The device is fully automated, can replace manual labor to assemble and weld semiconductor chips and wires, reduces the occupation of human resources, improves production efficiency, has high precision, reduces labor costs, and can prevent welding gas from damaging workers. Description of the Drawings

[0016] Figure 1 This is the first axonometric view of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0017] Figure 2 This is the second axonometric view of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0018] Figure 3 This is the installation schematic diagram of the workbench of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0019] Figure 4 This is the installation schematic diagram of the T-shaped push plate of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0020] Figure 5 This is the sectional view of the fixture seat of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0021] Figure 6 This is the installation schematic diagram of the clutch table of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0022] Figure 7 This is the installation schematic diagram of the drive seat of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0023] Figure 8 This is the sectional view of the clutch table of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0024] Figure 9 This is the installation schematic diagram of the clamping rod of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0025] Figure 10 This is the sectional view of the box body of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0026] Figure 11 This is the structural schematic diagram of the first wedge block and the second wedge block of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0027] Figure 12 This is the structural schematic diagram of the guide groove of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0028] Figure 13 This is the installation schematic diagram of the guide plate of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0029] Figure 14 This is the sectional view of the support column of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0030] Figure 15 This is the installation schematic diagram of the first long pin of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0031] Figure 16 Schematic diagram of the circular disk structure of a thermoelectric semiconductor laser welding integrated machine of the present invention.

[0032] Reference numerals in the figure: 1 - operating table, 2 - support leg, 3 - rotating disk, 4 - support column, 5 - working table, 6 - T-shaped push plate, 7 - short inclined groove, 8 - first sliding pin, 9 - fixture seat, 10 - first trapezoidal wedge, 11 - first spring, 12 - connecting plate, 13 - short guide rod, 14 - feeding conveyor, 15 - discharging conveyor, 16 - feeding manipulator, 17 - discharging manipulator, 18 - T-shaped seat, 19 - long guide rod, 20 - telescopic rod, 21 - driving seat, 22 - clutch table, 23 - vertical plate, 24 - positioning spring, 25 - spring retaining seat, 26 - U-shaped frame, 27 - guide plate, 28 - semiconductor chip, 29 - solder joint, 30 - wire, 31 - clamping rod, 32 - box body, 33 - second spring, 34 - second sliding pin, 35 - guide groove, 36 - short horizontal groove, 37 - first inclined groove, 38 - long horizontal groove, 39 - second inclined groove, 40 - first wedge, 41 - second wedge, 42 - support plate, 43 - tension spring, 44 - second trapezoidal wedge, 45 - third spring, 46 - pull rod, 47 - T-shaped connecting seat, 48 - first guide rod, 49 - guide plate, 50 - extension rod, 51 - pressing strip, 52 - laser welding machine, 53 - motor, 54 - circular disk, 55 - arc groove, 56 - V-shaped groove, 57 - first long pin, 58 - second long pin, 59 - arc wedge, 60 - feeding station, 61 - assembly station, 62 - welding station, 63 - discharging station. Detailed implementation manners

[0033] The following are specific embodiments of the present invention, and the technical solutions of the present invention are further described in conjunction with the accompanying drawings, but the present invention is not limited to these embodiments.

[0034] As Figures 1-16As shown in the figure, the present invention provides a thermoelectric semiconductor laser welding integrated machine, which includes an operation table 1. A rotatable turntable 3 is provided at the upper end of the operation table 1. There are also a loading station 60, an assembly station 61, a welding station 62, and an unloading station 63 on the operation table 1 that cooperate with the turntable 3. A plurality of evenly distributed worktables 5 are provided on the operation table 1. A plurality of evenly distributed fixture seats 9 for loading and fixing semiconductor chips 28 are provided on the worktables 5. Pressure bars 51 that cooperate with the semiconductor chips 28 are also respectively provided on the worktables 5. A wire feeding device is provided at the assembly station 61. The wire feeding device includes a driving seat 21 that can move left and right. A plurality of groups of clamping rods 31 are provided at the upper end of the driving seat 21. Wires 30 are respectively clamped on the corresponding clamping rods 31. When the driving seat 21 moves left to a specified position, a structure can be formed in which the clamping rods 31 move outward and the pressure bars 51 move downward. A laser welding machine 52 for welding the semiconductor chips 28 and the wires 30 is provided at the welding station 62. When the turntable 3 rotates to make the worktable 5 reach the unloading station 63, a structure can be formed in which the fixture seat 9 opens and the pressure bar 51 moves upward.

