Camera module and camera module preparation method

Abstract

The embodiments of the present application provide a camera module and a preparation method thereof, the camera module comprising: an optical assembly, comprising an optical lens and a driving assembly; an imaging assembly, located on the light-emitting side of the optical assembly, comprising a circuit board, a filter and a bracket, the filter being arranged on the bracket, the bracket being connected to the circuit board, and the circuit board being electrically connected to the driving assembly; and a filling body, the filling body being filled between the driving assembly and the bracket; wherein the driving assembly comprises a base, the base having a lower extension extending in a direction close to the circuit board, and at least one side of the lower extension being in contact with the filling body. The present application provides a filling body, so that the filling body is filled between the driving assembly and the bracket, and the lower extension is in contact with the filling body, thereby strengthening the connection between the driving assembly and the imaging assembly, so that under the impact of external force, the possibility and degree of movement of the driving assembly relative to the bracket are reduced, and the stability of the structure and electrical performance of the camera module is enhanced.

Description

Technical Field

[0001] The present application relates to the field of optical imaging technology, and more specifically, to a camera module and a method for preparing the camera module. Background Art

[0002] With the popularization of mobile electronic devices, the related technologies of camera modules used in mobile electronic devices to help users obtain images have also developed and progressed rapidly. The periscope camera module can achieve telephoto shooting under the premise of miniaturization of the camera module as a whole. It usually adopts the addition of reflective elements (such as prisms, mirrors, etc.) to allow the light incident on the lens to be reflected once or multiple times, and then pass through the lens to reach the imaging component for imaging.

[0003] In the related art, there are many reliability risks in the process of manufacturing camera modules, especially periscope camera modules, which often affect the performance of the camera modules and even cause the camera modules to fail. For example, in the reliability test of the camera module, it was found that part of the structure of the imaging component was easy to fall off, resulting in poor stability of the camera module and inability to use it normally. Summary of the invention

[0004] Embodiments of the present application provide a camera module and a method for preparing the camera module.

[0005] On the one hand, the present application provides a camera module, including: an optical component, including an optical lens and a driving component; an imaging component, located on the light-emitting side of the optical component, including a circuit board, a filter and a bracket, the filter is arranged on the bracket, the bracket is connected to the circuit board, and the circuit board is electrically connected to the driving component; and a filling body, the filling body is filled between the driving component and the bracket; wherein the driving component includes a base, the base has a downward extension portion extending in a direction close to the circuit board, and at least one side of the downward extension portion is in contact with the filling body.

[0006] The present application arranges a filling body so that the filling body is filled between the driving assembly and the bracket, and the lower extension portion contacts the filling body, thereby strengthening the connection between the driving assembly and the imaging assembly, so that under the impact of external force, the possibility and degree of movement of the driving assembly relative to the bracket are reduced, thereby enhancing the stability of the structure and electrical performance of the camera module.

[0007] According to an embodiment of the present application, a side of the lower extension portion close to the bracket is in contact with the filling body.

[0008] According to an embodiment of the present application, the base also has an inner extension portion perpendicular to the lower extension portion, and the camera module also includes a second connector, which connects the imaging component to the inner extension portion.

[0009] According to an embodiment of the present application, a side of the lower extension portion close to the bracket is in contact with the filling body, and a bottom of the inner extension portion is in contact with the filling body.

[0010] According to an embodiment of the present application, the filling body is also filled between the driving component and the circuit board, and the top of the circuit board is in contact with the filling body.

[0011] According to an embodiment of the present application, the bottom of the lower extension portion is in contact with the filling body.

[0012] According to an embodiment of the present application, the camera module also includes: a first connector, which connects the bracket to the circuit board; the elastic modulus of the filling body is lower than the elastic modulus of the first connector and lower than the elastic modulus of the second connector; the camera module also includes: a first protrusion, which is arranged on the bracket and extends from the bracket toward the lower extension along the second direction; a second protrusion, which is arranged on the lower extension and extends from the lower extension toward the bracket along the second direction.

[0013] According to an embodiment of the present application, the camera module includes two groups of second protrusions, the two groups of second protrusions are arranged on the same side of the lower extension portion, and the vertical projection of the first protrusion on the lower extension portion is located between the two groups of second protrusions.

[0014] According to an embodiment of the present application, the sum of the length of the first protrusion extending along the second direction and the length of any second protrusion extending along the second direction is not less than the distance between the bracket and the lower extension portion.

[0015] According to an embodiment of the present application, the base has two lower extensions, and the filling body is filled between the two lower extensions and the bracket.

[0016] According to an embodiment of the present application, the camera module also includes: a first protrusion, which is arranged on the bracket and extends from the bracket toward the two lower extensions along the second direction; a second protrusion, which is arranged on the two lower extensions and extends from the two lower extensions toward the bracket along the second direction.

[0017] According to an embodiment of the present application, the driving component includes: a base; a carrier, the carrier is arranged on the base, and the carrier is movable relative to the base; the optical lens includes: a first lens group, the first lens group is arranged on the base; a second lens group, the second lens group is located between the first lens group and the imaging component, the second lens group is arranged on the carrier, and moves with the carrier relative to the first lens group; and the optical component also includes: a reflective element, the reflective element is located on the optical path of the optical lens, and is rotatably arranged on the base.

[0018] According to an embodiment of the present application, the circuit board includes an imaging connection portion, the imaging connection portion is located outside the bracket, and the imaging connection portion is electrically connected to the driving component.

[0019] According to an embodiment of the present application, a driving connection portion is provided at a bottom end of one side of the lower extension portion, and the circuit board is electrically connected to the driving connection portion.

