Circuit board assembly installation method, device, storage medium and electronic device

Abstract

The embodiment of the present application provides a method, device, storage medium and electronic device for installing a circuit board assembly, wherein the method includes: receiving an installation request; responding to the installation request to obtain a circuit board identification of the current circuit board; detecting an installation strategy of the current circuit board under a target installation device based on the circuit board identification, wherein the installation strategy includes target component information and target position information of the current circuit board, the target component information is used to indicate the target hardware component to be installed by the target installation device for the current circuit board, and the target position information is used to indicate the target installation position of the target hardware component on the current circuit board; controlling the target installation device to install the target hardware component for the current circuit board according to the installation strategy, and when the installation is completed, transmitting the current circuit board with the target hardware component installed to the next installation device in the installation chain. Through this application, the problem of low installation efficiency of circuit board assemblies is solved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of computers, and more specifically, to a method, device, storage medium, and electronic device for installing a circuit board assembly. Background Art

[0002] The operation of an automated production line involves two major aspects: the automated management and transmission of production information, and the automated execution and process monitoring of production actions. Currently, the host computer adds materials to the circuit board according to the issued drawings. However, if the drawings change, the entire assembly chain needs to be adjusted one by one, which reduces the efficiency of the assembly process.

[0003] In view of the problems in the related art such as low installation efficiency of circuit board components, no effective solutions have been proposed. Summary of the Invention

[0004] The embodiments of the present application provide a method, device, storage medium, and electronic device for installing a circuit board assembly, so as to at least solve the problem of low installation efficiency of the circuit board assembly in the related art.

[0005] According to one embodiment of the present application, a method for installing a circuit board assembly is provided. A target assembly system includes a controller and an installation link. The installation link includes a plurality of sequentially connected installation devices. The installation link is configured to receive an initial circuit board on which a hardware component is to be installed, and sequentially transmit the initial circuit board to each of the installation devices before outputting a target circuit board. The installation devices are configured to install hardware components corresponding to the installation devices on the initial circuit board. The method is applied to the controller and includes:

[0006] receiving an installation request, wherein the installation request is used to request a target installation device deployed at a link position corresponding to the current circuit board to install a hardware component for the current circuit board;

[0007] In response to the installation request, obtaining a circuit board identifier of the current circuit board;

[0008] Detecting, based on the circuit board identifier, an installation strategy for the current circuit board under the target installation device, wherein the installation strategy includes target component information and target position information of the current circuit board, the target component information being used to indicate a target hardware component to be installed by the target installation device for the current circuit board, and the target position information being used to indicate a target installation position of the target hardware component on the current circuit board;

[0009] The target installation device is controlled to install the target hardware component for the current circuit board according to the installation strategy, and when the installation is completed, the current circuit board with the target hardware component installed is transmitted to the next installation device in the installation chain.

[0010] In an exemplary embodiment, the current circuit board is transmitted on the installation link by connecting an adapted target daughter board and connecting the target daughter board to a target mother board deployed on the installation link;

[0011] The obtaining of the circuit board identifier of the current circuit board includes:

[0012] Controlling a first reader deployed on the target mounting device to send a target read instruction to a first tag deployed on the target motherboard via a target electrical signal, wherein the target electrical signal is a radio signal, and the first tag is used to store identification information of the target motherboard;

[0013] The identification information of the target motherboard sent by the first tag in a backscattering manner in response to the target read instruction is received as the circuit board identification.

[0014] In an exemplary embodiment, the controller includes a monitoring module and an execution module, the monitoring module is used to monitor the link status of the installation link, and the execution module is used to issue an installation task to the installation link according to the link status, and the monitoring module and the execution module are connected via an application programming interface;

[0015] The detecting, according to the circuit board identifier, the installation strategy of the current circuit board under the target installation device includes:

[0016] Obtaining a target installation task for the current circuit board from the monitoring module according to the circuit board identifier, wherein the target installation task includes the component information and the location information corresponding to each installation device in the installation link;

[0017] Extracting the target component information and the target location information corresponding to the target installation device from the target installation task;

[0018] The installation policy is generated for the target installation device according to the target component information and the target location information, wherein the installation policy carries a target control instruction, and the target control instruction is used to control the target installation device to execute the installation policy.

[0019] In an exemplary embodiment, the current circuit board is transmitted on the installation link by connecting an adapted target daughter board and connecting the target daughter board to a target mother board deployed on the installation link;

[0020] Before acquiring the target installation task of the current circuit board from the monitoring module according to the circuit board identifier, the method further includes:

[0021] controlling a second reader to read a second tag deployed on the target motherboard, wherein the second reader is deployed at a starting end of the installation link;

[0022] parsing the second tag to obtain an identification code of the target motherboard, wherein the identification code is used to indicate identification information of the target motherboard;

[0023] The identification code is transmitted to the execution module, wherein the execution module is used to obtain the target installation task of the current circuit board and establish a corresponding relationship between the target installation task and the target motherboard according to the identification code.

[0024] In an exemplary embodiment, after transmitting the identification code to the execution module, the method further includes:

[0025] Acquire the target installation task of the current circuit board and the identification code of the target motherboard through the execution module, and establish a first corresponding relationship between the target motherboard and the target installation task according to the identification code;

[0026] Extracting the component information of each of the hardware components to be installed on the current circuit board and the position information of each of the hardware components to be installed in the current circuit board from the target installation task;

[0027] Establishing a second correspondence between each piece of component information, each piece of location information, and the installation device included in the installation link;

[0028] The first corresponding relationship and the second corresponding relationship are transmitted to the monitoring module through the application programming interface.

[0029] In an exemplary embodiment, before establishing the first corresponding relationship between the target motherboard and the target installation task according to the identification code, the method further includes:

[0030] Detecting a connection status between the target daughter board and the target motherboard, wherein the connection status is used to indicate whether the execution module stores a connection relationship between the target motherboard and other daughter boards;

[0031] In a case where the connection state indicates that the connection relationship between the target motherboard and the other daughter boards is stored in the execution module, deleting the connection relationship between the target motherboard and the other daughter boards stored in the execution module; and establishing a third corresponding relationship between the target motherboard and the target daughter board;

[0032] In a case where the connection relationship between the target motherboard and other daughter boards is not stored in the execution module, a third corresponding relationship between the target motherboard and the target daughter board is constructed.

[0033] In an exemplary embodiment, the current circuit board is transmitted on the installation link by connecting to an adapted target daughter board and connecting the target daughter board to a target motherboard deployed on the installation link. The controller includes a monitoring module and an execution module. The monitoring module is used to monitor the link status of the installation link, and the execution module is used to issue an installation task to the installation link. The monitoring module and the execution module are connected via an application programming interface.

