A fiber composite panel and a terminal device
By interlacing high tensile modulus first fibers and high flexural modulus second fibers with polymer resin to form fiber composite boards, the problem of low puncture strength of glass fibers is solved, and the thinner and lighter shells of consumer electronics products are achieved with high-strength protection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2024-03-21
- Publication Date
- 2026-07-10
AI Technical Summary
The glass fiber used in the back cover materials of existing consumer electronics products has low puncture strength, resulting in a relatively thick thickness, which cannot meet the requirements for a thinner and lighter overall device.
A fiber composite board is formed by combining interwoven high tensile modulus first fibers and high flexural modulus second fibers with polymer resin. The board is then hot-pressed to improve puncture strength and reduce thickness.
It achieves the goal of reducing the thickness of the outer shell while meeting structural strength requirements, making the outer shell both lightweight and high-strength, suitable for the protection of terminal equipment.
Smart Images
Figure CN118664982B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of composite materials, specifically to a fiber composite board and a terminal device. Background Technology
[0002] Currently, most consumer electronics products, such as mobile phones and tablets, use fiberglass composite materials as the back cover material to encapsulate internal electronic components. Existing back covers typically use fiberglass. Due to the low puncture strength of fiberglass, 5-6 layers of 0.08mm-0.2mm thick fiberglass cloth are needed to improve the structural strength of the back cover and meet drop resistance requirements, thus protecting critical internal components such as batteries, cameras, and circuit boards. Therefore, the puncture strength of existing back covers is relatively low, and the overall thickness is usually quite large, generally exceeding 0.5mm. This thickness cannot meet the current demand for increasingly thinner and lighter devices. Summary of the Invention
[0003] This application provides a fiber composite board and a terminal device, which can be used to obtain a high-strength shell and is expected to reduce the thickness of the shell.
[0004] In a first aspect, this application provides a fiber composite board, comprising at least one fiber composite layer, each fiber composite layer comprising a fiber fabric and a polymer resin, wherein the polymer resin fills the pores of the fiber fabric and coats the fiber fabric; the fiber fabric comprises interwoven first fibers and second fibers; the tensile modulus of the first fiber is ≥150Gpa, the flexural modulus of the second fiber is ≥35Gpa; and the puncture strength of the fiber composite board is >130N.
[0005] The fiber composite board of this application comprises at least one fiber composite layer, each fiber composite layer comprising fiber fabric and polymer resin, wherein the polymer resin fills the pores of the fiber fabric and coats the fiber fabric, and the fiber composite board is obtained after the at least one fiber composite layer is hot-pressed. The fiber fabric comprises interwoven first fibers and second fibers, wherein the tensile modulus of the first fiber is ≥150GPa, and the high tensile modulus of the first fiber enables the fiber composite board to have high tensile strength, thereby improving the puncture strength of the fiber composite board; the flexural modulus of the second fiber is ≥35GPa, and the second fiber can serve as a reinforcing fiber, enabling the fiber composite board to have high flexural strength, thereby improving the stiffness of the fiber composite board. Through the effective combination of the first and second fibers, this application enables the puncture strength of the fiber composite board to be >130N. When the fiber composite board is applied to the shell, it is expected to meet the structural strength requirements of electronic product shells while reducing the thickness of the shell, making the shell both thin and strong.
[0006] In one optional implementation, the mass percentage of the first fiber in each layer of the fiber fabric is 1 wt.%-99 wt.%, for example, 30%-99%, 40%-95%, 50%-90%, or 60%-90%; the mass percentage of the second fiber in each layer of the fiber fabric is 1 wt.%-99 wt.%, for example, 5%-55%, 7%-50%, 9%-45%, 10%-45%, or 10%-40%. By rationally setting the mass percentage of the first and second fibers in each layer of the fiber fabric, the roles of the first and second fibers can be maximized. That is, by effectively combining the advantages of the first and second fibers, the final fiber composite board has high strength and stiffness, which is conducive to achieving the thinness and lightness of the fiber composite board.
[0007] In one optional implementation, the diameter of the first fiber is 10μm-18μm, and the diameter of the second fiber is 5μm-15μm. During fiber preparation, first and second fibers with different diameters can be obtained. By rationally designing the diameters of the first and second fibers, a good match can be achieved, effectively combining the advantages of both fibers. This results in a final fiber composite board with high strength and stiffness, which is beneficial for achieving a thinner and lighter fiber composite board.