[0020] Another aspect of the present application provides a method for preparing a camera module, including: forming an optical assembly, the optical assembly including an optical lens and a driving assembly; setting an imaging assembly on the light-emitting side of the optical assembly, the imaging assembly including a circuit board, a filter and a bracket, setting the filter on the bracket, and connecting the bracket to the circuit board; electrically connecting the driving assembly to the circuit board; and filling a filling body between the driving assembly and the bracket, wherein the driving assembly includes a base, the base has a downward extension portion extending in a direction close to the circuit board, so that at least one side of the downward extension portion is in contact with the filling body.

[0021] According to an embodiment of the present application, a filling body is filled between the drive assembly and the bracket, including: a first arrangement of the gap between the bracket and the drive assembly along a third direction to form a portion of the filling body; and flipping the bracket and the drive assembly, and a second arrangement of the gap between the bracket and the drive assembly along the third direction to form another portion of the filling body.

[0022] According to an embodiment of the present application, the camera module preparation method further includes: after forming a portion of the filling body, pre-curing a portion of the filling body. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0024] Figure 1 is a schematic cross-sectional structure diagram of a camera module according to an embodiment of the present application;

[0025] Figure 2 is a schematic diagram of a partial structure of an imaging assembly according to an embodiment of the present application;

[0026] Figure 3 is a schematic structural diagram of a camera module according to an embodiment of the present application;

[0027] Figure 4 is a structural schematic diagram of a camera module according to another embodiment of the present application;

[0028] Figure 5 is a schematic diagram of a partial cross-sectional structure of a camera module according to an embodiment of the present application;

[0029] Figure 6 is a schematic diagram of a partial cross-sectional structure of a camera module according to another embodiment of the present application;

[0030] Figure 7 is a schematic diagram of a partial cross-sectional structure of a camera module according to another embodiment of the present application;

[0031] Figure 8is a schematic diagram of a partial cross-sectional structure of a camera module according to another embodiment of the present application;

[0032] Fig. 9 is a schematic diagram of a partial cross-sectional structure of a camera module according to another embodiment of the present application;

[0033] Fig.10 is a partial structural schematic diagram of a camera module according to an embodiment of the present application;

[0034] Fig.11 is a flow chart of preparing a camera module according to an embodiment of the present application;

[0035] Fig.12 is a partial structural schematic diagram of a camera module according to an embodiment of the present application; and

[0036] Fig.13 A schematic structural diagram of a second protrusion according to an embodiment of the present application is shown.

[0037] In the attached figure:

[0038] 1. Camera module; 10. Optical component; 11. Driving component; 111. Base; 1111. Lower extension; 1112. Inner extension; 112. Shell; 113. Driving connection; 114. Carrier; 12. Optical lens; 121. First lens group; 122. Second lens group; 13. Reflective element; 20. Imaging component; 21. Circuit board; 211. Circuit board body; 2111. Imaging connection; 212. Connecting belt; 22. Photosensitive chip; 23. Electronic components; 24. Bracket; 25. Filter; 26. Reinforcement plate; 30. First connector; 40. Electrical connector; 50. Filling body; 51. First part of filling body; 52. Second part of filling body; 53. Third part of filling body; 54. Fourth part of filling body; 60. Second connector; 70. First protrusion; 80. Second protrusion. DETAILED DESCRIPTION

[0039] In order to better understand the present application, a more detailed description will be made of various aspects of the present application with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of exemplary embodiments of the present application, and are not intended to limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0040] It should be noted that in this specification, the expressions first, second, third, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the feature. Therefore, without departing from the teaching of the present application, the first surface discussed below may also be referred to as the second surface. And vice versa.

[0041] In the drawings, the thickness, size and shape of the components have been slightly adjusted for ease of illustration. The drawings are for illustration only and are not drawn strictly to scale. As used herein, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not as terms of degree, and are intended to account for the inherent deviations in measurements or calculations that would be recognized by one of ordinary skill in the art.

[0042] It should also be understood that expressions such as "include", "including", "have", "contain" and / or "comprising" are open rather than closed expressions in this specification, which indicate the presence of the stated features, elements and / or components, but do not exclude the presence of one or more other features, elements, components and / or combinations thereof. In addition, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire list of features rather than just the individual elements in the list. In addition, when describing embodiments of the present application, "may" is used to mean "one or more embodiments of the present application". And, the term "exemplary" is intended to refer to an example or illustration.

[0043] Unless otherwise defined, all words (including engineering terms and scientific and technological terms) used in this article have the same meaning as those commonly understood by ordinary technicians in the field to which this application belongs. It should also be understood that unless there is a clear explanation in this application, words defined in commonly used dictionaries should be interpreted as having the same meaning as their meaning in the context of the relevant technology, and should not be interpreted in an idealized or overly formal sense.

[0044] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. In addition, unless explicitly limited or contradictory to the context, the specific steps included in the camera module recorded in the present application are not necessarily limited to the recorded order, but can be performed in any order or in parallel. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0045] Figure 1 It is a schematic diagram of the cross-sectional structure of a camera module according to an exemplary embodiment of the present application.

[0046] like Figure 1 As shown, the camera module 1 includes: an optical component 10 and an imaging component 20. The imaging component 20 is arranged on the light-emitting side of the optical component 10. The imaging component 20 receives the light converged from the optical component 10 for imaging.

