High sensitivity nested ring-on-ring single chip three-axis mems gyroscope

Abstract

The application relates to a three-axis gyroscope, in particular to a high-sensitivity nested wheel ring single-chip three-axis MEMS gyroscope chip. The application solves the problems of low sensitivity and low measurement accuracy of the existing three-axis gyroscope. The high-sensitivity nested wheel ring single-chip three-axis MEMS gyroscope chip comprises a resonator part and an electrode part; the resonator part comprises a wheel structure and a ring structure; the wheel structure comprises a disc-shaped mass; two left-right symmetrical notches are arranged on the outer side surface of the disc-shaped mass; the ring structure comprises a circular ring-shaped mass B; the circular ring-shaped mass B is coaxially sleeved on the outer side of a circular ring-shaped mass A; the electrode part comprises a square base; the square base is coaxially arranged with the disc-shaped mass. The application is suitable for high-precision and high-tech fields such as military navigation and deep space exploration.

Description

Technical Field

[0001] This invention relates to a three-axis gyroscope, specifically a high-sensitivity nested ring monolithic three-axis MEMS gyroscope chip. Background Technology

[0002] A three-axis gyroscope is a core sensing device in an inertial navigation system, capable of simultaneously measuring angular velocity input along the x, y, and z axes. It is widely used in high-precision fields such as military navigation and deep space exploration, and has extremely broad application prospects. Existing three-axis gyroscopes are mainly divided into two categories: One type is the monolithic integrated three-axis gyroscope. This type suffers from two problems: firstly, due to the geometric limitations of its resonator, its area utilization is low, resulting in low sensitivity; secondly, it cannot achieve complete decoupling between the driving and detection directions, leading to large coupling errors between modes and thus low measurement accuracy. The other type is the assembled three-axis gyroscope (composed of three single-axis gyroscopes). This type suffers from low measurement accuracy due to limitations in the assembly process. Therefore, it is necessary to invent a high-sensitivity nested ring monolithic three-axis MEMS gyroscope chip to solve the problems of low sensitivity and low measurement accuracy in existing three-axis gyroscopes. Summary of the Invention

[0003] To address the problems of low sensitivity and low measurement accuracy in existing three-axis gyroscopes, this invention provides a high-sensitivity nested wheel ring monolithic three-axis MEMS gyroscope chip.

[0004] This invention is achieved using the following technical solution:

[0005] A high-sensitivity nested ring monolithic three-axis MEMS gyroscope chip, including a resonator part and an electrode part;

[0006] The resonator part includes a wheel structure and a ring structure;

[0007] The wheel structure includes a disc-shaped mass block;

[0008] Two symmetrically distributed slots are opened on the outer side of the disc-shaped mass block; the bottom of the two slots are connected to two symmetrically distributed straight coupled cantilever beams A.

[0009] The ends of the two straight coupled cantilever beams A are connected to a circular support frame.

[0010] The outer side of the circular support frame is connected to eight double-sided comb-shaped coupled cantilever beams A that are symmetrically distributed along the circumference, four straight support cantilever beams A that are symmetrically distributed along the circumference, and two straight coupled cantilever beams B that are symmetrically distributed front and back.

[0011] Four straight support beams A are located one-to-one between the first double-sided comb-shaped coupling beam A and the second double-sided comb-shaped coupling beam A, between the third double-sided comb-shaped coupling beam A and the fourth double-sided comb-shaped coupling beam A, between the fifth double-sided comb-shaped coupling beam A and the sixth double-sided comb-shaped coupling beam A, and between the seventh double-sided comb-shaped coupling beam A and the eighth double-sided comb-shaped coupling beam A; the ends of the four straight support beams A are connected one-to-one to four anchor points A symmetrically distributed along the circumference;

[0012] Two straight coupled suspension beams B are located one-to-one between the second double-sided comb-shaped coupled suspension beam A and the third double-sided comb-shaped coupled suspension beam A, and between the sixth double-sided comb-shaped coupled suspension beam A and the seventh double-sided comb-shaped coupled suspension beam A; the ends of the two straight coupled suspension beams B are connected to a circular mass block A.

[0013] The inner side of the annular mass block A is connected to two suspended mass blocks that are symmetrically distributed from left to right; the two suspended mass blocks are located one-to-one between the fourth double-sided comb-shaped coupling suspension beam A and the fifth double-sided comb-shaped coupling suspension beam A, and between the eighth double-sided comb-shaped coupling suspension beam A and the first double-sided comb-shaped coupling suspension beam A.