[0034] Before controlling the target installation device to install the target hardware component for the current circuit board according to the installation strategy, the method further includes: obtaining a first installation status of the current circuit board through the monitoring module, wherein the first installation status is used to indicate that the hardware component identified in the monitoring module as having been completely installed in the current circuit board; verifying the first installation status through a third reader deployed on the target installation device to obtain a first verification result of the first installation status, wherein the first verification result is used to indicate whether the reference hardware component identified in the monitoring module as having been completely installed in the current circuit board is installed in the corresponding reference installation position; if the first verification result is used to indicate that the reference hardware component identified in the monitoring module as having been completely installed in the current circuit board is installed in the corresponding reference installation position, controlling the target installation device to install the target hardware component for the current circuit board according to the installation strategy;

[0035] After controlling the target installation device to install the target hardware component for the current circuit board according to the installation policy, the method further includes: marking the hardware component that has been installed by the target installation device in the current circuit board as having been installed in the monitoring module;

[0036] Before transmitting the current circuit board with the target hardware component installed to the next installation device in the installation chain, the method further includes: obtaining a second installation status of the current circuit board through the monitoring module, wherein the second installation status is used to indicate that the target installation device has completed the installation of the updated hardware component for the current circuit board; verifying the second installation status through the third reader deployed on the target installation device to obtain a second verification result of the second installation status, wherein the second verification result is used to indicate whether the updated hardware component installed in the current circuit board by the target installation device is accurately installed in the corresponding updated installation position; when the second verification result is used to indicate that the updated hardware component installed in the current circuit board by the target installation device is accurately installed in the corresponding updated installation position, transmitting the current circuit board with the target hardware component installed to the next installation device in the installation chain.

[0037] According to another embodiment of the present application, a circuit board assembly installation device is provided. The target assembly system includes a controller and an installation link. The installation link includes a plurality of sequentially connected installation devices. The installation link is used to receive an initial circuit board on which a hardware component is to be installed, and sequentially transmit the initial circuit board to each of the installation devices and then output a target circuit board. The installation devices are used to install hardware components corresponding to the installation devices on the initial circuit board. The device is applied to the controller and includes:

[0038] A receiving module, configured to receive an installation request, wherein the installation request is used to request a target installation device deployed at a link position corresponding to the current circuit board to install a hardware component for the current circuit board;

[0039] A first obtaining module, configured to respond to the installation request and obtain a circuit board identifier of the current circuit board;

[0040] a first detection module, configured to detect, based on the circuit board identifier, an installation strategy of the current circuit board under the target installation device, wherein the installation strategy includes target component information and target position information of the current circuit board, the target component information being used to indicate a target hardware component to be installed by the target installation device for the current circuit board, and the target position information being used to indicate a target installation position of the target hardware component on the current circuit board;

[0041] The first control module is used to control the target installation device to install the target hardware component for the current circuit board according to the installation strategy, and when the installation is completed, transmit the current circuit board with the target hardware component installed to the next installation device in the installation chain.

[0042] According to another embodiment of the present application, a computer-readable storage medium is provided, in which a computer program is stored. The computer program is configured to execute the steps of any one of the above method embodiments when run.

[0043] According to another embodiment of the present application, an electronic device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0044] According to another embodiment of the present application, a computer program product is provided, including a computer program, which implements the steps of any of the above method embodiments when executed by a processor.

[0045] Through the present application, an installation request is received, wherein the installation request is used to request the use of a target installation device deployed at a link position corresponding to the current circuit board to install a hardware component for the current circuit board; in response to the installation request, the circuit board identification of the current circuit board is obtained; the installation strategy of the current circuit board under the target installation device is detected based on the circuit board identification, wherein the installation strategy includes target component information and target position information of the current circuit board, the target component information is used to indicate the target hardware component to be installed by the target installation device for the current circuit board, and the target position information is used to indicate the target installation position of the target hardware component on the current circuit board; the target installation device is controlled to install the target hardware component for the current circuit board according to the installation strategy, and when the installation is completed, the current circuit board with the target hardware component installed is transmitted to the next installation device in the installation link. Since the target component information and target position information of the current circuit board are determined based on the circuit board identification, and then the installation strategy is generated for the target installation device based on the target component information and target position information, the problem of low installation efficiency of the circuit board assembly can be solved, thereby achieving the effect of improving the installation efficiency of the circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 This is a hardware structure block diagram of a server device for a circuit board assembly installation method according to an embodiment of the present application;

[0047] Figure 2 is a flow chart of a method for installing a circuit board assembly according to an embodiment of the present application;

[0048] Figure 3 is a schematic diagram of a motherboard according to an embodiment of the present application;

[0049] Figure 4 is a schematic diagram of a daughter board according to an embodiment of the present application;

[0050] Figure 5 is a schematic diagram of an interaction process between a controller, SCADA, and MES according to an embodiment of the present application;

[0051] Figure 6 is a flow chart of a process for installing a circuit board assembly according to an embodiment of the present application;

[0052] Figure 7 is a structural block diagram of a mounting device for a circuit board component according to an embodiment of the present application;

[0053] Figure 8 This is a structural block diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0054] The embodiments of the present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0055] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0056] The method embodiments provided in the embodiments of the present application can be executed in a server device or a similar computing device. Taking running on a server device as an example, Figure 1 This is a hardware structure diagram of a server device for a method of installing a circuit board assembly according to an embodiment of the present application. Figure 1 As shown, the server device may include one or more ( Figure 1 Only one is shown) a processor 102 (the processor 102 may include but is not limited to a microprocessor MCU or a programmable logic device FPGA and other processing devices) and a memory 104 for storing data, wherein the above-mentioned server device may also include a transmission device 106 for communication functions and an input and output device 108. It will be understood by those skilled in the art that Figure 1 The structure shown is only for illustration and does not limit the structure of the above server device. Figure 1 More or fewer components than shown, or with Figure 1 Different configurations shown.

[0057] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the method for installing the circuit board assembly in the embodiment of the present application. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, implementing the above-mentioned method. The memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include a memory remotely located relative to the processor 102, and these remote memories can be connected to the server device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0058] The transmission device 106 is used to receive or send data via a network. A specific example of the aforementioned network may include a wireless network provided by a communication provider of the server device. In one embodiment, the transmission device 106 includes a network interface controller (NIC), which can be connected to other network devices via a base station to enable communication with the Internet. In another embodiment, the transmission device 106 may be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0059] In this embodiment, a method for installing a circuit board assembly is provided. The target assembly system includes a controller and an installation link. The installation link includes a plurality of installation devices connected in sequence. The installation link is used to receive an initial circuit board on which a hardware component to be installed is to be installed, and to sequentially transmit the initial circuit board to each of the installation devices and then output a target circuit board. The installation devices are used to install hardware components corresponding to the installation devices on the initial circuit board. The method is applied to the controller. Figure 2 is a flow chart of a method for installing a circuit board assembly according to an embodiment of the present application, such as Figure 2 As shown, the process includes the following steps:

[0060] Step S202: receiving an installation request, wherein the installation request is used to request a target installation device deployed at a link position corresponding to the current circuit board to install a hardware component for the current circuit board;

[0061] Step S204, responding to the installation request, obtaining the circuit board identification of the current circuit board;

[0062] Step S206: detecting an installation strategy for the current circuit board under the target mounting device based on the circuit board identifier, wherein the installation strategy includes target component information and target position information of the current circuit board, the target component information being used to indicate a target hardware component to be installed by the target mounting device for the current circuit board, and the target position information being used to indicate a target mounting position of the target hardware component on the current circuit board;

[0063] Step S208 , controlling the target installation device to install the target hardware component for the current circuit board according to the installation strategy, and when the installation is completed, transmitting the current circuit board with the target hardware component installed to the next installation device in the installation chain.