[0047] In an exemplary embodiment, the optical assembly 10 may include a driving assembly 11 and an optical lens 12 mounted on the driving assembly 11, wherein the driving assembly 11 may drive the entire optical lens 12 or at least a portion of the optical lens 12 to move to achieve adjustment of the optical performance of the camera module 1. For example, optical image stabilization function: the driving assembly 11 drives the entire optical lens 12 or at least a portion of the optical lens 12 to move in a direction perpendicular to the optical axis to achieve the optical image stabilization function; optical zoom or optical focus function: the driving assembly 11 drives the entire optical lens 12 or at least a portion of the optical lens 12 to move in a direction parallel to the optical axis to achieve the optical focus or optical zoom function.

[0048] In an exemplary embodiment, the driving component 11 may include a base 111, a carrier 114, and a driving unit (not shown in the drawings). The carrier 114 is movably disposed in the base 111, and the driving unit is used to drive the carrier 114 to move relative to the base 111. Exemplarily, the driving unit may be a coil-magnet pair, a piezoelectric actuator, or an SMA actuator, which is not limited in the present application. When the driving unit is a coil-magnet pair, the magnet may be fixed to the carrier 114, and the coil may be fixed to the base 111, and then the carrier 114 may be driven to move by energizing the coil. In such an embodiment, the installation positions of the coil and the magnet are interchangeable, that is, the magnet may be fixed to the base 111, and the coil may be fixed to the carrier 114.

[0049] In an exemplary embodiment, the driving assembly 11 may further include a housing 112, and the housing 112 may be engaged with the base 111 to form a receiving cavity for receiving other components. In an exemplary embodiment, the optical lens 12 may be disposed in the receiving cavity.

[0050] In an exemplary embodiment, the optical lens 12 may include a lens barrel and at least one optical lens accommodated in the lens barrel.

[0051] In an exemplary embodiment, the optical lens 12 may include a first lens group 121 and a second lens group 122. The first lens group 121 may be disposed on the base 111, the second lens group 122 may be disposed on the carrier 114, and the second lens group 122 may be located between the first lens group 121 and the imaging assembly 20. In such an embodiment, the second lens group 122 is disposed in the carrier 114 that can move relative to the base 111, and can be driven by the driving unit as the carrier 114 moves relative to the base 111 and the first lens group 121 disposed on the base 111 in a direction parallel to the optical axis of the second lens group 122, thereby realizing the optical focus or optical zoom function of the camera module 1.

[0052] In an exemplary embodiment, the optical assembly 10 may further include at least one reflective element 13, which may be disposed on the object side, image side, or between two lens groups of the optical lens 12, thereby folding the imaging optical path of the camera module 1 to form a periscope camera module. In an exemplary embodiment, the reflective element 13 is disposed on the object side of the optical lens 12, and the reflective element 13 is rotatably disposed in the base 111, and the optical image stabilization function of the camera module 1 may be realized by rotating the reflective element 13.

[0053] Figure 2 FIG. 1 is a schematic diagram of a partial structure of an imaging assembly according to an embodiment of the present application. In an exemplary embodiment, as Figure 1 and Figure 2 As shown, the imaging assembly 20 may include a circuit board 21, a photosensitive chip 22, at least one electronic component 23, a bracket 24, and a filter 25. The circuit board 21 may include a circuit board body 211 and a connecting strip 212, wherein the connecting strip 212 may be electrically connected to the circuit board body 211 so as to electrically connect the circuit board body 211 to an external electronic device; the photosensitive chip 22 may be electrically connected to the circuit board 21, specifically, to the circuit board body 211; at least one electronic component 23 may be arranged around the photosensitive chip 22 and electrically connected to the circuit board 21, specifically, to the circuit board body 211. The electronic component 23 may be, for example, a passive device such as a resistor, a capacitor, an inductor, or an active device such as a driving chip or a sensor; the filter 25 may be arranged on the bracket 24; the bracket 24 may be connected to the circuit board 21, specifically, to the circuit board body 211, so that the filter 25 is supported above the photosensitive chip 22 through the bracket 24.

[0054] Figure 3 is a structural schematic diagram of a camera module according to an embodiment of the present application, Figure 4 FIG. 2 is a schematic diagram of a camera module according to another embodiment of the present application. In an exemplary embodiment, the connecting belt 212 may be as follows: Figure 3 The portion shown is attached to the outside of the housing 112, and may also be Figure 4 The connecting strip 212 is not attached to the housing 112 , and the present application does not limit this, and does not limit the shape of the connecting strip 212 .

[0055] In an exemplary embodiment, the imaging assembly 20 may further include a reinforcing plate 26 , which is connected to the circuit board body 211 and is located on the back side of the circuit board body 211 on which the bracket 24 is disposed.

[0056] Figure 5 is a schematic diagram of a partial cross-sectional structure of a camera module according to an embodiment of the present application. In an exemplary embodiment, as Figure 5As shown, the camera module 1 may further include a first connector 30, which connects the bracket 24 to the circuit board 21, and specifically fixes the bottom surface of the bracket 24 to the front surface of the circuit board body 211. In an exemplary embodiment, the first connector 30 may be glue. In an exemplary embodiment, the camera module 1 may further include a second connector 60, and the imaging component 20 and the driving component 11 may also be fixedly arranged by the second connector 60, and specifically, the second connector 60 connects the base 111 to the bracket 24. The second connector 60 may be glue, for example.

[0057] In an exemplary embodiment, if Figure 2 As shown, the camera module 1 may have a first direction X, a second direction Y and a third direction Z. The first direction X may be a direction perpendicular to the circuit board body 211, and the bracket 24 may be arranged on the circuit board body 211 along the first direction X; the second direction Y is perpendicular to the first direction X, and the third direction Z is perpendicular to both the first direction X and the second direction Y, that is, the first direction X, the second direction Y and the third direction Z are perpendicular to each other, the second direction Y and the third direction Z are parallel to the circuit board body 211, the second direction Y may extend along the length direction of the photosensitive chip 22, and the third direction Z may extend along the width direction of the photosensitive chip 22.

