A semiconductor heat dissipation structure

Abstract

The invention discloses a semiconductor heat dissipation structure, which belongs to the field of semiconductor technology. A clamping mechanism is movably installed in a slot, an extrusion block is movably arranged in an extrusion slot, a linkage plate is movably installed between vertical rods in the same group, an upper cooling pipe is arranged on an inner frame and located between the slots, a lower cooling pipe is located below the clamping mechanism and the inner frame, and an extrusion ball that automatically locks the air outlet is arranged at the outlet of the vertical nozzle; a butt joint pipe that cooperates with the vertical nozzle is arranged at the bottom of the air guide cover, and a top column that cooperates with the extrusion ball is arranged in the middle of the connecting arm. The vertical nozzle at the bottom can be triggered by the cooperation of the U-shaped piece and the extrusion block. When the top column squeezes the extrusion ball downward, the cold air cools the bottom of the semiconductor through the air-permeable slot, the butt joint pipe and the air guide cover. When the air conditioner is turned on, the second air hole can be automatically opened to ensure the smooth progress of gas injection. When the gas injection is completed, the second air hole can be automatically closed by the baffle and the spring.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, in particular to a semiconductor heat dissipation structure. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. Most electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors in their core units. Semiconductor components usually need to be used with cooling devices to improve the heat dissipation efficiency of semiconductor components, thereby further increasing the service life of semiconductor components.

[0003] The cooling effect of the existing semiconductor heat dissipation structure is general, it cannot cool it from multiple angles and positions, and has a low degree of freedom, and cannot cool the position where the semiconductor element is located. Therefore, in view of the above situation, it is urgent to develop a semiconductor heat dissipation structure to overcome the shortcomings in current practical applications. Summary of the invention

[0004] The purpose of the present invention is to provide a semiconductor heat dissipation structure to solve the problems that the existing semiconductor heat dissipation structure has a general cooling effect, cannot cool it from multiple angles and positions, has a low degree of freedom, and cannot specifically cool the position where the semiconductor element exists.

[0005] To achieve the above-mentioned purpose, the technical solution of the present invention is: a semiconductor heat dissipation structure, including a cooling box, a clamping mechanism and a pipeline mechanism, the cooling box includes an inner frame and an outer frame, a plurality of slots are provided on the inner walls on the front and rear sides of the inner frame, and the clamping mechanism is movably installed in the slots; an extrusion groove is provided at the bottom of the slot, an extrusion block is movably provided in the extrusion groove, a vertical rod passing through the bottom of the slot is connected below the extrusion block, and a linkage plate is movably installed between the vertical rods in the same group; the pipeline mechanism includes an upper cooling pipeline and a lower cooling pipeline that are interconnected, the upper cooling pipeline is provided on the inner frame and located between the slots, and the lower cooling pipeline is located at the clamping mechanism and below the inner frame; multiple groups of vertical nozzles are arranged on the lower cooling pipe, and a squeezing ball for automatically locking the air outlet is arranged at the outlet of the vertical nozzle; a guide cover facing upward is arranged in the middle of the linkage plate, and a docking tube cooperating with the vertical nozzle is arranged at the bottom of the guide cover, and multiple groups of connecting arms are arranged on the inner wall of the docking tube, and a top column cooperating with the squeezing ball is arranged in the middle of the connecting arm; when the clamping mechanism is installed in the slot, the bottom of the clamping mechanism squeezes the squeezing block, the vertical rod drives the top column downward to squeeze the squeezing ball, and the vertical nozzle located below the clamping mechanism cools the bottom of the clamping mechanism.

[0006] As a further solution of the present invention: the clamping mechanism includes a semiconductor and a U-shaped part, the semiconductor is movably mounted on the U-shaped part, the U-shaped part is movably mounted in the slot, and a plurality of through holes are provided at the bottom of the U-shaped part.

[0007] As a further solution of the present invention: a plurality of first support arms are connected to the outer wall of the inner frame, the inner frame is mounted on the inner wall of the outer frame through the first support arms, and air-permeable nets are provided on the left and right sides of the inner frame.

[0008] As a further solution of the present invention: a plurality of groups of slots are provided on the side wall of the slot, positioning springs are installed in the slots, balls are arranged on the outside of the positioning springs, and a plurality of groups of grooves cooperating with the balls are provided on both sides of the U-shaped part.

[0009] As a further solution of the present invention: a plurality of groups of return springs are connected to the bottom of the extrusion block.