[0064] Through the above steps, an installation request is received, wherein the installation request is used to request the use of a target installation device deployed at a link position corresponding to the current circuit board to install a hardware component for the current circuit board; in response to the installation request, the circuit board identification of the current circuit board is obtained; the installation strategy of the current circuit board under the target installation device is detected based on the circuit board identification, wherein the installation strategy includes target component information and target position information of the current circuit board, the target component information is used to indicate the target hardware component to be installed by the target installation device for the current circuit board, and the target position information is used to indicate the target installation position of the target hardware component on the current circuit board; the target installation device is controlled to install the target hardware component for the current circuit board according to the installation strategy, and when the installation is completed, the current circuit board with the target hardware component installed is transmitted to the next installation device in the installation chain. Since the target component information and target position information of the current circuit board are determined based on the circuit board identification, and then the installation strategy is generated for the target installation device based on the target component information and target position information, the problem of low installation efficiency of the circuit board assembly can be solved, thereby achieving the effect of improving the installation efficiency of the circuit board assembly.

[0065] Optionally, in this embodiment, the installation chain includes multiple installation devices connected in sequence, and the initial circuit board is input into the installation chain. Each installation device in the installation chain is used to install different hardware components for the circuit board until the initial circuit board completes the installation of all hardware components and outputs the target circuit board from the installation chain.

[0066] Optionally, in this embodiment, the initial circuit board may be, but is not limited to, a server motherboard on which hardware components are to be installed, or may be other board devices on which hardware components are to be installed. The hardware components may include, but are not limited to, a CPU (central processing unit), memory (RAM), storage devices, a cooling system, a PSU (power supply unit), expansion interfaces, and the like.

[0067] In the technical solution provided in step S202 above, the installation request may be, but is not limited to, automatically triggered when certain conditions are met, or may be generated and sent to the controller in other ways. The conditions for triggering the installation request may include, but are not limited to: triggering the installation request when a new installation task is acquired; triggering the installation request when an unconnected current circuit board is detected in the installation chain; triggering the installation request when the current circuit board in the installation chain arrives at a new target installation device, etc.

[0068] In the technical solution provided in the above step S204, the above circuit board identifier can be obtained by, but is not limited to, scanning the current circuit board; or, the above circuit board identifier can be extracted from an installation request carrying the circuit board identifier; or, the above circuit board identifier can be obtained by other means.

[0069] Optionally, in this embodiment, the installation strategy corresponding to the circuit board identification of the current circuit board can be obtained from the circuit board identifications and installation strategies with corresponding relationships based on the circuit board identification of the current circuit board, but is not limited to; or, the target component information and target position information corresponding to the circuit board identification of the current circuit board can be searched as the installation strategy from the circuit board identifications, component information and position information with corresponding relationships based on the circuit board identification of the current circuit board.

[0070] In an exemplary embodiment, the current circuit board is transmitted on the installation link by connecting to an adapted target daughter board and connecting the target daughter board to a target mother board deployed on the installation link; the circuit board identification of the current circuit board can be obtained in the following manner, but is not limited to: controlling a first reader deployed on the target installation device to send a target read instruction to a first tag deployed on the target mother board through a target electrical signal, wherein the target electrical signal is a radio signal, and the first tag is used to store identification information of the target mother board; receiving the identification information of the target mother board sent by the first tag in response to the target read instruction by backscattering as the circuit board identification.

[0071] Optionally, in this embodiment, a first reader can be deployed on each installation device in the installation link but is not limited to it. The first reader is used to send a target read instruction to a first tag deployed on the target motherboard via a radio signal, and receive the identification information of the target motherboard sent by the first tag in response to the target read instruction via backscattering as a circuit board identification.

[0072] Optionally, in this embodiment, the first tag may be, but is not limited to, a tag that allows information to be stored, such as an RFID (Radio Frequency Identification) tag, an NFC (Near Field Communication) tag, an Optical Character Recognition (OCR) tag, and the like.

[0073] Optionally, in this embodiment, a first reader that allows identification of the first tag can be selected based on, but is not limited to, the first tag. For example, when the first tag is an RFID tag, an RFID read / write head with the function of identifying the RFID tag is selected as the first reader and deployed on each installation device.

[0074] In the technical solution provided in the above step S206, when the installation policy is obtained, the target installation device may be controlled to install the target hardware component at the target installation location indicated by the installation policy, but is not limited to the above.

[0075] In an exemplary embodiment, the controller includes a monitoring module and an execution module, the monitoring module is used to monitor the link status of the installation link, and the execution module is used to issue installation tasks to the installation link according to the link status, and the monitoring module and the execution module are connected through an application programming interface; the installation strategy of the current circuit board under the target installation device can be detected according to the circuit board identifier in the following manner, but is not limited to: obtaining the target installation task of the current circuit board from the monitoring module according to the circuit board identifier, wherein the target installation task includes the component information and the location information corresponding to each of the installation devices in the installation link; extracting the target component information and the target location information corresponding to the target installation device from the target installation task; generating the installation strategy for the target installation device according to the target component information and the target location information, wherein the installation strategy carries a target control instruction, and the target control instruction is used to control the target installation device to execute the installation strategy.

[0076] Optionally, in this embodiment, the monitoring module may be, but is not limited to, a SCADA (Supervisory Control and Data Acquisition) system or other systems that can be deployed in a controller and monitor the link status of the installation link. The execution module may be, but is not limited to, an MES (Manufacturing Execution System) or other systems that can be deployed in a controller and issue installation tasks to the installation link based on the link status.

[0077] Optionally, in this embodiment, the monitoring module may, but is not limited to, cooperate with the first reader deployed on the target installation device to provide real-time monitoring of the installation link. For example, based on the circuit board identifier reported by the first reader, the monitoring module may determine which circuit board is awaiting hardware component installation on the target installation device, further determine the circuit board corresponding to each installation device, and obtain the link status of the installation link. In other words, the link status of the installation link may, but is not limited to, indicate the current position of the circuit board in the installation link and the installation device deployed at the link position corresponding to the circuit board's current position in the installation link.

[0078] Optionally, in this embodiment, the execution module can be used, but is not limited to, to receive the complete target installation task of the current circuit board passing through the installation link, and split the target installation task according to the target installation task and the function of each installation device in the installation link to obtain the current circuit board, installation device, and component information and location information corresponding to each installation device with a corresponding relationship. The execution module transmits the current circuit board, installation device, and component information and location information corresponding to each installation device with a corresponding relationship to the monitoring module. The monitoring module can be used, but is not limited to, monitoring the working status of each installation device according to the corresponding relationship to obtain the link status of the installation link.

[0079] Optionally, in this embodiment, the monitoring module can, but is not limited to, pre-store circuit board identifications, installation devices, and component information and location information corresponding to each installation device with corresponding relationships, search for the component information and location information corresponding to the circuit board identification of the current circuit board from the corresponding relationships, and then obtain the target component information and target location information based on the installation device deployed by the first reader that obtains the circuit board identification.