[0008] In one alternative implementation, the porosity of the fiber fabric is ≤5%. By controlling the porosity of the fiber fabric formed by the interlacing of the first and second fibers, the density of the fiber fabric can be increased, which in turn can improve the strength and stiffness of the fiber composite board.
[0009] In one alternative implementation, the first fiber comprises poly(p-phenylenebenzodioxazole) (precisionboost overdrive, PBO) fiber, and the second fiber comprises either glass fiber or ceramic fiber. It is understood that the first fiber in different fiber composite layers of the same fiber composite board can be the same or different. For example, a fiber composite board may have three fiber composite layers, wherein the first fiber in the first fiber composite layer is PBO fiber and the second fiber is glass fiber; the first fiber in the second fiber composite layer is PBO fiber and the second fiber is ceramic fiber; and the first fiber in the third fiber composite layer is PBO fiber and the second fiber is glass fiber.
[0010] In one optional implementation, the polymer resin content in each fiber composite layer is 30 wt.% to 50 wt.%. Adjusting the polymer resin content in each fiber composite layer according to actual conditions makes the structure of each fiber fabric more stable, which is beneficial for the curing and molding of the fiber composite layer and the fiber composite board.
[0011] In one alternative implementation, the polymer resin includes at least one of epoxy resin, bismaleimide resin, polycarbonate resin, and polyetheretherketone resin. It is understood that the polymer resins in different fiber composite layers of the same fiber composite board can be the same or different.
[0012] In one alternative implementation, the fiber composite layer consists of 2-5 layers. The number of fiber composite layers can be adjusted based on the actual thickness of each layer to ensure the final fiber composite board achieves the required strength and stiffness.
[0013] In one optional implementation, the thickness of the fiber composite board is <0.5mm. The fiber composite board of this application, through the composite of a fiber fabric formed by the interlacing of first and second fibers with a polymer resin, can reduce the thickness of the fiber composite board to below 0.5mm, and possesses characteristics such as high strength and good rigidity.
[0014] In this application, the data in the various possible implementations mentioned above, such as tensile modulus, thickness, diameter, strength, etc., should be understood as being within the range defined in this application, provided that the values are within the engineering measurement error range.
[0015] Secondly, this application provides a terminal device, including a housing and electronic components disposed within the housing, wherein at least a portion of the housing is a fiber composite board as described in the first aspect.
[0016] In the terminal equipment of this application, the fiber composite board can be used as at least part of the outer shell of devices such as mobile phones, computers, electronic watches, displays, home appliances, and vehicles. Since the puncture strength of the fiber composite board of this application is >130N, when used as the outer shell of a terminal device, it possesses high strength and rigidity, satisfying the requirement of maintaining structural strength to protect internal electronic components while reducing the shell thickness, thus contributing to the overall thinning and lightening of the device.
[0017] The technical effects that can be achieved in the second aspect mentioned above can be referred to the corresponding effect descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description
[0018] Figure 1 This is a structural schematic diagram of a fiber composite board provided in an embodiment of this application;
[0019] Figure 2 This is a schematic diagram of the structure of a fiber fabric provided in an embodiment of this application;
[0020] Figure 3This is a schematic diagram of another fiber fabric structure provided in an embodiment of this application;
[0021] Figure 4 This is a schematic diagram of another fiber fabric provided in an embodiment of this application.
[0022] Figure label:
[0023] 1-Fiber composite layer; 2-First fiber; 3-Second fiber. Detailed Implementation
[0024] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.
[0025] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise.
[0026] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.
[0027] Electronic devices, such as mobile phones, computers, smartwatches, displays, home appliances, and vehicles, typically have casings to encapsulate internal electronic components like batteries, cameras, and circuit boards, thus protecting them. As the casing of electronic devices, it needs to possess high structural strength and low thickness to protect critical components and meet the requirements of thinness and lightness. However, existing materials cannot simultaneously meet the demands of thinness and high strength. Therefore, this application provides a fiber composite board, from which a casing can be prepared that achieves high strength while maintaining a relatively thin thickness.
