An intelligent power module, controller and household appliance

Abstract

The application discloses an intelligent power module, a controller and a household appliance, and relates to the technical field of semiconductors.The application comprises a power chip set, a first frame and a second frame, and the second frame is located below the first frame.Power chips of the power chip set are dispersedly arranged on the first frame and the upper end face of the second frame.The second frame is provided with a first exposed area, and the first exposed area is used as a high-voltage direct-current input end and is electrically connected with a printed circuit board.Thus, the power chips with large heat can be arranged in layers through the double-layer frame, the heat generated by part of the power chips can be dissipated through the top plastic package, and the heat generated by the other part of the power chips can be transmitted to the printed circuit board through the metal exposed area of the second frame and then dissipated.Thus, the heat dissipation path of the intelligent power module is increased, the heat dissipation efficiency is improved, and the product applicability of the intelligent power module is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to an intelligent power module, a controller and a household appliance. BACKGROUND

[0002] An intelligent power module (IPM) is an advanced power switching device, which integrates an IGBT (Insulated Gate Bipolar Transistor) module inside, and is widely used in the scene of controlling and driving high-power electronic devices, for example, the high-power electronic devices can include but are not limited to AC motor drivers, frequency converters and inverters, etc.

[0003] In the working process of the IPM module, the switching tube is controlled to switch at a very high switching frequency, and the direct current is converted into an alternating current. A large amount of heat loss is generated in the process of switching and conduction of the switching tube, so that the IPM module is quickly heated in the working process. Only when the working temperature of the IPM module is controlled in a reasonable range, the normal work of the IPM module can be ensured.

[0004] At present, the IPM module is usually fully wrapped by a plastic package body, and then a heat sink is arranged on the surface of the IPM module to dissipate heat. The heat of the power chip of the IPM module is transferred to the plastic package body through the heat sink, and then dissipated to the air. The heat dissipation efficiency is limited, and it is difficult to meet the heat dissipation demand of the IPM module with higher power. SUMMARY

[0005] In view of the above problems, the present application is proposed in order to provide an intelligent power module, a controller and a household appliance which can overcome the above problems or at least partially solve the above problems.

[0006] Based on the first aspect of the present application, the present application provides an intelligent power module, which comprises:

[0007] a power chip set, the power chip set comprising at least two power chips;

[0008] a first frame and a second frame, the second frame being located below the first frame and connected with the first frame, wherein the power chips of the power chip set are dispersedly installed on the first frame and the upper end surface of the second frame, and the lower end surface of the second frame is provided with a first exposed area, so as to take the first exposed area as a high-voltage direct-current input end, form an electrical connection with a printed circuit board, and transfer the heat generated by the power chips located on the second frame to the printed circuit board.

[0009] An optional summary, the power chip is installed on the lower end surface of the first frame.

[0010] An optional summary, the upper end surface of the first frame is provided with a second exposed area, and the intelligent power module further comprises:

[0011] A copper substrate covers the second exposed area and is fixed with the first frame, wherein the heat generated by the power chip on the first frame is transferred to the copper substrate;

[0012] A heat-conducting glue layer is located on the end surface of the copper substrate away from the first frame to transfer the heat on the copper substrate;

[0013] A heat sink is located on the end surface of the heat-conducting glue layer away from the copper substrate to dissipate the heat of the heat-conducting glue layer outward.

[0014] An optional summary, the first frame and the copper substrate are bonded by insulating heat-conducting glue.

[0015] An optional summary, the power chip located on the first frame is installed in the end surface area opposite to the second exposed area.

[0016] An optional summary, the projection area of the second exposed area on the first frame completely covers the projection area of at least one power chip on the first frame.

[0017] An optional summary, the intelligent power module further comprises:

[0018] A heat sink is located on the upper end surface of the first frame.

[0019] An optional summary, the upper end surface of the first frame is provided with a second exposed area, and the intelligent power module further comprises:

[0020] A copper substrate covers the second exposed area and is fixed with the first frame, wherein the heat generated by the power chip on the first frame is transferred to the copper substrate;

[0021] At least one heat-conducting wire is provided on the end surface of the copper substrate away from the first frame to dissipate the heat of the copper substrate outward.

[0022] An optional summary, the heat-conducting wire comprises a copper wire; or,

[0023] The heat-conducting wire comprises an aluminum wire; or,

[0024] The heat-conducting wire includes a copper wire and an aluminum wire.

[0025] An optional invention content is that the heat-conducting wire is bonded to the copper substrate.

[0026] An optional invention content is that the power chip on the second frame is mounted in an end surface area opposite to the first exposed area.

[0027] An optional invention content is that a projection area of the first exposed area on the second frame completely covers a projection area of the power chip on the second frame on the second frame.

[0028] An optional invention content is that the first frame is curved towards a direction away from the second frame, the second frame is curved towards a direction away from the second frame, and the first frame and the second frame cooperate to form a mounting cavity for the power chip.

[0029] Based on the second aspect of the application, the application further provides a controller, which includes a printed circuit board and the intelligent power module according to any one of the above invention contents, wherein the intelligent power module is electrically connected to the printed circuit board through the first exposed area to transfer heat generated by the power chip on the second frame to the printed circuit board.

[0030] Based on the third aspect of the application, the application further provides a household appliance, which includes the controller according to the above invention content.

