Device and method for machining special-shaped holes using electrolyte-guided laser

Abstract

The present invention belongs to the field of precision machining, and specifically relates to a device and method for machining irregular-shaped holes using an electrolyte-guided laser. The device comprises: a coupling assembly, an electrode plate assembly, a power supply module, and a control module. The coupling assembly is used to form an electrolyte-guided laser beam, and a liquid outlet is provided at the bottom for vertically spraying the electrolyte-guided laser beam downward. The electrode plate assembly is disposed directly below the liquid outlet and comprises several pairs of electrode plates vertically arranged with the vertical axis of the liquid outlet as the central axis of symmetry, with the two electrode plates in each pair of electrode plates disposed facing each other. The control module is used to control the power supply module to supply power to the coupling assembly so that the electrolyte beam is charged, and to control the power supply module to supply power to the electrode plate assembly so that the electrolyte-guided laser beam passing through the vertical center axis of the electrode plate assembly is deflected under the action of a uniform electric field, and the angle and direction of the deflection meet the requirements for machining a predetermined irregular-shaped hole. The present invention can achieve the machining of irregular-shaped holes at low cost, high quality, and high efficiency.

Description

Technical Field

[0001] The present invention belongs to the field of precision machining, and more specifically, relates to a device and method for machining special-shaped holes using an electrolyte-guided laser. Background Art

[0002] Nanosecond pulse laser drilling is widely used in the drilling process due to its advantages, including strong material versatility, high efficiency, low cost, minimal tooling, and significant comprehensive technical and economic benefits. However, during the nanosecond pulse laser drilling process, the vaporization of the material and the splashing of the molten pool often generate smoke and dust pollution. This not only shields the incident laser and causes a low aspect ratio, but can also cause the smoke and dust to adhere to the hole wall after cooling, forming a recast layer and reducing the hole wall quality. In addition, due to the strong thermal effect of nanosecond pulse lasers, large-area drilling results in significant thermal stress and deformation, which restricts its widespread application.

[0003] To address the above issues, patent publication number CN 113751900 A proposes a water-guided laser drilling system and method. This method couples a nanosecond pulsed laser beam into a fine water jet, utilizing its total reflection in the water jet to guide the laser beam to the workpiece, thereby achieving laser drilling. This method has the advantages of a small heat-affected zone, few microcracks, and no pollution. Compared to nanosecond pulsed laser drilling, this method utilizes the flushing effect of the water jet to effectively cool smoke and the workpiece, flush away smoke, reduce thermal stress and recast layers on the workpiece surface, improve hole wall quality, and reduce thermal deformation during large-area machining. Furthermore, water jet-guided laser beam transmission effectively extends the laser focal depth, enabling the machining of holes with large aspect ratios. However, due to the absorption and scattering effects of the water jet on the laser, the laser energy acting on the workpiece is significantly reduced, resulting in low machining efficiency.

[0004] Patent CN 114713970 A proposes a laser-electrolysis composite machining method, which organically combines water-conducting laser machining technology and electrolytic machining technology. While the water-conducting laser ablates the workpiece surface, the electrolytic machining causes the workpiece surface to undergo anodic dissolution in the electrolyte under the action of the electric field, creating a synergistic effect and improving machining efficiency while ensuring machining quality.