[0080] Optionally, in this embodiment, a target control instruction can be generated based on, but not limited to, the target component information and the target location information, and the target control instruction is sent to the target installation device. The target installation device responds to the target control instruction to install the target hardware component indicated by the target component information at the target installation location indicated by the target location information.

[0081] In an exemplary embodiment, the current circuit board is transmitted on the installation link by connecting an adapted target daughter board and connecting the target daughter board to the target mother board deployed on the installation link; before obtaining the target installation task of the current circuit board from the monitoring module according to the circuit board identification, the correspondence between the target installation task and the target mother board can be constructed in the following manner, but is not limited to: controlling a second reader to read a second tag deployed on the target mother board, wherein the second reader is deployed at the starting end of the installation link; parsing the second tag to obtain an identification code of the target mother board, wherein the identification code is used to indicate the identification information of the target mother board; transmitting the identification code to the execution module, wherein the execution module is used to obtain the target installation task of the current circuit board, and construct a correspondence between the target installation task and the target mother board according to the identification code.

[0082] Optionally, in this embodiment, the second reader can be but is not limited to being deployed at the starting end of the installation link, or it can also be deployed on the first installation device in the installation link. The above-mentioned second tag can be but is not limited to being a tag that allows information to be stored in the form of an image, such as: QR code, barcode, etc.

[0083] Optionally, in this embodiment, a second reader that is allowed to capture and parse the second tag can be selected based on the second tag but is not limited to it. For example, when the second tag is a QR code, a barcode scanner with the function of capturing and parsing the QR code is selected as the second reader, etc.

[0084] Optionally, in this embodiment, the execution module can be but is not limited to receiving the target installation task, and upon receiving the identification code, bind the motherboard where the current circuit board is located to the target installation task, and then bind the current circuit board to the target installation task.

[0085] Optionally, in this embodiment, Figure 3 is a schematic diagram of a motherboard according to an embodiment of the present application, such as Figure 3 As shown, the motherboard remains in the installation chain. An RFID tag is located on the bottom of the motherboard, and an RFID read / write head is deployed along the installation chain to read the information at the corresponding location. A QR code labeled on the side of the motherboard is scanned by a scanner to transmit the motherboard information to the MES. The MES obtains the motherboard information and binds it to the pre-received target installation task. It should be noted that the QR code and RFID tag represent the same information: the motherboard information.

[0086] Optionally, in this embodiment, Figure 4 is a schematic diagram of a daughter board according to an embodiment of the present application, such as Figure 4As shown, the daughterboard is installed through the positioning pins in fixed positions and the positioning pin holes of the motherboard to ensure that each daughterboard can share the motherboard. The motherboard model is silk-screened on the daughterboard. The daughterboard is made according to the type of the motherboard (initial circuit board). The positioning blocks on the upper surface of the daughterboard are arranged according to the shape of the motherboard to ensure the positioning accuracy of the motherboard on the daughterboard. The motherboard needs to be installed on the corresponding daughterboard, and then the daughterboard is lifted by the folding handle and installed on the motherboard, and then the handle is folded to prevent interference with the subsequent installation process.

[0087] In an exemplary embodiment, after the identification code is transmitted to the execution module, a second correspondence relationship can be constructed in the following manner, but is not limited to: obtaining the target installation task of the current circuit board and the identification code of the target motherboard through the execution module, and constructing a first correspondence relationship between the target motherboard and the target installation task based on the identification code; extracting the component information of each hardware component to be installed on the current circuit board and the position information of each hardware component to be installed in the current circuit board from the target installation task; constructing a second correspondence relationship between each component information, each position information and the installation device included in the installation link; and transmitting the first correspondence relationship and the second correspondence relationship to the monitoring module through the application programming interface.

[0088] Optionally, in this embodiment, the execution module can be but is not limited to being used to obtain the target installation task of the current circuit board, and upon receiving the identification code of the target motherboard, construct a first correspondence between the target motherboard and the target installation task according to the identification code.

[0089] Optionally, in this embodiment, the execution module extracts the component information of each hardware component to be installed on the current circuit board and the location information of each hardware component to be installed on the current circuit board from the target installation task; constructs a second correspondence between each component information, each location information and the installation equipment included in the installation link according to the identification code; and transmits each second correspondence to the monitoring module through the application programming interface.

[0090] Therefore, when the monitoring module obtains the circuit board identification, the target installation task of the current circuit board can be determined from the first correspondence relationship based on the circuit board identification, and then the target component information and target position information corresponding to the target installation device can be determined from the second correspondence relationship based on the device information of the target installation device.

[0091] In an exemplary embodiment, before constructing the first correspondence between the target motherboard and the target installation task based on the identification code, a third correspondence can be constructed in the following manner, but is not limited to: detecting the connection status between the target daughter board and the target motherboard, wherein the connection status is used to indicate whether the connection relationship between the target motherboard and other daughter boards is stored in the execution module; if the connection status is used to indicate that the connection relationship between the target motherboard and other daughter boards is stored in the execution module, deleting the connection relationship between the target motherboard and other daughter boards stored in the execution module; constructing the third correspondence between the target motherboard and the target daughter board; if the connection relationship between the target motherboard and other daughter boards is not stored in the execution module, constructing the third correspondence between the target motherboard and the target daughter board.

[0092] Optionally, in this embodiment, before establishing the first correspondence, the target daughter board and the target motherboard may be bound, but is not limited to, to establish a correspondence between the target motherboard and the current circuit board of the corresponding model. Since the motherboard is deployed on the installation link and transmission is maintained, if the connection state between the target daughter board and the target motherboard is used to indicate that the connection relationship between the target motherboard and other daughter boards is stored in the execution module, it is necessary to delete the connection relationship between the target motherboard and other daughter boards stored in the execution module; and establish a third correspondence between the target motherboard and the target daughter board. Alternatively, if the connection relationship between the target motherboard and other daughter boards is not stored in the execution module, a third correspondence between the target motherboard and the target daughter board is established.

[0093] By establishing this third correspondence, the first tag read by the first reader deployed on the target installation device and the second tag read by the second reader deployed at the starting end of the installation chain can both use the motherboard information as the identifier of the current circuit board connected to the daughterboard. This design method for both the daughterboard and the motherboard allows the motherboard and its first and second tags to be reused, saving materials and the effort of replacing the circuit boards for the hardware components to be installed.

[0094] In the technical solution provided in the above step S208, the target installation device is used to parse the installation policy to obtain the target installation location and the target hardware component corresponding to the target installation location, and install the target hardware component at the target installation location.

[0095] In an exemplary embodiment, the current circuit board is transmitted on the installation link by connecting to an adapted target daughter board and connecting the target daughter board to a target motherboard deployed on the installation link. The controller includes a monitoring module and an execution module. The monitoring module is used to monitor the link status of the installation link, and the execution module is used to issue an installation task to the installation link. The monitoring module and the execution module are connected via an application programming interface.