[0035] As Figures 1-9As shown, a plurality of support legs 2 are fixedly connected to the lower end surface of the operation table 1. The support legs 2 and the operation table 1 are used to support the entire device. There are four worktables 5. The rotating disk 3 can rotate 90 degrees each time, so that the worktable 5 corresponds to the corresponding loading station 60, assembly station 61, welding station 62, and unloading station 63. A motor 53 is fixedly connected to the lower end surface of the operation table 1. The rotating disk 3 is fixedly connected to the output end of the motor 53. The motor 53 can provide a driving force for the rotating disk 3. The motor 53 is a prior art and will not be elaborated; the worktable 5 is used to support components such as the fixture seat 9. The semiconductor chip 28 can be limited and fixed by the provided fixture seat 9; a loading conveyor 14 and a loading manipulator 16 are also provided on the loading station 60. A plurality of semiconductor chips 28 are placed on the loading conveyor 14, which can drive the semiconductor chips 28 to move. The loading manipulator 16 can adsorb and fix the semiconductor chips 28, and can also flip and extend backward when the loading manipulator 16 works, so that the semiconductor chips 28 are loaded onto the fixture seat 9; an unloading conveyor 15 and an unloading manipulator 17 are provided on the unloading station 63. The unloading manipulator 17 can adsorb and fix the semiconductor chips 28 on the fixture seat 9, carry the semiconductor chips 28 and place them on the unloading conveyor 15. When the unloading conveyor 15 works, it will transport the semiconductor chips 28 to the designated position; the conveyor and the manipulator are both prior arts and will not be elaborated; after completion at the loading station 60, that is, when the semiconductor chip 28 is fixed on the corresponding fixture seat 9, the rotating disk 3 rotates to make the corresponding worktable 5, fixture seat 9, semiconductor chip 28, etc. rotate to the area of the assembly station 61. When the wire feeding device works, that is, when the driving seat 21, the clamping rod 31, the wire 30, etc. move synchronously to the left, it can drive the wire 30 to the designated position above the corresponding semiconductor chip 28, that is, at the solder joint 29 of the semiconductor chip 28. When the driving seat 21 moves to the designated position to the left, it can make the clamping rod 31 move outward, and the corresponding clamping rod 31 no longer clamps and fixes the wire 30. The pressing strip 51 moves downward. When the pressing strip 51 moves downward, it can squeeze and fix the wire 30 downward, so that the wire 30 contacts the solder joint 29 position. At this time, under the extrusion of the pressing strip 51, the wire 30 can be temporarily fixed at the upper end position of the semiconductor chip 28 and can move synchronously with the semiconductor chip 28. When the rotating disk 3 continues to rotate to the welding station 62, through the provided laser welding machine 52, the wire 30 and the semiconductor chip 28 can be welded and fixed. The laser welding machine 52 is a prior art and will not be elaborated;After the welding work is completed, when the rotary disk 3 continues to rotate to move the working table 5, the semiconductor chip 28, and the wire 30 to the blanking station 63, the corresponding fixture seat 9 will open at this time, no longer fixing the semiconductor chip 28, and the pressing strip 51 will move upward and no longer squeeze the semiconductor chip 28 and the wire 30. Unloading work can be completed when the blanking manipulator 17 works, that is, the entire assembly process is completed. The device operates fully automatically, can replace manual labor to assemble and weld the semiconductor chip 28 and the wire 30, reduce the occupation of human resources, improve production efficiency, have high precision, reduce labor costs, and prevent the welding gas from damaging the workers.

[0036] Four uniformly distributed support columns 4 are fixedly connected to the inner wall of the rotary disk 3, and the working table 5 is fixedly connected to the upper surface of the support columns 4. The fixture seats 9 are respectively fixedly connected to the upper surfaces of the corresponding working tables 5; the inner walls on both sides of the fixture seat 9 are respectively slidably connected with first trapezoidal wedges 10. First springs 11 are respectively fixedly connected to the outer end faces of the two first trapezoidal wedges 10. Two short guide rods 13 are respectively fixedly connected to the two end faces of the fixture seat 9. A connecting plate 12 is slidably connected to the outer surfaces of the two short guide rods 13. The other ends of the first springs 11 are respectively fixedly connected to the corresponding connecting plates 12. First sliding pins 8 are respectively fixedly connected to the inner walls of the connecting plates 12. Movable T-shaped push plates 6 are respectively arranged on the upper surfaces of the working tables 5, and a plurality of short inclined slots 7 matching the first sliding pins 8 are respectively formed in the T-shaped push plates 6.

[0037] As Figures 1-5 shown, the support columns 4 are used to fixedly support the corresponding working tables 5 and can drive the working tables 5 to rotate and move when the rotary disk 3 rotates; the installation and shape of the first trapezoidal wedges 10, the first springs 11, the connecting plates 12, and the short guide rods 13 are as Figure 5 shown. The first trapezoidal wedges 10 can slide in the inner walls of the fixture seats 9, and the short guide rods 13 can limit the connecting plates 12. Under the limitation of the short guide rods 13, the connecting plates 12 can only move inward or outward; the installation and shape of the T-shaped push plates 6, the first sliding pins 8, and the short inclined slots 7 are as Figure 4As shown, the short oblique groove 7 is set in an eight-shaped shape. When the T-shaped push plate 6 moves outward, it can drive the corresponding two first sliding pins 8 to move inward or outward. When the first sliding pin 8 moves, it will drive the corresponding two connecting plates 12 to move inward or outward; when the T-shaped push plate 6 does not move, the corresponding short guide rods 13 and connecting plates 12 are fixed in position; the first spring 11 can be lengthened or shortened; the inner end face of the first trapezoidal wedge block 10 is provided with an inclined surface and a right-angle surface. When the semiconductor chip 28 is pushed into the fixture seat 9, the semiconductor chip 28 contacts the inclined surface of the first trapezoidal wedge block 10, which will cause the two first trapezoidal wedge blocks 10 to move outward. When the first trapezoidal wedge block 10 moves outward, it will enter the inner walls on both sides of the fixture seat 9 and compress the first spring 11. When the semiconductor chip 28 moves to completely enter the inner wall of the fixture seat 9, it will be in contact with When the inclined surface of the first trapezoidal wedge block 10 is out of contact, the first trapezoidal wedge block 10 will move inward under the elastic force of the first spring 11. At this time, the right-angled surface of the first trapezoidal wedge block 10 will block the semiconductor chip 28 to prevent the semiconductor chip 28 from moving out of the fixture seat 9, that is, the fixture seat 9 is in a closed state at this time; when it is necessary to drive the fixture seat 9 to open, by driving the corresponding T-shaped push plate 6 to move outward, the short inclined groove 7 and the first sliding pin 8 are engaged, the corresponding connecting plate 12 and the outer end of the first spring 11 will move outward, and the first spring 11 will pull the corresponding first trapezoidal wedge block 10 to move outward when it moves outward. After the first trapezoidal wedge block 10 moves outward to the inner wall of the fixture seat 9, it no longer blocks the semiconductor chip 28, that is, the corresponding fixture seat 9 is in an open state, and the semiconductor chip 28 can be taken out normally.