[0014] The ring structure includes a circular annular mass block B;

[0015] An annular mass block B is coaxially fitted on the outside of an annular mass block A; the inner surface of the annular mass block B is connected to eight straight coupling suspension beams C that are symmetrically distributed along the circumference, and the circumferential positions of the eight straight coupling suspension beams C correspond one-to-one with the circumferential positions of the four straight supporting suspension beams A, the two straight coupling suspension beams B, and the two suspended mass blocks.

[0016] The ends of the eight straight coupled cantilever beams C are connected one-to-one with eight circumferentially symmetrically distributed U-shaped support cantilever beams.

[0017] The inner sides of the eight square-shaped support beams are connected one-to-one with eight straight support beams B that are symmetrically distributed along the circumference.

[0018] The ends of the eight straight support beams B are connected to eight anchor points B that are symmetrically distributed along the circumference.

[0019] The outer surface of the annular mass block B is connected to eight double-sided comb-shaped coupling suspension beams B that are symmetrically distributed along the circumference, and the circumferential positions of the eight double-sided comb-shaped coupling suspension beams B correspond one-to-one with the circumferential positions of the eight straight coupling suspension beams C.

[0020] The electrode portion includes a square base;

[0021] A square base and a disk-shaped mass block are coaxially arranged; the upper surface of the square base is sputtered with two front-to-back symmetrically distributed arc-shaped planar electrodes, two front-to-back symmetrically distributed drum-shaped planar electrodes A, two front-to-back symmetrically distributed drum-shaped planar electrodes B, eight pairs of circumferentially symmetrically distributed strip-shaped planar electrodes A, four circumferentially symmetrically distributed point-shaped planar electrodes A, two left-to-right symmetrically distributed T-shaped planar electrodes, two pairs of left-to-right symmetrically distributed arc-shaped planar electrodes A, two pairs of left-to-right symmetrically distributed arc-shaped planar electrodes B, eight circumferentially symmetrically distributed point-shaped planar electrodes B, eight pairs of circumferentially symmetrically distributed arc-shaped planar electrodes C, and eight pairs of circumferentially symmetrically distributed strip-shaped planar electrodes B.

[0022] The upper surfaces of the two arc-shaped planar electrodes and the lower surface of the disk-shaped mass block together form two parallel capacitors A;

[0023] Two drum-shaped planar electrodes A are located between two arc-shaped planar electrodes; the upper surfaces of the two drum-shaped planar electrodes A and the lower surface of the disk-shaped mass block together form two parallel capacitors B;

[0024] Both drum-shaped planar electrodes B are located between two drum-shaped planar electrodes A; the upper surfaces of the two drum-shaped planar electrodes B and the lower surface of the disk-shaped mass block together form two parallel capacitors C;

[0025] Eight pairs of single-sided comb-shaped three-dimensional electrodes A are bonded one-to-one on the upper surface of eight pairs of strip planar electrodes A, which are symmetrically distributed along the circumference. The eight pairs of single-sided comb-shaped three-dimensional electrodes A are symmetrically embedded on both sides of eight double-sided comb-shaped coupling cantilever beams A, and the eight pairs of single-sided comb-shaped three-dimensional electrodes A and the eight double-sided comb-shaped coupling cantilever beams A correspond to each other to form eight pairs of comb-shaped capacitors A.

[0026] The upper surfaces of the four point-shaped planar electrodes A are bonded to the lower surfaces of the four anchor points A in a one-to-one correspondence;

[0027] The upper surfaces of the two T-shaped planar electrodes, together with the lower surface of the annular mass block A and the lower surfaces of the two suspended mass blocks, form two parallel capacitors D.

[0028] Two pairs of arc-shaped planar electrodes A are symmetrically distributed on both sides of two T-shaped planar electrodes; the upper surfaces of the two pairs of arc-shaped planar electrodes A and the lower surface of the annular mass block A together form two pairs of parallel capacitors E.

[0029] Two pairs of arc-shaped planar electrodes B are symmetrically distributed on both sides of two pairs of arc-shaped planar electrodes A; the upper surfaces of the two pairs of arc-shaped planar electrodes B and the lower surface of the annular mass block A together form two pairs of parallel capacitors F.

[0030] The upper surfaces of the eight point-shaped planar electrodes B are bonded to the lower surfaces of the eight anchor points B in a one-to-one correspondence.

[0031] Eight pairs of arc-shaped planar electrodes C are bonded to the upper surface of the eight pairs of arc-shaped three-dimensional electrodes in a one-to-one correspondence; the eight pairs of arc-shaped three-dimensional electrodes are symmetrically distributed on both sides of the eight straight coupled cantilever beams C in a one-to-one correspondence, and the outer surfaces of the eight pairs of arc-shaped three-dimensional electrodes and the inner surfaces of the annular mass block B together form eight pairs of parallel capacitors G.