[0031] Compared with the prior art, the application includes a power chip set, a first frame and a second frame, the power chip set includes at least two power chips, the second frame is located below the first frame and connected to the first frame, wherein the power chips of the power chip set are mounted on the first frame and an upper end surface of the second frame, a lower end surface of the second frame is provided with a first exposed area, the first exposed area is used as a high-voltage direct-current input end, is electrically connected to a printed circuit board, and transfers heat generated by the power chip on the second frame to the printed circuit board. Thus, the power chips with large heat can be arranged in layers through the double-layer frame, heat generated by a part of the power chips can be dissipated through the top plastic package, and heat generated by another part of the power chips is transferred to the printed circuit board through the metal exposed area of the second frame to be dissipated. Thus, the heat dissipation path of the intelligent power module is increased, the heat dissipation efficiency is improved, and the product applicability of the intelligent power module is improved.

[0032] The above description is only a summary of the technical solutions of the present application. In order to make the technical means of the present application more clearly understood and implemented according to the content of the specification, and in order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0033] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a description of the preferred embodiments and are not meant to limit the present application. Furthermore, the same reference numerals in the drawings indicate the same elements throughout the several drawings.

[0034] In the drawings:

[0035] Figure 1 is a structural schematic diagram of an intelligent power module provided by an embodiment of the present application;

[0036] Figure 2 is a structural schematic diagram of a second exposed area provided by an embodiment of the present application;

[0037] Figure 3 is a structural schematic diagram of another intelligent power module provided by an embodiment of the present application;

[0038] Figure 4 is a structural schematic diagram of a first frame provided by an embodiment of the present application;

[0039] Figure 5 is a structural schematic diagram of a first exposed area provided by an embodiment of the present application;

[0040] Figure 6 is a structural schematic diagram of another intelligent power module provided by an embodiment of the present application;

[0041] Figure 7 is a structural schematic diagram of another intelligent power module provided by an embodiment of the present application;

[0042] Reference signs: 1, power chip; 2, first frame; 201, second exposed area; 3, second frame; 301, first exposed area; 4, copper substrate; 5, heat-conducting glue layer; 6, heat sink; 7, heat-conducting wire; 8, plastic package; 9, mounting cavity; 10, printed circuit board. DETAILED DESCRIPTION

[0043] Exemplary embodiments of the present application will be described in greater detail below with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it is understood that the present application can be embodied in various forms without being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.

[0044] An intelligent power module (IPM) is an advanced power switching device that integrates an IGBT (Insulated Gate Bipolar Transistor) module inside, and is widely used in scenarios of controlling and driving high-power electronic devices, for example, high-power electronic devices can include but are not limited to AC motor drivers, frequency converters, and inverters, etc.

[0045] In operation, the IPM module controls the switching of the switching tube at a very high switching frequency, converts DC power into AC power, and generates a large amount of heat loss in the process of switching and conduction of the switching tube, thereby causing the IPM module to heat up quickly during operation. Only when the operating temperature of the IPM module is controlled within a reasonable range, can the normal operation of the IPM module be ensured.

[0046] Currently, the IPM module is usually fully wrapped with a plastic package, and then a heat sink is arranged on the surface of the IPM module to dissipate heat from the IPM module. The heat generated by the power chip of the IPM module is transferred to the plastic package through the heat sink and then dissipated to the air. The heat dissipation efficiency is limited, and it cannot meet the heat dissipation requirements of higher-power IPM modules.

[0047] In view of the technical problems above, the embodiment of the present application can include a power chip set, a first frame 2 and a second frame 3, the power chip set includes at least two power chips 1, the second frame 3 is located below the first frame 2 and is connected with the first frame 2. Wherein, the power chips 1 of the power chip set are dispersedly mounted on the first frame 2 and the upper end surface of the second frame 3, the lower end surface of the second frame 3 is provided with a first exposed area 301, the first exposed area 301 is taken as a high-voltage direct-current input end, electrically connected with a printed circuit board 10, and the heat generated by the power chips 1 located on the second frame 3 is transferred to the printed circuit board 10. Thus, the power chips 1 with large heat can be layered by the double-layer frame, the heat generated by a part of the power chips 1 can be dissipated by the top plastic package 8, and the heat generated by another part of the power chips 1 is transferred to the printed circuit board 10 through the metal exposed area of the second frame 3 to be dissipated. Thus, the heat dissipation path of the intelligent power module is increased, the heat dissipation efficiency is improved, and the product applicability of the intelligent power module is improved.

[0048] Referring to Figure 1 and Figure 2 The embodiment of the present application provides an intelligent power module, which can include a power chip set, a first frame 2 and a second frame 3, wherein:

[0049] The power chip set includes at least two power chips 1, a part of the power chips 1 in the power chip set are mounted on the first frame 2. The second frame 3 is located below the first frame 2 and is connected with the first frame 2, wherein another part of the power chips 1 in the power chip set are mounted on the upper end surface of the second frame 3, the lower end surface of the second frame 3 is provided with a first exposed area 301, the first exposed area 301 is taken as a high-voltage direct-current input end, electrically connected with a printed circuit board 10, and the heat generated by the power chips 1 located on the second frame 3 is transferred to the printed circuit board 10.

[0050] In the embodiment of the present application, the intelligent power module can include a power chip set, a first frame 2 and a second frame 3. The power chip 1 can include an IGBT chip, a driving circuit chip and a protection circuit chip, etc. For an IPM module, it includes a power chip 1, and since the power chip 1 works at a very high switching frequency, in the IPM module, the power chip 1 is an electrical component that generates a large amount of heat and is also a key component that needs to be cooled. Wherein, the power chip 1 can be separated into a die by wafer cutting, and then be bonded.