[0028] Figure 1 This is a structural schematic diagram of a fiber composite board. Figure 1As shown, the fiber composite board includes a fiber composite layer 1. The fiber composite layer 1 can be a single layer or multiple layers, such as 2-5 layers. For example, the number of fiber composite layers 1 can be 1, 2, 3, 4, 5, 6 or more layers. When the fiber composite layer 1 is multiple layers, the multiple fiber composite layers 1 are stacked and hot-pressed to obtain the fiber composite board.
[0029] Each fiber composite layer 1 comprises a fiber fabric and a polymer resin, with the polymer resin filling and coating the pores of the fiber fabric. The fiber fabric acts as a reinforcement, improving the lightness and stiffness of the fiber composite panel and facilitating a reduction in its thickness. The polymer resin, as a matrix, fills the pores of the fiber fabric, increasing its structural density and distributing loads throughout, thus enhancing the structural stability of the fiber composite panel. Simultaneously, the polymer resin coating helps protect the fiber fabric from external environmental forces, reducing the likelihood of damage to the fiber composite panel. The combined action of the fiber fabric and polymer resin ensures optimal quality and performance of the fiber composite panel.
[0030] The structural composition of fiber fabrics and polymer resins will be explained below.
[0031] The fiber fabric of this application embodiment can be obtained by a bidirectional weaving process of the first fiber 2 and the second fiber 3. Figure 2 This is a schematic diagram of the structure of a fiber fabric according to one embodiment. Figure 2 As shown, the fiber fabric in each fiber composite layer 1 includes interwoven first fibers 2 and second fibers 3. Specifically, in a first direction, only the first fibers 2 are arranged; in a second direction, only the second fibers 3 are arranged, meaning there is an angle between the first fibers 2 and the second fibers 3.
[0032] Figure 3 This is a schematic diagram of the structure of a fiber fabric according to another embodiment. Figure 3 As shown, the fiber fabric in each fiber composite layer 1 also includes interwoven first fibers 2 and second fibers 3. Specifically, the first fibers 2 are arranged in both the first and second directions, and the second fibers 3 are also arranged in some directions, i.e., some of the first fibers 2 and second fibers 3 are at an angle to each other, while others are parallel.
[0033] It should be noted that, Figure 4 This is a schematic diagram of the structure of a fiber fabric according to another embodiment. Figure 4 As shown, the fiber fabric can also be made by a unidirectional weaving process of the first fiber 2 and the second fiber 3, that is, all the first fibers 2 and the second fibers 3 are arranged in parallel.
[0034] In each fiber composite layer 1, the tensile modulus of the first fiber 2 is ≥150 GPa, meaning the first fiber 2 provides high tensile strength to the fiber composite board, thereby improving its puncture strength. In each fiber composite layer 1, the flexural modulus of the second fiber 3 is ≥35 GPa. The second fiber 3 serves as a reinforcing fiber, providing high flexural strength to the fiber composite board, thereby improving its stiffness and flatness. The tensile modulus of the second fiber can be <150 GPa, and the flexural modulus of the first fiber can be <35 GPa.
[0035] The fiber composite board of this application embodiment is made by combining a fiber fabric formed by interlacing the first fiber 2 and the second fiber 3 with a polymer resin, which can make the puncture strength of the fiber composite board >130N. When the fiber composite board is applied to the shell, it is expected to reduce the thickness of the shell while meeting the structural strength requirements of the electronic product shell, so that the shell has both the characteristics of being thin and light and having high strength.
[0036] Reference Figures 2-4 In the fiber composite board of this application embodiment, the mass percentage of the first fiber 2 in each layer of fiber fabric is 1wt.%-99wt.%, and for example, the mass percentage of the first fiber 2 in each layer of fiber fabric is 1wt.%, 5wt.%, 10wt.%, 20wt.%, 30wt.%, 40wt.%, 50wt.%, 60wt.%, 70wt.%, 80wt.%, 90wt.%, 99wt.%, etc. Correspondingly, the mass percentage of the second fiber 3 in each layer of fiber fabric is 99wt.%-1wt.%, and for example, the mass percentage of the second fiber 3 in each layer of fiber fabric is 99wt.%, 90wt.%, 80wt.%, 70wt.%, 60wt.%, 50wt.%, 40wt.%, 30wt.%, 20wt.%, 10wt.%, 5wt.%, 1wt.%, etc. It is understood that the above values are merely illustrative examples, and these values may be minimum or maximum values. Any value between these two values is within the scope of protection of this application. By rationally setting the mass ratio of the first fiber 2 and the second fiber 3 in each layer of fiber fabric, this application can maximize the role of the first fiber 2 and the second fiber 3. That is, by effectively combining the advantages of the first fiber 2 and the second fiber 3, the final fiber composite board can have high strength and rigidity, which is beneficial to reducing the thickness of the fiber composite board while meeting strength requirements, so as to achieve the goal of making the whole machine lighter and thinner.