[0096] Before controlling the target installation device to install the target hardware component for the current circuit board according to the installation strategy, verification can be performed in the following manner but is not limited to: obtaining a first installation status of the current circuit board through the monitoring module, wherein the first installation status is used to indicate that the hardware component that has been installed in the current circuit board is identified in the monitoring module; verifying the first installation status through a third reader deployed on the target installation device to obtain a first verification result of the first installation status, wherein the first verification result is used to indicate whether the reference hardware component that has been installed in the current circuit board identified in the monitoring module is installed in the corresponding reference installation position; in the case where the first verification result is used to indicate that the reference hardware component that has been installed in the current circuit board identified in the monitoring module is installed in the corresponding reference installation position, controlling the target installation device to install the target hardware component for the current circuit board according to the installation strategy; after controlling the target installation device to install the target hardware component for the current circuit board according to the installation strategy, modification of the monitoring status can be performed in the following manner but is not limited to. Information in the module: the hardware component that has been installed in the current circuit board by the target installation device is marked as having been installed in the monitoring module; before the current circuit board with the target hardware component installed is transmitted to the next installation device in the installation chain, verification can be performed in the following manner but is not limited to: obtaining a second installation status of the current circuit board through the monitoring module, wherein the second installation status is used to indicate that the target installation device has installed an updated hardware component on the current circuit board; verifying the second installation status through the third reader deployed on the target installation device to obtain a second verification result of the second installation status, wherein the second verification result is used to indicate whether the updated hardware component that has been installed in the current circuit board by the target installation device is accurately installed in the corresponding updated installation position; when the second verification result is used to indicate that the updated hardware component that has been installed in the current circuit board by the target installation device is accurately installed in the corresponding updated installation position, the current circuit board with the target hardware component installed is transmitted to the next installation device in the installation chain.

[0097] Optionally, in this embodiment, before controlling the target installation device to install the target hardware component for the current circuit board according to the installation strategy, the hardware component that has been installed in the current circuit board is identified in the monitoring module; a third reader deployed on the target installation device is used to verify whether the reference hardware component that has been installed in the current circuit board as identified in the monitoring module is installed in the corresponding reference installation position; when it is identified in the monitoring module that the reference hardware component that has been installed in the current circuit board is installed in the corresponding reference installation position, the target installation device is controlled to install the target hardware component for the current circuit board according to the installation strategy.

[0098] Optionally, in this embodiment, after controlling the target installation device to install the target hardware component for the current circuit board according to the installation policy, the hardware component installed by the target installation device in the current circuit board is marked as completed in the monitoring module.

[0099] Optionally, in this embodiment, before the target circuit board with the target hardware component installed is transmitted to the next installation device in the installation chain, the updated hardware component installed by the target installation device for the current circuit board is obtained through the monitoring module; and a third reader deployed on the target installation device is used to verify whether the updated hardware component is accurately installed in the corresponding updated installation position; and when the updated hardware component is accurately installed in the corresponding updated installation position, the current circuit board with the target hardware component installed is transmitted to the next installation device in the installation chain until the target circuit board with all hardware components installed is output.

[0100] Through multiple verification processes, we ensure that when installing hardware components for the current circuit board, we avoid the situation where the hardware components are placed on the current circuit board but not installed correctly due to position deviation. This ensures the efficiency of the installation and further improves the accuracy of the installation process.

[0101] Optionally, in this embodiment, the third reader may be, but is not limited to, a detection device having a visual system.

[0102] In an exemplary embodiment, with the monitoring module being SCADA and the execution module being MES, an example of an interaction process between a controller and SCADA and MES is provided. Figure 5 Schematic diagram of the interaction process between a controller, SCADA and MES according to an embodiment of the present application, such as Figure 5As shown, the MES receives the target installation task of the current circuit board, the controller sends the identification code of the target motherboard to the MES, and the MES establishes a first correspondence between the target installation task and the target motherboard. The MES splits the target installation task into component information and location information according to the function of each installation device in the installation link, and establishes a second correspondence between the installation device, component information and location information. The MES sends the first correspondence and the second correspondence to the SCADA system.

[0103] When the controller receives an installation request, it obtains the identification information of the target motherboard as the circuit board identification and sends it to the SCADA system. The SCADA system then determines the target installation task from a first correspondence based on the circuit board identification. Based on the target installation task and the target installation device, it then determines the target component information and target location information from a second correspondence based on the target installation task and the target installation device. The controller then controls the target installation device to execute the installation strategy. Through the above process, the combined use of multiple systems and multiple hardware makes product tracking and quality control easier. Real-time data collection and monitoring provide transparency in the production process. A flexible recipe management system can adapt to various personalized configuration requirements. Precise material and assembly management improves the quality of the final product.

[0104] Optionally, in this embodiment, in order to better understand the installation process of the above-mentioned circuit board assembly in the installation method of the circuit board assembly proposed in this application, the above-mentioned process is described in combination with the optional embodiment below, but it is not used to limit the technical solution of the embodiment of this application.

[0105] In an exemplary embodiment, an example of the installation process of a circuit board assembly is provided, taking the current circuit board as a server mainboard, the first reader as an RFID read / write head, the first tag as an RFID tag, the second reader as a barcode scanner, the second tag as a QR code, the monitoring module as SCADA, and the execution module as MES as an example. Figure 6 is a flow chart of a process for installing a circuit board assembly according to an embodiment of the present application, such as Figure 6 As shown, according to the production model plan, the motherboard carrier is prepared in advance. The motherboard consists of a motherboard and a daughterboard. The motherboard runs on the installation chain and has an RFID tag on the bottom. Each installation device in the installation chain is equipped with an RFID read / write head to read the motherboard information.

[0106] A numbered QR code is affixed to the side of the motherboard. This code can be scanned by a barcode scanner and transmitted to the MES. The MES then retrieves the motherboard information and binds the previously acquired target motherboard installation task to the motherboard information. Both the QR code and the RFID tag information are used to identify the motherboard deployed on the daughterboard. The motherboard model is silkscreened on the daughterboard. The daughterboard is manufactured according to the motherboard type and is installed using fixed-position locating pins that mate with the motherboard's locating pin holes, ensuring that each daughterboard can share the same motherboard. The daughterboard is lifted and installed onto the motherboard using a folding handle, which is then folded to prevent interference with subsequent processes. Locating blocks are arranged on the daughterboard's surface based on the motherboard's shape to ensure accurate positioning of the motherboard on the daughterboard. Based on the target installation task, the MES adds installation tasks for hardware components such as the motherboard, memory, CPU, and heat sink by material number. Installation tasks can be added separately to, but are not limited to, the installation equipment and SCADA. The location and visual identification of hardware components are added to the installation equipment, and the material number and installation task are added to SCADA. The material number and installation task in the installation equipment and SCADA are matched one by one. The point correspondence between the motherboard and the hardware component is established in SCADA. In this way, after the point is calculated and the site is allocated in MES, SCADA can receive and parse the material location to be installed for a certain order. SCADA sends an operation code request through the API interface, and MES responds with information in the corresponding table in the database. The installation process of the circuit board assembly can be executed through, but is not limited to, the following steps:

[0107] Step S602: The RFID reader on the target installation device obtains the motherboard identification;

[0108] Step S604: Obtain the target hardware component and target installation location corresponding to the target installation device from SCADA according to the motherboard identifier;

[0109] Step S606: Generate an installation strategy based on the target hardware component and the target installation location;

[0110] Step S608: The target installation device receives the installation policy;

[0111] Step S610: The target mounting device verifies the received current circuit board. It should be noted that the purpose of the verification process in step S610 is to ensure that no failure occurs in the installation process of the mounting device before the target mounting device.