[0032] Eight pairs of single-sided comb-shaped three-dimensional electrodes B are bonded to the upper surfaces of eight pairs of strip planar electrodes B in a one-to-one correspondence; the eight pairs of single-sided comb-shaped three-dimensional electrodes B are symmetrically embedded on both sides of eight double-sided comb-shaped coupling cantilever beams B in a one-to-one correspondence, and the eight pairs of single-sided comb-shaped three-dimensional electrodes B and the eight double-sided comb-shaped coupling cantilever beams B form eight pairs of comb-shaped capacitors B in a one-to-one correspondence.

[0033] During operation, the annular mass block A serves as the x-axis detection mass block. The disk-shaped mass block serves as the y-axis detection mass block. The annular mass block B serves as the z-axis detection mass block. The first, second, fifth, and sixth comb-tooth capacitor pairs A, A, and B all serve as x / y-axis drive excitation capacitors. The third, fourth, seventh, and eighth comb-tooth capacitor pairs A, A, and B all serve as x / y-axis drive response capacitors. Both parallel capacitors D serve as x-axis detection response capacitors. Both parallel capacitor pairs E serve as x-axis detection excitation capacitors. Both parallel capacitor pairs F serve as x-axis frequency tuning capacitors. Both parallel capacitors A serve as y-axis detection response capacitors. Both parallel capacitors B serve as y-axis detection excitation capacitors. Both parallel capacitors C serve as y-axis frequency tuning capacitors. The first and third comb-tooth capacitor pairs B serve as z-axis drive excitation capacitors. The fifth and seventh comb-tooth capacitor pairs B serve as z-axis drive response capacitors. The second and fourth pairs of comb-tooth capacitors B serve as z-axis detection response capacitors. The sixth and eighth pairs of comb-tooth capacitors B serve as z-axis detection excitation capacitors. The eight pairs of parallel capacitors G serve as z-axis frequency modulation capacitors. Two bow-shaped planar electrodes, two drum-shaped planar electrodes A, two drum-shaped planar electrodes B, eight pairs of strip-shaped planar electrodes A, four point-shaped planar electrodes A, two T-shaped planar electrodes, two pairs of arc-shaped planar electrodes A, two pairs of arc-shaped planar electrodes B, eight point-shaped planar electrodes B, eight pairs of arc-shaped planar electrodes C, and eight pairs of strip-shaped planar electrodes B are all connected to the control system via metal wires.