[0010] As a further solution of the present invention: a plurality of groups of second support arms are connected to the bottom of the inner wall of the outer frame, and a plurality of groups of fan blades are arranged in the middle of the second support arms.

[0011] As a further solution of the present invention: a plurality of groups of horizontal nozzles are arranged on the upper cooling pipe, and the horizontal nozzles are arranged between adjacent slots; a baffle is arranged inside the horizontal nozzle, a top ring is arranged at the outlet of the horizontal nozzle, a self-opening movable plate is movably arranged between the baffle and the top ring, and the edge of the movable plate is connected to the top ring through a spring; a plurality of groups of first air holes are opened on the baffle, and a plurality of groups of second air holes staggered with the first air holes are opened on the movable plate.

[0012] As a further solution of the present invention: multiple groups of bosses are arranged on the inner wall of the vertical nozzle, a limiting ring is arranged at the outlet of the vertical nozzle, the squeezing ball is movably arranged between the boss and the limiting ring, the bottom of the squeezing ball is connected with a base, the base is connected to the boss through spring 2, and multiple groups of air grooves are opened on the side of the base; under the action of spring 2, the limiting ring blocks the air groove and limits the flow of cold air; when the top column squeezes the squeezing ball downward, the cold air cools the bottom of the clamping mechanism through the air groove, the docking tube and the guide cover.

[0013] As a further solution of the present invention: an air conditioner is installed on the side of the outer frame, and a branch pipe is connected to the outlet of the air conditioner. The upper part of the branch pipe is connected to the upper cooling pipe, and the lower part of the branch pipe is connected to the lower cooling pipe.

[0014] As a further solution of the present invention: a top cover is movably installed between the outer frame and the inner frame, and a bottom cover is movably installed at the bottom of the outer frame.

[0015] The present invention provides a semiconductor heat dissipation structure through improvement. Compared with the prior art, the present invention has the following beneficial effects:

[0016] The present invention can quickly cool down the semiconductor from multiple angles and positions through the design of the outer frame and the inner frame, avoiding damage caused by long-term high temperature conditions. The vertical nozzle at the bottom can be triggered by the cooperation of the U-shaped part and the extrusion block. When the top column squeezes the extrusion ball downward, the cold air centrally cools the bottom of the semiconductor through the air vent, the docking tube and the air guide cover. When the U-shaped part and the semiconductor are out of the slot, under the action of spring two, the limit ring blocks the air vent and restricts the flow of cold air. In addition, the second air hole can be automatically opened when the air conditioner is turned on through the self-opening movable plate to ensure smooth gas injection. When the gas injection is completed, the second air hole can be automatically closed by the cooperation of the baffle and spring one. This design improves the safety and practicality of the semiconductor heat dissipation structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further explained below in conjunction with the accompanying drawings and embodiments:

[0018] Figure 1 It is a three-dimensional structural diagram of the present invention;

[0019] Figure 2 The internal structure of the present invention Figure 1 ;

[0020] Figure 3 is a cross-sectional view of the internal structure of the present invention;

[0021] Figure 4 yes Figure 3 A magnified view of the structure at center A;

[0022] Figure 5 yes Figure 3 A magnified view of the structure at B in the middle;

[0023] Figure 6 It is a three-dimensional structural diagram of the clamping mechanism in the present invention;

[0024] Figure 7 The internal structure of the present invention Figure 2 ;

[0025] Figure 8 It is a three-dimensional structural diagram of the pipeline mechanism in the present invention;

[0026] Fig. 9 It is a three-dimensional structural diagram of the upper cooling pipe in the present invention;

[0027] Fig.10 yes Fig. 9 A magnified view of the structure at C in the middle;

[0028] Fig.11 yes Fig. 9 A magnified view of the structure at D in the middle;

[0029] Fig.12 It is a partial cross-sectional view of the lower cooling pipe in the present invention.

