Electronic device

Abstract

This application provides an electronic device, relating to the field of communication technology. The electronic device includes: a chip; a heat sink including a first heat sink layer and a second heat sink layer stacked along a first direction perpendicular to the heat sink wall, the heat sink wall being used to dissipate heat from the chip; a first receiving groove disposed on the first heat sink layer and opening towards the second heat sink layer; and an expansion portion located in the first receiving groove, the expansion portion being used to apply a first force to the first heat sink layer and / or the second heat sink layer when the temperature is above a threshold, and to apply a second force to the first heat sink layer and the second heat sink layer when the temperature is below or equal to the threshold, the second force being greater than the first force. By providing an expansion portion between the two heat sink layers, the heat dissipation capacity of the heat sink wall can be adjusted, thereby reducing heat dissipation at lower temperatures.

Description

Technical Field

[0001] This application relates to the field of communication technology, and more specifically, to an electronic device. Background Technology

[0002] With the development of communication technology, electronic devices are being used more and more widely. Chips in electronic devices generate a lot of heat during operation, and these chips can only function normally within a certain temperature range. To prevent the chip temperature from becoming too high, methods such as increasing the heat dissipation area and using materials with high thermal conductivity are commonly used to enhance heat dissipation capabilities.

[0003] However, some electronic devices (such as edge computing boxes) are often deployed in harsh outdoor environments, such as highways, bridges, and construction sites. The ambient temperature of these devices varies greatly depending on the season and region, sometimes dropping as low as -40 degrees Celsius. Even with enhanced heat dissipation designs, edge computing boxes can experience rapid temperature loss in low-temperature environments, leading to excessively low chip temperatures and affecting normal operation.

[0004] How to reduce heat dissipation of electronic devices under low temperatures is an urgent problem to be solved. Summary of the Invention

[0005] This application provides an electronic device that can reduce heat dissipation at low temperatures, thereby saving energy consumption.

[0006] In a first aspect, an electronic device is provided, comprising: a chip; a heat sink including a first heat sink layer and a second heat sink layer stacked along a first direction perpendicular to the heat sink wall, the heat sink wall being used to dissipate heat from the chip; a first receiving groove disposed in the first heat sink layer and opening toward the second heat sink layer; and an expansion portion located in the first receiving groove, the expansion portion being used to apply a first force to the first heat sink layer and / or the second heat sink layer when the temperature is above a threshold, and to apply a second force to the first heat sink layer and the second heat sink layer when the temperature is less than or equal to the threshold, the second force being greater than the first force.

[0007] This application embodiment, by providing an expansion portion between two heat dissipation layers, can adjust the heat dissipation capacity of the heat dissipation wall. At higher or normal temperatures, the heat dissipation wall composed of these two heat dissipation layers can dissipate heat normally. When the temperature is lower, the expansion portion applies a greater force to the first and / or second heat dissipation layers, offsetting the original contact pressure between the first and second heat dissipation layers. In other words, the contact pressure between the first and second heat dissipation layers decreases, thereby increasing the thermal resistance between them, thus reducing the heat dissipation performance of the heat dissipation wall, reducing heat dissipation, and achieving reduced heat dissipation at lower temperatures. Furthermore, the electronic device provided by this application embodiment has a simple structure and is easy to manufacture.

[0008] In conjunction with the first aspect, in some implementations of the first aspect, the expansion portion includes a negative thermal expansion material, wherein the coefficient of thermal expansion of the negative thermal expansion material is negative when the temperature of the expansion portion is equal to the threshold value.

[0009] The expansion part in this application embodiment can be processed using a negative thermal expansion material. The expansion part has a simple structure and is easy to manufacture.

[0010] In conjunction with the first aspect, in some implementations of the first aspect, thermally conductive silicone grease is applied between the first heat dissipation layer and the second heat dissipation layer.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the expansion portion includes a temperature sensor and a driver; when the temperature sensor detects that the temperature is less than or equal to the threshold, the driver drives the expansion portion to apply the second force to the first heat dissipation layer and / or the second heat dissipation layer.

[0012] In this embodiment, the expansion portion may include a temperature sensor and a driver. The expansion portion can apply a greater force to the first and / or second heat dissipation layers when the temperature is less than or equal to a threshold, thus counteracting the original contact pressure between the first and second heat dissipation layers. In other words, the contact pressure between the first and second heat dissipation layers decreases, thereby increasing the thermal resistance between them. This reduces the heat dissipation performance of the heat dissipation wall, thereby reducing heat dissipation.