[0051] The first frame 2 is located above the second frame 3, that is, the first frame 2 and the second frame 3 are arranged in a top-down manner, and one end of the first frame 2 is fixedly connected to one end of the second frame 3. For example, a proper amount of conductive glue or a proper amount of tin paste can be applied at the connection between the first frame 2 and the second frame 3, and the first frame 2 and the second frame 3 can be fixed by a mold, so that the first frame 2 is located above the second frame 3, and then the first frame 2 and the second frame 3 are sent into a high-temperature oven for curing of the conductive glue or the tin paste, and then the first frame 2 and the second frame 3 are sent into a reflow soldering device for reflow soldering. The first frame 2 and the second frame 3 are fixedly connected. The first frame 2 and the second frame 3 are both used for mounting the power chip 1. In some embodiments, the first frame 2 and the second frame 3 are both made of metal material. In other words, the first frame 2 is a metal frame, and the second frame 3 is also a metal frame.

[0052] The power chip 1 can be divided into two parts, one part of the power chip 1 is mounted on the upper end surface of the second frame 3, and the other part of the power chip 1 includes at least two power chips 1, and one part of the power chip 1 is mounted on the first frame 2. For example, the die (IGBT chip) after die bonding is arranged in an orderly manner on a blue film, the die on the blue film is placed on the corresponding region of the first frame 2, and then the first frame 2 is sent into a high-temperature oven for curing of conductive glue (silver glue) or tin paste, and then the first frame 2 is sent into a reflow soldering device for reflow soldering. Thus, the welding between the power chip 1 and the first frame 2 is completed. The welding between the power chip 1 and the second frame 3 can be completed in the same manner as described above. Finally, the aluminum wire bonding device and the gold wire bonding device are used to complete the electrical connection between the power chip 1 and the first frame 2 and between the power chip 1 and the second frame 3 by bonding.

[0053] The layered assembly of the power chip 1 can reduce the assembly area of the power chip 1 on the same frame. For example, the horizontal assembly area of the IPM module can be reduced, thereby the assembly area occupied by the printed circuit board 10 can be reduced, which is beneficial to the miniaturization design of the controller in the later stage. In addition, the two frames are used for layered heat conduction of the power chip 1, which is beneficial to heat diffusion of the power chip 1 in the IPM module.

[0054] In some embodiments, another part of the power chip 1 can be installed on the lower end surface of the first frame 2, i.e. close to the end surface of the second frame 3. In other embodiments, another part of the power chip 1 can be installed on the upper end surface of the first frame 2, i.e. away from the end surface of the second frame 3. The lower end surface of the second frame 3 is provided with a first exposed area 301, wherein the first exposed area 301 can be understood as an area where the second frame 3 is not insulated by the plastic package 8 when the IPM module is plastic packaged by the plastic package 8. For example, the entire IPM module is placed in an injection mold, and the IPM module is gap filled with plastic packaging material. The filled gap does not include the first exposed area 301. After the plastic packaging material is pre-cured, an injection body 8 corresponding to the IPM module is obtained. Finally, the pre-cured product is sent to an oven, and after 6 hours at 125°C, the plastic package is completely cured. The cured IPM module is sent to a die of a rib cutting device, the ribs of the first frame 2 and the second frame 3 are cut off by the die, and then the product is sent to a forming die to complete the bending of the functional feet, thereby obtaining the IPM module.

[0055] Since the second frame 3 is made of metal material, the thermal conductivity is greatly improved compared with the plastic package 8. Direct contact between the second frame 3 and the printed circuit board 10 can greatly improve the heat dissipation performance of the IPM module. Thus, the first exposed area 301 on the second frame 3 can be used as a high-voltage direct-current input end (also referred to as a P end) to form an electrical connection with the printed circuit board 10 (PCB, Printed circuit board). Thus, without the need for electrical insulation between the bottom of the second frame 3 and the printed circuit board 10, the heat transfer efficiency from the second frame 3 to the printed circuit board 10 can be improved. Thus, the power chip 1 located on the first frame 2 can be cooled by the plastic package 8 on the top of the IPM module, and the power chip 1 located on the second frame 3 can be cooled by the printed circuit board 10.

[0056] Thus, by arranging the power chip 1 in two layers, the heat generated by part of the power chip 1 can be dissipated through the plastic package 8 on the top. The heat generated by another part of the power chip 1 is transmitted to the printed circuit board 10 through the metal exposed area of the second frame 3 for dissipation. Thus, the heat dissipation path of the intelligent power module is increased, the heat dissipation efficiency is improved, and the product applicability of the intelligent power module is improved.

[0057] An alternative embodiment of the application is shown in Figure 1 The power chip 1 is installed on the lower end surface of the first frame 2.

[0058] In the embodiment of the present application, the power chip 1 is installed on the lower end surface of the first frame 2, and the assembly space of the heat dissipation component on the upper end surface of the first frame 2 can be reserved. In the case that the power requirement of the intelligent power module is high, and the heat dissipation requirement cannot be met by the heat dissipation of the top through the plastic package 8, other heat dissipation components, such as the heat sink 6, are added to further improve the heat dissipation performance of the intelligent power module.

[0059] An optional embodiment of the present application, referring to FIGS. 1, 2 and 3, Figure 3 and Figure 5 The intelligent power module can include a power chip set, a first frame 2, a second frame 3, a copper substrate 4, a heat-conducting glue layer 5, and a heat sink 6. The power chip set includes at least two power chips. A part of the power chips 1 in the power chip set is installed on the lower end surface of the first frame 2, and the second frame 3 is located below the first frame 2 and connected with the first frame 2. Another part of the power chips 1 in the power chip set is installed on the upper end surface of the second frame 3, and the lower end surface of the second frame 3 is provided with a first exposed area 301, which is used as a high-voltage direct-current input end, and is electrically connected with a printed circuit board 10, and the heat generated by the power chips 1 on the second frame 3 is transmitted to the printed circuit board 10.