[0112] Step S612: When the received current circuit board passes the verification, the target installation device installs the target hardware components for the current circuit board according to the installation strategy;

[0113] It should be noted that when the equipment installs the material according to the recipe data and reaches the offline workstation, the SCADA system will determine whether the installation result uploaded by the equipment is OK or NG to pass the station. If the station cannot be passed, the prompt message will be displayed to check the cause, manually resolve the problem, and then manually pass the station. During the pass, the SCADA system will upload the corresponding material PN, QID, pressure, screw torque and other key information to the MES. The MES will verify that the PN is used for this order and simultaneously unbind the carrier board and mainboard.

[0114] Step S614: When the target installation device completes the installation of the target hardware component, the installed current circuit board is verified. It should be noted that the purpose of the verification process in step S614 is to ensure that no failure occurs during the installation process of the target installation device.

[0115] Step S616: When the installed circuit board passes the verification, the current circuit board is transferred to the next installation device. When passing the station, SCADA uploads the corresponding material PN, QID, pressure, screw torque and other key information of the point to MES. MES verifies whether the PN is used for this order until the order quantity is fully completed, and this process ends.

[0116] Through the installation method of the circuit board assembly proposed in this application, by opening up the interfaces of various systems, ensuring smooth information flow, the system forms a linkage interaction between multiple systems, which not only ensures the correct use of materials and the correct installation position, but also can automatically complete the formula point identification, improve assembly efficiency and accuracy, and thus improve product yield.

[0117] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus the necessary general hardware platform, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application, or the part that contributes to the relevant technology, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for enabling a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the method described in each embodiment of the present application.

[0118] In this embodiment, a device for installing a circuit board component is also provided. The target assembly system includes a controller and an installation link. The installation link includes a plurality of installation devices connected in sequence. The installation link is used to receive an initial circuit board of a hardware component to be installed, and transmit the initial circuit board to each of the installation devices in sequence and then output a target circuit board. The installation device is used to install a hardware component corresponding to the installation device for the initial circuit board. The device is applied to the controller. The device is used to implement the above-mentioned embodiments and preferred implementation methods. Those that have been explained will not be repeated here. As used below, the term "module" can implement a combination of software and / or hardware that implements a predetermined function. Although the device described in the following embodiments is preferably implemented in software, implementation in hardware, or a combination of software and hardware, is also possible and conceivable.

[0119] Figure 7 is a structural block diagram of a mounting device for a circuit board component according to an embodiment of the present application, such as Figure 7 As shown, the device includes:

[0120] A receiving module 72 is configured to receive an installation request, wherein the installation request is used to request that a target installation device deployed at a link position corresponding to the current circuit board be used to install a hardware component for the current circuit board;

[0121] A first obtaining module 74 is configured to obtain a circuit board identifier of the current circuit board in response to the installation request;

[0122] A first detection module 76 is configured to detect, based on the circuit board identifier, an installation strategy for the current circuit board under the target mounting device, wherein the installation strategy includes target component information and target position information of the current circuit board, the target component information being used to indicate a target hardware component to be installed by the target mounting device for the current circuit board, and the target position information being used to indicate a target mounting position of the target hardware component on the current circuit board;

[0123] The first control module 78 is used to control the target installation device to install the target hardware component for the current circuit board according to the installation strategy, and when the installation is completed, transmit the current circuit board with the target hardware component installed to the next installation device in the installation chain.

[0124] Through the above-mentioned device, an installation request is received, wherein the installation request is used to request the use of a target installation device deployed at a link position corresponding to the current circuit board to install a hardware component for the current circuit board; in response to the installation request, a circuit board identification of the current circuit board is obtained; based on the circuit board identification, an installation strategy for the current circuit board under the target installation device is detected, wherein the installation strategy includes target component information and target position information of the current circuit board, the target component information is used to indicate the target hardware component to be installed by the target installation device for the current circuit board, and the target position information is used to indicate the target installation position of the target hardware component on the current circuit board; the target installation device is controlled to install the target hardware component for the current circuit board according to the installation strategy, and when the installation is completed, the current circuit board with the target hardware component installed is transmitted to the next installation device in the installation chain. Since the target component information and target position information of the current circuit board are determined based on the circuit board identification, and then an installation strategy is generated for the target installation device based on the target component information and target position information, the problem of low installation efficiency of the circuit board assembly can be solved, thereby achieving the effect of improving the installation efficiency of the circuit board assembly.

[0125] In an exemplary embodiment, the current circuit board is transmitted on the installation link by connecting an adapted target daughter board and connecting the target daughter board to a target motherboard deployed on the installation link; the first acquisition module includes:

[0126] a control unit, configured to control a first reader deployed on the target mounting device to send a target read instruction to a first tag deployed on the target motherboard via a target electrical signal, wherein the target electrical signal is a radio signal, and the first tag is configured to store identification information of the target motherboard;

[0127] The receiving unit is configured to receive the identification information of the target motherboard sent by the first tag in a backscattering manner in response to the target read instruction as the circuit board identification.

[0128] In an exemplary embodiment, the controller includes a monitoring module and an execution module. The monitoring module is used to monitor the link status of the installation link, and the execution module is used to issue an installation task to the installation link based on the link status. The monitoring module and the execution module are connected via an application programming interface. The first detection module includes:

[0129] an acquiring unit, configured to acquire a target installation task of the current circuit board from the monitoring module according to the circuit board identifier, wherein the target installation task includes the component information and the position information corresponding to each installation device in the installation link;

[0130] an extraction unit, configured to extract the target component information and the target location information corresponding to the target installation device from the target installation task;

[0131] A generating unit is configured to generate the installation policy for the target installation device according to the target component information and the target location information, wherein the installation policy carries a target control instruction, and the target control instruction is configured to control the target installation device to execute the installation policy.

[0132] In an exemplary embodiment, the current circuit board is transmitted on the installation link by connecting to an adapted target daughter board and connecting the target daughter board to a target motherboard deployed on the installation link; before obtaining the target installation task of the current circuit board from the monitoring module according to the circuit board identifier, the apparatus further includes:

[0133] A second control module is configured to control a second reader to read a second tag deployed on the target motherboard, wherein the second reader is deployed at a starting end of the installation link;

[0134] a parsing module, configured to parse the second tag to obtain an identification code of the target motherboard, wherein the identification code is used to indicate identification information of the target motherboard;

[0135] The first transmission module is used to transmit the identification code to the execution module, wherein the execution module is used to obtain the target installation task of the current circuit board and establish a corresponding relationship between the target installation task and the target motherboard according to the identification code.

[0136] In an exemplary embodiment, after transmitting the identification code to the execution module, the apparatus further includes:

[0137] a second acquisition module, configured to acquire the target installation task of the current circuit board and the identification code of the target motherboard through the execution module, and to establish a first corresponding relationship between the target motherboard and the target installation task according to the identification code;

[0138] an extraction module, configured to extract, from the target installation task, the component information of each of the hardware components to be installed on the current circuit board, and the position information of each of the hardware components to be installed in the current circuit board;

[0139] A first building module is configured to build a second correspondence between each piece of component information, each piece of location information, and the installation device included in the installation link;

[0140] The second transmission module is configured to transmit the first corresponding relationship and the second corresponding relationship to the monitoring module through the application programming interface.