[0034] The specific working process is as follows: First, the control system generates a DC bias voltage signal A and two drive voltage signals A with the same amplitude, frequency, and phase. The DC bias voltage signal A is applied to four point-shaped planar electrodes A. At the same time, the first drive voltage signal A is applied to four x / y axis drive excitation capacitors (the first comb capacitor A in the first pair of comb capacitors A, the first comb capacitor A in the second pair of comb capacitors A, the first comb capacitor A in the fifth pair of comb capacitors A, and the first comb capacitor A in the sixth pair of comb capacitors A). On the other hand, the second drive voltage signal A is applied to the other four x / y axis drive excitation capacitors (the second comb capacitor A in the first pair of comb capacitors A, the second comb capacitor A in the second pair of comb capacitors A, the second comb capacitor A in the fifth pair of comb capacitors A, and the second comb capacitor A in the sixth pair of comb capacitors A). This causes the annular support frame, the x-axis detection mass block, and the y-axis detection mass block to perform in-plane reciprocating rotation under the action of electrostatic force. During the motion, the control system measures the displacement of the annular support frame in real time through four pairs of x / y-axis drive response capacitors, and controls the two drive voltage signals A in real time based on the measurement results. Simultaneously, the control system generates a DC bias voltage signal B and two drive voltage signals B with the same amplitude, frequency, and opposite phase. The DC bias voltage signal B is applied to eight point-like planar electrodes B. At the same time, the first drive voltage signal B is applied to two of the z-axis drive excitation capacitors (the first pair of comb-tooth capacitors B), and the second drive voltage signal B is applied to the other two z-axis drive excitation capacitors (the third pair of comb-tooth capacitors B). This causes the z-axis detection mass block to undergo in-plane four-antinode bending vibration under the action of electrostatic force. During the motion, the control system measures the displacement of the z-axis detection mass block in real time through two pairs of z-axis drive response capacitors, and controls the two drive voltage signals B in real time based on the measurement results. When there is no angular velocity input, the annular support frame, the x-axis detection mass block, and the y-axis detection mass block perform in-plane reciprocating rotational motion in the driving mode. This keeps the plate spacing of the two x-axis and two y-axis detection response capacitors constant, thus keeping their capacitance constant. Simultaneously, the z-axis detection mass block performs in-plane four-antinode bending vibration in the driving mode. At this time, the two pairs of z-axis detection response capacitors are located at the nodes of the four-antinode bending vibration, keeping the plate spacing of the two pairs of z-axis detection response capacitors constant, thus keeping their capacitance constant. At this time, the output of this invention is zero. When there is an angular velocity input in the x-axis direction, the x-axis detection mass block moves out-of-plane around the y-axis under the action of Coriolis force. This changes the plate spacing of the two x-axis detection response capacitors, thus changing their capacitance. At this time, the control system can calculate the angular velocity input in the x-axis direction by detecting the capacitance of the two x-axis detection response capacitors.In this process, the control system performs force feedback control through two pairs of x-axis excitation capacitors to achieve closed-loop detection of the x-axis. Simultaneously, it applies electrostatic negative stiffness through two pairs of x-axis frequency-tuning capacitors to tune the frequency of the x-axis detection mode. When there is an angular velocity input in the y-axis direction, the y-axis detection mass moves out-of-plane around the x-axis under the action of Coriolis force, causing a change in the distance between the plates of the two y-axis detection response capacitors, thus changing their capacitance. At this time, the control system can calculate the angular velocity input in the y-axis direction by detecting the capacitance of the two y-axis detection response capacitors. Similarly, when there is an angular velocity input in the z-axis direction, the z-axis detection mass undergoes in-plane four-antinode bending vibration in the detection mode under the action of Coriolis force. At this point, the two pairs of z-axis detection response capacitors are located at the antinodes of the four-antinode bending vibration, causing a change in the plate spacing of the two pairs of z-axis detection response capacitors, which in turn changes their capacitance. The control system can then calculate the angular velocity input in the z-axis direction by detecting the capacitance of the two pairs of z-axis detection response capacitors. During this process, the control system performs force feedback control through the two pairs of z-axis detection excitation capacitors, thereby achieving closed-loop detection of the z-axis. Simultaneously, it applies electrostatic negative stiffness through eight pairs of z-axis frequency-tuning capacitors, thereby performing frequency tuning of the z-axis detection mode.

[0035] Based on the above process, compared with existing three-axis gyroscopes, the high-sensitivity nested wheel-ring monolithic three-axis MEMS gyroscope chip of this invention, through the adoption of a novel structure, achieves simultaneous measurement of angular velocity input in the x, y, and z axes, thus possessing the following advantages: First, compared with existing monolithic integrated three-axis gyroscopes, this invention has the following advantages: Firstly, the resonator of this invention adopts a nested wheel-ring structure, which effectively reduces the ring structure area while maximizing the wheel structure area, thereby effectively improving area utilization and thus effectively improving sensitivity. Secondly, this invention achieves complete decoupling of each driving and detection direction, thereby effectively reducing coupling errors between modes and thus effectively improving measurement accuracy. Second, compared with existing assembled three-axis gyroscopes, this invention adopts a monolithic integrated structure, therefore it is no longer limited by assembly processes, thus effectively improving measurement accuracy.

[0036] This invention has a reasonable structure and ingenious design, which effectively solves the problems of low sensitivity and low measurement accuracy of existing three-axis gyroscopes, and is suitable for high-precision fields such as military navigation and deep space exploration. Attached Figure Description

[0037] Figure 1This is a three-dimensional structural diagram of the present invention.

[0038] Figure 2 This is a schematic diagram of the planar structure of the present invention.

[0039] Figure 3 This is a schematic diagram of the wheel structure of the resonator part and the planar structure of the eight pairs of single-sided comb-shaped three-dimensional electrodes A in this invention.

[0040] Figure 4 This is a schematic diagram of the planar structure of the ring structure, eight pairs of arc-shaped three-dimensional electrodes, and eight pairs of single-sided comb-shaped three-dimensional electrodes B of the resonator part in this invention.

[0041] Figure 5 This is a three-dimensional structural diagram of the square base, two bow-shaped planar electrodes, two drum-shaped planar electrodes A, two drum-shaped planar electrodes B, eight pairs of strip-shaped planar electrodes A, four point-shaped planar electrodes A, two T-shaped planar electrodes, two pairs of arc-shaped planar electrodes A, two pairs of arc-shaped planar electrodes B, eight point-shaped planar electrodes B, eight pairs of arc-shaped planar electrodes C, and eight pairs of strip-shaped planar electrodes B in this invention.