[0038] The T-shaped push plate 6 is slidably connected to the upper end surface of the workbench 5, and the lower end surface of the T-shaped push plate 6 is fixedly connected to the first long pin 57. The upper end surface of the operating table 1 is fixedly connected to a circular ring disk 54. The circular ring disk 54 is provided with a circular ring groove matching the first long pin 57. The circular ring groove includes an arc groove 55 and a V-shaped groove 56. When the workbench 5 moves in a circle, the first long pin 57 is engaged with the arc groove 55, so that the T-shaped push plate 6 and the workbench 5 can remain relatively still. When the workbench 5 moves in a circle, the first long pin 57 is engaged with the V-shaped groove 56, so that the T-shaped push plate 6 can move inward or outward on the upper end surface of the workbench 5.

[0039] like Figure 4As shown in Fig. 15 or 16, the T-shaped push plate 6 can slide inward or outward on the upper surface of the workbench 5, and when the workbench 5 moves circumferentially, it will drive the corresponding T-shaped push plate 6 and the first long pin 57 to move circumferentially; under the engagement of the first long pin 57 with the arc groove 55 and the V-shaped groove 56, the state of the T-shaped push plate 6 can be controlled; the arc groove 55 corresponds to the corresponding feeding station 60, assembling station 61, and welding station 62 respectively, and the V-shaped groove 56 corresponds to the discharging station 63; when the workbench 5 rotates circumferentially, it can drive the corresponding first long pin 57, T-shaped push plate 6, etc. to move synchronously in a circle. Under the engagement of the first long pin 57 with the arc groove 55, the corresponding T-shaped push plate 6 will remain relatively stationary with respect to the workbench 5, that is, when the T-shaped push plate 6 is at the innermost end, it remains relatively stationary with respect to the workbench 5, that is, the corresponding fixture base 9 is always in a closed state when at the feeding station 60, assembling station 61, and welding station 62, and can stably clamp and fix the semiconductor chip 28; when the first long pin 57, T-shaped push plate 6, and workbench 5 rotate to the discharging station 63, that is, the first long pin 57 enters into engagement with the inner wall of the V-shaped groove 56. Under the engagement of the V-shaped groove 56, the first long pin 57 and the T-shaped push plate 6 will move outward. When the T-shaped push plate 6 moves outward to the top position, the corresponding fixture base 9 will open, and at this time, the semiconductor chip 28 can be removed from the fixture base 9. When the first long pin 57, workbench 5, etc. continue to move circumferentially, under the engagement of the first long pin 57 with the V-shaped groove 56, the corresponding T-shaped push plate 6 will move inward again, that is, the corresponding fixture base 9 will close, and it can be used cyclically.

[0040] The wire feeding device further includes a T-shaped seat 18 fixedly connected to the operating table 1. Long guide rods 19 are respectively slidably connected to the inner walls at the left and right ends of the T-shaped seat 18. A clutch table 22 is fixedly connected to the left end surfaces of the two long guide rods 19. Two telescopic rods 20 are fixedly connected to the inner wall of the middle part of the T-shaped seat 18. A driving seat 21 is fixedly connected to the telescopic ends of the two telescopic rods 20; A vertical plate 23 is fixedly connected to the upper surface of the driving seat 21. Positioning springs 24 are respectively fixedly connected to the left and right end surfaces of the vertical plate 23. Spring retaining seats 25 fixedly connected to the clutch table 22 are respectively fixedly connected to the outer ends of the two positioning springs 24. The vertical plate 23 is also slidably connected to the inner wall of the clutch table 22. U-shaped frames 26 are respectively fixedly connected to the left and right sides of the upper surface of the clutch table 22. Clamping rods 31 are respectively arranged on the corresponding U-shaped frames 26. When the vertical plate 23 slides left and right in the inner wall of the clutch table 22, a structure in which the clamping rods 31 open or close can be formed.

[0041] As Figures 6-8As shown, the T-shaped seat 18 is used to support the wire feeding device. The long guide rod 19 can slide left and right on the inner wall of the T-shaped seat 18, that is, the limit clutch table 22 can only move left and right; the telescopic rod 20 is used to drive the corresponding drive seat 21 to move left and right. The telescopic rod 20 is a prior art and will not be elaborated here; the vertical plate 23 can slide left and right on the inner wall of the clutch table 22. The spring retaining seat 25, the positioning spring 24, and the vertical plate 23 are installed and shaped as Figure 8 As shown, the spring retaining seat 25 supports the positioning spring 24. The two positioning springs 24 can position the vertical plate 23 under normal conditions, that is, keep the vertical plate 23 in the middle position of the clutch table 22; the clutch table 22 and the U-shaped frame 26 support and limit parts such as the clamping rod 31; when the telescopic rod 20 works, it can make the drive seat 21 move left or right. When the drive seat 21 moves left, it will make the corresponding vertical plate 23 move left. Under the connection of the positioning spring 24 and the spring retaining seat 25, the vertical plate 23 moving left can drive the clutch table 22, the U-shaped frame 26, the clamping rod 31, etc. to move left or right synchronously. When the drive seat 21, the clutch table 22, the U-shaped frame 26, the clamping rod 31, etc. move left to the specified position, that is, the clutch table 22 moves left to the frontmost position, that is, when the clutch table 22 contacts the fixture seat 9, at this time, the clutch table 22, the U-shaped frame 26, and the clamping rod 31 no longer move left. When the drive seat 21 continues to move left, it will drive the vertical plate 23 to move left and compress the positioning spring 24 at the left end and stretch the positioning spring 24 at the right end. At this time, the vertical plate 23 slides left on the inner wall of the clutch table 22, which can make the clamping rod 31 open; when the drive seat 21, the clutch table 22, the U-shaped frame 26, the clamping rod 31, etc. move right to the specified position, that is, the clutch table 22 moves right to the frontmost position, that is, when the clutch table 22 contacts the fixture seat 9, at this time, the clutch table 22, the U-shaped frame 26, and the clamping rod 31 no longer move right. When the drive seat 21 continues to move right, it will drive the vertical plate 23 to move right and compress the positioning spring 24 at the right end and stretch the positioning spring 24 at the left end. At this time, the vertical plate 23 slides right on the inner wall of the clutch table 22, which can make the clamping rod 31 close and clamp.