[0060] The upper end surface of the first frame 2 is provided with a second exposed area 201, and the copper substrate 4 covers the second exposed area 201 and is fixed with the first frame 2. The heat generated by the power chips 1 on the first frame 2 is transmitted to the copper substrate 4. The heat-conducting glue layer 5 is located on the end surface of the copper substrate 4 away from the first frame 2, to transmit the heat on the copper substrate 4. The heat sink 6 is located on the end surface of the heat-conducting glue layer 5 away from the copper substrate 4, to dissipate the heat of the heat-conducting glue layer 5 outward.

[0061] In the embodiment of the present application, the intelligent power module can include a power chip set, a first frame 2, and a second frame 3. The power chip 1 can include an IGBT chip, a driving circuit chip, and a protection circuit chip, etc. For an IPM module, it includes the power chip 1, and since the power chip 1 works at a very high switching frequency, in the IPM module, the power chip 1 is an electrical component that generates a large amount of heat, and is also a key component that needs to be cooled.

[0062] The first frame 2 is located above the second frame 3, i.e. the first frame 2 and the second frame 3 are arranged in a top-down manner, and one end of the first frame 2 is fixedly connected to one end of the second frame 3. Both the first frame 2 and the second frame 3 are used for mounting the power chip 1. In some embodiments, the first frame 2 and the second frame 3 are respectively made of metal material. In other words, the first frame 2 is a metal frame, and the second frame 3 is also a metal frame. The power chip 1 can be divided into two parts, one part of the power chip 1 is mounted on the upper end surface of the second frame 3, and the other part of the power chip 1 is mounted on the lower end surface of the first frame 2. In this way, the assembly area of the power chip 1 on the same frame can be reduced. For example, the horizontal assembly area of the IPM module can be reduced, thereby the assembly area occupied by the printed circuit board 10 can be reduced, which is beneficial to the miniaturization design of the controller in the later stage. In addition, the two frames are used for layered heat conduction of the power chip 1, which is beneficial to the heat diffusion of the power chip 1 inside the IPM module.

[0063] The lower end surface of the second frame 3 is provided with a first exposed area 301. The first exposed area 301 can be understood as an area of the second frame 3 which is not insulated by the plastic package 8 when the IPM module is plastic packaged by the plastic package 8. The collector of the IGBT chip is fixed by welding with the second frame 3. Since the second frame 3 is made of metal material, the thermal conductivity is greatly improved compared with the plastic package 8. Direct contact between the second frame 3 and the printed circuit board 10 can greatly improve the heat dissipation performance of the IPM module. In this way, the first exposed area 301 on the second frame 3 can be used as a high-voltage direct-current input end (also referred to as P end) to form an electrical connection with the printed circuit board 10 (PCB, Printed circuit board). Thus, the heat transfer efficiency from the second frame 3 to the printed circuit board 10 can be improved without the need for electrical insulation between the bottom of the second frame 3 and the printed circuit board 10. In this way, the power chip 1 located on the second frame 3 can be transferred to the printed circuit board 10 through the bottom of the IPM module for heat dissipation.

[0064] The upper end surface of the first frame 2 is provided with a second exposed area 201, and the copper substrate 4 covers the second exposed area 201 and is fixed with the first frame 2. Wherein, the second exposed area 201 can be understood as an area of the first frame 2 which is not insulated by the plastic package 8 when the IPM module is plastic packaged by the plastic package 8. As a preferred embodiment, the copper substrate 4 completely covers the second exposed area 201. A large amount of heat generated by the power chip 1 on the first frame 2 can be directly heat-conducted to the copper substrate 4. The heat on the power chip 1 can be quickly dissipated to ensure the working stability of the power chip 1. The heat-conducting adhesive layer 5 is located on the end surface of the copper substrate 4 away from the first frame 2 to transfer the heat on the copper substrate 4. The heat sink 6 is located on the end surface of the heat-conducting adhesive layer 5 away from the copper substrate 4 to dissipate the heat of the heat-conducting adhesive layer 5 outward. Wherein, the heat-conducting adhesive layer 5 can be made of heat-conducting silicone grease. The heat sink 6 can be understood as a forced air cooling heat sink 6 including a fan.

[0065] In summary, through the double-layer frame structure of the first frame 2 and the second frame 3, the power chip 1 with large heat is layered and arranged. The heat generated by the power chip 1 on the first frame 2 is mainly dissipated as follows: firstly transferred to the first frame 2, then transferred to the copper substrate 4, then transferred to the heat-conducting adhesive layer 5, and finally transferred to the heat sink 6 for heat dissipation. The heat generated by the power chip 1 on the second frame 3 is mainly dissipated as follows: firstly transferred to the second frame 3, then transferred to the printed circuit board 10 in contact with the second frame 3, and then dissipated through the printed circuit board 10. Thus, the intelligent power module can be comprehensively cooled through the top cooling path and the bottom cooling path. On the basis of increasing the cooling path of the intelligent power module, the cooling efficiency is greatly improved, and the integration of the power chip 1 on the frame can be improved, and the product applicability of the intelligent power module can be further improved. Wherein, the IPM module can adapt to the cooling demand of larger power, thereby being conducive to the product iteration of the intelligent power module.

[0066] An optional embodiment of the application, the first frame 2 and the copper substrate 4 are bonded by insulating heat-conducting adhesive.

[0067] In the embodiment of the present application, the copper substrate 4 can be bonded and fixed to the first frame 2 by using insulating and heat-conducting glue, so that the heat on the first frame 2 can be transferred to the copper substrate 4, while ensuring the stability of the connection between the first frame 2 and the copper substrate 4, and ensuring the electrical insulation between the first frame 2 and the copper substrate. Thus, the heat dissipation path of the power chip 1 located on the lower end surface of the first frame 2 can be from the first frame 2 to the insulating and heat-conducting glue, from the insulating and heat-conducting glue to the copper substrate 4, from the copper substrate 4 to the heat-conducting glue layer 5, and finally from the heat-conducting glue layer 5 to the heat sink 6.