[0141] In an exemplary embodiment, before establishing the first corresponding relationship between the target motherboard and the target installation task according to the identification code, the apparatus further includes:

[0142] a second detection module, configured to detect a connection status between the target daughter board and the target motherboard, wherein the connection status is used to indicate whether a connection relationship between the target motherboard and other daughter boards is stored in the execution module;

[0143] a deleting module configured to, when the connection state indicates that the connection relationship between the target motherboard and the other daughterboards is stored in the execution module, delete the connection relationship between the target motherboard and the other daughterboards stored in the execution module; a second constructing module configured to construct a third corresponding relationship between the target motherboard and the target daughterboard;

[0144] The third constructing module is configured to construct a third corresponding relationship between the target motherboard and the target daughterboard when the connection relationship between the target motherboard and other daughterboards is not stored in the executing module.

[0145] In an exemplary embodiment, the current circuit board is transmitted on the installation link by connecting to an adapted target daughter board and connecting the target daughter board to a target mother board deployed on the installation link. The controller includes a monitoring module and an execution module. The monitoring module is used to monitor the link status of the installation link, and the execution module is used to send installation tasks to the installation link. The monitoring module and the execution module are connected through an application programming interface; the first control module is also used to: obtain a first installation status of the current circuit board through the monitoring module before controlling the target installation device to install the target hardware component for the current circuit board according to the installation strategy, wherein the first installation status The state is used to indicate that the monitoring module identifies the hardware component that has been installed in the current circuit board; the first installation state is verified by a third reader deployed on the target installation device to obtain a first verification result of the first installation state, wherein the first verification result is used to indicate whether the reference hardware component that has been installed in the current circuit board identified in the monitoring module is installed in the corresponding reference installation position; when the first verification result is used to indicate that the reference hardware component that has been installed in the current circuit board identified in the monitoring module is installed in the corresponding reference installation position, the target installation device is controlled to install the target hardware component for the current circuit board according to the installation strategy;

[0146] After controlling the target installation device to install the target hardware component for the current circuit board according to the installation strategy, marking the hardware component that has been installed by the target installation device in the current circuit board as having been installed in the monitoring module;

[0147] Before the current circuit board on which the target hardware component is installed is transferred to the next installation device in the installation chain, a second installation status of the current circuit board is acquired through the monitoring module, wherein the second installation status is used to indicate that the target installation device has completed installation of the updated hardware component for the current circuit board; the second installation status is verified by the third reader deployed on the target installation device to obtain a second verification result of the second installation status, wherein the second verification result is used to indicate whether the updated hardware component installed in the current circuit board by the target installation device is accurately installed in the corresponding updated installation position; when the second verification result is used to indicate that the updated hardware component installed in the current circuit board by the target installation device is accurately installed in the corresponding updated installation position, the current circuit board on which the target hardware component is installed is transferred to the next installation device in the installation chain.

[0148] It should be noted that the above modules can be implemented through software or hardware. For the latter, it can be implemented in the following ways, but not limited to: the above modules are all located in the same processor; or the above modules are located in different processors in any combination.

[0149] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored. The computer program is configured to execute the steps of any of the above method embodiments when run.

[0150] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disk.

[0151] An embodiment of the present application further provides an electronic device, Figure 8 is a structural block diagram of an electronic device according to an embodiment of the present application, such as Figure 8 As shown, the electronic device includes a memory and a processor, the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0152] In an exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor, and the input / output device is connected to the processor.

[0153] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps in any one of the above method embodiments are implemented.

[0154] An embodiment of the present application further provides another computer program product, comprising a non-volatile computer-readable storage medium, wherein the non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of any of the above method embodiments are implemented.

[0155] An embodiment of the present application further provides a computer program, which includes computer instructions stored in a computer-readable storage medium; a processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device performs the steps of any of the above method embodiments.

[0156] For specific examples in this embodiment, reference may be made to the examples described in the above embodiments and exemplary implementation modes, and this embodiment will not be described in detail here.

[0157] Obviously, those skilled in the art should understand that the modules or steps of the present application described above can be implemented using a general-purpose computing device, they can be concentrated on a single computing device, or distributed across a network composed of multiple computing devices, they can be implemented using program code executable by the computing device, and thus, they can be stored in a storage device and executed by the computing device, and in some cases, the steps shown or described can be performed in a different order than herein, or they can be fabricated into separate integrated circuit modules, or multiple modules or steps can be fabricated into a single integrated circuit module for implementation. Thus, the present application is not limited to any specific combination of hardware and software.

[0158] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. made within the principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A method for installing a circuit board assembly, characterized in that: The target assembly system includes a controller and an installation link, wherein the installation link includes a plurality of sequentially connected installation devices, the installation link is used to receive an initial circuit board of a hardware component to be installed, and sequentially transmit the initial circuit board to each of the installation devices and then output a target circuit board, the installation devices are used to install hardware components corresponding to the installation devices on the initial circuit board, and the method is applied to the controller, the method comprising: receiving an installation request, wherein the installation request is used to request a target installation device deployed at a link position corresponding to the current circuit board to install a hardware component for the current circuit board; In response to the installation request, obtaining a circuit board identifier of the current circuit board; Detecting, based on the circuit board identifier, an installation strategy for the current circuit board under the target installation device, wherein the installation strategy includes target component information and target position information of the current circuit board, the target component information being used to indicate a target hardware component to be installed by the target installation device for the current circuit board, and the target position information being used to indicate a target installation position of the target hardware component on the current circuit board; Controlling the target installation device to install the target hardware component for the current circuit board according to the installation strategy, and when the installation is completed, transmitting the current circuit board with the target hardware component installed to the next installation device in the installation chain; The current circuit board is transmitted on the installation link by connecting to an adapted target daughter board and connecting the target daughter board to a target motherboard deployed on the installation link. The controller includes a monitoring module and an execution module. The monitoring module is used to monitor the link status of the installation link. The execution module is used to issue an installation task to the installation link. The monitoring module and the execution module are connected via an application programming interface. Before controlling the target installation device to install the target hardware component for the current circuit board according to the installation strategy, the method further includes: obtaining a first installation status of the current circuit board through the monitoring module, wherein the first installation status is used to indicate that the hardware component identified in the monitoring module as having been completely installed in the current circuit board; verifying the first installation status through a third reader deployed on the target installation device to obtain a first verification result of the first installation status, wherein the first verification result is used to indicate whether the reference hardware component identified in the monitoring module as having been completely installed in the current circuit board is installed in the corresponding reference installation position; if the first verification result is used to indicate that the reference hardware component identified in the monitoring module as having been completely installed in the current circuit board is installed in the corresponding reference installation position, controlling the target installation device to install the target hardware component for the current circuit board according to the installation strategy; After controlling the target installation device to install the target hardware component for the current circuit board according to the installation policy, the method further includes: marking the hardware component that has been installed by the target installation device in the current circuit board as having been installed in the monitoring module; Before transmitting the current circuit board with the target hardware component installed to the next installation device in the installation chain, the method further includes: obtaining a second installation status of the current circuit board through the monitoring module, wherein the second installation status is used to indicate that the target installation device has completed the installation of the updated hardware component for the current circuit board; verifying the second installation status through the third reader deployed on the target installation device to obtain a second verification result of the second installation status, wherein the second verification result is used to indicate whether the updated hardware component installed in the current circuit board by the target installation device is accurately installed in the corresponding updated installation position; when the second verification result is used to indicate that the updated hardware component installed in the current circuit board by the target installation device is accurately installed in the corresponding updated installation position, transmitting the current circuit board with the target hardware component installed to the next installation device in the installation chain.