[0037] The first fiber 2 and the second fiber 3 of different diameters can be prepared by a dry-jet wet spinning process, and then the first fiber 2 and the second fiber 3 of different diameters can be used to produce a fiber fabric through a unidirectional or bidirectional weaving process. Specifically, the diameter of the first fiber 2 is 10μm-18μm, and for example, the diameter of the first fiber 2 is 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, 16μm, 17μm, 18μm, etc. The diameter of the second fiber 3 is 5μm-15μm, and for example, the diameter of the second fiber 3 is 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, etc. It is understood that the above values are only illustrative examples, and the above values can be the minimum or maximum values. Any value between any two of the above values is within the protection scope of this application. During the preparation of the first fiber 2 and the second fiber 3, by rationally designing the diameters of the first fiber 2 and the second fiber 3 in each fiber composite layer 1, the first fiber 2 and the second fiber 3 can be well matched, which can better combine the advantages of the first fiber 2 and the second fiber 3, so that the final fiber composite board has high strength and rigidity, which is conducive to realizing the thinness of the fiber composite board.
[0038] Reference Figures 2-4 In this embodiment, the porosity of the fiber fabric in each fiber composite layer 1 is ≤5%. For example, the porosity of the fiber fabric in each fiber composite layer 1 is 0%, 0.5%, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, etc. By controlling the porosity of the fiber fabric formed by the interlacing of the first fiber 2 and the second fiber 3, the polymer resin can fill the interlacing pores of the first fiber 2 and the second fiber 3 as much as possible, thereby increasing the density of the fiber fabric and further improving the strength and stiffness of the fiber composite board.
[0039] Continue to refer to Figures 2-4 In this embodiment, the first fiber 2 includes, but is not limited to, PBO fiber, and the second fiber 3 includes, but is not limited to, glass fiber and ceramic fiber. It should be noted that the first fiber 2 in different fiber composite layers 1 of the same fiber composite board can be the same or different. For example, a fiber composite board has three fiber composite layers 1, wherein in the first fiber composite layer, the first fiber 2 is PBO fiber and the second fiber 3 is glass fiber; in the second fiber composite layer, the first fiber 2 is PBO fiber and the second fiber 3 is ceramic fiber; and in the third fiber composite layer, the first fiber 2 is PBO fiber and the second fiber 3 is glass fiber.
[0040] The polymer resin content in each fiber composite layer 1 is 30 wt.%-50 wt.%, for example, 30 wt.%, 35 wt.%, 40 wt.%, 45 wt.%, and 50 wt.%. By reasonably adjusting the polymer resin content in each fiber composite layer 1, the structure of each fiber fabric layer can be made more stable, which is beneficial to the curing and molding of fiber composite layer 1 and fiber composite board. In this embodiment, by reasonably designing the mass ratio of the first fiber 2, the second fiber 3, and the polymer resin, the fiber composite board can have high structural strength with a relatively low thickness.
[0041] The polymer resin includes one of thermosetting resins and thermoplastic resins. Thermosetting resins include, but are not limited to, at least one of epoxy resins and bismaleimide resins. Thermoplastic resins include, but are not limited to, at least one of polycarbonate resins and polyetheretherketone resins. Epoxy resin is preferred as the polymer resin. It should be noted that the polymer resins in different fiber composite layers 1 of the same fiber composite board can be the same or different. For example, a fiber composite board has three fiber composite layers 1, wherein the first fiber composite layer has epoxy resin, the second fiber composite layer has bismaleimide resin, and the third fiber composite layer has epoxy resin.