[0013] In this embodiment, thermally conductive grease is applied between the first and second heat dissipation layers. The grease has good thermal conductivity, thus enhancing the thermal conductivity of the heat dissipation wall. However, the thermal conductivity of the grease decreases with decreasing pressure. Therefore, at lower temperatures, the expansion portion expands, exerting a greater force on the first and / or second heat dissipation layers. This counteracts the original contact pressure between the two layers, leading to a decrease in pressure between them. This increases the thermal resistance of the grease, thereby increasing the contact thermal resistance between the two layers. Consequently, the heat dissipation performance of the heat dissipation wall composed of these two layers decreases, reducing heat dissipation.

[0014] In conjunction with the first aspect, in some implementations of the first aspect, the chip is in contact with the first heat dissipation layer, the second heat dissipation layer is located on the side of the first heat dissipation layer away from the chip, and heat dissipation fins are provided on the side of the second heat dissipation layer away from the first heat dissipation layer.

[0015] The heat dissipation wall provided in this application embodiment can be provided with heat dissipation fins, which increase the heat dissipation area of ​​the heat dissipation wall and thus enhance the heat dissipation performance of the heat dissipation wall.

[0016] In conjunction with the first aspect, in some implementations of the first aspect, the heat dissipation fins are arranged at equal intervals along a second direction, which is parallel to the heat dissipation wall.

[0017] The heat dissipation wall provided in this application embodiment can be provided with heat dissipation fins arranged at equal intervals, which enhances the heat dissipation performance of the heat dissipation wall and facilitates processing and production.

[0018] In conjunction with the first aspect, in some implementations of the first aspect, the electronic device further includes: a fixing part for fixing the first heat dissipation layer and the second heat dissipation layer, such that when the temperature is less than or equal to the threshold, the contact pressure between the first heat dissipation layer and the second heat dissipation layer is greater than 0.

[0019] In this embodiment, the first and second heat dissipation layers are fixed by a fixing part. When the expansion part is not expanded, the pressure between the first and second heat dissipation layers is relatively high, improving heat dissipation performance. When the expansion part expands, the pressure between the first and second heat dissipation layers decreases, reducing heat dissipation performance and thus reducing heat dissipation. On the other hand, the fixing part applies a certain force during installation, ensuring that a certain contact pressure is maintained between the first and second heat dissipation layers even when the expansion part expands. In other words, the first and second heat dissipation layers remain in contact, thus achieving a fixing effect.

[0020] In conjunction with the first aspect, in some implementations of the first aspect, the electronic device further includes: a second receiving groove disposed on the surface of the second heat dissipation layer facing the first heat dissipation layer, and the expansion portion located in the first receiving groove and the second receiving groove.

[0021] In conjunction with the first aspect, in some implementations of the first aspect, the electronic device further includes a heating element disposed inside the electronic device, the heating element being used to heat the chip.

[0022] The electronic device provided in this application embodiment may include a heating element, and the heat dissipation capacity of the heat dissipation wall is adjusted by an expansion element. When the temperature is low, the heat dissipation capacity of the heat dissipation wall is reduced, thus saving energy. On the other hand, when the edge heat dissipation box starts at a low temperature, the preheating time is shortened, improving the working efficiency of the electronic device. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of an electronic device 100.

[0024] Figure 2 This is a schematic diagram of an electronic device 200 provided in an embodiment of this application.

[0025] Figure 3 This is a schematic diagram of an expansion section 240 provided in an embodiment of this application.

[0026] Figure 4 This is a schematic diagram of a heat dissipation wall 210 provided in an embodiment of this application.

[0027] Figure 5 This is a schematic diagram of another heat dissipation wall 210 provided in an embodiment of this application.

[0028] Figure 6 This is a schematic diagram of another heat dissipation wall 210 provided in the embodiments of this application.

[0029] Figure 7 This is a schematic diagram of another electronic device 200 provided in an embodiment of this application. Detailed Implementation

[0030] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0031] In the embodiments of this application, the words "exemplary," "for example," etc., are used to indicate that they are examples, illustrations, or descriptions. Any embodiment or design that is described as "exemplary" in this application should not be construed as being more preferred or advantageous than other embodiments or design options. Specifically, the use of the term "exemplary" is intended to present the concept in a concrete manner.