2. The method according to claim 1, characterized in that The current circuit board is transmitted on the installation link by connecting the adapted target daughter board and connecting the target daughter board to the target mother board deployed on the installation link; The obtaining of the circuit board identifier of the current circuit board includes: Controlling a first reader deployed on the target mounting device to send a target read instruction to a first tag deployed on the target motherboard via a target electrical signal, wherein the target electrical signal is a radio signal, and the first tag is used to store identification information of the target motherboard; The identification information of the target motherboard sent by the first tag in a backscattering manner in response to the target read instruction is received as the circuit board identification.

3. The method according to claim 1, characterized in that The controller includes a monitoring module and an execution module, wherein the monitoring module is used to monitor the link status of the installation link, and the execution module is used to issue an installation task to the installation link according to the link status, and the monitoring module and the execution module are connected via an application programming interface; The detecting, according to the circuit board identifier, the installation strategy of the current circuit board under the target installation device includes: Acquire a target installation task for the current circuit board from the monitoring module according to the circuit board identifier, wherein the target installation task includes the component information and the location information corresponding to each installation device in the installation link; Extracting the target component information and the target location information corresponding to the target installation device from the target installation task; The installation policy is generated for the target installation device according to the target component information and the target location information, wherein the installation policy carries a target control instruction, and the target control instruction is used to control the target installation device to execute the installation policy.

4. The method according to claim 3, characterized in that The current circuit board is transmitted on the installation link by connecting the adapted target daughter board and connecting the target daughter board to the target mother board deployed on the installation link; Before acquiring the target installation task of the current circuit board from the monitoring module according to the circuit board identifier, the method further includes: controlling a second reader to read a second tag deployed on the target motherboard, wherein the second reader is deployed at a starting end of the installation link; parsing the second tag to obtain an identification code of the target motherboard, wherein the identification code is used to indicate identification information of the target motherboard; The identification code is transmitted to the execution module, wherein the execution module is used to obtain the target installation task of the current circuit board and establish a corresponding relationship between the target installation task and the target motherboard according to the identification code.

5. The method according to claim 4, characterized in that After transmitting the identification code to the execution module, the method further includes: Acquire the target installation task of the current circuit board and the identification code of the target motherboard through the execution module, and establish a first corresponding relationship between the target motherboard and the target installation task according to the identification code; Extracting the component information of each of the hardware components to be installed on the current circuit board and the position information of each of the hardware components to be installed in the current circuit board from the target installation task; Establishing a second correspondence between each piece of component information, each piece of location information, and the installation device included in the installation link; The first corresponding relationship and the second corresponding relationship are transmitted to the monitoring module through the application programming interface.

6. The method according to claim 5, characterized in that Before establishing the first corresponding relationship between the target motherboard and the target installation task according to the identification code, the method further includes: Detecting a connection status between the target daughter board and the target motherboard, wherein the connection status is used to indicate whether a connection relationship between the target motherboard and other daughter boards is stored in the execution module; In a case where the connection state indicates that the execution module stores a connection relationship between the target motherboard and other daughter boards, deleting the connection relationship between the target motherboard and other daughter boards stored in the execution module; and establishing a third corresponding relationship between the target motherboard and the target daughter board; In a case where the connection relationship between the target motherboard and other daughter boards is not stored in the execution module, a third corresponding relationship between the target motherboard and the target daughter board is constructed.

7. A mounting device for a circuit board component, characterized in that: The target assembly system includes a controller and an installation link, wherein the installation link includes a plurality of sequentially connected installation devices, the installation link is used to receive an initial circuit board of a hardware component to be installed, and sequentially transmit the initial circuit board to each of the installation devices and then output a target circuit board, the installation devices are used to install hardware components corresponding to the installation devices on the initial circuit board, and the device is applied to the controller, and the device includes: A receiving module, configured to receive an installation request, wherein the installation request is used to request a target installation device deployed at a link position corresponding to the current circuit board to install a hardware component for the current circuit board; A first obtaining module, configured to respond to the installation request and obtain a circuit board identifier of the current circuit board; a first detection module, configured to detect, based on the circuit board identifier, an installation strategy of the current circuit board under the target installation device, wherein the installation strategy includes target component information and target position information of the current circuit board, the target component information being used to indicate a target hardware component to be installed by the target installation device for the current circuit board, and the target position information being used to indicate a target installation position of the target hardware component on the current circuit board; a first control module, configured to control the target installation device to install the target hardware component on the current circuit board according to the installation strategy, and, upon completion of the installation, transmit the current circuit board with the target hardware component installed to the next installation device in the installation chain; The current circuit board is transmitted on the installation link by connecting to an adapted target daughter board and connecting the target daughter board to a target motherboard deployed on the installation link. The controller includes a monitoring module and an execution module. The monitoring module is used to monitor the link status of the installation link. The execution module is used to issue an installation task to the installation link. The monitoring module and the execution module are connected via an application programming interface. The first control module is further configured to: before controlling the target installation device to install the target hardware component for the current circuit board according to the installation strategy, obtain a first installation status of the current circuit board through the monitoring module, wherein the first installation status is used to indicate that the hardware component identified in the monitoring module as having been completely installed in the current circuit board; verify the first installation status through a third reader deployed on the target installation device to obtain a first verification result of the first installation status, wherein the first verification result is used to indicate whether the reference hardware component identified in the monitoring module as having been completely installed in the current circuit board is installed in the corresponding reference installation position; and control the target installation device to install the target hardware component for the current circuit board according to the installation strategy when the first verification result indicates that the reference hardware component identified in the monitoring module as having been completely installed in the current circuit board is installed in the corresponding reference installation position. After controlling the target installation device to install the target hardware component for the current circuit board according to the installation strategy, marking the hardware component that has been installed by the target installation device in the current circuit board as having been installed in the monitoring module; Before the current circuit board on which the target hardware component is installed is transferred to the next installation device in the installation chain, a second installation status of the current circuit board is obtained through the monitoring module, wherein the second installation status is used to indicate that the target installation device has completed the installation of the updated hardware component for the current circuit board; the second installation status is verified by the third reader deployed on the target installation device to obtain a second verification result of the second installation status, wherein the second verification result is used to indicate whether the updated hardware component installed in the current circuit board by the target installation device is accurately installed in the corresponding updated installation position; when the second verification result is used to indicate that the updated hardware component installed in the current circuit board by the target installation device is accurately installed in the corresponding updated installation position, the current circuit board on which the target hardware component is installed is transferred to the next installation device in the installation chain.

8. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, wherein the computer program implements the steps of the method according to any one of claims 1 to 6 when executed by a processor.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

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