[0058] In an exemplary embodiment, if Figure 2 As shown, the size of the circuit board body 211 along the second direction Y can be greater than the size of the bracket 24 along the second direction Y, so that at least part of the circuit board body 211 is not covered by the bracket 24 and the filter 25 disposed on the bracket 24 in the second direction Y. At least one side of the circuit board body 211 has at least one imaging connection portion 2111, and the imaging connection portion 2111 is disposed at a position on the circuit board body 211 that is not covered by the bracket 24, and the imaging connection portion 2111 is electrically connected to the driving assembly 11. It can also be said that the imaging connection portion 2111 is located outside the bracket 24. In an exemplary embodiment, a plurality of imaging connection portions 2111 are disposed on both sides of the circuit board body 211, at a position that is not covered by the bracket 24.

[0059] In an exemplary embodiment, if Figure 5 As shown, the driving component 11 may include a driving connection part 113, and the circuit board 21 may be electrically connected to the driving connection part 113. Specifically, the driving component 11 may be electrically connected to the imaging connection part 2111 on the circuit board body 211 through the driving connection part 113, thereby realizing the electrical connection between the driving component 11 and the imaging component 20.

[0060] In an exemplary embodiment, if Figure 5As shown, the camera module 1 may further include an electrical connector 40, which electrically connects the drive assembly 11 to the circuit board 21. In an exemplary embodiment, the electrical connector 40 may be a conductive medium, such as solder, i.e., solder or other tin-containing welding medium. In such an embodiment, the imaging assembly 20 and the drive assembly 11 are electrically connected by welding.

[0061] In an exemplary embodiment, if Figure 5 As shown, the base 111 (e.g., the side wall of the base 111) may have a lower extension 1111, and the lower extension 1111 may extend in a direction close to the circuit board 21, specifically, along the X direction, in a direction close to the circuit board body 211, for example, it may extend to the outside of the bracket 24. A driving connection portion 113 may be provided on one side of the lower extension 1111. The driving connection portion 113 may be provided on the side of the lower extension 1111 facing away from the bracket 24. In such an embodiment, the imaging connection portion 2111 is closer to the outside of the circuit board body 211 than the bracket 24 and the driving connection portion 113, and the electrical connection body 40 is closer to the outside of the circuit board body 211 than the bracket 24. In an exemplary embodiment, the driving connection part 113 may be, for example, a conductive member embedded in the bottom of the lower extension part 1111 on the side facing away from the bracket 24, and the side of the conductive member close to the circuit board body 211 away from the bracket 24 may be exposed to facilitate welding; the driving connection part 113 may also be, for example, a circuit board 21 attached to the bottom of the lower extension part 1111 on the side facing away from the bracket 24, in such an embodiment, the imaging connection part 2111 may be a pad for conducting electricity. In an exemplary embodiment, the lower extension part 1111 may be, for example, a plastic part.

[0062] In an exemplary embodiment, the imaging assembly 20 and the base 111 may be assembled by active calibration, and in such an embodiment, an air gap may be reserved between the base 111 and the imaging assembly 20. In an exemplary embodiment, the minimum size of the air gap between the bracket 24 of the imaging assembly 20 and the lower extension 1111 of the base 111 may be greater than or equal to 0.1 mm to provide space for active calibration. Preferably, the size may be greater than 0.2 mm.

[0063] Figures 6 to 9 is a schematic diagram of a partial cross-sectional structure of a camera module according to an embodiment of the present application. In an exemplary embodiment, as Figures 6 to 9 As shown, the camera module 1 may further include a filler 50, which is filled between the driving assembly 11 and the bracket 24. The filler 50 may be, for example, glue, which may change shape to adapt to the filled air gap. Figures 6 to 9 As shown, at least one side of the lower extension portion 1111 is in contact with the filling body 50 .

[0064] The inventor of the present application found that the bracket 24 in the imaging component 20 is connected to the circuit board 21 through the first connector 30, and the driving component 11 and the circuit board 21 are connected through the electrical connector 40. When the first connector 30 is glue and the electrical connector 40 is a conductive medium, the stability of the connection using the electrical connector 40 is greater than the stability of the connection using the first connector 30, that is, the stability of the connection between the driving component 11 and the circuit board 21 (specifically, between the imaging connection part 2111 and the driving connection part 113) is greater than the stability of the connection between the bracket 24 and the circuit board 21. In addition, a certain air gap needs to be left between the imaging component 20 and the lower extension part 1111, especially when the assembly between the imaging component 20 and the base 111 is performed by active calibration, more space needs to be reserved between the base 111 and the imaging component 20 for translation, and the air gap will be larger at this time. Due to the existence of the air gap and the lower extension 1111, and the fact that the imaging connection part 2111 needs to be arranged closer to the outside than the driving connection part 113, the electrical connection body 40 is far away from the first connection body 30 (or the bonding position of the bracket 24). When subjected to external force impact, when there is a tendency for the distance between the lower extension 1111 located on the outside and the circuit board body 211 to increase or translate, the difference in stability between the connection using the first connection body 30 and the connection using the electrical connection body 40 becomes more obvious, causing the driving connection part 113 fixed to the lower extension 1111 to pull the imaging connection part 2111 through the conductive medium (solder), creating the risk of the imaging connection part 2111 being separated from the circuit board body 211, thereby causing the electrical performance of the camera module 1 to fail.