[0042] It should be further noted that the fiber composite board in this application embodiment may also include at least one of flame retardant, coupling agent, curing agent, antioxidant, and colorant. The flame retardant ensures the safety of electronic products during use and charging. The coupling agent enhances the interfacial properties of the material, allowing the polymer resin material to better bond and solidify with the fiber fabric, thus improving the bonding strength between the two. When the polymer resin used is a thermosetting resin, a curing agent is also required. The curing agent can initiate or accelerate the curing reaction of the fiber composite layer 1, promoting the formation of the fiber composite layer 1 and making it more robust and stable. The antioxidant can delay or inhibit the oxidative discoloration of the fiber composite layer 1, extending its service life. The colorant enhances the appearance quality of the fiber composite board, meeting the color requirements of different users.
[0043] The fiber composite board of this application embodiment can be obtained by laminating 2-5 layers of fiber composite layer 1 and then hot-pressing them. (Refer to...) Figure 1The fiber composite board is made of three fiber composite layers 1. The number of fiber composite layers 1 can be adjusted according to the actual thickness of each layer 1 to achieve the required strength and stiffness in the final fiber composite board. It should be noted that the multiple fiber composite layers 1 in the fiber composite board can be the same or different, the weaving process of the fiber fabrics in the multiple fiber composite layers 1 can be the same or different, and the polymer resins in the multiple fiber composite layers 1 can be the same or different. For example, a fiber composite board has three fiber composite layers 1. In the first fiber composite layer, the first fiber 2 is PBO fiber, the second fiber 3 is glass fiber, and the first fiber 2 and the second fiber 3 are formed into a fiber fabric through a bidirectional weaving process. The polymer resin is epoxy resin. In the second fiber composite layer, the first fiber 2 is PBO fiber, the second fiber 3 is ceramic fiber, and the first fiber 2 and the second fiber 3 are formed into a fiber fabric through a unidirectional weaving process. The polymer resin is bismaleimide resin. In the third fiber composite layer, the first fiber 2 is PBO fiber, the second fiber 3 is glass fiber, and the first fiber 2 and the second fiber 3 are formed into a fiber fabric through a bidirectional weaving process. The polymer resin is epoxy resin.
[0044] It should be noted that the thickness of each fiber composite layer 1 is 0.05mm-0.20mm. For example, the thickness of each fiber composite layer 1 can be 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.20mm, etc.
[0045] This application effectively combines the advantages of the first fiber 2 and the second fiber 3, enabling the fiber composite board to meet the structural strength requirements of electronic product casings while reducing the thickness of the fiber composite board to below 0.5mm, thus giving the casing both lightweight and high strength.
[0046] The preparation process of the fiber composite board in this application includes the following steps:
[0047] S201. A slurry is formed by blending polymer resin with flame retardant, coupling agent, curing agent, antioxidant, and colorant.
[0048] S202. Pass the same / different fiber fabrics through an impregnation tank containing slurry to obtain the same / different single-layer fiber composite layer 1 prepreg.
[0049] S203. Stack multiple layers of the same / different fiber composite layer 1 prepreg and perform hot pressing to obtain fiber composite board. The hot pressing temperature is 140℃-160℃ and the processing time is 4-7min.
[0050] This application embodiment utilizes the combination of fiber fabric and polymer resin to prepare a fiber composite board with a puncture strength >130N. Simultaneously, the fiber fabric is woven from first fiber 2 and second fiber 3, effectively combining the advantages of both fibers. This enhances the strength and stiffness of the fiber composite board, enabling it to possess high structural strength while maintaining a relatively small thickness, thus conforming to the trend of thinner and lighter overall designs.
[0051] The fiber composite board of this application is used in the housing of terminal equipment. The strength and rigidity of the fiber composite board enable the housing to protect the internal electronic components with a relatively thin thickness.
[0052] The fiber composite board of this application will be further described in detail below with reference to specific embodiments.
[0053] The preparation process of PBO fibers in the following examples is as follows: PBO resin is obtained by polycondensation reaction of 4,6-diaminoresorcinol dihydrochloride and terephthalic acid. PBO resin is then processed by dry-jet wet spinning to obtain PBO fibers of different diameters. The tensile modulus of the PBO fibers is 240 GPa, the flexural modulus is 20 GPa, and the fiber diameter is 12 μm. The tensile modulus of the ceramic fibers is 270 GPa, the flexural modulus is 55 GPa, and the fiber diameter is 12 μm. The tensile modulus of the glass fibers is 80 GPa, the flexural modulus is 28 GPa, and the fiber diameter is 10 μm. The porosity of the fiber fabrics in these examples is ≤5%. The polymer resin used in these examples is epoxy resin (a blend of bisphenol A type epoxy resin and biphenyl type epoxy resin), the flame retardant is aluminum hydroxide, the coupling agent is an aminosilane coupling agent, the curing agent is imidazole, the antioxidant is antioxidant 1010, and the colorant is titanium dioxide. It should be noted that in the preparation process of the slurry in the following examples, epoxy resin accounts for 90 wt.%, and flame retardant, coupling agent, curing agent, antioxidant, and colorant together account for 10 wt.%. The fiber fabrics in the following examples all use... Figure 2 Weave as shown.