[0032] The business scenarios described in the embodiments of this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided in the embodiments of this application. As those skilled in the art will know, with the emergence of new business scenarios, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

[0033] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0034] Edge computing (EC) is the opposite of cloud computing. EC allows the collection and analysis of data to be performed on a network close to the user's local device, without transmitting data to the cloud where computing resources are centralized for processing. EC can also be called distributed cloud computing, fog computing, or fourth-generation data centers.

[0035] Electronic devices are products designed for edge computing. They are characterized by strong computing power, small size, and strong environmental adaptability, and can be widely deployed in edge environments to meet the application needs of complex environments such as security, transportation, communities, parks, shopping malls, and supermarkets.

[0036] Figure 1 An electronic device 100 is shown. The electronic device includes multiple walls 110 that enclose the device. One of the walls 110 is a heat dissipation wall 120, which has multiple fins 130. The fins 130 are used to dissipate heat from a chip 140, thereby reducing the temperature of the chip 140 and enabling it to function normally.

[0037] The driving force for heat dissipation of electronic device 100 is related to the temperature difference between the inside and outside of electronic device 100, and the thermal conductivity of heat dissipation wall 120 often does not change much.

[0038] In scenarios where electronic device 100 is used in edge computing boxes or other chip-containing applications, when the external temperature of electronic device 100 is low, due to its strong heat dissipation capacity, heat is easily lost from the inside of electronic device 100, leading to excessively low internal temperatures and affecting the normal operation of chip 140. To address this issue, related technical solutions employ auxiliary heating, which activates heating when the temperature falls below a certain value to ensure the normal operation of chip 140. However, the heat generated inside electronic device 100 is continuously transferred away through heat dissipation wall 120, resulting in wasted thermal energy and consequently, wasted electrical energy. In other words, since the heat dissipation capacity of electronic device 100 does not decrease at low temperatures, frequent heating with electrical energy is required to maintain the normal operating temperature of the chip.

[0039] On the other hand, in order to shorten the startup time of electronic devices and other equipment in low-temperature conditions, sufficient heating power is required in addition to the power supply needed to maintain the normal operation of the electronic devices and other equipment. Therefore, electronic device 100 needs to provide a higher power supply. As the power supply specifications increase, the price of hardware such as power adapters also increases, thereby increasing costs.

[0040] Figure 2 An electronic device 200 according to an embodiment of this application is shown. The electronic device 200 includes: a chip 230; a heat dissipation wall 210, which includes a first heat dissipation layer 211 and a second heat dissipation layer 212 stacked along a first direction perpendicular to the heat dissipation wall 210, and the heat dissipation wall 210 is used to dissipate heat from the chip 230; a first receiving groove 220 disposed on the first heat dissipation layer 211 and opening toward the second heat dissipation layer 212; and an expansion portion 240 located in the first receiving groove 220, which is used to apply a first force to the first heat dissipation layer 211 and / or the second heat dissipation layer 212 when the temperature is higher than a threshold, and to apply a second force to the first heat dissipation layer 211 and the second heat dissipation layer 212 when the temperature is less than or equal to the threshold, the second force being greater than the first force.

[0041] Figure 2 This is a front view of electronic device 200. Figure 2 The illustrated electronic device 200 is a cuboid. However, this application does not limit the shape of the electronic device; for example, it can also be a cylinder, a cone, etc. That is to say, the "wall" mentioned in this application can be a flat wall or an arc-shaped wall. In the case of an arc-shaped wall, the first direction is perpendicular to the heat dissipation wall 210, which can be understood as the first direction being perpendicular to a chord of the arc of the arc-shaped wall.

[0042] For example, the threshold can be between -20 degrees Celsius and 70 degrees Celsius.

[0043] In some embodiments, an adhesive may be applied to a portion of the surface of the first heat dissipation layer 211 and the second heat dissipation layer 212 (e.g., the edge of the first heat dissipation layer 211) to bond the first heat dissipation layer 211 and the second heat dissipation layer 212 together.

[0044] In other embodiments, screws can be used to fix the first heat dissipation layer 211 and the second heat dissipation layer 212.