[0042] A guide plate 27 is fixedly connected to the upper surface of the vertical plate 23, and the guide plate 27 is slidably connected to the lower surfaces of the two U-shaped frames 26; the clamping rods 31 are respectively slidably connected to the inner walls of the U-shaped frames 26, and second sliding pins 34 are respectively provided at the lower ends of the clamping rods 31. A plurality of guide grooves 35 matching the second sliding pins 34 are formed on the guide plate 27.

[0043] As Figures 9-10As shown, the clamping rod 31 can slide left and right on the inner wall of the U-shaped frame 26. There are two clamping rods 31 in each group, which are symmetrically arranged and are both slidably connected to the inner wall of the U-shaped frame 26; the guide plate 27 can move left and right following the vertical plate 23, and the guide plate 27 is also slidably connected to the U-shaped frame 26, improving the stability of the guide plate 27; through the cooperation of the provided guide groove 35 and the second sliding pin 34, when the guide plate 27 moves, it can control the second sliding pin 34 to move outward or inward.

[0044] The lower end surfaces of the clamping rods 31 are respectively fixedly connected with boxes 32, and the second sliding pins 34 are respectively slidably connected to the inner walls of the corresponding boxes 32. The bottom inner walls of the boxes 32 are respectively fixedly connected with second springs 33 that cooperate with the second sliding pins 34; the guide grooves 35 respectively include short horizontal grooves 36, long horizontal grooves 38, first inclined grooves 37 and second inclined grooves 39. The short horizontal grooves 36, first inclined grooves 37, long horizontal grooves 38, and second inclined grooves 39 are connected end to end to form a closed space. The bottom inner walls of the first inclined grooves 37 are respectively fixedly connected with first wedge-shaped blocks 40 that cooperate with the second sliding pins 34, and the bottom inner walls of the long horizontal grooves 38 are respectively fixedly connected with second wedge-shaped blocks 41 that cooperate with the second sliding pins 34.