[0030] Description of reference numerals:

[0031] 1. Cooling box; 101. Inner frame; 102. Outer frame; 103. First support arm; 104. Breathable net; 105. Slot; 106. Slot; 107. Positioning spring; 108. Ball; 109. Extrusion groove; 110. Extrusion block; 111. Vertical rod; 112. Return spring; 113. Linkage plate; 114. Air guide cover; 115. Butt pipe; 116. Connecting arm; 117. Top column; 118. Second support arm; 119. Fan blade; 120. Air conditioner; 121. Top cover; 122. Bottom cover; 2. Card Connecting mechanism; 201, semiconductor; 202, U-shaped part; 203, through hole; 204, groove; 3, pipeline mechanism; 301, branch pipe; 302, upper cooling pipeline; 303, lower cooling pipeline; 304, horizontal nozzle; 305, vertical nozzle; 306, first air hole; 307, top ring; 308, movable plate; 309, spring one; 310, second air hole; 311, boss; 312, squeeze ball; 313, base; 314, spring two; 315, air groove; 316, limit ring; 317, baffle. DETAILED DESCRIPTION

[0032] The following will be combined with the attached Figures 1 to 12 The technical solution of the present invention is described clearly and completely. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] The present invention provides a semiconductor heat dissipation structure by improvement. Figure 1-Figure 12As shown, it includes a cooling box 1, a clamping mechanism 2 and a pipe mechanism 3. The cooling box 1 includes an inner frame 101 and an outer frame 102. A plurality of slots 105 are provided on the inner walls of the front and rear sides of the inner frame 101. The clamping mechanism 2 is movably installed in the slots 105. An extrusion groove 109 is provided at the bottom of the slot 105. An extrusion block 110 is movably arranged in the extrusion groove 109. A vertical rod 111 penetrating the bottom of the slot 105 is connected to the lower part of the extrusion block 110. A linkage plate 113 is movably installed between the vertical rods 111 in the same group. The pipe mechanism 3 includes an upper cooling pipe 302 and a lower cooling pipe 303 which are interconnected. The upper cooling pipe 302 is arranged on the inner frame 101 and located between the slots 105. The lower cooling pipe 303 is located below the clamping mechanism 2 and the inner frame 101. A plurality of vertical nozzles 305 are arranged on the lower cooling pipe 303, and a squeezing ball 312 for automatically locking the air outlet is arranged at the outlet of the vertical nozzle 305; a deflector 114 facing upward is arranged in the middle of the linkage plate 113, and a docking tube 115 cooperating with the vertical nozzle 305 is arranged at the bottom of the deflector 114, and a plurality of connecting arms 116 are arranged on the inner wall of the docking tube 115, and a top column 117 cooperating with the squeezing ball 312 is arranged in the middle of the connecting arm 116; when the clamping mechanism 2 is installed in the slot 105, the bottom of the clamping mechanism 2 squeezes the squeezing block 110, and the vertical rod 111 drives the top column 117 downward to squeeze the squeezing ball 312, and the vertical nozzle 305 located below the clamping mechanism 2 cools the bottom of the clamping mechanism 2.

[0034] In this embodiment: the semiconductor heat dissipation structure is mainly divided into three parts: a cooling box 1, a clamping mechanism 2 and a pipeline mechanism 3. When the device is in use, the air conditioner 120 and the fan blade 119 are first turned on. Then the semiconductor 201 is installed on the U-shaped member 202, and finally the U-shaped member 202 is inserted downward to the bottom along the slot 105. When the U-shaped member 202 squeezes the extrusion block 110 downward, the extrusion block 110 drives the vertical rod 111 at the bottom to move downward, and at this time, the air guide 114 and the butt joint 115 in the middle of the linkage plate 113 squeeze the extrusion ball 312 downward. The cold air cools the bottom of the semiconductor 201 through the air permeable groove 315, the butt joint 115 and the air guide 114. When the U-shaped member 202 is separated from the slot 105, under the action of the spring 2 314, the limit ring 316 blocks the air permeable groove 315 and limits the flow of cold air. At this time, under the impact of the cold air, the movable plate 308 moves inward along the horizontal nozzle 304, and the cold air is injected into the space between the semiconductor 201 through the first air hole 306 and the second air hole 310. When the air cooler 120 is turned off, under the action of the spring 1 309, the movable plate 308 is tightly attached to the top of the baffle 317. Since the first air hole 306 and the second air hole 310 are misaligned, the baffle 317 will cover the second air hole 310.

[0035] See attached Figure 6The clamping mechanism 2 includes a semiconductor 201 and a U-shaped member 202 . The semiconductor 201 is movably mounted on the U-shaped member 202 . The U-shaped member 202 is movably mounted in the slot 105 . A plurality of through holes 203 are formed at the bottom of the U-shaped member 202 .

[0036] In this embodiment, in order to improve the cooling effect, a plurality of through holes 203 are provided at the bottom of the U-shaped member 202 .