[0042] Figure 6 This is a schematic diagram of the planar structure of the square base, two bow-shaped planar electrodes, two drum-shaped planar electrodes A, two drum-shaped planar electrodes B, eight pairs of strip-shaped planar electrodes A, four point-shaped planar electrodes A, two T-shaped planar electrodes, two pairs of arc-shaped planar electrodes A, two pairs of arc-shaped planar electrodes B, eight point-shaped planar electrodes B, eight pairs of arc-shaped planar electrodes C, and eight pairs of strip-shaped planar electrodes B in this invention.

[0043] In the diagram: 101-Disc-shaped mass block, 102-Straight coupled cantilever beam A, 103-Annular support frame, 104-Double-sided comb-shaped coupled cantilever beam A, 105-Straight support cantilever beam A, 106-Straight coupled cantilever beam B, 107-Anchor point A, 108-Annular mass block A, 109-Suspended mass block, 110-Annular mass block B, 111-Straight coupled cantilever beam C, 112-U-shaped support cantilever beam, 113-Straight support cantilever beam B, 114-Anchor point B, 115-Double-sided comb-shaped coupled cantilever beam B, 2 01-Square base, 202-Arch-shaped planar electrode, 203-Drum-shaped planar electrode A, 204-Drum-shaped planar electrode B, 205-Strip-shaped planar electrode A, 206-Point-shaped planar electrode A, 207-T-shaped planar electrode, 208-Arc-shaped planar electrode A, 209-Arc-shaped planar electrode B, 210-Point-shaped planar electrode B, 211-Arc-shaped planar electrode C, 212-Strip-shaped planar electrode B, 213-Single-sided comb-shaped three-dimensional electrode A, 214-Arc-shaped three-dimensional electrode, 215-Single-sided comb-shaped three-dimensional electrode B. Detailed Implementation

[0044] A high-sensitivity nested ring monolithic three-axis MEMS gyroscope chip, including a resonator part and an electrode part;

[0045] The resonator part includes a wheel structure and a ring structure;

[0046] The wheel structure includes a disc-shaped mass block 101;

[0047] Two symmetrically distributed slots are provided on the outer side of the disc-shaped mass block 101; the bottom of the two slots are connected to two symmetrically distributed straight coupling cantilever beams A102.

[0048] The ends of the two straight coupled cantilever beams A102 are connected to a circular support frame 103.

[0049] The outer side of the circular support frame 103 is connected to eight double-sided comb-shaped coupling cantilever beams A104 that are symmetrically distributed along the circumference, four straight support cantilever beams A105 that are symmetrically distributed along the circumference, and two straight coupling cantilever beams B106 that are symmetrically distributed front and back.

[0050] Four straight support beams A105 are located one-to-one between the first double-sided comb-shaped coupling beam A104 and the second double-sided comb-shaped coupling beam A104, between the third double-sided comb-shaped coupling beam A104 and the fourth double-sided comb-shaped coupling beam A104, between the fifth double-sided comb-shaped coupling beam A104 and the sixth double-sided comb-shaped coupling beam A104, and between the seventh double-sided comb-shaped coupling beam A104 and the eighth double-sided comb-shaped coupling beam A104; the ends of the four straight support beams A105 are connected to four anchor points A107 that are symmetrically distributed along the circumference.

[0051] Two straight coupled suspension beams B106 are located one-to-one between the second double-sided comb-shaped coupled suspension beam A104 and the third double-sided comb-shaped coupled suspension beam A104, and between the sixth double-sided comb-shaped coupled suspension beam A104 and the seventh double-sided comb-shaped coupled suspension beam A104; the ends of the two straight coupled suspension beams B106 are connected to a circular mass block A108.

[0052] The inner surface of the annular mass block A108 is connected to two suspended mass blocks 109 that are symmetrically distributed from left to right; the two suspended mass blocks 109 are located one-to-one between the fourth double-sided comb-shaped coupling suspension beam A104 and the fifth double-sided comb-shaped coupling suspension beam A104, and between the eighth double-sided comb-shaped coupling suspension beam A104 and the first double-sided comb-shaped coupling suspension beam A104;

[0053] The ring structure includes a circular annular mass block B110;

[0054] An annular mass block B110 is coaxially sleeved on the outside of an annular mass block A108; eight straight coupling suspension beams C111 are connected to the inner side of the annular mass block B110, which are symmetrically distributed along the circumference. The circumferential positions of the eight straight coupling suspension beams C111 correspond one-to-one with the circumferential positions of the four straight supporting suspension beams A105, the two straight coupling suspension beams B106, and the two suspended mass blocks 109.