[0054] Example 1
[0055] This embodiment is a fiber composite board, which is prepared by the following method:
[0056] S301. Prepare the slurry according to the above method;
[0057] S302. 60 wt.% PBO fiber and 40 wt.% ceramic fiber are combined through a bidirectional weaving process to form a fiber fabric. The fiber fabric is then passed through an impregnation tank containing slurry to obtain a single-layer fiber composite prepreg with a thickness of 0.12 mm.
[0058] S303. Three layers of fiber composite prepreg are stacked and hot-pressed to obtain a fiber composite board with a thickness of 0.35 mm. The hot-pressing temperature is 150℃ and the processing time is 6 min.
[0059] According to GB / T10004-2008, the fiber composite board was subjected to a puncture strength test. The test results showed that the puncture strength of the fiber composite board in this embodiment was 200 N and the flexural modulus was 36 GPa.
[0060] Example 2
[0061] This embodiment is a fiber composite board, which is prepared by the following method:
[0062] S301. Prepare the slurry according to the above method;
[0063] S302. 60 wt.% PBO fiber and 40 wt.% glass fiber are combined through a bidirectional weaving process to form a fiber fabric. The fiber fabric is then passed through an impregnation tank containing slurry to obtain a single-layer fiber composite prepreg with a thickness of 0.12 mm.
[0064] S303. Three layers of fiber composite prepreg are stacked and hot-pressed to obtain a fiber composite board with a thickness of 0.35 mm. The hot-pressing temperature is 150℃ and the processing time is 6 min.
[0065] According to GB / T10004-2008, the fiber composite board was subjected to a puncture strength test. The test results showed that the puncture strength of the fiber composite board in this embodiment was 180N and the flexural modulus was 29Gpa.
[0066] Example 3
[0067] This embodiment is a fiber composite board, which is prepared by the following method:
[0068] S301. Prepare the slurry according to the above method;
[0069] S302. A first fiber fabric is formed by combining 60 wt.% PBO fiber and 40 wt.% glass fiber through a bidirectional weaving process. A second fiber fabric is formed by combining 60 wt.% PBO fiber and 40 wt.% ceramic fiber through a bidirectional weaving process. The first and second fiber fabrics are passed through an impregnation tank containing slurry to obtain prepregs with different single-layer fiber composite layers of 0.12 mm thickness.
[0070] S303. Two layers of fiber composite prepreg containing the first type of fiber fabric and one layer of fiber composite prepreg containing the second type of fiber fabric are alternately stacked and hot-pressed to obtain a fiber composite board with a thickness of 0.35 mm. The hot-pressing temperature is 150℃ and the processing time is 6 min.
[0071] According to GB / T10004-2008, the puncture strength of the fiber composite board was tested. The test results showed that the puncture strength of the fiber composite board in this embodiment was 190 N and the flexural modulus was 31 GPa.
[0072] Example 4
[0073] This embodiment is a fiber composite board, which is prepared by the following method:
[0074] S301. Prepare the slurry according to the above method;
[0075] S302. 70 wt.% PBO fiber and 30 wt.% glass fiber are combined through a bidirectional weaving process to form a fiber fabric. The fiber fabric is then passed through an impregnation tank containing slurry to obtain a single-layer fiber composite prepreg with a thickness of 0.12 mm.
[0076] S303. Three layers of fiber composite prepreg are stacked and hot-pressed to obtain a fiber composite board with a thickness of 0.35 mm. The hot-pressing temperature is 150℃ and the processing time is 6 min.
[0077] According to GB / T10004-2008, the puncture strength of the fiber composite board was tested. The test results showed that the puncture strength of the fiber composite board in this embodiment was 220 N and the flexural modulus was 28 GPa.