[0065] The present application sets a filling body 50 so that the filling body 50 is filled between the driving component 11 and the bracket 24, and the lower extension portion contacts the filling body, thereby strengthening the connection between the driving component 11 and the imaging component 20, so that under the impact of external force, the possibility and degree of movement of the driving component 11 relative to the bracket 24 are reduced, thereby reducing the risk of the imaging connection part 2111 being separated from the circuit board body 211, and enhancing the stability of the structure and electrical performance of the camera module 1.

[0066] In an exemplary embodiment, if Figure 6 As shown, the side of the lower extension 1111 close to the bracket 24 contacts the filling body 50, so that the lower extension 1111 and the bracket 24 form a whole, so that under the impact of external force, the degree of movement of the lower extension 1111 relative to the bracket 24 is reduced, thereby reducing the risk of the imaging connection part 2111 being separated from the circuit board body 211. In such an embodiment, the filling body 50 can play a role in buffering and absorbing stress.

[0067] In an exemplary embodiment, if Figure 5As shown, the base 111 may also have an inner extension portion 1112 perpendicular to the lower extension portion 1111, and the second connector 60 connects the imaging assembly 20 to the inner extension portion 1112. In an exemplary embodiment, the bottom of the inner extension portion 1112 and the top of the bracket 24 (i.e., the side of the bracket 24 away from the circuit board body 211) contact the second connector 60.

[0068] In an exemplary embodiment, if Figure 7 As shown, the side of the lower extension 1111 close to the bracket 24 contacts the filling body 50, and the bottom of the inner extension 1112 contacts the filling body 50, which can further increase the area of ​​the filling body 50 contacting the base 111 and reduce the difficulty of setting the filling body 50. In such an embodiment, the filling body 50 and the second connector 60 can fill the gap between the inner side of the lower extension 1111 and the outer side of the bracket 24, and the gap between the inner extension 1112 and the bracket 24.

[0069] In an exemplary embodiment, the filler 50 is also filled between the driving assembly 11 and the circuit board 21, and the top of the circuit board 21 is in contact with the filler 50. Specifically, Figure 8 As shown, the top of the circuit board body 211 is in contact with the filling body 50, so that the lower extension portion 1111, the bracket 24 and the circuit board body 211 (especially the outer area of ​​the circuit board body 211) form a whole, so that the outer area of ​​the circuit board body 211 and the lower extension portion 1111 are filled by the filling body 50, thereby reducing the risk of the imaging connection portion 2111 being separated from the circuit board body 211.

[0070] In an exemplary embodiment, if Fig. 9 As shown, the bottom of the lower extension 1111 can contact the filler 50 to further strengthen the connection between the lower extension 1111 and the outer area of ​​the circuit board body 211. In such an embodiment, the first connector filler 50 can fill the gap between the top of the circuit board body 211 and the bottom of the lower extension 1111, the gap between the inner side of the lower extension 1111 and the outer side of the bracket 24, and the gap between the inner extension 1112 and the top of the circuit board body 211. In one example, the filler 50 can also contact the electrical connector 40, thereby maximizing the buffering and stress absorption functions.

[0071] In the above embodiment, the shape of the filling body 50 varies with the gap to be filled, and the present application does not limit the shape of the filling body 50. The present application also does not limit the shapes of the first connector 30, the electrical connector 40, and the second connector 60.

[0072] Fig.10 FIG. 1 is a schematic diagram of a partial structure of a camera module according to an embodiment of the present application. In an exemplary embodiment, as Fig.10As shown, the camera module 1 may further include a first protrusion 70 and a second protrusion 80. The first protrusion 70 is arranged on the bracket 24 and extends from the bracket 24 toward the lower extension 1111 along the second direction Y; the second protrusion 80 is arranged on the lower extension 1111 and extends from the lower extension 1111 toward the bracket 24 along the second direction Y. The inventor of the present application found that when the filling body 50 is arranged, the arrangement from one end opening of the gap between the lower extension 1111 and the bracket 24 toward the other end opening along the third direction Z may cause the filling body 50 to overflow from the other end opening, resulting in poor filling effect. In this embodiment, by arranging the first protrusion 70 and the second protrusion 80, the gap between the bracket 24 and the lower extension 1111 has a bent shape, which can prevent the filling body 50 from overflowing from the opening of the gap between the lower extension 1111 and the bracket 24, especially preventing the filling body 50 that has just been arranged and has not yet solidified from overflowing. In an exemplary embodiment, the first protrusion 70 and the second protrusion 80 are staggered. In the exemplary embodiment, the filling body 50 is divided into two parts by the first protrusion 70, and there is a gap between the two parts. In the exemplary embodiment, the two parts into which the filling body 50 is divided are respectively located at both ends of the lower extension part 1111 along the third direction Z.

[0073] In an exemplary embodiment, the camera module 1 may include two groups of second protrusions 80, the two groups of second protrusions 80 may be arranged on the same side of the lower extension 1111, and the vertical projection of the first protrusion 70 on the lower extension 1111 may be located between the two groups of second protrusions 80. In an exemplary embodiment, the first protrusion 70 may be located in the middle area of ​​the side of the bracket 24 close to the lower extension 1111. The first protrusion 70 may be located in the middle area of ​​the side of the bracket 24 close to the lower extension 1111, which may reduce the requirement for the gap size between the bracket 24 and the lower extension 1111, reduce the impact on the active calibration between the imaging component 20 and the optical component 10, reduce the thinning degree of the bracket 24 or the lower extension 1111, and prevent the overall size of the camera module 1 from increasing; and the two parts of the filling body 50 may also be similar in size. In an exemplary embodiment, each group of second protrusions 80 may have two protrusions, and the two protrusions are arranged at an interval, wherein one of the protrusions may be arranged at an edge of the lower extension portion 1111 and flush with the side wall of the base 111 .