[0045] It should be noted that, Figure 2 The first receiving groove 220 shown is disposed on the first heat dissipation layer 211, wherein the first heat dissipation layer 211 is below the second heat dissipation layer 212. However, this application does not limit the positional relationship between the first heat dissipation layer 211 and the second heat dissipation layer 212. For example, the first heat dissipation layer 211 may also be above the second heat dissipation layer 212.

[0046] This application does not limit the specific shape of the first receiving groove 220. For example, the space in the first receiving groove 220 can be a cuboid, a cylinder, a sphere or other arbitrary shape.

[0047] in addition, Figure 2 The first receiving groove 220 has a slightly larger cross-sectional area than the expansion portion 240, but this is merely for ease of description. In reality, the space in the first receiving groove 220 can be largely occupied by the expansion portion 240. In some embodiments, the space in the first receiving groove 220 is only slightly larger than the volume of the expansion portion 240, that is, the first receiving groove 220 can just accommodate the expansion portion 240. In other words, the expansion portion 240 completely fills the first receiving groove 220.

[0048] In some embodiments, the space of the first receiving groove 220 can be provided as needed. For example, the space of the first receiving groove 220 can be slightly larger than the volume of the expansion portion 240 at room temperature. Or, for example, the space of the first receiving groove 220 can be slightly larger than the volume of the expansion portion 240 at 10 degrees Celsius.

[0049] For example, the cross-sectional area of ​​the first receiving groove 220 in the layer direction of the heat dissipation wall 210 can account for 10% of the layer area of ​​the heat dissipation wall 210.

[0050] In some embodiments, the chip 230 can be in close contact with the heat sink 210, so that the temperature in the chip 230 can be transferred away through the heat sink 210 as quickly as possible. In other embodiments, the chip 230 can also be at a certain distance from the heat sink 210.

[0051] The second force is greater than the first force. That is, when the temperature is less than or equal to the threshold, the force exerted by the expansion portion on the first heat dissipation layer 211 and the second heat dissipation layer 212 increases. It should be noted that the first force can be 0.

[0052] It is understandable that, compared to the case where no force is applied or a small force is applied, when a larger force is applied to the first heat dissipation layer and the second heat dissipation layer, this larger force cancels out the original contact pressure between the first heat dissipation layer and the second heat dissipation layer, thereby reducing the pressure between the first heat dissipation layer and the second heat dissipation layer.

[0053] Decreasing contact pressure leads to increased contact thermal resistance. For example, although the first and second heat dissipation layers are in close contact macroscopically, this contact is incomplete microscopically. Tiny gaps exist between the first and second heat dissipation layers, reducing their contact area. When the contact pressure increases, these tiny gaps further decrease, increasing the contact area and thus improving heat conduction efficiency. In other words, increasing contact pressure can reduce contact thermal resistance.

[0054] This application embodiment, by providing an expansion portion between two heat dissipation layers, can adjust the heat dissipation capacity of the heat dissipation wall. At higher or normal temperatures, the heat dissipation wall composed of these two heat dissipation layers can dissipate heat normally. When the temperature is lower, the expansion portion applies a greater force to the first and / or second heat dissipation layers, offsetting the original contact pressure between the first and second heat dissipation layers. In other words, the contact pressure between the first and second heat dissipation layers decreases, thereby increasing the thermal resistance between them, thus reducing the heat dissipation performance of the heat dissipation wall, reducing heat dissipation, and achieving reduced heat dissipation at lower temperatures. Furthermore, the electronic device provided by this application embodiment has a simple structure and is easy to manufacture.

[0055] Optionally, the expansion section 240 includes a negative thermal expansion (NTE) material, wherein the coefficient of thermal expansion of the NTE material is negative when the temperature of the expansion section is equal to the threshold.

[0056] NTE materials exhibit the property of "thermal contraction and thermal expansion" within a certain temperature range, and the coefficient of linear expansion and the coefficient of volume expansion of NTE materials can be negative.

[0057] In some embodiments, the material of the expansion portion 240 may be a manganese nitride compound (e.g., Mn3Zn). 0.5 Ni 0.5(N, etc.). This application does not limit the specific material of the expansion part 240. As long as it has the function of negative thermal expansion and can cause the first heat dissipation layer or the second heat dissipation layer to deform during expansion, it falls within the scope of the expansion part 240 of this application.

[0058] The expansion part in this application embodiment can be processed using a negative thermal expansion material. The expansion part has a simple structure and is easy to manufacture.