[0045] As Figures 9-12 shown, the second sliding pin 34 can be slidably connected to the inner wall of the box 32 up and down. The second spring 33 always has a downward driving force on the second sliding pin 34, so that the second sliding pin 34 is in the bottommost position under normal conditions, that is, the second sliding pin 34 can be stably engaged with the guide groove 35; the installation and shape of the short horizontal groove 36, first inclined groove 37, long horizontal groove 38, and second inclined groove 39 are as Figure 12 shown. Under the engagement of the second sliding pin 34 and the short horizontal groove 36, when the guide plate 27 moves to the left, the second sliding pin 34 can be in a short-term static state. The second sliding pin 34 is at the innermost end under the engagement of the short horizontal groove 36, that is, the two clamping rods 31 are in a closed clamping state. When the guide plate 27 moves to the left until the second sliding pin 34 enters the inner wall of the first inclined groove 37, it will drive the two second sliding pins 34 to move outward, that is, the corresponding clamping rods 31 move outward. When the guide plate 27 moves to the left until the second sliding pin 34 enters the inner wall of the long horizontal groove 38, at this time, the two second sliding pins 34 are the farthest apart, that is, the corresponding clamping rods 31 are in an open state; when the guide plate 27 moves to the right to reset, the second sliding pin 34 will move along the inner wall of the long horizontal groove 38, that is, the second sliding pin 34 and the clamping rod 31 are in an open state. When the guide plate 27 moves to the right until the second sliding pin 34 enters the inner wall of the second inclined groove 39, at this time, the second sliding pin 34 and the clamping rod 31 are still in an open state. When the guide plate 27 continues to move to the left, under the engagement of the second sliding pin 34 and the second inclined groove 39, it can make the second sliding pin 34 and the clamping rod 31 move inward, that is, the clamping rod 31 clamps and fixes again; the installation and shape of the first wedge-shaped block 40, second wedge-shaped block 41, and second sliding pin 34 are as Figures 11-12As shown, the first wedge block 40 is arranged at the connection of the first inclined slot 37 and the long horizontal slot 38, and the second wedge block 41 is arranged at the connection of the second inclined slot 39 and the long horizontal slot 38. One ends of the first wedge block 40 and the second wedge block 41 are respectively provided with inclined surfaces, and the other ends are respectively provided with right-angled surfaces. The functions of the first wedge block 40 and the second wedge block 41 are to limit that the second sliding pin 34 can only move forward in the corresponding guiding slot 35 and prevent the second sliding pin 34 from moving back. That is, when the second sliding pin 34 moves on the inner wall of the first inclined slot 37, it will encounter the first wedge block 40. Under the action of the inclined surface of the first wedge block 40, the second sliding pin 34 will move upward, and part of the second sliding pin 34 enters the inner wall of the box body 32 and compresses the second spring 33. When the second sliding pin 34 moves to enter the inner wall of the long horizontal slot 38, it will disengage from the first wedge block 40. At this time, the second sliding pin 34 will move downward and reset under the self-elastic force of the second spring 33, that is, the second sliding pin 34 contacts the bottom wall of the long horizontal slot 38. When the guide plate 27 moves reversely to the right, at this time, the second sliding pin 34 can only move along the inner wall of the long horizontal slot 38 under the blocking action of the right-angled surface of the first wedge block 40 and will not enter the inner wall of the first inclined slot 37 from the inner wall of the long horizontal slot 38 until it moves to the second wedge block 41 and enters the inner wall of the second inclined slot 39. Similarly, when the second sliding pin 34 enters the inner wall of the second inclined slot 39, at this time, when the guide plate 27 moves to the left, under the blocking of the right-angled surface of the second wedge block 41, the second sliding pin 34 can only move along the inner wall of the second inclined slot 39 and will not enter the inner wall of the long horizontal slot 38 from the inner wall of the second inclined slot 39, thereby restricting the second sliding pin 34 to only move forward; when the driving seat 21, the clutch table 22, etc. move synchronously to the left, they can drive the corresponding clamping rod 31, the wire 30, etc. to move synchronously to the left. When the clutch table 22 moves to the left and contacts the fixture seat 9, that is, when the wire 30 reaches the upper end position of the corresponding semiconductor chip 28, at this time, when the driving seat 21 continues to move to the left, it will no longer drive the clutch table 22 to move to the left, that is, the corresponding wire 30, the clamping rod 31, etc. will no longer move to the left. At this time, when the driving seat 21 moves to the left, it will drive the vertical plate 23 and the guide plate 27 to move to the left. When the guide plate 27 moves to the left, under the engagement of the second sliding pin 34 and the short horizontal slot 36, the clamping rod 31 will still be in a short-term clamping state, which can provide a short operating space for the driving seat 21 to push the guide plate 49, that is, the driving seat 21 pushes the guide plate 49 to move backward, so that the pressing strip 51 moves downward to squeeze and fix the wire 30, and then the clamping rod 31 moves outward to open, which can prevent the wire 30 from moving out of position and make the wire 30 accurately squeezed on the solder joint 29. When the driving seat 21 continues to move to the left, it can make the second sliding pin 34 enter the inner wall of the first inclined slot 37. Under the engagement of the first inclined slot 37, the clamping rod 31 can move outward to open, that is, at this time, the clamping rod 31 no longer clamps the wire 30. When the driving plate moves to the top position, that is, it will make the second sliding pin 34 enter the inner wall of the long horizontal slot 38. At this time, the second sliding pin 34 and the clamping rod 31 are at the outermost end. When the driving seat 21 moves to the right to reset,At this time, corresponding clutch platforms 22, clamping rods 31, etc. will not immediately move to the right along with the driving seat 21 under the stretched and compressed states of the positioning spring 24. That is, when the driving seat 21 moves to the right, it can make the second sliding pin 34 move along the inner wall of the long horizontal groove 38. When the driving seat 21 moves to the right to make the vertical plate 23 located at the middle position of the clutch platform 22, that is, the corresponding positioning spring 24 no longer stretches or compresses. At this time, the second sliding pin 34 is still on the inner wall of the long horizontal groove 38, that is, at the alignment position at the connection of the second inclined groove 39 and the short horizontal groove 36. At this time, the clamping rod 31 is in an open state, which can prevent the clamping rod 31 from mis-clamping the wire 30 when moving back to the right, so that the wire 30 can be stably fixed on the corresponding semiconductor chip 28. When the driving seat 21 continues to move to the right until the clutch platform 22 contacts the T-shaped seat 18, at this time the clutch platform 22 no longer moves to the right. At this time, the clamping rod 31 is in an open state. After the wire 30 is manually fed or fed by a manipulator to the inner sides of the corresponding two clamping rods 31, when the driving seat 21 continues to move to the right, the corresponding first sliding pin 8 will enter the inner wall of the second inclined groove 39. Under the engagement of the second inclined groove 39, the second sliding pin 34 and the clamping rod 31 will move inward, that is, the clamping rod 31 moves inward to clamp and fix the wire 30. When the driving seat 21 moves to the left to feed the wire 30 again, the corresponding clutch platform 22, clamping rod 31, etc. will not immediately move to the left along with the driving seat 21 under the stretched and compressed states of the positioning spring 24. That is, the driving seat 21 will drive the vertical plate 23 and the guide plate 27 to move to the left. The guide plate 27 moves to the left relative to the clutch platform 22. At this time, the second sliding pin 34 will move inward under the engagement of the second inclined groove 39, that is, the corresponding clamping rod 31 moves inward to clamp and fix the wire 30. When the vertical plate 23 moves to the left to the middle position of the clutch platform 22, that is, the positioning spring 24 is no longer compressed or stretched. At this time, the second sliding pin 34 enters the inner wall of the short horizontal groove 36, that is, the clamping rod 31 moves inward to the innermost end to stably clamp and fix the wire 30. At this time, when the driving seat 21 continues to move to the left, it will drive the clutch platform 22, the clamping rod 31, the wire 30, etc. to move to the left, and feed the wire 30 to the semiconductor chip 28 again, and can be used cyclically.