[0078] Example 5
[0079] This embodiment is a fiber composite board, which is prepared by the following method:
[0080] S301. Prepare the slurry according to the above method;
[0081] S302. 80 wt.% PBO fiber and 20 wt.% glass fiber are combined through a bidirectional weaving process to form a fiber fabric. The fiber fabric is then passed through an impregnation tank containing slurry to obtain a single-layer fiber composite prepreg with a thickness of 0.12 mm.
[0082] S303. Three layers of fiber composite prepreg are stacked and hot-pressed to obtain a fiber composite board with a thickness of 0.35 mm. The hot-pressing temperature is 150℃ and the processing time is 6 min.
[0083] According to GB / T10004-2008, the fiber composite board was subjected to a puncture strength test. The test results showed that the puncture strength of the fiber composite board in this embodiment was 240 N and the flexural modulus was 26 GPa.
[0084] Example 6
[0085] This embodiment is a fiber composite board, which is prepared by the following method:
[0086] S301. Prepare the slurry according to the above method;
[0087] S302. 90 wt.% PBO fiber and 10 wt.% glass fiber are combined through a bidirectional weaving process to form a fiber fabric. The fiber fabric is then passed through an impregnation tank containing slurry to obtain a single-layer fiber composite prepreg with a thickness of 0.12 mm.
[0088] S303. Three layers of fiber composite prepreg are stacked and hot-pressed to obtain a fiber composite board with a thickness of 0.35 mm. The hot-pressing temperature is 150℃ and the processing time is 6 min.
[0089] According to GB / T10004-2008, the fiber composite board was subjected to a puncture strength test. The test results showed that the puncture strength of the fiber composite board in this embodiment was 250N and the flexural modulus was 25Gpa.
[0090] Comparative Example 1
[0091] This embodiment is a fiber composite board, which is prepared by the following method:
[0092] S301. Prepare the slurry according to the above method;
[0093] S302. 100wt.% of glass fiber is formed into a fiber fabric through a bidirectional weaving process. The fiber fabric is then passed through an impregnation tank containing slurry to obtain a single-layer fiber composite prepreg with a thickness of 0.12mm.
[0094] S303. Three layers of fiber composite prepreg are stacked and hot-pressed to obtain a fiber composite board with a thickness of 0.45 mm. The hot-pressing temperature is 150℃ and the processing time is 6 min.
[0095] According to GB / T10004-2008, the fiber composite board was subjected to a puncture strength test. The test results showed that the puncture strength of the fiber composite board in this embodiment was 70 N and the flexural modulus was 28 GPa.
[0096] Comparative Example 2
[0097] This embodiment is a fiber composite board, which is prepared by the following method:
[0098] S301. Prepare the slurry according to the above method;
[0099] S302. 100wt.% of ceramic fibers are formed into a fiber fabric through a bidirectional weaving process. The fiber fabric is then passed through an impregnation tank containing slurry to obtain a single-layer fiber composite prepreg with a thickness of 0.15mm.
[0100] S303. Three layers of fiber composite prepreg are stacked and hot-pressed to obtain a fiber composite board with a thickness of 0.35 mm. The hot-pressing temperature is 150℃ and the processing time is 6 min.
[0101] According to GB / T10004-2008, the puncture strength of the fiber composite board was tested. The test results showed that the puncture strength of the fiber composite board in this embodiment was 60 N and the flexural modulus was 53 GPa.
[0102] Comparative Example 3
[0103] This embodiment is a fiber composite board, which is prepared by the following method:
[0104] S301. Prepare the slurry according to the above method;
[0105] S302. 100wt.% PBO fiber is formed into a fiber fabric through a bidirectional weaving process. The fiber fabric is then passed through an impregnation tank containing slurry to obtain a single-layer fiber composite prepreg with a thickness of 0.12mm.
[0106] S303. Three layers of fiber composite prepreg are stacked and hot-pressed to obtain a fiber composite board with a thickness of 0.35 mm. The hot-pressing temperature is 150℃ and the processing time is 6 min.
[0107] According to GB / T10004-2008, the fiber composite board was subjected to a puncture strength test. The test results showed that the puncture strength of the fiber composite board in this embodiment was 260 N and the flexural modulus was 21 GPa.