[0059] Optionally, the expansion portion 240 includes a temperature sensor and a driver; when the temperature sensor detects that the temperature is less than or equal to the threshold, the driver drives the expansion portion to apply the second force to the first heat dissipation layer and / or the second heat dissipation layer.

[0060] Figure 3 A schematic diagram of an expansion section 240 is shown. See also Figure 3 The temperature sensor 241 and the driver 242 can communicate with each other. The expansion part 240 also includes a first surface 243 and a second surface 244. The driver 242 can drive the first surface 243 and / or the second surface 244 to apply a greater force to the first heat dissipation layer and / or the second heat dissipation layer.

[0061] It is understood that the first surface 243 can contact one side of the first heat dissipation layer 211, thereby applying a force to the first heat dissipation layer 211; the second surface 244 can contact one side of the second heat dissipation layer 212, thereby applying a force to the second heat dissipation layer 212.

[0062] In this embodiment, the expansion portion may include a temperature sensor and a driver. The expansion portion can apply a greater force to the first and / or second heat dissipation layers when the temperature is less than or equal to a threshold, thus counteracting the original contact pressure between the first and second heat dissipation layers. In other words, the contact pressure between the first and second heat dissipation layers decreases, thereby increasing the thermal resistance between them. This reduces the heat dissipation performance of the heat dissipation wall, thereby reducing heat dissipation.

[0063] This application does not limit the shape of the expansion portion 240. The expansion portion 240 can be any shape, such as a cuboid, cylinder, sphere or other arbitrary shape.

[0064] For ease of description, the first receiving groove 220 is not shown in the heat dissipation wall 210 described below. It can be understood that the first receiving groove 220 is located at the position shown for the expansion portion 240.

[0065] Figure 4 This application illustrates a heat dissipation wall 210 provided in an embodiment of the present application, the heat dissipation wall 210 having a first receiving groove ( Figure 4 (Not shown) can be disposed in the first heat dissipation layer 211. For ease of description, Figure 4 The heat dissipation wall 210 is shown separately, but those skilled in the art will understand that in some applications, the heat dissipation wall 210 can be integrally formed with other components.

[0066] The gap 250 is the void between the first heat dissipation layer 211 and the second heat dissipation layer 212. It should be noted that this gap 250 is not intentionally designed, but rather unavoidably formed during the actual manufacturing process of the first and second heat dissipation layers 211 and 212. Even with the most precise metal mirror finishing, micron-level gaps will remain.

[0067] In some embodiments, thermally conductive silicone grease is applied between the first heat dissipation layer and the second heat dissipation layer.

[0068] For example, thermal grease can be placed in the gap 250, and the thermal grease can enhance the thermal conductivity of the heat sink 210.

[0069] In this embodiment, thermally conductive grease is applied between the first and second heat dissipation layers. The grease has good thermal conductivity, thus enhancing the thermal conductivity of the heat dissipation wall. However, the thermal conductivity of the grease decreases with decreasing pressure. Therefore, at lower temperatures, the expansion portion expands, leading to a decrease in pressure between the two heat dissipation layers. This increases the thermal resistance of the grease, thereby increasing the contact thermal resistance between the two heat dissipation layers. Consequently, the heat dissipation performance of the heat dissipation wall composed of these two layers decreases, reducing heat dissipation.

[0070] In some embodiments, the expansion portion 240 is used to expand when the temperature is less than or equal to the threshold. After the expansion portion 240 expands, the thermal resistance between the first heat dissipation layer 211 and the second heat dissipation layer 212 is greater than the thermal resistance between the first heat dissipation layer 211 and the second heat dissipation layer 212 before the expansion portion 240 expands.

[0071] For example, the threshold can be between -20 degrees Celsius and 70 degrees Celsius.

[0072] The expansion portion 240 expands when the temperature is relatively low. For example, it expands when the temperature is less than or equal to a threshold. After the expansion portion 240 expands, the thermal resistance between the first heat dissipation layer 211 and the second heat dissipation layer 212 increases, thereby increasing the thermal resistance of the heat dissipation wall 210.

[0073] For example, before expansion, the thermal resistance of the expansion section could be 0.01℃·in. 2 / W, after expansion, the thermal resistance of the expansion section can be 0.025℃·in 2 / W.