[0046] The inner walls of the support columns 4 are respectively slidably connected with supporting plates 42. On both sides of the upper surface of the supporting plates 42, extension rods 50 slidably connected with the working table 5 are respectively fixedly connected. The pressing strips 51 are respectively fixedly connected to the corresponding extension rods 50. The bottom inner walls of the support columns 4 are respectively fixedly connected with tension springs 43, and the upper surfaces of the tension springs 43 are respectively fixedly connected to the corresponding supporting plates 42; engaging devices cooperating with the supporting plates 42 are also respectively arranged on the inner walls of the support columns 4.

[0047] Such as Figures 13-14As shown, the pallet 42 is slidably connected to the inner wall of the support column 4 in the up and down direction, and the extension rod 50 passes through the workbench 5 and is slidably connected to the inner wall of the workbench 5 in the up and down direction; there are two pressing strips 51 in each group, and when descending to squeeze and fix the wire 30, they can fall on both sides of the solder joint 29, so that the contact position between the solder joint 29 and the wire 30 is exposed, thus facilitating laser welding; the tension spring 43 always has a downward pulling force on the pallet 42, so that the pallet 42 has a downward driving force under normal conditions; through the provided engaging device, the position of the pallet 42 can be locked, that is, when the pallet 42 is in the topmost position, the engaging device can lock the pallet 42; when the engaging device is opened, at this time the pallet 42 can move downward under the pulling force of the tension spring 43, that is, the corresponding extension rod 50 and pressing strip 51 move downward, and when the pressing strip 51 moves downward to the specified position, that is, after squeezing and fixing the wire 30, it no longer moves downward.

[0048] The engaging device respectively includes a second trapezoidal wedge block 44 that cooperates with the pallet 42. The second trapezoidal wedge blocks 44 are respectively slidably connected to the inner walls of the corresponding support columns 4. One side end faces of the second trapezoidal wedge blocks 44 are respectively fixedly connected with pull rods 46. Third springs 45 that cooperate with the second trapezoidal wedge blocks 44 are respectively sleeved on the outer surfaces of the pull rods 46. Both ends of the outer surface of the support column 4 are respectively slidably connected with first guide rods 48. Inner ends of the two first guide rods 48 are respectively fixedly connected with T-shaped connection seats 47. The pull rods 46 are respectively fixedly connected to the corresponding T-shaped connection seats 47. Outer ends of the two first guide rods 48 are respectively fixedly connected with a guide plate 49 that cooperates with the drive seat 21.

[0049] As Figures 13-14As shown in the figure, the second trapezoidal wedge block 44 and the pull rod 46 can slide inward or outward on the inner wall of the support column 4. The third spring 45 always has an outward driving force on the second trapezoidal wedge block 44, so that the second trapezoidal wedge block 44 is at the outermost end under normal conditions. The lower end surface of the outer end of the second trapezoidal wedge block 44 is provided with an inclined surface, and the upper end surface is provided with a flat surface, which can make the support plate 42 slide upward unidirectionally and cannot slide downward. That is, when the support plate 42 moves from bottom to top, when the support plate 42 moves upward to contact the inclined surface, the second trapezoidal wedge block 44 can be moved inward under the action of the inclined surface, and the third spring 45 is compressed. When the support plate 42 moves upward to disengage from the second trapezoidal wedge block 44, at this time, the second trapezoidal wedge block 44 will move outward and reset under the elastic force of the third spring 45. After the second trapezoidal wedge block 44 moves outward and resets, when the support plate 42 moves downward, it will contact the flat surface of the second trapezoidal cut, and the position of the support plate 42 will be locked under the block of the flat surface; both ends of the outer surface of the support column 4 are provided with ear plates, and the first guide rods 48 are respectively slidably connected to the inner walls of the corresponding ear plates in the front-back or left-right direction, which is equivalent to the first guide rods 48 being slidably connected to both ends of the outer surface of the support column 4. The ear plates can limit the first guide rods 48 to move only inward or outward; when the support column 4, the guide plate 49, etc. are selected to the assembly station 61, when the driving seat 21 moves to the left, it will first make the clutch table 22 contact the fixture seat 9, that is, limit the clutch table 22 to move to the left, that is, the wire 30 moves to the upper position of the semiconductor chip 28. At this time, when the driving seat 21 continues to move to the left, it will contact the guide plate 49. When the guide plate 49 moves to the left, it will drive the corresponding T-shaped connecting rod, pull rod 46, second trapezoidal wedge block 44, etc. to move to the left. When the second trapezoidal wedge block 44 moves to the left and completely enters the inner wall of the support column 4, the corresponding support plate 42 will move downward under the tension of the tension spring 43. When the support plate 42 moves downward, it will make the pressure strip 51 move downward and squeeze and fix the wire 30 on the solder joint 29. At this time, when the driving seat 21 continues to move to the left, it will make the clamping rod 31 open. When the driving seat 21 moves to the right and resets, under the engagement of the guide groove 35 and the second sliding pin 34, the clamping rod 31 can always be in an open state, that is, it can prevent the wire 30 from being clamped again, that is, prevent the wire 30 from being pulled out of position.

[0050] The lower end surfaces of the support plate 42 are respectively fixedly connected with second long pins 58 that are slidably connected to the support column 4, and the blanking station 63 is provided with arc-shaped wedges 59 that cooperate with the second long pins 58.