[0074] In an exemplary embodiment, the sum of the length of the first protrusion 70 extending along the second direction Y and the length of any second protrusion 80 extending along the second direction Y is not less than the distance between the bracket 24 and the lower extension 1111. In other words, when viewed along the third direction Z, the first protrusion 70 and the second protrusion 80 at least partially overlap, which can enhance the bending of the gap between the bracket 24 and the lower extension 1111, and further prevent the filling body 50 from overflowing from the opening of the gap between the lower extension 1111 and the bracket 24.

[0075] In such an embodiment, even if the bracket 24 and the lower extension 1111 are respectively provided with the first protrusion 70 and the second protrusion 80, the gap between the two still needs to be large enough to ensure that the active calibration between the imaging component 20 and the optical component 10 is not affected, and the minimum size of the gap between the bracket 24 and the lower extension 1111 can be greater than or equal to 0.1 mm. Preferably, the size can be greater than or equal to 0.2 mm.

[0076] In an exemplary embodiment, the base 111 may have two lower extensions 1111, and the filling body 50 is filled between the two lower extensions 1111 and the bracket 24. In such an embodiment, the two lower extensions 1111 are respectively located on both sides of the bracket 24 and are arranged opposite to each other along the second direction Y. The two lower extensions 1111 can enhance the stability of the connection between the bracket 24 and the driving assembly 11, and are arranged along the second direction Y instead of the third direction Z, so that the size of the camera module 1 in the third direction Z can be small, meeting the miniaturization requirements of the periscope camera module 1, so that the camera module 1 can adapt to thinner mobile electronic devices.

[0077] In an exemplary embodiment, the first protrusions 70 extend from the bracket 24 along the second direction Y toward the two lower extensions 1111, respectively, and the second protrusions 80 extend from the two lower extensions 1111 along the second direction Y toward the bracket 24, respectively, and the first protrusions 70 and the second protrusions 80 are staggered. In such an embodiment, the filler 50 is divided into four parts by the two first protrusions 70. In an exemplary embodiment, there is a certain gap between the two parts of the filler 50 distributed along the third direction Z. In an exemplary embodiment, the two parts of the filler 50 distributed along the third direction Z are respectively located at the two ends of the lower extension 1111 along the third direction Z. In such an embodiment, the positions of the four parts into which the filler 50 is divided are symmetrical, so that the force of the four parts of the filler 50 when contracting acts evenly on the bracket 24 and the circuit board 21, which can reduce the risk of the filter 25 disposed on the bracket 24 being broken.

[0078] Another aspect of the present application provides a camera module preparation method, by which the camera module 1 of any of the above embodiments can be prepared. Fig.11 FIG. 1 shows a flow chart of the preparation of a camera module according to an embodiment of the present application. Fig.11As shown, it includes: step S100: forming an optical component 10, the optical component includes an optical lens 12 and a driving component 11; step S200: setting an imaging component 20 on the light-emitting side of the optical component 10, the imaging component 20 includes a circuit board 21, a filter 25 and a bracket 24, the filter 25 is set on the bracket 24, and the bracket 24 is connected to the circuit board 21; step S300: electrically connecting the circuit board 21 to the driving component 11; and step S400: filling a filling body 50 between the driving component 11 and the bracket 24, wherein the driving component 11 includes a base 111, the base 111 has a lower extension portion 1111 extending in a direction close to the circuit board 21, so that at least one side of the lower extension portion 1111 is in contact with the filling body 50.

[0079] In an exemplary embodiment, the imaging assembly 20 and the driving assembly 11 may be electrically connected by welding.

[0080] In an exemplary embodiment, filling the filling body 50 between the drive assembly 11 and the bracket 24 may include: first laying out the gap between the bracket 24 and the drive assembly 11 along the third direction Z to form a portion of the filling body 50; flipping the bracket 24 and the drive assembly 11, and secondly laying out the gap between the bracket 24 and the drive assembly 11 along the third direction to form another portion of the filling body 50. The inventor of the present application found that since the gap between the bracket 24 and the lower extension 1111 is relatively long along the first direction X and the third direction Z, if only one laying is performed, more glue needs to be laid out, and the laying equipment also needs to be laid deep into the gap, which makes laying difficult, and there is a risk of glue leaking from the other end after laying out more glue. Therefore, in the present application, the above two layings are designed to form a two-part filling body 50. In such an embodiment, there may be a gap (e.g., an air gap) between the two parts of the filling body 50.

[0081] Furthermore, along the third direction Z, the gap between the bracket 24 and the driving assembly 11 is arranged.

[0082] In an exemplary embodiment, the viscosity of the filler 50 before curing can be 15000cps~20000cps, so that the filler 50 has a certain fluidity but does not seep, that is, the filler 50 is not easy to overflow the gap between the bracket 24 and the drive assembly 11 when it is not cured.

[0083] In an exemplary embodiment, the method further includes: after forming a portion of the filling body 50, a portion of the filling body 50 can be pre-cured. Preferably, a portion of the filling body 50 is pre-cured after each formation of a portion of the filling body 50, and after forming the complete filling body 50, the filling body 50 is baked to achieve the curing of the filling body 50. In an exemplary embodiment, the filling body 50 can be a UV thermosetting adhesive, which can be pre-cured by UV light irradiation and then completely cured by baking. In such an embodiment, since the gap between the bracket 24 and the lower extension 1111 has a deep depth, it is difficult for light to penetrate deeply, and the use of UV light for pre-curing can only pre-cure the surface of the filling glue. Preferably, the filling body 50 can be a transparent UV thermosetting adhesive so that light can penetrate deeply.