[0037] See attached Figure 2 -Attached Figure 3 A plurality of first support arms 103 are connected to the outer wall of the inner frame 101 , and the inner frame 101 is mounted on the inner wall of the outer frame 102 through the first support arms 103 . A breathable net 104 is provided on the left and right sides of the inner frame 101 .

[0038] In this embodiment, in order to fix the inner frame 101 to the inner wall of the outer frame 102, multiple groups of first support arms 103 are connected to the outer wall of the inner frame 101. In order to further improve the heat dissipation effect, air permeable nets 104 are provided on the left and right sides of the inner frame 101.

[0039] See attached Figure 3 -Attached Figure 4 A plurality of slots 106 are provided on the side wall of the slot 105 , a positioning spring 107 is installed in the slot 106 , a ball 108 is arranged on the outer side of the positioning spring 107 , and a plurality of grooves 204 cooperating with the ball 108 are provided on both sides of the U-shaped member 202 .

[0040] In this embodiment, in order to position the U-shaped member 202 and further improve the stability, and to prevent the U-shaped member 202 and the semiconductor 201 from being unable to be fixed in position under the action of the return spring 112 , a plurality of groups of balls 108 are movably arranged on the side wall of the slot 105 .

[0041] See attached Figure 3 -Attached Figure 4 The bottom of the extrusion block 110 is connected to multiple sets of return springs 112.

[0042] In this embodiment, when the U-shaped member 202 is disengaged upward from the slot 105 , in order to automatically reset the extrusion block 110 and the top column 117 , a plurality of sets of reset springs 112 are connected to the bottom of the extrusion block 110 .

[0043] See attached Figure 2 -Attached Figure 3 A plurality of second support arms 118 are connected to the bottom of the inner wall of the outer frame 102 , and a plurality of fan blades 119 are arranged in the middle of the second support arms 118 .

[0044] In this embodiment, in order to further improve the fluidity of the air and thus further improve the cooling effect, a plurality of sets of fan blades 119 are movably installed at the bottom of the outer frame 102 .

[0045] See attached Fig. 9 -Attached Fig.11 , a plurality of groups of horizontal nozzles 304 are arranged on the upper cooling pipe 302, and the horizontal nozzles 304 are arranged between adjacent slots 105; a baffle 317 is arranged inside the horizontal nozzle 304, and a top ring 307 is arranged at the outlet of the horizontal nozzle 304, a self-opening movable plate 308 is movably arranged between the baffle 317 and the top ring 307, and the edge of the movable plate 308 is connected to the top ring 307 through a spring 1 309; a plurality of groups of first air holes 306 are opened on the baffle 317, and a plurality of groups of second air holes 310 which are offset from the first air holes 306 are opened on the movable plate 308.

[0046] In this embodiment, when the air cooler 120 is turned off, in order to automatically close the horizontal nozzle 304, a plurality of second air holes 310 offset from the first air holes 306 are provided on the movable plate 308. When the air cooler 120 is turned on, the movable plate 308 moves inward along the horizontal nozzle 304 under the impact of the cold air, and the cold air is injected between the semiconductor 201 through the first air hole 306 and the second air hole 310. When the air cooler 120 is turned off, under the action of the spring 1 309, the movable plate 308 is tightly attached to the top of the baffle 317. Since the first air hole 306 and the second air hole 310 are offset, the baffle 317 will block the second air hole 310.

[0047] See attached Figure 5 and attached Fig.12 A plurality of bosses 311 are arranged on the inner wall of the vertical nozzle 305, a limiting ring 316 is arranged at the outlet of the vertical nozzle 305, a squeezing ball 312 is movably arranged between the boss 311 and the limiting ring 316, a base 313 is connected to the bottom of the squeezing ball 312, the base 313 is connected to the boss 311 through a spring 314, and a plurality of air-permeable grooves 315 are arranged on the side of the base 313.

[0048] In this embodiment, in order to improve the cooling effect, air is blown only at the bottom of the slot 105 with the semiconductor 201, so the squeezing ball 312 is movably arranged between the boss 311 and the limiting ring 316. When the top column 117 squeezes the squeezing ball 312 downward, the cold air cools the bottom of the clamping mechanism 2 through the air-permeable groove 315, the butt joint 115 and the air guide cover 114. When the U-shaped member 202 is separated from the slot 105, under the action of the second spring 314, the limiting ring 316 blocks the air-permeable groove 315 and limits the flow of cold air.