[0005] In modern manufacturing, there are a large number of problems in processing special-shaped holes with large aspect ratios, such as the fuel injection holes (oblique holes) of internal combustion engines, the film cooling holes (cat-ear-shaped holes) on the combustion chambers and guide vanes of aircraft engines, etc. The existing water-guided laser needs to be combined with a five-axis linkage CNC machine tool to realize the processing of special-shaped holes. However, the five-axis machine tool is complex and expensive, which increases the processing cost. Patent CN103394809 A uses an optical path system composed of a spectrometer, a reflector, and a focusing lens to deflect the laser beam to process oblique holes, thereby realizing efficient and precise batch processing of fuel injection holes on fuel injection plate parts. However, due to the principle of water-guided laser, the laser beam is constrained to propagate with the water jet in the water jet, and the water jet is difficult to tilt. Therefore, it is impossible to achieve special-shaped hole processing by tilting the optical path. Patent CN110877161A proposes to use a beam shaping method to shape the femtosecond laser with a Gaussian distribution into a flat-top beam with uniform energy distribution after focusing. Since the energy distribution of the flat-top beam is relatively uniform and the pulse width of the femtosecond laser is small, problems such as heat effects, slag, and spattering during the processing process can be effectively avoided. By setting the path and parameters of the laser scanning, high-quality complex special-shaped hole processing can be achieved. However, the processing efficiency of femtosecond laser processing is low, and it is difficult to achieve efficient special-shaped hole processing. In addition, patent CN208662839 U proposes a deflected water beam guided laser method based on a non-uniform electric field, which uses a non-uniform electric field to deflect the uncharged water beam, thereby achieving control of the water beam trajectory deflection angle and improving the accuracy of water-light coupling alignment. However, the non-uniform electric field used in this patent can only achieve deflection of the water beam in a single dimension, which is still difficult for the processing of special-shaped holes.

[0006] Therefore, there is an urgent need for a high-quality and efficient method for processing special-shaped holes with large aspect ratios, which can not only ensure the hole wall quality and aspect ratio during the processing, but also achieve high processing efficiency, so as to solve the limitations of nanosecond pulse and water-guided laser processing special-shaped hole technologies in practical engineering applications. Summary of the Invention

[0007] In response to the defects of the existing technology and the need for improvement, the present invention provides a device and method for processing special-shaped holes using an electrolyte-guided laser, the purpose of which is to achieve the processing of special-shaped holes at low cost, high quality and high efficiency.

[0008] To achieve the above object, according to one aspect of the present invention, there is provided an apparatus for machining irregular-shaped holes using an electrolyte-guided laser, comprising: an electrolyte and laser coupling assembly, an electrode plate assembly, a power supply module, and a control module;

[0009] The coupling component is used to couple the laser beam with the electrolyte beam to form an electrolyte-guided laser beam. A liquid outlet is provided at the bottom of the coupling component for spraying the electrolyte-guided laser beam vertically downward; the electrode plate assembly is arranged directly below the liquid outlet, and includes several pairs of electrode plates vertically placed with the vertical axis where the liquid outlet is located as the central symmetry axis, and the two electrode plates in each pair of electrode plates are arranged facing each other; the control module is used to control the power supply module to supply power to the coupling component so that the electrolyte beam is charged and to control the power supply module to supply power to one or more groups of electrodes in the electrode plate assembly, generating a uniform electric field in the middle area of ​​the electrode plate assembly, so that the electrolyte-guided laser beam passing through the vertical center axis of the electrode plate assembly is deflected relative to the vertical axis under the action of the uniform electric field, and the angle and direction of the deflection meet the requirements of the required processing of the preset special-shaped hole.

[0010] Furthermore, it also includes a laser source and a liquid supply component; the liquid supply component is used to input electrolyte into the liquid inlet of the coupling component; the laser source is used to introduce a laser beam into the coupling component.

[0011] Furthermore, it also includes: a processing tank for placing the processed workpiece, and a return liquid pipeline with its two ends respectively connected to the processing tank and the liquid supply component, for recovering the electrolyte; wherein a filter is provided in the return liquid pipeline for filtering the processed electrolyte.

[0012] Furthermore, the electrode plate assembly includes two pairs of electrode plates.

[0013] Furthermore, the control module is specifically used to generate a landing point trajectory of the electrolyte-guided laser beam during processing based on the required special-shaped hole structural parameters; based on the landing point trajectory, the voltage value of one or more pairs of electrodes in the electrode plate assembly is controlled in real time to realize single-layer scanning processing of the workpiece by the electrolyte-guided laser beam, and the scanning process is repeated so that the electrolyte-guided laser beam scans the workpiece layer by layer to realize subtractive processing of special-shaped holes of the required shape.

[0014] The present invention also provides a method for processing special-shaped holes, which uses the above-mentioned device for processing special-shaped holes with an electrolyte-guided laser to process the special-shaped holes.