[0055] The ends of the eight straight coupled cantilever beams C111 are connected one-to-one to eight circumferentially symmetrically distributed U-shaped support cantilever beams 112.

[0056] The inner sides of the eight square-shaped support beams 112 are connected one-to-one with eight straight support beams B113 that are symmetrically distributed along the circumference.

[0057] The ends of the eight straight support beams B113 are connected to eight anchor points B114 that are symmetrically distributed along the circumference.

[0058] The outer surface of the annular mass block B110 is connected to eight double-sided comb-shaped coupling suspension beams B115 that are symmetrically distributed along the circumference, and the circumferential positions of the eight double-sided comb-shaped coupling suspension beams B115 correspond one-to-one with the circumferential positions of the eight straight coupling suspension beams C111.

[0059] The electrode portion includes a square base 201;

[0060] A square base 201 is coaxially arranged with a disk-shaped mass block 101; the upper surface of the square base 201 is sputtered with two front-to-back symmetrically distributed arc-shaped planar electrodes 202, two front-to-back symmetrically distributed drum-shaped planar electrodes A203, two front-to-back symmetrically distributed drum-shaped planar electrodes B204, eight pairs of circumferentially symmetrically distributed strip-shaped planar electrodes A205, four circumferentially symmetrically distributed point-shaped planar electrodes A206, two left-to-right symmetrically distributed T-shaped planar electrodes 207, two pairs of left-to-right symmetrically distributed arc-shaped planar electrodes A208, two pairs of left-to-right symmetrically distributed arc-shaped planar electrodes B209, eight circumferentially symmetrically distributed point-shaped planar electrodes B210, eight pairs of circumferentially symmetrically distributed arc-shaped planar electrodes C211, and eight pairs of circumferentially symmetrically distributed strip-shaped planar electrodes B212.

[0061] The upper surfaces of the two arc-shaped planar electrodes 202 and the lower surface of the disk-shaped mass block 101 together form two parallel capacitors A;

[0062] Both drum-shaped planar electrodes A203 are located between two bow-shaped planar electrodes 202; the upper surfaces of the two drum-shaped planar electrodes A203 and the lower surface of the disk-shaped mass block 101 together form two parallel capacitors B;

[0063] Both drum-shaped planar electrodes B204 are located between two drum-shaped planar electrodes A203; the upper surfaces of the two drum-shaped planar electrodes B204 and the lower surface of the disk-shaped mass block 101 together form two parallel capacitors C.

[0064] Eight pairs of single-sided comb-shaped three-dimensional electrodes A213 are bonded to the upper surfaces of eight pairs of strip planar electrodes A205 in a corresponding manner. The eight pairs of single-sided comb-shaped three-dimensional electrodes A213 are symmetrically embedded on both sides of eight double-sided comb-shaped coupling cantilever beams A104 in a corresponding manner, and the eight pairs of single-sided comb-shaped three-dimensional electrodes A213 and the eight double-sided comb-shaped coupling cantilever beams A104 in a corresponding manner constitute eight pairs of comb-shaped capacitors A.

[0065] The upper surfaces of the four point-shaped planar electrodes A206 are bonded to the lower surfaces of the four anchor points A107 in a one-to-one correspondence;

[0066] The upper surfaces of the two T-shaped planar electrodes 207, together with the lower surfaces of the annular mass block A108 and the two suspended mass blocks 109, form two parallel capacitors D.

[0067] Two pairs of arc-shaped planar electrodes A208 are symmetrically distributed on both sides of two T-shaped planar electrodes 207 in a one-to-one correspondence; the upper surfaces of the two pairs of arc-shaped planar electrodes A208 and the lower surface of the annular mass block A108 together form two pairs of parallel capacitors E.

[0068] Two pairs of arc-shaped planar electrodes B209 are symmetrically distributed on both sides of two pairs of arc-shaped planar electrodes A208; the upper surfaces of the two pairs of arc-shaped planar electrodes B209 and the lower surface of the annular mass block A108 together form two pairs of parallel capacitors F.

[0069] The upper surfaces of the eight point-shaped planar electrodes B210 are bonded to the lower surfaces of the eight anchor points B114 in a one-to-one correspondence.

[0070] Eight pairs of arc-shaped planar electrodes C211 are bonded to the upper surfaces of the eight pairs of arc-shaped three-dimensional electrodes 214 in a one-to-one correspondence; the eight pairs of arc-shaped three-dimensional electrodes 214 are symmetrically distributed on both sides of the eight straight coupled cantilever beams C111 in a one-to-one correspondence, and the outer surfaces of the eight pairs of arc-shaped three-dimensional electrodes 214 together with the inner surfaces of the annular mass block B110 form eight pairs of parallel capacitors G.