[0049] See attached Figure 2 -Attached Figure 3and attached Figure 8 An air conditioner 120 is installed on the side of the outer frame 102, and a branch pipe 301 is connected to the outlet of the air conditioner 120. The upper part of the branch pipe 301 is connected to the upper cooling pipe 302, and the lower part of the branch pipe 301 is connected to the lower cooling pipe 303.

[0050] In this embodiment, in order to inject cold air into the upper cooling pipe 302 located at the top and the lower cooling pipe 303 located at the bottom at the same time, a branch pipe 301 is connected to the outlet of the air conditioner 120.

[0051] See attached Figure 1 A top cover 121 is movably installed between the outer frame 102 and the inner frame 101 , and a bottom cover 122 is movably installed at the bottom of the outer frame 102 .

[0052] In this embodiment: in order to close the upper and lower positions of the outer frame 102 and the inner frame 101 to form a U-shaped operating space, a top cover 121 is movably installed between the outer frame 102 and the inner frame 101, and a bottom cover 122 is movably installed at the bottom of the outer frame 102.

[0053] Working principle of the present invention: When the device is in use, first turn on the air cooler 120 and the fan blade 119. Then install the semiconductor 201 on the U-shaped part 202, and finally insert the U-shaped part 202 downward to the bottom along the slot 105. When the U-shaped part 202 squeezes the extrusion block 110 downward, the extrusion block 110 drives the vertical rod 111 at the bottom to move downward. At this time, the air guide cover 114 and the butt joint pipe 115 in the middle of the linkage plate 113 squeeze the extrusion ball 312 downward. The cold air cools the bottom of the semiconductor 201 through the air permeable groove 315, the butt joint pipe 115 and the air guide cover 114. When the U-shaped part 202 is separated from the slot 105, under the action of the spring 2 314, the limit ring 316 blocks the air permeable groove 315 and limits the flow of cold air. At this time, under the impact of the cold air, the movable plate 308 moves inward along the horizontal nozzle 304, and the cold air is injected into the space between the semiconductor 201 through the first air hole 306 and the second air hole 310. When the air cooler 120 is turned off, under the action of the spring 1 309, the movable plate 308 is tightly attached to the top of the baffle 317. Since the first air hole 306 and the second air hole 310 are misaligned, the baffle 317 will cover the second air hole 310.

[0054] The present invention can quickly cool down the semiconductor 201 from multiple angles and positions through the design of the outer frame 102 and the inner frame 101, avoiding damage caused by long-term high temperature conditions. The vertical nozzle 305 at the bottom can be triggered by the cooperation of the U-shaped member 202 and the extrusion block 110. When the top column 117 squeezes the extrusion ball 312 downward, the cold air is concentratedly cooled down on the bottom of the semiconductor 201 through the air permeable groove 315, the butt joint 115 and the guide cover 114. When the U-shaped member 202 and the semiconductor 201 are separated from the slot 105, under the action of the second spring 314, the limit ring 316 blocks the air permeable groove 315 and limits the flow of cold air. In addition, the second air hole 310 can be automatically opened when the air cooler 120 is turned on through the self-opening movable plate 308 to ensure the smooth progress of gas injection. When the gas injection is completed, the second air hole 310 can be automatically closed through the cooperation of the baffle 317 and the spring 1 309. This design improves the safety and practicality of the semiconductor heat dissipation structure.

[0055] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and inventive features disclosed herein.

Claims

1. A semiconductor heat dissipation structure, comprising a cooling box (1), a clamping mechanism (2) and a pipeline mechanism (3), characterized in that: The cooling box (1) comprises an inner frame (101) and an outer frame (102); a plurality of slots (105) are provided on the inner walls of the front and rear sides of the inner frame (101); the clamping mechanism (2) is movably installed in the slots (105); an extrusion groove (109) is provided at the bottom of the slots (105); an extrusion block (110) is movably arranged in the extrusion groove (109); a vertical rod (111) penetrating the bottom of the slot (105) is connected below the extrusion block (110); and a linkage plate (113) is movably installed between the vertical rods (111) in the same group; The pipeline mechanism (3) comprises an upper cooling pipeline (302) and a lower cooling pipeline (303) which are interconnected, wherein the upper cooling pipeline (302) is arranged on the inner frame (101) and located between the slots (105), and the lower cooling pipeline (303) is located below the clamping mechanism (2) and the inner frame (101); a plurality of groups of vertical nozzles (305) are arranged on the lower cooling pipeline (303), and a squeezing ball (312) which automatically locks the air outlet is arranged at the outlet of the vertical nozzle (305); a deflector (114) facing upward is arranged in the middle of the linkage plate (113), and a deflector (114) is arranged at the bottom of the deflector (114). A butt joint tube (115) cooperates with the vertical nozzle (305), and a plurality of groups of connecting arms (116) are arranged on the inner wall of the butt joint tube (115), and a top column (117) cooperating with the squeezing ball (312) is arranged in the middle of the connecting arm (116); when the clamping mechanism (2) is installed in the slot (105), the bottom of the clamping mechanism (2) squeezes the squeezing block (110), the vertical rod (111) drives the top column (117) to squeeze the squeezing ball (312) downward, and the vertical nozzle (305) located below the clamping mechanism (2) cools the bottom of the clamping mechanism (2).