[0084] In an exemplary embodiment, the filler 50 may be a thermosetting adhesive, and pre-curing the filler 50 in this embodiment can avoid unnecessary flow of the filler 50 during the process of transferring the camera module 1 to the oven for baking. In such an embodiment, the filler 50 can be pre-cured by temporary heating.

[0085] In an exemplary embodiment, the filler 50 can be a moisture-curing glue (silicone or polyurethane resin). After each part of the filler 50 is laid out, the surface is cured (pre-cured) within 7 minutes and is fully cured in 24 hours. That is, in this embodiment, the filler 50 does not need to be baked to achieve complete curing.

[0086] In an exemplary embodiment, the elastic modulus of the cured filler 50 can be between 300Mpa and 800Mpa, so that the filler 50 plays a good buffering role and has good adhesion. In an exemplary embodiment, the elastic modulus of the filler 50 is lower than the elastic modulus of the second connector 60, and the elastic modulus of the filler 50 is lower than the elastic modulus of the first connector 30. The elastic modulus of the first connector 30 and the second connector 60 are both above 1000Mpa, so that the first connector 30 and the second connector 60 can respectively ensure the bonding effect between the bracket 24 and the circuit board body 211, the base 111 and the bracket 24. In such an embodiment, due to the setting of the filler 50 and the filler 50 having a smaller elastic modulus, the risk of cracking of the filter 25 and the second connector 60 when subjected to external force impact can be further reduced, and the stress generated under the external force impact can be absorbed.

[0087] Fig.12 FIG. 1 is a schematic diagram of a partial structure of a camera module according to an embodiment of the present application. In an exemplary embodiment, as Fig.12As shown, a filling body 50 is arranged between the driving component 11 and the bracket 24, including: a first arrangement of the gap between the bracket 24 and the driving component 11 along a third direction Z to form a first partial filling body 51; flipping the bracket 24 and the driving component 11, and a second arrangement of the gap between the bracket 24 and the driving component 11 along the third direction to form a second partial filling body 52.

[0088] In an exemplary embodiment, if Fig.10 As shown, the camera module 1 includes two groups of second protrusions 80, and the two groups of second protrusions 80 are located on the same side of the lower extension portion 1111. The vertical projection of the first protrusion 70 on the lower extension portion 1111 is located between the two groups of second protrusions 80, so that the two layout operations can be consistent during the two layouts, so that the two parts of the formed filling body 50 are of similar size.

[0089] In an exemplary embodiment, if Fig.12 As shown, the base 111 has two lower extensions 1111, and the filling body 50 connects the two lower extensions 1111 to the bracket 24. In such an embodiment, four layouts are required, namely: along the third direction Z, the gap between the bracket 24 and the drive assembly 11 is laid out for the first time to form a first part of the filling body 51; the bracket 24 and the drive assembly 11 are flipped over, and the gap between the bracket 24 and the drive assembly 11 is laid out for the second time along the third direction Z to form a second part of the filling body 52; the bracket 24 and the drive assembly 11 are flipped over, and the gap between the bracket 24 and the drive assembly 11 is laid out for the third time along the third direction Z to form a third part of the filling body 53; the bracket 24 and the drive assembly 11 are flipped over, and the gap between the bracket 24 and the drive assembly 11 is laid out for the fourth time along the third direction Z to form a fourth part of the filling body 54.

[0090] The figure shows the first part of the filling body 51, the second part of the filling body 52, the third part of the filling body 53 and the fourth part of the filling body 54 respectively. The four parts of the filling body 50 are symmetrically positioned. Specifically, the first part of the filling body 51 and the fourth part of the filling body 54 are distributed along the second direction Y, and the second part of the filling body 52 and the third part of the filling body 53 are distributed along the second direction Y; the first part of the filling body 51 and the second part of the filling body 52 are distributed along the third direction Z, and the fourth part of the filling body 54 and the third part of the filling body 53 are distributed along the third direction Z. In the process of four layouts, the operations of the four layouts can be made consistent, so that the four parts of the filling body 50 formed are similar in size. In addition, the force of the four parts of the filling body 50 when they shrink is uniform on the bracket 24 and the circuit board body 211, reducing the risk of the filter 25 breaking. The "first", "second", "third" and "fourth" here are only for the convenience of understanding, and the present application does not limit the order of layout.

[0091] In an exemplary embodiment, the method further includes: arranging the gap between the bracket 24 and the drive assembly 11 for the first time along the third direction Z to form a first partial filling body 51; arranging the gap between the bracket 24 and the drive assembly 11 for the second time along the third direction Z to form a fourth partial filling body 54 distributed along the second direction Y with the first partial filling body 51; flipping the bracket 24 and the drive assembly 11, arranging the gap between the bracket 24 and the drive assembly 11 for the third time along the third direction Z to form a second partial filling body 52 distributed along the third direction Z with the first partial filling body 51; arranging the gap between the bracket 24 and the drive assembly 11 for the fourth time along the third direction Z to form a third partial filling body 53 distributed along the second direction Y with the second partial filling body 52. ​​In this embodiment, only one flipping is required to complete the arrangement of the filling body 50. In such an embodiment, after forming the first partial filler 51 and the fourth partial filler 54, the first partial filler 51 and the fourth partial filler 54 can be pre-cured; after forming the second partial filler 52 and the third partial filler 53, the second partial filler 52 and the third partial filler 53 can be pre-cured, and then the filler 50 can be baked to achieve the curing of the filler 50.