[0071] Eight pairs of single-sided comb-shaped three-dimensional electrodes B215 are bonded to the upper surfaces of eight pairs of strip planar electrodes B212 in a one-to-one correspondence; the eight pairs of single-sided comb-shaped three-dimensional electrodes B215 are symmetrically embedded on both sides of eight double-sided comb-shaped coupling cantilever beams B115 in a one-to-one correspondence, and the eight pairs of single-sided comb-shaped three-dimensional electrodes B215 and the eight double-sided comb-shaped coupling cantilever beams B115 form eight pairs of comb-shaped capacitors B in a one-to-one correspondence.

[0072] The resonator is made of silicon; the square base 201 is made of glass.

[0073] The resonator and electrode components are manufactured as a single unit using SOG technology.

[0074] While specific embodiments of the present invention have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but all such changes and modifications fall within the scope of protection of the present invention.

Claims

1. A high-sensitivity nested ring monolithic three-axis MEMS gyroscope chip, characterized in that: Includes the harmonic oscillator and the electrode components; The resonator part includes a wheel structure and a ring structure; The wheel structure includes a disc-shaped mass block (101). Two slots are provided on the outer side of the disc-shaped mass block (101) in a symmetrical arrangement; the bottom of the two slots is connected to two straight coupled cantilever beams A (102) in a symmetrical arrangement. The ends of the two straight coupled cantilever beams A (102) are connected to a circular support frame (103). The outer side of the circular support frame (103) is connected to eight double-sided comb-shaped coupling cantilever beams A (104) symmetrically distributed along the circumference, four straight support cantilever beams A (105) symmetrically distributed along the circumference, and two straight coupling cantilever beams B (106) symmetrically distributed front and back. Four straight support beams A (105) are located one-to-one between the first double-sided comb-shaped coupling beam A (104) and the second double-sided comb-shaped coupling beam A (104), between the third double-sided comb-shaped coupling beam A (104) and the fourth double-sided comb-shaped coupling beam A (104), between the fifth double-sided comb-shaped coupling beam A (104) and the sixth double-sided comb-shaped coupling beam A (104), and between the seventh double-sided comb-shaped coupling beam A (104) and the eighth double-sided comb-shaped coupling beam A (104); the ends of the four straight support beams A (105) are connected to four anchor points A (107) that are symmetrically distributed along the circumference. Two straight coupled suspension beams B (106) are located one-to-one between the second double-sided comb-shaped coupled suspension beam A (104) and the third double-sided comb-shaped coupled suspension beam A (104), and between the sixth double-sided comb-shaped coupled suspension beam A (104) and the seventh double-sided comb-shaped coupled suspension beam A (104); the ends of the two straight coupled suspension beams B (106) are connected to a circular mass block A (108); The inner side of the annular mass block A (108) is connected to two suspended mass blocks (109) that are symmetrically distributed on the left and right sides; the two suspended mass blocks (109) are located one-to-one between the fourth double-sided comb-shaped coupling suspension beam A (104) and the fifth double-sided comb-shaped coupling suspension beam A (104), and between the eighth double-sided comb-shaped coupling suspension beam A (104) and the first double-sided comb-shaped coupling suspension beam A (104); The ring structure includes a circular annular mass block B (110). An annular mass block B (110) is coaxially sleeved on the outside of an annular mass block A (108); the inner surface of the annular mass block B (110) is connected to eight straight coupling suspension beams C (111) symmetrically distributed along the circumference, and the circumferential positions of the eight straight coupling suspension beams C (111) correspond one-to-one with the circumferential positions of the four straight support suspension beams A (105), the two straight coupling suspension beams B (106), and the two suspended mass blocks (109); The ends of the eight straight coupled cantilever beams C (111) are connected one-to-one to eight circumferentially symmetrically distributed square-shaped support cantilever beams (112). The inner sides of the eight square-shaped support beams (112) are connected to eight straight support beams B (113) that are symmetrically distributed along the circumference. The ends of the eight straight support beams B (113) are connected to eight anchor points B (114) that are symmetrically distributed along the circumference. The outer surface of the annular mass block B (110) is connected to eight double-sided comb-shaped coupling suspension beams B (115) that are symmetrically distributed along the circumference, and the circumferential positions of the eight double-sided comb-shaped coupling suspension beams B (115) correspond one-to-one with the circumferential positions of the eight straight coupling suspension beams C (111). The