[0015] Furthermore, the specific method of the processing is:

[0016] The workpiece is placed directly below the electrode plate assembly in the device, and the coupling assembly is caused to eject an electrolyte beam that moves vertically downward;

[0017] controlling, by a control module in the device, the power supply module to supply power to the coupling assembly so that the electrolyte beam is charged;

[0018] Introducing a laser beam into the coupling component, and coupling the laser beam with the electrolyte beam through the coupling component to form an electrolyte-guided laser beam;

[0019] Through the control module in the device, the power supply module is controlled to supply power to one or more pairs of electrodes in the electrode plate assembly, generating a uniform electric field in the middle area of ​​the electrode plate assembly. Under the action of the uniform electric field, the electrolyte-guided laser beam passing through the vertical center axis of the electrode plate assembly is deflected relative to the vertical center axis, and the angle and direction of the deflection meet the requirements for processing the preset special-shaped holes, so that the electrolyte-guided laser beam lands at the opening position of the workpiece, realizing the composite processing of laser burning and electrolytic processing, and completing the special-shaped hole processing.

[0020] In general, the above technical solutions conceived by the present invention can achieve the following beneficial effects:

[0021] (1) The present invention utilizes an electrode plate to deflect the laser-coupled electrolyte-guided laser beam, that is, the electrode plate deflects the charged electrolyte-guided laser jet, with the purpose of processing irregular-shaped holes. Among them, the electrode plate assembly is arranged directly below the liquid outlet, including several pairs of electrode plates vertically placed with the vertical axis of the liquid outlet as the central symmetry axis, and the two electrode plates in each pair of electrode plates are arranged facing each other. Thus, the electrode plates in the X and Y directions are linked to realize uniform electric fields in different directions at the laser beam passing through the central area of ​​the electrode plate, realizing flexible and high-speed deflection of the electrolyte jet, thereby realizing irregular-shaped hole processing at any angle in the plane. By utilizing the electric field to deflect the electrolyte-guided laser beam, the deflection response speed is fast and the controllability is strong. There is no need to use a five-axis machine tool (the response time of the machine tool is long and the cost is high), thereby improving the speed of the mechanism. This method not only has the advantages of electrolyte-guided laser drilling: high efficiency, small recast layer, and small thermal deformation, but also has the ability to drill irregular holes. In addition, applying this electrolyte-guided laser processing technology to the field of special-shaped hole processing can effectively reduce the smoke pollution caused by the laser processing process and improve the processing efficiency and the depth-to-diameter ratio of the hole, effectively ensuring the processing quality and efficiency of special-shaped holes.

[0022] (2) The preferred electrode plate assembly of the present invention comprises two pairs of electrode plates. When the two pairs of electrode plates are energized, the electric field intensity components generated by the electrolyte-guided laser beam can be precisely controlled by the voltage values ​​of the two pairs of electrode plates. Therefore, precise deflection control of the electrolyte-guided laser beam can be achieved by controlling the voltage value of the assembly. The electrode plate assembly can achieve three-dimensional flexible control of the laser beam through the synergistic action of the two pairs of electrode plates, thereby meeting the requirements of complex and irregular hole processing.

[0023] (3) The present invention also proposes a control module specifically for generating a landing point trajectory of the electrolyte-guided laser beam during processing according to the required special-shaped hole structural parameters, and performing layer-by-layer scanning and material reduction based on the landing point trajectory, thereby achieving precise processing of the special-shaped hole. The control module may include a path planning unit and a voltage control unit. The path planning unit calculates the optimal processing path of the electrolyte-guided laser beam based on the input special-shaped hole structural parameters and generates a specific landing point trajectory. The voltage control unit adjusts the voltage of the electrode plate in real time according to the landing point trajectory information provided by the path planning unit to ensure that the laser beam scans according to the predetermined trajectory.