[0068] An optional embodiment of the present application, referring to Figure 5 The power chip 1 located on the first frame 2 is mounted in the end surface region opposite to the second exposed area 201.

[0069] In the embodiment of the present application, when the power chip 1 located on the first frame 2 is mounted on the lower end surface of the first frame 2, it can be mounted in the end surface region opposite to the second exposed area 201. That is, the heat generated by the power chip 1 can be conducted to the first frame 2, and then conducted to the copper substrate 4 located on the second exposed area 201 through the first frame 2. That is, the heat transfer path of the power chip 1 located on the first frame 2 can be vertical upward. Thus, on the basis of using metal with fast heat transfer speed, the top heat transfer path can be greatly shortened, and a large amount of heat generated by the power chip 1 can be quickly conducted to the copper substrate 4.

[0070] In some optional embodiments, the projection area of the second exposed area 201 on the first frame 2 completely covers the projection area of the power chip 1 located on the first frame 2 on the first frame 2. Thus, the top heat dissipation path of each power chip 1 located on the first frame 2 can be regarded as vertical upward, thereby further improving the heat dissipation efficiency of the intelligent power module.

[0071] An optional embodiment of the present application, referring to Figure 6As shown, the intelligent power module can include a power chip set, a first frame 2, a second frame 3, and a heat sink 6, wherein the power chip set includes at least two power chips 1, and some of the power chips 1 in the power chip set are mounted on the first frame 2. The second frame 3 is located below the first frame 2 and is connected with the first frame 2, wherein the other power chips 1 in the power chip set are mounted on the upper end surface of the second frame 3, and the lower end surface of the second frame 3 is provided with a first exposed area 301, so as to take the first exposed area 301 as a high-voltage direct-current input end, form an electrical connection with a printed circuit board 10, and transfer the heat generated by the power chips 1 located on the second frame 3 to the printed circuit board 10. The heat sink 6 is located on the upper end surface of the first frame 2.

[0072] In the embodiment of the present application, the intelligent power module can include a power chip set, a first frame 2, and a second frame 3. The power chip 1 can include an IGBT chip, a driving circuit chip, and a protection circuit chip, etc. For an IPM module, it includes power chips 1, and since the power chips 1 work at a very high switching frequency, in the IPM module, the power chips 1 are electrical components that generate a large amount of heat, and are also the key components that need to be cooled most.

[0073] The first frame 2 is located above the second frame 3, that is, the first frame 2 and the second frame 3 are arranged in an upper and lower interval, and one end of the first frame 2 is fixedly connected with one end of the second frame 3. The first frame 2 and the second frame 3 are both used for mounting the power chips 1. In some embodiments, the first frame 2 and the second frame 3 are respectively made of metal materials. In other words, the first frame 2 is a metal frame, and the second frame 3 is also a metal frame. The power chips 1 can be divided into two parts, one part of the power chips 1 is mounted on the upper end surface of the second frame 3, and the other part of the power chips 1 is mounted on the lower end surface of the first frame 2. In this way, the assembly area of the power chips 1 on the same frame can be reduced. For example, the horizontal assembly area of the IPM module can be reduced, so that the assembly area occupied by the printed circuit board 10 can be reduced, which is beneficial to the miniaturization design of the controller in the later stage. In addition, the two frames are used for layered heat conduction of the power chips 1, which is beneficial to the heat diffusion of the power chips 1 inside the IPM module.

[0074] The lower end surface of the second frame 3 is provided with a first exposed area 301, wherein the first exposed area 301 can be understood as an area of the second frame 3 which is not insulated by the plastic package 8 when the IPM module is plastic packaged by the plastic package 8. The collector of the IGBT chip is fixed by welding with the second frame 3. Since the second frame 3 is made of metal material, the thermal conductivity is greatly improved compared with the plastic package 8. Directly contacting the second frame 3 with the printed circuit board 10 can greatly improve the heat dissipation performance of the IPM module. Therefore, the first exposed area 301 on the second frame 3 can be used as a high-voltage direct-current input end (also referred to as a P end) to form an electrical connection with the printed circuit board 10 (PCB, Printed circuit board). Therefore, without the need for electrical insulation between the bottom of the second frame 3 and the printed circuit board 10, the heat transfer efficiency from the second frame 3 to the printed circuit board 10 can be improved. Therefore, the power chip 1 located on the second frame 3 can be transferred to the printed circuit board 10 for heat dissipation through the bottom of the IPM module.

[0075] When the first frame 2 and the second frame 3 are insulated and plastic packaged by the plastic package 8, the heat sink 6 is located on the upper end surface of the first frame 2, for example, the heat sink 6 is fixedly connected with the plastic package 8. Therefore, the heat generated by the power chip 1 located on the first frame 2 is mainly dissipated in the following way: first transferred to the first frame 2, then transferred to the plastic package 8, and finally transferred to the heat sink 6 for heat dissipation. The heat generated by the power chip 1 located on the second frame 3 is mainly dissipated in the following way: first transferred to the second frame 3, then transferred to the printed circuit board 10 in contact with the second frame 3, and then dissipated through the printed circuit board 10. Therefore, the intelligent power module can be comprehensively cooled through the top cooling path and the bottom cooling path, greatly improving the cooling efficiency on the basis of increasing the cooling path of the intelligent power module. Moreover, the integration of the power chip 1 on the frame can be improved, further improving the product applicability of the intelligent power module, thereby facilitating the product iteration of the intelligent power module.