[0074] In this embodiment, when the temperature is low, the expansion portion expands, exerting a greater force on the first heat dissipation layer and / or the second heat dissipation layer. This reduces the contact pressure between the first and second heat dissipation layers, thereby increasing the thermal resistance between them. Consequently, the heat dissipation performance of the heat dissipation wall decreases, reducing heat dissipation.

[0075] Optionally, the expansion portion 240 is used to expand when the temperature is less than or equal to a threshold; after the expansion portion 240 expands, the pressure between the first heat dissipation layer 211 and the second heat dissipation layer 212 is less than the pressure between the first heat dissipation layer 211 and the second heat dissipation layer 212 before the expansion portion 240 expands.

[0076] In some embodiments, the thermal conductivity of the thermal grease is pressure-dependent. Therefore, at low temperatures, the expansion portion 240 expands, reducing the pressure between the first heat dissipation layer 211 and the second heat dissipation layer 212, thereby decreasing the thermal conductivity of the thermal grease, increasing the thermal resistance between the first heat dissipation layer 211 and the second heat dissipation layer 212, weakening the heat dissipation capacity of the heat dissipation wall 210, and slowing down heat loss.

[0077] For example, before expansion, the pressure between the first heat dissipation layer 211 and the second heat dissipation layer 212 is 20 psi (pounds per square inch), at which point the thermal resistance is low, for example, 0.01 °C·in. 2 / W; After expansion, the expansion portion 240 offsets part of the pressure between the first heat dissipation layer 211 and the second heat dissipation layer 212, for example, the pressure can be reduced to below 5 psi. At this time, the thermal resistance increases, for example, to 0.025°C·in. 2 / W.

[0078] In some embodiments, when the ambient temperature is relatively low, the expansion portion 240 is in an expanded state. At this time, the pressure between the first heat dissipation layer 211 and the second heat dissipation layer 212 is small, the thermal resistance of the heat dissipation wall 210 is large, and the heat dissipation performance of the heat dissipation wall 210 is low. When the ambient temperature rises, the expansion portion 240 begins to contract, the pressure between the first heat dissipation layer 211 and the second heat dissipation layer 212 increases, the thermal resistance decreases, and the heat dissipation performance of the heat dissipation wall 210 increases.

[0079] The embodiments of this application can reduce the pressure between the first heat dissipation layer and the second heat dissipation layer by expanding the expansion part when the temperature decreases, thereby increasing the thermal resistance and reducing the heat dissipation performance of the heat dissipation wall composed of the two heat dissipation layers, so as to reduce the dissipation of heat energy.

[0080] Optionally, the expansion portion 240 is used to expand when the temperature is less than or equal to a threshold; after the expansion portion 240 expands, the gap 250 between the first heat dissipation layer 211 and the second heat dissipation layer 212 is greater than the gap 250 between the first heat dissipation layer 211 and the second heat dissipation layer 212 before the expansion portion 240 expands.

[0081] When the gap 250 increases, the pressure between the first heat dissipation layer 211 and the second heat dissipation layer 212 also decreases, thereby increasing the thermal resistance between the first heat dissipation layer 211 and the second heat dissipation layer 212, which in turn increases the thermal resistance of the heat dissipation wall 210.

[0082] In this embodiment, the gap between the first and second heat dissipation layers can be increased by expanding the expansion portion when the temperature decreases, thereby increasing the thermal resistance and reducing the heat dissipation performance of the heat dissipation wall composed of these two heat dissipation layers, so as to reduce the dissipation of heat energy.

[0083] Figure 5 This application illustrates another heat dissipation wall 210 provided in an embodiment of the present application, with a first receiving groove in the heat dissipation wall 210 ( Figure 5 (Not shown) can be disposed on the second heat dissipation layer 212.

[0084] It is understood that the chip 230 is in contact with the first heat dissipation layer 211, and the second heat dissipation layer 212 is located on the side of the first heat dissipation layer 211 away from the chip 230. The side of the second heat dissipation layer 212 away from the first heat dissipation layer 211 is provided with heat dissipation fins 260.

[0085] Figure 5 Only one possible implementation is shown; this application does not limit the number, shape, or arrangement of the fins 260. It is understood that the heat dissipation fins 260 can improve the heat dissipation performance of the second heat dissipation layer 212, thereby improving the heat dissipation performance of the heat dissipation wall 210. For ease of description, Figure 5 The heat dissipation wall 210 is shown separately, but those skilled in the art will understand that in some applications, the heat dissipation wall 210 can be integrally formed with other components.