[0024] (4) The layer-by-layer scanning method of material removal is similar to the layer-by-layer manufacturing principle in 3D printing, but in this invention, the material is removed layer by layer using a laser. The scanning trajectory of each layer is precisely calculated and controlled to ensure that the removal of each layer of material meets the design requirements of the special-shaped hole. The layer-by-layer scanning process can effectively control the processing depth and shape, so that the final special-shaped hole has high precision and good surface quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 An overall schematic diagram of a device for machining irregular-shaped holes using an electrolyte-guided laser provided by an embodiment of the present invention;

[0026] Figure 2 A schematic diagram of the specific structure of a device for machining irregular-shaped holes using an electrolyte-guided laser according to an embodiment of the present invention;

[0027] Figure 3 for Figure 1 Schematic diagram of the specific structure of the coupling component;

[0028] Figure 4 Schematic diagram of the laser beam propagation in the electrolyte beam deflected by the electric field;

[0029] Figure 5 A schematic diagram of a processing process provided by an embodiment of the present invention.

[0030] Throughout the drawings, the same reference numerals are used to denote the same elements or structures, wherein:

[0031] 1. Coupling assembly, 11. Upper end cover, 12. Water chamber component, 13. Lower end cover, 14. Nozzle holder, 15. Nozzle, 16. Optical window, 17. Water inlet, 2. Electrode plate, 31. First power supply, 32. Second power supply, 4. Control module, 5. Laser beam, 6. Liquid supply assembly, 61. Electrolyte tank, 62. First filter, 63. Plunger pump, 64. Accumulator, 65. Pressure regulating valve, 66. Second filter, 7. Electrolyte-guided laser beam, 71. Trajectory of the electrolyte-guided laser beam after application of an electric field, 72. Trajectory of the electrolyte-guided laser beam without application of an electric field, 8. Workpiece, 9. Workbench. DETAILED DESCRIPTION

[0032] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely for the purpose of explaining the present invention and are not intended to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

[0033] Example 1

[0034] A device for processing special-shaped holes by using electrolyte-guided laser, such as Figure 1 As shown, it includes: an electrolyte and laser coupling component 1, an electrode plate component 2, a power module 3 and a control module 4;

[0035] The coupling component is used to couple the laser beam 5 with the electrolyte beam to form an electrolyte-guided laser beam. A liquid outlet (i.e., nozzle 15) is provided at the bottom of the coupling component for spraying the electrolyte-guided laser beam 7 vertically downward; the electrode plate assembly is provided directly below the liquid outlet, and includes several pairs of electrode plates vertically placed with the vertical axis where the liquid outlet is located as the central symmetry axis, and the two electrode plates in each pair of electrode plates are arranged facing each other; the control module is used to control the power supply module to supply power to the coupling component so that the electrolyte beam is charged, and to control the power supply module to supply power to one or more groups of electrodes in the electrode plate assembly, generating a uniform electric field in the middle area of ​​the electrode plate assembly, so that the electrolyte-guided laser beam passing through the vertical center axis of the electrode plate assembly is deflected relative to the vertical axis under the action of the uniform electric field, and the angle and direction of the deflection meet the requirements of the required processing of the preset special-shaped hole.

[0036] In view of the fact that the existing technology cannot achieve flexible and high-speed deflection of water beams in space, which restricts the development of electric field deflection water beam technology, this embodiment uses electrode plates to deflect the electrolyte-guided laser beam that has been coupled to the laser, that is, the electrode plates deflect the charged electrolyte-guided laser jet, with the purpose of processing special-shaped holes, wherein the electrode plate assembly is arranged directly below the liquid outlet, including several pairs of electrode plates vertically placed with the vertical axis where the liquid outlet is located as the central symmetry axis, and the two electrode plates in each pair of electrode plates are arranged facing each other, thereby, the X and Y direction electrode plates are linked to realize uniform electric fields in different directions at the laser beam passing through the central area of ​​the electrode plates, realizing flexible and high-speed deflection of the electrolyte jet, thereby realizing special-shaped hole processing at any angle in the plane. By using electric field to deflect the electrolyte-guided laser beam, the deflection response speed is fast and the controllability is strong, and there is no need to use a five-axis machine tool (the response time of the machine tool is long and the cost is high), thereby improving the speed of the mechanism. This method not only shares the advantages of electrolyte-guided laser drilling: high efficiency, minimal recast layer, and minimal thermal deformation, but also boasts the ability to drill irregularly shaped holes. Furthermore, applying this electrolyte-guided laser processing technology to irregularly shaped holes effectively reduces smoke pollution caused by laser processing, improves processing efficiency and hole depth-to-diameter ratio, and effectively ensures the quality and efficiency of irregularly shaped hole processing.