[0108] Table 1
[0109]
[0110]
[0111] As can be seen from the data in Table 1, in the puncture strength test of fiber composite boards, compared with Example 1, under the premise of maintaining the same thickness of fiber composite boards, the fiber composite board formed by weaving PBO fibers and ceramic fibers can improve the puncture resistance of the fiber composite board to a certain extent compared with the fiber composite board formed by weaving PBO fibers and glass fibers.
[0112] Compared with Examples 1-2, Example 3, while maintaining the same thickness of the fiber composite board, shows that the fiber composite board containing both PBO fiber and glass fiber, and PBO fiber and ceramic fiber, has higher puncture strength and flexural modulus than the fiber composite board containing only PBO fiber and ceramic fiber, and only PBO fiber and glass fiber. This indicates that the fiber composite board made from different fiber composite layers has better overall performance.
[0113] Comparing Examples 2, 4, 5, and 6, while maintaining the same thickness of the fiber composite board, the puncture strength of the fiber composite boards woven from PBO fibers and glass fibers increased to 180N, 220N, 240N, and 250N respectively with increasing PBO fiber content, indicating a gradual increase in puncture resistance. Referring to Comparative Example 3, the puncture strength was highest when the PBO fiber content reached 100%.
[0114] Compared with Comparative Examples 1-2, Examples 1-6 show that when the fiber composite layer contains two types of fibers, the puncture strength of the fiber composite board is significantly improved compared to when only one fiber is used as the fiber layer. It should be noted that although the ceramic fiber in Comparative Example 2 has a higher tensile modulus, it is brittle and prone to breakage during puncture testing, resulting in a lower puncture strength for the final fiber composite board.
[0115] Meanwhile, compared with Comparative Example 1, Examples 1-6 show that while reducing the thickness of the fiber composite board, the puncture resistance is further improved, indicating that the fiber fabric of this application can improve the puncture resistance of the fiber composite board.
[0116] Furthermore, compared with Comparative Example 3, Examples 1-6 show that the addition of ceramic fibers and glass fibers increases the bending strength of the fiber composite board to a certain extent, indicating that the addition of rigid fibers can improve the stiffness of the fiber composite board.
[0117] Based on the same technical concept, embodiments of this application provide a terminal device, which includes a housing and electronic components disposed within the housing, wherein at least a portion of the housing is a fiber composite board as described in the embodiments of this application. The terminal devices of this application include, but are not limited to, mobile phones, computers, electronic watches, displays, home appliances, vehicles, and other devices.
[0118] In the terminal device of this application, the fiber composite board can be used as at least part of the outer shell. Since the puncture strength of the fiber composite board of this application is >130N, when the fiber composite board of this application is used as the outer shell of the terminal device, it has high strength and rigidity, which can meet the requirement of protecting the internal electronic components while reducing the thickness of the outer shell, which is conducive to achieving the overall thinness and lightness of the device.
[0119] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A fiber composite board, characterized in that, It includes at least one fiber composite layer, each fiber composite layer comprising fiber fabric and polymer resin, wherein the polymer resin fills the pores of the fiber fabric and coats the fiber fabric; The fiber fabric comprises interwoven first and second fibers; the tensile modulus of the first fiber is ≥150 GPa, and the flexural modulus of the second fiber is ≥35 GPa; the first fiber comprises PBO fiber, and the second fiber comprises one of glass fiber and ceramic fiber; the mass percentage of the first fiber in each layer of the fiber fabric is 60 wt.%-90 wt.%; and the mass percentage of the second fiber in each layer of the fiber fabric is 10 wt.%-40 wt.%. The polymer resin in each fiber composite layer accounts for 30wt.%-50wt.%, and the polymer resin includes at least one of epoxy resin, bismaleimide resin, polycarbonate resin, and polyetheretherketone resin. The puncture strength of the fiber composite board is >130N.
2. The fiber composite board according to claim 1, characterized in that, The diameter of the first fiber is 10μm-18μm, and the diameter of the second fiber is in the range of 5μm-15μm.
3. The fiber composite board according to claim 1, characterized in that, The porosity of the fiber fabric is ≤5%.
4. The fiber composite board according to any one of claims 1-3, characterized in that, The fiber composite layer consists of 2-5 layers.
5. The fiber composite board according to any one of claims 1-3, characterized in that, The thickness of the fiber composite board is <0.5mm.
6. A terminal device, characterized in that, It includes a housing and electronic components disposed within the housing, wherein at least a portion of the housing is a fiber composite board as described in any one of claims 1-5.