[0092] Fig.13 FIG. 8 is a schematic diagram showing the structure of the second protrusion 80 according to an embodiment of the present application. In an exemplary embodiment, as shown in FIG. Fig.13 As shown, the second protrusion 80 may be in a trapezoidal shape, and the length of the second protrusion 80 extending along the second direction Y gradually increases from the side away from the inner extension 1112 along the first direction X to the direction close to the inner extension 1112, so that the gap between the lower extension 1111 and the bracket 24 is wide outside and narrow inside, so as to facilitate layout. In such an embodiment, the sum of the length of the first protrusion 70 extending along the second direction Y and the height of any trapezoidal second protrusion 80 is not less than the distance between the bracket 24 and the lower extension 1111. In other words, when viewed along the third direction Z, the first protrusion 70 and the second protrusion 80 at least partially overlap.

[0093] The above description is only an implementation method of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of protection involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the technical concept. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other to form a technical solution.

Claims

1. A camera module, characterized in that: include: Optical components, including optical lenses and drive components; An imaging component, located at the light-emitting side of the optical component, comprises a circuit board, a filter and a bracket, wherein the filter is arranged on the bracket, the bracket is connected to the circuit board, and the circuit board is electrically connected to the driving component; as well as A filling body, wherein the filling body is filled between the driving assembly and the bracket; Wherein, the driving assembly comprises a base, the base has a lower extension portion extending in a direction close to the circuit board, and at least one side of the lower extension portion is in contact with the filling body; The base further comprises an inner extension portion perpendicular to the lower extension portion, and the camera module further comprises a second connector, which connects the imaging assembly to the inner extension portion; The camera module also includes: a first connector, the first connector connecting the bracket to the circuit board; The elastic modulus of the filling body is lower than the elastic modulus of the first connecting body, and lower than the elastic modulus of the second connecting body.

2. The camera module according to claim 1, characterized in that: A side of the lower extension portion close to the bracket contacts the filling body.

3. The camera module according to claim 1, characterized in that: A side of the lower extension portion close to the bracket contacts the filling body, and a bottom of the inner extension portion contacts the filling body.

4. The camera module according to any one of claims 1 to 3, characterized in that: The filling body is also filled between the driving component and the circuit board, and the top of the circuit board is in contact with the filling body.

5. The camera module according to claim 4, characterized in that: The bottom of the lower extension portion contacts the filling body.

6. The camera module according to claim 1, characterized in that: The camera module also includes: A first protrusion is disposed on the bracket and extends from the bracket toward the lower extension along a second direction; The second protrusion is disposed on the lower extension portion and extends from the lower extension portion toward the bracket along the second direction.

7. The camera module according to claim 6, characterized in that: The camera module includes two groups of the second protrusions, the two groups of the second protrusions are arranged on the same side of the lower extension, and the vertical projection of the first protrusion on the lower extension is located between the two groups of the second protrusions.

8. The camera module according to claim 6, characterized in that: The sum of the length of the first protrusion extending along the second direction and the length of any second protrusion extending along the second direction is not less than the distance between the bracket and the lower extension portion.

9. The camera module according to claim 1, characterized in that: The base has two lower extensions, and the filling body is filled between the two lower extensions and the bracket; The camera module also includes: A first protrusion is disposed on the bracket and extends from the bracket toward the two lower extensions respectively along a second direction; The second protruding portion is disposed on the two lower extending portions and extends from the two lower extending portions toward the bracket respectively along the second direction.

10. The camera module according to claim 1, characterized in that: The drive assembly comprises: Base; A carrier, the carrier is disposed on the base, and the carrier is movable relative to the base; The optical lens comprises: A first lens group, wherein the first lens group is disposed on a base; A second lens group, the second lens group is located between the first lens group and the imaging assembly, the second lens group is arranged on the carrier and moves with the carrier relative to the first lens group; and the optical assembly further includes: A reflective element is located on the optical path of the optical lens and is rotatably disposed on the base.

11. The camera module according to claim 1, characterized in that: The circuit board comprises an imaging connection portion, the imaging connection portion is located outside the bracket, and the imaging connection portion is electrically connected to the driving component.

12. The camera module according to claim 1, characterized in that: A driving connection portion is disposed at a bottom end of one side of the lower extension portion, and the circuit board is electrically connected to the driving connection portion.

13. A method for preparing a camera module, characterized in that: include: forming an optical assembly, the optical assembly comprising an optical lens and a drive assembly; An imaging component is arranged on the light-emitting side of the optical component, wherein the imaging component comprises a circuit board, a filter and a bracket, the filter is arranged on the bracket, and the bracket is connected to the circuit board; electrically connecting the circuit board to the driving assembly; as well as Filling a filling body between the driving assembly and the bracket, wherein the driving assembly includes a base, the base has a lower extension portion extending in a direction close to the circuit board, and at least one side of the lower extension portion is in contact with the filling body; The base further comprises an inner extension portion perpendicular to the lower extension portion, and the camera module further comprises a second connector, which connects the imaging assembly to the inner extension portion; The camera module also includes: a first connector, the first connector connecting the bracket to the circuit board; The elastic modulus of the filling body is lower than the elastic modulus of the first connecting body, and lower than the elastic modulus of the second connecting body.

14. The method for preparing a camera module according to claim 13, characterized in that: Filling a filling body between the driving assembly and the bracket comprises: Along the third direction, a first arrangement is performed on the gap between the bracket and the driving assembly to form a part of the filling body; and The support and the driving assembly are turned over, and the gap between the support and the driving assembly is arranged for a second time along a third direction to form another part of the filling body.

15. The camera module preparation method according to claim 14, characterized in that: The method further comprises: After forming a portion of the filling body, pre-curing a portion of the filling body.

Images