[0037] As a preferred embodiment, it further includes a laser source and a liquid supply component 6; the liquid supply component is used to input electrolyte into the liquid inlet of the coupling component; and the laser source is used to introduce a laser beam into the coupling component.

[0038] As a preferred embodiment, it also includes: a processing tank for placing the processed workpiece, and a return liquid pipeline with both ends connected to the processing tank and the liquid supply component respectively, for recovering the electrolyte; wherein a filter is provided in the return liquid pipeline for filtering the processed electrolyte.

[0039] In the above scheme, if Figure 3 As shown, the coupling assembly includes a coaxially arranged upper end cap 11, a water chamber member 12, a lower end cap 13, a nozzle holder 14, and a water inlet 17 on the side of the water chamber member, an optical window 16 located in the middle of the upper end cap's inner cavity, and a nozzle 15 fixed to the middle of the upper end of the nozzle holder. The upper end cap, water chamber member, lower end cap, nozzle holder, nozzle, and optical window are coaxially arranged in the direction of the laser axis. High-pressure electrolyte is supplied to the water inlet by the liquid supply assembly, forming a 1mm thick electrolyte layer between the optical window and the upper end surface of the lower end cap. Under the action of pressure, the electrolyte is emitted from the liquid outlet, forming a stable electrolyte beam. The optical window is made of transparent quartz glass coated with an anti-reflection coating, with a laser beam transmittance greater than 99.9%. It is fixed to the middle of the upper end cap's inner cavity. The liquid outlet is fixed to the mounting hole in the middle of the upper end of the nozzle holder.

[0040] In the above scheme, if Figure 2As shown, the liquid supply assembly 6 includes an electrolyte tank 61, a first filter 62, a plunger pump 63, an accumulator 64, a pressure regulating valve 65, and a second filter 66, forming a main liquid supply circuit. The filter, water suction pump, accumulator, and pressure regulating valve are sequentially arranged on the liquid outlet pipeline, which is connected to the water inlet of the coupling assembly to output a stable high-pressure electrolyte beam. The return liquid pipeline is connected to the electrolyte tank and is provided with a filter to filter out impurities in the electrolyte, prevent nozzle clogging, and realize the recycling of the electrolyte. The control module can be used to control the pressure value of the plunger pump in the liquid supply assembly.

[0041] The power module 3 includes a first power supply 31 and a second power supply 32 . The negative pole of the first power supply is connected to the water chamber component 12 , and the positive pole is connected to the workpiece 8 . When powered on, the electrolyte beam between the two is charged.

[0042] The electrolyte-guided laser beam is formed by focusing the laser beam on the center of the upper end surface of the nozzle 15 and coupling with the electrolyte beam flow.

[0043] The control module is connected to the first power supply 31, the second power supply 32, and the plunger pump 63, respectively, and can control the voltage of the first power supply, the pressure of the water suction pump, and the voltage of the electrode plates. By controlling the voltage of one or more pairs of electrode plates, the angle at which the electrolyte-guided laser beam deflects can be changed.

[0044] The control module adjusts the voltage value of the parallel electrode plates by controlling the second power supply, so that a specific electric field strength is generated between the parallel electrode plates. Figure 4 As shown in the figure, under the action of a uniform electric field, the electrolyte beam is deflected, and the laser beam is still fully reflected and conducted in it. The electrolyte guides the laser beam to be transmitted to the opening position of the workpiece at a preset specific angle to perform a composite special-shaped hole processing effect of laser ablation and electrolytic machining. The electrolyte beam flushes the surface of the workpiece, takes away smoke and slag, and cools the workpiece.

[0045] As a preferred embodiment, the electrode plate assembly includes two pairs of electrode plates.