2. A semiconductor heat dissipation structure according to claim 1, characterized in that: The clamping mechanism (2) comprises a semiconductor (201) and a U-shaped member (202); the semiconductor (201) is movably mounted on the U-shaped member (202); the U-shaped member (202) is movably mounted in the slot (105); and a plurality of through holes (203) are provided at the bottom of the U-shaped member (202).

3. A semiconductor heat dissipation structure according to any one of claims 1 to 2, characterized in that: A plurality of groups of first support arms (103) are connected to the outer wall of the inner frame (101); the inner frame (101) is mounted on the inner wall of the outer frame (102) via the first support arms (103); and air-permeable nets (104) are provided on the left and right sides of the inner frame (101).

4. A semiconductor heat dissipation structure according to claim 2, characterized in that: The side wall of the slot (105) is provided with a plurality of slots (106), a positioning spring (107) is installed in the slot (106), a ball (108) is arranged on the outside of the positioning spring (107), and both sides of the U-shaped member (202) are provided with a plurality of grooves (204) that cooperate with the ball (108).

5. The semiconductor heat dissipation structure according to claim 1, characterized in that: The bottom of the extrusion block (110) is connected to a plurality of sets of return springs (112).

6. A semiconductor heat dissipation structure according to claim 1, characterized in that: The bottom of the inner wall of the outer frame (102) is connected to a plurality of groups of second support arms (118), and a plurality of groups of fan blades (119) are arranged in the middle of the second support arms (118).

7. A semiconductor heat dissipation structure according to claim 1, characterized in that: The upper cooling pipe (302) is provided with a plurality of groups of horizontal nozzles (304), and the horizontal nozzles (304) are arranged between adjacent slots (105); a baffle (317) is arranged inside the horizontal nozzle (304), and a top ring (307) is arranged at the outlet of the horizontal nozzle (304); a self-opening movable plate (308) is movably arranged between the baffle (317) and the top ring (307), and the edge of the movable plate (308) is connected to the top ring (307) via a spring (309); a plurality of groups of first air holes (306) are provided on the baffle (317), and a plurality of groups of second air holes (310) offset from the first air holes (306) are provided on the movable plate (308).

8. A semiconductor heat dissipation structure according to claim 1, characterized in that: A plurality of groups of bosses (311) are arranged on the inner wall of the vertical nozzle (305); a limiting ring (316) is arranged at the outlet of the vertical nozzle (305); the squeezing ball (312) is movably arranged between the boss (311) and the limiting ring (316); the bottom of the squeezing ball (312) is connected to a base (313); the base (313) is connected to the boss (311) via a second spring (314); a plurality of groups of air permeable grooves (315) are arranged on the side of the base (313); under the action of the second spring (314), the limiting ring (316) blocks the air permeable groove (315) and limits the flow of cold air; when the top column (117) squeezes the squeezing ball (312) downward, the cold air cools the bottom of the clamping mechanism (2) through the air permeable groove (315), the butt joint pipe (115) and the air guide cover (114).

9. A semiconductor heat dissipation structure according to any one of claims 1-2, characterized in that: An air cooler (120) is installed on the side of the outer frame (102); a branch pipe (301) is connected to the outlet of the air cooler (120); the upper part of the branch pipe (301) is connected to the upper cooling pipe (302); and the lower part of the branch pipe (301) is connected to the lower cooling pipe (303).

10. A semiconductor heat dissipation structure according to any one of claims 1-2, characterized in that: A top cover (121) is movably mounted between the outer frame (102) and the inner frame (101), and a bottom cover (122) is movably mounted at the bottom of the outer frame (102).

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