electrode portion includes a square base (201); A square base (201) is coaxially arranged with a disk-shaped mass block (101); the upper surface of the square base (201) is sputtered with two arch-shaped planar electrodes (202) symmetrically distributed front and back, two drum-shaped planar electrodes A (203) symmetrically distributed front and back, two drum-shaped planar electrodes B (204) symmetrically distributed front and back, eight pairs of strip-shaped planar electrodes A (205) symmetrically distributed circumferentially, four point-shaped planar electrodes A (206) symmetrically distributed circumferentially, two T-shaped planar electrodes (207) symmetrically distributed left and right, two pairs of arc-shaped planar electrodes A (208) symmetrically distributed left and right, two pairs of arc-shaped planar electrodes B (209) symmetrically distributed left and right, eight point-shaped planar electrodes B (210) symmetrically distributed circumferentially, eight pairs of arc-shaped planar electrodes C (211) symmetrically distributed circumferentially, and eight pairs of strip-shaped planar electrodes B (212) symmetrically distributed circumferentially. The upper surfaces of the two arc-shaped planar electrodes (202) and the lower surface of the disk-shaped mass block (101) together form two parallel capacitors A; Two drum-shaped planar electrodes A (203) are located between two bow-shaped planar electrodes (202); the upper surfaces of the two drum-shaped planar electrodes A (203) and the lower surface of the disk-shaped mass block (101) together form two parallel capacitors B; The two drum-shaped planar electrodes B (204) are located between the two drum-shaped planar electrodes A (203); the upper surfaces of the two drum-shaped planar electrodes B (204) and the lower surface of the disk-shaped mass block (101) together form two parallel capacitors C; Eight pairs of strip planar electrodes A (205) are bonded one-to-one with eight pairs of unilateral comb-shaped three-dimensional electrodes A (213) symmetrically distributed along the circumference; the eight pairs of unilateral comb-shaped three-dimensional electrodes A (213) are symmetrically embedded on both sides of eight double-sided comb-shaped coupling cantilever beams A (104), and the eight pairs of unilateral comb-shaped three-dimensional electrodes A (213) and the eight double-sided comb-shaped coupling cantilever beams A (104) correspond one-to-one to form eight pairs of comb-shaped capacitors A; The upper surfaces of the four point-shaped planar electrodes A (206) are bonded to the lower surfaces of the four anchor points A (107) in a one-to-one correspondence; The upper surfaces of the two T-shaped planar electrodes (207), the lower surfaces of the annular mass block A (108) and the lower surfaces of the two suspended mass blocks (109) together form two parallel capacitors D; Two pairs of arc-shaped planar electrodes A (208) are symmetrically distributed on both sides of two T-shaped planar electrodes (207) in a one-to-one correspondence; the upper surfaces of the two pairs of arc-shaped planar electrodes A (208) and the lower surface of the annular mass block A (108) together form two pairs of parallel capacitors E. Two pairs of arc-shaped planar electrodes B (209) are symmetrically distributed on both sides of two pairs of arc-shaped planar electrodes A (208); the upper surfaces of the two pairs of arc-shaped planar electrodes B (209) and the lower surface of the annular mass block A (108) together form two pairs of parallel capacitors F. The upper surfaces of the eight point-shaped planar electrodes B (210) are bonded one-to-one with the lower surfaces of the eight anchor points B (114); Eight pairs of arc-shaped planar electrodes C (211) are bonded one-to-one with eight pairs of arc-shaped three-dimensional electrodes (214); the eight pairs of arc-shaped three-dimensional electrodes (214) are symmetrically distributed on both sides of eight straight coupled cantilever beams C (111), and the outer surfaces of the eight pairs of arc-shaped three-dimensional electrodes (214) together with the inner surfaces of the annular mass block B (110) form eight pairs of parallel capacitors G. Eight pairs of single-sided comb-shaped three-dimensional electrodes B (215) are bonded to the upper surface of eight pairs of strip planar electrodes B (212) in a one-to-one correspondence; the eight pairs of single-sided comb-shaped three-dimensional electrodes B (215) are symmetrically embedded on both sides of eight double-sided comb-shaped coupling cantilever beams B (115) in a one-to-one correspondence, and the eight pairs of single-sided comb-shaped three-dimensional electrodes B (215) and the eight double-sided comb-shaped coupling cantilever beams B (115) form eight pairs of comb-shaped capacitors B in a one-to-one correspondence.

2. The high-sensitivity nested ring monolithic three-axis MEMS gyroscope chip according to claim 1, characterized in that: The resonator is made of silicon; the square base (201) is made of glass.

3. The high-sensitivity nested ring monolithic three-axis MEMS gyroscope chip according to claim 1, characterized in that: The resonator and electrode components are manufactured as a single unit using SOG technology.

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