[0046] Two pairs of parallel electrode plates, perpendicular to each other in the X and Y directions, are placed vertically between the coupling assembly and the workpiece. Powered by a second power supply, the distance between the center of each electrode plate and the electrolyte beam is adjustable. Adjusting the voltage between the two pairs of electrode plates generates a specific electric field strength between the parallel plates. Under the influence of the uniform electric field, the electrolyte beam is deflected, while the laser beam is still fully reflected and conducted within it. The electrolyte guides the laser beam to the workpiece opening, performing a combined process of laser ablation and electrolytic machining. The electrolyte beam scours the workpiece surface, removing smoke and slag while cooling the workpiece.

[0047] As a preferred embodiment, the control module is specifically used to generate a landing point trajectory of the electrolyte-guided laser beam during processing according to the required special-shaped hole structural parameters; based on the landing point trajectory, the voltage value of one or more pairs of electrodes in the electrode plate assembly is controlled in real time to realize single-layer scanning processing of the workpiece by the electrolyte-guided laser beam, and the scanning process is repeated so that the electrolyte-guided laser beam scans the workpiece layer by layer to realize subtractive processing of special-shaped holes of the required shape.

[0048] Based on the shape of the irregular hole, the algorithm in the control module automatically plans the machining trajectory. The control module controls the voltage value of the two pairs of electrode plates in real time, scanning layer by layer to complete the subtractive machining of any irregular hole shape.

[0049] The device in this embodiment is a device for processing irregular-shaped holes using an electrolyte-guided laser. This device not only possesses the advantages of electrolyte-guided laser drilling: high efficiency, minimal recast layer, and minimal thermal deformation, but also has the ability to drill irregular-shaped holes. Uniform electric field deflection enables flexible and high-speed deflection of the electrolyte jet, thereby enabling irregular-shaped hole processing. The use of linked electric field deflection in the X and Y directions enables flexible and high-speed spatial deflection of the water beam, thereby enabling the processing of irregular-shaped holes of any shape. Applying this electrolyte-guided laser processing technology to the field of irregular-shaped hole processing can effectively reduce smoke pollution caused by laser processing and improve processing efficiency, effectively ensuring the quality and efficiency of irregular-shaped hole processing.

[0050] Example 2

[0051] A method for machining special-shaped holes, such as Figure 5 As shown, the device for processing special-shaped holes using an electrolyte-guided laser as described in the first embodiment above is used to process special-shaped holes.

[0052] As a preferred embodiment, the specific method of the above processing is:

[0053] The workpiece is placed directly below the electrode plate assembly in the above device, and the coupling assembly is caused to eject an electrolyte beam that moves vertically downward;

[0054] Controlling the power supply module to supply power to the coupling assembly through the control module in the device, so that the electrolyte beam is charged;

[0055] Introducing a laser beam into the coupling assembly, coupling the laser beam with the electrolyte beam through the coupling assembly to form an electrolyte-guided laser beam;

[0056] Through the control module in the above-mentioned device, the above-mentioned power supply module is controlled to supply power to one or more pairs of electrodes in the above-mentioned electrode plate assembly, generating a uniform electric field in the middle area of ​​the electrode plate assembly. Under the action of the uniform electric field, the electrolyte-guided laser beam passing through the vertical center axis of the electrode plate assembly is deflected relative to the vertical center axis, and the angle and direction of the deflection meet the requirements for processing the preset special-shaped holes, so that the electrolyte-guided laser beam lands at the opening position of the workpiece, realizing the composite processing of laser burning and electrolytic processing, and completing the special-shaped hole processing.

[0057] More specifically, the method can be divided into the following steps:

[0058] S1: Clamp and fix the workpiece 8 on the workbench 9.

[0059] S2: Open the liquid supply component, the control module controls the pressure value of the water suction pump, and adjusts the pressure regulating valve to output high-voltage electrolyte. The high-voltage electrolyte forms a stable thin electrolyte layer through the coupling component, and a stable electrolyte beam is ejected from the nozzle.

[0060] S3: The control module starts the first power supply to charge the electrolyte beam (after being charged, it is coupled to the laser beam to prevent the laser beam from ablating the non-processing area).