[0076] An optional embodiment of the application is described with reference to Figure 7As shown, the intelligent power module can include a power chip set, a first frame 2, a second frame 3, a copper substrate 4, and at least one heat-conducting wire 7. The power chip set includes at least two power chips, and a part of the power chips 1 in the power chip set are mounted on the lower end surface of the first frame 2. The second frame 3 is located below the first frame 2 and is connected with the first frame 2. Another part of the power chips 1 in the power chip set are mounted on the upper end surface of the second frame 3. The lower end surface of the second frame 3 is provided with a first exposed area 301, which is used as a high-voltage direct-current input end, is electrically connected with a printed circuit board 10, and transmits the heat generated by the power chips 1 on the second frame 3 to the printed circuit board 10. The upper end surface of the first frame 2 is provided with a second exposed area 201, and the copper substrate 4 covers the second exposed area 201 and is fixed with the first frame 2. The heat generated by the power chips 1 on the first frame 2 is transmitted to the copper substrate 4. At least one heat-conducting wire 7 is arranged on the end surface of the copper substrate 4 away from the first frame 2, so as to dissipate the heat of the copper substrate 4 outward.

[0077] In the embodiment of the present application, the intelligent power module can include a power chip set, a first frame 2, and a second frame 3. The power chip 1 can include an IGBT chip, a driving circuit chip, and a protection circuit chip, etc. For an IPM module, it includes power chips 1, and because the power chips 1 work at a very high switching frequency, in the IPM module, the power chips 1 are electrical components that generate a large amount of heat and are also the key components that need to be cooled most.

[0078] The first frame 2 is located above the second frame 3, that is, the first frame 2 and the second frame 3 are arranged in an upper-lower interval, and one end of the first frame 2 is fixedly connected with one end of the second frame 3. The first frame 2 and the second frame 3 are both used for mounting the power chips 1. In some embodiments, the first frame 2 and the second frame 3 are respectively made of metal materials. In other words, the first frame 2 is a metal frame, and the second frame 3 is also a metal frame. The power chips 1 can be divided into two parts, one part of the power chips 1 is mounted on the upper end surface of the second frame 3, and the other part of the power chips 1 is mounted on the lower end surface of the first frame 2. In this way, the assembly area of the power chips 1 on the same frame can be reduced. For example, the horizontal assembly area of the IPM module can be reduced, thereby the assembly area occupied by the printed circuit board 10 can be reduced, which is beneficial to the miniaturization design of the controller in the later stage. In addition, the two frames are used for layered heat conduction of the power chips 1, which is beneficial to the heat diffusion of the power chips 1 inside the IPM module.

[0079] The lower end surface of the second frame 3 is provided with a first exposed area 301, wherein the first exposed area 301 can be understood as an area of the second frame 3 which is not insulated by the plastic package 8 when the IPM module is plastic packaged by the plastic package 8. The collector of the IGBT chip is fixed by welding with the second frame 3. Since the second frame 3 is made of metal material, the thermal conductivity is greatly improved compared with the plastic package 8. Directly contacting the second frame 3 with the printed circuit board 10 can greatly improve the heat dissipation performance of the IPM module. Thus, the first exposed area 301 on the second frame 3 can be used as a high-voltage direct-current input end (also referred to as P end) to form an electrical connection with the printed circuit board 10 (PCB, Printed circuit board). Thus, without the need for electrical insulation between the bottom of the second frame 3 and the printed circuit board 10, the heat transfer efficiency from the second frame 3 to the printed circuit board 10 can be improved. Thus, the power chip 1 on the second frame 3 can be transferred to the printed circuit board 10 for heat dissipation through the bottom of the IPM module.

[0080] The upper end surface of the first frame 2 is provided with a second exposed area 201, and the copper substrate 4 covers the second exposed area 201 and is fixed with the first frame 2. Wherein the second exposed area 201 can be understood as an area of the first frame 2 which is not insulated by the plastic package 8 when the IPM module is plastic packaged by the plastic package 8. As a preferred embodiment, the copper substrate 4 completely covers the second exposed area 201. A large amount of heat generated by the power chip 1 on the first frame 2 can be directly conducted to the copper substrate 4. The heat on the power chip 1 can be quickly dissipated to ensure the working stability of the power chip 1.

[0081] The heat-conducting wire 7 is located on the end surface of the copper substrate 4 away from the first frame 2, which dissipates the heat of the copper substrate 4 outward. Wherein, in the case that the plastic package 8 wraps the intelligent power module, the heat-conducting wire 7 can extend to the outside of the plastic package 8 for heat dissipation. In summary, through the double-frame structure of the first frame 2 and the second frame 3, the power chip 1 with large heat is layered, and the heat generated by the power chip 1 on the first frame 2 is mainly dissipated in the following way: first, to the first frame 2, then to the copper substrate 4, and then to the heat-conducting wire 7, and finally, through the heat-conducting wire 7 for heat dissipation.

[0082] The heat generated by the power chip 1 located on the second frame 3 corresponds to a heat dissipation path mainly as follows: firstly, the heat is transferred to the second frame 3, and then the heat is transferred to the printed circuit board 10 in contact with the second frame 3, so that the heat is dissipated through the printed circuit board 10. Therefore, the intelligent power module can be comprehensively cooled through the top heat dissipation path and the bottom heat dissipation path, the heat dissipation efficiency is greatly improved on the basis of increasing the heat dissipation path of the intelligent power module, and the integration of the power chip 1 on the frame can be improved, and the product applicability of the intelligent power module can be further improved. Among them, the IPM module can adapt to the heat dissipation demand of larger power, thereby being beneficial to the product iteration of the intelligent power module.

[0083] In some embodiments, the number of the heat conduction wires 7 can be determined by the number of the power chips 1 located on the first frame 2 and the heat conduction effect of the heat conduction wires 7. For example, the heat conduction wires 7 can be provided in one, three, five, etc., which is not limited herein. The number of the heat conduction wires 7 is in a proportional relationship with the heat generation amount per unit time of the power chips 1 located on the first frame 2.