[0051] As Figure 14 , 16 shown, the second long pins 58 can slide up and down on the inner wall of the support column 4, and the arc-shaped wedges 59 are fixedly connected to the upper end surface of the operating table 1, that is, arranged at the blanking station 63. As Figure 16As shown, after the support column 4 and the second long pin 58 rotate to the blanking station 63, under the action of the inclined surface of the arc wedge block 59, the second long pin 58 can move upward. When the second long pin 58 moves upward, it will drive the pallet 42 to move upward. When the pallet 42 moves upward, it will drive the corresponding pressure strip 51 and the like to move upward. When the pressure strip 51 moves upward, it no longer squeezes the wire 30 and the semiconductor chip 28. And at this time, the fixture base 9 can be opened under the engagement of the V-shaped groove 56 and the first long pin 57. At this time, the semiconductor chip 28 in the fixture base 9 can be taken, that is, the semiconductor chip 28 is transported to the blanking conveyor 15 by the blanking manipulator 17; when the pallet 42 and the second long pin 58 move upward to the topmost position, that is, when they move upward to the upper end position of the second trapezoidal wedge block 44, under the block of the second trapezoidal wedge block 44, the pallet 42 and the pressure strip 51 can be in the top state, that is, after loading the semiconductor chip 28 and the wire 30, it can work in a cycle again, that is, when the support column 4 rotates to the assembly station 61, the pressure strip 51 continues to squeeze and fix the wire 30 and the semiconductor chip 28, and the whole device can be used cyclically.

[0052] When the present invention is in use, after the feeding station 60 is completed, that is, when the semiconductor chip 28 is fixed on the corresponding fixture base 9, the rotating disk 3 rotates to make the corresponding workbench 5, fixture base 9, semiconductor chip 28, etc. rotate to the area of the assembly station 61. When the wire feeding device works, that is, when the driving seat 21, the clamping rod 31, the wire 30, etc. move synchronously to the left, it can drive the wire 30 to reach the specified position above the corresponding semiconductor chip 28, that is, at the solder joint 29 of the semiconductor chip 28. When the driving seat 21 moves to the specified position to the left, the clamping rod 31 can move outward, and the corresponding clamping rod 31 no longer clamps and fixes the wire 30. The pressure strip 51 moves downward. When the pressure strip 51 moves downward, it can squeeze and fix the wire 30 downward, so that the wire 30 contacts the solder joint 29 position. At this time, under the extrusion of the pressure strip 51, the wire 30 can be temporarily fixed at the upper end position of the semiconductor chip 28 and can move synchronously with the semiconductor chip 28. When the rotating disk 3 continues to rotate to the welding station 62, through the provided laser welding machine 52, the wire 30 and the semiconductor chip 28 can be welded and fixed. After the welding work is completed, when the rotating disk 3 continues to rotate to make the workbench 5, the semiconductor chip 28, and the wire 30 move to the blanking station 63, at this time, the corresponding fixture base 9 will be opened, no longer fixing the semiconductor chip 28, and the pressure strip 51 moves upward and no longer squeezes the semiconductor chip 28 and the wire 30. When the blanking manipulator 17 works, the unloading work can be completed, that is, the entire assembly process is completed. The device operates fully automatically, can replace manual labor to assemble and weld the semiconductor chip 28 and the wire 30, reduces the occupation of human resources, improves production efficiency, has high precision, reduces labor costs, and can prevent the welding gas from damaging the workers.

[0053] The specific embodiments described herein are merely illustrative of the spirit of the present invention. Those skilled in the art to which the present invention pertains may make various modifications or supplements to the described specific embodiments or use similar means to replace them, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

Claims

1. A thermoelectric semiconductor laser welding integrated machine, comprising an operating table (1), characterized in that: The upper end of the operation table (1) is provided with a rotatable turntable (3). There are also a feeding station (60), an assembly station (61), a welding station (62), and a discharging station (63) on the operation table (1) that cooperate with the turntable (3). The operation table (1) is provided with a plurality of evenly distributed workbenches (5). The workbenches (5) are provided with a plurality of evenly distributed fixture seats (9) for loading and fixing semiconductor chips (28). The workbenches (5) are also respectively provided with pressing strips (51) that cooperate with the semiconductor chips (28). The assembly station (61) is provided with a wire feeding device. The wire feeding device includes a driving seat (21) that can move left and right. The upper end of the driving seat (21) is provided with multiple groups of clamping rods (31). The wires (30) are respectively clamped on the corresponding clamping rods (31). When the driving seat (21) moves to the specified position to the left, a structure can be formed in which the clamping rods (31) move outward and the pressing strips (51) move downward. The welding station (62) is provided with a laser welding machine (52) for welding the semiconductor chips (28) and the wires (30). When the turntable (3) rotates to make the workbench (5) reach the discharging station (63), a structure can be formed in which the fixture seat (9) opens and the pressing strip (51) moves upward. The wire feeding device further includes a T-shaped seat (18) fixedly connected to the operation table (1). The inner walls of the left and right ends of the T-shaped seat (18) are respectively slidably connected with long guide rods (19). A clutch platform (22) is fixedly connected to the left end surfaces of the two long guide rods (19). Two telescopic rods (20) are fixedly connected to the inner wall of the middle part of the T-shaped seat (18). The driving seat (21) is fixedly connected to the telescopic ends of the two telescopic rods (20). A vertical plate (23) is fixedly connected to the upper end surface of the driving seat (21). Positioning springs (24) are respectively fixedly connected to the left and right end surfaces of the vertical plate (23). The outer ends of the two positioning springs (24) are respectively fixedly connected to spring retaining seats (25) fixedly connected to the clutch platform (22). The vertical plate (23) is also slidably connected to the inner wall of the clutch platform (22). U-shaped frames (26) are respectively fixedly connected to the left and right sides of the upper end surface of the clutch platform (22). The clamping rods (31) are respectively arranged on the corresponding U-shaped frames (26). When the vertical plate (23) slides left and right in the inner wall of the clutch platform (22), a structure can be formed in which the clamping rods (31) open or close. A guide plate (27) is fixedly connected to the upper end surface of the vertical plate (23). The guide plate (27) is also slidably connected to the lower end surfaces of the two U-shaped frames (26). The clamping rods (31) are respectively slidably connected to the inner walls of the U-shaped frames (26). Second sliding pins (34) are respectively arranged at the lower ends of the clamping rods (31). A plurality of guide grooves (35) that cooperate with the second sliding pins (34) are formed in the guide plate (27).