[0086] The heat dissipation wall provided in this application embodiment can be provided with heat dissipation fins, which increase the heat dissipation area of ​​the heat dissipation wall and thus enhance the heat dissipation performance of the heat dissipation wall.

[0087] Optionally, the heat dissipation fins 260 are arranged at equal intervals along a second direction, which is parallel to the heat dissipation wall 210.

[0088] See Figure 5 The second direction can be parallel to the heat dissipation wall 210. When the heat dissipation wall 210 is an arc-shaped wall, the second direction can be parallel to a chord of the arc-shaped wall.

[0089] The heat dissipation fins 260 are arranged at equal intervals, which helps to further enhance the heat dissipation performance of the second heat dissipation layer 212.

[0090] The heat dissipation wall provided in this application embodiment can be provided with heat dissipation fins arranged at equal intervals, which enhances the heat dissipation performance of the heat dissipation wall and facilitates processing and production.

[0091] Optionally, the electronic device 200 further includes a fixing part for fixing the first heat dissipation layer and the second heat dissipation layer, such that when the temperature is less than or equal to the threshold, the contact pressure between the first heat dissipation layer and the second heat dissipation layer is greater than 0.

[0092] For example, the fixing part can be a screw, etc. Figure 6 As shown, the fixing part 270 is used to fix the first heat dissipation layer 211 and the second heat dissipation layer 212.

[0093] It is understandable that when installing the fixing part, the initial contact pressure between the first heat dissipation layer and the second heat dissipation layer can be made large enough so that when the temperature is less than or equal to the threshold, the contact pressure between the first heat dissipation layer and the second heat dissipation layer does not drop to 0, that is, it is greater than 0.

[0094] In this embodiment, the first and second heat dissipation layers are fixed by a fixing part. When the expansion part is not expanded, the pressure between the first and second heat dissipation layers is relatively high, improving heat dissipation performance. When the expansion part expands, the pressure between the first and second heat dissipation layers decreases, reducing heat dissipation performance and thus reducing heat dissipation. On the other hand, the fixing part applies a certain force during installation, ensuring that a certain contact pressure is maintained between the first and second heat dissipation layers even when the expansion part expands. In other words, the first and second heat dissipation layers remain in contact, thus achieving a fixing effect.

[0095] Figure 6 Another method for setting up the receiving slot is also shown.

[0096] Optionally, the electronic device further includes: a second receiving groove 221 disposed on the second heat dissipation layer 212 and opening toward the first heat dissipation layer 211, and the expansion portion 240 located in the first receiving groove 220 and the second receiving groove 221.

[0097] See Figure 6 The first receiving groove 220 and the second receiving groove 221 can be arranged opposite to each other, and the first receiving groove 220 and the second receiving groove 221 together receive the expansion part 240.

[0098] In other embodiments, the second receiving groove 221 may be disposed with... Figure 6In other locations, the second receiving groove 221 can be used to individually receive the expansion portion 240. That is, a receiving groove 220 can be provided on the first heat dissipation layer 211 to receive the expansion portion 240, and a second receiving groove 221 can be provided on the second heat dissipation layer 212 to receive another expansion portion 240.

[0099] In some other embodiments, the first heat dissipation layer 211 may be provided with more first receiving slots 220 for accommodating multiple expansion portions 240. The second heat dissipation layer 212 may also be provided with more second receiving slots 221 for accommodating other expansion portions 240.

[0100] Figure 7 This illustration shows a schematic diagram of an electronic device 200 provided in an embodiment of this application. The electronic device 200 may include the aforementioned electronic device 200 or any embodiment of the electronic device 200. For example, the electronic device 200 may be applied to the Atlas 500 smart station.

[0101] The electronic device provided in this application includes an expansion portion. When the temperature is high, the heat dissipation wall can dissipate heat normally. When the temperature is low, the expansion portion expands, which reduces the pressure between the two heat dissipation layers of the heat dissipation wall. This increases the thermal resistance between the two heat dissipation layers, which reduces the heat dissipation performance of the heat dissipation wall composed of the two heat dissipation layers and reduces the dissipation of heat energy.

[0102] The electronic device 200 includes a chip 230 disposed inside the electronic device 200 and adjacent to the heat sink 210.