[0084] In an optional embodiment, the heat conduction wires 7 can include metal wires with high heat conduction coefficients. For example, the heat conduction wires 7 can include aluminum wires. For another example, the heat conduction wires 7 can include copper wires. For yet another example, the heat conduction wires 7 can include copper wires and aluminum wires, that is, in the case where a plurality of heat conduction wires 7 are provided, a part of the heat conduction wires 7 can be copper wires, and another part of the heat conduction wires 7 can be aluminum wires. The corresponding heat conduction wires 7 can be selected by the person skilled in the art according to the heat conduction effect and production cost of the copper wires and the aluminum wires, which is not limited herein.

[0085] In an optional embodiment, the heat conduction wires 7 are bonded to the copper substrate 4.

[0086] In the embodiment, bonding means that the heat conduction wires 7 are tightly welded to the copper substrate 4 by means of heat, pressure, ultrasonic energy, etc. Therefore, the contact area of the heat conduction wires 7 and the copper substrate 4 can be increased on the basis of ensuring the stability of the connection between the heat conduction wires 7 and the copper substrate 4, and heat conduction is facilitated.

[0087] In an optional embodiment, referring to FIG. 3, Figure 2 The power chip 1 located on the second frame 3 is installed in an end surface region opposite to the first exposed region 301.

[0088] In the embodiment of the present application, when the power chip 1 located on the second frame 3 is installed on the upper end surface of the second frame 3, it can be installed in the end surface area opposite to the first exposed area 301. That is, the heat generated by the power chip 1 can be conducted to the second frame 3 and then directly conducted to the printed circuit board 10 located on the first exposed area 301 through the second frame 3. Since the power chip 1 and the second frame 3 are fixed by welding, and the second frame 3 and the printed circuit board 10 are fixed by welding, and there is no gap in between, it can be seen that the heat transfer path of the power chip 1 located on the second frame 3 is vertically downward. Thus, on the basis of the fast heat conduction of metal, the bottom heat transfer path can be greatly shortened, and a large amount of heat generated by the power chip 1 can be quickly conducted to the copper substrate 4.

[0089] In some optional embodiments, the projection area of the first exposed area 301 on the second frame 3 completely covers the projection area of the power chip 1 located on the second frame 3 on the second frame 3. Thus, the top heat dissipation path of each power chip 1 located on the second frame 3 can be seen as vertically downward, thereby further improving the heat dissipation efficiency of the intelligent power module.

[0090] An optional embodiment of the present application is shown in Figure 1 , Figure 3 , Figure 4 , Figure 6 and Figure 7 The first frame 2 is bent away from the second frame 3, the second frame 3 is bent away from the second frame 3, and the first frame 2 and the second frame 3 cooperate to form a mounting cavity 9 for assembling the power chip 1.

[0091] In the embodiment of the present application, the first frame 2 is bent away from the second frame 3, and the second frame 3 is bent away from the second frame 3. Thus, a high mounting cavity 9 is formed between the first frame 2 and the second frame 3 for assembling the power chip 1. Thus, in the case of layered installation of the power chip 1, the spacing between the power chips 1 on different frames can be maximized, thereby reducing the heat interference between the power chips 1 and further improving the heat dissipation efficiency of the intelligent power module.

[0092] In the embodiment of the present application, those skilled in the art can also adapt to add insulating devices or insulating glue at different positions according to actual design needs or other electrical insulation needs, which is not limited here.

[0093] In some optional embodiments, the bottom of the second frame 3 can also be provided with a supporting bottom plate, which can also be a copper substrate. After the electrical connection between the power chip 1 and the first frame 2 and the power chip 1 and the second frame 3 is completed, the supporting bottom plate can be bonded to the bottom of the second frame 3, and then the entire IPM module is placed into an injection mold, and the IPM module is filled with plastic sealing material. After the plastic sealing material is pre-solidified, an injection body 8 corresponding to the IPM module is obtained.

[0094] In summary, the embodiment of the present application discloses an intelligent power module, which can include a power chip set, a first frame 2 and a second frame 3. The power chip set includes at least two power chips 1. The second frame 3 is located below the first frame 2 and connected with the first frame 2. The power chips 1 of the power chip set are dispersedly installed on the first frame 2 and the upper end surface of the second frame 3. The lower end surface of the second frame 3 is provided with a first exposed area 301, which is used as a high-voltage direct-current input end, forms an electrical connection with a printed circuit board 10, and transmits the heat generated by the power chips 1 located on the second frame 3 to the printed circuit board 10. Thus, the power chips 1 with large heat can be layered by the double-layer frame. The heat generated by a part of the power chips 1 can be dissipated by the top plastic sealing body 8, and the heat generated by another part of the power chips 1 can be transmitted to the printed circuit board 10 through the metal exposed area of the second frame 3 for dissipation. Thus, the heat dissipation path of the intelligent power module is increased, the heat dissipation efficiency is improved, and the product applicability of the intelligent power module is improved.

[0095] The embodiment of the present application also discloses a controller, which includes a printed circuit board 10 and an intelligent power module as described in any one of the above embodiments. The intelligent power module forms an electrical connection with the printed circuit board 10 through the first exposed area 301, so as to transmit the heat generated by the power chips 1 located on the second frame 3 to the printed circuit board 10.

[0096] In the embodiment of the present application, the printed circuit board 10 and the first exposed area 301 of the intelligent power module can be welded, so as to transmit the heat generated by the power chips 1 located on the second frame 3 to the printed circuit board 10 through the metal exposed area of the second frame 3 for dissipation. Thus, the heat dissipation path of the intelligent power module is increased, the heat dissipation efficiency is improved, and the product applicability of the intelligent power module is improved.