2. The thermoelectric semiconductor laser welding integrated machine according to claim 1, wherein: Four uniformly distributed support columns (4) are fixedly connected to the inner wall of the rotating disk (3), the operating table (5) is fixedly connected to the upper surface of the support columns (4), and the fixture seats (9) are respectively fixedly connected to the upper surface of the corresponding operating tables (5); first trapezoidal wedges (10) are respectively slidably connected to the inner walls on both sides of the fixture seat (9), first springs (11) are respectively fixedly connected to the outer ends of the two first trapezoidal wedges (10), two short guide rods (13) are respectively fixedly connected to both end surfaces of the fixture seat (9), a connecting plate (12) is slidably connected to the outer surface of each of the two short guide rods (13), the other ends of the first springs (11) are respectively fixedly connected to the corresponding connecting plates (12), first sliding pins (8) are respectively fixedly connected to the inner walls of the connecting plates (12), movable T-shaped push plates (6) are respectively arranged on the upper surface of the operating table (5), and a plurality of short inclined grooves (7) matched with the first sliding pins (8) are respectively formed in the T-shaped push plates (6).

3. The thermoelectric semiconductor laser welding integrated machine according to claim 2, characterized in that: The T-shaped push plates (6) are respectively slidably connected to the upper surface of the operating table (5), first long pins (57) are respectively fixedly connected to the lower surfaces of the T-shaped push plates (6), a circular ring plate (54) is fixedly connected to the upper surface of the operating table (1), a circular ring groove matched with the first long pins (57) is formed in the circular ring plate (54), the circular ring groove includes an arc groove (55) and a V-shaped groove (56), when the operating table (5) moves circumferentially, the T-shaped push plates (6) can be kept relatively stationary with respect to the operating table (5) under the engagement of the first long pins (57) and the arc groove (55), and when the operating table (5) moves circumferentially, the T-shaped push plates (6) can move inwards or outwards on the upper surface of the operating table (5) under the engagement of the first long pins (57) and the V-shaped groove (56).

4. A thermoelectric semiconductor laser welding integrated machine according to claim 1, characterized in that: Box bodies (32) are respectively fixedly connected to the lower surfaces of the clamping rods (31), second sliding pins (34) are respectively slidably connected to the inner walls of the corresponding box bodies (32), and second springs (33) matched with the second sliding pins (34) are respectively fixedly connected to the bottom inner walls of the box bodies (32); the guiding grooves (35) respectively include a short horizontal groove (36), a long horizontal groove (38), a first inclined groove (37) and a second inclined groove (39), the short horizontal groove (36), the first inclined groove (37), the long horizontal groove (38) and the second inclined groove (39) are connected end to end to form a closed space, first wedge-shaped blocks (40) matched with the second sliding pins (34) are respectively fixedly connected to the bottom inner walls of the first inclined grooves (37), and second wedge-shaped blocks (41) matched with the second sliding pins (34) are respectively fixedly connected to the bottom inner walls of the long horizontal grooves (38).

5. The thermoelectric semiconductor laser welding integrated machine according to claim 2, wherein: A support plate (42) is respectively slidably connected to the inner wall of the support column (4), extension rods (50) slidably connected to the operating table (5) are respectively fixedly connected to both sides of the upper surface of the support plate (42), pressing strips (51) are respectively fixedly connected to the corresponding extension rods (50), tension springs (43) are respectively fixedly connected to the bottom inner walls of the support columns (4), and the upper surfaces of the tension springs (43) are respectively fixedly connected to the corresponding support plates (42); a clamping device matched with the support plate (42) is also respectively arranged on the inner wall of the support column (4).

6. The thermoelectric semiconductor laser welding integrated machine according to claim 5, wherein: The engaging devices respectively include second trapezoidal wedges (44) that cooperate with the pallet (42). The second trapezoidal wedges (44) are respectively slidably connected to the inner walls of the corresponding support columns (4). One end faces of the second trapezoidal wedges (44) are respectively fixedly connected with pull rods (46). Third springs (45) that cooperate with the second trapezoidal wedges (44) are respectively sleeved on the outer surfaces of the pull rods (46). The outer surfaces of the two ends of the support columns (4) are respectively slidably connected with first guide rods (48). T-shaped connecting seats (47) are respectively fixedly connected to the inner ends of the two first guide rods (48). The pull rods (46) are respectively fixedly connected to the corresponding T-shaped connecting seats (47). Guide plates (49) that cooperate with the driving seat (21) are respectively fixedly connected to the outer ends of the two first guide rods (48).

7. The thermoelectric semiconductor laser welding integrated machine according to claim 5, characterized in that: Second long pins (58) that are slidably connected to the support columns (4) are respectively fixedly connected to the lower surfaces of the pallet (42). Arc-shaped wedges (59) that cooperate with the second long pins (58) are provided at the blanking station (63).

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