[0061] S4: The laser beam passes through the optical window and the thin electrolyte layer in the coupling component, and couples with the charged electrolyte beam at the upper end surface of the nozzle to form an electrolyte-guided laser.

[0062] S5: The control module activates the second power supply and adjusts the voltage of two pairs of parallel electrode plates in the X and Y directions to generate a specific electric field strength between the parallel electrode plates. Under the action of the uniform electric field, the electrolyte guides the laser to the workpiece opening location to perform a combined laser ablation and electrolytic machining process.

[0063] S6: Based on the shape of the irregular hole, the computer automatically plans the machining trajectory. The control module controls the voltage value of the two pairs of electrode plates in real time, scanning layer by layer to complete the subtractive machining of the irregular hole of the required shape.

[0064] S7: After the processing is completed, the laser beam input is stopped, and the first power supply, the second power supply, the liquid supply system and the control module are turned off in sequence.

[0065] Compared to existing methods for machining irregularly shaped holes, this embodiment utilizes a combination of water-guided laser machining and electrolytic machining. While the water-guided laser ablates the workpiece, the electrolytic machining simultaneously causes anodic dissolution of the workpiece surface in the electrolyte under the influence of the electric field, creating a synergistic effect that significantly improves machining efficiency. Furthermore, the flushing effect of the electrolyte beam effectively cools the workpiece to prevent thermal stress and removes smoke and slag generated during machining, thereby ensuring hole wall quality. This method can process irregularly shaped holes of varying angles as required, enabling the machining of large hole depths and holes with large aspect ratios.

[0066] The following is a further explanation by taking the use of an electrolyte-guided laser composite processing device to process a narrow-entry inverted trapezoidal special-shaped hole as an example.

[0067] Open the liquid supply system, the control module controls the pressure value of the water pump, and adjusts the pressure regulating valve to output high-voltage electrolyte. The high-voltage electrolyte forms a stable thin electrolyte layer through the coupling system, and a stable electrolyte beam is ejected from the nozzle.

[0068] The control module activates the first power supply to charge the electrolyte beam. The laser beam passes through the optical window and the thin electrolyte layer in the coupling system, and couples with the charged electrolyte beam at the upper end surface of the nozzle to form an electrolyte-guided laser.

[0069] The control module activates the second power supply and adjusts the voltage of two pairs of parallel electrode plates in the X and Y directions to generate a specific electric field strength between the parallel electrode plates. Under the action of the uniform electric field, the electrolyte guides the laser light to the hole opening on the workpiece surface, performing a combined laser ablation and electrolytic machining process.

[0070] The control module controls the voltage values ​​of two pairs of parallel electrode plates in the X and Y directions, so that the trajectory of the electrolyte-guided laser landing on the workpiece coincides with the circular entrance of the special-shaped hole to be processed, and circular blind holes are processed layer by layer.

[0071] The voltage values ​​of the two pairs of parallel electrode plates in the X and Y directions are controlled so that the deflection angle of the electrolyte-guided laser is equal to the angle between the busbar of the inverted trapezoidal hole and the vertical direction. After the inverted trapezoidal contour is processed, the voltage values ​​of the two pairs of parallel electrode plates in the X and Y directions are gradually reduced to perform subtractive processing on the solid inside the workpiece to complete the processing of the narrow entrance-inverted trapezoidal special-shaped hole.

[0072] In general, the present invention has the following four characteristics: (1) the water-guided laser processing technology and the electrolytic processing technology are organically combined. While the water-guided laser ablates the surface of the workpiece, the electrolytic processing causes the surface of the workpiece to undergo anodic dissolution in the electrolyte under the action of the electric field, which has a synergistic effect and greatly improves the processing efficiency; (2) the water jet guided laser beam transmission can effectively extend the laser focal depth, and can realize the processing of large hole depth and large aspect ratio holes; (3) the electrolyte-guided laser processing technology is applied to the field of special-shaped hole processing. The flushing effect of the electrolyte beam can effectively cool the workpiece to avoid the generation of thermal stress, and at the same time take away the smoke and slag generated during the processing to ensure the quality of the hole wall; (4) by adjusting the voltage of multiple pairs of parallel electrode plates, the electrolyte-guided laser beam is deflected, and the water beam is deflected flexibly and at high speed in space, and special-shaped holes of different shapes can be processed according to needs.