[0097] The embodiment of the present application also discloses a household appliance, which includes a controller as described in the above embodiments.

[0098] The household appliance can include, but is not limited to, an air conditioner, an air purifier, a washing machine, a refrigerator, a fan, a vacuum cleaner, and the like.

[0099] To sum up, the embodiment of the present application discloses a kind of intelligent power module, controller and household appliance, the embodiment of the present application can include power chip set, first frame 2 and second frame 3, the power chip set at least includes two power chips 1, the second frame 3 is located below the first frame 2, and is connected with the first frame 2.Wherein, the power chip 1 of the power chip set is dispersedly installed on the first frame 2 and the upper end surface of the second frame 3, the lower end surface of the second frame 3 is provided with first bare area 301, to take the first bare area 301 as high voltage direct current input end, form electrical connection with printed circuit board 10, and the heat generated by power chip 1 located on the second frame 3 is transferred to the printed circuit board 10.Thereby, the power chip 1 of large heat can be arranged in layers by double-layer frame, the heat generated by part of power chip 1 can be dissipated by top plastic package 8, and the heat generated by another part of power chip 1 is transferred to printed circuit board 10 by the metal bare area of second frame 3 and is dissipated.Thereby, the heat dissipation path of intelligent power module is increased, the heat dissipation efficiency is improved, and the product applicability of intelligent power module is improved.

[0100] Each embodiment in the specification is described in a progressive manner, and each embodiment focuses on the difference from other embodiments, and the same or similar parts between each embodiment can be referred to each other.

[0101] As those skilled in the art can readily perceive that any combination application of the above-mentioned embodiments is feasible, any combination of the above-mentioned embodiments is an embodiment of the present application, but due to the limitation of the length of the specification, the above-mentioned embodiments are not described in detail here.

[0102] In the specification provided herein, a large number of specific details are described. However, it can be understood that the embodiments of the present application can be practiced without these specific details. In some examples, well-known methods, structures and techniques are not shown in detail in order not to obscure the understanding of the specification.

[0103] Similarly, it should be understood that, in order to simplify the present application and help understand one or in various inventive aspects, in the above description of exemplary embodiments of the present application, various features of the present application are sometimes grouped together in a single embodiment, figure, or description thereof.

[0104] Furthermore, to one skilled in the art, and with the benefit of this disclosure, the combination of features of different embodiments can be understood to be within the scope of the application and to form different embodiments. For example, in the claims, any of the claimed embodiments can be used in any combination.

Claims

1. An intelligent power module, characterized by The intelligent power module comprises: a power chip set comprising at least two power chips (1); a first frame (2) and a second frame (3) located below the first frame (2) and connected with the first frame (2), wherein the power chips (1) of the power chip set are installed on the lower end surface of the first frame (2) and the upper end surface of the second frame (3), the lower end surface of the second frame (3) is provided with a first exposed area (301) as a high-voltage direct-current input end, and the first exposed area (301) is electrically connected with a printed circuit board (10) to transfer the heat generated by the power chips (1) on the second frame (3) to the printed circuit board (10), and the upper end surface of the first frame (2) is provided with a second exposed area (201); a copper substrate (4) covering the second exposed area (201) and fixed with the first frame (2), wherein the heat generated by the power chips (1) on the first frame (2) is transferred to the copper substrate (4), and the heat on the copper substrate (4) is transferred outward in one of the following ways: at least one heat-conducting wire (7) is arranged on the end surface of the copper substrate (4) away from the first frame (2); a heat-conducting glue layer (5) is arranged on the end surface of the copper substrate (4) away from the first frame (2), and a heat sink (6) is arranged on the end surface of the heat-conducting glue layer (5) away from the copper substrate (4) to dissipate the heat of the heat-conducting glue layer (5) outward.

2. The intelligent power module according to claim 1, characterized in that The first frame (2) and the copper substrate (4) are bonded by insulating heat-conducting glue.

3. The intelligent power module according to claim 1, characterized in that The power chips (1) on the first frame (2) are installed in the end surface area opposite to the second exposed area (201).

4. The intelligent power module according to claim 3, characterized in that The projection area of the second exposed area (201) on the first frame (2) completely covers the projection area of at least one power chip (1) on the first frame (2).

5. The intelligent power module according to claim 1, characterized in that The heat-conducting wire (7) comprises a copper wire; or The heat-conducting wire (7) comprises an aluminum wire; or The heat-conducting wire (7) comprises a copper wire and an aluminum wire.

6. The intelligent power module according to claim 1, characterized in that The heat-conducting wire (7) is bonded with the copper substrate (4).

7. The intelligent power module according to claim 1, characterized by The power chips (1) on the second frame (3) are installed in the end surface area opposite to the first exposed area (301).

8. The intelligent power module according to claim 7, characterized in that The projection area of the first exposed area (301) on the second frame (3) completely covers the projection area of the power chip (1) on the second frame (3).

9. The intelligent power module according to claim 1, characterized in that The first frame (2) is arranged to be curved away from the second frame (3), the second frame (3) is arranged to be curved away from the second frame (3), and the first frame (2) and the second frame (3) cooperate to form a mounting cavity (9) for assembling the power chips (1).

10. A controller characterized by comprising: The controller comprises a printed circuit board (10) and the intelligent power module as claimed in any one of claims 1-9, wherein the intelligent power module is electrically connected with the printed circuit board (10) through the first exposed area (301) to transfer the heat generated by the power chip (1) located on the second frame (3) to the printed circuit board (10).

11. A domestic appliance characterized in that, The household appliance comprises the controller as claimed in claim 10.

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