[0103] The electronic device provided in this application embodiment may include a chip, and the heat dissipation capacity of the heat sink is adjusted by the expansion portion so that the chip is within the temperature range in which it can operate normally.

[0104] Optionally, the electronic device 200 further includes a heating element 280 disposed inside the electronic device 200, which is used to heat the chip 230.

[0105] Electronic devices typically operate at temperatures ranging from -40°C to 70°C, without relying on fans for natural cooling. The minimum operating temperature of key components (e.g., chip 230) is -25°C, necessitating the design of heating circuits (e.g., heating element 280) to provide heat at low temperatures. Conversely, to maintain good heat dissipation at high temperatures, the casing of electronic devices is often made of aluminum, designed as an aluminum heat sink, closely fitted to the chips and other major heat-generating components.

[0106] When the temperature is very low, electronic devices must first enter a heating mode upon startup. For example, the microcontroller unit (MCU) controls the heating resistor in the heating element 280 to heat the internal temperature of the electronic device to above zero degrees Celsius with a power of approximately 35W before officially starting up. This heating process can take up to 90 minutes.

[0107] The electronic device provided in this application, due to its stacked heat sink design, is expected to heat up in less than 45 minutes.

[0108] Optionally, thermal grease can be applied between the heat sink 210 and the chip 230 to ensure full contact between them.

[0109] The electronic device provided in this application embodiment may include a heating element, and the heat dissipation capacity of the heat dissipation wall is adjusted by an expansion element. When the temperature is low, the heat dissipation capacity of the heat dissipation wall is reduced, thus saving energy. On the other hand, when the edge heat dissipation box starts at a low temperature, the preheating time is shortened, improving the working efficiency of the electronic device.

[0110] Optionally, the electronic device 200 may also include a printed circuit board 290.

[0111] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: chip; A heat dissipation wall, comprising a first heat dissipation layer and a second heat dissipation layer stacked along a first direction, the first direction being perpendicular to the heat dissipation wall, the heat dissipation wall being used to dissipate heat from the chip; A first receiving groove is disposed in the first heat dissipation layer and opens toward the second heat dissipation layer; An expansion portion is located in the first receiving groove. The expansion portion is used to apply a first force to the first heat dissipation layer and / or the second heat dissipation layer when the temperature is higher than a threshold; and to apply a second force to the first heat dissipation layer and the second heat dissipation layer when the temperature is less than or equal to the threshold, the second force being greater than the first force, so as to reduce the contact pressure between the first heat dissipation layer and the second heat dissipation layer.

2. The electronic device according to claim 1, characterized in that, The expansion section includes a negative thermal expansion material, and when the temperature of the expansion section is equal to the threshold, the expansion coefficient of the negative thermal expansion material is negative.

3. The electronic device according to claim 1, characterized in that, The expansion portion includes a temperature sensor and a driver; when the temperature sensor detects that the temperature is less than the threshold, the driver drives the expansion portion to apply the second force to the first heat dissipation layer and / or the second heat dissipation layer.

4. The electronic device according to any one of claims 1 to 3, characterized in that, Thermal grease is applied between the first heat dissipation layer and the second heat dissipation layer.

5. The electronic device according to any one of claims 1 to 3, characterized in that, The chip is in contact with the first heat dissipation layer, and the second heat dissipation layer is located on the side of the first heat dissipation layer away from the chip. Heat dissipation fins are provided on the side of the second heat dissipation layer away from the first heat dissipation layer.

6. The electronic device according to claim 5, characterized in that, The heat dissipation fins are arranged at equal intervals along a second direction, which is parallel to the heat dissipation wall.

7. The electronic device according to any one of claims 1 to 3, characterized in that, Also includes: A fixing part is provided to fix the first heat dissipation layer and the second heat dissipation layer, such that when the temperature is less than or equal to the threshold, the contact pressure between the first heat dissipation layer and the second heat dissipation layer is greater than 0.

8. The electronic device according to any one of claims 1 to 3, characterized in that, Also includes: The second receiving groove is disposed in the second heat dissipation layer and opens toward the first heat dissipation layer. The expansion portion is located in the first receiving groove and the second receiving groove.

9. The electronic device according to any one of claims 1 to 3, characterized in that, Also includes: A heating element is disposed within the electronic device and is used to heat the chip.

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