[0073] The relevant technical solutions are the same as those in Example 1 and will not be described again here.

[0074] It will be easily understood by those skilled in the art that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A device for processing special-shaped holes using an electrolyte-guided laser, characterized in that: include: Electrolyte and laser coupling assembly (1), electrode plate assembly (2), power module (3) and control module (4); The coupling assembly (1) is used to couple the laser beam (5) with the electrolyte beam to form an electrolyte-guided laser beam. The bottom of the coupling assembly (1) is provided with a liquid outlet for vertically spraying the electrolyte-guided laser beam (7) downward. The electrode plate assembly (2) is provided directly below the liquid outlet and comprises a plurality of pairs of electrode plates vertically arranged with the vertical axis of the liquid outlet as the central symmetry axis, and the two electrode plates in each pair of electrode plates are arranged facing each other. The control module (4) is used to control the power supply module (3) to supply power to the coupling assembly (1) so that the electrolyte beam is charged, and to control the power supply module (3) to supply power to one or more groups of electrodes in the electrode plate assembly (2) to generate a uniform electric field in the middle area of ​​the electrode plate assembly (2), so that the electrolyte-guided laser beam (7) passing through the vertical center axis of the electrode plate assembly (2) is deflected relative to the vertical axis under the action of the uniform electric field, and the angle and direction of the deflection meet the requirements of the required processing of the preset special-shaped hole. The control module (4) is specifically used to generate a landing point trajectory of the electrolyte-guided laser beam (7) during processing according to the required special-shaped hole structural parameters; based on the landing point trajectory, the voltage value of one or more pairs of electrodes in the electrode plate assembly (2) is controlled in real time to achieve single-layer scanning processing of the workpiece by the electrolyte-guided laser beam (7); repeating the scanning process allows the electrolyte-guided laser beam (7) to scan the workpiece layer by layer, thereby achieving subtractive processing of the special-shaped hole of the required shape.

2. The device according to claim 1, characterized in that It also includes a laser source and a liquid supply component; the liquid supply component is used to input electrolyte into the liquid inlet of the coupling component (1); and the laser source is used to introduce a laser beam into the coupling component (1).

3. The device according to claim 2, characterized in that Also includes: A processing tank for placing a workpiece to be processed, and a liquid return line with two ends respectively connected to the processing tank and the liquid supply assembly for recovering the electrolyte; wherein a filter is provided in the liquid return line for filtering the processed electrolyte.

4. The device according to claim 1, characterized in that The electrode plate assembly (2) contains two pairs of electrode plates.

5. A method for machining a special-shaped hole, characterized in that: The device for processing special-shaped holes using an electrolyte-guided laser as described in any one of claims 1 to 4 is used to process special-shaped holes.

6. A method for machining a special-shaped hole according to claim 5, characterized in that: The specific method of the processing is: The workpiece is placed directly below the electrode plate assembly in the device, and the coupling assembly is caused to eject an electrolyte beam that moves vertically downward; controlling, by a control module in the device, the power supply module to supply power to the coupling assembly so that the electrolyte beam is charged; Introducing a laser beam into the coupling component, and coupling the laser beam with the electrolyte beam through the coupling component to form an electrolyte-guided laser beam; Through the control module in the device, the power supply module is controlled to supply power to one or more pairs of electrodes in the electrode plate assembly, generating a uniform electric field in the middle area of ​​the electrode plate assembly. Under the action of the uniform electric field, the electrolyte-guided laser beam passing through the vertical center axis of the electrode plate assembly is deflected relative to the vertical center axis, and the angle and direction of the deflection meet the requirements for processing the preset special-shaped holes, so that the electrolyte-guided laser beam lands at the opening position of the workpiece, realizing the composite processing of laser burning and electrolytic processing, and completing the special-shaped hole processing.

Images